JP6827755B2 - Manufacturing method of imprinting equipment and articles - Google Patents

Description

The present invention relates to an imprinting device and a method for manufacturing an article.

With the increasing demand for miniaturization of semiconductor devices, in addition to the conventional photolithography technology, an imprint technology capable of forming a fine pattern (structure) on the order of several nanometers on a substrate is drawing attention. In the imprint technology, an uncured imprint material is supplied (coated) on a substrate, and the imprint material and a mold (mold) are brought into contact with each other to imprint corresponding to a fine uneven pattern formed on the mold. This is a microfabrication technology for forming a material pattern on a substrate.

In the imprint technology, there is a photocuring method as one of the curing methods of the imprint material. In the photo-curing method, the imprint material supplied to the shot region on the substrate is in contact with the mold, and light is irradiated to cure the imprint material, and the mold is separated from the cured imprint material. This is a method of forming a pattern of a printing material on a substrate.

When superimposing the pattern of the mold and the pattern (base) formed on the substrate, the mold and the substrate are relatively placed based on the relative positions of the marks formed on the mold and the marks formed on the substrate. By moving it, the shift and the misalignment in the rotation direction are corrected. Further, by deforming the mold (pattern), shape errors such as magnification, skew, trapezoid, bow, and pincushion are corrected.

In order to improve the accuracy of superimposing the mold pattern and the base, a device that deforms the mold with an accuracy of several nanometers or less is required. Such devices include actuators and sensors for applying an external force to the mold to change the pattern into an arbitrary shape, and are arranged at a plurality of locations so as to surround the outer circumference of the mold. For example, an imprint device having an actuator between a side surface of a mold and a support structure and a force sensor between the actuator and the support structure has been proposed (see Patent Documents 1 and 2). In such an imprint device, the compressive force applied from the actuator to the side surface of the mold is detected by a force sensor and feedback controlled.

Japanese Unexamined Patent Publication No. 2009-141328 Patent No. 4573873

However, in the imprinting apparatus, the mold is shifted and displaced in the rotational direction due to an external force applied to the mold in the imprinting process of bringing the mold into contact with the imprint material on the substrate and the mold release process of pulling the mold away from the imprint material on the substrate. May occur. In such a case, in principle, the mold cannot be returned to the original position by the feedback control using the force sensor as described above.

The misalignment of the mold causes unintended deformation (distortion) of the mold due to friction between the mold and the holding portion (chuck) that holds the mold, which causes a decrease in the overlay accuracy. In addition, since the relative positional deviation between the mold and the substrate immediately after the imprinting process becomes large, the amount of movement of the mold and the substrate required for alignment between the mold and the substrate increases, which affects the alignment time. Will be given. Furthermore, since the spring characteristics of the imprint material act between the mold and the substrate, a force proportional to the amount of movement of the mold and substrate required for alignment is applied to the mold, causing deformation (distortion) of the mold. Well.

An exemplary object of the present invention is to provide an imprinting apparatus that is made in view of such problems of the prior art and is advantageous in suppressing misalignment of a mold.

In order to achieve the above object, the imprinting apparatus as one aspect of the present invention is an imprinting apparatus that forms a pattern of an imprint material on a substrate by using a mold, and has a holding portion that holds the mold. , An actuator that applies a force to the side surface of the mold held by the holding portion, a first measuring unit that measures the force applied to the side surface of the mold by the actuator, and a position of the mold held by the holding portion. The operation amount input to the actuator is controlled based on the second measuring unit for measuring the above, the force target value corresponding to the force to be applied to the side surface of the mold by the actuator, and the output of the first measuring unit. The control unit and the input unit that converts the difference between the position target value corresponding to the position where the mold should be located in the holding unit and the output of the second measurement unit into a force operation amount and inputs it to the control unit. The control unit controls the operation amount input to the actuator based on the operation amount input from the input unit , and the position target value is such that the actuator is on the side surface of the mold. It is characterized in that it corresponds to the position of the mold in a state where a force corresponding to a force target value is applied.

Further objects or other aspects of the invention will be manifested in the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide an imprinting apparatus which is advantageous for suppressing the misalignment of the mold.

It is the schematic which shows the structure of the imprinting apparatus as one aspect of this invention. It is the schematic which shows the mold, the actuator, the 1st measurement part and the 2nd measurement part of the imprint apparatus shown in FIG. 1 from the Z-axis direction. It is a block diagram which shows the control system about the correction of the shape of the mold of the imprint apparatus shown in FIG. It is a flowchart for demonstrating the operation of the imprint apparatus shown in FIG. It is a figure for demonstrating the manufacturing method of an article.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each figure, the same members are assigned the same reference numbers, and duplicate description will be omitted.

FIG. 1 is a schematic view showing a configuration of an imprinting apparatus 100 as one aspect of the present invention. The imprinting apparatus 100 is a lithography apparatus used in a semiconductor device manufacturing process and performs an imprinting process for forming a pattern of an imprinting material on a substrate by using a mold. In the present embodiment, the imprinting apparatus 100 brings the imprinting material supplied on the substrate into contact with the mold, and applies energy for curing to the imprinting material to transfer the uneven pattern of the mold to the cured product. Form the pattern of.

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. are used as the energy for curing. As the electromagnetic wave, for example, light such as infrared rays, visible light rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less is used.

The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like.

The imprint material may be applied in a film form on the substrate by a spin coater or a slit coater. Further, the imprint material may be applied onto the substrate in the form of droplets or islands or films formed by connecting a plurality of droplets by the liquid injection head. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

As shown in FIG. 1, the imprint device 100 includes an irradiation unit 1, a mold holding unit 4, an actuator 5, a first measurement unit 6, a second measurement unit 7, a substrate stage 9, and a supply unit 10. And an alignment measurement unit 11 and a control unit 15.

The irradiation unit 1 irradiates the imprint material on the substrate with ultraviolet rays via the mold 2. The irradiation unit 1 includes, for example, a light source and a plurality of optical elements for adjusting the ultraviolet rays from the light source to a state suitable for imprint processing.

The mold 2 has a rectangular outer shape, and a pattern to be transferred to the imprint material on the substrate is formed in a three-dimensional shape on the surface facing the substrate 8. The surface of the pattern of the mold 2 is processed to have a high flatness in order to maintain the adhesion with the imprint material (board 8) on the substrate. The mold 2 is made of a material that transmits ultraviolet rays, such as quartz.

The mold holding portion 4 includes a chuck that attracts the mold 2 by an attractive force or an electrostatic force, and holds the mold 2. The mold holding portion 4 is driven by the mold driving portion. The mold driving unit drives the mold holding unit 4 in the Z-axis direction in order to bring the imprint material on the substrate into contact with the mold 2 or to separate the mold 2 from the imprint material on the substrate.

The actuator 5 (mold deformation mechanism) applies a force (compressive force) to the side surface of the mold 2 held by the mold holding portion 4 to deform the pattern of the mold 2. The first measuring unit 6 includes a force sensor such as a load cell and a strain gauge, and measures the force applied to the side surface of the mold 2 from the actuator 5. The second measuring unit 7 includes a displacement sensor and measures the position of the side surface (displacement of the side surface) of the mold 2 held by the mold holding unit 4.

The supply unit 10 (dispenser) supplies (coats) the imprint material on the substrate. In the present embodiment, the imprint material has a property of being cured by irradiation with ultraviolet rays (photocurability). Further, the imprint material is appropriately selected according to the type of semiconductor device to be manufactured. The substrate stage 9 is a stage that holds the substrate 8 by vacuum suction and can move freely in the XY plane.

The alignment measurement unit 11 includes a measurement light source 12 such as a He-Ne laser that emits light having a wavelength that does not cure the imprint material on the substrate, and a detector 13 such as a CCD image sensor. The alignment measurement unit 11 is used when superimposing the pattern of the mold 2 and the pattern (base) formed on the substrate 8. The alignment measurement unit 11 irradiates the alignment marks formed on the mold 2 and the substrate 8 with light from the measurement light source 12, and detects the interference pattern formed by the light from these marks with the detector 13. Then, measure the relative positions of the marks.

The control unit 15 controls the entire (operation) of the imprint device 100, including the CPU and memory. The control unit 15 comprehensively controls each unit of the imprint device 100 to perform the imprint process. Further, the control unit 15 controls the process related to the alignment between the mold 2 and the substrate 8. For example, the position deviation between the mold 2 and the substrate 8 in the X-axis direction, the Y-axis direction, and the rotation direction is obtained from the measurement result (relative position of the alignment mark) of the alignment measurement unit 11, and the substrate stage 9 is moved. The misalignment between the mold 2 and the substrate 8 is corrected. Further, shape errors such as magnification, skew, trapezoid, bow, and pincushion between the mold 2 and the substrate 8 are corrected by deforming the pattern of the mold 2 by the actuator 5 to obtain the target shape. As the control related to the correction of the shape of the mold 2 by the actuator 5, open control and feedback control can be considered. The open control is performed before the mold 2 is brought into contact with the imprint material on the substrate, for example, based on the shape correction amount obtained from the result of measuring the pattern formed on the substrate 8 by the imprint process with a measuring device such as SEM. It is a control that transforms into. The feedback control is a control that deforms the mold 2 in real time based on the measurement result of the alignment measurement unit 11.

FIG. 2 is a schematic view showing the mold 2, the actuator 5, the first measuring unit 6 and the second measuring unit 7 from the Z-axis direction, and is a schematic view showing the actuator 5, the first measuring unit 6 and the second measuring unit 7 with respect to the mold 2. An example of the arrangement of is shown. A pattern 20 to be transferred to the imprint material on the substrate is formed in the center of the mold 2. Further, the pattern 20 includes an alignment mark 21 for measuring a relative position with the alignment mark formed on the substrate 8.

With reference to FIG. 2, a plurality of actuators 5 are arranged so as to surround the mold 2, that is, to face each of the four side surfaces 2a, 2b, 2c and 2d of the mold 2. In the present embodiment, four actuators 5 are arranged on one side surface of the mold 2 (each of the side surfaces 2a to 2d). Each of the actuators 5 is supported by a mold holding portion 4 that holds the mold 2. As the actuator 5, a piezo actuator having a small heat generation amount and excellent responsiveness is generally used. Further, each of the actuators 5 is provided with a first measuring unit 6 for measuring the force applied to the side surface of the mold 2 from the actuator 5.

The second measuring unit 7 that measures the position of the side surface of the mold 2 is supported by the mold holding unit 4. At least three or more second measuring units 7 are arranged on two of the four side surfaces 2a to 2d of the mold 2 that are orthogonal to each other. In other words, the second measuring unit 7 measures at least the position of two points on the side surface (first side surface) of the mold 2 and the position of one point on the side surface orthogonal to the side surface (second side surface). Includes three measurement axes. As a result, the second measuring unit 7 can measure the positional deviation X of the mold 2 in the X-axis direction, the positional deviation Y of the mold 2 in the Y-axis direction, and the positional deviation Qz of the mold 2 in the rotational direction. In the present embodiment, as shown in FIG. 2, two second measuring units 7a and 7b are arranged with respect to the side surface 2b of the mold 2 along the Y-axis direction, and the side surface 2a of the mold 2 along the X-axis direction. A second measuring unit 7c is arranged with respect to the above, but the present invention is not limited to this. For example, one second measuring unit 7 may be arranged on the side surface 2b of the mold 2, and two second measuring units 7 may be arranged on the side surface 2a of the mold 2, or the side surfaces 2a and 2a of the mold 2 may be arranged. Two second measuring units 7 may be arranged for each of the above.

FIG. 3 is a block diagram showing a control system for correcting the shape of the mold 2 in the control unit 15. Such a control system is composed of a force control loop (minor loop) for performing force control and a position control loop (major loop) for performing position control.

As will be described later, the force control loop controls the operation amount input to the actuator 5 based on the force target value corresponding to the force to be applied to the side surface of the mold 2 by the actuator 5 and the output of the first measuring unit 6. (Functions as a control unit). Further, the position control loop converts the difference between the position target value corresponding to the position where the mold 2 should be located in the mold holding unit 4 and the output of the second measuring unit 7 into a force operation amount and inputs it to the force control loop. (Functions as an input unit). Then, the force control loop controls the operation amount input to the actuator 5 based on the operation amount input from the position control loop.

First, the force control loop will be described. The force control loop is configured independently for each of the actuators 5 (16 axes in this embodiment). The shape target value for forming the mold 2 into a desired shape is input to the force target value generation unit 301 as a correction amount (deformation amount) for each shape component such as magnification, skew, trapezoid, and spool. The shape target value may be, for example, a correction amount for correcting a shape error obtained from the result of measuring the pattern formed on the substrate 8 by the imprint process with a measuring device such as SEM. Further, the shape target value may be a correction amount for correcting the relative error between the mold 2 and the substrate 8 measured by the alignment measuring unit 11. Further, the shape target value may be a correction amount that combines both the shape error and the relative error.

The force target value generation unit 301 generates a force target value corresponding to the force to be applied to the side surface of the mold 2 by each of the actuators 5 based on the input shape target value. The force target value is a unit system of force, and is generated for each of the actuators 5 (16 axes in this embodiment) according to the following equation (1).

In the equation (1), the matrix [r] is a matrix composed of n elements of deformation components decomposed into magnification, skew, trapezoid, pincushion, and the like. The matrix [f] is an element of a force target value (compressive force) for the feedback control system of the actuator 5, and is a matrix composed of m elements corresponding to the number of actuators 5. The matrix [A] is a matrix composed of m × n elements for determining the force target value [f] from the deformation component [r], and is the shape of the mold 2, Young's modulus, Poisson's ratio, and the mold holding portion 4. Is a parameter determined by the frictional force generated by holding the mold 2. The matrix [A] is obtained in advance by simulation. Specifically, the amount of deformation of the pattern 20 of the mold 2 when a force corresponding to the force target value [f] is applied to the side surface of the mold 2 is obtained by a known method such as the finite element method (FEA), and each deformation The component [r] is calculated. This process is performed while changing the force target value [f], and from the force target value [f] (matrix element) and its deformation component [r] (matrix element), a matrix is used using the least squares method or the like. [A] is determined. Although the equation (1) corresponds to a system of equations of the first order, the equation (1) may be developed to increase the order in order to correct the shape of the mold 2 with high accuracy.

The force target value generated by the force target value generation unit 301 is input to the compensator 302 as a difference (deviation) from the output (force applied from the actuator 5 to the side surface of the mold 2) of the first measurement unit 6. .. The compensator 302 includes a PID controller and a filter (low-pass filter, notch filter) used in general feedback control. The manipulated variable output from the compensator 302 is amplified via a driver 303 such as a current amplifier and input to the actuator 5. The actuator 5 applies a force (force for deforming the mold 2) according to the amount of operation from the compensator 302 to the side surface of the mold 2. The force applied to the side surface of the mold 2 from the actuator 5 is measured by the first measuring unit 6, and is used to obtain the deviation input to the compensator 302 as described above.

Next, the position control loop will be described. The second measuring unit 7 measures the positions X1 and X2 on the side surface of the mold 2 in the X-axis direction and the position Y on the side surface of the mold 2 in the Y-axis direction, and outputs them to the coordinate conversion unit 305. The coordinate conversion unit 305 outputs the outputs (positions X1 and X2, position Y) of the second measurement unit 7 to the position shift X of the mold 2 in the X-axis direction, the position shift Y of the mold 2 in the Y-axis direction, and the rotation of the mold 2. Convert to directional misalignment Qz. For example, the displacement X of the mold 2 in the X-axis direction is the average value of the positions X1 and X2 measured by the second measuring unit 7, and the displacement Y of the mold 2 in the Y-axis direction is defined by the second measuring unit 7. Let it be the measured position Y. Further, the position deviation Qz in the rotation direction of the mold 2 is obtained by dividing the difference between the position X1 and the position X2 by the mounting pitch (distance in the Y-axis direction) of the second measuring unit 7 that measures these.

On the other hand, when the mold 2 is deformed by the actuator 5 so that the shape of the pattern 20 of the mold 2 becomes the target shape, the displacement of the deformed component is included in the output of the second measuring unit 7 as a position error. Therefore, in the present embodiment, the position of the side surface of the mold 2 in a state where the actuator 5 applies a force corresponding to the force target value to the side surface of the mold 2 is set as a unit system of the positional deviations X, Y, and Qz, such as a memory. It is stored in the storage unit 306 of. For example, in the control system shown in FIG. 3, a calculation unit is provided to calculate the position (displacement) of the side surface of the mold 2 in a state where the mold 2 is deformed by the actuator 5, and the position of the side surface of the mold 2 calculated by the calculation unit is provided. Is stored in the storage unit 306 as a position target value. Further, the position of the side surface of the mold 2 measured by the second measuring unit 7 in the state where the mold 2 is deformed by the actuator 5 may be stored in the storage unit 306 as a position target value. The position target value corresponds to the position where the mold 2 should be located in the mold holding portion 4.

The positional deviations X, Y, and Qz output from the coordinate conversion unit 305 are input to the compensator 307 as a difference (positional deviation) from the position target value. Such a position deviation corresponds to the difference between the position target value corresponding to the position where the mold 2 should be located in the mold holding unit 4 and the output of the second measuring unit 7. The compensator 307 includes a PID controller, a filter (low-pass filter, a notch filter), and the like, like the compensator 302.

The position manipulation amount output from the compensator 307 is input to the force conversion unit 308. The force conversion unit 308 converts the position operation amount from the compensator 307 into a force operation amount, and inputs the position operation amount to the force control loop as a force correction amount which is a unit system of force. The force conversion unit 308 inputs (distributes) a force correction amount to the force control loop so as to be added to the force target value in each force control loop or the output of the first measurement unit 6.

Since the principle of superposition is established for the correction of the position of the mold 2, the distribution of the force correction amount can be expressed by the following equation (2). In the equation (2), the matrix [B] is a matrix composed of m × 3 elements. m corresponds to the number of force control loops (the number of actuators 5). The matrix [cf] is a force correction amount input to the force control loop, and is composed of m elements.

In the present embodiment, the force correction amount from the force conversion unit 308 is added to the force target value in each force control loop or the output of the first measurement unit 6, thereby making the position control loop a major loop and the force control loop. It is a minor loop. However, by configuring a loop in which the force correction amount of the position control loop is added to the operation amount from the compensator 302 in the force control loop, the force control loop can be made a major loop and the position control loop can be made a minor loop. Good.

The operation of the imprint device 100 will be described with reference to FIG. In the imprint device 100, the force control loop and the position control loop may be always enabled, or the position control loop may be enabled as needed. The case where the position control loop is enabled as needed will be described below.

In S401, the amount of deformation of the mold 2 is initialized. Specifically, the mold 2 carried into the imprint device 100 is held by the mold holding unit 4, and a force corresponding to the initial value is applied from the actuator 5 to the side surface of the mold 2. At this time, the force control loop is enabled to deform the mold 2, and the position control loop is disabled.

In S402, the mold 2 is deformed by applying a force from the actuator 5 to the side surface of the mold 2 so that the shape of the pattern 20 of the mold 2 becomes the target shape.

In S403, the position control loop is enabled. Specifically, in a state where the actuator 5 applies a force to the side surface of the mold 2 (S403), the position of the mold 2 is measured by the second measuring unit 7. Then, the positional deviations X, Y, and Qz of the mold 2 are obtained from the measurement results of the second measuring unit 7, and stored in the storage unit 306 as the position target values. As a result, the displacement of the mold 2 caused by disturbance or the like is measured as a displacement based on the position target value, and the displacement is corrected.

In S404, the stamping process is performed. Specifically, the mold 2 and the substrate 8 are brought relatively close to each other, and the mold 2 and the imprint material supplied on the substrate are brought into contact with each other. Then, the substrate stage 9 is moved to align the mold 2 with the substrate 8. In S405, a hardening treatment is performed. Specifically, in a state where the mold 2 and the imprint material on the substrate are in contact with each other, the imprint material on the substrate is cured by irradiating ultraviolet rays from the irradiation unit 1. In S406, the mold release process is performed. Specifically, the mold 2 and the substrate 8 are relatively separated from each other, and the mold 2 is separated from the cured imprint material on the substrate.

In S404 to S406, since the mold 2 is in contact with the impregnating material on the substrate, the force generated by the imprinting process and the mold release process and the force generated by moving the substrate stage 9 in the alignment are the force generated by the mold 2. It becomes a disturbance to. However, in the present embodiment, by enabling the position control loop, it is possible to suppress the misalignment of the mold 2 due to such disturbance.

In S407, it is determined whether or not the imprint processing has been performed on all the shot areas of the substrate 8. When the imprint processing is performed on all the shot areas of the substrate 8, the operation of the imprint device 100 is terminated. On the other hand, when the imprint processing is not performed on all the shot areas of the substrate 8, the process proceeds to S408. In S408, the position control loop is invalidated, and the process shifts to S402 in order to perform imprint processing in the next shot area.

In FIG. 4, S404, S405 and S406 may be performed only by the force control loop without enabling the position control loop in S403. However, at the timing of S403, the position of the mold 2 is measured while the actuator 5 is applying a force to the side surface of the mold 2, and the positional deviations X, Y, and Qz of the mold 2 are obtained, and the storage unit 306 is used as the position target value. Remember in. In other words, each time the imprinting process for one shot area of the substrate 8 is completed, the position of the mold 2 measured by the second measuring unit 7 in a state where the actuator 5 applies a force to the side surface of the mold 2. Store as a position target value. In this case, the positional deviation of the mold 2 that occurred in S404, S405, and S406 cannot be corrected, but since the position target value is stored in S403, the position control loop can be enabled at the timing of S407. The mold 2 can be returned to its original position. After that, the position control loop is invalidated, and the imprint process for each shot area of the substrate 8 is repeated.

For example, it has been confirmed that the misalignment of the mold 2 with respect to the mold holding portion 4 tends to occur in one direction by repeating the imprint process. If the direction in which the position shift of the mold 2 occurs is known in advance, the position error in alignment can be reduced by correcting the initial position (dive position) of the substrate stage 9. However, the positional error between the mold 2 and the mold holding portion 4 is accumulated each time the imprinting process is repeated, and the frictional force between the mold 2 and the mold holding portion 4 causes unintended deformation (distortion) of the mold 2. Will cause. Such distortion of the mold 2 becomes a factor of lowering the overlay accuracy. In the present embodiment, since the positional deviation of the mold 2 can be corrected each time the imprint processing is performed on one shot region, it is possible to reduce the unintended deformation of the mold 2 as described above.

The pattern of the cured product formed by using the imprint device 100 is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The cured product pattern is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching or ion implantation in the substrate processing process.

Next, a specific manufacturing method of the article will be described. As shown in FIG. 5A, a substrate 8 such as a silicon wafer on which a work material such as an insulator is formed on the surface is prepared, and subsequently, an imprint material is printed on the surface of the work material by an inkjet method or the like. Is given. Here, a state in which a plurality of droplet-shaped imprint materials are applied onto the substrate is shown.

As shown in FIG. 5B, the imprint mold 2 is opposed to the imprint material on the substrate with the side on which the uneven pattern is formed facing the imprint material. As shown in FIG. 5C, the substrate 8 to which the imprint material is applied is brought into contact with the mold 2 to apply pressure. The imprint material is filled in the gap between the mold 2 and the material to be processed. When light is irradiated through the mold 2 as energy for curing in this state, the imprint material is cured.

As shown in FIG. 5D, when the mold 2 and the substrate 8 are separated from each other after the imprint material is cured, a pattern of the cured product of the imprint material is formed on the substrate. The pattern of the cured product has a shape in which the concave portion of the mold 2 corresponds to the convex portion of the cured product and the convex portion of the mold 2 corresponds to the concave portion of the cured product, that is, the uneven pattern of the mold M is formed on the imprint material. It has been transcribed.

As shown in FIG. 5 (e), when etching is performed using the pattern of the cured product as an etching-resistant mask, the portion of the surface of the material to be processed that has no cured product or remains thin is removed to form a groove. .. As shown in FIG. 5 (f), when the pattern of the cured product is removed, an article having grooves formed on the surface of the material to be processed can be obtained. Here, the pattern of the cured product is removed, but it may be used as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article, without being removed even after processing.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

100: Imprint device 2: Mold 4: Mold holding unit 5: Actuator 6: First measuring unit 7: Second measuring unit 8: Substrate 15: Control unit

Claims (7)

An imprinting device that forms a pattern of imprinting material on a substrate using a mold.
A holding part that holds the mold and
An actuator that applies a force to the side surface of the mold held by the holding portion,
A first measuring unit that measures the force applied to the side surface of the mold from the actuator, and
A second measuring unit that measures the position of the mold held by the holding unit, and
A control unit that controls an operation amount input to the actuator based on a force target value corresponding to a force to be applied to the side surface of the mold by the actuator and an output of the first measurement unit.
The holding unit has an input unit that converts the difference between the position target value corresponding to the position where the mold should be located and the output of the second measuring unit into a force operation amount and inputs it to the control unit. ,
The control unit controls the operation amount input to the actuator based on the operation amount input from the input unit .
The imprint device, characterized in that the position target value corresponds to the position of the mold in a state where the actuator applies a force corresponding to the force target value to the side surface of the mold . The imprint device according to claim 1, wherein the input unit includes a storage unit that stores the position target value. The input unit includes a calculation unit that calculates the position of the mold in the state.
The imprint device according to claim 2 , wherein the storage unit stores the position of the side surface of the mold calculated by the calculation unit as the position target value. The imprint device according to claim 2 , wherein the storage unit stores the position of the mold measured by the second measurement unit in the state as the position target value. A plurality of shot regions are formed on the substrate.
Each time the storage unit forms a pattern of the imprint material with respect to one shot region of the substrate, the storage unit stores the position of the mold measured by the second measurement unit in the state as the position target value. The imprinting apparatus according to claim 4 . The second measuring unit has at least three measuring axes for measuring the positions of two points on the first side surface of the mold and the positions of one point on the second side surface orthogonal to the first side surface of the mold. The imprinting apparatus according to any one of claims 1 to 5 , further comprising. A step of forming a pattern on a substrate by using the imprinting apparatus according to any one of claims 1 to 6 .
A step of processing the substrate on which the pattern is formed in the step and a step of processing the substrate.
A method of manufacturing an article, which comprises.

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