JP6482454B2 - Electronic component manufacturing method and electronic component manufacturing apparatus - Google Patents

Description

  The present invention relates to an electronic component, a manufacturing method thereof, and an electronic component manufacturing apparatus.

  In response to market demands for reducing the thickness of electronic components (thinning electronic components), technologies for reducing the thickness of semiconductor chips have been developed.

  For example, a technique is known in which the back surface of a semiconductor wafer (having an integrated circuit pattern formed on the front surface side) before being singulated to form a semiconductor chip is ground (back grind).

JP-A-4-297056

  If the thickness of the semiconductor wafer is below a certain level (for example, about 100 μm or less), cracking or chipping is likely to occur during grinding of the back surface of the wafer, separation into pieces, or conveyance due to insufficient strength. As described above, when the semiconductor wafer is set to a certain thickness or less, processing becomes difficult, and the yield of semiconductor chips deteriorates.

  Further, from a viewpoint different from the above, an independent manufacturing apparatus used in each step of manufacturing an electronic component includes a workpiece carry-in portion and a carry-out portion. Providing manufacturing apparatuses used for each process separately increases the area occupied by the apparatus in the electronic component manufacturing factory.

  One object of the present invention is to provide an electronic component in which cracking or chipping of a semiconductor wafer is suppressed and yield is improved, and a method for manufacturing the same.

  In another aspect different from the above, another object of the present invention is to provide an electronic component manufacturing apparatus having a reduced occupation area in an electronic component manufacturing factory.

  In one aspect, the step of providing a plurality of functional elements on the substrate, the step of resin-sealing the plurality of functional elements formed on the substrate, and grinding the upper surface of the resin used for the resin sealing described above And a step of reducing the thickness of the resin.

  In another aspect, the electronic component manufacturing method according to the present invention includes a step of mounting a plurality of semiconductor chips on a substrate, a step of resin-sealing the plurality of semiconductor chips mounted on the substrate, and the resin sealing. Grinding the upper surface of the resin used for stopping and reducing the thickness of the resin.

  In one embodiment, in the method of manufacturing an electronic component, the semiconductor chip is mounted on the substrate by flip chip bonding, and the upper surface of the resin is ground so that the semiconductor chip is exposed.

  In one embodiment, the method of manufacturing the electronic component includes a step of reducing the thickness of the resin and the thickness of the semiconductor chip by grinding the upper surface of the resin and the upper surface of the semiconductor chip.

  In another aspect, a method of manufacturing an electronic component according to the present invention includes a step of mounting a plurality of semiconductor chips on a substrate, and a step of grinding the upper surface of the semiconductor chip to reduce the thickness of the semiconductor chip.

  In one aspect, an electronic component manufacturing apparatus according to the present invention includes a first specific mechanism having a first function and a grinding mechanism for grinding an upper surface of a resin that seals a plurality of functional elements provided on a substrate. The first function is a function of resin-sealing the plurality of functional elements provided on the substrate.

  In another aspect, the electronic component manufacturing apparatus according to the present invention includes a grinding mechanism for grinding an upper surface of a resin that seals a plurality of functional elements provided on a substrate, and a second specific mechanism having a second function. The second function is a function of cutting the substrate and the resin to produce individual electronic parts.

  In still another aspect, the electronic component manufacturing apparatus according to the present invention is configured to grind the upper surface of the resin that seals the first specific mechanism having the first function and the plurality of functional elements provided on the substrate. A mechanism and a second specific mechanism having a second function, wherein the first function is a function of resin-sealing the plurality of functional elements provided on the substrate. The function is a function of cutting the substrate and the resin to produce individualized electronic components.

  In still another aspect, the electronic component manufacturing apparatus according to the present invention includes a grinding mechanism for grinding an upper surface of a resin that seals a plurality of functional elements provided on a substrate, and a third specification having a third function. And the third function is a function of marking at least the upper surface of the resin.

  In one embodiment, in the electronic component manufacturing apparatus, the first to third specific mechanisms and the grinding mechanism are detachable from each other.

  In one aspect, an electronic component according to the present invention includes a substrate, a plurality of functional elements provided on the substrate, a sealing resin that seals the plurality of functional elements, and an upper surface of the sealing resin. And a continuous groove.

  In another aspect, an electronic component according to the present invention includes a substrate, a plurality of functional elements provided on the substrate, and a seal that seals the plurality of functional elements while exposing the top surfaces of the plurality of functional elements. A stop resin, and a groove continuous over the upper surface of the sealing resin and the upper surfaces of the plurality of functional elements are provided.

  In still another aspect, an electronic component according to the present invention includes a substrate, a semiconductor chip mounted on the substrate, a sealing resin that seals the semiconductor chip, and a groove that is continuous on the top surface of the sealing resin. With.

  In still another aspect, an electronic component according to the present invention includes a substrate, a semiconductor chip mounted on the substrate, a sealing resin that seals the semiconductor chip while exposing an upper surface of the semiconductor chip, and A groove that is continuous over the upper surface of the sealing resin and the upper surface of the semiconductor chip is provided.

  As one effect, according to the present invention, after the semiconductor chip is mounted on the substrate, a grinding process for reducing the thickness of the resin or the semiconductor chip is performed. As a result, the yield can be improved by suppressing the occurrence of cracks and chips in the semiconductor chip.

  As another effect, according to the present invention, by incorporating a grinding mechanism for grinding the upper surface of the resin that seals the semiconductor chip into the same device as the resin sealing mechanism, the singulation mechanism, and the marking mechanism, An electronic component manufacturing apparatus having a reduced occupation area in a manufacturing factory can be provided.

It is a flowchart which shows the manufacturing method of the electronic component which concerns on one embodiment of this invention. It is a flowchart which shows the manufacturing method of the electronic component which concerns on a comparative example. It is a figure which shows the state which performed the resin sealing process in the manufacturing method of the electronic component which concerns on one embodiment of this invention. It is a figure which shows the grinding process in the manufacturing method of the electronic component which concerns on one embodiment of this invention. It is a figure which shows the cutting process in the manufacturing method of the electronic component which concerns on one embodiment of this invention. It is a figure which shows the electronic component manufacturing apparatus which concerns on one embodiment of this invention. It is a figure which shows the electronic component manufacturing apparatus which concerns on other embodiment of this invention. It is sectional drawing which shows the example of the electronic component as a workpiece processed by the electronic component manufacturing apparatus shown in FIG. 6, FIG. It is sectional drawing which shows 1 process of the modification of the manufacturing method of the electronic component which concerns on one embodiment of this invention. FIG. 10 is a top view corresponding to the state of FIG. 9. It is a top view which shows the further modification of the example shown in FIG. 9, FIG.

  Embodiments of the present invention will be described below. Note that the same or corresponding portions are denoted by the same reference numerals, and the description thereof may not be repeated.

  Note that in the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified.

  FIG. 1 is a flowchart showing a method for manufacturing an electronic component according to the present embodiment. As shown in FIG. 1, the method of manufacturing an electronic component according to the present embodiment includes a step of forming a semiconductor chip by separating a wafer (S10), and a step of mounting a semiconductor chip on a substrate (S20). A step of resin-sealing the semiconductor chip mounted on the substrate (S30), a step of polishing (grinding) the upper surface of the resin (S40), a step of separating the resin-sealed product into pieces (S50), And a step of performing an inspection / test (S60). The step of mounting the semiconductor chip on the substrate (S20) includes a step of mounting the semiconductor chip on the substrate (eg, die bonding) and a step of electrically connecting the terminals of the semiconductor chip and the terminals of the substrate ( Example: wire bonding). Flip chip bonding is also included in the step of mounting the semiconductor chip on the substrate (S20).

  FIG. 2 is a flowchart showing a method for manufacturing an electronic component according to a comparative example. As shown in FIG. 2, the method of manufacturing an electronic component according to the comparative example also includes a wafer singulation step (S10A), a semiconductor chip mounting step (S20A), a resin sealing step (S30A), and polishing ( A grinding) step (S40A), a resin-encapsulated product singulation step (S50A), and an inspection / test step (S60A). However, in the comparative example, the wafer back surface polishing (grinding) step (S40A) is performed before the wafer singulation step (S10A). As described above, when the thickness of a semiconductor chip is reduced before being mounted on a substrate, cracking or chipping is likely to occur during polishing (grinding), wafer singulation, or semiconductor chip transport, and the yield of semiconductor chips. Gets worse.

  On the other hand, in the electronic component manufacturing method according to the present embodiment, the semiconductor wafer manufactured in the previous process (wafer manufacturing process) is cut while maintaining a predetermined thickness in the subsequent process (assembly process). It becomes a semiconductor chip. The semiconductor chip is resin-sealed after being mounted on the circuit board. Thereafter, the resin-encapsulated portion and the semiconductor chip are ground and thinned sequentially. By doing in this way, a crack and a chip | tip of a semiconductor chip can be suppressed and the yield of a semiconductor chip can be improved.

  FIG. 3 is a diagram showing a state where the resin sealing step (S30) in the electronic component manufacturing method according to the present embodiment is performed. As shown in FIG. 3, a plurality of semiconductor chips 20 are mounted on the substrate 10 and are sealed with a sealing resin 30. As the sealing resin 30, for example, an epoxy resin is used. Each semiconductor chip 20 has functions such as calculation, control, and data storage. The plurality of semiconductor chips 20 mounted on the substrate 10 correspond to a plurality of functional elements provided on the substrate 10.

  FIG. 4 is a diagram showing a polishing (grinding) step (S40) in the method of manufacturing an electronic component according to the present embodiment. As shown in FIG. 4, the substrate 10 on which the semiconductor chip 20 is mounted is attracted to the table 40 (arrow DR40). The substrate 10 may be fixed to the table 40 using a jig. A solder ball 10 </ b> A as a back electrode is formed on the back surface of the substrate 10. The table 40 has a recess 40A that can accommodate the solder ball 10A. The sealing resin 30 and the semiconductor chip 20 are polished by the grinder 50 that moves in the direction of the arrow DR50 at a constant moving speed while rotating. By polishing the sealing resin 30 in addition to the semiconductor chip 20, the area to be polished is increased as compared with the case of polishing only the back surface of the semiconductor chip 20, but before the semiconductor chip 20 is mounted on the substrate 10. Therefore, it is possible to suppress the occurrence of cracks and chips in the semiconductor chip 20 and improve the yield.

  FIG. 4 shows a step of simultaneously polishing (grinding) the entire thickness of the sealing resin 30 and a part of the thickness of the semiconductor chip 20 as a step of polishing (grinding) (S40). In this case, the rotational speed of the grinder 50 (referred to as the rotational speed per unit time; hereinafter the same) is limited by the semiconductor chip 20 having hard and brittleness. For the purpose of increasing the efficiency of polishing (grinding), after polishing (grinding) all the thickness of the sealing resin 30 at a large rotational speed, the thickness of a part of the semiconductor chip 20 is polished (ground) at a small rotational speed. May be. After polishing (grinding) all the thickness of the sealing resin 30 at a high moving speed, the thickness of a part of the semiconductor chip 20 may be polished (ground) at a low moving speed. The moving speed may be a relative moving speed between the table 40 and the grinder 50.

  FIG. 5 is a diagram showing a cutting step (S50) in the method of manufacturing an electronic component according to the present embodiment. As shown in FIG. 5, the substrate 10 and the sealing resin 30 are cut by the rotating blade 60, and the resin-sealed electronic component is cut (divided into pieces) according to the product size.

Next, the electronic component manufacturing apparatus according to the present embodiment will be described with reference to FIGS.
FIG. 6 shows an example in which the resin sealing mechanism and the grinding mechanism are incorporated into one apparatus, and FIG. 7 shows an example in which the grinding mechanism and the cutting mechanism are incorporated into one apparatus.

  In the example of FIG. 6, the electronic component manufacturing apparatus includes first to fourth units A1 to A4. The first unit A1 as a “carry-in unit” includes a carry-in unit 100 into which a workpiece is carried in, a workpiece conveyance mechanism 150, and a substrate platform 200. The second unit A2 as the “resin sealing unit” includes a rotation mechanism 300 that rotates the workpiece and a resin sealing mechanism 400 that performs resin sealing of the semiconductor chip. The third unit A3 as a “grinding unit” includes a rotation mechanism 300 that rotates the workpiece, and a grinding mechanism 500 that polishes (grinds) the workpiece. The fourth unit A4 as the “inspection / unloading unit” includes an inspection table 600 and an unloading unit 700 for unloading the workpiece.

  In FIG. 6, the first unit A1 and the second unit A2 are detachable from each other. The second unit A2 and the third unit A3 are detachable from each other. The third unit A3 and the fourth unit A4 are detachable from each other. In addition, the same type of units, for example, two or more second units as “resin sealing units” may be provided as in the second units A2a, A2b,. In this case, the second units A2a, A2b,... Can be attached to and detached from each other. Two or more third units A3 as “grinding units” may be provided as the same type of unit. In this case, the third units A3a, A3b,... Can be attached to and detached from each other.

  In the example of FIG. 7, the electronic component manufacturing apparatus includes first to fourth units B1 to B4. The first unit B1 as a “carry-in unit” includes a carry-in unit 100 into which a workpiece is carried in, a workpiece conveyance mechanism 150, and a substrate platform 200. The second unit B2 as the “grinding unit” includes a rotation mechanism 300 that rotates the workpiece and a grinding mechanism 500 that polishes (grinds) the workpiece. The third unit B3 as the “cutting unit” includes a rotation mechanism 300 that rotates the workpiece and a cutting mechanism 800 that cuts the workpiece. The fourth unit B4 as the “inspection / unloading unit” includes an inspection table 600 and an unloading unit 700 for unloading the workpiece.

  In FIG. 7, the first unit B1 and the second unit B2 are detachable from each other. The second unit B2 and the third unit B3 are detachable from each other. The third unit B3 and the fourth unit B4 are detachable from each other. It is the same in the case of the example in FIG. 6 that two or more units of the same type may be provided. In the example of FIG. 7, the same type of unit is a second unit as a “grinding unit” and a third unit as a “cutting unit”.

  In the example of FIG. 7, a resin sealing unit (see the second unit A2 in FIG. 6) may be provided in front of the second unit B2 as the “grinding unit”. In this case, the first unit B1 as the “carry-in unit” and the resin sealing unit are detachable from each other, and the resin sealing unit and the grinding unit are detachable from each other.

  6 and FIG. 7, after the third unit A3 (see FIG. 6) or the second unit B2 (see FIG. 7) as a “grinding unit”, at least the top surface of the sealing resin used for resin sealing A marking unit for marking a mark may be provided. In this case, the grinding unit and the marking unit can be attached to and detached from each other.

  According to this embodiment, the grinding unit for grinding the upper surface of the resin that seals the semiconductor chip is incorporated afterwards into a common apparatus including the resin sealing unit, the singulation unit, and the marking unit. It is removed from the device afterwards. Therefore, if necessary, it is possible to provide an electronic component manufacturing apparatus in which the grinding unit is incorporated afterwards and the grinding unit is removed afterward. In addition, it is possible to provide an electronic component manufacturing apparatus in which a resin sealing unit is added afterwards and a resin sealing unit is removed afterward as needed. Therefore, according to these electronic component manufacturing apparatuses, it is possible to respond to an increase or decrease in demand for electronic components and a request for thinning of electronic components afterwards.

  As a modification example, for example, a resin sealing mechanism, a grinding mechanism, and a cutting mechanism may be incorporated into one device.

  FIG. 8 is a cross-sectional view of an electronic component as a workpiece processed by the above-described electronic component manufacturing apparatus. As shown in FIG. 8A, an electronic component in which the semiconductor chip 20 is wire-bonded on the substrate 10 may be used, or as shown in FIG. 8B, the semiconductor chip 20 is flipped on the substrate 10. It may be a chip-mounted electronic component.

  In the case of the structure shown in FIG. 8A, the grinding range needs to be higher than the wire 20A, and is, for example, higher than the “A” line in the figure. In this case, the semiconductor chip 20 is not exposed, but a cooling plate mounted on the semiconductor chip 20 may be exposed. After grinding, a continuous polishing mark is formed on the upper surface of the sealing resin 30.

  In the case of the structure of FIG. 8B, an underfill 20 </ b> B is provided below the semiconductor chip 20. In the case of this structure, it is also possible to grind the back surface of the semiconductor chip 20 together with the sealing resin 30 with the grinding range being higher than “B” in the drawing. Thereby, the back surface of the semiconductor chip 20 is exposed from the sealing resin 30. Further, after grinding, a continuous polishing mark is formed over the upper surface of the sealing resin 30 and the upper surface of the semiconductor chip 20. As an electronic component to which the structure shown in FIG. 8B is applied, for example, MEMS can be cited in addition to an electronic component including a semiconductor element.

  In FIG. 8B, only the underfill 20B may be provided as the sealing resin. In this case, continuous polishing marks are formed on the upper surface of the semiconductor chip.

  A plurality of semiconductor chips 20 may be included in one electronic component. For example, a plurality of semiconductor chips 20 included in one electronic component may be stacked. In this case, the sealing resin 30 on the uppermost semiconductor chip 20 is polished. The obtained electronic component becomes a stack-type electronic component.

  In a PoP (Package on Package) type electronic component, the sealing resin 30 on the uppermost semiconductor chip 20 is polished. When the uppermost semiconductor chip 20 is a flip chip, the sealing resin 30 on the uppermost semiconductor chip 20 and the uppermost semiconductor chip 20 are polished.

  A plurality of chips included in one electronic component may include a chip other than a semiconductor chip. For example, the plurality of chips shown in FIG. 4 may be control ICs, power devices, passive elements, and the like. In this case, dimensions such as thickness and the number of terminals in a plurality of chips are different. The part after the grinding process shown in FIG. 4 is completed may correspond to one electronic part (for example, an electronic module for power control).

  In both cases of the structure of FIG. 8A and the structure of FIG. 8B, continuous polishing marks are constituted by a plurality of continuous fine grooves arranged in parallel. In other words, a plurality of fine ridges and valleys are formed in parallel on the upper surface of the electronic component. Depending on the polishing method, a plurality of fine concave portions and convex portions are formed side by side. In the present application documents, the term “groove” includes “concave portion”.

  The surface area on the top surface of the sealing resin, the surface area on the top surface of the semiconductor chip, or the top surface of the sealing resin and the top surface of the semiconductor chip by a plurality of fine grooves formed side by side, The surface area on the top surface increases. Therefore, first, heat dissipation from the upper surface of the sealing resin and heat dissipation from the upper surface of the semiconductor chip are improved. Second, in the case where a heat sink is attached to at least the upper surface of the semiconductor chip, the adhesion and heat dissipation between the upper surface of the semiconductor chip and the lower surface of the heat sink are improved. Thirdly, when marking an electronic component by stamping, the adhesion between the ink and the sealing resin or semiconductor chip is improved. Fourth, in the step of mounting the electronic component on a printed circuit board or the like, it is suppressed that the image recognition for positioning the electronic component is hindered by the reflected light.

  FIG. 9 is a cross-sectional view showing one step of a modified example of the electronic component manufacturing method according to the present embodiment. In the modification of FIG. 9, grooves 30A (30A1, 30A2) are formed in the sealing resin 30 before the grinding process. Although the molded substrate after resin sealing may be warped due to the difference in thermal expansion coefficient between the resin and the substrate, the warpage can be reduced by forming the groove 30A. However, the groove 30A is formed shallower than the grinding line (C).

  The step of forming the groove 30A is incorporated between a plurality of steps, for example, the groove 30A is formed by a cutting mechanism after resin sealing, the resin surface is ground by the grinding mechanism, and completely cut again by the cutting mechanism. Can do. Thereby, the conveyance time of a workpiece can be reduced.

  The arrangement of the grooves 30A may be as shown in FIG. 10 or as shown in FIG. The groove shapes shown in FIGS. 10 and 11 are examples and can be arbitrarily changed.

  In FIG. 8, examples of wire bonding and flip chip mounting are shown as the steps of electrically connecting the terminals of the plurality of semiconductor chips 20 and the terminals of the substrate 10. The method of mounting the semiconductor chip 20 on the upper surface of the substrate 10 is arbitrary, and the type of electronic component is not limited to the example of FIG.

  Moreover, the manufacturing process shown in FIGS. 3-5 is only an example for demonstrating invention roughly. For example, in addition to the processes described above, there are an after-curing process and a marking process after resin sealing. The present invention appropriately employs a manufacturing process corresponding to the type of electronic component, and is not limited to the above-described manufacturing process.

  Further, the semiconductor chip 20 and the sealing resin 30 are not necessarily ground together. Depending on the product type, only the semiconductor chip 20 or only the sealing resin 30 may be ground. When grinding only the semiconductor chip 20, for example, after underfilling (filling a resin between the semiconductor chip 20 and the substrate 10) is performed on the semiconductor chip 20 that is flip-chip mounted, the semiconductor chip 20 is then ground. Can be ground.

  The order of the manufacturing process of the electronic component according to the present invention is appropriately changed depending on the manufacturing type. In the present embodiment, an example in which the resin sealing mechanism or the cutting mechanism and the grinding mechanism are incorporated (built-in) in one apparatus has been described. However, the process of combining with the grinding mechanism can be appropriately changed according to the type of manufacture. .

  According to the method for manufacturing an electronic component according to the present embodiment, after mounting the semiconductor chip 20 on the substrate 10, a grinding process is performed to reduce at least one of the thickness of the sealing resin 30 or the thickness of the semiconductor chip 20. This makes it possible to omit the step of grinding the semiconductor wafer before mounting the semiconductor chip 20 on the substrate 10. As a result, it is possible to suppress the occurrence of cracks and chips in the semiconductor chip 20 and improve the yield. Even when the step of grinding the semiconductor wafer is left before the semiconductor wafer is singulated, the amount (thickness) of grinding the semiconductor wafer can be reduced. Therefore, first, the yield can be improved by making the thickness of the semiconductor wafer easy to handle during transportation. Secondly, the number of steps for grinding the semiconductor wafer can be reduced.

  Further, by incorporating the grinding mechanism 500 for grinding the upper surface of the sealing resin 30 for sealing the semiconductor chip 20 into the mechanism for performing the preceding and following processes, the occupation area in the electronic component manufacturing factory is reduced, and the factory floor area is reduced. There is room.

  The electronic component according to the present invention is not limited to an electronic component including a semiconductor chip. A first example of the electronic component is a surface acoustic wave filter. One surface of a substrate having a piezoelectric function (having a piezoelectric effect) is divided into a plurality of regions, and opposing comb-like metal electrodes are formed in each region. One surface of the substrate is resin-sealed, the upper surface of the sealing resin is polished, and the substrate is separated into each region. A plurality of surface acoustic wave filters corresponding to a plurality of regions can be manufactured. In this case, the comb-like metal electrode in each region corresponds to a functional element that functions as a surface acoustic wave filter.

  A first example of the electronic component is a micromirror array. One surface of a substrate made of silicon, glass, ceramics, or the like is divided into a plurality of regions. A metal thin film is formed on one surface of the substrate by vapor deposition, sputtering, or the like. A plurality of minute columnar metals are formed on the metal thin film by combining processes such as photolithography and electroforming. After resin-sealing one surface of the substrate, the upper surface of the sealing resin is polished to expose the cross-sections of the plurality of columnar metals in a mirror shape. Thereafter, the substrate is divided into each region. Light such as laser light is reflected by the exposed surface of the columnar metal. A plurality of micromirror arrays corresponding to a plurality of regions can be manufactured. In this case, the plurality of columnar metals in each region correspond to functional elements that function as a micromirror array. The substrate between the plurality of columnar metals may be removed by an appropriate thickness by etching or the like.

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

10 substrate, 10A solder ball, 20 semiconductor chip, 20A wire, 20B underfill, 30 sealing resin, 30A, 30A1, 30A2 groove, 40 table, 40A, 40B recess, 50 grinder, 60 blade, 100 carry-in, 150 transport Mechanism, 200 Substrate placing part, 300 Rotating mechanism, 400 Resin sealing mechanism, 500 Grinding mechanism, 600 Inspection table, 700 Unloading part, 800 Cutting mechanism

Claims (10)

Providing a plurality of functional elements on the main surface of the substrate;
A step of resin-sealing the plurality of functional elements formed on the substrate;
Forming a back electrode on the back surface of the substrate;
Grinding the upper surface of the resin used for the resin sealing to reduce the thickness of the resin while fixing the substrate to the table in a state where the back electrode is housed in the first recess of the table ; and
A step of cutting the substrate and the resin with a blade to separate the resin-sealed electronic components,
In the step of dividing into pieces, the electronic component is placed on the table with the surface ground in the step of reducing the thickness of the resin facing the table, and the tip of the blade has the table An electronic component manufacturing method that is received in the second recess . Mounting a plurality of semiconductor chips on the main surface of the substrate;
A step of resin-sealing the plurality of semiconductor chips mounted on the substrate;
Forming a back electrode on the back surface of the substrate;
Grinding the upper surface of the resin used for the resin sealing to reduce the thickness of the resin while fixing the substrate to the table in a state where the back electrode is housed in the first recess of the table ; and
A step of cutting the substrate and the resin with a blade to separate the resin-sealed electronic components,
In the step of dividing into pieces, the electronic component is placed on the table with the surface ground in the step of reducing the thickness of the resin facing the table, and the tip of the blade has the table An electronic component manufacturing method that is received in the second recess . The semiconductor chip is mounted on the substrate by flip chip bonding,
The method of manufacturing an electronic component according to claim 2, wherein an upper surface of the resin is ground so that the semiconductor chip is exposed.   The method of manufacturing an electronic component according to claim 3, further comprising a step of reducing the thickness of the resin and the thickness of the semiconductor chip by grinding the upper surface of the resin and the upper surface of the semiconductor chip. Mounting a plurality of semiconductor chips on the main surface of the substrate;
Forming a back electrode on the back surface of the substrate;
Reducing the thickness of the semiconductor chip by grinding the upper surface of the semiconductor chip while fixing the substrate to the table in a state where the back electrode is housed in the first recess of the table ;
Cutting the substrate with a blade to separate the electronic components into pieces,
In the step of dividing into pieces, the electronic component is placed on the table with the surface ground in the step of reducing the thickness of the resin facing the table, and the tip of the blade has the table An electronic component manufacturing method that is received in the second recess . It is an electronic component manufacturing apparatus used for the manufacturing method of the electronic component of any one of Claims 1-5,
A resin sealing mechanism having a function of resin sealing the plurality of functional elements provided on the substrate;
A grinding mechanism for grinding the upper surface of the resin sealing a plurality of functional elements provided on the substrate;
A cutting mechanism having a function of cutting the substrate and the resin to produce individualized electronic components ;
An electronic component manufacturing apparatus in which the grinding mechanism and the cutting mechanism are incorporated in one apparatus. The electronic component manufacturing apparatus according to claim 6, further comprising a marking mechanism having a function of marking at least an upper surface of the resin . The electronic component manufacturing apparatus according to claim 6 or 7 , wherein the resin sealing mechanism and the grinding mechanism are detachable from each other. The electronic component manufacturing apparatus according to claim 7 , wherein the marking mechanism and the grinding mechanism are detachable from each other. The electronic component manufacturing apparatus according to claim 7 , wherein the resin sealing mechanism, the marking mechanism, and the grinding mechanism are detachable from each other.

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