JP6541444B2 - Display device and display unit - Google Patents
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- JP6541444B2 JP6541444B2 JP2015111821A JP2015111821A JP6541444B2 JP 6541444 B2 JP6541444 B2 JP 6541444B2 JP 2015111821 A JP2015111821 A JP 2015111821A JP 2015111821 A JP2015111821 A JP 2015111821A JP 6541444 B2 JP6541444 B2 JP 6541444B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Description
本発明は、表示装置および表示ユニットに関する。 The present invention relates to a display apparatus and a display unit.
表示装置は、光源をマトリクス状に配列して構成される。この種の表示装置において、外光が表示装置における光源の外周部分に入射するとその光源の外周部分からの反射光が発生する。この場合、光源が点灯している状態において、光源と光源の外周部分とのコントラストが低下し、表示装置の視認性が低下してしまう。これに対して、例えば複数の発光ダイオードと、各発光ダイオードの外周近傍に設けられたルーバと、を備える表示装置が提案されている(特許文献1参照。)。特許文献1に記載された表示装置では、ルーバが表示装置における発光ダイオードの外周部分へ入射する外光を遮断することにより発光ダイオードの視認性を向上させている。 The display device is configured by arranging light sources in a matrix. In this type of display device, when external light is incident on the outer peripheral portion of the light source in the display device, reflected light from the outer peripheral portion of the light source is generated. In this case, when the light source is on, the contrast between the light source and the outer peripheral portion of the light source is reduced, and the visibility of the display device is reduced. On the other hand, there has been proposed a display device including, for example, a plurality of light emitting diodes and a louver provided in the vicinity of the outer periphery of each light emitting diode (see Patent Document 1). In the display device described in Patent Document 1, the visibility of the light emitting diode is improved by the louver blocking external light entering the outer peripheral portion of the light emitting diode in the display device.
しかしながら、特許文献1に記載された構成では、ルーバが発光ダイオードの外周近傍に設けられているため、発光ダイオードから放射される光が部分的にルーバに遮られてしまい、発光ダイオードから放射される光が損なわれてしまう。 However, in the configuration described in Patent Document 1, since the louver is provided in the vicinity of the outer periphery of the light emitting diode, the light emitted from the light emitting diode is partially blocked by the louver and emitted from the light emitting diode The light is lost.
本発明は、上記事由に鑑みてなされたものであり、発光部から放射される光の損失を低減できる表示装置を提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a display device capable of reducing the loss of light emitted from a light emitting unit.
上記目的を達成するために、本発明に係る表示装置は、
マトリクス状に配列された複数の発光部と、
前記複数の発光部が実装された基板と、
前記基板の前記発光部側の主面において前記複数の発光部それぞれの外周部に設けられ前記基板の前記主面へ入射する外光の反射を防止する反射防止部と、
前記基板の前記主面とは反対側の裏面側が内部空間に露出する形で前記基板を保持する筐体と、を備え、
前記基板は、隣接する2つの発光部の間に前記基板の厚さ方向に貫通する貫通孔を有し、
前記反射防止部は、少なくとも前記発光部の前記複数の発光部の光軸に直交する一方向側において、前記複数の発光部から放射された光が配光される配光領域の外側に位置し、前記主面を覆う主面被覆部と、前記裏面を覆う裏面被覆部と、前記貫通孔の内側に位置し前記主面被覆部と前記裏面被覆部とを結合する結合部と、を有するとともに、前記基板における前記裏面の少なくとも一部を覆わない。
In order to achieve the above object, a display device according to the present invention is
A plurality of light emitting units arranged in a matrix;
A substrate on which the plurality of light emitting units are mounted;
A reflection preventing portion provided on an outer peripheral portion of each of the plurality of light emitting portions on the main surface on the light emitting portion side of the substrate and preventing reflection of external light incident on the main surface of the substrate;
And a case for holding the substrate in a form in which the back surface side opposite to the main surface of the substrate is exposed to the internal space ,
The substrate has a through hole penetrating in the thickness direction of the substrate between two adjacent light emitting units,
The reflection preventing unit, the one-way side perpendicular to the optical axis of the plurality of light emitting portions of at least the light emitting portion, located outside the light distribution area where light emitted from the plurality of light emitting portions are light distribution A main surface covering portion covering the main surface, a back surface covering portion covering the back surface, and a coupling portion located inside the through hole and coupling the main surface covering portion and the back surface covering portion; And not covering at least a part of the back surface of the substrate .
本発明によれば、反射防止部が、発光部から放射された光が配光される配光領域の外側に位置する。これにより、少なくとも発光部の光軸に直交する一方向側において、発光部から放射された光が、反射防止部により遮られることがないので、発光部から放射される光の損失を低減できる。 According to the present invention, the anti-reflection portion is located outside the light distribution area where the light emitted from the light emitting portion is distributed. Thus, the light emitted from the light emitting unit is not blocked by the anti-reflection unit at least on one side orthogonal to the optical axis of the light emitting unit, so that the loss of light emitted from the light emitting unit can be reduced.
以下、本発明の実施の形態に係る表示装置について、添付図面を参照しながら説明する。 Hereinafter, a display device according to an embodiment of the present invention will be described with reference to the attached drawings.
(実施の形態1)
本実施の形態に係る表示装置1は、屋外や屋内に設置されるいわゆる大型表示ディスプレイである。図1に示すように、表示装置1は、マトリスク状に配列され各画素を構成する複数の発光部11と、複数の発光部11の外周部に設けられた反射防止部13と、を備える。また、表示装置1は、図2に示すように、発光部11が実装される基板12を備える。
Embodiment 1
The display device 1 according to the present embodiment is a so-called large display which is installed outdoors or indoors. As shown in FIG. 1, the display device 1 includes a plurality of light emitting units 11 arranged in a matrix shape and configuring each pixel, and a reflection preventing unit 13 provided on the outer peripheral portion of the plurality of light emitting units 11. Moreover, the display apparatus 1 is provided with the board | substrate 12 in which the light emission part 11 is mounted, as shown in FIG.
発光部11は、いわゆる表面実装型であり、図2に示すように、発光ダイオード111と、発光ダイオード111にワイヤ114を介して接続された正極端子112と、半田等の導電性部材(図示せず)を介して接続された負極端子113とを備える。更に、発光部11は、内側に発光ダイオード111が配置されるハウジング115と、発光ダイオード111を封止する封止部116と、を有する。ハウジング115は、一面が開放された矩形箱状であり、その底面に発光ダイオード111が配置されている。封止部116は、ハウジング115に充填されている。 The light emitting unit 11 is a so-called surface mounted type, and as shown in FIG. 2, the light emitting diode 111, the positive electrode terminal 112 connected to the light emitting diode 111 via the wire 114, and a conductive member such as solder And the negative electrode terminal 113 connected via the Furthermore, the light emitting unit 11 includes a housing 115 in which the light emitting diode 111 is disposed, and a sealing unit 116 that seals the light emitting diode 111. The housing 115 is in the form of a rectangular box whose one surface is open, and the light emitting diode 111 is disposed on the bottom surface thereof. The sealing portion 116 is filled in the housing 115.
発光部11から放射される光の指向角θ1は、50°から60°の間に設定されている。ここで、「指向角」とは、放射される光が光軸方向に放射される光の光量の半分となる放射方向の光軸に対する角度を意味する。ハウジング115は、発光ダイオード111から指向角θ1で放射される光を遮らない形状に設定されている。以下、本明細書では、放射方向と発光部11の光軸J1とのなす角度が発光部11の指向角θ1以下である光が放射される領域A1(図2中のクロスハッチ部分参照)を、発光部11から放射された光が配光される配光領域A1として説明する。 The directivity angle θ1 of the light emitted from the light emitting unit 11 is set between 50 ° and 60 °. Here, the “directing angle” means an angle with respect to the optical axis of the radiation direction which is half the light amount of the light emitted in the optical axis direction. The housing 115 is set so as not to block the light emitted from the light emitting diode 111 at the directivity angle θ1. Hereinafter, in the present specification, an area A1 (refer to the cross hatch portion in FIG. 2) in which light whose angle between the radiation direction and the optical axis J1 of the light emitting portion 11 is smaller than the directivity angle θ1 of the light emitting portion 11 is emitted. The light distribution area A1 will be described in which the light emitted from the light emitting unit 11 is distributed.
基板12は、ガラスエポキシ基板等のリジッド基板と、このリジッド基板上に金属等から形成され、発光部11へ電力を供給する導体パターンと、から構成される。基板12の導体パターンは、発光部11の正極端子112、負極端子113に、半田等の導電部材を介して接続される。 The substrate 12 is composed of a rigid substrate such as a glass epoxy substrate and a conductive pattern formed of metal or the like on the rigid substrate to supply power to the light emitting unit 11. The conductor pattern of the substrate 12 is connected to the positive electrode terminal 112 and the negative electrode terminal 113 of the light emitting unit 11 via a conductive member such as solder.
反射防止部13は、発光部11の外周部等に設けられ基板12の主面12aへ入射する外光の反射を防止する。この反射防止部13は、光の反射率が低く且つ吸光度が高い低反射高吸収膜から構成されている。この低反射高吸収膜は、非透光性(例えば黒色に着色された)シリコーン樹脂やエポキシ樹脂等の熱硬化性樹脂から形成されている。反射防止部13は、基板12の主面12aから裏面12bにまで回り込む形で形成されている。この反射防止部13は、基板12の主面12aを覆う主面被覆部13aと、基板12の裏面12bを覆う裏面被覆部13bと、主面被覆部13a、裏面被覆部13bおよび基板12の側方を覆う側方被覆部13cと、を有する。主面被覆部13aの基板12の厚さ方向の高さは、発光部11の発光面11aの基板12の厚さ方向における高さと略同じ高さL1に設定されている。これにより、主面被覆部13aは、発光部11から放射された光が配光される配光領域A1の外側に位置する。また、裏面被覆部13bの基板12の厚さ方向の高さL3は、基板12の裏面12bに形成された導体パターンの電気的絶縁性が確保できる程度の大きさに設定される。 The reflection preventing portion 13 is provided on an outer peripheral portion or the like of the light emitting portion 11 and prevents reflection of external light incident on the major surface 12 a of the substrate 12. The reflection preventing portion 13 is formed of a low reflection high absorption film having a low light reflectance and a high absorbance. This low reflection and high absorption film is formed of thermosetting resin such as non-light transmitting (for example, black colored) silicone resin and epoxy resin. The anti-reflection portion 13 is formed to extend from the main surface 12 a to the back surface 12 b of the substrate 12. The reflection preventing portion 13 includes a main surface covering portion 13a covering the main surface 12a of the substrate 12, a back surface covering portion 13b covering the back surface 12b of the substrate 12, a main surface covering portion 13a, a back surface covering portion 13b and the substrate 12 side. And a side covering portion 13c covering the side. The height of the main surface covering portion 13a in the thickness direction of the substrate 12 is set to a height L1 substantially the same as the height of the light emitting surface 11a of the light emitting portion 11 in the thickness direction of the substrate 12. Thus, the main surface covering portion 13a is located outside the light distribution area A1 in which the light emitted from the light emitting portion 11 is distributed. Further, the height L3 of the back surface covering portion 13b in the thickness direction of the substrate 12 is set to such a size that the electrical insulation of the conductor pattern formed on the back surface 12b of the substrate 12 can be secured.
次に、本実施の形態に係る表示装置1の製造方法について説明する。まず、発光部11を基板12に実装する。ここでは、例えばリフロー方式により、発光部11の正極端子112、負極端子113を、基板12の主面12aに形成された導体パターンに半田づけする。 Next, a method of manufacturing the display device 1 according to the present embodiment will be described. First, the light emitting unit 11 is mounted on the substrate 12. Here, the positive electrode terminal 112 and the negative electrode terminal 113 of the light emitting unit 11 are soldered to the conductor pattern formed on the main surface 12 a of the substrate 12 by, for example, a reflow method.
次に、トランスファー成型法または射出成型法により、反射防止部13を形成する成型工程を実行する。ここでは、まず、図3(A)に示すように、発光部11と基板12とを、金型51、52とで形成される領域S1内に配置する。このとき、発光部11の発光面11aを弾性材料から形成された緩衝材53を介して金型51の内壁に押さえ付ける方向に付勢した状態で配置する。例えば、発光部11、基板12および金型51、52を、金型51側が鉛直下側となる姿勢で保持する。この場合、発光部11と基板12とが、自重により緩衝材53を介して金型51に押さえ付けられる。これにより、発光部11の発光面11aの基板12の主面12aからの高さにバラツキが存在しても、緩衝材53が弾性変形することにより発光部11の発光面11aと金型51との間に空隙が発生するのを防止できる。 Next, a molding step of forming the reflection preventing portion 13 is performed by a transfer molding method or an injection molding method. Here, first, as shown in FIG. 3A, the light emitting unit 11 and the substrate 12 are disposed in the region S1 formed by the molds 51 and 52. At this time, the light emitting surface 11 a of the light emitting portion 11 is disposed in a state of being biased in a direction to press against the inner wall of the mold 51 via the buffer material 53 formed of an elastic material. For example, the light emitting unit 11, the substrate 12, and the molds 51 and 52 are held in a posture in which the mold 51 side is vertically downward. In this case, the light emitting unit 11 and the substrate 12 are pressed against the mold 51 via the buffer material 53 by their own weight. As a result, even if the height of the light emitting surface 11a of the light emitting portion 11 from the main surface 12a of the substrate 12 varies, the buffer material 53 elastically deforms to thereby cause the light emitting surface 11a of the light emitting portion 11 and the metal mold 51 Air gaps can be prevented from occurring.
次に、図3(B)に示すように、領域S1内に液体状の樹脂材料13dを圧入する。ここで、緩衝材53は、発光部11の発光面11aと金型51との間への樹脂材料13dの侵入を防止する役割を果たす。これにより、反射防止部13の基となる材料が発光部11の発光面11aと金型51との間に発生する空隙に入り込み、発光部11の発光面11aが覆われてしまうのを防止できる。 Next, as shown in FIG. 3B, the liquid resin material 13d is pressed into the region S1. Here, the buffer material 53 plays a role of preventing the intrusion of the resin material 13 d between the light emitting surface 11 a of the light emitting unit 11 and the mold 51. Thereby, it can prevent that the material used as the basis of the reflection prevention part 13 entraps into the space which generate | occur | produces between the light emission surface 11a of the light emission part 11, and the metal mold 51, and the light emission surface 11a of the light emission part 11 is covered. .
続いて、領域S1に圧入した樹脂材料13dを硬化させる。具体的には、金型51、52、発光部11、基板12および緩衝材53全体を加熱することにより、樹脂材料13dを硬化させる。樹脂材料13dが硬化した部分が反射防止部13となる。 Subsequently, the resin material 13d pressed into the region S1 is cured. Specifically, the resin material 13 d is cured by heating all of the molds 51 and 52, the light emitting unit 11, the substrate 12, and the buffer material 53. The portion where the resin material 13 d is cured becomes the anti-reflection portion 13.
その後、図3(C)に示すように、金型51、52および緩衝材53を取り除く(図3(C)中の矢印AR11、AR12)。 Thereafter, as shown in FIG. 3C, the molds 51 and 52 and the buffer material 53 are removed (arrows AR11 and AR12 in FIG. 3C).
以上説明したように、本実施の形態に係る表示装置1では、反射防止部13が、発光部11から放射された光が配光される配光領域A1の外側に位置する。具体的には、反射防止部13の主面被覆部13aの基板12の厚さ方向の高さは、発光部11の基板12の厚さ方向における高さと略同じ高さL1に設定されている。これにより、発光部11から放射された光が、反射防止部13により遮られることがないので、発光部11から放射される光の損失を低減できる。 As described above, in the display device 1 according to the present embodiment, the anti-reflection unit 13 is located outside the light distribution area A1 in which the light emitted from the light emitting unit 11 is distributed. Specifically, the height in the thickness direction of the substrate 12 of the main surface covering portion 13 a of the anti-reflection portion 13 is set to the height L 1 substantially the same as the height in the thickness direction of the substrate 12 of the light emitting portion 11 . As a result, the light emitted from the light emitting unit 11 is not blocked by the anti-reflection unit 13, so the loss of light emitted from the light emitting unit 11 can be reduced.
また、本実施の形態に係る表示装置1の製造方法では、発光部11の発光面11aと、基板12の主面12aに対向配置される金型51との間に、弾性材料から形成された緩衝材53を介在させる。これにより、発光部11の発光面11aの基板12の主面12aからの高さにバラツキが存在しても、緩衝材53が弾性変形することにより発光部11の発光面11aと金型51との間に空隙が発生するのを防止できるので、発光部11の発光面11aが反射防止部13により覆われるのを防止できる。 Further, in the method of manufacturing the display device 1 according to the present embodiment, the elastic material is formed between the light emitting surface 11 a of the light emitting unit 11 and the mold 51 disposed opposite to the major surface 12 a of the substrate 12. A buffer 53 is interposed. As a result, even if the height of the light emitting surface 11a of the light emitting portion 11 from the main surface 12a of the substrate 12 varies, the buffer material 53 elastically deforms to thereby cause the light emitting surface 11a of the light emitting portion 11 and the metal mold 51 Since it can prevent that a space | gap generate | occur | produces between, it can prevent that the light emission surface 11a of the light emission part 11 is covered by the reflection prevention part 13. FIG.
(実施の形態2)
実施の形態1では、反射防止部13の各発光部11の外周部が平坦である表示装置1について説明した。但し、反射防止部の形状は、発光部11から放射される光を遮らない形状であれば、実施の形態1で説明した形状に限定されない。本実施の形態に係る表示装置のように、反射防止部が、その隣り合う発光部11の間に窪み部が設けられた形状を有するものであってもよい。
Second Embodiment
In the first embodiment, the display device 1 in which the outer peripheral portion of each light emitting unit 11 of the reflection preventing unit 13 is flat has been described. However, the shape of the reflection preventing portion is not limited to the shape described in Embodiment 1 as long as the shape does not block the light emitted from the light emitting portion 11. As in the display device according to the present embodiment, the reflection preventing portion may have a shape in which a recess is provided between the adjacent light emitting portions 11.
図4に示すように、本実施の形態に係る表示装置201は、反射防止部213の形状が、実施の形態1で説明した反射防止部13の主面被覆部13aの各発光部11を囲む部位を取り除いて窪み部を形成したものに相当する。反射防止部213は、図5に示すように、主面被覆部213aと裏面被覆部13bと側方被覆部213cと発光部11の側方を覆う発光部側方被覆部213dとを有する。反射防止部213を形成する材料は実施の形態1と同様である。なお、図4、図5において、実施の形態1と同様の構成については、図1、図2と同一の符号を付している。 As shown in FIG. 4, in the display device 201 according to the present embodiment, the shape of the anti-reflection portion 213 surrounds each light emitting portion 11 of the main surface covering portion 13 a of the anti-reflection portion 13 described in the first embodiment. It corresponds to what removed the part and formed the hollow part. As shown in FIG. 5, the reflection preventing portion 213 has a main surface covering portion 213a, a back surface covering portion 13b, a side covering portion 213c, and a light emitting portion side covering portion 213d which covers the side of the light emitting portion 11. The material forming the reflection preventing portion 213 is the same as that of the first embodiment. In FIGS. 4 and 5, the same components as in the first embodiment are denoted by the same reference numerals as in FIGS.
主面被覆部213aは、基板12の厚さ方向において、基板12の主面12aからの高さL21が発光部11の主面12aからの高さL1よりも低い。この高さL21は、基板12の主面12aに形成された導体パターンの電気的絶縁性が確保できる程度の大きさに設定されている。なお、発光部11のハウジング115が透明である場合、発光部側方被覆部213dの厚さは、ハウジング115を透過してきた光が外部に漏れない程度の厚さに設定される。 In the main surface covering portion 213a, the height L21 from the main surface 12a of the substrate 12 is smaller than the height L1 from the main surface 12a of the light emitting portion 11 in the thickness direction of the substrate 12. The height L21 is set to such a size that the electrical insulation of the conductor pattern formed on the main surface 12a of the substrate 12 can be secured. When the housing 115 of the light emitting unit 11 is transparent, the thickness of the light emitting unit side covering portion 213 d is set to such a thickness that light transmitted through the housing 115 does not leak to the outside.
次に、本実施の形態に係る表示装置201の製造方法について説明する。まず、実施の形態1で説明した製造方法と同様にして、発光部11を基板12に実装する。次に、トランスファー成型法または射出成型法により、反射防止部13を形成する。ここにおいて、図6(A)に示すように、発光部11に対応する位置に窪み部251aが設けられた金型251を用いる点が実施の形態1で説明した製造方法と相違する。そして、発光部11および基板12を、金型251と金型252とで形成される領域S2内に配置する。このとき、発光部11の発光面11aが、金型251の窪み部251aに緩衝材53を介して接するように配置する。ここで、窪み部251aの内壁と発光部11との間には、間隙S21が形成されている。なお、金型251の窪み部251aの大きさは、金型251に発光部11を配置する際のアライメント精度を考慮して設定してもよい。 Next, a method of manufacturing the display device 201 according to the present embodiment will be described. First, the light emitting unit 11 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, the reflection preventing portion 13 is formed by a transfer molding method or an injection molding method. Here, as shown in FIG. 6A, the manufacturing method described in the first embodiment is different in that a mold 251 provided with a depressed portion 251a at a position corresponding to the light emitting portion 11 is used. Then, the light emitting unit 11 and the substrate 12 are disposed in the region S2 formed by the mold 251 and the mold 252. At this time, the light emitting surface 11 a of the light emitting unit 11 is disposed so as to be in contact with the depressed portion 251 a of the mold 251 via the buffer material 53. Here, a gap S <b> 21 is formed between the inner wall of the recess 251 a and the light emitting portion 11. The size of the recess 251 a of the mold 251 may be set in consideration of the alignment accuracy at the time of disposing the light emitting unit 11 in the mold 251.
続いて、図6(B)に示すように、領域S2内に液体状の樹脂材料213eを圧入した後、樹脂材料213eを硬化させる。その後、図6(C)に示すように、金型251、252および緩衝材53を取り除く(図6(C)中の矢印AR11、AR12)。 Subsequently, as shown in FIG. 6B, a liquid resin material 213e is pressed into the region S2, and then the resin material 213e is cured. Thereafter, as shown in FIG. 6C, the molds 251 and 252 and the buffer material 53 are removed (arrows AR11 and AR12 in FIG. 6C).
以上説明したように、本実施の形態に係る表示装置201は、反射防止部213の各発光部11を囲む部位に窪み部が形成されている。これにより、反射防止部213の形成に要する樹脂材料213eの量を、実施の形態1に係る反射防止部13の形成に要する樹脂材料13dの量に比べて少なくすることができる。従って、反射防止部213の軽量化を図ることができるとともに、樹脂材料213eにかかるコストを低減することもできる。 As described above, in the display device 201 according to the present embodiment, the recessed portion is formed in a portion surrounding each light emitting unit 11 of the reflection preventing unit 213. Thereby, the amount of the resin material 213e required for forming the reflection preventing portion 213 can be reduced compared to the amount of the resin material 13d required for forming the reflection preventing portion 13 according to the first embodiment. Therefore, while being able to attain weight reduction of the reflection prevention part 213, the cost concerning the resin material 213e can also be reduced.
(実施の形態3)
ところで、表示装置に入射する外光の強度が大きくなると、実施の形態1や実施の形態2で説明した形状の反射防止部13、213では、外光の反射を十分に防止することができない虞がある。この場合、反射防止部13、213における各発光部11の近傍に螺子等によりルーバを取り付けることが考えられる。ところが、各発光部11の近傍に螺子等によりルーバを取り付ける工程を導入すると作業負担が増大する虞がある。そこで、この実施の形態3に係る表示装置では、反射防止部における発光部11の近傍の一部が、外光を遮る遮光部となっている。この遮光部は、反射防止部の遮光部以外の部位と一体に形成されている。
Third Embodiment
By the way, if the intensity of the external light incident on the display device is increased, there is a possibility that the reflection of the external light can not be sufficiently prevented in the reflection preventing portions 13 and 213 having the shapes described in the first embodiment and the second embodiment. There is. In this case, it is conceivable to attach a louver in the vicinity of each light emitting unit 11 in the reflection preventing units 13 and 213 with a screw or the like. However, if the process of attaching a louver with a screw etc. is introduced in the vicinity of each light emission part 11, there exists a possibility that an operation | work burden may increase. Therefore, in the display device according to the third embodiment, a part of the reflection preventing portion in the vicinity of the light emitting portion 11 is a light blocking portion that blocks external light. The light shielding portion is integrally formed with a portion other than the light shielding portion of the reflection preventing portion.
図7に示すように、本実施の形態に係る表示装置301は、反射防止部313が、図7における+Y方向側から斜めに入射する光を遮るための遮光部313eを備える。この表示装置301は、実施の形態1に係る表示装置1と同様に、図7、図8における−Y方向側が地面側となるように立てた状態で使用される。従って、屋外で使用される場合、表示装置1に対して+Y方向側から斜めに太陽からの外光が入射する。反射防止部313は、遮光部313eの他に、図8に示すように、主面被覆部313aと裏面被覆部13bと側方被覆部213cと発光部側方被覆部313dと減衰部313fとを有する。反射防止部313を形成する材料は実施の形態1と同様である。遮光部313eは、発光部側方被覆部313dにおける図8の+Y方向側の端部に連続している。また、主面被覆部313aにおける隣接する発光部11の間には、隣接する発光部11の間に入射した光を減衰させる減衰部313fが設けられている。なお、図7、図8において、実施の形態2と同様の構成については、図4、図5と同一の符号を付している。 As shown in FIG. 7, in the display device 301 according to the present embodiment, the reflection preventing portion 313 includes a light shielding portion 313 e for shielding light obliquely incident from the + Y direction side in FIG. 7. Like the display device 1 according to the first embodiment, the display device 301 is used in a state where it is erected so that the −Y direction side in FIGS. 7 and 8 is the ground side. Therefore, when used outdoors, external light from the sun is obliquely incident on the display device 1 from the + Y direction side. In addition to the light shielding portion 313e, as shown in FIG. 8, the reflection preventing portion 313 includes a main surface covering portion 313a, a back surface covering portion 13b, a side covering portion 213c, a light emitting portion side covering portion 313d and an attenuation portion 313f. Have. The material forming the reflection preventing portion 313 is the same as that of the first embodiment. The light shielding portion 313e is continuous with the end portion on the + Y direction side in FIG. 8 in the light emitting portion side covering portion 313d. Moreover, between the adjacent light emission parts 11 in the main surface covering part 313a, the attenuation part 313f which attenuates the light which entered between the adjacent light emission parts 11 is provided. In FIGS. 7 and 8, the same components as those in the second embodiment are denoted by the same reference numerals as those in FIGS.
遮光部313eは、発光部11における図8の+Y方向側に隣接して配置され、発光部11の+Y方向側から発光部11の発光面11aに向かって斜めに入射する外光を遮断する。遮光部313eは、+Y方向側から発光面11aに対して入射角θ2よりも大きい角度で入射する光を遮る。また、遮光部313eの基板12の厚さ方向における基板12の主面12aからの高さL33は、図8のY方向における両側に隣接する発光部11から放射される光を遮らない高さに設定されている。ここで、図8のY方向における遮光部313eと隣接する発光部11の光軸J1との間の距離をL31、発光ダイオード111の基板12の主面12aからの高さをL34、発光部11の指向角をθ1とすると、下記式(1)の関係式が成立する。
L33<L32=L31/arctan(θ1)+L34・・・式(1)
The light shielding portion 313e is disposed adjacent to the light emitting portion 11 on the + Y direction side in FIG. 8 and blocks external light obliquely incident on the light emitting surface 11a of the light emitting portion 11 from the + Y direction side of the light emitting portion 11. The light shielding portion 313e blocks light incident from the + Y direction side to the light emitting surface 11a at an angle larger than the incident angle θ2. Further, the height L33 of the light shielding portion 313e from the main surface 12a of the substrate 12 in the thickness direction of the substrate 12 is a height that does not block the light emitted from the light emitting portion 11 adjacent to both sides in the Y direction in FIG. It is set. Here, the distance between the light shielding portion 313e and the optical axis J1 of the light emitting portion 11 in the Y direction in FIG. 8 is L31, the height of the light emitting diode 111 from the main surface 12a of the substrate 12 is L34, and the light emitting portion 11 is Assuming that the directivity angle of the light beam is θ1, the following equation (1) is established.
L33 <L32 = L31 / arctan (θ1) + L34 formula (1)
減衰部313fは、反射防止部313における、隣り合う2つの発光部11の間に対応する部位に設けられ、入射する外光の強度を減衰させる。減衰部313fは、凹凸形状を有し、入射する光を乱反射することにより入射する外光の強度を減衰させる。 The attenuation unit 313 f is provided at a position corresponding to the position between the two adjacent light emitting units 11 in the anti-reflection unit 313, and attenuates the intensity of incident external light. The attenuation portion 313 f has a concavo-convex shape, and attenuates the intensity of incident external light by irregularly reflecting incident light.
以上説明したように、本実施の形態に係る反射防止部313は、発光部11の近傍に配置された遮光部313eを備える。これにより、発光部11の発光面11aへの外光の入射が防止されるので、発光部11の発光面11aの視認性向上を図ることができる。またこの遮光部313eは、反射防止部313の遮光部313e以外の部位と一体に形成されている。これにより、表示装置301の製造工程における作業負担を軽減することができるとともに、ルーバ等を固定するための螺子等が不要となるので、その分、表示装置301を構成する部品の点数の削減を図ることができる。 As described above, the reflection preventing portion 313 according to the present embodiment includes the light shielding portion 313 e disposed in the vicinity of the light emitting portion 11. Thereby, the incident of the external light to the light emitting surface 11 a of the light emitting unit 11 is prevented, so that the visibility of the light emitting surface 11 a of the light emitting unit 11 can be improved. Further, the light shielding portion 313 e is integrally formed with a portion of the reflection preventing portion 313 other than the light shielding portion 313 e. As a result, the work load in the manufacturing process of the display device 301 can be reduced, and a screw or the like for fixing a louver or the like becomes unnecessary, so the number of parts constituting the display device 301 can be reduced accordingly. Can be
また、本実施の形態に係る反射防止部213は、隣接する発光部11の間に設けられた減衰部313fを備える。これにより、表示装置301に入射した光の反射量を低減することができるので、発光部11の発光面11aの視認性向上を図ることができる。 Further, the reflection preventing portion 213 according to the present embodiment includes an attenuation portion 313 f provided between the adjacent light emitting portions 11. As a result, the amount of reflection of light incident on the display device 301 can be reduced, so that the visibility of the light emitting surface 11 a of the light emitting unit 11 can be improved.
(実施の形態4)
実施の形態1では、発光部11の発光面11aが平坦である表示装置1について説明したが、発光部11の発光面11aの形状はこれに限定されるものではない。図9に示すように、この実施の形態4に係る表示装置401では、発光部411の発光面411aが、ハウジング115の一面から外方へドーム状に突出している。なお、図9において、実施の形態3と同様の構成については、図8と同一の符号を付している。封止部4116は、シリコーン樹脂等の弾性のある樹脂材料から形成されている。
Embodiment 4
Although Embodiment 1 demonstrated the display apparatus 1 in which the light emission surface 11a of the light emission part 11 is flat, the shape of the light emission surface 11a of the light emission part 11 is not limited to this. As shown in FIG. 9, in the display device 401 according to the fourth embodiment, the light emitting surface 411 a of the light emitting unit 411 protrudes outward in a dome shape from one surface of the housing 115. In FIG. 9, the same components as in the third embodiment are assigned the same reference numerals as in FIG. The sealing portion 4116 is formed of an elastic resin material such as silicone resin.
次に、本実施の形態に係る表示装置401の製造方法について説明する。まず、実施の形態1で説明した製造方法と同様にして、発光部411を基板12に実装する。次に、トランスファー成型法または射出成型法により、反射防止部313を形成する。具体的には、図10(A)に示すような、発光部411および遮光部313eに対応する位置に窪み部451aが設けられ、減衰部313fに対応する位置に凹凸部451bが設けられた金型451を用いる。そして、発光部411および基板12を、金型451と金型452とで形成される領域S3内に配置する。このとき、発光部411の封止部4116が金型451に圧接するように配置する。これにより、封止部4116は、金型451との接触面に沿って変形し、金型451に密着した状態となり、発光部411の封止部4116と金型451との間に空隙が発生するのを防止できる。従って、樹脂材料が発光部411の発光面411aと金型451との間に発生する空隙に入り込み、発光部411の発光面411aが覆われてしまうのを防止できる。 Next, a method of manufacturing the display device 401 according to the present embodiment will be described. First, the light emitting unit 411 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, the reflection preventing portion 313 is formed by a transfer molding method or an injection molding method. Specifically, as shown in FIG. 10A, gold is provided with a depressed portion 451a at a position corresponding to the light emitting portion 411 and the light shielding portion 313e and an uneven portion 451b provided at a position corresponding to the attenuating portion 313f. The type 451 is used. Then, the light emitting unit 411 and the substrate 12 are disposed in the region S3 formed by the mold 451 and the mold 452. At this time, the sealing portion 4116 of the light emitting portion 411 is disposed in pressure contact with the mold 451. As a result, the sealing portion 4116 is deformed along the contact surface with the mold 451 and is in close contact with the mold 451, and a gap is generated between the sealing portion 4116 of the light emitting portion 411 and the mold 451. You can prevent it. Therefore, it is possible to prevent the resin material from entering the space generated between the light emitting surface 411 a of the light emitting unit 411 and the mold 451 and covering the light emitting surface 411 a of the light emitting unit 411.
続いて、図10(B)に示すように、領域S3内に液体状の樹脂材料313gを圧入した後、樹脂材料313gを硬化させる。その後、金型451、452を取り除く。 Subsequently, as shown in FIG. 10B, after 313 g of liquid resin material is pressed into the region S3, the resin material 313 g is cured. Thereafter, the molds 451 and 452 are removed.
以上説明したように、本実施の形態に係る表示装置401の製造方法では、緩衝材を用いることなく発光部411の封止部4116と金型451との間に空隙が発生するのを防止できる。これにより、緩衝材を金型451と発光部411との間に介挿する手間が省けるので、製造工程の簡素化を図ることができる。また、発光部411の発光面411aが、ハウジング115の一面から外方へドーム状に突出している。これにより、発光部411から放射される光の指向性を高めることができる。 As described above, in the method of manufacturing the display device 401 according to the present embodiment, it is possible to prevent the generation of a space between the sealing portion 4116 of the light emitting portion 411 and the mold 451 without using a buffer material. . As a result, the process of inserting the buffer material between the mold 451 and the light emitting unit 411 can be omitted, so that the manufacturing process can be simplified. In addition, a light emitting surface 411 a of the light emitting unit 411 protrudes outward in a dome shape from one surface of the housing 115. Thus, the directivity of the light emitted from the light emitting unit 411 can be improved.
(実施の形態5)
図11に示すように、実施の形態5に係る反射防止部613は、基板12の裏面12bを覆っていないところに特徴がある。この実施の形態5に係る表示装置601は、反射防止部613が、基板12の主面12a(図12参照)を覆い、基板12の裏面12bを覆っていない。なお、図11および図12において、実施の形態1と同様の構成には図1および図2と同一の符号を付している。また、表示装置601は、樹脂材料から形成され基板12の主面12aにおける発光部11の周囲に設けられた樹脂部616を備える。反射防止部613は、複数の発光部11それぞれを、樹脂部616を介して囲むように配置されている。反射防止部613を形成する材料は実施の形態1と同様である。更に、表示装置601は、一面が開放された扁平な矩形箱状の筐体614と、筐体614における発光部11が配置される側とは反対側に取り付けられたパッキン615と、を備える。この表示装置601は、表示装置601が取り付けられる相手方の筐体等にパッキン615を当接させた状態で取り付けられる。これにより、表示装置601の取り付け部分から筐体等の内部に水等が侵入するのを防止できる。
Fifth Embodiment
As shown in FIG. 11, the reflection preventing portion 613 according to the fifth embodiment is characterized in that it does not cover the back surface 12 b of the substrate 12. In the display device 601 according to the fifth embodiment, the anti-reflection portion 613 covers the main surface 12 a (see FIG. 12) of the substrate 12 and does not cover the back surface 12 b of the substrate 12. In FIGS. 11 and 12, the same components as in the first embodiment are denoted by the same reference numerals as in FIGS. 1 and 2. The display device 601 further includes a resin portion 616 formed of a resin material and provided around the light emitting portion 11 on the major surface 12 a of the substrate 12. The reflection preventing portion 613 is disposed so as to surround each of the plurality of light emitting portions 11 via the resin portion 616. The material forming the reflection preventing portion 613 is the same as that of the first embodiment. Furthermore, the display device 601 includes a flat rectangular box-like housing 614 whose one surface is open, and a packing 615 attached to the side of the housing 614 opposite to the side where the light emitting unit 11 is disposed. The display device 601 is attached in a state where the packing 615 is in contact with the other housing or the like to which the display device 601 is attached. Thus, water or the like can be prevented from entering the inside of a housing or the like from the attachment portion of the display device 601.
筐体614は、図12に示すように、基板12の裏面12b側がその内部空間S6に露出する形で基板12を保持する。反射防止部613は、基板12の主面12aに接着されている。ここで、接着剤としては、例えば変成シリコーン樹脂等を含む耐水性のある接着剤が用いられる。樹脂部616は、例えばシリコーン樹脂から形成されている。基板12は、その裏面12bの周縁部が筐体614の側壁614aに設けられた段部614bに当接した状態で筐体614に固定されている。筐体614は、金属材料から形成されている。そして、基板12の周縁部における筐体614と接触する部位と導体パターンとの間の最短沿面距離が、電気的絶縁性が維持できる程度の長さに設定されている。また、基板12の裏面12bは、筐体614の内部空間S6に露出している。 The housing 614 holds the substrate 12 such that the back surface 12b side of the substrate 12 is exposed to the internal space S6, as shown in FIG. The reflection preventing portion 613 is bonded to the major surface 12 a of the substrate 12. Here, as the adhesive, for example, a water resistant adhesive containing a modified silicone resin or the like is used. The resin portion 616 is formed of, for example, a silicone resin. The substrate 12 is fixed to the housing 614 in a state where the peripheral edge portion of the back surface 12 b is in contact with the step portion 614 b provided on the side wall 614 a of the housing 614. The housing 614 is formed of a metal material. The shortest creepage distance between the conductor pattern and the portion in contact with the housing 614 in the peripheral portion of the substrate 12 is set to such a length that electrical insulation can be maintained. The back surface 12 b of the substrate 12 is exposed to the internal space S 6 of the housing 614.
次に、本実施の形態に係る表示装置601の製造方法について説明する。まず、実施の形態1で説明した製造方法と同様にして、発光部11を基板12に実装する。次に、接着剤を用いて基板12上に反射防止部613を接着する。 Next, a method of manufacturing the display device 601 according to the present embodiment will be described. First, the light emitting unit 11 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, the reflection preventing portion 613 is adhered onto the substrate 12 using an adhesive.
続いて、基板12上における反射防止部613と発光部11との間に、液体状の樹脂材料を流し込む。その後、樹脂材料を硬化させることにより基板12、発光部11、反射防止部613および樹脂部616からなるモジュールが完成する。次に、完成したモジュールとパッキン615とを筐体614に取り付けると、表示装置601が完成する。 Subsequently, a liquid resin material is poured between the reflection preventing portion 613 and the light emitting portion 11 on the substrate 12. Thereafter, the resin material is cured to complete a module including the substrate 12, the light emitting unit 11, the reflection preventing unit 613, and the resin unit 616. Next, when the completed module and the packing 615 are attached to the housing 614, the display device 601 is completed.
以上説明したように、本実施の形態に係る表示装置601によれば、基板12の裏面12bは、筐体614の内部空間S6に露出している。これにより、例えば筐体614の内部空間S6に空冷ファン(図示せず)等を配置すれば、基板12の裏面12bを空冷ファンから流出する冷気に直接接触させることができる。従って、例えば実施の形態1に係る表示装置1のように基板12の裏面12bが反射防止部13で覆われている構成に比べて基板12を効率良く冷却することができる。 As described above, according to the display device 601 according to the present embodiment, the back surface 12 b of the substrate 12 is exposed to the internal space S 6 of the housing 614. Thus, for example, if an air cooling fan (not shown) or the like is disposed in the internal space S6 of the housing 614, the back surface 12b of the substrate 12 can be brought into direct contact with cold air flowing out of the air cooling fan. Therefore, for example, as compared with the configuration in which the back surface 12 b of the substrate 12 is covered with the anti-reflection portion 13 as in the display device 1 according to the first embodiment, the substrate 12 can be cooled efficiently.
(実施の形態6)
前述の各実施の形態では、発光装置単体について説明した。但し、これらの発光装置を複数個、二次元に配列することにより、いわゆる大画面化したものであってもよい。このような構成としては、例えば図13に示すように、実施の形態1で説明した表示装置1を2×2の二次元格子状に配列した表示ユニット1000が挙げられる。
Sixth Embodiment
In each of the embodiments described above, the light emitting device alone has been described. However, a so-called large screen may be obtained by arranging a plurality of these light emitting devices in two dimensions. As such a configuration, for example, as shown in FIG. 13, a display unit 1000 in which the display device 1 described in the first embodiment is arranged in a 2 × 2 two-dimensional grid shape can be mentioned.
(変形例)
以上、本発明の実施の形態について説明したが、本発明は実施の形態によって限定されるものではない。例えば、実施の形態1で説明した表示装置1の製造方法において、緩衝材53を用いない方法を採用してもよい。この場合、発光部11の発光面11aと金型51との間に生じうる空隙の大きさに応じて、樹脂材料13dの粘度を適宜設定すればよい。樹脂材料13dの粘度をこのように設定することにより、樹脂材料13dが、発光部11の発光面11aと金型51との間に生じる空隙に侵入するのを防止でき、発光部11の発光面11aが樹脂材料13dで覆われるのを防止できる。
(Modification)
As mentioned above, although embodiment of this invention was described, this invention is not limited by embodiment. For example, in the method of manufacturing the display device 1 described in the first embodiment, a method not using the buffer material 53 may be employed. In this case, the viscosity of the resin material 13d may be appropriately set in accordance with the size of the void that may occur between the light emitting surface 11a of the light emitting unit 11 and the mold 51. By setting the viscosity of the resin material 13 d in this manner, it is possible to prevent the resin material 13 d from intruding into the space generated between the light emitting surface 11 a of the light emitting unit 11 and the mold 51. It can prevent that 11a is covered with the resin material 13d.
本構成によれば、緩衝材を金型と発光部との間に介挿する手間が省けるので、製造工程の簡素化を図ることができる。 According to this configuration, it is possible to save time and labor for interposing the buffer material between the mold and the light emitting portion, so that the manufacturing process can be simplified.
前述の各実施の形態では、反射防止部が非透光性の樹脂材料から形成されている例について説明したが、これに限定されず、例えば反射防止部が、その表面につや消し処理が施された透光性材料から形成されていてもよい。この場合、発光部11の発光面11aが反射防止部で覆われていてもよい。また、発光部11のハウジング115および基板12を黒色にすることで、表示装置の発光部11側の黒輝度を低下させてもよい。 In each of the embodiments described above, although the example in which the anti-reflection portion is formed of a non-light-transmitting resin material has been described, the present invention is not limited thereto. For example, the anti-reflection portion is subjected to a matting treatment on its surface It may be formed of a transparent material. In this case, the light emitting surface 11 a of the light emitting unit 11 may be covered by the reflection preventing unit. In addition, the black luminance of the light emitting unit 11 side of the display device may be reduced by making the housing 115 and the substrate 12 of the light emitting unit 11 black.
図14に、発光面11aが、その表面につや消し処理が施された透明または半透明な部材で覆われている変形例に係る表示装置501を示す。なお、図14において実施の形態2と同様の構成は図5と同一の符号を付している。反射防止部513は、発光部11の側方と発光部11の発光面11aとを覆う発光部側方被覆部513dを有する。つや消し処理には、例えばブラスト処理等が採用される。反射防止部513が、その表面につや消し処理が施された透明または半透明な材料から形成されていることにより、反射防止部513の表面で外光の反射が低減される。 FIG. 14 shows a display device 501 according to a modification in which the light emitting surface 11a is covered with a transparent or translucent member whose surface has been subjected to a matting treatment. The same reference numerals as in FIG. 5 denote the same parts in FIG. 14 as in the second embodiment. The reflection preventing portion 513 includes a light emitting portion side covering portion 513 d which covers the side of the light emitting portion 11 and the light emitting surface 11 a of the light emitting portion 11. For example, a blasting process or the like is adopted as the matting process. The reflection preventing portion 513 is formed of a transparent or semi-transparent material whose surface has been subjected to a matting treatment, whereby the reflection of external light is reduced on the surface of the reflection preventing portion 513.
本構成によれば、発光部11の発光面11aが発光部側方被覆部513dで覆われているので、発光面11aの摩耗を抑制することができる。 According to this configuration, since the light emitting surface 11 a of the light emitting unit 11 is covered with the light emitting unit side covering 513 d, the wear of the light emitting surface 11 a can be suppressed.
また、実施の形態2で説明した表示装置201の製造方法において緩衝材53を省略することができる。これにより、緩衝材53を金型251と発光部11との間に介挿する手間が省けるので、製造工程の簡素化を図ることができる。 In addition, the buffer material 53 can be omitted in the method of manufacturing the display device 201 described in the second embodiment. As a result, since it is possible to save time and labor for inserting the buffer material 53 between the mold 251 and the light emitting unit 11, the manufacturing process can be simplified.
実施の形態5では、基板12の裏面12b全体が露出した構成について説明したが、これに限らず、例えば反射防止部が、基板の主面から、基板に設けられた貫通孔を介して基板の裏面側に回り込んだ構成であってもよい。 In the fifth embodiment, the configuration in which the entire back surface 12b of the substrate 12 is exposed has been described. However, the present invention is not limited thereto. For example, the anti-reflection portion may extend from the main surface of the substrate through the through hole provided in the substrate. The configuration may be such that it wraps around on the back side.
図15に、基板712の裏面712bが反射防止部713に覆われている変形例を示す。なお、図15において、実施の形態5と同様の構成については、図12と同一の符号を付している。樹脂部616は、基板712の主面12aに設けられている。基板712は、隣接する2つの発光部11の間に基板712の厚さ方向に貫通する貫通孔712cを有する。反射防止部713は、基板712の主面712aを覆う主面被覆部713aと、基板12の裏面12bを覆う裏面被覆部713bとを有する。また、反射防止部713は、主面被覆部713a、基板12の周縁に位置する裏面被覆部713bおよび基板712の側方を覆う側方被覆部713cと、主面被覆部713aと裏面被覆部713bとを結合する結合部713dと、を有する。結合部713dは、基板712の貫通孔712cの内側に位置する。 FIG. 15 shows a modification in which the back surface 712 b of the substrate 712 is covered with the anti-reflection portion 713. In FIG. 15, the same components as in the fifth embodiment are designated by the same reference numerals as in FIG. The resin portion 616 is provided on the main surface 12 a of the substrate 712. The substrate 712 has a through hole 712 c penetrating in the thickness direction of the substrate 712 between two adjacent light emitting units 11. The anti-reflection portion 713 has a main surface covering portion 713 a covering the main surface 712 a of the substrate 712 and a back surface covering portion 713 b covering the rear surface 12 b of the substrate 12. The reflection preventing portion 713 is a main surface covering portion 713a, a back surface covering portion 713b located on the periphery of the substrate 12, and a side covering portion 713c covering the side of the substrate 712, a main surface covering portion 713a and a rear surface covering portion 713b. And a connecting portion 713 d connecting the The coupling portion 713 d is located inside the through hole 712 c of the substrate 712.
ここで、本変形例に係る表示装置701の製造方法について説明する。まず、実施の形態1で説明した製造方法と同様にして、発光部11を基板12に実装する。次に、二色成型法により、反射防止部713と樹脂部616とを形成する。ここでは、図16(A)に示すように、発光部11に対応する位置に窪み部751aが設けられた金型751を、基板712の主面712aから被せる。このとき、発光部11の発光面11aが、金型751の窪み部751aに緩衝材53を介して接するように配置する。そして、金型751と基板712の主面712aとの間に形成された各領域S71内に、樹脂部616の基となる液体状の樹脂材料616aを圧入する。その後、発光部11、基板12、緩衝材53、金型751および樹脂材料616aの全体を加熱して樹脂材料616aを硬化させることにより樹脂部616を形成する。 Here, a method of manufacturing the display device 701 according to the present modification will be described. First, the light emitting unit 11 is mounted on the substrate 12 in the same manner as the manufacturing method described in the first embodiment. Next, a reflection preventing portion 713 and a resin portion 616 are formed by a two-color molding method. Here, as shown in FIG. 16A, a mold 751 provided with a depressed portion 751 a at a position corresponding to the light emitting portion 11 is covered from the main surface 712 a of the substrate 712. At this time, the light emitting surface 11 a of the light emitting unit 11 is disposed so as to be in contact with the depressed portion 751 a of the mold 751 via the buffer material 53. Then, a liquid resin material 616a to be a base of the resin portion 616 is pressed into each of the regions S71 formed between the mold 751 and the main surface 712a of the substrate 712. Then, the resin part 616 is formed by heating the whole of the light emitting part 11, the substrate 12, the buffer material 53, the mold 751, and the resin material 616a to cure the resin material 616a.
続いて、図16(B)に示すように、金型751を取り除く(図16(B)中の矢印AR13参照)。 Subsequently, as shown in FIG. 16B, the mold 751 is removed (see an arrow AR13 in FIG. 16B).
その後、図16(C)に示すように、発光部11、基板12および樹脂部616を、金型752と金型753とで形成される領域S72内に配置する。そして、金型751と基板712の主面712aとの間に形成された各領域S72内に、反射防止部713の基となる液体状の樹脂材料713eを圧入する。このとき、基板712の主面712a側の樹脂材料713eが、基板712の貫通孔712cを通じて基板712の裏面712b側に圧入される。その後、発光部11、基板12、樹脂部616、緩衝材53、金型752、753および樹脂材料713eの全体を加熱して樹脂材料713eを硬化させることにより反射防止部713を形成する。 Thereafter, as shown in FIG. 16C, the light emitting portion 11, the substrate 12, and the resin portion 616 are disposed in the region S72 formed by the mold 752 and the mold 753. Then, a liquid resin material 713e to be a base of the anti-reflection portion 713 is pressed into each region S72 formed between the mold 751 and the main surface 712a of the substrate 712. At this time, the resin material 713 e on the main surface 712 a side of the substrate 712 is press-fit to the back surface 712 b side of the substrate 712 through the through holes 712 c of the substrate 712. Thereafter, the whole of the light emitting portion 11, the substrate 12, the resin portion 616, the buffer material 53, the molds 752, 753, and the resin material 713e is heated to cure the resin material 713e, thereby forming the antireflective portion 713.
次に、金型752、753および緩衝材53を取り除いた後、反射防止部713にパッキン615を取り付けると、表示装置701が完成する。 Next, after removing the molds 752 and 753 and the buffer material 53, the packing 615 is attached to the anti-reflection portion 713, and the display device 701 is completed.
本構成によれば、基板712の裏面712bが反射防止部713に覆われず露出している。これにより、基板712で発生する熱を、基板712の裏面712bの露出部分から外部へ放出することができるので、例えば実施の形態1のように基板12の裏面12b全体が反射防止部13で覆われている構成に比べて、基板712の放熱性向上を図ることができる。 According to this configuration, the back surface 712 b of the substrate 712 is exposed without being covered by the anti-reflection portion 713. Thus, the heat generated at the substrate 712 can be dissipated to the outside from the exposed portion of the back surface 712 b of the substrate 712, so that the entire back surface 12 b of the substrate 12 is covered with the anti-reflection portion 13 as in the first embodiment, for example. The heat dissipation of the substrate 712 can be improved as compared with the configuration described above.
また、前述の図15および図16に示す表示装置701について、パッキン615を省略した構成であってもよい。図17に、パッキン615を省略した構成の変形例に係る表示装置801を示す。なお、図17において、図15に示す構成と同様の構成については図15と同一の符号を付している。表示装置801では、反射防止部813の側方被覆部813cが弾性材料から形成されている点が図16に示す構成と相違する。反射防止部813の側方被覆部813cは、例えばシリコーン樹脂等の弾性のある樹脂材料から形成されている。反射防止部813は、例えば二色成型法により形成される。 In the display device 701 shown in FIG. 15 and FIG. 16 described above, the packing 615 may be omitted. FIG. 17 shows a display device 801 according to a modification of the configuration in which the packing 615 is omitted. In FIG. 17, the same components as those shown in FIG. 15 are designated by the same reference numerals as in FIG. The display device 801 is different from the configuration shown in FIG. 16 in that the side covering portion 813 c of the reflection preventing portion 813 is formed of an elastic material. The side covering portion 813 c of the anti-reflection portion 813 is made of, for example, an elastic resin material such as silicone resin. The reflection preventing portion 813 is formed by, for example, a two-color molding method.
実施の形態5に係る表示装置601の製造方法では、反射防止部613を、基板12の主面12aに接着剤を用いて接着する例について説明したが、これに限定されず、例えば反射防止部613と樹脂部616とを二色成型法により形成してもよい。 In the method of manufacturing the display device 601 according to the fifth embodiment, the example in which the reflection preventing portion 613 is adhered to the main surface 12 a of the substrate 12 using an adhesive has been described, but it is not limited thereto. 613 and the resin portion 616 may be formed by a two-color molding method.
実施の形態1では、基板12がリジッド基板を有するものである例について説明したが、これに限定されず、例えば、基板12がフレキシブル基板やリジッドフレキシブル基板を有するものであってもよい。 In the first embodiment, an example in which the substrate 12 includes a rigid substrate has been described. However, the present invention is not limited to this. For example, the substrate 12 may include a flexible substrate or a rigid flexible substrate.
実施の形態1では、反射防止部13は、シリコーン樹脂やエポキシ樹脂等の熱硬化性樹脂から形成されている例について説明したが、反射防止部13の材料はこれに限定されない。例えば、反射防止部13は、黒色に着色されたアクリル樹脂やポリテトラフルオロエチレン樹脂等の熱可塑性樹脂から形成されてもよい。 In Embodiment 1, although the example in which the reflection preventing portion 13 is formed of a thermosetting resin such as a silicone resin or an epoxy resin has been described, the material of the reflection preventing portion 13 is not limited to this. For example, the antireflective portion 13 may be formed of a thermoplastic resin such as an acrylic resin or a polytetrafluoroethylene resin colored in black.
この場合、表示装置1の製造工程において、金型51、52、発光部11、基板12および緩衝材53全体を樹脂材料13dが液状化する温度にまで熱した状態で、金型51、52の内側に樹脂材料13dを圧入すればよい。そして、金型51、52、発光部11、基板12、緩衝材53および樹脂材料13d全体を常温にまで冷却することにより、樹脂材料13dを硬化させればよい。 In this case, in the manufacturing process of the display device 1, the whole of the molds 51 and 52, the light emitting unit 11, the substrate 12 and the buffer material 53 is heated to a temperature at which the resin material 13 d is liquefied. The resin material 13d may be pressed into the inside. Then, the resin material 13 d may be cured by cooling the whole of the molds 51 and 52, the light emitting unit 11, the substrate 12, the buffer material 53 and the resin material 13 d to normal temperature.
実施の形態6では、表示ユニット1000が実施の形態1で説明した表示装置1から構成される例について説明したが、これに限らず、表示ユニット1000は、前述の他の実施の形態または変形例で説明した表示装置から構成されてもよい。或いは、表示ユニット1000は、これらの表示装置を組み合わせて構成されたものであってもよい。 In the sixth embodiment, an example in which the display unit 1000 is configured from the display device 1 described in the first embodiment has been described. However, the present invention is not limited to this. The display unit 1000 is the other embodiment or modification described above. May be configured from the display device described above. Alternatively, the display unit 1000 may be configured by combining these display devices.
以上、本発明の各実施の形態および変形例(なお書きに記載したものを含む。以下、同様。)について説明したが、本発明はこれらに限定されるものではない。本発明は、実施の形態及び変形例が適宜組み合わされたもの、それに適宜変更が加えられたものを含む。 As mentioned above, although each embodiment and modification of the present invention (including the thing described in the statement. Hereinafter, the same) were explained, the present invention is not limited to these. The present invention includes those in which the embodiments and the modifications are combined as appropriate, and those in which changes are appropriately applied.
本発明は、屋外または屋内で使用される表示装置等に好適に利用することができる。 The present invention can be suitably used for a display device used outdoors or indoors.
1,201,301,401,501,601,701,801 表示装置、11,411 発光部、11a,411a 発光面、12,712 基板、12a,712a 主面、12b,712b 裏面、13,213,313,413,513,613,713,813 反射防止部、13a,213a,313a,713a 主面被覆部、13b,713b 裏面被覆部、13c,213c,713c,813c 側方被覆部、13d,213e,313g,616a,713e 樹脂材料、51,52,251,252,451,452,751,752,753 金型、53 緩衝材、111 発光ダイオード、112 正極端子、113 負極端子、114 ワイヤ、115 ハウジング、116,4116 封止部、213d,313d,513d 発光部側方被覆部、251a,451a,751a 窪み部、313e 遮光部、313f 減衰部、451b 凹凸部、614 筐体、614a 側壁、614b 段部、615 パッキン、616 樹脂部、712c 貫通孔、713d 結合部、1000 表示ユニット、A1 配光領域、J1 光軸、θ1 指向角 1, 201, 301, 401, 501, 601, 701, 801 Display device, 11, 411 light emitting unit, 11a, 411a light emitting surface, 12, 712 substrate, 12a, 712a main surface, 12b, 712b back surface, 13, 213, 313, 413, 513, 613, 713, 813 Anti-reflection portion, 13a, 213a, 313a, 713a Main surface covering portion, 13b, 713b Back surface covering portion, 13c, 213c, 713c, 813c Side covering portion, 13d, 213e, 313 g, 616 a, 713 e resin material, 51, 52, 251, 252, 452, 451, 751, 752, 753 mold, 53 buffer material, 111 light emitting diode, 112 positive terminal, 113 negative terminal, 114 wire, 115 housing, 116, 4116 sealing part, 213d, 313d, 13d light emitting part side covering part, 251a, 451a, 751a recessed part, 313e light shielding part, 313f attenuation part, 451b uneven part, 614 housing, 614a side wall, 614b stepped part, 615 packing, 616 resin part, 712c through hole, 713 d Coupling portion, 1000 display unit, A1 light distribution area, J1 light axis, θ1 directivity angle
Claims (8)
前記複数の発光部が実装された基板と、
前記基板の前記発光部側の主面において前記複数の発光部それぞれの外周部に設けられ前記基板の前記主面へ入射する外光の反射を防止する反射防止部と、
前記基板の前記主面とは反対側の裏面側が内部空間に露出する形で前記基板を保持する筐体と、を備え、
前記基板は、隣接する2つの発光部の間に前記基板の厚さ方向に貫通する貫通孔を有し、
前記反射防止部は、少なくとも前記発光部の前記複数の発光部の光軸に直交する一方向側において、前記複数の発光部から放射された光が配光される配光領域の外側に位置し、前記主面を覆う主面被覆部と、前記裏面を覆う裏面被覆部と、前記貫通孔の内側に位置し前記主面被覆部と前記裏面被覆部とを結合する結合部と、を有するとともに、前記基板における前記裏面の少なくとも一部を覆わない、
表示装置。 A plurality of light emitting units arranged in a matrix;
A substrate on which the plurality of light emitting units are mounted;
A reflection preventing portion provided on an outer peripheral portion of each of the plurality of light emitting portions on the main surface on the light emitting portion side of the substrate and preventing reflection of external light incident on the main surface of the substrate;
And a case for holding the substrate in a form in which the back surface side opposite to the main surface of the substrate is exposed to the internal space ,
The substrate has a through hole penetrating in the thickness direction of the substrate between two adjacent light emitting units,
The reflection preventing unit, the one-way side perpendicular to the optical axis of the plurality of light emitting portions of at least the light emitting portion, located outside the light distribution area where light emitted from the plurality of light emitting portions are light distribution A main surface covering portion covering the main surface, a back surface covering portion covering the back surface, and a coupling portion located inside the through hole and coupling the main surface covering portion and the back surface covering portion; Not covering at least a part of the back surface of the substrate,
Display device.
前記主面を覆い、前記基板の厚さ方向において、前記主面からの高さが前記発光部の前記主面からの高さ以下の主面被覆部と、
前記発光部の側方を覆う発光部側方被覆部と、を有する、
請求項1に記載の表示装置。 The reflection preventing portion is
A main surface covering portion covering the main surface and having a height from the main surface equal to or less than the height from the main surface of the light emitting portion in the thickness direction of the substrate;
And a light emitting portion side covering portion covering the side of the light emitting portion.
The display device according to claim 1.
前記発光部の光軸に直交する前記一方向側とは反対の他方向側に隣接して配置され、前記発光部の前記他方向側から前記発光部の発光面に向かって入射する外光を遮断する遮光部を有する、
請求項1または請求項2に記載の表示装置。 The reflection preventing portion is
The external light is disposed adjacent to the other direction side opposite to the one direction orthogonal to the optical axis of the light emitting portion, and external light incident toward the light emitting surface of the light emitting portion from the other direction side of the light emitting portion Have a light shield to shut off
The display device according to claim 1 or 2.
隣り合う2つの発光部の間に対応する部位に設けられ、入射する外光の強度を減衰させる減衰部を有する、
請求項1から3のいずれか1項に記載の表示装置。 The reflection preventing portion is
It has an attenuation part which is provided at a corresponding part between two adjacent light emitting parts and which attenuates the intensity of incident external light,
The display device according to any one of claims 1 to 3.
発光ダイオードと、
一面が開放された箱状であり、内側に前記発光ダイオードが配置されるハウジングと、
弾性材料から形成され、少なくとも前記ハウジングの内側を満たすとともに、前記発光ダイオードを封止する封止部と、を有し、
発光面が、前記ハウジングの前記一面から外方へドーム状に突出している、
請求項1から4のいずれか1項に記載の表示装置。 The light emitting unit is
A light emitting diode,
A housing that is open on one side and in which the light emitting diode is disposed inside;
And a sealing portion formed of an elastic material and filling at least the inside of the housing and sealing the light emitting diode.
The light emitting surface protrudes outward in a dome shape from the one surface of the housing,
The display device according to any one of claims 1 to 4.
請求項1から5のいずれか1項に記載の表示装置。 The reflection preventing portion is formed of a resin material.
The display device according to any one of claims 1 to 5 .
請求項1から6のいずれか1項に記載の表示装置。 The reflection preventing portion is formed of a translucent material.
The display apparatus of any one of Claim 1 to 6 .
表示ユニット。 A plurality of display devices according to any one of claims 1 to 7 ,
Display unit.
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| WO2019074278A1 (en) * | 2017-10-12 | 2019-04-18 | 주식회사 루멘스 | Led module assembly for display |
| JP6411685B1 (en) * | 2017-10-12 | 2018-10-24 | ルーメンス カンパニー リミテッド | LED module assembly for display |
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| JP2002223005A (en) * | 2001-01-26 | 2002-08-09 | Toyoda Gosei Co Ltd | Light emitting diode and display device |
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| JP5092866B2 (en) * | 2008-04-18 | 2012-12-05 | 日亜化学工業株式会社 | Display unit and manufacturing method thereof |
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