JP5953734B2 - Heatsinks, stacked electronic devices, and electronic equipment. - Google Patents

Description

  The technology disclosed in the present application relates to a radiator, a stacked electronic device, and an electronic apparatus.

  2. Description of the Related Art In a structure in which a plurality of integrated circuits are stacked one above the other on a substrate, an electronic component mounting structure is known in which at least a socket body and a multilayer integrated circuit heat sink are integrated.

  An integrated circuit assembly is also known that includes a heat dissipation device that is thermally coupled to a side surface of a die stack assembly that includes a plurality of integrated circuits and on which another integrated circuit is disposed.

  Here, in recent years, the number of mounted LSIs is increasing, and the number of mounted memories is increasing accordingly. In addition, the number of POLs (Point Of Load) mounted is on an increasing trend because the types of supply voltages are increasing as LSIs have lower voltages and larger currents. In addition, as memory and POL increase in this way, they tend to be mounted at high density. In addition, the amount of heat generation tends to increase with the increase in memory and POL that generate a large amount of heat and high-density mounting.

Japanese Patent Application Laid-Open No. H8-241954 JP 2008-91879 A

  Therefore, it is desired to cool the semiconductor device more effectively by improving the heat radiation effect of the radiator that cools the semiconductor device such as the memory and POL.

  The technology disclosed in the present application has been made in view of the above problems, and an object thereof is to improve the heat dissipation effect of a radiator that cools a semiconductor device.

  In order to achieve the above object, in the technology disclosed in the present application, a plurality of heat conductive plate portions of a radiator are stacked on a substrate on which a semiconductor device is mounted. The semiconductor device is in contact with the heat conducting plate. An attachment portion having thermal conductivity is attached to an end portion in the width direction orthogonal to the plate thickness direction of each heat conduction plate portion. And the connection part which has heat conductivity connects between attachment parts in a plate | board thickness direction.

  Alternatively, an attachment portion of the radiator is attached to the end portion in the width direction orthogonal to the plate thickness direction of each of the plurality of substrates on which the semiconductor devices are mounted so as to contact the heat conduction layer provided on the substrate. . And the connection part which has heat conductivity connects between attachment parts in a plate | board thickness direction.

  According to the radiator disclosed in the present application, the heat radiation area is widened, so that the heat radiation effect is improved.

(A) is the perspective view which shows a server apparatus, (B) is the figure which looked at the main board | substrate with which the multilayer electronic device was provided in the plate | board thickness direction. It is a perspective view which shows the main board | substrate with which the multilayer electronic device was provided. (A) is the perspective view which shows a multilayer electronic device, (B) is the figure which looked at the multilayer electronic device in the ventilation direction. It is a perspective view which shows the fixing | fixed part of a heat radiator. (A) is the figure which looked at the laminated | stacked electronic device of the state which is not mounting | wearing with the fixing | fixed part of a heat radiator from the direction orthogonal to a ventilation direction, (B) is the figure seen in the ventilation direction. (A) for demonstrating attachment / detachment of the fixing | fixed part of a heat radiator is the figure which looked at the laminated | stacked electronic device of the state which is not mounting | wearing with the fixing | fixed part from the direction orthogonal to a ventilation direction, (B) is a fixing | fixed part. It is a figure of the state which mounted | wore. (A) is a figure which shows the multilayer electronic device of the state which is not mounting | wearing with the fixing | fixed part of a heat radiator, (B) is a perspective view of the multilayer electronic device with which the fixing | fixed part was attached or detached. (A) is a figure which shows the multilayer electronic device of the 1st modification of the state which is not mounting | wearing with the fixing | fixed part of a heat radiator, (B) is the multilayer electronic device of the 1st modification with which the fixing | fixed part was attached or detached. FIG. (A) is a figure which shows the multilayer electronic device of the 2nd modification of the state which is not mounting | wearing with the fixing | fixed part of a heat radiator, (B) is the multilayer electronic device of the 2nd modification with which the fixing | fixed part was attached or detached. (C) is a perspective view which shows a heat conductive board part. It is the figure which looked at the lamination type electronic device of the 3rd modification from the blowing direction. It is explanatory drawing which shows the state which decomposed | disassembled and applied the probe of the measuring apparatus to the rigid part of the rigid flexible substrate.

  Hereinafter, an embodiment of the technology disclosed in the present application will be described in detail with reference to the drawings. In the present embodiment, an example in which the technology disclosed in the present application is applied to a server device used in a network system, a server system, or the like will be described.

  First, the overall structure of the server device will be described with reference to FIGS.

  As shown in FIG. 1A, a server apparatus 10 as an example of an electronic device includes an apparatus main body 12 including a housing 14 and a plurality of main boards (motherboards) 50 (removably attached to the apparatus main body 12). (See also FIG. 2).

  As shown in FIGS. 1B and 2, various electronic components 52 (see FIG. 2) such as a CPU (Central Processing Unit), a laminated electronic device 100 described later, and the like are mounted on the main board 50. . Further, at the end of the main board 50, a board-side signal connection connector 54, a board-side power connection connector 56, and the like are provided.

  As shown in FIG. 1A, the plurality of main boards 50 are detachably attached to the apparatus main body 12. The plurality of main boards 50 are arranged at intervals in the horizontal direction with the horizontal direction of the apparatus main body 12 being the plate thickness direction (out-of-plane direction). Further, the board-side signal connection connector 54 and the board-side power connection connector 56 of the main board 50 are connected to the body-side connection part and the body-side connector, which are not shown in the figure, provided in the apparatus body 12. The substrate 50 and the apparatus main body 12 are electrically connected.

  A plurality of air inlets 60 are provided in the lower end portion of the back surface of the housing 14 of the apparatus main body 12 at intervals in the horizontal direction. Each intake port 60 is provided with a blower 62, whereby air (outside air) is sucked into the apparatus main body 12. As shown by the arrow F, the sucked air flows between the main boards 50 arranged in the horizontal direction from the bottom to the top. And it exhausts from the exhaust port with which illustration was abbreviate | omitted provided in the upper end part in the front of the apparatus main body 12. FIG.

  Next, the multilayer electronic device 100 will be described with reference to FIGS. The arrow T indicates the plate thickness direction to be described later. Although details will be described later, in FIG. 6A, a total of four fixing portions 160 are shown on the left and right. However, the fixing portion 160 shown on the left and right outer sides of the drawing shows a state before the connecting portion 164 is extended, and the fixing portion 160 shown on the inner side is attached to the end portion 152A of the heat conducting plate portion 152. The state which extended the connection part 164 to FIG.

  As shown in FIG. 3, the multilayer electronic device 100 includes a rigid flexible substrate 110 and a radiator 150.

  As shown in FIGS. 3 and 5, the rigid flexible substrate 110 is a printed board in which a flexible portion (flexible substrate) 112 and a rigid portion (rigid substrate) 120 as an example of a substrate are integrated. The flexible portion 112 is made of a bending material such as polyimide, and the rigid portion 120 is made of a hard material such as glass epoxy.

  The rigid portion 120 is a plate having a substantially rectangular shape in plan view (viewed in the plate thickness direction), and a memory 122 as an example of a semiconductor device is mounted on a surface 120D orthogonal to the plate thickness direction on a ball grid array (BGA). ) Etc.

  Note that the memory 122 in the present embodiment is a semiconductor memory and is used as a main storage device.

  As shown in FIG. 3, the heat radiator 150 includes a fixing portion 160 (see also FIGS. 4 and 6A) that forms a pair with the heat conducting plate portion 152. The rigid portions 120 and the heat conduction plate portions 152 of the radiator 150 are alternately stacked. Further, the outer surface 122D of the memory 122 of the rigid portion 120 is in surface contact with the plate surface 152D of the heat conducting plate portion 152 (see also FIG. 5). The flexible portion 112 is curved and disposed outside the heat conducting plate portion 152 (see also FIG. 5B).

  Note that the thickness direction (stacking direction) of the rigid portion 120 and the heat conductive plate portion 152 in a state where the rigid portion 120 of the rigid flexible substrate 110 and the heat conductive plate portion 152 of the radiator 150 are stacked is indicated by an arrow T. ing. The plate thickness direction T also coincides with the plate thickness direction (out-of-plane direction) of the main substrate 50, and is horizontal when the main substrate 50 is mounted on the apparatus main body 12, as shown in FIG. .

  In addition, let the direction along the side part of the rigid part 120 and the heat conductive board part 152 orthogonal to a plate | board thickness direction be width direction W1, W2. Note that the width direction W2 in the perspective views of FIGS. 7A, 8A, and 9A is compared with FIGS. 2 and 3 from the relationship shown in FIG. Although it looks short, it is actually the same length as FIGS.

  Further, the heat conductive plate portion 152 is made of a metal material having higher heat conductivity than the rigid portion 120 and having excellent heat conductivity, for example, a metal material mainly composed of aluminum or copper. The shape of the heat conductive plate portion 152 in plan view (seen in the plate thickness direction T) is a substantially rectangular plate shape, and is larger than the rigid portion 120. Therefore, the heat conductive plate portion 152 projects outward from the rigid portion 120.

  As shown in FIGS. 3 and 4, the fixing portion 160 includes a mounting portion 162 and a connecting portion 164 that connects the mounting portion 162. The mounting portion 162 is substantially U-shaped in cross section and has two arm portions 161A and 161B. And it has the structure where 152 A of edge parts of the heat conductive board part 152 are inserted between the two arm parts 161A and 161B, and are clamped. Note that the length of the arm portions 161A and 161 in the width direction W2 is the same as the length of the end portion 152A of the heat conducting plate portion 152 in the width direction W2. Further, the connecting portion 164 has a plate spring structure in which a plurality of plate-like portions 166 are arranged in a bellows shape and elastically deforms by expanding and contracting in the plate thickness direction T. The direction along the ridge line of the mountain of the bellows-like bent part 165 of the connecting part 164 (folding line direction) is defined as a ridge line direction L.

  In the present embodiment, the end of the connecting portion 164 is joined to the mounting portion 162 by brazing solder or the like. Further, the mounting portion 162 and the connecting portion 164 are made of a metal material having a spring property that is higher in thermal conductivity and superior in thermal conductivity than the rigid portion 120, for example, beryllium copper for springs.

  And as shown in FIG. 3, the mounting part 162 of the fixing | fixed part 160 is each inserted and mounted | worn at both edge part 152A of the width direction W1 in which the flexible part 112 in the heat conductive board part 152 is not arrange | positioned.

  The interval in the plate thickness direction T of the mounting portion 162 of the fixing portion 160 (before inserting the end portion 152A of the heat conductive plate portion 152) illustrated on the left and right outer sides shown in FIG. It is narrower than the interval in the plate thickness direction T of the portion 152. Therefore, in a state where the mounting portion 162 of the fixed portion 160 is inserted into the end portion 152A of the heat conducting plate portion 152, the mounting portions 162 are urged toward each other by the elastic force of the connecting portion 164. The parts 152 are biased toward each other. Then, the heat conduction plate portion 152 is urged toward each other in this manner, whereby the heat conduction plate portion 152 and the rigid portion 120 are fixed (pressure contact) and integrated.

  As shown in FIGS. 3, 5, and 6, the rigid connector 120 disposed at a position facing the main board 50 is provided with a stack connector 130. The main board 50 is provided with a stack connector 132. Then, by connecting the stack connector 130 to the stack connector 132, the multilayer electronic device 100 and the main substrate 50 are electrically connected, and the multilayer electronic device 100 is fixed to the main substrate 50.

  As shown in FIG. 2, when the main board 50 is mounted on the apparatus main body 12, the plate thickness direction T (stacking direction) of the rigid portion 120 and the heat conducting plate portion 152 of the stacked electronic device 100 is the horizontal direction. . Therefore, in the state where the main board 50 is mounted on the apparatus main body 12, the plate thickness direction T of the rigid part 120 and the heat conduction plate part 152 of the multilayer electronic device 100 is determined by the blower 62 (see FIG. 1A). It is orthogonal to the blowing direction F flowing from the bottom to the top. That is, the plate surface 152D of the heat conducting plate portion 152 and the surface 120D of the rigid portion 120 are arranged along the blowing direction F. Further, in a state where the main board 50 is mounted on the apparatus main body 12, the ridge line direction L of the bellows bent portion 165 of the connecting portion 164 of the radiator 150 is along the blowing direction F, as shown in FIG. 4.

  Next, an example of a method for assembling and disassembling the multilayer electronic device 100 will be described with reference to FIGS. However, since the disassembling method may be performed in the reverse order of the assembling method, detailed description thereof is omitted. The multilayer electronic device 100 is attached to and detached from the main board 50 with the main board 50 removed from the apparatus main body 12. Further, the assembling method and the disassembling method are examples, and the present invention is not limited thereto.

  As shown in FIG. 5, the rigid portions 120 of the rigid flexible substrate 110 and the heat conductive plate portions 152 of the radiator 150 are alternately arranged in the plate thickness direction T with an interval therebetween. Further, the flexible portion 112 of the rigid flexible substrate 110 is curved and disposed outside the heat conducting plate portion 152.

  As shown in FIGS. 6A and 7A, the rigid portion 120 and the heat conductive plate portion 152 are stacked. As a result, the outer surface 122D of the memory 122 mounted on the rigid portion 120 contacts the plate surface 152D (see also FIG. 5) of the heat conducting plate portion 152. Further, the stack connector 130 provided in the rigid part 120 is connected to the stack connector 132 of the main board 50.

  As shown in FIGS. 6 and 7, the mounting portion 162 of the fixing portion 160 is inserted into both end portions 152 </ b> A where the flexible portion 112 is not disposed in the heat conducting plate portion 152. 6A, the interval in the plate thickness direction T of the mounting portion 162 of the fixing portion 160 is narrower than the interval between the heat conduction plate portions 152 in the stacked state. Therefore, like the fixing part 160 illustrated on the left and right inner sides, when inserting, the connecting part 164 is extended in the plate thickness direction T to widen the interval between the mounting parts 162, and the end of the heat conducting plate part 152. Plug into 152A.

  By mounting the fixing portion 160 in this manner, the heat conducting plate portions 152 are biased toward each other, whereby the heat conducting plate portion 152 and the rigid portion 120 are fixed (pressure contact) and integrated. .

  In this attachment method, the stack connector 130 provided in the rigid portion 120 is connected to the stack connector 132 of the main board 50 and then the fixing portion 160 of the heat radiator 150 is mounted. However, the present invention is not limited to this. After mounting the fixing part 160 of the radiator 150, the stack connector 130 provided on the rigid part 120 may be connected to the stack connector 132 of the main board 50.

  Further, as described above, the disassembling method may be performed in the reverse order of the assembling method. That is, it can be disassembled by pulling out the mounting portion 162 of the radiator 150 from the end portion 152A of the heat conducting plate portion 152.

  Next, functions and effects of the present embodiment will be described.

  As shown in FIG. 1A, air flows from the bottom to the top between the main boards 50 by the blower 62. In addition, the memory 122 (see FIG. 3 and the like) of the stacked electronic device 100 provided on the main board 50 shown in FIGS. 1B and 2 generates heat during operation. However, the thickness direction T of the rigid part 120 and the heat conduction plate part 152 in the multilayer electronic device 100 and the blowing direction F are orthogonal to each other. That is, the plate surface 152D of the heat conductive plate portion 152 and the 120D surface of the rigid portion 120 are arranged along the blowing direction F. Therefore, air flows smoothly between the rigid portion 120 and the heat conducting plate portion 152 along the plate surface of the rigid portion 120 and the plate surface 152D of the heat conducting plate portion 152 without being obstructed. As a result, air hits the memory 122 and the memory 122 is cooled.

  Further, the heat of the memory 122 is transmitted to the heat conduction plate portion 152 of the radiator 150, and is further transmitted from the heat conduction plate portion 152 to the mounting portion 162 and the connecting portion 164. Then, heat is radiated from the heat conduction plate portion 152 of the radiator 150 and is radiated from the mounting portion 162 and the connecting portion 164, thereby cooling the heat conduction plate portion 152, thereby cooling the memory 122.

  The heat conduction plate portion 152 of the radiator 150 radiates heat effectively because it has a large contact area in contact with air, that is, a heat radiation area. Furthermore, since air flows smoothly along the plate surface 152D of the heat conducting plate portion 152, heat is radiated effectively.

  Further, since the connecting portion 164 has a bellows shape and the plate-like portion 166 functions like a cooling fin, the connecting portion 164 has a large contact area in contact with air, that is, a heat dissipation area, and is effectively dissipated. Further, as shown in FIG. 4, since the ridge line direction L of the bellows is along the air blowing direction F in the connecting portion 164, the air smoothly flows along the plate-like portion 166 without being obstructed by the air flow. Therefore, a high heat dissipation effect is exhibited by arranging the connecting portion 164 in this way.

  Further, as shown in FIGS. 3 and 6 and the like, the heat conduction plate portion 152 is urged by the elastic force of the connecting portion 164 of the radiator 150, whereby the heat conduction plate portion 152 and the rigid portion 120 are fixed and integrated. It becomes. That is, the radiator 150 has both a heat radiation function and a fixing function. In particular, by arranging the connecting part 164 so that the connecting part 164 has a bellows shape and the ridge line direction L is along the blowing direction F, the structure has a structure that obtains an elastic force and exhibits a high heat dissipation effect.

  In addition, a slit or a hole through which air passes may be provided in the flexible portion 112 of the rigid flexible substrate 110 so that the air flows more smoothly, thereby improving the cooling efficiency.

  As shown in FIGS. 6 and 7, the mounting portion 162 of the radiator 150 is fixed by being inserted into the end portion 152 </ b> A of the heat conduction plate portion 152, and is disassembled by being pulled out from the end portion 152 </ b> A. Therefore, the multilayer electronic device 100 can be easily disassembled as compared with the method of fixing the heat conducting plate portion and the fixing portion using resin or solder.

  Since disassembly is easy in this manner, for example, as shown in FIG. 11, it is possible to easily disassemble and apply the probe 902 of the measuring apparatus 900 to the rigid portion 120 of the rigid flexible substrate 110, and thus inspection is possible. And measurement becomes easy. It is also easy to replace the rigid flexible substrate 110 due to a failure or the like.

  Here, between the outer surface 122D of the memory 122 mounted on the rigid portion 120 and the plate surface 152D of the heat conduction plate portion 152, a slight amount of air (for example, a micron level) depending on the smoothness accuracy of the surface. There may be layers. Therefore, in order to improve heat conduction from the memory 122 to the heat conduction plate portion 152, silicon grease or the like that fills the air layer is applied to at least one of the outer surface 122D of the memory 122 and the plate surface 152D of the heat conduction plate portion 152. May be.

  Next, a modification of the multilayer electronic device of this embodiment will be described. In addition, the same code | symbol is attached | subjected to the member same as the said embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 8, the multilayer electronic device 200 according to the first modification includes a rigid substrate 220 and a radiator 150 as an example of a substrate made of a hard material such as glass epoxy. Since the heat radiator 150 has the same configuration as that of the above embodiment, the description thereof is omitted. The heat radiator 150 has a higher thermal conductivity than the rigid substrate 220.

  A memory 122 is mounted on the rigid board 220. The rigid boards 1220 are electrically connected by cables 212.

First, the first modification will be described.
In the multilayer electronic device 200 of the first modified example, the cable 212 is smaller than, for example, the flexible portion 112 (see FIG. 7) of the above embodiment, so that air flows more smoothly (compare FIGS. 8 and 7). reference). Therefore, the cooling efficiency of the memory 122 is further improved.

Next, a second modification will be described.
A stacked electronic device 300 of the second modification shown in FIG. 9 has a rigid substrate 220 and a radiator 350.

  A memory 122 is mounted on each rigid board 220. Each rigid board 220 is provided with a stack connector 312, and is electrically connected and fixed by the stack connector 312.

  As shown in FIG. 9C, the heat conducting plate portion 352 of the radiator 350 has a notch 354 formed at a portion corresponding to the stack connector 312. The heat conduction plate portion 352 has the same structure as that of the heat conduction plate portion 152 (made of the same metal material) except that the notch portion 354 is formed. In addition, the mounting portion 162 and the connecting portion 164 of the fixing portion 160 of the radiator 350 are the same as those in the above embodiment, and thus description thereof is omitted.

  In the multilayer electronic device 300 of the second modification, the stack connector 312 is smaller than, for example, the flexible portion 112 (see FIG. 7) of the above embodiment, so that air flows more smoothly (see FIGS. 9 and 7). Comparison). Therefore, the cooling efficiency of the memory 122 is further improved.

  The rigid boards 220 are electrically connected and fixed by the stack connector 312. Therefore, the heat conductive plate portion 352 sandwiched between the rigid substrates 220 is also fixed. That is, there is little need to fix other than the outermost heat conduction plate portion 152. Therefore, if the outermost heat conduction plate portion 152 is not provided, it is possible to eliminate the need to fix the connecting portion 164 by the elastic force, and the connecting portion 164 may have a structure having no elastic force. Is possible.

Next, a third modification will be described.
A multilayer electronic device 400 of the third modification shown in FIG. 10 includes a rigid substrate 420 and a radiator 450 as an example of a substrate. The radiator 450 has the same structure as the fixing portion 160 (see FIG. 4) of the radiator 150 (see FIG. 3 and the like) of the above embodiment. In other words, the radiator 450 of this modification is the same as the structure of the radiator 150 that does not include the heat conduction plate portion 152. Therefore, the description of the radiator 450 is omitted.

  The rigid substrate 420 includes a substrate body 424 and a signal ground layer (SG layer) 422 as an example of a heat conductive layer having a higher thermal conductivity than the substrate body 424. The signal ground layer (SG layer) 422 is provided on the back surface of the rigid substrate 420. Further, the heat radiator 150 has a higher thermal conductivity than the substrate body 424.

  A memory 122 is mounted on the rigid board 420. Further, the rigid board 420 is provided with a stack connector 312, and the rigid boards 420 are electrically connected and fixed by the stack connector 312.

  The mounting portions 162 of the pair of radiators 450 (fixing portions 160) are inserted and attached to both ends of the rigid substrate 420 in the width direction W1. The arm portion 161B of the mounting portion 162 is in contact with the signal ground layer 422 of the rigid substrate 420 described above. Since the signal ground layer 422 of the rigid substrate 420 has high thermal conductivity, the heat of the memory 122 is transmitted to the signal ground layer 422, and is further transmitted from the signal ground layer 422 to the mounting portion 162 and the connecting portion 164. Then, the memory 122 is cooled by radiating heat from the mounting portion 162 and the connecting portion 164. That is, the signal ground layer 422 of the rigid substrate 420 performs the same function as the heat conductive plate portion 152 (see FIG. 3 and the like).

  Since the rigid boards 420 are fixed by the stack connector 312, it is possible to eliminate the need for fixing by the elastic force of the connecting portion 164, and the connecting portion 164 may have a structure having no elastic force. . In addition, you may electrically connect between the rigid boards 420 with the cable 212 like a 2nd modification.

  Further, even in the rigid substrate 420 having the signal ground layer 422, the heat conductive plate portions 152 and 352 are sandwiched between the rigid substrates 420, and the fixing portions 160 are provided on the end portions 152A and 352A of the heat conductive plate portions 152 and 352. It is good also as a structure to mount.

  In addition, the technique which this application discloses is not limited to the said embodiment.

  In the above embodiment, the semiconductor device (heat generating device) that generates heat is the memory (semiconductor memory) 122, but is not limited thereto. For example, POL (Point Of Load) may be used.

  Moreover, in the said embodiment, although the electronic device was the server apparatus 10, it is not limited to this. For example, a personal computer or a large general-purpose computer may be used. Furthermore, the present invention may be applied to electronic devices other than personal computers.

  For example, in the above embodiment, the mounting portion 162 and the connecting portion 164 are joined by brazing solder, but may be joined by other methods. Alternatively, for example, the mounting portion and the connecting portion may be formed from a single plate by pressing or the like.

  For example, in the said embodiment, although the mounting part 162 was inserted and attached to the edge part of the heat conductive board part 152, it is not limited to this. The mounting portion 162 and the heat conducting plate portion 152 may be fixed with screws, solder, or the like. Alternatively, the connecting portion 164 and the mounting portion 162 may be integrated.

  Further, for example, in the above-described embodiment, the connecting portion 164 is arranged in a bellows shape of the plurality of plate-like portions 166 and has a leaf spring structure that stretches in the plate thickness direction T and elastically deforms, but is not limited thereto. . For example, the connecting portion may have a coil spring structure. In the case of the coil spring structure, a plurality of coil springs may be provided in order to increase the heat dissipation effect (in order to increase the heat dissipation area). Further, the connecting portion may have a structure that does not expand and contract in the plate thickness direction T.

  Moreover, in the said embodiment, although the ventilation direction F was the up-down direction, it is not limited to this. For example, the blowing direction may be a horizontal direction. Moreover, what is necessary is just to arrange | position a heat radiator and a fixing | fixed part suitably according to a ventilation direction. For example, when the blowing direction is the horizontal direction, the plate thickness direction T may be arranged in the vertical direction.

  In addition, the above-mentioned embodiment and a some modification may be combined suitably and may be implemented.

  Furthermore, it goes without saying that the technology disclosed in the present application can be implemented with various modifications within a range not departing from the gist thereof.

10 Server device (an example of electronic equipment)
62 Blower 100 Stacked Electronic Device 120 Rigid Part (Example of Substrate)
122 Memory (an example of a semiconductor device)
150 radiator 152 heat conduction plate part 162 mounting part (an example of attachment part)
164 Connecting portion 165 Bending portion 160 Fixed portion 200 Multilayer electronic device 220 Rigid substrate (an example of substrate)
300 Laminated Electronic Device 350 Radiator 352 Heat Conducting Plate 400 Laminated Electronic Device 420 Rigid Substrate (Example of Substrate)
422 Signal ground layer (an example of a heat conduction layer)
450 radiator
L Ridge direction
T thickness direction
F Blowing direction
W1 width direction

Claims (8)

A plurality of heat conductive plate portions that are stacked on a substrate on which a semiconductor device is mounted, and the semiconductor device contacts;
A mounting portion having an attached thermally conductive end in the width direction perpendicular to the thickness direction that put on the thermal conductive plate,
A connecting portion that has thermal conductivity and connects between the mounting portions in the plate thickness direction in a bellows shape that is elastically deformable in the plate thickness direction;
A heatsink. The attachment portion has two arm portions that sandwich the end portion of the heat conducting plate portion.
The heat radiator according to claim 1. At the end in the width direction perpendicular to the plate thickness direction of each of the plurality of substrates on which the semiconductor devices stacked in the plate thickness direction are mounted, the semiconductor devices are attached so as to be in contact with the heat conductive layer provided on the substrate. A mounting portion having thermal conductivity;
A connecting portion that connects the attachment portions in the plate thickness direction in a bellows shape that is elastically deformable in the plate thickness direction;
A heatsink. The mounting portion has two arm portions that sandwich the end portion of the substrate.
The heat radiator according to claim 3. A substrate on which a semiconductor device is mounted;
The heat radiator according to any one of claims 1 to 4 ,
A multilayer electronic device comprising: The connecting portion is elastically deformable in the plate thickness direction and is attached in a tensile state.
The multilayer electronic device according to claim 5 . A blower for blowing air;
A substrate on which a semiconductor device is mounted and arranged along the air blowing direction of the air blown by the blower, and
The heat radiator according to any one of claims 1 to 4 ,
Electronic equipment comprising. The electronic device of Claim 7 arrange | positioned so that the ridgeline direction of the bending part of the bellows of the said connection part may follow the said ventilation direction.