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JP5522108B2 - Sensor device - Google Patents

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Publication number
JP5522108B2
JP5522108B2 JP2011081943A JP2011081943A JP5522108B2 JP 5522108 B2 JP5522108 B2 JP 5522108B2 JP 2011081943 A JP2011081943 A JP 2011081943A JP 2011081943 A JP2011081943 A JP 2011081943A JP 5522108 B2 JP5522108 B2 JP 5522108B2
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Japan
Prior art keywords
housing
pin
mold
electric circuit
jig
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Expired - Fee Related
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JP2011081943A
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Japanese (ja)
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JP2012215511A (en
Inventor
一史 芹澤
淳 近藤
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Denso Corp
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Denso Corp
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Priority to JP2011081943A priority Critical patent/JP5522108B2/en
Priority to DE102012102386.7A priority patent/DE102012102386B4/en
Priority to CN201210090718.5A priority patent/CN102735388B/en
Priority to US13/435,060 priority patent/US8656766B2/en
Publication of JP2012215511A publication Critical patent/JP2012215511A/en
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Publication of JP5522108B2 publication Critical patent/JP5522108B2/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M51/00Fuel-injection apparatus characterised by being operated electrically
    • F02M51/005Arrangement of electrical wires and connections, e.g. wire harness, sockets, plugs; Arrangement of electronic control circuits in or on fuel injection apparatus
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02DCONTROLLING COMBUSTION ENGINES
    • F02D41/00Electrical control of supply of combustible mixture or its constituents
    • F02D41/30Controlling fuel injection
    • F02D41/38Controlling fuel injection of the high pressure type
    • F02D41/3809Common rail control systems
    • F02D41/3836Controlling the fuel pressure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M47/00Fuel-injection apparatus operated cyclically with fuel-injection valves actuated by fluid pressure
    • F02M47/02Fuel-injection apparatus operated cyclically with fuel-injection valves actuated by fluid pressure of accumulator-injector type, i.e. having fuel pressure of accumulator tending to open, and fuel pressure in other chamber tending to close, injection valves and having means for periodically releasing that closing pressure
    • F02M47/027Electrically actuated valves draining the chamber to release the closing pressure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M57/00Fuel-injectors combined or associated with other devices
    • F02M57/005Fuel-injectors combined or associated with other devices the devices being sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061Electrical connection means
    • G01L19/0084Electrical connection means to the outside of the housing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/148Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L23/00Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
    • G01L23/08Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically
    • G01L23/18Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically by resistance strain gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02DCONTROLLING COMBUSTION ENGINES
    • F02D2200/00Input parameters for engine control
    • F02D2200/02Input parameters for engine control the parameters being related to the engine
    • F02D2200/06Fuel or fuel supply system parameters
    • F02D2200/0602Fuel pressure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M2200/00Details of fuel-injection apparatus, not otherwise provided for
    • F02M2200/24Fuel-injection apparatus with sensors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02MSUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
    • F02M2200/00Details of fuel-injection apparatus, not otherwise provided for
    • F02M2200/24Fuel-injection apparatus with sensors
    • F02M2200/247Pressure sensors

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Fuel-Injection Apparatus (AREA)

Description

本発明は、物理量に応じた電気信号を出力するセンサ装置に関するものである。   The present invention relates to a sensor device that outputs an electrical signal corresponding to a physical quantity.

内燃機関に燃料を噴射するインジェクタとして、燃料の圧力を検出するセンサ装置を内蔵するものが提案されている(例えば、特許文献1参照)。そして、このセンサ装置は、モールドIC等の電気回路部をハウジングに一体化した状態で、ハウジングの外周部に係合する治具を用いて、ハウジングをインジェクタのボデーに螺合させるようになっている。より詳細には、治具は、ハウジングの軸方向一端側から電気回路部を通り越してハウジングの外周部に係合する。   As an injector for injecting fuel into an internal combustion engine, one having a built-in sensor device for detecting the pressure of the fuel has been proposed (for example, see Patent Document 1). In this sensor device, the electric circuit part such as a mold IC is integrated with the housing, and the housing is screwed to the body of the injector using a jig that engages with the outer peripheral part of the housing. Yes. More specifically, the jig engages with the outer peripheral portion of the housing through the electric circuit portion from one axial end side of the housing.

特開2010−242574号公報JP 2010-242574 A

しかしながら、従来のセンサ装置は、ハウジングの外周部に治具を係合させるために、ハウジングの外形を電気回路部よりも大きくする必要がある。このことが、センサ装置の小型化を阻害する1つの要因になっていた。   However, in the conventional sensor device, the outer shape of the housing needs to be larger than the electric circuit portion in order to engage the jig with the outer peripheral portion of the housing. This has been one factor that hinders downsizing of the sensor device.

本発明は上記点に鑑みて、センサ装置の小型化を可能にすることを目的とする。   In view of the above points, an object of the present invention is to enable downsizing of a sensor device.

上記目的を達成するため、請求項1に記載の発明では、被取り付け部材(10)に螺合されるハウジング(12)と、ハウジング(12)の一端側に配置され、信号処理用の電子部品(160)を有する電気回路部(16)とを備え、ハウジング(12)および電気回路部(16)が一体化された後に、治具(50)によりハウジング(12)が被取り付け部材(10)に螺合され、物理量に応じた電気信号を出力するセンサ装置であって、電気回路部(16)を貫通する複数のピン(40)を備え、ピン(40)の一端はハウジング(12)のピン挿入孔(122)に挿入されて固定されると共に、ピン(40)の他端は電気回路部(16)から突出して治具(50)と係合可能に構成されていることを特徴とする。   In order to achieve the above object, according to the first aspect of the present invention, the housing (12) to be screwed to the attached member (10) and the electronic component for signal processing disposed on one end side of the housing (12) After the housing (12) and the electric circuit portion (16) are integrated, the housing (12) is attached by the jig (50) to the mounted member (10). Is a sensor device that outputs an electrical signal according to a physical quantity, and includes a plurality of pins (40) that penetrate the electrical circuit portion (16), and one end of the pin (40) is provided on the housing (12). The pin is inserted and fixed in the pin insertion hole (122), and the other end of the pin (40) protrudes from the electric circuit portion (16) and is configured to be engageable with the jig (50). To do.

これによると、ハウジング(12)に固定したピン(40)と治具(50)とを係合させて、治具(50)によりハウジング(12)を被取り付け部材(10)に螺合させることができるため、ハウジング(12)の外形を電気回路部(16)よりも大きくする必要がなくなり、センサ装置の小型化が可能になる。   According to this, the pin (40) fixed to the housing (12) is engaged with the jig (50), and the housing (12) is screwed to the attached member (10) by the jig (50). Therefore, it is not necessary to make the outer shape of the housing (12) larger than that of the electric circuit portion (16), and the sensor device can be downsized.

請求項2に記載の発明では、被取り付け部材(10)に螺合されるハウジング(12)と、ハウジング(12)の一端側に配置され、信号処理用の電子部品(160)を有する電気回路部(16)とを備え、ハウジング(12)および電気回路部(16)が一体化された後に、複数のピン部(501)を有する治具(50)によりハウジング(12)が被取り付け部材(10)に螺合され、物理量に応じた電気信号を出力するセンサ装置であって、電気回路部(16)はピン部(501)が貫通可能な貫通孔(164)を備え、ハウジング(12)はピン部(501)の先端が係合可能なピン挿入孔(122)を備えることを特徴とする。   According to the second aspect of the present invention, an electric circuit having a housing (12) screwed to the attached member (10) and an electronic component (160) for signal processing disposed on one end side of the housing (12). After the housing (12) and the electric circuit portion (16) are integrated, the housing (12) is attached to the attached member (50) by the jig (50) having a plurality of pin portions (501). 10) A sensor device that is screwed into 10) and outputs an electrical signal corresponding to a physical quantity. The electrical circuit portion (16) includes a through hole (164) through which the pin portion (501) can pass, and the housing (12). Has a pin insertion hole (122) with which the tip of the pin portion (501) can be engaged.

これによると、治具(50)のピン部(501)をハウジング(12)のピン挿入孔(122)に係合させて、治具(50)によりハウジング(12)を被取り付け部材(10)に螺合させることができるため、ハウジング(12)の外形を電気回路部(16)よりも大きくする必要がなくなり、センサ装置の小型化が可能になる。   According to this, the pin portion (501) of the jig (50) is engaged with the pin insertion hole (122) of the housing (12), and the housing (12) is attached by the jig (50). Therefore, it is not necessary to make the outer shape of the housing (12) larger than that of the electric circuit portion (16), and the sensor device can be downsized.

なお、この欄および特許請求の範囲で記載した各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示すものである。   In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

本発明の第1実施形態に係るセンサ装置を備えるインジェクタの要部を示す正面断面図である。It is front sectional drawing which shows the principal part of an injector provided with the sensor apparatus which concerns on 1st Embodiment of this invention. 第1ターミナル部材を組み付ける前の状態を示すインジェクタの平面図である。It is a top view of the injector which shows the state before attaching a 1st terminal member. 第1ターミナル部材を組み付けた後の状態を示すインジェクタの平面図である。It is a top view of the injector which shows the state after attaching the 1st terminal member. (a)は図1のインジェクタにおけるセンサ装置の要部を示す正面断面図、(b)は(a)の平面図である。(A) is front sectional drawing which shows the principal part of the sensor apparatus in the injector of FIG. 1, (b) is a top view of (a). (a)は図1の第1ターミナル部材単体を示す平面図、(b)は(a)のA−A線に沿う断面図である。(A) is a top view which shows the 1st terminal member single-piece | unit of FIG. 1, (b) is sectional drawing which follows the AA line of (a). 図1のセンサ装置の要部および組み付け治具を示す正面断面図である。It is front sectional drawing which shows the principal part and assembly | attachment jig | tool of the sensor apparatus of FIG. 本発明の第2実施形態に係るセンサ装置の要部および組み付け治具を示す正面断面図である。It is front sectional drawing which shows the principal part and assembly | attachment jig | tool of the sensor apparatus which concern on 2nd Embodiment of this invention.

以下、本発明の実施形態について図に基づいて説明する。なお、以下の各実施形態相互において、互いに同一もしくは均等である部分には、図中、同一符号を付してある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(第1実施形態)
本発明の第1実施形態について説明する。図1は第1実施形態に係るセンサ装置を備えるインジェクタの要部を示す正面断面図、図2は第1ターミナル部材を組み付ける前の状態を示すインジェクタの平面図、図3は第1ターミナル部材を組み付けた後の状態を示すインジェクタの平面図、図4(a)は図1のインジェクタにおけるセンサ装置の要部を示す正面断面図、図4(b)は図4(a)の平面図、図5(a)は図1の第1ターミナル部材単体を示す平面図、図5(b)は図5(a)のA−A線に沿う断面図、図6は図1のセンサ装置の要部および組み付け治具を示す正面断面図である。
(First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is a front sectional view showing an essential part of an injector provided with the sensor device according to the first embodiment, FIG. 2 is a plan view of the injector showing a state before assembling the first terminal member, and FIG. 3 shows the first terminal member. FIG. 4A is a front sectional view showing the main part of the sensor device in the injector of FIG. 1, FIG. 4B is a plan view of FIG. 4A, and FIG. 5 (a) is a plan view showing the first terminal member alone of FIG. 1, FIG. 5 (b) is a cross-sectional view taken along the line AA of FIG. 5 (a), and FIG. 6 is a main part of the sensor device of FIG. It is front sectional drawing which shows an assembly jig | tool.

図1、図4に示すように、インジェクタは、コモンレール(図示せず)から供給される高圧燃料をディーゼル内燃機関の気筒内に噴射するものであり、被取り付け部材としての金属製のインジェクタボデー10には、高圧燃料が流通する高圧通路100、および高圧通路100から分岐した分岐通路101が形成されている。   As shown in FIGS. 1 and 4, the injector injects high-pressure fuel supplied from a common rail (not shown) into a cylinder of a diesel internal combustion engine, and is made of a metal injector body 10 as a member to be attached. A high-pressure passage 100 through which high-pressure fuel flows and a branch passage 101 branched from the high-pressure passage 100 are formed.

インジェクタボデー10の上端には、鍔付き円筒状の金属製のハウジング12が螺合されている。このハウジング12は、インジェクタボデー10に螺合するための雄ねじ部120、分岐通路101を介して導かれる燃料の圧力に応じて変形する薄肉部121、およびピン40(詳細後述)が挿入される3つのピン挿入孔122を備えている。   A cylindrical metal housing 12 with a flange is screwed to the upper end of the injector body 10. The housing 12 is inserted with a male screw portion 120 for screwing into the injector body 10, a thin wall portion 121 that deforms according to the pressure of the fuel guided through the branch passage 101, and a pin 40 (details will be described later) 3 Two pin insertion holes 122 are provided.

薄肉部121には、薄肉部121の変形に応じて(換言すると、高圧通路100の燃料圧力に応じて)抵抗値が変化するセンサ部14が貼付されている。   A sensor portion 14 whose resistance value changes according to deformation of the thin portion 121 (in other words, according to the fuel pressure in the high pressure passage 100) is attached to the thin portion 121.

ハウジング12におけるハウジング回転軸X方向の一端側には、薄肉部121およびセンサ部14を囲むようにして、電気回路部としてのモールドIC16が配置されている。このモールドIC16は、センサ部14の抵抗値変化に基づいて圧力に応じた電気信号を出力する電子部品としての信号処理回路用IC160、および信号処理回路用IC160と電気的に接続されたリードフレーム161等を備えている。   On one end side of the housing 12 in the direction of the housing rotation axis X, a mold IC 16 as an electric circuit portion is disposed so as to surround the thin portion 121 and the sensor portion 14. The mold IC 16 includes a signal processing circuit IC 160 as an electronic component that outputs an electric signal corresponding to pressure based on a change in the resistance value of the sensor unit 14, and a lead frame 161 electrically connected to the signal processing circuit IC 160. Etc.

信号処理回路用IC160、およびリードフレーム161は、電気絶縁性に富む樹脂よりなるモールド樹脂層162にて封止されている。そして、リードフレーム161の一部であるセンサターミナル163が、モールド樹脂層162の外周側面から突出している。また、リードフレーム161およびモールド樹脂層162には、ピン40が挿入されるモールドIC貫通孔164が3つ形成されている。   The signal processing circuit IC 160 and the lead frame 161 are sealed with a mold resin layer 162 made of a resin having high electrical insulation. A sensor terminal 163 that is a part of the lead frame 161 protrudes from the outer peripheral side surface of the mold resin layer 162. The lead frame 161 and the mold resin layer 162 are formed with three mold IC through holes 164 into which the pins 40 are inserted.

モールドIC16における反ハウジング側には、電気ノイズを遮断するための金属板よりなるシールドカバー18が配置されている。このシールドカバー18には、ピン40が挿入されるシールドカバー貫通孔180が3つ形成されている。   A shield cover 18 made of a metal plate for blocking electrical noise is disposed on the side of the mold IC 16 opposite to the housing. The shield cover 18 is formed with three shield cover through holes 180 into which the pins 40 are inserted.

ピン40は、金属にて円柱状に形成され、その軸方向中間部に鍔部400が形成されている。ピン40はシールドカバー貫通孔180およびモールドIC貫通孔164に挿入され、ピン40の一端がピン挿入孔122に圧入固定されている。これにより、モールドIC16およびシールドカバー18がピン40の鍔部400とハウジング12との間に挟持され、ハウジング12とモールドIC16とシールドカバー18が一体化されている。また、ピン40の他端および鍔部400は、モールドIC16およびシールドカバー18から突出している。   The pin 40 is formed of a metal in a columnar shape, and a flange portion 400 is formed in an intermediate portion in the axial direction. The pin 40 is inserted into the shield cover through hole 180 and the mold IC through hole 164, and one end of the pin 40 is press-fitted and fixed to the pin insertion hole 122. Thus, the mold IC 16 and the shield cover 18 are sandwiched between the flange portion 400 of the pin 40 and the housing 12, and the housing 12, the mold IC 16 and the shield cover 18 are integrated. Further, the other end of the pin 40 and the flange 400 protrude from the mold IC 16 and the shield cover 18.

シールドカバー18における反ハウジング側には、複数の中継ターミナル200を有する中継ターミナル部材20が配置されている。そして、シールドカバー18と中継ターミナル部材20は接着剤にて接合される。   A relay terminal member 20 having a plurality of relay terminals 200 is disposed on the opposite side of the shield cover 18 from the housing. The shield cover 18 and the relay terminal member 20 are joined with an adhesive.

中継ターミナル部材20における反ハウジング側には、複数の第1ターミナルを有する第1ターミナル部材22が配置され、第1ターミナル部材22における反ハウジング側には、複数の第2ターミナルを有する第2ターミナル部材24が配置され、さらに、第2ターミナル部材24における反ハウジング側には、電気絶縁性に富む樹脂よりなる略円筒状の絶縁部材26が配置されている。また、絶縁部材26の貫通孔260内を複数のリード線28が貫通している。さらに、貫通孔260とリード線28との間は、ゴムにて円筒状に形成された防水部材29にてシールされている。   A first terminal member 22 having a plurality of first terminals is disposed on the non-housing side of the relay terminal member 20, and a second terminal member having a plurality of second terminals on the non-housing side of the first terminal member 22. Further, a substantially cylindrical insulating member 26 made of a resin having a high electrical insulating property is disposed on the side opposite to the housing of the second terminal member 24. A plurality of lead wires 28 pass through the through hole 260 of the insulating member 26. Further, a space between the through hole 260 and the lead wire 28 is sealed with a waterproof member 29 formed in a cylindrical shape with rubber.

インジェクタボデー10の一端には、円筒状のカバー30が螺合されており、カバー30の開口端部に円板状のキャップ32が圧入固定されている。そして、インジェクタボデー10、カバー30およびキャップ32にて囲まれた空間に、ハウジング12やモールドIC16等が収容されている。   A cylindrical cover 30 is screwed to one end of the injector body 10, and a disk-shaped cap 32 is press-fitted and fixed to the opening end of the cover 30. The housing 12, the mold IC 16 and the like are accommodated in a space surrounded by the injector body 10, the cover 30, and the cap 32.

図4(b)に示すように、ハウジング回転軸X方向に見たときの、ハウジング12とモールドIC16とシールドカバー18の外形形状は、相似形になっている。また、ハウジング回転軸X方向に見たときの、ハウジング12の外形は、モールドIC16やシールドカバー18の外形よりも小さくなっている。   As shown in FIG. 4B, the outer shapes of the housing 12, the mold IC 16, and the shield cover 18 when viewed in the housing rotation axis X direction are similar. Further, the outer shape of the housing 12 when viewed in the housing rotation axis X direction is smaller than the outer shapes of the mold IC 16 and the shield cover 18.

図1、図2に示すように、中継ターミナル部材20は、モールド樹脂よりなるモールド樹脂層202を備え、導電性金属よりなる4つの中継ターミナル200をモールド成形して一体化したものであり、板状になっている。4つの中継ターミナル200は、一端部がモールド樹脂層202の外周側面から突出しており、それらの一端部がモールドIC16のセンサターミナル163と溶接されている。   As shown in FIGS. 1 and 2, the relay terminal member 20 includes a mold resin layer 202 made of a mold resin, and is formed by molding and integrating four relay terminals 200 made of a conductive metal. It is in the shape. One end of each of the four relay terminals 200 protrudes from the outer peripheral side surface of the mold resin layer 202, and one end thereof is welded to the sensor terminal 163 of the mold IC 16.

4つの中継ターミナル200のうち3つの中継ターミナル200は、ハウジング回転軸X周りに同心円状に配置された円弧状の中間部を備え、その円弧状中間部がモールド樹脂層202の一端面側に露出している。4つの中継ターミナル200のうち1つの中継ターミナル200は、ハウジング回転軸X中心に配置された略矩形状の部位を備え、その矩形状部位がモールド樹脂層202の一端面側に露出している。   Of the four relay terminals 200, three relay terminals 200 include an arc-shaped intermediate portion arranged concentrically around the housing rotation axis X, and the arc-shaped intermediate portion is exposed on one end surface side of the mold resin layer 202. doing. One relay terminal 200 of the four relay terminals 200 includes a substantially rectangular portion disposed at the center of the housing rotation axis X, and the rectangular portion is exposed on one end surface side of the mold resin layer 202.

図3、図5に示すように、第1ターミナル部材22は、モールド樹脂よりなるモールド樹脂層220を備え、導電性金属よりなる4つの第1ターミナル221をモールド成形して一体化したものである。モールド樹脂層220は、板状であり、中央部には矩形状の開口部222が形成されている。   As shown in FIGS. 3 and 5, the first terminal member 22 includes a mold resin layer 220 made of a mold resin, and is formed by molding and integrating four first terminals 221 made of a conductive metal. . The mold resin layer 220 is plate-shaped, and a rectangular opening 222 is formed at the center.

4つの第1ターミナル221は、細長い薄板をプレス成形した短冊状で、平行に配置されている。第1ターミナル221における長手方向の中間部が開口部222内に位置しており、その中間部には、中継ターミナル200における円弧状中間部や略矩形状部位に向けて突出した凸部223が成形されている。そして、この凸部223が、中継ターミナル200における円弧状中間部や略矩形状部位と溶接されている。   The four first terminals 221 are strips formed by press-molding thin thin plates, and are arranged in parallel. An intermediate portion in the longitudinal direction of the first terminal 221 is located in the opening 222, and a convex portion 223 protruding toward the arc-shaped intermediate portion or the substantially rectangular portion of the relay terminal 200 is formed at the intermediate portion. Has been. And this convex part 223 is welded with the circular arc-shaped intermediate part in the relay terminal 200, or a substantially rectangular site | part.

また、各第1ターミナル221における長手方向のいずれか一方の端部は、モールド樹脂層220から突出している。この長手方向に突出した側の端部224を、以下、突出端部224という。   In addition, any one end portion in the longitudinal direction of each first terminal 221 protrudes from the mold resin layer 220. The end 224 on the side protruding in the longitudinal direction is hereinafter referred to as a protruding end 224.

図1に示すように、第2ターミナル部材24は、モールド樹脂よりなるモールド樹脂層240を備え、導電性金属よりなる4つの第2ターミナル241をモールド成形して一体化したものである。   As shown in FIG. 1, the second terminal member 24 includes a mold resin layer 240 made of a mold resin, and is formed by molding and molding four second terminals 241 made of a conductive metal.

第2ターミナル241は、L字状になっており、両端部がモールド樹脂層240から突出している。そして、第2ターミナル241の一端側は、第1ターミナル221の突出端部224と溶接され、第2ターミナル241の他端側は、リード線28と電気的に接続されている。   The second terminal 241 is L-shaped, and both end portions protrude from the mold resin layer 240. One end side of the second terminal 241 is welded to the protruding end 224 of the first terminal 221, and the other end side of the second terminal 241 is electrically connected to the lead wire 28.

すなわち、信号処理回路用IC160は、センサターミナル163、中継ターミナル部材20、第1ターミナル部材22、および第2ターミナル部材24を介して、複数のリード線28と電気的に接続されている。これらのリード線28は、信号処理回路用IC160の電源用、接地用、センサ信号をエンジン制御用ECUに出力するセンサ信号出力用等に利用される。   That is, the signal processing circuit IC 160 is electrically connected to the plurality of lead wires 28 via the sensor terminal 163, the relay terminal member 20, the first terminal member 22, and the second terminal member 24. These lead wires 28 are used for power supply of the signal processing circuit IC 160, grounding, sensor signal output for outputting sensor signals to the engine control ECU, and the like.

次に、ハウジング12やモールドIC16等のインジェクタボデー10への組み付け手順について説明する。   Next, a procedure for assembling the housing 12 and the molded body 16 to the injector body 10 will be described.

まず、センササブアッシーを準備する。具体的には、ハウジング12の薄肉部121にセンサ部14を貼付する。続いて、モールドIC16におけるハウジング12側の面に接着剤を塗布した後、ピン挿入孔122とモールドIC貫通孔164とが同軸になるように位置決めしてハウジング12とモールドIC16とを一体化する。   First, a sensor sub-assembly is prepared. Specifically, the sensor unit 14 is attached to the thin portion 121 of the housing 12. Subsequently, after an adhesive is applied to the surface of the mold IC 16 on the housing 12 side, the housing 12 and the mold IC 16 are integrated by positioning so that the pin insertion hole 122 and the mold IC through hole 164 are coaxial.

続いて、センサ部14とモールドIC16の信号処理回路用IC160とをボンディングワイヤにて接続する。続いて、シールドカバー18におけるモールドIC16側の面に接着剤を塗布した後、モールドIC貫通孔164とシールドカバー貫通孔180とが同軸になるように位置決めしてシールドカバー18をハウジング12やモールドIC16と一体化する。   Subsequently, the sensor unit 14 and the signal processing circuit IC 160 of the mold IC 16 are connected by a bonding wire. Subsequently, after an adhesive is applied to the surface of the shield cover 18 on the mold IC 16 side, the shield cover 18 is positioned so that the mold IC through hole 164 and the shield cover through hole 180 are coaxial, and the shield cover 18 is positioned in the housing 12 or the mold IC 16. And integrate.

続いて、ピン40をシールドカバー貫通孔180およびモールドIC貫通孔164に挿入し、ピン40の一端をピン挿入孔122に圧入して、センササブアッシーが完成する。   Subsequently, the pin 40 is inserted into the shield cover through-hole 180 and the mold IC through-hole 164, and one end of the pin 40 is press-fitted into the pin insertion hole 122 to complete the sensor sub-assembly.

また、リード線サブアッシーを準備する。具体的には、第2ターミナル部材24とリード線28を一体化し、キャップ32と絶縁部材26を一体化する。そして、リード線28をカバー30に通し、さらに、リード線28を絶縁部材26の貫通孔260に通したものが、リード線サブアッシーである。   In addition, a lead wire sub-assembly is prepared. Specifically, the second terminal member 24 and the lead wire 28 are integrated, and the cap 32 and the insulating member 26 are integrated. A lead wire sub-assembly is formed by passing the lead wire 28 through the cover 30 and passing the lead wire 28 through the through hole 260 of the insulating member 26.

次に、図6に示すように、治具50を用いてセンササブアッシーをインジェクタボデー10に取り付ける。この治具50は、シールドカバー18から突出したピン40の他端と係合可能なピン係合孔500を3つ備えている。そして、ピン係合孔500にピン40の他端を挿入してそれらを係合させた後、治具50をハウジング回転軸X中心に回転させることにより、ハウジング12の雄ねじ部120をインジェクタボデー10に螺合させて、センササブアッシーをインジェクタボデー10に取り付ける。   Next, as shown in FIG. 6, the sensor subassembly is attached to the injector body 10 using a jig 50. The jig 50 includes three pin engagement holes 500 that can be engaged with the other end of the pin 40 protruding from the shield cover 18. Then, after inserting the other end of the pin 40 into the pin engaging hole 500 and engaging them, the jig 50 is rotated about the housing rotation axis X, whereby the male screw portion 120 of the housing 12 is moved to the injector body 10. And the sensor sub-assembly is attached to the injector body 10.

続いて、治具50を外し、図1に示すように、シールドカバー18における反モールドIC16側の面に接着剤を塗布した後、シールドカバー18の上に中継ターミナル部材20を重ねて両者を接着する。続いて、中継ターミナル部材20の中継ターミナル200とセンサターミナル163とを溶接する。   Subsequently, the jig 50 is removed, and an adhesive is applied to the surface of the shield cover 18 on the side opposite to the mold 16 as shown in FIG. 1, and then the relay terminal member 20 is stacked on the shield cover 18 to bond them together. To do. Subsequently, the relay terminal 200 of the relay terminal member 20 and the sensor terminal 163 are welded.

続いて、中継ターミナル部材20の上に第1ターミナル部材22を重ね、中継ターミナル200と第1ターミナル221の凸部223を溶接する。続いて、第1ターミナル221の上にリード線サブアッシーにおける第2ターミナル部材24を重ね、第1ターミナル221と第2ターミナル241とを溶接する。   Then, the 1st terminal member 22 is piled up on the relay terminal member 20, and the convex part 223 of the relay terminal 200 and the 1st terminal 221 is welded. Subsequently, the second terminal member 24 in the lead wire sub-assembly is overlaid on the first terminal 221, and the first terminal 221 and the second terminal 241 are welded.

続いて、センササブアッシー、中継ターミナル部材20、第1ターミナル部材22、およびリード線サブアッシーを、インジェクタボデー10に取り付けた状態のまま、樹脂にて二次成形する。続いて、カバー30をインジェクタボデー10に螺合して、カバー30をインジェクタボデー10に取り付ける。   Subsequently, the sensor sub-assembly, the relay terminal member 20, the first terminal member 22, and the lead wire sub-assembly are secondarily molded with resin while being attached to the injector body 10. Subsequently, the cover 30 is screwed into the injector body 10 and the cover 30 is attached to the injector body 10.

続いて、絶縁部材26をカバー30に圧入して、キャップ32と絶縁部材26をカバー30に組み付けるとともに、絶縁部材26の貫通孔260に防水部材29を挿入する。以上により、ハウジング12やモールドIC16等のインジェクタボデー10への組み付けが完了する。   Subsequently, the insulating member 26 is press-fitted into the cover 30, the cap 32 and the insulating member 26 are assembled to the cover 30, and the waterproof member 29 is inserted into the through hole 260 of the insulating member 26. Thus, the assembly of the housing 12 and the mold body 16 to the injector body 10 is completed.

本実施形態によると、ハウジング12に固定したピン40と治具50とを係合させて治具50によりハウジング12をインジェクタボデー10に螺合させるため、従来のようにハウジング12の外形をモールドIC16やシールドカバー18よりも大きくする必要がない。したがって、ハウジング12の外形をモールドIC16やシールドカバー18よりも小さくして、センサ装置を小型にすることができる。   According to this embodiment, since the pin 40 fixed to the housing 12 and the jig 50 are engaged and the housing 12 is screwed into the injector body 10 by the jig 50, the outer shape of the housing 12 is molded with the mold IC 16 as in the prior art. Or larger than the shield cover 18. Therefore, the outer shape of the housing 12 can be made smaller than that of the mold IC 16 and the shield cover 18, and the sensor device can be downsized.

また、ピン40を、ハウジング12、モールドIC16およびシールドカバー18の位置決めに利用することにより、ハウジング12に対するモールドIC16およびシールドカバー18の位置決め精度を高めることができる。   Further, by using the pins 40 for positioning the housing 12, the mold IC 16 and the shield cover 18, the positioning accuracy of the mold IC 16 and the shield cover 18 with respect to the housing 12 can be increased.

(第2実施形態)
本発明の第2実施形態について説明する。図7は第2実施形態に係るセンサ装置の要部および組み付け治具を示す正面断面図である。以下、第1実施形態と異なる部分についてのみ説明する。
(Second Embodiment)
A second embodiment of the present invention will be described. FIG. 7 is a front cross-sectional view showing the main part and assembly jig of the sensor device according to the second embodiment. Only the parts different from the first embodiment will be described below.

図7に示すように、治具50には円柱状のピン部501が3つ形成され、これに伴い、第1実施形態におけるピン40が廃止されている。   As shown in FIG. 7, three cylindrical pin portions 501 are formed on the jig 50, and accordingly, the pins 40 in the first embodiment are abolished.

次に、ハウジング12やモールドIC16等のインジェクタボデー10への組み付け手順について説明する。   Next, a procedure for assembling the housing 12 and the molded body 16 to the injector body 10 will be described.

まず、ハウジング12の薄肉部121にセンサ部14を貼付する。続いて、モールドIC16におけるハウジング12側の面に接着剤を塗布した後、ピン挿入孔122とモールドIC貫通孔164とが同軸になるように位置決めしてハウジング12とモールドIC16とを一体化する。   First, the sensor part 14 is affixed to the thin part 121 of the housing 12. Subsequently, after an adhesive is applied to the surface of the mold IC 16 on the housing 12 side, the housing 12 and the mold IC 16 are integrated by positioning so that the pin insertion hole 122 and the mold IC through hole 164 are coaxial.

続いて、センサ部14とモールドIC16の信号処理回路用IC160とをボンディングワイヤにて接続する。続いて、シールドカバー18におけるモールドIC16側の面に接着剤を塗布した後、モールドIC貫通孔164とシールドカバー貫通孔180とが同軸になるように位置決めしてシールドカバー18をハウジング12やモールドIC16と一体化する。   Subsequently, the sensor unit 14 and the signal processing circuit IC 160 of the mold IC 16 are connected by a bonding wire. Subsequently, after an adhesive is applied to the surface of the shield cover 18 on the mold IC 16 side, the shield cover 18 is positioned so that the mold IC through hole 164 and the shield cover through hole 180 are coaxial, and the shield cover 18 is positioned in the housing 12 or the mold IC 16. And integrate.

続いて、治具50のピン部501をシールドカバー貫通孔180およびモールドIC貫通孔164に挿入し、ピン40の先端をピン係合孔500に挿入して係合させた後、治具50をハウジング回転軸X中心に回転させることにより、ハウジング12の雄ねじ部120をインジェクタボデー10に螺合させる。そして、治具50を外し、以下第1実施形態と同様の手順で組み付けを行う。   Subsequently, after inserting the pin portion 501 of the jig 50 into the shield cover through-hole 180 and the mold IC through-hole 164 and inserting the tip of the pin 40 into the pin engagement hole 500 to be engaged, the jig 50 is attached. By rotating about the housing rotation axis X, the male screw portion 120 of the housing 12 is screwed into the injector body 10. And the jig | tool 50 is removed and it assembles | assembles in the same procedure as 1st Embodiment below.

本実施形態によると、治具50のピン部501をハウジング12のピン係合孔500に係合させて治具50によりハウジング12をインジェクタボデー10に螺合させるため、ハウジング12の外形をモールドIC16やシールドカバー18よりも小さくして、センサ装置を小型にすることができる。   According to this embodiment, since the pin portion 501 of the jig 50 is engaged with the pin engaging hole 500 of the housing 12 and the housing 12 is screwed into the injector body 10 by the jig 50, the outer shape of the housing 12 is molded with the mold IC16. In addition, the sensor device can be made smaller than the shield cover 18.

(他の実施形態)
上記実施形態では、本発明をインジェクタに適用したが、本発明はインジェクタ以外にも適用することができる。
(Other embodiments)
In the above embodiment, the present invention is applied to an injector, but the present invention can be applied to other than the injector.

また、上記実施形態では、圧力を検出するセンサ装置を示したが、本発明は圧力以外の物理量を検出するセンサ装置にも適用することができる。   Moreover, although the sensor apparatus which detects a pressure was shown in the said embodiment, this invention is applicable also to the sensor apparatus which detects physical quantities other than a pressure.

10 インジェクタボデー(被取り付け部材)
12 ハウジング
16 モールドIC(電気回路部)
40 ピン
50 治具
122 ピン挿入孔
160 信号処理回路用IC(電子部品)
10 Injector body (attachment member)
12 Housing 16 Mold IC (Electric Circuit)
40 pin 50 jig 122 pin insertion hole 160 IC for signal processing circuit (electronic component)

Claims (4)

被取り付け部材(10)に螺合されるハウジング(12)と、前記ハウジング(12)の一端側に配置され、信号処理用の電子部品(160)を有する電気回路部(16)とを備え、前記ハウジング(12)および前記電気回路部(16)が一体化された後に、治具(50)により前記ハウジング(12)が前記被取り付け部材(10)に螺合され、物理量に応じた電気信号を出力するセンサ装置であって、
前記電気回路部(16)を貫通する複数のピン(40)を備え、前記ピン(40)の一端は前記ハウジング(12)のピン挿入孔(122)に挿入されて固定されると共に、前記ピン(40)の他端は前記電気回路部(16)から突出して前記治具(50)と係合可能に構成されていることを特徴とするセンサ装置。
A housing (12) screwed into the member to be attached (10), and an electric circuit portion (16) disposed on one end side of the housing (12) and having an electronic component (160) for signal processing, After the housing (12) and the electric circuit portion (16) are integrated, the housing (12) is screwed to the attachment member (10) by a jig (50), and an electric signal corresponding to a physical quantity is obtained. A sensor device that outputs
A plurality of pins (40) penetrating the electric circuit portion (16) are provided, and one end of the pin (40) is inserted and fixed in a pin insertion hole (122) of the housing (12). The other end of (40) protrudes from the said electric circuit part (16), and is comprised so that engagement with the said jig | tool (50) is possible.
被取り付け部材(10)に螺合されるハウジング(12)と、前記ハウジング(12)の一端側に配置され、信号処理用の電子部品(160)を有する電気回路部(16)とを備え、前記ハウジング(12)および前記電気回路部(16)が一体化された後に、複数のピン部(501)を有する治具(50)により前記ハウジング(12)が前記被取り付け部材(10)に螺合され、物理量に応じた電気信号を出力するセンサ装置であって、
前記電気回路部(16)は前記ピン部(501)が貫通可能な貫通孔(164)を備え、前記ハウジング(12)は前記ピン部(501)の先端が係合可能なピン挿入孔(122)を備えることを特徴とするセンサ装置。
A housing (12) screwed into the member to be attached (10), and an electric circuit portion (16) disposed on one end side of the housing (12) and having an electronic component (160) for signal processing, After the housing (12) and the electric circuit portion (16) are integrated, the housing (12) is screwed onto the attachment member (10) by a jig (50) having a plurality of pin portions (501). A sensor device that outputs an electrical signal according to a physical quantity,
The electric circuit part (16) includes a through hole (164) through which the pin part (501) can pass, and the housing (12) has a pin insertion hole (122) with which the tip of the pin part (501) can be engaged. A sensor device.
前記電気回路部(16)は、前記電子部品(160)を樹脂にて封止したモールドICであることを特徴とする請求項1または2に記載のセンサ装置。   3. The sensor device according to claim 1, wherein the electric circuit section is a mold IC in which the electronic component is sealed with a resin. 4. 前記被取り付け部材(10)は、内燃機関に燃料を噴射するインジェクタのボデーであり、
前記物理量は、前記ボデー(10)内を流通する燃料の圧力であることを特徴とする請求項1ないし3のいずれか1つに記載のセンサ装置。
The attached member (10) is an injector body that injects fuel into the internal combustion engine;
The sensor device according to any one of claims 1 to 3, wherein the physical quantity is a pressure of fuel flowing in the body (10).
JP2011081943A 2011-04-01 2011-04-01 Sensor device Expired - Fee Related JP5522108B2 (en)

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CN201210090718.5A CN102735388B (en) 2011-04-01 2012-03-30 Sensor apparatus integrated to injector of internal combustion engine
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