JP6643910B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device.

  A COB (Chip On Board) light emitting device in which a light emitting element such as an LED (light emitting diode) element is mounted on a general-purpose substrate such as a ceramic substrate or a metal substrate is known. In such a light emitting device, an LED element that emits blue light, for example, is sealed with a resin containing a fluorescent substance, and light obtained by exciting the fluorescent substance with light from the LED element is mixed. Obtain white light and so on.

  Patent Document 1 describes a COB structure planar light emitting device that irradiates light arranged in two or more colors and arranges light emitting elements at a boundary between two colors with no space therebetween to effectively emit light. ing. The light emitting device includes a substrate, light emitting elements arranged in a mounting area on the substrate, a frame formed around the mounting area on the substrate, and sealing the light emitting element by filling the inside of the frame. And a sealing member that transmits the light emitted by the light-emitting element. In a plan view, the irradiation area surrounded by the frame is divided into a first irradiation area in the center and a second irradiation area surrounding the center. Irradiate in luminescent color. The light emitting device further includes a light-transmitting wall that separates the second irradiation region from the first irradiation region in order to separate the second sealing member of the second irradiation region containing the phosphor. Since the light-transmitting wall transmits light emitted by the embedded light-emitting element, the light is evenly irradiated near the boundary with the second irradiation area.

JP 2013-051375 A

  In the light-emitting device of Patent Document 1, some light-emitting elements are also arranged below a light-transmitting wall that separates a first irradiation region and a second irradiation region. Therefore, unless phosphor is mixed into the light-transmitting wall as well as the sealing member for sealing the light-emitting element, only the light-emitting element disposed below the light-transmitting wall is not covered by the phosphor, and Is emitted, so that color unevenness may occur in the portion of the light transmitting wall. Further, in the light emitting device of Patent Document 1, although the irradiation area is doubled, since all the light emitting elements are turned on at the same time, the toning cannot be performed.

  In order to realize a light-emitting device capable of toning, it is conceivable to provide a plurality of light-emitting units which can be driven independently and emit light of different colors in one light-emitting device. Then, by adjusting the drive current of each light emitting unit and mixing the light emitted from each light emitting unit, it is possible to emit an intermediate color between them. However, in such a light emitting device, the color mixing of the light emitted from each light emitting unit is not always sufficient, and color unevenness may occur because a boundary line between the light emitting units is conspicuous.

  Therefore, an object of the present invention is to provide a light emitting device in which the color mixing of emitted light from a plurality of light emitting units that can be driven independently is improved.

  A substrate having a central region and an outer peripheral region having a height lower than the central region and surrounding the central region on an upper surface side; a plurality of first light emitting elements mounted on the central region of the substrate; and a plurality of first light emitting elements A first set of electrode terminals electrically connected to the first region, a first translucent sealing frame disposed along the edge of the central region and surrounding the central region, and a first sealing frame. A first sealing resin that fills a space in the surrounded central region and integrally seals the plurality of first light emitting elements; and a plurality of second light emitting elements mounted on an outer peripheral area of the substrate. A second set of electrode terminals electrically connected to the plurality of second light emitting elements, and a first sealing frame disposed along an edge of the outer peripheral region so as to surround the central region and the outer peripheral region. And a first sealing frame and a second sealing frame. Emitting device is provided, characterized in that it comprises a second sealing resin for sealing integrally filled in the space on the outer peripheral region a plurality of second light emitting elements.

  In the above light emitting device, the first encapsulating resin contains a phosphor excited by light from the plurality of first light emitting elements, and the second encapsulating resin includes a phosphor from the plurality of second light emitting elements. It is preferable that the first sealing resin has the same thickness as that of the first sealing resin.

The above light emitting device is disposed along the edge of the central region so as to contact the outer peripheral side of the first sealing frame and surround the first sealing frame, and the height of the upper end is equal to the second sealing frame. It is preferable to further include a reflective third sealing frame that is the same as the frame.
In the above-described light emitting device, it is preferable that the inner peripheral side of the third sealing frame is embedded in the first sealing frame.

In the above light emitting device, the substrate is composed of a metal mounting substrate and an insulating circuit substrate having an outer peripheral opening surrounding the central portion and fixed to the upper surface of the mounting substrate, and the central region is a circuit substrate. And the outer peripheral region is preferably the upper surface of the mounting board exposed in the outer peripheral opening.
Alternatively, in the light emitting device described above, the substrate is a metal mounting substrate having a step in which the central portion is raised by one step, the central region is the upper surface of the mounting substrate above the step, and the outer peripheral region is The lower surface is preferably the upper surface of the mounting board.

  In the above light emitting device, the first white light is emitted through the first sealing resin when the plurality of first light emitting elements emit light, and the second white light is emitted through the plurality of second light emitting elements. It is preferable that the second white light having a color temperature different from that of the first white light is emitted through the sealing resin.

  According to the above light emitting device, the color mixing of the emitted light from the plurality of light emitting units that can be driven independently is improved.

FIG. 3 is a perspective view and a sectional view of the light emitting device 1. FIG. 3 is a perspective view and an end view of the mounting board 10 and the circuit board 20. It is the top view and sectional drawing which show the example of arrangement of LED element 31,32. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 1. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 1. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 1. It is the perspective view and sectional drawing of another light emitting device 2. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 2. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 2. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 2. It is the perspective view and sectional drawing of another light emitting device 3. FIG. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 3. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 3. It is the perspective view and end view for explaining the example of the manufacturing process of light emitting device 3. FIG. 9 is a cross-sectional view of still another light emitting device 4. It is sectional drawing of another light emitting device 5.

  Hereinafter, the light emitting device will be described with reference to the drawings. However, it should be understood that the invention is not limited to the drawings or the embodiments described below.

  FIGS. 1A and 1B are a perspective view and a cross-sectional view of the light emitting device 1. FIG. 1A is a perspective view of a light emitting device 1 as a finished product, and FIG. 1B is a cross-sectional view of the light emitting device 1 along line IB-IB in FIG. 1A. The light emitting device 1 includes an LED element as a light emitting element, and is used as an LED light source device such as a floodlight, a high ceiling illumination, a studio illumination, and an illumination. The light emitting device 1 includes, as main components, a mounting board 10, a circuit board 20, LED elements 31, 32, a central sealing frame 41, an outer peripheral sealing frame 42, and sealing resins 51, 52.

  In the light emitting device 1, a portion covered by the sealing resins 51 and 52 corresponds to a light emitting portion. The light emitting portion is divided into a circular shape and a donut shape by a central sealing frame 41. Electrode terminals 220 and 230 are provided corresponding to the central light emitting unit, and electrode terminals 270 and 280 are provided corresponding to the outer light emitting unit. The two divided light emitting units (two light emitting units) are mutually connected. Can be turned on independently. The two light emitting units emit white light having different color temperatures, for example, the center light emitting unit emits 5000K white light, and the outer light emitting unit emits 3000K white light. Designed for In the light emitting device 1, by adjusting the current flowing through the electrode terminals 220, 230 and the electrode terminals 270, 280, light of 5000K, 3000K and their intermediate colors can be obtained. That is, the light emitting device 1 is a COB light emitting device that realizes a white light toning function by providing two sets of electrode terminals by integrating two LED light emitting modules into one.

  2A to 2C are a perspective view and an end view of the mounting board 10 and the circuit board 20, respectively. FIG. 2A is an exploded perspective view of the mounting board 10 and the circuit board 20, and FIG. 2B is a perspective view of a state where the mounting board 10 and the circuit board 20 are bonded to each other. FIG. 3 is an end view of the mounting board 10 and the circuit board 20 along the line IIC-IIC in FIG. The substrate of the light emitting device 1 includes a mounting substrate 10 and a circuit substrate 20.

  The mounting substrate 10 has a square shape as an example, and is a metal substrate on which the LED elements 32 are mounted. The mounting substrate 10 also functions as a heat radiation substrate for radiating heat generated by the LED elements 31 and 32 and the particles of the phosphor described below, and is therefore made of, for example, aluminum having excellent heat resistance and heat radiation. However, the material of the mounting board 10 may be another metal such as copper as long as it is excellent in heat resistance and heat dissipation.

  The circuit board 20 is an insulating board such as a glass epoxy board, for example, and has a square shape having the same size as the mounting board 10 as an example. The circuit board 20 has four outer peripheral openings 26A to 26D formed so as to form a circular central region 21 on the upper surface of the central portion. The outer peripheral openings 26A to 26D have a substantially annular shape surrounding the central region 21 as a whole. The lower surface of the circuit board 20 is attached and fixed to the upper surface of the mounting board 10 by, for example, an adhesive sheet.

  The upper surfaces of the mounting substrate 10 exposed in the outer peripheral openings 26A to 26D are hereinafter referred to as “outer peripheral regions 16A to 16D”, respectively. The outer peripheral regions 16A to 16D are lower than the central region 21 by the thickness of the circuit board 20 (the height of the wall portion 29), and are arranged so as to surround the central region 21.

  The LED element 31 is an example of a first light emitting element, and is mounted on the central area 21 of the circuit board 20. The LED element 32 is an example of a second light emitting element, and is mounted on the outer peripheral regions 16A to 16D of the mounting substrate 10 exposed in the outer peripheral openings 26A to 26D. In the light emitting device 1, a plurality of LED elements 32 are mounted in each of the outer peripheral openings 26A to 26D. Each of the LED elements 31 and 32 is, for example, a blue LED that emits blue light having an emission wavelength band of about 450 to 460 nm. The lower surface of each of the LED elements 31 and 32 is directly fixed to the upper surface of the mounting board 10 or the circuit board 20 by, for example, a transparent insulating adhesive.

  On the upper surface of the circuit board 20, wiring patterns 22, 23, electrode terminals 220, 230, wiring patterns 27, 28, and electrode terminals 270, 280 are formed. The electrode terminal 220 and the electrode terminal 270 are arranged near one corner of the circuit board 20. On the other hand, the electrode terminal 230 and the electrode terminal 280 are arranged near a corner located diagonally to the corner where the electrode terminal 220 and the electrode terminal 270 are arranged.

  The wiring pattern 22 passes through the edge of the central region 21 over a half circumference so as to surround the central region 21, passes over the connection region 221 which is a wall between the outer peripheral opening 26 </ b> A and the outer peripheral opening 26 </ b> D, and Connected to terminal 220. The wiring pattern 23 has a point-symmetrical shape with respect to the wiring pattern 22, and passes through the edge of the central region 21 over a half circumference on the opposite side to the wiring pattern 22 with the center of the central region 21 interposed therebetween. It is connected to the electrode terminal 230 over the connection region 231 which is the wall between the outer peripheral opening 26C.

  The wiring pattern 27 extends along the outer peripheral edges of the outer peripheral openings 26A and 26B and the connection region 271 which is a wall between the outer peripheral openings 26A and 26B, and is connected to the electrode terminals 270. ing. The wiring pattern 28 has a point-symmetrical shape with respect to the wiring pattern 27, and is an outer peripheral edge of the outer peripheral openings 26C and 26D and a connection between the outer peripheral opening 26C and the outer peripheral opening 26D. It extends along the region 281 and is connected to the electrode terminal 280.

  The electrode terminals 220 and 230 are an example of a first set of electrode terminals, and are electrically connected to the LED element 31 via wiring patterns 22 and 23, respectively. One of the electrode terminals 220 and 230 is an anode electrode, and the other is a cathode electrode. When these are connected to an external power supply and a voltage is applied, the LED element 31 emits light. The electrode terminals 270 and 280 are an example of a second set of electrode terminals, and are electrically connected to the LED element 32 via the wiring patterns 27 and 28, respectively. One of the electrode terminals 270 and 280 serves as an anode electrode, and the other serves as a cathode electrode. When these are connected to an external power supply and a voltage is applied, the LED element 32 emits light.

  FIGS. 3A and 3B are a plan view and a cross-sectional view showing an example of the arrangement of the LED elements 31 and 32. FIG. FIG. 3A is a plan view of the light emitting device 1 from which the central sealing frame 41, the outer peripheral sealing frame 42, and the sealing resins 51 and 52 have been removed, and FIG. FIG. 3 is an enlarged sectional view of a part indicated by reference numeral IIIB.

  The number of the LED elements 31 and 32 included in the light emitting device 1 may be any number, and is appropriately determined according to the application. Although only a small number of the LED elements 31 and 32 are shown in FIG. 1B and FIG. 4A and the subsequent drawings for simplicity, in practice, as shown in FIG. May have a larger number of elements.

  The LED elements 31 and 32 have a pair of element electrodes on the upper surface. As shown in FIG. 3A, the element electrodes of the adjacent LED elements 31 and 32 are bonded wires (hereinafter simply referred to as wires) 33 and 34. Are electrically connected to each other. More specifically, the 15 LED elements 31 arranged in the central region 21 are connected in series by 15 wires 33, and these 15 LED elements 31 constitute one group. The wires 33 protruding from the LED elements 31 at both ends of each group are connected to the wiring pattern 22 or the wiring pattern 23. In the light emitting device 1, the LED elements 31 of the eleven groups are connected to the wiring pattern 22 and the wiring pattern 23. Are connected in parallel. When the forward voltage of the LED elements 31 is set to Vfw1, by applying a voltage of 15 × Vfw1 or more between the electrode terminals 220 and 230, all the LED elements 31 are turned on.

  The 24 LED elements 32 arranged in the outer peripheral openings 26A to 26D are connected in series by wires 34, and the 24 LED elements 32 constitute one group. The wires 34 coming out of the LED elements 32 at both ends of each group are connected to the wiring pattern 27 or the wiring pattern 28 on the connection region 271 or the connection region 281, and in the light emitting device 1, 16 groups of LED elements 32 are connected in parallel between the wiring pattern 27 and the wiring pattern 28. When the forward voltage of the LED elements 32 is set to Vfw2, by applying a voltage of 24 × Vfw1 or more between the electrode terminals 270 and 280, all the LED elements 32 are turned on.

  The LED element 32 arranged in the outer peripheral opening 26A and the LED element 32 arranged in the outer peripheral opening 26D are connected to each other across the connection region 221. As shown in FIG. 3B, in this portion, the wire 34 has a substantially trapezoidal shape excluding the bottom side and straddles the connection region 221 and the wiring pattern 22 thereon. Further, in the connection region 221, a resist resin 60 is applied on the wiring pattern 22 so that a short circuit does not occur between the wiring pattern 22 and the wire. The sealing resin 52 is filled so as to cover the LED elements 32, the wires 34, and the resist resin 60.

  In addition, the LED element 32 arranged in the outer peripheral opening 26B and the LED element 32 arranged in the outer peripheral opening 26C are connected to each other across the connection region 231. The cross section of this portion is similar to that shown in FIG.

  The central sealing frame 41 is an example of a first sealing frame, and is a dam material for preventing the sealing resin 51 from flowing out. The central sealing frame 41 is a circular frame formed according to the size of the central region 21, and is arranged along the edge of the central region 21 so as to surround the central region 21. The center sealing frame 41 is fixed on the upper surface of the circuit board 20 at a position overlapping with the wiring patterns 22 and 23. The central sealing frame 41 is made of, for example, a transparent silicone resin so as to enhance the color mixing of the light emitted from the LED element 31 and the light emitted from the LED element 32, and has a light transmitting property. Note that a scattering material may be mixed in the center sealing frame 41.

  The outer peripheral sealing frame 42 is an example of a second sealing frame, and is a dam material for preventing the sealing resin 52 from flowing out. The outer peripheral sealing frame 42 is a circular frame formed according to the size of the outer circumference of the outer peripheral openings 26A to 26D, and is formed so as to surround the central region 21 and the outer regions 16A to 16D. It is arranged along the edges of 16A to 16D. The outer peripheral sealing frame 42 is fixed on the upper surface of the circuit board 20 at a position overlapping the wiring patterns 27 and 28. The outer peripheral sealing frame 42 is made of, for example, an opaque silicone resin mixed with white particles, and has reflectivity. Thereby, the outer peripheral sealing frame 42 directs the light emitted from the LED elements 31 and 32 to the upper side of the light emitting device 1 on the opposite side to the mounting substrate 10 when viewed from the LED elements 31 and 32. Reflect.

  The central sealing frame 41 and the outer peripheral sealing frame 42 are both arranged concentrically on the upper surface of the circuit board 20. The heights of the lower ends of the central sealing frame 41 and the outer peripheral sealing frame 42 are the same, but the central sealing frame 41 is taller than the outer peripheral sealing frame 42. In other words, the position (height) of the upper end of the outer peripheral sealing frame 42 is lower than that of the central sealing frame 41.

  The sealing resin 51 is an example of a first sealing resin, and is filled in a space above the central region 21 surrounded by the central sealing frame 41 to integrally seal (protect) the plurality of LED elements 31. I do. For example, the sealing resin 51 is a colorless and transparent resin such as an epoxy resin or a silicone resin. The sealing resin 51 is hardened into a disk shape in the example shown in FIG.

  The sealing resin 52 is an example of a second sealing resin, and is a space on the outer peripheral regions 16A to 16D and the connection regions 221, 231, 271 and 281 surrounded by the central sealing frame 41 and the outer peripheral sealing frame 42. To integrally seal (protect) the plurality of LED elements 32. For example, the sealing resin 52 is a colorless and transparent resin such as an epoxy resin or a silicone resin. The material of the sealing resin 52 may be the same as or different from the sealing resin 51. In the example shown in FIG. 1A, the sealing resin 52 is cured in an annular shape, and is fixed by, for example, the central sealing frame 41 and the outer peripheral sealing frame 42. Although the height of the upper surface of the sealing resin 52 is lower than that of the sealing resin 51, the sealing resin 52 has the same thickness as the sealing resin 51.

The sealing resin 51 contains a phosphor excited by light from the LED element 31, and the sealing resin 52 contains a phosphor excited by light from the LED element 32. For example, each of the sealing resins 51 and 52 may contain a yellow phosphor such as YAG (Yttrium Aluminum Garnet), or may contain a plurality of types of phosphors. Plural kinds of phosphors, for _{example, (BaSr) 2 SiO 4:} Eu and a green phosphor such as ^2+, CaAlSiN _3: may be the combination of the red phosphor such as ^{Eu 2+,} or green and red phosphors May be further combined with a yellow phosphor. In this case, through each of the sealing resins 51 and 52, blue light from the LED element 31 or 32, which is a blue LED, and light obtained by exciting the phosphor (yellow light, green light, red light) , Etc.) are emitted.

  In the light emitting device 1, the type of the phosphor, the mixing ratio, or both of them may be changed between the sealing resin 51 and the sealing resin 52. For example, the phosphor of the sealing resin 51 is selected such that white light having a color temperature of 5000K is obtained by mixing light from the LED element 31 with light obtained by exciting the phosphor. . The phosphor of the sealing resin 52 is selected such that white light having a color temperature of 3000 K is obtained by mixing light from the LED element 32 with light obtained by exciting the phosphor. . In this case, in the light emitting device 1, when the LED element 31 emits light, white light of 5000K is emitted as the first white light, and when the LED element 32 emits light, the color temperature of the light is equal to that of the first white light. A 3000K white light is emitted as a different second white light.

  Unlike the light emitting device 1, the upper surface of the sealing resin 51, which is the central light emitting surface, and the upper surface of the sealing resin 52, which is the outer light emitting surface, are covered with the sealing resin 51. It is also conceivable to emit white light having different color temperatures from the central light emitting unit and the outer light emitting unit covered with the sealing resin 52. However, if the light emitting surfaces on the center and the outer peripheral side are at the same height, a part of the luminous flux emitted from the LED element 31 to the side passes through the central sealing frame 41 and then passes through the central sealing frame 42 at the outer peripheral sealing frame 42. Since the light is reflected in the direction (the axis passing through the center of the sealing resin 51 and extending perpendicularly to the circuit board 20), the irradiation angle of the central light emitting portion is reduced. As a result, the color mixing between the light flux of the central light emitting portion and the light flux of the outer light emitting portion is reduced.

  On the other hand, in the light emitting device 1, the central region 21 is located at a position higher by the thickness of the circuit board 20 than the outer peripheral regions 16A to 16D. Is mounted at a higher position. Since the upper end of the central sealing frame 41 is higher than the upper end of the outer peripheral sealing frame 42, the upper surface of the sealing resin 51 is higher than the upper surface of the sealing resin 52. When the central light emitting portion is raised in this manner, the irradiation angle of white light from the central light emitting portion becomes wider than when the bottom is not raised. The color is easily mixed with the 3000K white light emitted from the light emitting unit. Therefore, in the light emitting device 1, the color mixing between the central light emitting portion and the light emitting portion on the outer peripheral side is improved as compared with the case where the central light emitting portion is not raised.

  In the light emitting device 1, the sealing resin 51 and the sealing resin 52 have the same thickness. As described above, when the resin thicknesses of both are the same, for example, when the same phosphor-containing resin is used for the sealing resins 51 and 52, the same light emitting characteristics are obtained in the central light emitting portion and the light emitting portion on the outer peripheral side. Therefore, there is an advantage that the designed color can be easily obtained.

  FIGS. 4A to 6B are a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 1. FIGS. 4B, 5B, and 6B respectively show the IVB-IVB line in FIG. 4A, the VB-VB line in FIG. 5A, and the VIB line in FIG. 6A. 5 shows an end face along the VIB line. With reference to FIGS. 2A to 3B and FIGS. 4A to 6B, a manufacturing process of the light emitting device 1 will be described.

  When the light emitting device 1 is manufactured, first, as shown in FIGS. 2A to 2C, the circuit board 20 having the outer peripheral openings 26A to 26D and the mounting board 10 are overlapped and bonded. Then, as shown in FIGS. 4A and 4B, a plurality of LED elements 31 are mounted on the central region 21 of the circuit board 20 and are exposed in the outer peripheral openings 26A to 26D. The plurality of LED elements 32 are mounted on the ten outer peripheral regions 16A to 16D. Subsequently, as shown in FIGS. 3A and 3B, each LED element 31 is electrically connected to electrode terminals 220 and 230 via a wire 33, and each LED element 32 is connected to a wire 34. Are electrically connected to the electrode terminals 270 and 280 via the.

  Next, as shown in FIGS. 5A and 5B, the outer peripheral sealing frame 42 is fixed on the circuit board 20 along the edges of the outer peripheral regions 16A to 16D. As shown in FIGS. 6A and 6B, a central sealing frame 41 is fixed on the circuit board 20 along the edge of the central region 21. Further, the space above the central region 21 surrounded by the central sealing frame 41 is filled with the sealing resin 51, and the space above the outer peripheral regions 16A to 16D surrounded by the central sealing frame 41 and the outer peripheral sealing frame 42 is sealed. The resin 52 is filled. Thus, the light emitting device 1 shown in FIGS. 1A and 1B is completed.

  7A and 7B are a perspective view and a cross-sectional view of another light emitting device 2. FIG. FIG. 7A is a perspective view of the light emitting device 2 as a finished product, and FIG. 7B is a cross-sectional view of the light emitting device 2 along the line VIIB-VIIB in FIG. 7A. The light emitting device 2 is different from the light emitting device 1 in that the light emitting device 2 has a central sealing frame 43 that is not included in the light emitting device 1. Since the components other than the central sealing frame 43 of the light emitting device 2 are the same as those of the light emitting device 1, the same reference numerals as those of the light emitting device 1 are used for the portions overlapping with the light emitting device 1, and the details thereof will be described. Detailed description is omitted.

  The center sealing frame 43 is an example of a third sealing frame, and is a circular frame formed in accordance with the size of the circumference inside the outer peripheral openings 26A to 26D. The central sealing frame 43 is arranged along the edge of the central region 21 so as to contact the outer peripheral side of the central sealing frame 41 and surround the central sealing frame 41. The center sealing frame 43 is made of, for example, an opaque silicone resin mixed with white particles and has a reflective property, similarly to the outer peripheral sealing frame 42.

  The central sealing frame 43 is arranged concentrically with the central sealing frame 41 and the outer peripheral sealing frame 42 on the upper surface of the circuit board 20. The height of the center sealing frame 43 is the same as that of the outer peripheral sealing frame 42. That is, the position (height) of the lower end of the central sealing frame 43 is the same as the position of the central sealing frame 41 and the outer peripheral sealing frame 42, but the position (height) of the upper end of the central sealing frame 43 is It is lower than the stop frame 41 and is the same as the outer peripheral sealing frame 42. Thus, in the light emitting device 2, the sealing resin 52 is filled up to the height of the upper ends of the outer peripheral sealing frame 42 and the central sealing frame 43.

  Also in the light emitting device 2, the central light emitting portion is raised above the light emitting portion on the outer peripheral side, and the central sealing frame 41 is made of a transparent resin. In the light emitting device 2, there is a central sealing frame 43 made of white resin between the central light emitting unit and the outer peripheral light emitting unit. However, since the central sealing frame 41 is taller than the central sealing frame 43, Above the central sealing frame 43, white light is mixed between the central light emitting portion and the outer light emitting portion. Therefore, in the light emitting device 2 as well, similar to the light emitting device 1, the color mixing between the central light emitting portion and the light emitting portion on the outer peripheral side is improved as compared with the case where the bottom light emitting portion is not raised.

  Further, in the light emitting device 2, since there is a central sealing frame 43 whose upper end is the same as the outer peripheral sealing frame 42, the sealing resin 52 is filled in accordance with the upper ends of the outer peripheral sealing frame 42 and the central sealing frame 43. By doing so, it is easy to make the height of the sealing resin 52 on the outer peripheral side uniform.

  In the light emitting device 2, since the central sealing frame 43 is made of white resin and has reflectivity, for example, light emitted laterally from the LED elements 31 in the central region 21 passes through the central sealing frame 41. Then, the light is reflected upward from the light emitting device 1 by the central sealing frame 43. As a result, in the light emitting device 2, the brightness at the front of the device is improved as compared with the light emitting device 1.

  8A to 10B are a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 2. FIGS. 8B, 9B, and 10B are respectively a VIIIB-VIIIB line of FIG. 8A, an IXB-IXB line of FIG. 9A, and an XB line of FIG. 10A. -Shows the end face along the XB line. With reference to FIGS. 2A to 3B and FIGS. 8A to 10B, a manufacturing process of the light emitting device 2 will be described.

  As in the case of manufacturing the light emitting device 1, first, as shown in FIGS. 8A and 8B, a plurality of LED elements 31 are provided on the central region 21 of the circuit board 20 bonded to the mounting board 10. The plurality of LED elements 32 are mounted on the outer peripheral regions 16A to 16D of the mounting substrate 10. Subsequently, as shown in FIGS. 3A and 3B, each LED element 31 is electrically connected to electrode terminals 220 and 230 via a wire 33, and each LED element 32 is connected to a wire 34. Are electrically connected to the electrode terminals 270 and 280 via the.

  Next, as shown in FIGS. 8A and 8B, the outer peripheral sealing frame 42 is fixed on the circuit board 20 along the edges of the outer regions 16 </ b> A to 16 </ b> D. The central sealing frame 43 is fixed along the portion. Further, as shown in FIGS. 9A and 9B, the central sealing frame 41 is fixed on the central region 21 so as to contact the inner peripheral side of the central sealing frame 43. Further, as shown in FIGS. 10A and 10B, the sealing resin 52 is filled in spaces on the outer peripheral regions 16 </ b> A to 16 </ b> D surrounded by the outer peripheral sealing frame 42 and the central sealing frame 43. . The space above the central region 21 surrounded by the central sealing frame 41 is filled with a sealing resin 51. Thus, the light emitting device 2 shown in FIGS. 7A and 7B is completed.

  FIGS. 11A and 11B are a perspective view and a sectional view of still another light emitting device 3. FIG. 11A is a perspective view of the light emitting device 3 as a finished product, and FIG. 11B is a cross-sectional view of the light emitting device 3 along the line XIB-XIB in FIG. The light-emitting device 3 is different from the light-emitting device 1 in that the light-emitting device 3 has a central sealing frame 41 ′ instead of the central sealing frame 41 of the light-emitting device 1, and has the same central sealing frame 43 as the light-emitting device 2. Since the components other than the central sealing frames 41 ′ and 43 of the light emitting device 3 are the same as those of the light emitting device 1, the same reference numerals as those of the light emitting device 1 are used for the portions overlapping with the light emitting device 1. Detailed description thereof will be omitted.

  In the light emitting device 2, the center sealing frame 41 and the center sealing frame 43 are in contact with each other, but are separate sealing frames. On the other hand, in the light emitting device 3, the central sealing frame 43 is embedded in the central sealing frame 41 ', and is integrated with the central sealing frame 41'. More specifically, as illustrated in FIG. 11B, in the light emitting device 3, about half of the inner peripheral side of the central sealing frame 43 is located at the lower portion of the outer peripheral side of the central sealing frame 41 ′. It is embedded inside 41 '. The central sealing frame 41 ′ is a circular frame formed of, for example, a transparent silicone resin according to the size of the central region 21, similarly to the central sealing frame 41. Differently, the lower part on the outer peripheral side has a recess in which the central sealing frame 43 is fitted over the entire circumference. The center sealing frame 41 'is also an example of the first sealing frame.

  The height relationship and materials of the central sealing frame 41 ′, the outer peripheral sealing frame 42, and the central sealing frame 43 of the light emitting device 3 are the same as those of the light emitting devices 1 and 2, respectively. Also in the light emitting device 3, the sealing resin 52 is filled up to the height of the upper ends of the outer peripheral sealing frame 42 and the central sealing frame 43. Therefore, in the light emitting device 3, as in the light emitting devices 1 and 2, the color mixing property between the central light emitting portion and the light emitting portion on the outer peripheral side is improved, and the height of the sealing resin 52 on the outer peripheral side is made uniform. It becomes easier. Furthermore, in the light emitting device 3, since about half of the inner peripheral side of the central sealing frame 43 overlaps the central sealing frame 41 ', the area of the upper surface of the sealing resin 52 is smaller than that of the light emitting device 2 by that much. As a result, the light emitting portion on the outer peripheral side becomes wider.

  FIGS. 12A to 14B are a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 3. FIGS. 12 (B), 13 (B) and 14 (B) are respectively a line XIIB-XIIB of FIG. 12 (A), a line XIIIB-XIIIB of FIG. 13 (A) and a line XIVB of FIG. 14 (A). -Shows the end face along the XIVB line. With reference to FIGS. 2A to 3B and FIGS. 12A to 14B, a manufacturing process of the light emitting device 3 will be described.

  As in the case of manufacturing the light emitting devices 1 and 2, first, as shown in FIGS. 12A and 12B, a plurality of LED elements are placed on the central region 21 of the circuit board 20 bonded to the mounting board 10. A plurality of LED elements 32 are mounted on the outer peripheral regions 16A to 16D of the mounting board 10. Subsequently, as shown in FIGS. 3A and 3B, each LED element 31 is electrically connected to electrode terminals 220 and 230 via a wire 33, and each LED element 32 is connected to a wire 34. Are electrically connected to the electrode terminals 270 and 280 via the.

  Next, as shown in FIGS. 12A and 12B, the outer peripheral sealing frame 42 is fixed on the circuit board 20 along the edges of the outer regions 16 </ b> A to 16 </ b> D. The central sealing frame 43 is fixed along the portion. In addition, as shown in FIGS. 13A and 13B, the sealing resin 52 is filled in spaces on the outer peripheral regions 16 </ b> A to 16 </ b> D surrounded by the outer peripheral sealing frame 42 and the central sealing frame 43. . Further, as shown in FIGS. 14A and 14B, a central sealing frame 41 ′ having a depression in the lower part on the outer peripheral side over the entire circumference and matching the curved surface of the central sealing frame 43 is provided. It is fixed on the central area 21 so as to mesh with the frame 43. The space above the central region 21 surrounded by the central sealing frame 41 'is filled with the sealing resin 51. Thus, the light emitting device 3 shown in FIGS. 11A and 11B is completed.

  Different from the above description, the central sealing frames 41 ′ and 43 may be formed as one sealing frame from the beginning, arranged on the central region 21, and filled with the sealing resin 51.

  In the light emitting devices 1 to 3 described so far, the LED element 31 is mounted on the central region 21 of the circuit board 20, and the LED element 32 is mounted on the mounting board 10 in the outer peripheral openings 26A to 26D of the circuit board 20. By doing so, the central light emitting portion is raised with respect to the light emitting portion on the outer peripheral side. However, as described below, by providing a step on the mounting substrate itself, the center light emitting portion may be raised with respect to the light emitting portion on the outer peripheral side.

  FIG. 15 and FIG. 16 are cross-sectional views of still other light emitting devices 4 and 5, respectively. The perspective views of the light emitting devices 4 and 5 are the same as those in FIG. 1A, and FIGS. 15 and 16 show the same cross sections as in FIG. 1B for the light emitting devices 4 and 5, respectively. The light-emitting devices 4 and 5 differ from the light-emitting device 1 only in the shape of the mounting substrate and the circuit board, and have the same configuration as the light-emitting device 1 in other respects. The same reference numerals as those described above are used, and their detailed description is omitted.

  As shown in FIG. 15, the mounting substrate 10 ′ of the light emitting device 4 has a step in which the upper surface of the central portion is raised one step, for example, in a disk shape, and has the concave portion 12 on the lower surface of the central portion. The mounting substrate 10 'is formed by recessing a central portion of a metal substrate such as aluminum from the lower surface side. Further, the circuit board 20 ′ of the light emitting device 4 is an insulating substrate having a circular central opening 21 ′ in addition to the outer peripheral openings similar to the outer peripheral openings 26 A to 26 D of the circuit board 20. Reference numeral 29 denotes a part of the circuit board 20 ', which indicates a wall separating the central opening 21' and the outer peripheral opening.

  As shown in FIG. 16, the mounting substrate 10 ″ of the light emitting device 5 also has a step in which the upper surface side of the central portion is one step higher, for example, in a disk shape, like the mounting substrate 10 ′ of the light emitting device 4. The lower surface of the substrate 10 ″ is a flat surface. The mounting substrate 10 ″ is configured by, for example, bonding two substrates made of metal such as aluminum having different sizes. The circuit board 20 ′ of the light emitting device 5 is the same as that of the light emitting device 4.

  In the light emitting devices 4 and 5, the steps of the mounting boards 10 'and 10' 'are fitted in the central opening 21' of the circuit board 20 '. A central region 11 'is exposed in the central opening 21'. Further, an outer peripheral region 16 ', which is the upper surface of the mounting substrates 10' and 10 '' below the step, is exposed in the outer peripheral opening. The LED elements 31 and 32 are mounted on the central area 11 'and the outer peripheral area 16' which are the upper surfaces of the mounting substrates 10 'and 10' ', respectively.

  Also in the light emitting devices 4 and 5, the central light emitting portion is raised above the light emitting portion on the outer peripheral side, and the central sealing frame 41 is made of transparent resin. The color mixing between the central light emitting portion and the light emitting portion on the outer peripheral side is improved as compared with the case where the bottom is not raised. Further, in the light emitting devices 4 and 5, not only the LED element 32 but also the LED element 31 are directly mounted on the upper surfaces of the mounting substrates 10 'and 10' '. Therefore, in the light emitting devices 4 and 5, the heat generated by the LED elements 31 can be efficiently released to the mounting substrates 10 'and 10' ', so that the heat radiation is improved as compared with the light emitting device 1.

  One or both of the LED elements 31 and 32 may be a plurality of types of LED elements such as a blue LED and a green LED, or a blue LED, a green LED and a red LED. For example, one type of blue LED may be used as the LED element 31, and three types of blue LED, green LED and red LED may be used as the LED element 32. In this case, a transparent resin containing a yellow phosphor may be used for the sealing resin 51, and a transparent resin containing no phosphor may be used for the sealing resin 52. When a blue LED, a green LED, and a red LED are used as the LED element 31 or the LED element 32, white light is obtained by blue light, green light, and red light from the LED elements. It does not have to contain a body. Further, for example, when a plurality of types of LED elements are used as the LED elements 31 or 32, a plurality of sets of the electrode terminals 220 and 230 or the electrode terminals 270 and 280 may be provided, and the LED elements may be connected for each type. .

1,2,3,4,5 Light emitting device 10,10 ', 10''Mounting board 11', 21 Central area 16A, 16B, 16C, 16D, 16 'Outer area 20,20' Circuit board 220,230,270 , 280 electrode terminal 26A, 26B, 26C, 26D outer peripheral opening 31, 32 LED element 41, 41 ', 43 central sealing frame 42 outer sealing frame 51, 52 sealing resin

Claims (7)

A substrate having a central region and an outer peripheral region on the upper surface side that is lower in height than the central region and surrounds the central region,
A plurality of first light emitting elements mounted on the central region of the substrate;
A first set of electrode terminals electrically connected to the plurality of first light emitting elements;
A light-transmitting first sealing frame disposed along an edge of the central region and surrounding the central region;
A first sealing resin that fills a space above the central region surrounded by the first sealing frame and integrally seals the plurality of first light emitting elements;
A plurality of second light emitting elements mounted on the outer peripheral region of the substrate;
A second set of electrode terminals electrically connected to the plurality of second light emitting elements;
A reflective second sealing frame disposed along an edge of the outer peripheral region so as to surround the central region and the outer peripheral region, and a position of an upper end lower than the first sealing frame;
A second sealing resin that fills a space on the outer peripheral region surrounded by the first sealing frame and the second sealing frame and integrally seals the plurality of second light emitting elements; ,
A light emitting device comprising: The first sealing resin contains a phosphor excited by light from the plurality of first light emitting elements,
2. The second sealing resin according to claim 1, wherein the second sealing resin contains a phosphor excited by light from the plurality of second light emitting elements, and has the same thickness as the first sealing resin. 3. Light emitting device.   The first sealing frame is arranged along the edge of the central region so as to contact the outer peripheral side of the first sealing frame and surround the first sealing frame, and the height of the upper end is equal to the height of the second sealing frame. 3. The light emitting device according to claim 2, further comprising a reflective third sealing frame that is the same.   The light emitting device according to claim 3, wherein an inner peripheral side of the third sealing frame is embedded in the first sealing frame. The board includes a metal mounting board and an insulating circuit board having an outer peripheral opening surrounding a central portion and fixed to an upper surface of the mounting board,
The central region is an upper surface of the central portion of the circuit board,
The light emitting device according to claim 1, wherein the outer peripheral region is an upper surface of the mounting board that is exposed in the outer peripheral opening. The substrate is a metal mounting substrate having a step in which a central portion is raised one step,
The central region is an upper surface of the mounting board above the step,
The light emitting device according to claim 1, wherein the outer peripheral region is an upper surface of the mounting board below the step. When the plurality of first light emitting elements emit light, first white light is emitted through the first sealing resin,
The second white light having a color temperature different from that of the first white light is emitted through the second sealing resin when the plurality of second light emitting elements emit light, according to claim 1. A light-emitting device according to any one of the preceding claims.

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