[go: up one dir, main page]

JP6760638B2 - Flat surface polishing device - Google Patents

Flat surface polishing device Download PDF

Info

Publication number
JP6760638B2
JP6760638B2 JP2016081116A JP2016081116A JP6760638B2 JP 6760638 B2 JP6760638 B2 JP 6760638B2 JP 2016081116 A JP2016081116 A JP 2016081116A JP 2016081116 A JP2016081116 A JP 2016081116A JP 6760638 B2 JP6760638 B2 JP 6760638B2
Authority
JP
Japan
Prior art keywords
thickness
work
carrier
surface plate
thickness measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016081116A
Other languages
Japanese (ja)
Other versions
JP2017189849A5 (en
JP2017189849A (en
Inventor
井上　裕介
裕介 井上
秀明 吉原
秀明 吉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2016081116A priority Critical patent/JP6760638B2/en
Priority to KR1020170045067A priority patent/KR102315142B1/en
Priority to CN201710228022.7A priority patent/CN107297678A/en
Priority to TW106112056A priority patent/TWI704613B/en
Publication of JP2017189849A publication Critical patent/JP2017189849A/en
Publication of JP2017189849A5 publication Critical patent/JP2017189849A5/ja
Application granted granted Critical
Publication of JP6760638B2 publication Critical patent/JP6760638B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

本発明は、少なくとも一部が透光性を有する材料により形成されるキャリアに保持された半導体ウエーハやガラス基板等の板状のワークを研磨する平面研磨装置に関するものであり、さらに詳しくは、ワーク及びキャリアの厚さを測定して研磨する平面研磨装置に関するものである。 The present invention relates to a flat surface polishing apparatus for polishing a plate-shaped work such as a semiconductor wafer or a glass substrate held by a carrier formed of a material having at least a part of translucency, and more particularly, the work. It also relates to a flat surface polishing device that measures and polishes the thickness of a carrier.

平面研磨装置において、キャリアに保持されたワークの両面を研磨する場合、ワークの厚さとキャリアの厚さとを測定し、該ワークの厚さとキャリアの厚さとの差（ギャップ）が所定の値になった時点で研磨を終了することにより、平坦度の高いワークを得ることができる。
このようにワークの厚さとキャリアの厚さとの差を管理するギャップ管理方式の研磨を行う場合、従来は、ワークの厚さは研磨加工中にレーザー光で測定し、キャリアの厚さは、ワークの研磨が行われていないときに、該キャリアを平面研磨装置から取り出してマイクロメータ等で測定するようにしていた。このため、キャリアの厚さ測定に手間がかかり、非能率的であるばかりでなく、測定ミスや測定データの入力ミス等人為的なミスが発生する恐れがあるという問題があった。 When polishing both sides of a work held by a carrier in a flat surface polishing device, the thickness of the work and the thickness of the carrier are measured, and the difference (gap) between the thickness of the work and the thickness of the carrier becomes a predetermined value. By finishing the polishing at that point, a work having a high flatness can be obtained.
When polishing with a gap management method that manages the difference between the work thickness and the carrier thickness in this way, conventionally, the work thickness is measured with a laser beam during polishing, and the carrier thickness is the work. When the polishing was not performed, the carrier was taken out from the surface polishing device and measured with a micrometer or the like. For this reason, it takes time and effort to measure the thickness of the carrier, which is not only inefficient, but also has a problem that human error such as measurement error or input error of measurement data may occur.

特許文献１には、平面研磨装置の支持フレームにレーザー光による厚さ測定装置を取り付け、この厚さ測定装置からレーザー光を、上定盤に設けた窓部を通してワークに照射し、該ワークの表面及び裏面で反射する反射光を受光して該ワークの厚さを測定するようにしたものが開示されている。
しかし、特許文献１に開示されたものは、支持フレームに固定的に設置した厚さ測定装置から、回転する上定盤に設けた窓部を通してワークにレーザー光を照射するようにしているため、窓部が測定位置を通るときだけにしか測定データが得られず、このため、測定データ数が少ないという問題がある。ワークの研磨精度は、該ワークの厚さに関する測定データ数が多いほど向上するため、できるだけ多くの測定データを得ることが望ましい。 In Patent Document 1, a thickness measuring device using a laser beam is attached to a support frame of a flat surface polishing device, and the work is irradiated with laser light from the thickness measuring device through a window provided on an upper surface plate. It is disclosed that the thickness of the work is measured by receiving the reflected light reflected on the front surface and the back surface.
However, in the one disclosed in Patent Document 1, since the thickness measuring device fixedly installed on the support frame irradiates the work with the laser beam through the window portion provided on the rotating upper surface plate. The measurement data can be obtained only when the window portion passes through the measurement position, and therefore, there is a problem that the number of measurement data is small. Since the polishing accuracy of the work improves as the number of measurement data relating to the thickness of the work increases, it is desirable to obtain as much measurement data as possible.

一方、特許文献２には、光源を含む光学計測装置を上定盤に取り付け、この光学計測装置を上定盤と一体に回転させながらワークの厚さを測定するようにしたものが開示されている。このようにすれば、得られる測定データの数は多くなるが、レーザー発振装置からなる光源を含む光学計測装置は、全体的に大がかりで重量も大きいため、上定盤を含む回転部分の構成が複雑化するばかりでなく、該上定盤の回転時のバランスを保つのが非常に難しく、該上定盤が振動し易い。このため、測定データが上定盤の振動によるノイズの影響を受け易い。この場合、ワークは透光性に優れているため、上記ノイズの影響を大きく受けて厚さ測定が困難になるようなことは殆どないが、ワークに比べて透光性が低いキャリアの場合は、レーザー光を照射した際の反射強度がワークに比べて弱いため、上記ノイズの影響を大きく受けて厚さ測定が困難になることが考えられる。 On the other hand, Patent Document 2 discloses a device in which an optical measuring device including a light source is attached to an upper surface plate, and the thickness of the work is measured while rotating the optical measuring device integrally with the upper surface plate. There is. In this way, the number of measurement data that can be obtained increases, but since the optical measurement device including the light source consisting of the laser oscillator is large and heavy as a whole, the configuration of the rotating part including the upper surface plate is configured. Not only is it complicated, but it is very difficult to maintain the balance of the upper surface plate during rotation, and the upper surface plate tends to vibrate. Therefore, the measurement data is easily affected by noise due to the vibration of the upper surface plate. In this case, since the work has excellent translucency, it is unlikely that the thickness measurement becomes difficult due to the influence of the above noise, but in the case of a carrier having lower translucency than the work. Since the reflection intensity when irradiated with laser light is weaker than that of the work, it is considered that the thickness measurement becomes difficult due to the influence of the above noise.

特許文献２において、光学計測装置から光源を分離し、上定盤には光学計測装置だけを取り付け、光源から光ロータリコネクタを介して光学計測装置にレーザー光を供給するようにすることも考えられるが、光ロータリコネクタを経由したレーザー光や反射光は、該光ロータリコネクタで減衰したり回転に伴うノイズが含まれたりし易いため、ワークに比べて透光性が低いキャリアの厚さ測定に支障を来すことが考えられる。 In Patent Document 2, it is also conceivable to separate the light source from the optical measuring device, attach only the optical measuring device to the upper platen, and supply the laser light from the light source to the optical measuring device via the optical rotary connector. However, the laser light and reflected light that have passed through the optical rotary connector are likely to be attenuated by the optical rotary connector and contain noise due to rotation, so it is suitable for measuring the thickness of carriers that are less translucent than the workpiece. It may cause problems.

特開２００８−２２７３９３号公報Japanese Unexamined Patent Publication No. 2008-227393 特開２００２−５９３６４号公報Japanese Unexamined Patent Publication No. 2002-59364

本発明の技術的課題は、キャリアに保持された半導体ウエーハやガラス基板等のワークを研磨する平面研磨装置において、ワークとキャリアとの厚さ差に基づくギャップ管理方式の研磨を行うために、ワークの厚さとキャリアの厚さの両方をレーザー光によって確実に測定することができるようにすると共に、ワークの厚さに関する測定データ数をより多く得られるようにすることによって研磨精度を高めることにある。 A technical subject of the present invention is to perform a gap management method polishing based on a thickness difference between a work and a carrier in a flat surface polishing apparatus for polishing a work such as a semiconductor wafer or a glass substrate held by a carrier. The purpose is to improve the polishing accuracy by ensuring that both the thickness of the wafer and the thickness of the carrier can be measured reliably by the laser beam, and that a larger number of measurement data regarding the thickness of the work can be obtained. ..

前記課題を解決するため、本発明は、回転自在に支持された下定盤と、昇降自在且つ回転自在に支持された上定盤と、前記上定盤と下定盤との間に配置され、該上定盤と下定盤とで研磨されるワークを保持するキャリアとを有し、前記キャリアに保持されたワークを前記上定盤と下定盤とで挟持して前記ワークの両面を研磨する平面研磨装置であって、前記キャリアは、少なくとも一部が透光性を有する材料で形成され、前記上定盤に取り付けられ、前記ワークにレーザー光を照射して該ワークの表面及び裏面からの反射光を受光することにより該ワークの厚さを測定する第１厚さ測定器と、前記上定盤及び下定盤を支持する機体に取り付けられ、前記キャリアにレーザー光を照射して該キャリアの表面及び裏面からの反射光を受光することにより該キャリアの厚さを測定する第２厚さ測定器とを有することを特徴とする。 In order to solve the above problems, the present invention is arranged between a rotatably supported lower surface plate, an elevating and rotatably supported upper surface plate, and the upper surface plate and the lower surface plate. It has a carrier that holds the work to be polished by the upper surface plate and the lower surface plate, and the work held by the carrier is sandwiched between the upper surface plate and the lower surface plate to polish both sides of the work. In the device, the carrier is formed of at least a part of a translucent material, attached to the upper surface plate, irradiates the work with laser light, and reflected light from the front surface and the back surface of the work. It is attached to a first thickness measuring instrument that measures the thickness of the work by receiving light, and a machine body that supports the upper surface plate and the lower surface plate, and irradiates the carrier with laser light to irradiate the surface of the carrier and the surface plate. It is characterized by having a second thickness measuring device that measures the thickness of the carrier by receiving the reflected light from the back surface.

このとき、前記平面研磨装置は、前記レーザー光の光源を有し、前記第１厚さ測定器は、ロータリコネクタを介して前記光源に接続されていることが好ましい。 At this time, it is preferable that the surface polishing device has the light source of the laser beam, and the first thickness measuring device is connected to the light source via a rotary connector.

また、前記上定盤には、レーザー光を透過させるワーク用測定窓及びキャリア用測定窓が形成され、前記第１厚さ測定器は、前記ワーク用測定窓を通して前記ワークの厚さを測定し、前記第２厚さ測定器は、前記キャリア用測定窓を通して前記キャリアの厚さを測定することが好ましい。 Further, the upper surface plate is formed with a measuring window for a work and a measuring window for a carrier through which laser light is transmitted, and the first thickness measuring instrument measures the thickness of the work through the measuring window for the work. It is preferable that the second thickness measuring device measures the thickness of the carrier through the measuring window for the carrier.

本発明によれば、ワークにレーザー光を照射することでワークの厚さを測定する第１厚さ測定器が、回転自在に支持された上定盤に取り付けられ、少なくとも一部が透光性を有する材料で形成されたキャリアにレーザー光を照射することでキャリアの厚さを測定する第２厚さ測定器が、上定盤及び下定盤を支持する機体に取り付けられている。そのため、ワークの厚さとキャリアの厚さの両方をレーザー光によって確実に測定し、かつ、ワークの厚さに関する測定データ数をより多く得ることができる。また、キャリアの厚さを測定する際、該キャリアを研磨装置から都度取り外す必要がないため、ワークの厚さとキャリアの厚さとのギャップ管理が容易なものとなり、その作業工数が削減される。また、キャリアの取り外し・再装填によるキャリアの変形や破損を防止することができるため、その変形や破損により上下定盤の研磨面に対する接触が不均一となり、研磨面の状態が不安定になることによるワークの加工精度のばらつきの発生を防止することができ、安定した研磨加工の実現が可能となる。 According to the present invention, a first thickness measuring instrument for measuring the thickness of a work by irradiating the work with a laser beam is attached to a rotatably supported upper surface plate, and at least a part thereof is translucent. A second thickness measuring instrument that measures the thickness of the carrier by irradiating the carrier made of the material having the above surface plate with a laser beam is attached to the machine body that supports the upper surface plate and the lower surface plate. Therefore, both the thickness of the work and the thickness of the carrier can be reliably measured by the laser beam, and a larger number of measurement data regarding the thickness of the work can be obtained. Further, when measuring the thickness of the carrier, it is not necessary to remove the carrier from the polishing apparatus each time, so that the gap between the thickness of the work and the thickness of the carrier can be easily managed, and the work man-hours can be reduced. In addition, since it is possible to prevent the carrier from being deformed or damaged due to the removal and reloading of the carrier, the deformation or damage causes uneven contact with the polished surface of the upper and lower surface plates, and the state of the polished surface becomes unstable. It is possible to prevent variations in the processing accuracy of the work due to the above, and it is possible to realize stable polishing processing.

本発明に係る平面研磨装置の実施形態を概略的に示す断面図である。It is sectional drawing which shows typically the embodiment of the plane polishing apparatus which concerns on this invention. 下定盤上に配設されているキャリアと上定盤に形成されている測定孔との位置関係を示す概略平面図である。It is a schematic plan view which shows the positional relationship between the carrier arranged on the lower surface plate and the measurement hole formed in the upper surface plate.

本実施形態の平面研磨装置１は、シリコンウエーハ、サファイアウエーハ、セラミックスウエーハ、水晶ウエーハ、ガラス基板等のような透光性（光透過性）を有する板状のワークＷの両面を研磨するためのもので、機体２に回転自在に支持された下定盤１０と、機体２に昇降自在及び回転自在に支持された上定盤２０と、上定盤２０と下定盤１０とで研磨されるワークＷを保持するキャリア４０とを有している。上定盤２０の下面及び下定盤１０の上面には、研磨パッド１８ａ，１８ｂが貼付されているが、研磨パッド１８ａ，１８ｂの代わりに砥石を貼着した構造や定盤面自体が研磨面をなす構造であってもよい。 The surface polishing apparatus 1 of the present embodiment is for polishing both sides of a plate-shaped work W having translucency (light transmissivity) such as a silicon wafer, a sapphire wafer, a ceramic wafer, a crystal wafer, and a glass substrate. The lower surface plate 10 rotatably supported by the machine body 2, the upper surface plate 20 rotatably supported by the machine body 2, and the work W polished by the upper surface plate 20 and the lower surface plate 10. Has a carrier 40 that holds the surface plate. Polishing pads 18a and 18b are attached to the lower surface of the upper surface plate 20 and the upper surface of the lower surface plate 10, but the structure in which a grindstone is attached instead of the polishing pads 18a and 18b and the surface plate surface itself form a polishing surface. It may be a structure.

下定盤１０の中心にはサンギア１１が配設され、下定盤１０の外周にはインターナルギア１２が下定盤１０を取り囲むように配設されている。下定盤１０と上定盤２０とサンギア１１とインターナルギア１２とは、軸線Ｌを中心にして同軸上に配置されている。また、下定盤１０上には、キャリア４０が、サンギア１１とインターナルギア１２とに噛合して複数配設されている。サンギア１１の中央下部には第１駆動軸１３が接続され、下定盤１０の中央下部には第２駆動軸１４が接続され、インターナルギア１２の中央下部には第３駆動軸１５が接続されている。また、下定盤１０の中心には第４駆動軸１６が接続され、この第４駆動軸１６は第１駆動軸１３に収容されている。第１駆動軸１３は第２駆動軸１４に収容されており、第２駆動軸１４は第３駆動軸１５に収容されている。これらの第１から第４駆動軸１３−１６は、図示しない駆動装置によって駆動及び回転するように構成されている。 A sun gear 11 is arranged at the center of the lower platen 10, and an internal gear 12 is arranged around the lower platen 10 so as to surround the lower platen 10. The lower surface plate 10, the upper surface plate 20, the sun gear 11, and the internal gear 12 are arranged coaxially with the axis L as the center. Further, a plurality of carriers 40 are arranged on the lower platen 10 in mesh with the sun gear 11 and the internal gear 12. The first drive shaft 13 is connected to the lower center of the sun gear 11, the second drive shaft 14 is connected to the lower center of the lower platen 10, and the third drive shaft 15 is connected to the lower center of the internal gear 12. There is. A fourth drive shaft 16 is connected to the center of the lower platen 10, and the fourth drive shaft 16 is housed in the first drive shaft 13. The first drive shaft 13 is housed in the second drive shaft 14, and the second drive shaft 14 is housed in the third drive shaft 15. These first to fourth drive shafts 13-16 are configured to be driven and rotated by a drive device (not shown).

図２に示すように、上定盤２０と下定盤１０との間には、外周に歯部を備えたキャリア４０が等間隔で複数配設され、この歯部とサンギア１１及びインターナルギア１２とが互いに噛合せしめられており、サンギア１１及びインターナルギア１２の回転によって、キャリア４０はサンギア１１の周りを自転及び公転する。各キャリア４０は、ワークＷが嵌合するワーク保持孔４１を有し、ワーク保持孔４１は、このキャリア４０と中心を異にして形成されている。キャリア４０は、その一部又は全部が、測定に用いるレーザー光が透過する材料で形成されている必要がある。その材料としては、エポキシガラス、ポリ塩化ビニル樹脂、アクリル系樹脂、ウレタン系樹脂、アラミド樹脂、ポリエチレンテレフタレート樹脂（ＰＥＴ）、ポリカーボネート樹脂、ポリスチレン樹脂等の合成樹脂、ガラス等を単独で用いることも、あるいは２つ以上を組み合わせて用いることもできる。 As shown in FIG. 2, a plurality of carriers 40 having teeth on the outer periphery are arranged between the upper surface plate 20 and the lower surface plate 10 at equal intervals, and the teeth, the sun gear 11, and the internal gear 12 are arranged. Are meshed with each other, and the rotation of the sun gear 11 and the internal gear 12 causes the carrier 40 to rotate and revolve around the sun gear 11. Each carrier 40 has a work holding hole 41 into which the work W is fitted, and the work holding hole 41 is formed so as to have a different center from the carrier 40. The carrier 40 needs to be partially or wholly formed of a material through which the laser beam used for measurement can be transmitted. As the material, epoxy glass, polyvinyl chloride resin, acrylic resin, urethane resin, aramid resin, polyethylene terephthalate resin (PET), polycarbonate resin, synthetic resin such as polystyrene resin, glass and the like can be used alone. Alternatively, two or more can be used in combination.

上定盤２０は、定盤吊り３１を介して昇降軸である昇降用アクチュエータ７の昇降ロッド３２に取り付けられている。この昇降用アクチュエータ７は機体２に支持され、昇降ロッド３２は、下定盤１０、上定盤２０、サンギア１１、インターナルギア１２と同じ軸線Ｌを中心としている。
この構成についてより詳細に説明すると、定盤吊り３１の外周側の下面には、下方向に延びる複数の支持スタッド３３が円周方向に設けられ、この支持スタッド３３が上定盤２０の上面に取り付けられている。また、定盤吊り３１の内周面と昇降ロッド３２の外周面との間には、この定盤吊り３１と昇降ロッド３２とを上下方向には固定的に結合するが上定盤２０の回転方向には相対的に回転自在に結合するベアリング３４が介設されている。 The upper surface plate 20 is attached to an elevating rod 32 of an elevating actuator 7 which is an elevating shaft via a surface plate suspension 31. The elevating actuator 7 is supported by the machine body 2, and the elevating rod 32 is centered on the same axis L as the lower surface plate 10, the upper surface plate 20, the sun gear 11, and the internal gear 12.
To explain this configuration in more detail, a plurality of support studs 33 extending downward are provided on the lower surface of the outer peripheral side of the surface plate suspension 31 in the circumferential direction, and the support studs 33 are provided on the upper surface of the upper surface plate 20. It is attached. Further, between the inner peripheral surface of the surface plate suspension 31 and the outer peripheral surface of the elevating rod 32, the surface plate suspension 31 and the elevating rod 32 are fixedly coupled in the vertical direction, but the rotation of the upper surface plate 20 A bearing 34 that is relatively rotatably coupled in the direction is interposed.

上定盤２０は、ワークＷの非研磨時に、昇降用アクチュエータ７の駆動による昇降ロッド３２の収縮によって待避位置（不図示）に上昇し、ワークＷの研磨時に、昇降用アクチュエータ７の駆動による昇降ロッド３２の伸長によって図１の研磨位置まで下降する。上定盤２０が下降すると、上定盤２０に取り付けられたフック２２が第４駆動軸１６の上端のドライバ１７に係合するため、上定盤２０と定盤吊り３１は、第４駆動軸１６によりドライバ１７を介して駆動され、一体に回転する。 When the work W is not polished, the upper surface plate 20 rises to a shunting position (not shown) due to the contraction of the lifting rod 32 driven by the lifting actuator 7, and when the work W is polished, the upper platen 20 is lifted by driving the lifting actuator 7. The extension of the rod 32 lowers it to the polishing position shown in FIG. When the upper surface plate 20 is lowered, the hook 22 attached to the upper surface plate 20 engages with the driver 17 at the upper end of the fourth drive shaft 16, so that the upper surface plate 20 and the surface plate suspension 31 are connected to the fourth drive shaft. It is driven by 16 via the driver 17, and rotates integrally.

このように構成された平面研磨装置１でワークＷを研磨するときは、各キャリア４０にワークＷがセットされたあと、上定盤２０が昇降用アクチュエータ７の駆動による昇降ロッド３２の伸長によって待避位置から図１の研磨位置まで下降し、上定盤２０に取り付けられたフック２２がドライバ１７に係合する。この状態で、第１−第４駆動軸１３−１６が図示しない駆動装置によって駆動及び回転されることにより、各キャリア４０がサンギア１１の周りで自転及び公転し、各キャリア４０に保持されたワークＷの上下両面が上定盤２０と下定盤１０とによって研磨される。 When polishing the work W with the flat surface polishing device 1 configured in this way, after the work W is set on each carrier 40, the upper surface plate 20 is evacuated by the extension of the elevating rod 32 driven by the elevating actuator 7. It descends from the position to the polishing position of FIG. 1, and the hook 22 attached to the upper surface plate 20 engages with the driver 17. In this state, when the first to fourth drive shafts 13-16 are driven and rotated by a drive device (not shown), each carrier 40 rotates and revolves around the sun gear 11, and the work held by each carrier 40. Both the upper and lower surfaces of W are polished by the upper surface plate 20 and the lower surface plate 10.

平面研磨装置１には、ワークＷの厚さとキャリア４０の厚さとを測定し、それらの厚さの差（ギャップ）が所定の値になった時点で研磨を終了するというギャップ管理方式の研磨を行うため、レーザー光でワークＷの厚さとキャリア４０の厚さとを測定するための厚さ測定装置が設けられている。それについて以下に説明する。
機体２には、レーザー光を出力する光源３と、演算制御部４とが設置され、上定盤２０には、レーザー光を用いてワークＷの厚さを測定するための第１厚さ測定器２１ａが設けられ、光源３と第１厚さ測定器２１ａとが、光ファイバー５１ａにより、ロータリコネクタ６を介して接続されている。上定盤２０及び下定盤１０の回転の影響を受けない位置には、キャリア４０の厚さを測定するための第２厚さ測定器２１ｂが設置されている。第２厚さ測定器２１ｂと光源３とは光ファイバー５１ｂによって接続されている。また、光源３は演算制御部４に接続されている。また、本実施形態では、光源３から出力されるレーザー光は赤外線レーザーであるが、ワークＷとキャリア４０のいずれの厚さも測定できるものであれば、他のレーザーであってもよい。 The flat surface polishing device 1 is subjected to a gap management type polishing in which the thickness of the work W and the thickness of the carrier 40 are measured, and the polishing is terminated when the difference (gap) between the thicknesses reaches a predetermined value. For this purpose, a thickness measuring device for measuring the thickness of the work W and the thickness of the carrier 40 with a laser beam is provided. It will be described below.
A light source 3 for outputting laser light and an arithmetic control unit 4 are installed on the machine body 2, and a first thickness measurement for measuring the thickness of the work W using laser light is performed on the upper surface plate 20. A device 21a is provided, and the light source 3 and the first thickness measuring device 21a are connected by an optical fiber 51a via a rotary connector 6. A second thickness measuring device 21b for measuring the thickness of the carrier 40 is installed at a position not affected by the rotation of the upper surface plate 20 and the lower surface plate 10. The second thickness measuring instrument 21b and the light source 3 are connected by an optical fiber 51b. Further, the light source 3 is connected to the arithmetic control unit 4. Further, in the present embodiment, the laser light output from the light source 3 is an infrared laser, but any other laser may be used as long as the thickness of both the work W and the carrier 40 can be measured.

ワークＷ及びキャリア４０の厚さ測定のための機構について、さらに詳細に説明する。
支持スタッド３３にはホルダー３６が固定されており、このホルダー３６に第１厚さ測定器２１ａを保持することで、第１厚さ測定器（プローブヘッド）２１ａが上定盤２０の上側に取り付けられている。すなわち、第１厚さ測定器２１ａは、上定盤２０と共に回転するように設けられている。なお、第１厚さ測定器２１ａは上定盤２０と共に回転するように取り付けられていればよく、支持スタッド３３以外の箇所に固定されていても構わない。この第１厚さ測定器２１ａの直下には、上定盤２０を上下に貫通する第１厚さ測定孔２３ａが形成されている。第１厚さ測定孔２３ａには、ワーク用測定窓２４ａが取り付けられている。このワーク用測定窓２４ａは、合成樹脂製やガラス製などの筒状体で、第１厚さ測定孔２３ａの口径と略等しい外径を有し、該ワーク用測定窓２４ａの上端には、第１厚さ測定孔２３ａの直径よりも大径のフランジ部２５ａが設けられており、そのフランジ部２５ａを上定盤２０の表面に係合させることにより取り付けられている。また、該ワーク用測定窓２４ａの下端には、透光性を有する窓板２６ａが設けられている。このように、第１厚さ測定器２１ａは常に第１厚さ測定孔２３ａの直上に位置することとなり、ワークＷの厚さに関する測定データ数をより多く得ることができる。
また、図２に示すように、第１厚さ測定孔２３ａは、研磨加工中にワークＷの中心付近の直上を通過する範囲Ｅに形成されている。これにより、第１厚さ測定孔２３ａがワークＷの中心又は中心付近を通過するようにワークＷの厚さを測定することができ、その結果、ワークＷの厚さに関する測定データをより一層多く得ることができる。 The mechanism for measuring the thickness of the work W and the carrier 40 will be described in more detail.
A holder 36 is fixed to the support stud 33, and by holding the first thickness measuring instrument 21a in the holder 36, the first thickness measuring instrument (probe head) 21a is attached to the upper side of the upper surface plate 20. Has been done. That is, the first thickness measuring instrument 21a is provided so as to rotate together with the upper surface plate 20. The first thickness measuring instrument 21a may be attached so as to rotate together with the upper surface plate 20, and may be fixed at a place other than the support stud 33. Immediately below the first thickness measuring instrument 21a, a first thickness measuring hole 23a that vertically penetrates the upper surface plate 20 is formed. A work measuring window 24a is attached to the first thickness measuring hole 23a. The work measuring window 24a is a tubular body made of synthetic resin or glass, has an outer diameter substantially equal to the diameter of the first thickness measuring hole 23a, and has an outer diameter substantially equal to that of the first thickness measuring hole 23a. A flange portion 25a having a diameter larger than the diameter of the first thickness measuring hole 23a is provided, and the flange portion 25a is attached by engaging the flange portion 25a with the surface of the upper surface plate 20. Further, a translucent window plate 26a is provided at the lower end of the work measurement window 24a. In this way, the first thickness measuring instrument 21a is always located directly above the first thickness measuring hole 23a, and a larger number of measurement data regarding the thickness of the work W can be obtained.
Further, as shown in FIG. 2, the first thickness measuring hole 23a is formed in a range E that passes directly above the vicinity of the center of the work W during polishing. As a result, the thickness of the work W can be measured so that the first thickness measuring hole 23a passes through the center or the vicinity of the center of the work W, and as a result, the measurement data regarding the thickness of the work W is further increased. Obtainable.

第２厚さ測定器（プローブヘッド）２１ｂは、上定盤２０及び下定盤１０の回転の影響を受けない位置に設置されており、本実施形態では機体２に設置されている。これにより、測定されたキャリア４０の厚さに関する測定データに、研磨加工中に発生する振動によるノイズが混入することを防止することができる。上定盤２０における第２厚さ測定器２１ｂの直下の位置には、上定盤２０を上下に貫通する第２厚さ測定孔２３ｂが形成されている。第２厚さ測定孔２３ｂには、第１厚さ測定孔２３ａと同様のフランジ部２５ｂと窓板２６ｂとを有するキャリア用測定窓２４ｂが、フランジ部２５ｂを上定盤２０の表面に係合させて取り付けられている。
そして、第１厚さ測定孔２３ａと第２厚さ測定孔２３ｂは、第１厚さ測定孔２３ａの中心と軸線Ｌとの距離と、第２厚さ測定孔２３ｂの中心と軸線Ｌとの距離とが等しくなるように、上定盤２０に形成されている。すなわち、第１厚さ測定孔２３ａ、第２厚さ測定孔２３ｂ、第１厚さ測定器２１ａ、第２厚さ測定器２１ｂは、軸線Ｌを中心とした同一円周上に設けられている。 The second thickness measuring instrument (probe head) 21b is installed at a position that is not affected by the rotation of the upper surface plate 20 and the lower surface plate 10, and is installed on the machine body 2 in the present embodiment. As a result, it is possible to prevent noise due to vibration generated during polishing from being mixed in the measured measurement data regarding the thickness of the carrier 40. A second thickness measuring hole 23b that vertically penetrates the upper surface plate 20 is formed at a position directly below the second thickness measuring instrument 21b on the upper surface plate 20. In the second thickness measuring hole 23b, a carrier measuring window 24b having a flange portion 25b and a window plate 26b similar to the first thickness measuring hole 23a engages the flange portion 25b with the surface of the upper surface plate 20. It is attached by letting.
The first thickness measuring hole 23a and the second thickness measuring hole 23b are formed by the distance between the center of the first thickness measuring hole 23a and the axis L and the center of the second thickness measuring hole 23b and the axis L. It is formed on the upper surface plate 20 so that the distance is equal to that of the upper platen 20. That is, the first thickness measuring hole 23a, the second thickness measuring hole 23b, the first thickness measuring device 21a, and the second thickness measuring device 21b are provided on the same circumference centered on the axis L. ..

窓板２６ａの材料には、第１厚さ測定器２１ａから照射されるレーザー光と、ワークＷから反射されるレーザー光とを透過する材料、具体的には、石英ガラス、ＢＫ−７等のガラス系材料、サファイア、樹脂等の透光性（光透過性）を有する材料、好ましくは透明の材料が用いられる。また、窓板２６ｂの材料には、第２厚さ測定器２１ｂから照射されるレーザー光と、キャリア４０から反射されるレーザー光とを透過する物質、具体的には、石英ガラス、ＢＫ−７等のガラス系材料、サファイア、樹脂等の透光性（光透過性）を有する材料、好ましくは透明の材料が用いられる。 The material of the window plate 26a is a material that transmits the laser light emitted from the first thickness measuring instrument 21a and the laser light reflected from the work W, specifically, quartz glass, BK-7, or the like. A transparent material such as a glass-based material, sapphire, or resin, preferably a transparent material, is used. The material of the window plate 26b is a substance that transmits the laser light emitted from the second thickness measuring instrument 21b and the laser light reflected from the carrier 40, specifically, quartz glass and BK-7. Glass-based materials such as, sapphire, resin, and other materials having translucency (light transmissivity), preferably transparent materials are used.

昇降ロッド３２には、昇降ロッド３２の軸線Ｌと同一軸線上にロータリコネクタ６が配設されている。本実施形態では、昇降ロッド３２の下端部と定盤吊り３１との間にロータリコネクタ６が配設され、このロータリコネクタ６を介して、光源３と第１厚さ測定器２１ａとが光ファイバー５１ａにより接続されている。 The elevating rod 32 is provided with a rotary connector 6 on the same axis as the axis L of the elevating rod 32. In the present embodiment, the rotary connector 6 is arranged between the lower end of the elevating rod 32 and the surface plate suspension 31, and the light source 3 and the first thickness measuring instrument 21a are connected to the optical fiber 51a via the rotary connector 6. Is connected by.

以上の厚さ測定装置を用いて、ワークの厚さとキャリアの厚さとの差を管理するギャップ管理方式の研磨を行うときは、キャリア４０の厚さの測定をワークＷの非研磨時に行い、ワークの厚さの測定は研磨中に行う。
すなわち、キャリア４０の厚さ測定は、最初のワークを研磨する前か、ワークの研磨終了後に研磨スラリーや洗浄水等の水切りを行った後、次のワークＷを研磨する前などに行われる。
具体的には、キャリア４０の厚さ測定は、第２厚さ測定孔２３ｂに取り付けられたキャリア用測定窓２４ｂが第２厚さ測定器２１ｂの直下に位置する状態で、上定盤２０の回転を停止させると共に上昇させた状態とし、その状態で、キャリア４０をゆっくりと自転及び公転させながら行われる。このとき、第２厚さ測定器２１ｂから照射されたレーザー光は、キャリア用測定窓２４ｂの窓板２６ｂを通過してキャリア４０の表面及び裏面に到達し、その表面及び裏面からの反射光が窓板２６ｂを通過して第２厚さ測定器２１ｂで受信される。そして、受信された反射光は、光ファイバー５１ｂを介して演算制御部４に伝送され、この反射光に基づいてキャリア４０の厚さが演算制御部４で演算される。
このとき、第２厚さ測定器２１ｂは、光源３からロータリコネクタ６を介さずに光ファイバー５１ｂで接続されているため、ロータリコネクタ６を介して接続する場合のようにキャリア４０に照射されたレーザー光やその反射光が減衰やノイズ等による影響を受けることなく、その厚さを確実に測定することができる。 When polishing the gap management method for controlling the difference between the thickness of the work and the thickness of the carrier using the above thickness measuring device, the thickness of the carrier 40 is measured when the work W is not polished, and the work is polished. The thickness of the is measured during polishing.
That is, the thickness of the carrier 40 is measured before polishing the first work, after draining the polishing slurry, washing water, etc. after polishing the work, and before polishing the next work W.
Specifically, the thickness of the carrier 40 is measured on the upper surface plate 20 with the carrier measurement window 24b attached to the second thickness measuring hole 23b located directly below the second thickness measuring instrument 21b. The rotation is stopped and raised, and in that state, the carrier 40 is slowly rotated and revolved. At this time, the laser light emitted from the second thickness measuring instrument 21b passes through the window plate 26b of the carrier measuring window 24b and reaches the front surface and the back surface of the carrier 40, and the reflected light from the front surface and the back surface is emitted. It passes through the window plate 26b and is received by the second thickness measuring instrument 21b. Then, the received reflected light is transmitted to the arithmetic control unit 4 via the optical fiber 51b, and the thickness of the carrier 40 is calculated by the arithmetic control unit 4 based on the reflected light.
At this time, since the second thickness measuring instrument 21b is connected from the light source 3 by the optical fiber 51b without passing through the rotary connector 6, the laser irradiated to the carrier 40 as in the case of connecting via the rotary connector 6. The thickness of light and its reflected light can be reliably measured without being affected by attenuation, noise, or the like.

一方、ワークＷの厚さ測定は、上定盤２０と下定盤１０との間に研磨スラリーを供給しながら、ワークＷを研磨する際に行われる。
具体的には、第１厚さ測定器２１ａから照射されるレーザー光は、光源３から出力されたレーザー光であり、ロータリコネクタ６を介した光ファイバー５１ａにより伝送される。第１厚さ測定器２１ａから照射されるレーザー光は、第１厚さ測定器２１ａの直下に形成された第１厚さ測定孔２３ａに取り付けられたワーク用測定窓２４ａの窓板２６ａの直下にワークＷが位置している時（ワークＷが窓板２６ａの直下を通過している時）に、窓板２６ａを通過してワークＷの表面及び裏面に到達し、ワークＷの表面及び裏面からの反射光が窓板２６ａを通過して第１厚さ測定器２１ａで受光される。受光された反射光は、光ファイバー５１ａ、ロータリコネクタ６を介して演算制御部４に伝送され、この反射光に基づいてワークＷの厚さが演算制御部４で演算される。 On the other hand, the thickness measurement of the work W is performed when polishing the work W while supplying the polishing slurry between the upper surface plate 20 and the lower surface plate 10.
Specifically, the laser light emitted from the first thickness measuring instrument 21a is the laser light output from the light source 3, and is transmitted by the optical fiber 51a via the rotary connector 6. The laser beam emitted from the first thickness measuring instrument 21a is directly below the window plate 26a of the work measuring window 24a attached to the first thickness measuring hole 23a formed directly under the first thickness measuring instrument 21a. When the work W is located at (when the work W passes directly under the window plate 26a), it passes through the window plate 26a and reaches the front surface and the back surface of the work W, and the front surface and the back surface of the work W. The reflected light from the above passes through the window plate 26a and is received by the first thickness measuring instrument 21a. The received reflected light is transmitted to the arithmetic control unit 4 via the optical fiber 51a and the rotary connector 6, and the thickness of the work W is calculated by the arithmetic control unit 4 based on the reflected light.

測定されたワークＷの厚さとキャリア４０の厚さとは、演算制御部４で比較され、それらの差が所定の値になった時点で研磨が終了する。これによって、平坦度の高い所望のワークＷを得ることができる。 The measured thickness of the work W and the thickness of the carrier 40 are compared by the arithmetic and control unit 4, and polishing ends when the difference between them reaches a predetermined value. Thereby, a desired work W having a high flatness can be obtained.

なお、本実施形態では、第１厚さ測定器２１ａと第２厚さ測定器２１ｂ、及び第１厚さ測定孔２３ａと第２厚さ測定孔２３ｂは、軸線Ｌから等距離となるように上定盤２０に形成されている。しかしながら、装置構造を勘案し、第１厚さ測定器２１ａと第１厚さ測定孔２３ａ、又は第２厚さ測定器２１ｂと第２厚さ測定孔２３ｂは、軸線Ｌからの距離を異なる距離となる位置に形成してもよい。 In the present embodiment, the first thickness measuring instrument 21a and the second thickness measuring instrument 21b, and the first thickness measuring hole 23a and the second thickness measuring hole 23b are equidistant from the axis L. It is formed on the upper surface plate 20. However, in consideration of the device structure, the first thickness measuring instrument 21a and the first thickness measuring hole 23a, or the second thickness measuring instrument 21b and the second thickness measuring hole 23b have different distances from the axis L. It may be formed at the position where

また、キャリア４０の厚さ測定は、ワークＷの研磨時に行ってもよい。このワークＷの研磨時におけるキャリア４０の厚さ測定は、上定盤２０の回転と、キャリア４０の自転及び公転とによって、第２厚さ測定器２１ｂ及び第２厚さ測定孔２３ｂの直下にキャリア４０が位置する時に測定される。このとき、上定盤２０と下定盤１０との間に研磨スラリーが供給されているため、第２厚さ測定器２１ｂで受信される反射光は、研磨スラリーや洗浄水等に起因するノイズを含むが、キャリア４０からの反射強度がノイズの値よりも大きくなるキャリア４０の材料を適宜選択することで、ノイズの影響の少ない測定を行うことができる。
また、キャリア４０の厚さ測定をワークＷの研磨時に行う場合には、第２厚さ測定孔２３ｂを上定盤２０に複数形成することが望ましい。この場合において、各第２厚さ測定孔２３ｂは、軸線Ｌを中心点とする同一円周上に互いに等距離となるように形成され、かつ、各第２厚さ測定孔２３ｂと軸線Ｌとの距離が、第２厚さ測定器２１ｂと軸線Ｌとの距離と等しくなるように形成される。 Further, the thickness of the carrier 40 may be measured at the time of polishing the work W. The thickness of the carrier 40 at the time of polishing the work W is measured directly under the second thickness measuring instrument 21b and the second thickness measuring hole 23b by the rotation of the upper surface plate 20 and the rotation and revolution of the carrier 40. Measured when the carrier 40 is located. At this time, since the polishing slurry is supplied between the upper surface plate 20 and the lower surface plate 10, the reflected light received by the second thickness measuring instrument 21b causes noise caused by the polishing slurry, washing water, and the like. However, by appropriately selecting the material of the carrier 40 in which the reflection intensity from the carrier 40 is larger than the noise value, the measurement with less influence of noise can be performed.
Further, when the thickness of the carrier 40 is measured at the time of polishing the work W, it is desirable to form a plurality of second thickness measuring holes 23b in the upper surface plate 20. In this case, each of the second thickness measuring holes 23b is formed so as to be equidistant from each other on the same circumference centered on the axis L, and each of the second thickness measuring holes 23b and the axis L Is formed so that the distance between the two is equal to the distance between the second thickness measuring instrument 21b and the axis L.

さらに、第１厚さ測定器２１ａ及び第２厚さ測定器２１ｂで測定したワークＷ及びキャリア４０の厚さに関する測定データは、反射光のまま演算制御部４で演算するようにしているが、ワークＷ及びキャリア４０からの反射光を第１厚さ測定器２１ａ及び第２厚さ測定器２１ｂで電気信号に変換し、該第１厚さ測定器２１ａと演算制御部４とをロータリコネクタ６を介して結ぶ電気ケーブル（不図示）を通じて演算制御部４に送るようにし、該第２厚さ測定器２１ｂと演算制御部４とをロータリコネクタ６を介さずに結ぶ電気ケーブル（不図示）を通じて演算制御部４に送るようにしても良く、あるいは、第１厚さ測定器２１ａ及び第２厚さ測定器２１ｂから無線で演算制御部４に送ることによっても、本発明と同様の作用効果を得ることができる。 Further, the measurement data regarding the thickness of the work W and the carrier 40 measured by the first thickness measuring device 21a and the second thickness measuring device 21b is calculated by the calculation control unit 4 as the reflected light. The reflected light from the work W and the carrier 40 is converted into an electric signal by the first thickness measuring instrument 21a and the second thickness measuring instrument 21b, and the first thickness measuring instrument 21a and the arithmetic control unit 4 are connected to the rotary connector 6 The second thickness measuring instrument 21b and the arithmetic control unit 4 are connected to the arithmetic control unit 4 through an electric cable (not shown) connected via a rotary connector 6 (not shown). The same operation and effect as in the present invention may be obtained by sending the data to the arithmetic control unit 4 or by wirelessly sending the data from the first thickness measuring device 21a and the second thickness measuring instrument 21b to the arithmetic control unit 4. Obtainable.

さらに、光源３、演算制御部４、第２厚さ測定器２１ｂの設置位置は、上定盤２０や下定盤１０等の回転や昇降を伴う構成以外の箇所に設置されていれば、機体２とは別に設けられた保持手段等により、機体２以外の箇所に設置されていても本発明の作用効果を得ることができる。 Further, if the light source 3, the arithmetic control unit 4, and the second thickness measuring instrument 21b are installed at a location other than the upper surface plate 20 or the lower surface plate 10 that involves rotation or ascending / descending, the machine body 2 The operation and effect of the present invention can be obtained even if it is installed in a place other than the machine body 2 by a holding means or the like provided separately from the above.

１ 平面研磨装置
２ 機体
３ 光源
６ ロータリコネクタ
１０ 下定盤
２０ 上定盤
２１ａ 第１厚さ測定器
２１ｂ 第２厚さ測定器
２４ａ ワーク用測定窓
２４ｂ キャリア用測定窓
３１ 定盤吊り
３２ 昇降ロッド（昇降軸）
４０ キャリア
Ｗ ワーク 1 Flat surface polishing device 2 Machine 3 Light source 6 Rotary connector 10 Lower platen
20 Upper surface plate 21a First thickness measuring instrument 21b Second thickness measuring instrument 24a Measuring window for work 24b Measuring window for carrier 31 Surface plate suspension 32 Lifting rod (lifting shaft)
40 Carrier W Work

Claims (3)

回転自在に支持された下定盤と、
昇降自在且つ回転自在に支持された上定盤と、
前記上定盤と下定盤との間に配置され、該上定盤と下定盤とで研磨されるワークを保持するキャリアを有し、前記キャリアに保持されたワークを前記上定盤と下定盤とで挟持して前記ワークの両面を研磨する平面研磨装置であって、
前記キャリアは、少なくとも一部が透光性を有する材料で形成され、
前記上定盤に取り付けられ、前記ワークにレーザー光を照射して該ワークの表面及び裏面からの反射光を受光することにより該ワークの厚さを測定する第１厚さ測定器と、
前記上定盤及び下定盤を支持する機体に取り付けられ、前記キャリアにレーザー光を照射して該キャリアの表面及び裏面からの反射光を受光することにより該キャリアの厚さを測定する第２厚さ測定器と、を有する
ことを特徴とする平面研磨装置。 The lower platen that is rotatably supported and
An upper surface plate that can be raised and lowered and rotated freely,
It has a carrier that is arranged between the upper surface plate and the lower surface plate and holds a work that is polished by the upper surface plate and the lower surface plate, and the work held by the carrier is the upper surface plate and the lower surface plate. A flat surface polishing device that is sandwiched between and polishes both sides of the work.
The carrier is made of a material that is at least partially translucent.
A first thickness measuring device attached to the upper surface plate, which measures the thickness of the work by irradiating the work with laser light and receiving reflected light from the front surface and the back surface of the work.
A second thickness that is attached to the machine body that supports the upper and lower surface plates and measures the thickness of the carrier by irradiating the carrier with laser light and receiving reflected light from the front and back surfaces of the carrier. A surface polishing apparatus characterized by having a measuring instrument. 前記平面研磨装置は、
前記レーザー光の光源を有し、
前記第１厚さ測定器は、ロータリコネクタを介して前記光源に接続されている、
ことを特徴とする請求項１に記載の平面研磨装置。 The surface polishing device is
It has the light source of the laser light
The first thickness measuring instrument is connected to the light source via a rotary connector.
The flat surface polishing apparatus according to claim 1. 前記上定盤には、レーザー光を透過させるワーク用測定窓及びキャリア用測定窓が形成され、前記第１厚さ測定器は、前記ワーク用測定窓を通して前記ワークの厚さを測定し、前記第２厚さ測定器は、前記キャリア用測定窓を通して前記キャリアの厚さを測定することを特徴とする請求項１又は２に記載の平面研磨装置。 A work measuring window and a carrier measuring window for transmitting laser light are formed on the upper surface plate, and the first thickness measuring instrument measures the thickness of the work through the work measuring window. The surface polishing apparatus according to claim 1 or 2, wherein the second thickness measuring instrument measures the thickness of the carrier through the measuring window for the carrier.
JP2016081116A 2016-04-14 2016-04-14 Flat surface polishing device Active JP6760638B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016081116A JP6760638B2 (en) 2016-04-14 2016-04-14 Flat surface polishing device
KR1020170045067A KR102315142B1 (en) 2016-04-14 2017-04-07 Surface polishing apparatus
CN201710228022.7A CN107297678A (en) 2016-04-14 2017-04-10 Flat grinding device
TW106112056A TWI704613B (en) 2016-04-14 2017-04-11 Surface polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016081116A JP6760638B2 (en) 2016-04-14 2016-04-14 Flat surface polishing device

Publications (3)

Publication Number Publication Date
JP2017189849A JP2017189849A (en) 2017-10-19
JP2017189849A5 JP2017189849A5 (en) 2019-05-16
JP6760638B2 true JP6760638B2 (en) 2020-09-23

Family

ID=60085360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016081116A Active JP6760638B2 (en) 2016-04-14 2016-04-14 Flat surface polishing device

Country Status (4)

Country Link
JP (1) JP6760638B2 (en)
KR (1) KR102315142B1 (en)
CN (1) CN107297678A (en)
TW (1) TWI704613B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7046358B2 (en) * 2018-04-17 2022-04-04 スピードファム株式会社 Polishing equipment
CN110193775B (en) * 2019-03-12 2021-09-17 上海新昇半导体科技有限公司 Chemical mechanical polishing method and chemical polishing system
JP7651151B2 (en) * 2019-12-25 2025-03-26 スピードファム株式会社 Workhole detection device and workhole detection method
JP7435113B2 (en) * 2020-03-23 2024-02-21 株式会社Sumco Double-sided polishing device for workpieces
CN113245973B (en) * 2021-06-08 2022-07-22 唐山国芯晶源电子有限公司 Method for detecting grinding thickness of quartz wafer polishing loose pulley
IT202100022463A1 (en) * 2021-08-27 2023-02-27 Biesse Spa METHOD FOR CHECKING THE PROCESSING OF PANELS OF SUBSTANTIALLY PARALLELEPIPED SHAPE AND MACHINE FOR PROCESSING OF PANELS OF SUBSTANTIALLY PARALLELEPIPED SHAPE, IN PARTICULAR SANDING MACHINE FOR SANDING/GLOSSY OF PANELS OF WOOD, METAL, OR SIMILAR
JP7296161B1 (en) * 2022-06-27 2023-06-22 不二越機械工業株式会社 Double-sided polishing machine
CN117359435B (en) * 2023-12-05 2024-03-05 福建荣德光电科技有限公司 Numerical control plane precision milling and grinding machine for optical lens processing
CN117583975B (en) * 2024-01-18 2024-03-19 山西日盛达太阳能科技股份有限公司 Photovoltaic glass polishing device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740233A (en) * 1993-07-27 1995-02-10 Speedfam Co Ltd Thickness measuring device of work
JP2888339B1 (en) * 1998-03-27 1999-05-10 直江津電子工業株式会社 Workpiece holding plate
JP4324933B2 (en) 2000-08-23 2009-09-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Surface polishing machine
JP4202841B2 (en) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ Surface polishing equipment
JP2008227393A (en) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp Wafer double-side polishing equipment
JP2010023167A (en) * 2008-07-18 2010-02-04 Epson Toyocom Corp Abrasive particle processing apparatus and abrasive particle processing method therewith
JP4955624B2 (en) 2008-07-31 2012-06-20 信越半導体株式会社 Double-side polishing equipment
KR20100079199A (en) * 2008-12-30 2010-07-08 주식회사 동부하이텍 Method and apparatus for chemical mechanical polishing
US20120276662A1 (en) * 2011-04-27 2012-11-01 Iravani Hassan G Eddy current monitoring of metal features
JP5917994B2 (en) * 2012-04-23 2016-05-18 スピードファム株式会社 Measuring window structure for polishing equipment
JP6146213B2 (en) * 2013-08-30 2017-06-14 株式会社Sumco Double-side polishing apparatus and double-side polishing method for work
JP6622117B2 (en) * 2016-03-08 2019-12-18 スピードファム株式会社 Planar polishing apparatus and carrier

Also Published As

Publication number Publication date
KR20170117878A (en) 2017-10-24
TW201737336A (en) 2017-10-16
KR102315142B1 (en) 2021-10-20
JP2017189849A (en) 2017-10-19
CN107297678A (en) 2017-10-27
TWI704613B (en) 2020-09-11

Similar Documents

Publication Publication Date Title
JP6760638B2 (en) Flat surface polishing device
JP6622117B2 (en) Planar polishing apparatus and carrier
CN101264585B (en) Double-side polishing apparatus
TWI752045B (en) Polishing device
JP2017189849A5 (en)
JP2017204609A (en) Cross-sectional shape measuring method
JP5639147B2 (en) Material removal machining method for ultra-thin workpiece in double-side grinding machine
JP4955624B2 (en) Double-side polishing equipment
JP4799313B2 (en) Double-side polishing apparatus and method for detecting overlap of workpiece and carrier in double-side polishing apparatus
CN117300886B (en) Double-sided grinding device
JP6622105B2 (en) Surface polishing equipment
TW202339900A (en) Double-sided polishing device and double-sided polishing method which can accurately evaluate the thickness (shape) of the peripheral portion of a wafer during polishing and perform reliable thickness measurement
CN108214282B (en) Surface Grinder
JP2010186776A (en) Method of grinding wafer
CN112775821B (en) Grinding device
JP2016179513A (en) Adjustment method of polishing pad
TWI619580B (en) Surface grinding machine and method
KR20240158794A (en) Polishing method, computer readable storage medium storing program for operating computer, and polishing apparatus

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190401

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190401

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200221

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200303

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200422

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200804

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200831

R150 Certificate of patent or registration of utility model

Ref document number: 6760638

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250