JP5780492B2 - Silicone composition for vibration damping material and vibration damping material obtained by curing the same - Google Patents
Silicone composition for vibration damping material and vibration damping material obtained by curing the same Download PDFInfo
- Publication number
- JP5780492B2 JP5780492B2 JP2012175696A JP2012175696A JP5780492B2 JP 5780492 B2 JP5780492 B2 JP 5780492B2 JP 2012175696 A JP2012175696 A JP 2012175696A JP 2012175696 A JP2012175696 A JP 2012175696A JP 5780492 B2 JP5780492 B2 JP 5780492B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- silicone composition
- acid
- vibration damping
- damping material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001296 polysiloxane Polymers 0.000 title claims description 115
- 238000013016 damping Methods 0.000 title claims description 50
- 239000000203 mixture Substances 0.000 title claims description 47
- 239000000463 material Substances 0.000 title claims description 42
- -1 polysiloxane Polymers 0.000 claims description 87
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims description 30
- 239000003054 catalyst Substances 0.000 claims description 26
- 125000005372 silanol group Chemical group 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 12
- 238000006460 hydrolysis reaction Methods 0.000 claims description 10
- 229910000077 silane Inorganic materials 0.000 claims description 9
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 8
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 8
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 7
- 230000007062 hydrolysis Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052718 tin Inorganic materials 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 7
- 239000004945 silicone rubber Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920002545 silicone oil Polymers 0.000 description 5
- 241001247482 Amsonia Species 0.000 description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 4
- 125000005370 alkoxysilyl group Chemical group 0.000 description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- 239000012975 dibutyltin dilaurate Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 229920006311 Urethane elastomer Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 150000007529 inorganic bases Chemical class 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 150000007530 organic bases Chemical class 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- GYSCBCSGKXNZRH-UHFFFAOYSA-N 1-benzothiophene-2-carboxamide Chemical compound C1=CC=C2SC(C(=O)N)=CC2=C1 GYSCBCSGKXNZRH-UHFFFAOYSA-N 0.000 description 1
- PPNCOQHHSGMKGI-UHFFFAOYSA-N 1-cyclononyldiazonane Chemical compound C1CCCCCCCC1N1NCCCCCCC1 PPNCOQHHSGMKGI-UHFFFAOYSA-N 0.000 description 1
- NFDXQGNDWIPXQL-UHFFFAOYSA-N 1-cyclooctyldiazocane Chemical compound C1CCCCCCC1N1NCCCCCC1 NFDXQGNDWIPXQL-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZJEBBVLQWCVKRI-UHFFFAOYSA-N ClCC(=O)O.C1(=CC=CC=C1)S(=O)(=O)O Chemical compound ClCC(=O)O.C1(=CC=CC=C1)S(=O)(=O)O ZJEBBVLQWCVKRI-UHFFFAOYSA-N 0.000 description 1
- GHVNFZFCNZKVNT-UHFFFAOYSA-N Decanoic acid Natural products CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- ZRGUXTGDSGGHLR-UHFFFAOYSA-K aluminum;triperchlorate Chemical compound [Al+3].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O ZRGUXTGDSGGHLR-UHFFFAOYSA-K 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229960004365 benzoic acid Drugs 0.000 description 1
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- LGBHQFWRSMFRJF-UHFFFAOYSA-N butanedioic acid;oxalic acid Chemical compound OC(=O)C(O)=O.OC(=O)CCC(O)=O LGBHQFWRSMFRJF-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012973 diazabicyclooctane Substances 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- ZIYVHBGGAOATLY-UHFFFAOYSA-N methylmalonic acid Chemical compound OC(=O)C(C)C(O)=O ZIYVHBGGAOATLY-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 229960002969 oleic acid Drugs 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000004980 phosphorus peroxides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960004274 stearic acid Drugs 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- LYSLZRDZOBAUFL-UHFFFAOYSA-L zinc;4-tert-butylbenzoate Chemical compound [Zn+2].CC(C)(C)C1=CC=C(C([O-])=O)C=C1.CC(C)(C)C1=CC=C(C([O-])=O)C=C1 LYSLZRDZOBAUFL-UHFFFAOYSA-L 0.000 description 1
- JDLYKQWJXAQNNS-UHFFFAOYSA-L zinc;dibenzoate Chemical compound [Zn+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 JDLYKQWJXAQNNS-UHFFFAOYSA-L 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Vibration Prevention Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Description
本発明は、各種部材や装置を振動から保護する制振材用シリコーン組成物およびこれを硬化させて得られる制振材に関する。 The present invention relates to a silicone composition for damping material that protects various members and devices from vibrations, and a damping material obtained by curing the silicone composition.
従来、コンパクトディスク、レーザーディスク(登録商標)等の光学信号読み取り装置、磁気ディスク、光磁気ディスク等の磁気信号読み取り装置、精密測定装置、精密機器、また振動が発生するポンプなどには、これらを振動による破損から保護するためゴムやエラストマーなどからなる制振材が使用されている。特に、半導体製造装置やその測定装置のステージには、nmオーダーの高い位置決め性能が要求され、高精度位置決めを行うためには、装置の定常振動、ステージ動作時の残留振動を抑える必要があり、制振材が用いられている。 Conventionally, these are used for optical signal readers such as compact discs and laser discs (registered trademark), magnetic signal readers such as magnetic discs and magneto-optical discs, precision measuring devices, precision instruments, and pumps that generate vibration. Damping materials made of rubber or elastomer are used to protect against damage caused by vibration. In particular, high-level positioning performance on the order of nm is required for semiconductor manufacturing equipment and the stage of its measuring equipment, and in order to perform high-precision positioning, it is necessary to suppress steady vibration of the equipment and residual vibration during stage operation. Damping material is used.
制振材としては、振動を吸収する制振性に加えて、長時間の使用に耐えられる高い耐久性、同時に振動を吸収することで発生する熱にも耐えられる高い耐熱性が求められている。これまで、高い制振性を有する材料としては、ウレタンゴムやアクリルゴムが用いられているが、これらは耐久性が低く、長期間の使用や多数回の振動により、形状が変形し制振性が失われたり、材料が液状化したりすることが多く見られている(特許文献1)。
一方、シリコーン系の制振材として、シリコーンオイル等の粘性液体に固体粉末を混合したものや、シリコーンゲルが知られている(特許文献2〜4)。これらは液体であるため、長時間の使用によりシリコーンオイルが浸み出し、変形が発生しやすく、さらに揮発性の環状シロキサンが発生するため、精密機器や、長時間振動し続ける機械にはできない問題があった。
As damping materials, in addition to damping properties that absorb vibration, high durability that can withstand long-term use, and at the same time, high heat resistance that can withstand the heat generated by absorbing vibration is required. . Up to now, urethane rubber and acrylic rubber have been used as materials with high vibration damping properties, but these have low durability, and their shape changes due to long-term use and numerous vibrations. Are often lost or the material is liquefied (Patent Document 1).
On the other hand, as a silicone-based vibration damping material, a mixture of a viscous liquid such as silicone oil with a solid powder or a silicone gel is known (Patent Documents 2 to 4). Since these are liquids, silicone oil oozes out when used for a long time, easily deforms, and further generates volatile cyclic siloxane, which is impossible for precision instruments and machines that continue to vibrate for a long time. was there.
本発明は、硬化させることにより、優れた制振性を有しつつ、耐久性および耐熱性も合わせもつ制振材を与える制振材用シリコーン組成物を提供することを目的とする。 An object of the present invention is to provide a silicone composition for a vibration damping material that provides a vibration damping material having excellent vibration damping properties and durability and heat resistance by being cured.
本発明者らは、上記課題を解決するために鋭意検討した結果、特定のトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン、特定のオルガノポリシロキサン(B)を用いることにより上記課題を解決しうることを見出し、本発明を完成するに到った。 As a result of intensive studies to solve the above problems, the present inventors can solve the above problems by using a specific trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane and a specific organopolysiloxane (B). As a result, the present invention has been completed.
すなわち、本発明は、一般式(1):
(式中、R1は、メチル基またはフェニル基を表し、平均繰り返し単位数mは、30〜1,500の整数を表す)で表される両末端にシラノール基を有するポリシロキサン(1)および一般式(2):Si(OR2)4(式中、R2は、メチル基またはエチル基を表す)で表されるテトラアルコキシシランの部分縮合物(2)を脱アルコール反応させて得られるトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)、一般式(3):R3 3SiX(式中、R3 は、炭素数1〜6の炭化水素基、Xはメトキシ基、エトキシ基又はクロロ基を表す)で表されるシラン化合物(3)及び一般式(4):SiX´4(式中、X´はメトキシ基、エトキシ基又はクロロ基を表す)で表されるシラン化合物(4)を加水分解、縮合して得られるオルガノポリシロキサン(B)ならびに硬化触媒(C)を含有し、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)とオルガノポリシロキサン(B)のシロキサン単位のモル比率((A):(B))が、10:4〜15であることを特徴とする制振材用シリコーン組成物;前記制振材用シリコーン組成物を硬化させて得られる制振材に関する。
That is, the present invention relates to the general formula (1):
(Wherein R 1 represents a methyl group or a phenyl group, and the average repeating unit number m represents an integer of 30 to 1,500) and polysiloxane (1) having silanol groups at both ends It is obtained by subjecting a partial condensate (2) of tetraalkoxysilane represented by the general formula (2): Si (OR 2 ) 4 (wherein R 2 represents a methyl group or an ethyl group) to a dealcoholization reaction. Trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A), general formula (3): R 3 3 SiX (wherein R 3 is a hydrocarbon group having 1 to 6 carbon atoms, X is a methoxy group, an ethoxy group, or Silane compound (3) represented by the formula (4): SiX ′ 4 (wherein X ′ represents a methoxy group, an ethoxy group, or a chloro group) (4) ) Hydrolysis, shrinkage The organopolysiloxane (B) and the curing catalyst (C) obtained by combining, the molar ratio of the siloxane units of the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) and the organopolysiloxane (B) ((A ): (B)) is 10: 4-15, and relates to a damping material obtained by curing the silicone composition for damping material.
本発明は、優れた制振性を有しつつ、長期間の使用によって制振性が低下しない耐久性と、振動吸収熱等による劣化を生じにくい耐熱性を併せ持つ制振材を得ることができる。 INDUSTRIAL APPLICABILITY The present invention can provide a vibration damping material that has excellent vibration damping properties, durability that does not deteriorate the vibration damping properties over a long period of use, and heat resistance that hardly causes deterioration due to vibration absorption heat or the like. .
本発明の制振材用シリコーン組成物はトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)とオルガノポリシロキサン(B)ならびに硬化触媒(C)を含有することを特徴とする。
本発明のトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)は、一般式(1):
The trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) of the present invention has the general formula (1):
(式中、R1は、メチル基またはフェニル基を表し、平均繰り返し単位数mは、30〜1,500の整数を表す)で表される両末端にシラノール基を有するポリシロキサンおよび一般式(2):Si(OR2)4(式中、R2は、メチル基またはエチル基を表す)で表わされるテトラアルコキシシランの部分縮合物(2)を脱アルコール反応させて得られる。 (Wherein R 1 represents a methyl group or a phenyl group, and the average repeating unit number m represents an integer of 30 to 1,500) and a polysiloxane having a silanol group at both ends and a general formula ( 2): Obtained by dealcoholizing a partial condensate (2) of tetraalkoxysilane represented by Si (OR 2 ) 4 (wherein R 2 represents a methyl group or an ethyl group).
本発明で用いる両末端にシラノール基を有するポリシロキサン(1)は、前述の一般式(1)で表される主鎖の両末端にシラノール基を有するものであり、R1がメチル基またはフェニル基であるシリコーンオイルである。 The polysiloxane (1) having silanol groups at both ends used in the present invention has silanol groups at both ends of the main chain represented by the general formula (1), and R 1 is a methyl group or a phenyl group. This is the base silicone oil.
このようなポリシロキサン(1)の主鎖構造としては、ポリジメチルシロキサン、ポリメチルフェニルシロキサン、ポリジフェニルシロキサン等が挙げられ、2種類以上の主鎖構造を持つシロキサンを混合して用いても良い。本発明に用いるポリシロキサン(1)はその主鎖構造が、有機性共有結合(C−C、C−O、Si−Cなど)を含まず、耐熱性の強いシロキサン結合(Si−O−Si)で構成され、主鎖の両末端に、シラノール基(SiOH)が直接結合した構造を有していていることを特徴としている。一般的な市販のシリコーンオイルは、ポリエーテルやポリカーボネートなどを主鎖構造中に含むものや、分子末端がアミノプロピル基、グリシドキシプロピル基、カルビトール基、(メタ)アクリル基などの有機性官能基を持つものが多いが、有機性共有結合を含むこれらのシリコーンオイルを使うと、硬化物の耐熱性が落ち好ましくない。 Examples of the main chain structure of such polysiloxane (1) include polydimethylsiloxane, polymethylphenylsiloxane, polydiphenylsiloxane, and the like, and siloxanes having two or more types of main chain structures may be used in combination. . The polysiloxane (1) used in the present invention does not contain organic covalent bonds (C—C, C—O, Si—C, etc.) in the main chain structure, and has a high heat resistance siloxane bond (Si—O—Si). And a structure in which silanol groups (SiOH) are directly bonded to both ends of the main chain. Common commercially available silicone oils include those containing polyether or polycarbonate in the main chain structure, and organic molecules such as aminopropyl groups, glycidoxypropyl groups, carbitol groups, and (meth) acrylic groups at the molecular ends. Although many have functional groups, the use of these silicone oils containing an organic covalent bond is not preferable because the heat resistance of the cured product is lowered.
両末端にシラノール基を有するポリシロキサン(1)は、主に硬化物の硬さ、オルガノポリシロキサン(B)との相溶性及び得られるシリコーン組成物の粘度を適切なものとする観点から、一般式(1)における平均繰り返し単位数mは30〜1,500程度、好ましくは50〜1,000のものを使用する。また、両末端にシラノール基を有するポリシロキサン(1)のゲル浸透クロマトグラフ(GPC、東ソー(株)製SC8010)によって測定した数平均分子量は500〜100,000程度、好ましくは800〜70,000のものを使用することが好ましい。数平均分子量を500以上とすることにより硬化物の硬度を適度に維持でき、クラック等の発生を抑制できるため好ましく、100,000以下とすることによりオルガノポリシロキサン(B)と混和しやすくなり、得られるシリコーン組成物の粘度を適度に維持でき、取り扱いが容易になるため好ましい。 The polysiloxane (1) having silanol groups at both ends is generally used from the viewpoint of suitable hardness of the cured product, compatibility with the organopolysiloxane (B) and the viscosity of the resulting silicone composition. The average repeating unit number m in the formula (1) is about 30 to 1,500, preferably 50 to 1,000. The number average molecular weight measured by gel permeation chromatography (GPC, SC8010 manufactured by Tosoh Corp.) of polysiloxane (1) having silanol groups at both ends is about 500 to 100,000, preferably 800 to 70,000. Are preferably used. By setting the number average molecular weight to 500 or more, the hardness of the cured product can be appropriately maintained, and it is preferable because the occurrence of cracks and the like can be suppressed. By setting the number average molecular weight to 100,000 or less, it becomes easy to mix with the organopolysiloxane (B). It is preferable because the viscosity of the resulting silicone composition can be maintained moderately and handling becomes easy.
テトラアルコキシシランの部分縮合物(2)は、前述の一般式(2)で表されるテトラアルコキシシランを部分的に加水分解、縮合させたものである。ここで、R2としてはメチル基あるいはエチル基を示す。R2としてメチル基またはエチル基以外の置換基を有するものを用いた場合には、シリコーン組成物の硬化が困難になる。一方、R2がシラノール基の場合にはシリコーン組成物の粘度安定性が悪くなり取扱いにくくなる。 The tetraalkoxysilane partial condensate (2) is obtained by partially hydrolyzing and condensing the tetraalkoxysilane represented by the general formula (2). Here, R 2 represents a methyl group or an ethyl group. When using R 2 having a substituent other than a methyl group or an ethyl group, curing of the silicone composition becomes difficult. On the other hand, when R 2 is a silanol group, the viscosity stability of the silicone composition is deteriorated and the handling becomes difficult.
このようなテトラアルコキシシランの具体例としては、テトラメトキシシラン、テトラエトキシシランなどがあげられる。これらの中でも、シリコーン組成物の粘度安定性と硬化のしやすさからR2がエチル基のテトラエトキシシランを用いるのが最も好ましい。一方、テトラアルコキシシランに代えて、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、フェニルトリメトキシシランなどのトリアルコキシシラン類、或いはジメチルジメトキシシラン、ジメチルジエトキシシラン、ジエチルジメトキシシラン、ジエチルジエトキシシランなどのジアルコキシシラン類を用いると耐熱性が悪化するため好ましくない。 Specific examples of such tetraalkoxysilane include tetramethoxysilane and tetraethoxysilane. Among these, it is most preferable to use tetraethoxysilane in which R 2 is an ethyl group from the viewpoint of viscosity stability of the silicone composition and ease of curing. On the other hand, instead of tetraalkoxysilane, trialkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, phenyltrimethoxysilane, or dimethyldimethoxysilane, dimethyldiethoxysilane, Use of dialkoxysilanes such as diethyldimethoxysilane and diethyldiethoxysilane is not preferable because the heat resistance deteriorates.
テトラアルコキシシランの部分縮合物(2)は、テトラアルコキシシランのアルコキシ基1当量に対し水を0.125〜0.33当量程度の範囲で加水分解反応させ、さらに縮合して得られる。 The tetraalkoxysilane partial condensate (2) is obtained by subjecting 1 equivalent of the tetraalkoxysilane alkoxy group to a hydrolysis reaction in the range of about 0.125 to 0.33 equivalent, followed by condensation.
また、テトラアルコキシシランの部分縮合物(2)は、1分子あたり平均で3〜6個のケイ素原子を含有するものとすることが好ましい。1分子あたりの平均ケイ素原子数が3未満であると、脱アルコール反応時に未反応のまま系外に留去するテトラアルコキシシランの割合が増え、また硬化物の耐熱性が落ちるため好ましくない。また1分子あたりの平均ケイ素原子数が6を超えると、ポリシロキサン(1)との相溶性が得られにくく、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)の製造が困難な傾向がある。 Further, the tetraalkoxysilane partial condensate (2) preferably contains 3 to 6 silicon atoms on average per molecule. When the average number of silicon atoms per molecule is less than 3, the proportion of tetraalkoxysilane distilled off from the system while remaining unreacted during the dealcoholization reaction is increased, and the heat resistance of the cured product is lowered. If the average number of silicon atoms per molecule exceeds 6, compatibility with polysiloxane (1) is difficult to obtain, and trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) tends to be difficult to produce. .
トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)は、上記両末端にシラノール基を有するポリシロキサン(1)と、上記テトラアルコキシシランの部分縮合物(2)とを脱アルコール反応させて製造する。両末端にシラノール基を有するポリシロキサン(1)とテトラアルコキシシランの部分縮合物(2)の使用割合は、特に制限されないが、テトラアルコキシシランの部分縮合物(2)のモル数/両末端にシラノール基を有するポリシロキサン(1)のモル数(モル比)を、好ましくは1.5〜2.5、更に好ましくは1.6〜2.0の範囲とする。1.5未満では脱アルコール反応途中にゲル化が生じる傾向があり、2.5を超えるとポリシロキサン(1)と反応しない未反応のアルコキシシラン部分縮合物(2)が増加する。 The trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) is produced by dealcoholizing the polysiloxane (1) having silanol groups at both ends and the partial condensate (2) of the tetraalkoxysilane. . The ratio of the polysiloxane (1) having silanol groups at both ends and the partial condensate (2) of tetraalkoxysilane is not particularly limited, but the number of moles of the partial condensate (2) of tetraalkoxysilane / The number of moles (molar ratio) of the polysiloxane (1) having a silanol group is preferably 1.5 to 2.5, more preferably 1.6 to 2.0. If it is less than 1.5, gelation tends to occur during the dealcoholization reaction, and if it exceeds 2.5, unreacted alkoxysilane partial condensate (2) that does not react with polysiloxane (1) increases.
具体的には、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)は、たとえば、上記両末端にシラノール基を有するポリシロキサン(1)と上記テトラアルコキシシランの部分縮合物(2)を上記した使用割合で仕込み、加熱して生成するアルコールを留去しながらエステル交換反応を行なう。反応温度は、特に限定されないが、通常、90〜170℃程度、好ましくは110〜150℃であり、全反応時間は、通常、1〜15時間程度である。 Specifically, the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) is, for example, the above-described partial condensate (2) of the polysiloxane (1) having silanol groups at both ends and the tetraalkoxysilane. The transesterification reaction is carried out while distilling off the alcohol produced by charging at a use rate and heating. Although reaction temperature is not specifically limited, Usually, it is about 90-170 degreeC, Preferably it is 110-150 degreeC, and total reaction time is about about 1 to 15 hours normally.
また、上記の脱アルコール反応に際しては、反応促進のために公知のエステル交換触媒を使用できる。該触媒としては、例えば、リチウム、ナトリウム、カリウム、ルビジウム、セシウム、マグネシウム、カルシウム、バリウム、ストロンチウム、亜鉛、アルミニウム、チタン、コバルト、ゲルマニウム、錫、鉛、アンチモン、砒素、セリウム、硼素、カドミウム、マンガン、ビスマスのような金属や、これらの酸化物、有機酸塩、ハロゲン化物、アルコキシド等があげられる。これらの中でも、特に有機錫、有機酸錫が好ましく、具体的には、ジオクチル錫ジラウレートやオクチル酸錫が好ましい。 In the above dealcoholization reaction, a known transesterification catalyst can be used to promote the reaction. Examples of the catalyst include lithium, sodium, potassium, rubidium, cesium, magnesium, calcium, barium, strontium, zinc, aluminum, titanium, cobalt, germanium, tin, lead, antimony, arsenic, cerium, boron, cadmium, manganese. And metals such as bismuth, oxides thereof, organic acid salts, halides, and alkoxides. Among these, organic tin and organic acid tin are particularly preferable, and specifically, dioctyltin dilaurate and tin octylate are preferable.
本発明に用いるトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)においては、使用されるポリシロキサン(1)の末端シラノール基の少なくとも80%がアルコキシシラン変性されていることが好ましい。反応率が80%未満であると、未反応のアルコキシシラン部分縮合物(2)が増加し、硬化時の揮発によってクラックを生じる傾向がある。一方、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)は、少量であれば、未反応のテトラアルコキシシランの部分縮合物(2)を含有していても差し支えなく、未反応のテトラアルコキシシランの部分縮合物(2)は、本発明のシリコーン組成物の硬化時に、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)とともに硬化する。 In the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) used in the present invention, it is preferable that at least 80% of the terminal silanol groups of the polysiloxane (1) used are modified with alkoxysilane. When the reaction rate is less than 80%, the unreacted alkoxysilane partial condensate (2) increases, and there is a tendency to cause cracks due to volatilization during curing. On the other hand, the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) may contain a partial condensate (2) of unreacted tetraalkoxysilane as long as the amount is small. The partial condensate (2) is cured together with the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) when the silicone composition of the present invention is cured.
前記トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)は、ポリシロキサン(1)に由来するセグメントの両側にテトラアルコキシシランの部分縮合物(2)に由来するポリアルコキシシランセグメントを有するブロックコポリマーである。両端に位置するアルコキシシリル基はゾル−ゲル硬化によって、シリカ(SiO2)を形成する。両端にアルコキシシリル基を集中させることで、アルコキシシリル基の分子内或いは分子間の反応性を向上させて硬化物中に未反応のアルコキシシリル基が残存することを抑制している。またこれらのシリカは、ポリシロキサン(1)に由来するセグメントによって共有結合で結ばれる。当該ポリシロキサン(1)に由来するセグメントにはセグメント中に反応性基を含まず、硬化時に生じる応力を緩和し、発泡を抑制、更に硬化物に強靭性、柔軟性を与える。 The trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) is a block copolymer having polyalkoxysilane segments derived from a partial condensate of tetraalkoxysilane (2) on both sides of a segment derived from polysiloxane (1). is there. The alkoxysilyl groups located at both ends form silica (SiO 2 ) by sol-gel curing. By concentrating the alkoxysilyl group at both ends, the reactivity of the alkoxysilyl group in the molecule or between the molecules is improved, and the unreacted alkoxysilyl group is prevented from remaining in the cured product. In addition, these silicas are linked by a covalent bond by a segment derived from polysiloxane (1). The segment derived from the polysiloxane (1) does not contain a reactive group in the segment, relieves stress generated during curing, suppresses foaming, and gives toughness and flexibility to the cured product.
本発明のオルガノポリシロキサン(B)は、一般式(3):R3 3SiX(式中、R3は、炭素数1〜6の炭化水素基、Xはメトキシ基、エトキシ基又はクロロ基を表わす)で表されるシラン化合物および一般式(4):SiX´4(式中、X´はメトキシ基、エトキシ基又はクロロ基を表わす)で表されるシラン化合物を加水分解、縮合することで得られる。 The organopolysiloxane (B) of the present invention has the general formula (3): R 3 3 SiX (wherein R 3 is a hydrocarbon group having 1 to 6 carbon atoms, X is a methoxy group, an ethoxy group or a chloro group. By hydrolyzing and condensing the silane compound represented by formula (4): SiX ′ 4 (wherein X ′ represents a methoxy group, an ethoxy group, or a chloro group). can get.
一般式(3):R3 3SiX(式中、R3は、炭素数1〜6の炭化水素基、Xはメトキシ基、エトキシ基又はクロロ基を表わす)で表されるシラン化合物(3)と一般式(4):SiX´4(式中、X´はメトキシ基、エトキシ基又はクロロ基を表わす)で表されるシラン化合物(4)の使用割合は、シロキサン単位のモル数で、シラン化合物(3)/シラン化合物(4)=0.3以上であることが好ましい。この範囲を下回ると、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)との相溶性が悪くなり、均一にならず、十分な制振性が発現しない場合がある。 Silane compound (3) represented by the general formula (3): R 3 3 SiX (wherein R 3 represents a hydrocarbon group having 1 to 6 carbon atoms, X represents a methoxy group, an ethoxy group or a chloro group) And the general formula (4): SiX ′ 4 (wherein X ′ represents a methoxy group, an ethoxy group or a chloro group), the use ratio of the silane compound (4) is the number of moles of siloxane units, It is preferable that it is more than compound (3) / silane compound (4) = 0.3. Below this range, the compatibility with the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) is deteriorated, it is not uniform, and sufficient vibration damping properties may not be exhibited.
加水分解反応に必要な水の量は、[加水分解反応に用いる水のモル数]/[前記一般式(3)および一般式(4)に含まれる各アルコキシ基またはクロロ基の合計モル数](モル比)が0.4以上10以下が好ましく、より好ましくは1である。前記モル比の範囲とすることにより、加水分解されずに残存するアルコキシ基の数を少なくし、かつ、縮合反応(脱水反応)の際に除くべき水の量を少なくして効率よく製造することができる。 The amount of water required for the hydrolysis reaction is [number of moles of water used for hydrolysis reaction] / [total number of moles of each alkoxy group or chloro group contained in the general formula (3) and the general formula (4)]. The (molar ratio) is preferably 0.4 or more and 10 or less, more preferably 1. By making the molar ratio within this range, the number of alkoxy groups remaining without being hydrolyzed is reduced, and the amount of water to be removed in the condensation reaction (dehydration reaction) is reduced, thereby producing efficiently. Can do.
加水分解反応に用いる触媒としては、特に限定はされず、公知の加水分解触媒を任意に用いることができる。加水分解触媒としては、有機酸、無機酸、有機塩基、無機塩基を挙げることができる。有機酸としては、例えば酢酸、プロピオン酸、ブタン酸、ペンタン酸、ヘキサン酸、ヘプタン酸、オクタン酸、ノナン酸、デカン酸、シュウ酸(蓚酸)、マレイン酸、メチルマロン酸、アジピン酸、セバシン酸、没食子酸、酪酸、メリット酸、アラキドン酸、2−エチルヘキサン酸、オレイン酸、ステアリン酸、リノール酸、リノレイン酸、サリチル酸、安息香酸、p−アミノ安息香酸、p−トルエンスルホン酸、ベンゼンスルホン酸、モノクロロ酢酸、ジクロロ酢酸、トリクロロ酢酸、トリフルオロ酢酸、ギ酸、マロン酸、スルホン酸、フタル酸、フマル酸、クエン酸、酒石酸等を挙げることができる。無機酸としては、例えば塩酸、硝酸、硫酸、リン酸等を挙げることができる。有機塩基としては、例えばピリジン、ピロール、ピペラジン、ピロリジン、ピペリジン、ピコリン、トリメチルアミン、トリエチルアミン、モノエタノールアミン、ジエタノールアミン、ジメチルモノエタノールアミン、モノメチルジエタノールアミン、トリエタノールアミン、ジアザビシクロオクタン、ジアザビシクロノナン、ジアザビシクロウンデセン、テトラメチルアンモニウムハイドロオキサイド、1,8−ジアザビシクロ[5,4,0]−7−ウンデセン等を挙げることができる。無機塩基としては、例えばアンモニア、水酸化ナトリウム、水酸化カリウム、水酸化バリウム、水酸化カルシウム等を挙げることができる。 The catalyst used for the hydrolysis reaction is not particularly limited, and a known hydrolysis catalyst can be arbitrarily used. Examples of the hydrolysis catalyst include organic acids, inorganic acids, organic bases, and inorganic bases. Examples of organic acids include acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, oxalic acid (succinic acid), maleic acid, methylmalonic acid, adipic acid, and sebacic acid , Gallic acid, butyric acid, meritic acid, arachidonic acid, 2-ethylhexanoic acid, oleic acid, stearic acid, linoleic acid, linolenic acid, salicylic acid, benzoic acid, p-aminobenzoic acid, p-toluenesulfonic acid, benzenesulfonic acid Monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoroacetic acid, formic acid, malonic acid, sulfonic acid, phthalic acid, fumaric acid, citric acid, tartaric acid and the like. Examples of inorganic acids include hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid and the like. Examples of the organic base include pyridine, pyrrole, piperazine, pyrrolidine, piperidine, picoline, trimethylamine, triethylamine, monoethanolamine, diethanolamine, dimethylmonoethanolamine, monomethyldiethanolamine, triethanolamine, diazabicyclooctane, diazabicyclononane, Examples thereof include diazabicycloundecene, tetramethylammonium hydroxide, 1,8-diazabicyclo [5,4,0] -7-undecene and the like. Examples of the inorganic base include ammonia, sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide and the like.
触媒の添加量は、特に限定されないが、通常、シラン化合物(3)およびシラン化合物(4)の合計量100重量部に対して、0.1〜25重量部である。反応温度、時間はシラン化合物の種類により任意に設定できるが、通常0〜100℃程度、好ましくは20〜60℃、1分間〜2時間程度である。該加水分解反応は、溶剤の存在下または不存在下で行うことができる。溶剤の種類は特に限定されず、任意の溶剤を1種類以上選択して用いることができる。 Although the addition amount of a catalyst is not specifically limited, Usually, it is 0.1-25 weight part with respect to 100 weight part of total amounts of a silane compound (3) and a silane compound (4). The reaction temperature and time can be arbitrarily set depending on the type of the silane compound, but are usually about 0 to 100 ° C, preferably about 20 to 60 ° C and about 1 minute to 2 hours. The hydrolysis reaction can be performed in the presence or absence of a solvent. The type of the solvent is not particularly limited, and one or more arbitrary solvents can be selected and used.
縮合反応は、従来公知の脱水縮合触媒を任意に用いることができる。脱水縮合触媒としては、前記の加水分解触媒に例示したものがあげられる。反応温度、時間はそれぞれ任意に設定できるが、通常は40〜150℃程度、好ましくは60〜100℃、30分〜12時間程度である。 A conventionally known dehydration condensation catalyst can be arbitrarily used for the condensation reaction. Examples of the dehydration condensation catalyst include those exemplified for the hydrolysis catalyst. The reaction temperature and time can be arbitrarily set, but are usually about 40 to 150 ° C., preferably 60 to 100 ° C. and about 30 minutes to 12 hours.
オルガノポリシロキサン(B)は、軟化温度が−20℃以上、80℃以下とすることが好ましい。当該範囲とすることでシリコーン組成物を硬化させて制振材にして使用される際に、−40℃から100℃の温度範囲における制振性が向上するため好ましい。
オルガノポリシロキサン(B)は、ゲルパーミエーションクロマトグラフィーにより測定したポリスチレン換算の重量平均分子量(M
w)が10,000以下にあることが好ましく、3,000以下であることがより好ましい。オルガノポリシロキサン(B)の重量平均分子量が10,000以下とすることにより、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)との相溶性がより良好なものとなり、制振性が向上する。
The organopolysiloxane (B) preferably has a softening temperature of -20 ° C or higher and 80 ° C or lower. When the silicone composition is cured and used as a vibration damping material within this range, vibration damping in a temperature range of −40 ° C. to 100 ° C. is preferable.
Organopolysiloxane (B) is a polystyrene-reduced weight average molecular weight (M) measured by gel permeation chromatography.
w) is preferably 10,000 or less, and more preferably 3,000 or less. When the weight average molecular weight of the organopolysiloxane (B) is 10,000 or less, the compatibility with the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) becomes better, and the vibration damping property is improved. .
トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)とオルガノポリシロキサン(B)のシロキサン単位のモル比率が、10:4〜15であることが好ましい。モル比率が10:4未満であると、制振性が不足する場合がある。10:15を超えると、硬化した際に、硬くなりすぎて1mmを越えるようないわゆる厚物の成形物を作製することが困難になる傾向があり、好ましくない。 The molar ratio of the siloxane units of the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) and the organopolysiloxane (B) is preferably 10: 4-15. If the molar ratio is less than 10: 4, vibration damping may be insufficient. If the ratio exceeds 10:15, it tends to be difficult to produce a so-called thick molded article that is too hard and exceeds 1 mm when cured.
本発明のシリコーン組成物に用いる硬化触媒(C)は、前記トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)のアルコキシシラン部位と、前記オルガノポリシロキサン(B)のシラノール部位を硬化させるために必要とされる成分である。硬化触媒(C)としては、シリコーン組成物の安定性、得られる硬化物の硬度、得られる硬化物の耐熱性等に優れることから、有機金属系触媒が用いられる。有機金属系触媒としては、例えば、亜鉛、鉄、アルミニウム、チタン、錫、コバルト、ビスマス等の原子を含有するものが挙げられ、好ましくは亜鉛、アルミニウム、錫、ビスマス原子を含有するものである。具体的には、有機酸亜鉛化合物、有機酸錫化合物、有機錫化合物、有機アルミニウム化合物、有機酸ビスマス化合物等が挙げられる。より具体的には、オクチル酸亜鉛、安息香酸亜鉛、p-tert-ブチル安息香酸亜鉛、ラウリン酸亜鉛、ステアリン酸亜鉛、塩化アルミニウム、過塩素酸アルミニウム、リン酸アルミニウム、アルミニウムトリイソプロポキシド、アルミニウムアセチルアセトナート、アルミニウムブトキシビスエチルアセトアセテート、テトラブチルチタネート、テトライソプロピルチタネート、オクチル酸錫、ナフテン酸コバルト、ナフテン酸錫、ジオクチル錫ジラウレート、ジブチル錫ジラウレート、オクチル酸ビスマス等が挙げられ、好ましくはオクチル酸錫、ジブチル錫ジラウレートである。これらは、一種を単独で用いても二種以上を併用してもよい。 The curing catalyst (C) used in the silicone composition of the present invention is for curing the alkoxysilane moiety of the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) and the silanol moiety of the organopolysiloxane (B). It is a required ingredient. As the curing catalyst (C), an organometallic catalyst is used because it is excellent in stability of the silicone composition, hardness of the obtained cured product, heat resistance of the obtained cured product, and the like. Examples of the organometallic catalyst include those containing atoms such as zinc, iron, aluminum, titanium, tin, cobalt, and bismuth, and those containing zinc, aluminum, tin, and bismuth atoms are preferable. Specific examples include organic acid zinc compounds, organic acid tin compounds, organic tin compounds, organic aluminum compounds, and organic acid bismuth compounds. More specifically, zinc octylate, zinc benzoate, zinc p-tert-butylbenzoate, zinc laurate, zinc stearate, aluminum chloride, aluminum perchlorate, aluminum phosphate, aluminum triisopropoxide, aluminum Examples include acetylacetonate, aluminum butoxybisethyl acetoacetate, tetrabutyl titanate, tetraisopropyl titanate, tin octylate, cobalt naphthenate, tin naphthenate, dioctyltin dilaurate, dibutyltin dilaurate, bismuth octylate, and preferably octyl. It is acid tin and dibutyltin dilaurate. These may be used individually by 1 type, or may use 2 or more types together.
硬化触媒(C)の配合量は、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)とオルガノポリシロキサン(B)の合計を100重量部とした時、通常0.1〜5重量部程度である。0.1重量部以上とすることで硬化が容易になるため好ましく、5重量部以下とすることで、シリコーン組成物の安定性が良好となり、さらに硬化物の耐熱性が向上するため好ましい。 The amount of the curing catalyst (C) is usually about 0.1 to 5 parts by weight when the total of trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A) and organopolysiloxane (B) is 100 parts by weight. is there. Curing is facilitated by setting it to 0.1 parts by weight or more, and it is preferable to make it 5 parts by weight or less, since the stability of the silicone composition is improved and the heat resistance of the cured product is further improved.
本発明の制振材用シリコーン組成物には、上記記載のトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)、オルガノポリシロキサン(B)、硬化触媒(C)のほかに、本発明の作用・効果を損なわない範囲において、その他の任意成分を配合することができる。その他の任意成分としては、例えば、無機フィラー、無機蛍光体、老化防止剤、ラジカル禁止剤、紫外線吸収剤、接着性改良剤、難燃剤、界面活性剤、保存安定改良剤、オゾン劣化防止剤、光安定剤、増粘剤、可塑剤、カップリング剤、酸化防止剤、熱安定剤、導電性付与剤、帯電防止剤、放射線遮断剤、核剤、リン系過酸化物分解剤、滑剤、顔料、金属不活性化剤、物性調整剤、有機溶媒等が挙げられる。これらの任意成分は、一種を単独で用いても二種以上を併用してもよい。 In addition to the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A), organopolysiloxane (B), and curing catalyst (C) described above, the silicone composition for vibration damping material of the present invention has the function of the present invention. -Other arbitrary components can be mix | blended in the range which does not impair an effect. Other optional components include, for example, inorganic fillers, inorganic phosphors, anti-aging agents, radical inhibitors, ultraviolet absorbers, adhesion improvers, flame retardants, surfactants, storage stability improvers, ozone deterioration inhibitors, Light stabilizer, Thickener, Plasticizer, Coupling agent, Antioxidant, Thermal stabilizer, Conductivity imparting agent, Antistatic agent, Radiation shielding agent, Nucleating agent, Phosphorus peroxide decomposition agent, Lubricant, Pigment , Metal deactivators, physical property modifiers, organic solvents and the like. These optional components may be used alone or in combination of two or more.
無機フィラーを配合することにより、得られる硬化物の屈折率や組成物の流動性が適切な範囲となったり、該組成物を硬化物の強度が向上させることができる。無機フィラーとしては、特に限定されないが、他の特性を低下させない微粒子状のものが好ましく、例えば、アルミナ、水酸化アルミニウム、溶融シリカ、結晶性シリカ、超微粉無定型シリカ、疎水性超微粉シリカ、タルク、炭酸カルシウム、硫酸バリウム、黒鉛等が挙げられる。 By mix | blending an inorganic filler, the refractive index of the hardened | cured material obtained and the fluidity | liquidity of a composition can become an appropriate range, or the intensity | strength of hardened | cured material can improve this composition. The inorganic filler is not particularly limited, but is preferably in the form of fine particles that do not deteriorate other properties, such as alumina, aluminum hydroxide, fused silica, crystalline silica, ultrafine amorphous silica, hydrophobic ultrafine silica, Examples include talc, calcium carbonate, barium sulfate, and graphite.
本発明の制振材用シリコーン組成物は、前記トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)、オルガノポリシロキサン(B)、硬化触媒(C)および場合により含有される任意成分を公知の方法により混合して調製することができる。具体的には、例えば、トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)、オルガノポリシロキサン(B)、硬化触媒(C)、および上記任意成分を、通常、市販の攪拌機(例えば、THINKY CONDITIONING MIXER((株)シンキー製)等)に入れて、1〜5分間程度、均一に混合することによって、本発明の組成物を調製することができる。 The silicone composition for vibration damping material of the present invention is known from the trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A), organopolysiloxane (B), curing catalyst (C) and optionally contained optional components. It can be prepared by mixing according to the method. Specifically, for example, a trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A), an organopolysiloxane (B), a curing catalyst (C), and the above optional components are usually mixed with a commercially available stirrer (for example, THINKY CONDITIONING The composition of the present invention can be prepared by mixing in MIXER (manufactured by Shinky Co., Ltd., etc.) and mixing uniformly for about 1 to 5 minutes.
また、前記制振材用シリコーン組成物を硬化させる際の硬化方法は、例えば、80〜200℃で1〜12時間程度行うことができるが、80〜200℃の範囲でステップキュアをすることにより行うことが好ましい。例えば、ステップキュアは、2段階または3段階以上を経て、好ましくは以下の3段階を経て行うことができる。まず、本発明の組成物を、通常、80〜120℃程度で低温硬化させる。硬化時間は、特に限定されないが、通常、0.5〜2時間程度の範囲でよい。次いで、当該低温硬化物を、通常、125〜175℃程度で加熱硬化させる。硬化時間は、特に限定されないが、通常、0.5〜2時間程度の範囲でよい。最後に、当該硬化物を180〜200℃程度で加熱硬化させる。硬化時間は、特に限定されないが、通常、1〜10時間程度の範囲でよい。より具体的には、該組成物を80℃で1時間低温硬化させ、次いで150℃で1時間加熱硬化させ、さらに200℃で8時間加熱硬化させることが好ましい。これらの段階を経たステップキュアにより、得られる組成物は硬化性に優れ、気泡の発生も適切な範囲となる。更に、ステップキュアにより、1mm以上の厚みを有する硬化物を得ることができるため特に好適である。 Moreover, although the hardening method at the time of hardening the said silicone composition for damping materials can be performed for about 1 to 12 hours at 80-200 degreeC, for example, by carrying out step cure in the range of 80-200 degreeC. Preferably it is done. For example, step cure can be performed through two or more stages, preferably through the following three stages. First, the composition of the present invention is usually cured at a low temperature of about 80 to 120 ° C. Although hardening time is not specifically limited, Usually, the range of about 0.5 to 2 hours may be sufficient. Next, the low-temperature cured product is usually heat-cured at about 125 to 175 ° C. Although hardening time is not specifically limited, Usually, the range of about 0.5 to 2 hours may be sufficient. Finally, the cured product is heated and cured at about 180 to 200 ° C. Although hardening time is not specifically limited, Usually, the range of about 1 to 10 hours may be sufficient. More specifically, it is preferable that the composition is low-temperature cured at 80 ° C. for 1 hour, then heat-cured at 150 ° C. for 1 hour, and further heat-cured at 200 ° C. for 8 hours. By the step cure through these stages, the resulting composition is excellent in curability and the generation of bubbles is in an appropriate range. Furthermore, it is particularly suitable because a cured product having a thickness of 1 mm or more can be obtained by step cure.
また本発明の制振材用シリコーン組成物を硬化して得られる制振材は、主鎖構造がポリシロキサン(1)に由来するシロキサン結合(Si−O−Si)、架橋部位がアルコキシシラン部分縮合物(2)、かつオルガノポリシロキサン(B)に由来するシリカ(SiO2)構造を持ち、有機性の共有結合を含まないため熱分解しにくく、特に高温下において耐熱性を求められる条件で使用する制振材として有用である。 The vibration damping material obtained by curing the silicone composition for vibration damping material of the present invention has a siloxane bond (Si—O—Si) having a main chain structure derived from polysiloxane (1) and an alkoxysilane moiety as a crosslinking site. It has a silica (SiO 2 ) structure derived from the condensate (2) and the organopolysiloxane (B) and does not contain an organic covalent bond, so it is difficult to thermally decompose, particularly under conditions where heat resistance is required at high temperatures. It is useful as a damping material to be used.
以下、実施例および比較例をあげて本発明を具体的に説明する。なお、各例中、「部」および「%」は特記しない限り重量基準である。 Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. In each example, “parts” and “%” are based on weight unless otherwise specified.
合成例A1(トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)の製造)
攪拌機、冷却管、温度計、窒素導入管を備えた反応装置に、両末端シラノールのポリシロキサン(1)(モメンティブ・パフォーマンス・マテリアルズ・ジャパン(同)製,商品名「YF3800」、数平均分子量6000、一般式(1)において、R1がメチル基、m=80のもの)1900部とテトラエトキシシラン部分縮合物(2)(一般式(2)において、R2がエチル基、n=5のもの)471.83部を仕込み加熱した。140℃になったときに触媒としてジブチル錫ジラウレート0.48部を加え、そのまま140℃で6時間反応させてトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A1)を得た。なお、仕込み時の(アルコキシシラン部分縮合物(2)のモル数/ポリシロキサン(1)のモル数(モル比))=2.0である。反応前と反応後の質量差から留去したエタノール量は32.2部であることを確認した。
Synthesis Example A1 (Production of trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A))
Polysiloxane (1) of both-end silanol (made by Momentive Performance Materials Japan Co., Ltd., trade name “YF3800”, number average molecular weight, with a reactor equipped with a stirrer, cooling tube, thermometer, and nitrogen introduction tube 6000, in general formula (1), R 1 is methyl group, m = 80 1900 parts and tetraethoxysilane partial condensate (2) (in general formula (2), R 2 is ethyl group, n = 5 1) 471.83 parts were charged and heated. When the temperature reached 140 ° C., 0.48 part of dibutyltin dilaurate was added as a catalyst, and the mixture was reacted at 140 ° C. for 6 hours to obtain a trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A1). In addition, (number of moles of alkoxysilane partial condensate (2) / number of moles of polysiloxane (1) (molar ratio)) at the time of preparation = 2.0. It was confirmed that the amount of ethanol distilled off from the mass difference before and after the reaction was 32.2 parts.
合成例A2(トリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A)の製造)
合成例1と同様の装置に、両末端シラノールのポリシロキサン(1)(Bluestar Silicones製,商品名「48V3500」、数平均分子量35,000、一般式(1)において、R1がメチル基、m=470のもの)1000部とテトラメトキシシラン部分縮合物(2)(一般式(2)において、R2がメチル基、n=5のもの)19.9部を仕込み加熱した。130℃になったときに触媒としてジブチル錫ジラウレート0.03部を加え、そのまま130℃で6時間反応させてトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A2)を得た。なお、仕込み時の(アルコキシシラン部分縮合物(2)のモル数/ポリシロキサン(1)のモル数(モル比))=1.5である。反応前と反応後の質量差から留去したメタノール量は2.5部であることを確認した。
Synthesis Example A2 (Production of trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A))
In the same apparatus as in Synthesis Example 1, polysiloxane (1) of both-end silanols (manufactured by Bluestar Silicones, trade name “48V3500”, number average molecular weight 35,000, in general formula (1), R 1 is a methyl group, m = 470) and 19.9 parts of tetramethoxysilane partial condensate (2) (in the general formula (2), R 2 is a methyl group, n = 5) were charged and heated. When the temperature reached 130 ° C., 0.03 part of dibutyltin dilaurate was added as a catalyst and reacted at 130 ° C. for 6 hours to obtain a trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A2). In addition, (number of moles of alkoxysilane partial condensate (2) / number of moles of polysiloxane (1) (molar ratio)) at the time of preparation = 1.5. It was confirmed that the amount of methanol distilled off from the mass difference before and after the reaction was 2.5 parts.
[実施例1](制振用シリコーン組成物およびシート状制振材の製造)
合成例A1で得られたトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A1)65.8部と、オルガノポリシロキサン(B)商品名「10350tt」(Bluestar Silicones製、軟化温度30℃、固形分65%)を61.5部、硬化触媒としてオクチル酸錫を1.0部混合し、シリコーン組成物とした。このシリコーン組成物をテフロン(登録商標)カップ中に硬化後の厚みが3mmになるように流し入れ、80℃で1時間、150℃で1時間、200℃で1時間加熱し、硬化させ、シート状制振材を得た。
[Example 1] (Manufacture of silicone composition for vibration damping and sheet-shaped vibration damping material)
Trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A1) 65.8 parts obtained in Synthesis Example A1 and organopolysiloxane (B) trade name “10350tt” (manufactured by Bluestar Silicones, softening temperature 30 ° C., solid content 65 %) Was mixed with 61.5 parts, and 1.0 part of tin octylate as a curing catalyst was mixed to obtain a silicone composition. This silicone composition was poured into a Teflon (registered trademark) cup so that the thickness after curing was 3 mm, and it was cured by heating at 80 ° C. for 1 hour, 150 ° C. for 1 hour, and 200 ° C. for 1 hour. A damping material was obtained.
[実施例2](シリコーンゴム組成物およびシリコーンゴムシートの製造)
合成例A2で得られたトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A2)60.7部と、実施例1で使用したオルガノポリシロキサン(B)を76.9部、硬化触媒としてジオクチル錫ジラウレートを2.0部混合し、シリコーン組成物とした。このシリコーン組成物をテフロン(登録商標)カップ中に硬化後の厚みが3mmになるように流し入れ、80℃で1時間、150℃で1時間、200℃で1時間加熱し、硬化させ、シート状制振材を得た。
[Example 2] (Production of silicone rubber composition and silicone rubber sheet)
60.7 parts of trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A2) obtained in Synthesis Example A2, 76.9 parts of organopolysiloxane (B) used in Example 1, and dioctyltin dilaurate as a curing catalyst Was mixed to give a silicone composition. This silicone composition was poured into a Teflon (registered trademark) cup so that the thickness after curing was 3 mm, and it was cured by heating at 80 ° C. for 1 hour, 150 ° C. for 1 hour, and 200 ° C. for 1 hour. A damping material was obtained.
[実施例3](制振用シリコーン組成物およびシート状制振材の製造)
合成例A2で得られたトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A2)50.6部と、実施例1で使用したオルガノポリシロキサン(B)を76.9部、硬化触媒としてジオクチル錫ジラウレートを1.2部混合し、シリコーンゴム組成物とした。このシリコーン組成物をテフロン(登録商標)カップ中に硬化後の厚みが3mmになるように流し入れ、80℃で1時間、150℃で1時間、200℃で1時間加熱し、硬化させ、シート状制振材を得た。
[Example 3] (Manufacture of silicone composition for vibration damping and sheet-shaped damping material)
50.6 parts of trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A2) obtained in Synthesis Example A2, 76.9 parts of organopolysiloxane (B) used in Example 1, and dioctyltin dilaurate as a curing catalyst Was mixed to give a silicone rubber composition. This silicone composition was poured into a Teflon (registered trademark) cup so that the thickness after curing was 3 mm, and it was cured by heating at 80 ° C. for 1 hour, 150 ° C. for 1 hour, and 200 ° C. for 1 hour. A damping material was obtained.
[比較例1]
エーテル系ウレタンエラストマー商品名「ソルボセイン022M」(三進興産(株)製)、厚み3mmのものをシート状制振材とした。
[Comparative Example 1]
An ether-based urethane elastomer product name “Sorbocein 022M” (manufactured by Sanshin Kosan Co., Ltd.) having a thickness of 3 mm was used as a sheet-like vibration damping material.
[比較例2]
合成例A2で得られたトリアルコキシシリル基末端アルコキシシラン変性ポリシロキサン(A2)100部と、硬化触媒としてジオクチル錫ジラウレートを1.0部混合し、シリコーン組成物とした。このシリコーン組成物をテフロン(登録商標)カップ中に硬化後の厚みが3mmになるように流し入れ、80℃で1時間、150℃で1時間、200℃で1時間加熱し、硬化させ、シート状制振材を得た。
[Comparative Example 2]
100 parts of trialkoxysilyl group-terminated alkoxysilane-modified polysiloxane (A2) obtained in Synthesis Example A2 and 1.0 part of dioctyltin dilaurate as a curing catalyst were mixed to obtain a silicone composition. This silicone composition was poured into a Teflon (registered trademark) cup so that the thickness after curing was 3 mm, and it was cured by heating at 80 ° C. for 1 hour, 150 ° C. for 1 hour, and 200 ° C. for 1 hour. A damping material was obtained.
[比較例3]
両末端ジメチルヒドロキシシロキシ基封鎖ジメチルポリシロキサン生ゴム(Bluestar Silicones製、平均重合度が1,400)100部、側鎖に2.4モル%のビニル基を有する両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体(Bluestar Silicones製、平均重合度が500)0.8部、メチルフェニルポリシロキサン(信越化学工業株式会社製、平均重合度80)12部、BET法比表面積が200m2 /gのヒュームドシリカ(日本アエロジル(株)製、アエロジル200)42.5部、けいそう土(昭和化学工業(株)製、ラヂオライトF)10部をニーダーミキサーに投入して、100℃で混練してシリコーンゴムベースコンパウンドを製造した。
[Comparative Example 3]
100 parts of dimethylpolysiloxane raw rubber with both ends dimethylhydroxysiloxy group blocked (manufactured by Bluestar Silicones, average polymerization degree 1,400), both ends trimethylsiloxy group blocked dimethylsiloxane methyl having 2.4 mol% vinyl group in the side chain 0.8 parts of vinylsiloxane copolymer (manufactured by Bluestar Silicones, average polymerization degree 500), 12 parts of methylphenylpolysiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., average polymerization degree 80), BET specific surface area of 200 m @ 2 / g 42.5 parts of fumed silica (Aerosil 200 manufactured by Nippon Aerosil Co., Ltd.) and 10 parts of diatomaceous earth (Radiolite F manufactured by Showa Chemical Industry Co., Ltd.) are put into a kneader mixer and kneaded at 100 ° C. A silicone rubber base compound was manufactured.
このコンパウンド100部に、硬化剤として2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキサン0.15部を添加して二本ロール上で均一混合してシリコーンゴム組成物を製造した。このシリコーンゴム組成物を170℃で10分間の条件下で圧縮して厚さ3mmのシリコーンゴムのシート状制振材とした。 To 100 parts of this compound, 0.15 part of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane as a curing agent is added and mixed uniformly on two rolls to obtain a silicone rubber composition. Manufactured. The silicone rubber composition was compressed at 170 ° C. for 10 minutes to obtain a silicone rubber sheet damping material having a thickness of 3 mm.
上記により得られたシート状制振材を以下の方法で性能を評価した。
(貯蔵弾性率、損失正接)
実施例1〜3および比較例1〜3で得られたシート状制振材をそれぞれ10mm×30mmにカットして試料とし、粘弾性測定器(セイコーインスツル(株)製、商品名「DMS6100」、測定条件:振動数10Hz、スロープ3℃/分、測定温度0℃〜150℃)を用いて貯蔵弾性率、損失弾性率を測定して、損失正接を算出した。機械強度として25℃と100℃での貯蔵弾性率を、制振性として25℃と100℃での損失正接を評価した。
(アウトガス)
実施例1〜3および比較例1〜3で得たシート状制振材をそれぞれ30mm×30mmにカットして試料とし、順風乾燥機で180℃100時間加熱した際、下記式によりアウトガス量を測定した。
アウトガス(%)=(初期の重さ−180℃100時間後の重さ)/(初期の重さ)×100
(多数回振動後の外観)
実施例1〜3および比較例1〜3で得たシート状制振材をそれぞれ50mm×50mmにカットして試料とした。試料を金属板で挟み、0.3mm圧縮するように加圧しては除圧することを1秒間に10回の速度で1000万回繰り返した。所定の回数を上下動させた後に、試料に破断が見られるものを破壊として、破壊されるかどうかを確認した。同時に、液状成分の浸み出しが見られるか目視にて評価した。
The performance of the sheet-shaped damping material obtained as described above was evaluated by the following method.
(Storage modulus, loss tangent)
Each of the sheet-like vibration damping materials obtained in Examples 1 to 3 and Comparative Examples 1 to 3 was cut into 10 mm × 30 mm to obtain samples, and viscoelasticity measuring instruments (trade name “DMS6100” manufactured by Seiko Instruments Inc.). , Measurement conditions: frequency 10 Hz, slope 3 ° C./min, measurement temperature 0 ° C. to 150 ° C.) were measured for storage elastic modulus and loss elastic modulus, and loss tangent was calculated. The storage elastic modulus at 25 ° C. and 100 ° C. was evaluated as the mechanical strength, and the loss tangent at 25 ° C. and 100 ° C. was evaluated as the vibration damping property.
(Outgas)
The sheet-like damping materials obtained in Examples 1 to 3 and Comparative Examples 1 to 3 were each cut to 30 mm × 30 mm to prepare samples, and when heated at 180 ° C. for 100 hours in a normal air dryer, the amount of outgas was measured by the following formula. did.
Outgas (%) = (initial weight−weight after 100 hours at 180 ° C.) / (Initial weight) × 100
(Appearance after many vibrations)
The sheet-like vibration damping materials obtained in Examples 1 to 3 and Comparative Examples 1 to 3 were each cut into 50 mm × 50 mm to obtain samples. The sample was sandwiched between metal plates, pressurized and compressed so as to compress 0.3 mm, and repeated 10 million times at a rate of 10 times per second. After moving up and down a predetermined number of times, it was confirmed whether the sample was broken or not, and whether or not the sample was broken was confirmed. At the same time, it was visually evaluated whether the liquid component oozed out.
Claims (4)
The damping material obtained by hardening the silicone composition for damping materials in any one of Claims 1-3 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012175696A JP5780492B2 (en) | 2012-08-08 | 2012-08-08 | Silicone composition for vibration damping material and vibration damping material obtained by curing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012175696A JP5780492B2 (en) | 2012-08-08 | 2012-08-08 | Silicone composition for vibration damping material and vibration damping material obtained by curing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014034612A JP2014034612A (en) | 2014-02-24 |
| JP5780492B2 true JP5780492B2 (en) | 2015-09-16 |
Family
ID=50283797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012175696A Expired - Fee Related JP5780492B2 (en) | 2012-08-08 | 2012-08-08 | Silicone composition for vibration damping material and vibration damping material obtained by curing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5780492B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116217934B (en) * | 2022-12-27 | 2024-11-29 | 湖北环宇化工有限公司 | A chelated organotin catalyst and its application in storage-resistant dealcoholization type RTV-1 silicone rubber |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6043866B2 (en) * | 1977-08-24 | 1985-09-30 | 東芝シリコ−ン株式会社 | Room temperature curable polysiloxane composition |
| EP0850998B1 (en) * | 1996-12-31 | 2004-04-28 | Dow Corning Corporation | Method for making rubber-modified rigid silicone resins and composites produced therefrom |
| US5830950A (en) * | 1996-12-31 | 1998-11-03 | Dow Corning Corporation | Method of making rubber-modified rigid silicone resins and composites produced therefrom |
| JP4469052B2 (en) * | 2000-02-29 | 2010-05-26 | 東レ・ダウコーニング株式会社 | Method for producing crosslinked silicone particles |
| JP2008069326A (en) * | 2006-09-15 | 2008-03-27 | Suzuka Fuji Xerox Co Ltd | Organic-inorganic hybrid polymer and method for producing the same |
| TWI487747B (en) * | 2009-02-09 | 2015-06-11 | Arakawa Chem Ind | Transparent sealing material composition and optical semiconductor component |
-
2012
- 2012-08-08 JP JP2012175696A patent/JP5780492B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014034612A (en) | 2014-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6522625B2 (en) | Moisture curable composition | |
| JP5669852B2 (en) | Paintable elastomer | |
| JP5132027B2 (en) | Silicon-containing curable composition and cured product obtained by thermally curing the same | |
| JP2738235B2 (en) | Ultraviolet and moisture curable organopolysiloxane composition, cured product thereof and method for producing the same | |
| KR102081074B1 (en) | Condensation Reaction Silicone Composition and Cured Product | |
| JP2008280525A (en) | Room temperature fast-curing organopolysiloxane composition and curing method thereof | |
| KR20150086249A (en) | Room-temperature-curable polyorganosiloxane composition | |
| JPWO2010090280A1 (en) | Transparent encapsulant composition and optical semiconductor element | |
| JP2024117823A (en) | Two-component room temperature fast curing organopolysiloxane composition, cured product and article of said composition, and method for curing room temperature fast curing organopolysiloxane composition | |
| JP5780492B2 (en) | Silicone composition for vibration damping material and vibration damping material obtained by curing the same | |
| JP2014218558A (en) | Room temperature curable polyorganosiloxane composition | |
| JP7327212B2 (en) | Two-component room temperature condensation-curable organopolysiloxane composition | |
| JP5008913B2 (en) | Room temperature curable polyorganosiloxane composition | |
| JP6319168B2 (en) | Method for producing condensation reaction product, method for producing room temperature curable organopolysiloxane composition containing the condensation reaction product | |
| JP5888112B2 (en) | Method for producing room temperature curable organopolysiloxane composition and article | |
| WO2015016010A1 (en) | Moisture-curing composition | |
| JP6915551B2 (en) | A method for improving heat-resistant adhesiveness in flame-retardant room-temperature-curable organopolysiloxane compositions, electrical or electronic components, and electrical or electronic components. | |
| JP2016086086A (en) | Encapsulant composition and optical semiconductor element | |
| JP6589572B2 (en) | Condensation curable room temperature curable silicone rubber composition and electronic circuit | |
| JP3418262B2 (en) | Room temperature curable polyorganosiloxane composition | |
| JP2762206B2 (en) | Curable organopolysiloxane composition and cured product thereof | |
| JP7234807B2 (en) | Water- and oil-repellent film composition and its use | |
| JP5547037B2 (en) | Room temperature curable polyorganosiloxane composition | |
| JP7687232B2 (en) | Method for preventing gelation during preparation of room temperature curable organopolysiloxane compositions | |
| JP2020045387A (en) | Curable composition, cured product, and optical member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140305 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20141225 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150113 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150120 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150622 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5780492 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150705 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |