JP6798472B2 - Electronic devices and their manufacturing methods - Google Patents

Description

The present invention relates to an electronic device having an electromagnetic shield structure and a method for manufacturing the same.

In recent years, in consumer electronic devices such as portable electronic devices such as mobile phones, it has been required to supply thin, lightweight, compact and highly water resistant wearable products at low cost. Generally, an electronic device is configured by assembling various electronic components on a printed circuit board. However, printed circuit boards that form circuits by etching copper foil are expensive in terms of material costs and processing costs, and are also materials for mounting electronic components using solder, conductive adhesives, metal wires, etc. Since the cost and processing cost are high, it becomes expensive.

Therefore, a method for mounting an electronic component that does not use a printed circuit board has been proposed in order to reduce the thickness, size, and cost of the product. For example, Japanese Patent Application Laid-Open No. 7-66570 (Patent Document 1) discloses an electronic circuit package in which a wiring pattern is formed on a surface in which an electronic component of a molding resin is embedded and a shield conductor layer is formed on a non-embedded surface.

Japanese Unexamined Patent Publication No. 7-666570

However, in the electronic circuit package described in JP-A-7-66570, the shield conductor layer is formed only on the non-embedded surface, and the performance of the electromagnetic shield is not sufficient.

The present disclosure has focused on the above problems, and an object of the present disclosure is to provide an electronic device having excellent electromagnetic shield performance and a method for manufacturing the same.

In one example of the present disclosure, the electronic device is formed on a resin molded body, an electronic component embedded in the resin molded body so as to be exposed from the first surface of the resin molded body, and connected to the electronic component. It includes wiring, a first metal plate joined to the second surface of the resin molded body, and a second metal plate that covers electronic components and wiring. The second surface is the surface behind the first surface. The first metal plate has at least one first bent portion that is bent so as to be exposed from the first surface and embedded in the resin molded body. The second metal plate is electrically connected to at least one first bend.

According to the above configuration, the first metal plate and the second metal plate form an electromagnetic shield structure that sandwiches an electronic circuit composed of electronic components and wiring from above and below. As a result, the electronic device is excellent in the performance of the electromagnetic shield.

In one example of the present disclosure, at least one first bend includes a plurality of first bends. The plurality of first bending portions are arranged so as to surround the electronic component and the wiring.

According to the above configuration, since the plurality of first bent portions surround the electronic component and the wiring, the performance of the electromagnetic shield is further improved.

In one example of the present disclosure, the first metal plate is further bent so as to be exposed from the first surface and further has a second bent portion embedded in the resin molded body. The electronic device further includes a heat transfer layer formed on the first surface so as to connect the electronic component and the second bent portion.

According to the above configuration, the heat of the electronic component can be diffused to the first metal plate via the heat transfer layer.

In one example of the present disclosure, the electronic device further comprises a third metal plate connected to a second surface. The third metal plate has a third bent portion which is bent so that the tip is exposed from the first surface and is embedded in the resin molded body, and a terminal portion which can be connected to an external device. The wiring is connected to the third bent portion.

According to the above configuration, the electronic component can be electrically connected to the external device via the third metal plate.

In one example of the present disclosure, the method for manufacturing an electronic device includes the following first to sixth steps. The first step is a step of bending the first metal plate to form a bent portion. The second step is a step of sticking a part of the bent portion and the electronic component on one surface of the sheet. In the third step, the sheet was placed in the molding die so that the other surface of the sheet was in contact with the inner surface of the molding die, and the molding die was filled with resin, so that the electronic component and the bent portion were embedded. This is a process of molding a resin molded product. The fourth step is a step of peeling the sheet from the resin molded body. The fifth step is a step of forming wiring to be connected to the electronic component on the surface of the exposed resin molded body by peeling the sheet. The sixth step is a step of arranging the second metal plate so as to cover the electronic parts and the wiring, and electrically connecting the second metal plate and the bent portion.

According to the above configuration, the bent portion of the first metal plate is embedded in the resin molded body together with the electronic parts. Therefore, when molding the resin molded body, the electronic component and the first metal plate can be integrated. The second metal plate is arranged so as to cover the electronic components and the wiring after the wiring is formed on the first surface of the resin molded body. In this way, the first metal plate and the second metal plate can be easily attached to the resin molded body in which the electronic components are embedded. Therefore, it is possible to easily manufacture an electronic device having an electromagnetic shield structure without performing a complicated process.

According to the present disclosure, it is possible to provide an electronic device having excellent electromagnetic shield performance and a method for manufacturing the same.

It is a top view which shows typically an example of the electronic apparatus which concerns on this embodiment. It is a top view which shows the electronic apparatus shown in FIG. 1 when the metal plate arranged in the upper part is removed. It is a bottom view of the electronic device shown in FIG. It is a cross-sectional view taken along the line XX of FIG. FIG. 5 is a cross-sectional view taken along the line VV of FIG. It is a cross-sectional view taken along the line of VI-VI of FIG. It is a top view which shows an example of a metal plate schematically. It is a bottom view of the metal plate shown in FIG. 7. FIG. 5 is a cross-sectional view taken along the line XX of FIG. It is a cross-sectional view taken along the line VV of FIG. It is sectional drawing which shows an example of the pasting process typically. It is sectional drawing which shows typically an example of a sheet, an electronic component and a metal plate arranged in a molding die. It is sectional drawing which shows typically an example of a resin molding process. It is sectional drawing which shows an example of the peeling process typically. It is sectional drawing which shows an example of the wiring formation process typically. It is sectional drawing which shows an example of the bonding process typically. It is a top view which shows an example of a cutting process schematically.

<Application example>
An example of a situation in which the present invention is applied will be described with reference to FIGS. 1 to 6. FIG. 1 is a plan view schematically showing an example of the electronic device 1 according to the present embodiment. FIG. 2 is a plan view showing the electronic device 1 shown in FIG. 1 when the metal plate 40 arranged at the upper portion is removed. FIG. 3 is a bottom view of the electronic device 1 shown in FIG. FIG. 4 is a cross-sectional view taken along the line XX of FIG. FIG. 5 is a cross-sectional view taken along the line VV of FIG. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. The electronic device 1 can be mounted on various types of electronic devices.

In the example shown in FIGS. 1 to 6, the electronic device 1 includes a resin molded body 10, electronic components 20a to 20e, wirings 60a, 60b, 61, and metal plates 30, 40. The electronic components 20a to 20e are embedded in the resin molded body 10 so as to be exposed from the upper surface 11 of the resin molded body 10. The wirings 60a, 60b, 61 are formed on the upper surface 11 of the resin molded body 10 and are connected to any of the electronic components 20a to 20e. The metal plate 30 is joined to the first lower surface 12 of the resin molded body 10. The first lower surface 12 is the back side of the upper surface 11. The metal plate 30 has bent portions 34a to 34e that are bent so as to be exposed from the upper surface 11 and embedded in the resin molded body 10. The metal plate 40 covers the upper surface 11 of the resin molded body 10 and is electrically connected to the bent portions 34a to 34e.

The electronic components 20a to 20e and the wirings 60a, 60b, 61 form an electronic circuit on the upper surface 11 of the resin molded body 10. The electronic circuit is located between the metal plate 30 and the metal plate 40. Therefore, the metal plate 30 and the metal plate 40 form an electromagnetic shield structure that sandwiches an electronic circuit composed of electronic components 20a to 20e and wirings 60a, 60b, 61. As a result, the electronic device 1 is excellent in the performance of the electromagnetic shield.

<Configuration example>
The details of each configuration of the electronic device 1 will be described below. In the example shown in FIGS. 1 to 6, the electronic device 1 includes a resin molded body 10, electronic components 20a to 20e, metal plates 30, 31a, 31b, 40, a heat transfer layer 50, and wirings 60a, 60b. 61 and the conductive adhesive member 70 may be provided.

The resin molded product 10 is made of, for example, a resin such as polycarbonate (PC), acrylonitrile butadiene styrene (ABS), or polyamide (PA). However, the material of the resin molded body 10 is not particularly limited. The resin molded body 10 has, for example, a substantially plate shape having a rectangular shape in a plan view. The thickness of the resin molded body 10 is not particularly limited, and is, for example, 3 mm. The surface of the resin molded body 10 includes an upper surface 11, a first lower surface 12 joined to the metal plate 30, and a second lower surface 13 exposed from the metal plate 30 (see FIGS. 4 to 6).

The metal plates 30, 31a, 31b, and 40 are made of a heat-transmitting metal such as stainless steel. The thickness of the metal plates 30, 31a, 31b, 40 is not particularly limited, and is, for example, 0.2 mm.

The metal plate 30 covers most of the lower surface of the resin molded body 10 and is joined to the first lower surface 12 of the resin molded body 10. The outer size of the metal plate 30 in a plan view is larger than the outer size of the resin molded body 10 in a plan view. A notch 36 and holes 37a to 37c are formed in the metal plate 30 (see FIG. 3). A part of the notch 36 and the holes 37a to 37c are filled with the resin molded body 10. The second lower surface 13 of the resin molded body 10 is a surface exposed from the notch 36 and the holes 37a to 37c.

The metal plate 30 has bent portions 34a to 34e, 35 which are bent so that the tip thereof is exposed from the upper surface 11 of the resin molded body 10 and are embedded in the resin molded body 10. The bent portions 34a to 34e are arranged so as to surround the electronic components 20a to 20e and the wirings 60a, 60b, 61 on all sides.

The tip surface 39 (see FIG. 5) of the bent portion 35 is continuous with the upper surface 11 of the resin molded body 10. Here, "consecutive" of two surfaces means that the step between the two surfaces is so small that the heat transfer layer 50 or the wirings 60a, 60b, 61 formed on the two surfaces are not cut. To do. The tip surfaces of the bent portions 34a to 34e are also continuous with the upper surface 11 of the resin molded body 10.

The metal plates 31a and 31b are arranged in the notch 36 of the metal plate 30 and are joined to the first lower surface 12 of the resin molded body 10. The metal plates 31a and 31b each have terminal portions 33a and 33b protruding from the resin molded body 10 in a plan view (see FIGS. 2 and 5). The terminal portions 33a and 33b can be electrically connected to an external device. Hereinafter, unless the metal plates 31a and 31b are particularly distinguished, each of the metal plates 31a and 31b is referred to as a "metal plate 31". When the terminal portions 33a and 33b are not particularly distinguished, each of the terminal portions 33a and 33b is referred to as a "terminal portion 33".

The metal plates 31a and 31b have bent portions 32a and 32b that are bent so that their tips are exposed from the upper surface 11 of the resin molded body 10 and are embedded in the resin molded body 10, respectively. The tip surface 38b (see FIG. 5) of the bent portion 32b is continuous with the upper surface 11 of the resin molded body 10. The tip surface of the bent portion 32a is also continuous with the upper surface 11 of the resin molded body 10.

The metal plate 40 has a rectangular shape in a plan view having substantially the same size as the upper surface 11 of the resin molded body 10, and covers the upper surface 11 of the resin molded body 10. The metal plate 40 is electrically connected to the bent portions 34a to 34e via the conductive adhesive member 70.

The electronic components 20a to 20e include, for example, passive components (resistors, capacitors, etc.), active components (LSI (Large-Scale Integration), IC (Integrated Circuit), power transistors, etc.), power supply devices (batteries, etc.), and display devices (LEDs). (Light Emitting Diode), etc.), sensors, switches, etc. The electronic components 20a to 20e each have electrodes 21a to 21e. Each of the electronic components 20a to 20e has a plurality of electrodes, but only one of the plurality of electrodes is designated in the drawing. For example, the chip-type electronic components 20c to 20e have two electrodes 21c to 21e, respectively. For example, the electronic component 20a, which is an IC, has four electrodes 21a. For example, the electronic component 20b, which is an LSI, has six electrodes 21b. Hereinafter, when the electronic components 20a to 20e are not particularly distinguished, each of the electronic components 20a to 20e is referred to as an "electronic component 20". When the electrodes 21a to 21e are not particularly distinguished, each of the electrodes 21a to 21e is referred to as an "electrode 21".

The electronic component 20 is embedded in the resin molded body 10 so as to be exposed from the upper surface 11 of the resin molded body 10. At this time, the electrode 21 is also exposed from the upper surface 11 of the resin molded body 10. The surface of the electronic component 20 exposed from the resin molded body 10 is continuous with the upper surface 11 of the resin molded body 10.

The heat transfer layer 50 is made of a heat transfer material. The heat transfer layer 50 may be made of a conductive metal such as silver having a thermal conductivity of 430 W / mK, or may be made of a non-conductive material such as graphite or a heat conductive resin material. The thickness of the heat transfer layer 50 is not particularly limited, and is, for example, 1 to 5 μm. The heat transfer layer 50 is formed on the upper surface 11 of the resin molded body 10 and connects to the surface of the electronic component 20b and the tip surface 39 of the bent portion 35 of the metal plate 30. As a result, the heat of the electronic component 20b can be diffused to the metal plate 30.

The heat transfer layer 50 is easily formed by applying a liquid heat transfer ink (for example, silver (Ag) nano ink) to the upper surface 11 of the resin molded body 10 by using, for example, an inkjet printing method or a screen printing method. .. The inkjet printing method is a printing method in which liquid ink is ejected from a nozzle and the ink is deposited on the surface to be ejected.

The wirings 60a, 60b, 61 are made of a metal such as silver having a resistivity of 3 to 6 μΩcm, for example. The thickness of the wirings 60a, 60b, 61 is not particularly limited, and is, for example, 1 to 5 μm. The wirings 60a, 60b, 61 are formed on the upper surface 11 of the resin molded body 10.

The wiring 60a is connected to the electrode 21a of the electronic component 20a, the electrode 21b of the electronic component 20b, and the tip surface of the bent portion 32a of the metal plate 31a. As a result, the electronic components 20a and 20b and the metal plate 31a are electrically connected. The wiring 60b is connected to the electrode 21b of the electronic component 20b, the electrode 21e of the electronic component 20e, and the tip surface 38b of the bent portion 32b of the metal plate 31b. As a result, the electronic components 20b and 20e and the metal plate 31b are electrically connected. In the following, unless the wirings 60a and 60b are particularly distinguished, each of the wirings 60a and 60b is referred to as "wiring 60".

The wiring 61 is connected to each electrode 21 of the plurality of electronic components 20. As a result, the plurality of electronic components 20 are electrically connected to each other.

The wirings 60a, 60b, 61 are easily formed by applying a liquid conductive ink (for example, silver (Ag) nanoink) to the upper surface 11 of the resin molded body 10 by using, for example, an inkjet printing method or a screen printing method. Will be done.

The conductive adhesive member 70 is made of a conductive adhesive and adheres the tips of the bent portions 34a to 34e to the metal plate 40. The thickness of the conductive adhesive member 70 is thicker than the thickness of the wirings 60a, 60b, 61. Therefore, the metal plate 40 does not come into contact with the wirings 60a, 60b, 61.

<Manufacturing method of electronic device>
Next, an example of a method for manufacturing the electronic device 1 will be described with reference to FIGS. 7 to 17. The electronic device 1 is manufactured by, for example, the following metal plate preparation step, pasting step, resin molding step, peeling step, wiring forming step, bonding step, and cutting step.

(Metal plate preparation process)
An example of the preparation step of the metal plate 130 which is the source of the metal plates 30, 31a and 31b will be described with reference to FIGS. 7 to 10. FIG. 7 is a plan view schematically showing an example of the metal plate 130. FIG. 8 is a bottom view of the metal plate 130 shown in FIG. 7. FIG. 9 is a cross-sectional view taken along the line XX of FIG. FIG. 10 is a cross-sectional view taken along the line VV of FIG.

In the examples of FIGS. 7 to 10, a metal plate 130 having a rectangular shape in a plan view is prepared. The metal plate 130 is cut along a predetermined pattern, a part thereof is removed, and a part is bent at a right angle. As a result, a metal plate 130 having bent portions 32a, 32b, 34a to 34e, 35 and having holes 37a to 37d formed is prepared. In the following, when the bent portions 32a and 32b are not particularly distinguished, each of the bent portions 32a and 32b is referred to as a "folded portion 32". When the bent portions 34a to 34e are not particularly distinguished, each of the bent portions 34a to 34e is referred to as a "folded portion 34". Unless the holes 37a to 37d are particularly distinguished, each of the holes 37a to 37d is referred to as a "hole 37".

(Pasting process)
FIG. 11 is a cross-sectional view schematically showing an example of the pasting process. In the example of FIG. 11, the electronic component 20 is attached to the sheet 80 using an adhesive (not shown). At this time, the electronic component 20 is attached to the sheet 80 so that the electrode 21 comes into contact with the sheet 80. Further, the tip surfaces of the bent portions 32, 34, 35 of the metal plate 130 are attached to the sheet 80.

As the material of the sheet 80, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS) and the like can be used. The sheet 80 is preferably made of a material that transmits ultraviolet rays and has flexibility.

The electronic components 20 and the bent portions 32, 34, and 35 can be attached to the sheet 80 by using, for example, an ultraviolet curable adhesive (not shown) applied to the sheet 80. For example, an ultraviolet curable adhesive is applied to one surface 80a of a transparent PET sheet 80 having a thickness of 50 μm to a thickness of 2 to 3 μm. This coating is performed using a method such as an inkjet printing method. After that, the electronic component 20 is placed in a predetermined position. Further, the metal plate 130 is arranged so that the tip surfaces of the bent portions 32, 34, and 35 come into contact with the sheet 80. At this time, the metal plate 130 is arranged so that the electronic component 20 is surrounded by the bent portion 34. By irradiating the other surface 80b of the sheet 80 (that is, the surface opposite to the electronic component 20 and the bent portions 32, 34, 35) with ultraviolet rays 82 having an intensity of, for example, 3000 mJ / cm ² , the adhesive is released. After curing, the tip surfaces of the electronic component 20 and the bent portions 32, 34, 35 are attached to the sheet 80.

Further, the surface of the metal plate 130 on which the bent portions 32, 34, and 35 are not bent is attached to one surface 81a of the sheet 81 so that the hole 37 is covered by the sheet 81. The metal plate 130 is attached to the sheet 81 by using the same method as the method of attaching the electronic component 20 and the bent portions 32, 34, 35 to the sheet 80. That is, the metal plate 130 is attached to the sheet 81 by irradiating the sheet 81 with ultraviolet rays 82 from the other surface 81b of the sheet 81 using an ultraviolet ray-transparent sheet 81 and an ultraviolet curable adhesive (not shown).

(Resin molding process)
FIG. 12 is a cross-sectional view schematically showing an example of the sheets 80, 81, the electronic component 20 and the metal plate 130 arranged in the molding die. In the example shown in FIG. 12, the sheets 80 and 81 are arranged between the upper molding die 83 and the lower molding die 84. At this time, the sheet 80 is arranged between the upper molding die 83 and the lower molding die 84 so that the surface 80b of the sheet 80 is in contact with the inner surface of the upper molding die 83. Further, the sheet 81 is arranged between the upper molding die 83 and the lower molding die 84 so that the surface 81b of the sheet 81 is in contact with the inner surface of the lower molding die 84. As a result, a space 85 is formed between the upper molding die 83 and the lower molding die 84.

FIG. 13 is a cross-sectional view schematically showing an example of the resin molding process. The resin molded body 10 is molded by injecting the molten resin into the space 85 (see FIG. 12) between the upper molding die 83 and the lower molding die 84. The resin is filled so as to surround the electronic component 20 and the bent portions 32, 34, 35 (see FIGS. 13 and 4 to 6). Therefore, the electronic component 20 and the bent portions 32, 34, and 35 are embedded in the resin molded body 10. Further, the first lower surface 12 of the resin molded body 10 is joined to the metal plate 130.

The conditions for injection molding the resin are appropriately selected according to the material of the resin. For example, when polycarbonate (PC) is used, injection molding is performed at an injection resin temperature of 270 ° C. and an injection pressure of 100 MPa. When acrylonitrile-butadiene styrene (ABS) is used, injection molding is performed at an injection resin temperature of 180 ° C. and an injection pressure of 20 kgf / cm ² .

(Peeling process)
FIG. 14 is a cross-sectional view schematically showing an example of the peeling step. The sheets 80 and 81 are peeled from the resin molded body 10 taken out from the upper molding die 83 and the lower molding die 84. By peeling off the sheet 80, the upper surface 11 of the resin molded body 10 is exposed. The upper surface 11 of the resin molded body 10 is a surface that has been joined to the sheet 80. In the above-mentioned pasting step, the electronic component 20 and the tip surfaces of the bent portions 32, 34, and 35 are pasted on the sheet 80 (see FIG. 11). Therefore, the surface of the electronic component 20 and the tip surfaces of the bent portions 32, 34, and 35 are continuous with the upper surface 11 of the resin molded body 10 (see FIGS. 14 and 4 to 6).

By peeling off the sheet 81, the second lower surface 13 of the resin molded body 10 is exposed from the hole 37 of the metal plate 130. The second lower surface 13 of the resin molded body 10 is a surface that has been joined to the sheet 81. In the above-mentioned sticking step, the metal plate 130 is stuck to the sheet 81. Therefore, the surface of the metal plate 130 and the second lower surface 13 of the resin molded body 10 are continuous.

(Wiring formation process)
FIG. 15 is a cross-sectional view schematically showing an example of a wiring forming process. For example, using an inkjet printing machine 90, the heat transfer layer 50 and the wirings 60 and 61 are formed on the upper surface 11 of the resin molded body 10. The heat transfer layer 50 is formed so as to connect to the surface of the electronic component 20 (excluding the electrode 21) and the tip surface 39 of the bent portion 35 (see FIGS. 15 and 5). The wiring 60 is formed so as to connect to the electrode 21 of the electronic component 20 and the tip end surface of the bent portion 32 (see FIGS. 15 and 4 to 6). The wiring 61 is formed so as to be connected to the electrodes 21 of the plurality of electronic components 20 (see FIGS. 15 and 4 to 6). The heat transfer layer 50 and the wirings 60 and 61 may be formed by using a screen printing method or the like. The materials of the heat transfer layer 50 and the wirings 60 and 61 may be the same or different.

(Adhesion process)
FIG. 16 is a cross-sectional view schematically showing an example of the bonding process. The conductive adhesive member 70 is arranged on the bent portion 34 exposed from the upper surface 11 of the resin molded body 10, and the metal plate 40 is adhered from above. As a result, the metal plate 40 covers the electronic component 20 exposed from the upper surface 11 of the resin molded body 10 and is electrically connected to the bent portion 34.

(Cut process)
FIG. 17 is a plan view schematically showing an example of the cutting process. By cutting out the cut target portion 131 of the metal plate 130, the metal plate 130 is divided into the metal plates 30, 31a and 31b. At this time, the hole 37d becomes the notch 36 (see FIG. 3). As a result, the metal plates 31a and 31b can be used as terminals for connecting to an external device, and the metal plate 30 can be used as an electromagnetic shield. Since the metal plates 30, 31a and 31b are manufactured based on the same metal plate 130, they are made of the same material and have the same thickness. The cutting step may be performed before the bonding step or may be performed before the wiring forming step. The cutting step may be omitted depending on the shape of the metal plate 130.

<Modification example 1>
In the above description, the metal plate 30 having the five bent portions 34a to 34e has been described as an example, but the number of the bent portions 34 included in the metal plate is not limited to this. For example, the metal plate 30 may have only one bent portion. Even in this case, the metal plate 30 and the metal plate 40 are electrically connected, and the electronic circuit composed of the electronic component 20 and the wirings 60 and 61 is located between the metal plate 30 and the metal plate 40. Be sandwiched. As a result, the performance of the electromagnetic shield of the electronic circuit composed of the electronic component 20 and the wirings 60 and 61 is excellent.

<Modification 2>
In the above description, the tip surfaces of the bent portions 32, 34, and 35 are exposed on the upper surface 11 of the resin molded body 10. However, a part of the surfaces of the bent portions 32, 34, and 35 may be exposed from the upper surface 11 of the resin molded body 10. For example, the bent portions 32, 34, 35 may be further bent in an L shape at a predetermined distance from the tips, and the surface from the bent portions to the tips may be exposed from the upper surface 11 of the resin molded body 10. As a result, the surface area of the bent portions 32, 34, 35 exposed from the upper surface 11 of the resin molded body 10 becomes large, and the wiring 60 can be easily formed. Further, the conductive adhesive member 70 facilitates electrical connection between the metal plate 30 and the metal plate 40.

<Modification example 3>
In the above description, the metal plates 30, 31a and 31b are made from the same metal plate 130. However, the metal plate 30, the metal plate 31a, and the metal plate 31b may be prepared separately and attached to the sheet 80.

<Action / effect>
As described above, in the electronic device 1 according to the present embodiment, the electronic component 20 is embedded in the resin molded body 10 so as to be exposed from the upper surface 11 of the resin molded body 10. Wiring 60, 61 connected to the electronic component 20 is formed on the upper surface 11. A metal plate 30 is joined to the first lower surface 12 of the resin molded body 10, and a metal plate 40 covering the electronic component 20 is arranged above the upper surface 11. The metal plate 30 has a bent portion 34 that is bent so that its tip is exposed from the upper surface 11 and is embedded in the resin molded body 10. The metal plate 40 is electrically connected to the bent portion 34.

According to the above configuration, the metal plate 30 and the metal plate 40 form an electromagnetic shield structure that sandwiches an electronic circuit composed of an electronic component 20 and wirings 60 and 61 from above and below. As a result, the electronic device 1 is excellent in the performance of the electromagnetic shield.

Further, the bent portion 34 of the metal plate 30 is embedded in the resin molded body 10 together with the electronic component 20. Therefore, the bondability between the resin molded body 10 and the metal plate 30 can be improved.

The metal plate 30 has a plurality of bent portions 34. The plurality of bent portions 34 are arranged so as to surround the electronic component 20 and the wirings 60 and 61. As a result, the plurality of bent portions 34 surround the four sides of the electronic circuit composed of the electronic component 20 and the wirings 60 and 61. As a result, the electronic device 1 can further improve the performance of the electromagnetic shield.

The metal plate 30 is further bent so as to be exposed from the upper surface 11 and further has a bent portion 35 embedded in the resin molded body 10. The electronic device 1 further includes a heat transfer layer 50 formed on the upper surface 11 so as to connect the electronic component 20 and the bent portion 35. As a result, the heat of the electronic component 20 can be diffused to the metal plate 30 via the heat transfer layer 50.

The electronic device 1 further includes a metal plate 31 connected to the first lower surface 12 of the resin molded body 10. The metal plate 31 has a bent portion 32 that is bent so as to be exposed from the upper surface 11 and embedded in the resin molded body 10, and a terminal portion 33 that can be connected to an external device. The wiring 60 is connected to the bent portion 32. As a result, the electronic component 20 can be electrically connected to the external device via the metal plate 31.

In the manufacturing method of the electronic device 1 according to the present embodiment, the above-mentioned metal plate preparation step, pasting step, resin molding step, peeling step, wiring forming step, and bonding step are carried out. In this way, the bent portion 34 of the metal plate 30 is embedded in the resin molded body 10 together with the electronic component 20. Therefore, when the resin molded body 10 is molded, the electronic component 20 and the metal plate 30 can be integrated. The metal plate 40 is arranged so as to cover the electronic component 20 and the wiring 60 after the wiring 60 is formed on the upper surface 11 of the resin molded body 10. In this way, the metal plates 30 and 40 can be easily attached to the resin molded body 10 in which the electronic component 20 is embedded. Therefore, the electronic device 1 provided with the electromagnetic shield structure can be easily manufactured without performing a complicated process.

Further, the wiring 60 is formed on the upper surface 11 of the resin molded body 10 by, for example, an inkjet printing method. Therefore, high-temperature heat treatment such as soldering becomes unnecessary, and the resin molded body 10 can be molded using a resin having low heat resistance. As a result, the degree of freedom of the material used for the resin molded body 10 is increased.

The wiring 60 is formed after molding the resin molded body 10, and receives almost no stress from the resin. Therefore, for example, as compared with an electronic device in which the bonding wire is embedded in the resin, deterioration of manufacturing quality can be suppressed.

<Additional notes>
As described below, the present embodiment includes the following disclosures.
The electronic device (1) includes a resin molded body (10) and an electronic component (20) embedded in the resin molded body (10) so as to be exposed from the first surface (upper surface 11) of the resin molded body (10). , A first metal plate (60, 61) formed on the first surface (11) and connected to the electronic component (20) and a first metal plate (first lower surface 12) joined to the second surface (first lower surface 12) of the resin molded body 10. 30) and a second metal plate (40) that covers the electronic component (20). The second surface (12) is the surface on the back side of the first surface (11). The first metal plate (30) has at least one first bent portion (34) that is bent so as to be exposed from the first surface (11) and embedded in the resin molded body (10). The second metal plate (40) is electrically connected to at least one first bent portion (34).

At least one first bent portion (34) includes a plurality of first bent portions (34a to 34e). The plurality of first bending portions (34a to 34e) are arranged so as to surround the electronic component (20) and the wiring (60, 61).

The first metal plate (30) further has a second bent portion (35) that is bent so as to be exposed from the first surface (11) and embedded in the resin molded body (10). The electronic device (1) further includes a heat transfer layer (50) formed on the first surface (11) so as to connect the electronic component (20) and the second bent portion (35).

The electronic device (1) further includes a third metal plate (31) connected to the second surface (12). The third metal plate (31) is bent so that the tip is exposed from the first surface (11), and can be connected to the third bent portion (32) embedded in the resin molded body (10) and an external device. It has a terminal portion (33). The wiring (60) is connected to the third bent portion (32).

The manufacturing method of the electronic device (1) includes a step of bending the first metal plate (130) to form a bent portion (34), a part of the bent portion (34), and an electronic component (20). The step of attaching the sheet (80) to one surface (80a) and the molding die (80) so that the other surface (80b) of the sheet (80) is in contact with the inner surface of the molding die (83,84). By arranging in 83,84) and filling the molding die (83,84) with resin, a resin molded body (10) in which an electronic part (20) and a bent portion (34) are embedded is molded. A step of peeling the sheet (80) from the resin molded body (10), and an electronic component (20) on the surface (upper surface 11) of the resin molded body (10) exposed by peeling the sheet (80). The second metal plate (40) is arranged so as to cover the electronic component (20) and the wiring (60, 61) in the process of forming the wiring (60, 61) to be connected to the second metal plate (40). It is provided with a step of electrically connecting the bent portion (34) and the bent portion (34).

Although embodiments of the present invention have been described, it should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. The scope of the present invention is indicated by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

1 Electronic device, 10 Resin molded body, 11 Upper surface, 12 First lower surface, 13 Second lower surface, 20 (20a to 20e) electronic component, 21 (21a to 21e) electrodes, 30, 31a, 31b, 40, 130 Metal plate , 32 (32a, 32b), 34 (34a-34e), 35 bent part, 33a, 33b terminal part, 36 notch part, 37 (37a-37d) hole, 38b, 39 tip surface, 50 heat transfer layer, 60 (60a, 60b), 61 wiring, 70 conductive adhesive member, 80, 81 sheet, 80a, 80b, 81a, 81b surface, 82 ultraviolet rays, 83 top molding die, 84 bottom molding die, 85 space, 90 inkjet printing machine, 131 The part to be cut.

Claims (5)

Resin molded body and
Electronic components embedded in the resin molded body so as to be exposed from the first surface of the resin molded body,
A wiring formed on the first surface and connected to the electronic component,
A first metal plate joined to the second surface of the resin molded body and
The electronic component and the second metal plate covering the wiring are provided.
The second surface is a surface on the back side of the first surface.
The first metal plate has at least one first bent portion that is bent so as to be exposed from the first surface and embedded in the resin molded body.
An electronic device in which the second metal plate is electrically connected to the at least one first bent portion. The at least one first bending portion includes a plurality of first bending portions.
The electronic device according to claim 1, wherein the plurality of first bent portions are arranged so as to surround the electronic component and the wiring. The first metal plate is further bent so as to be exposed from the first surface, and further has a second bent portion embedded in the resin molded body.
The electronic device
The electronic device according to claim 1 or 2, further comprising a heat transfer layer formed on the first surface so as to connect the electronic component and the second bent portion. The electronic device further comprises a third metal plate joined to the second surface.
The third metal plate is
A third bent portion that is bent so as to be exposed from the first surface and embedded in the resin molded body.
It has a terminal part that can be connected to an external device.
The electronic device according to any one of claims 1 to 3, wherein the wiring is connected to the third bent portion. The process of bending the first metal plate to form a bent part,
The process of attaching a part of the bent portion and the electronic component to one surface of the sheet, and
The electronic component and the bent portion are embedded by arranging the sheet in the molding die so that the other surface of the sheet is in contact with the inner surface of the molding die and filling the molding die with resin. The process of molding the resin molded body and
The step of peeling the sheet from the resin molded body and
A step of forming wiring to be connected to the electronic component on the surface of the resin molded body exposed by peeling the sheet, and
A method for manufacturing an electronic device, comprising a step of arranging a second metal plate so as to cover the electronic component and the wiring, and electrically connecting the second metal plate and the bent portion.

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