JP7029900B2 - Manufacturing method of die bonding equipment and semiconductor equipment - Google Patents

Description

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonding apparatus having a void detection function.

As part of the manufacturing process of semiconductor devices, there is a process of mounting a semiconductor chip (hereinafter, simply referred to as a die) on a wiring board, a lead frame, etc. (hereinafter, simply referred to as a substrate) and assembling a package. Partly, there is a step of dividing a die from a semiconductor wafer (hereinafter, simply referred to as a wafer) and a bonding step of mounting the divided die on a substrate. The semiconductor manufacturing device used in the bonding process is a die bonding device such as a die bonder.

A die bonder is a device that uses solder, gold plating, or resin as a bonding material to bond (mount and bond) a die onto a substrate or a die that has already been bonded. In a die bonder that bonds a die to the surface of a substrate, for example, the die is sucked from a wafer using a suction nozzle called a collet, picked up, transported onto the substrate, and a pressing force is applied to heat the bonding material. By doing so, the operation (work) of performing bonding is repeated. The collet is a holder having suction holes, sucking air, and sucking and holding the die, and has the same size as the die.

In the die bonder, in order to recognize the position of the die or inspect the appearance, the die is irradiated with scattered light to perform imaging (for example, Japanese Patent Application Laid-Open No. 2008-66452). In addition, void detection is performed offline (outside the die bonder) using a SAT (ultrasonic image pickup device).

Japanese Unexamined Patent Publication No. 2008-66452

When scattered light is used for visual inspection of dies, it is difficult to recognize unevenness due to voids.
An object of the present disclosure is to provide a die bonding apparatus capable of recognizing voids.
Other issues and novel features will become apparent from the description and accompanying drawings herein.

The following is a brief overview of the representative ones of this disclosure.
That is, the die bonding apparatus includes a bonding unit having a bonding head for bonding the die on a substrate or a die that has already been bonded, an imaging unit that images the bonded die, and the bonded die and the imaging unit. It includes an illumination unit arranged on a line connecting the two, and a control unit that controls the bonding unit, the image pickup unit, and the illumination unit. When the position inspection of the die is performed, the control unit irradiates the die with diffused light from the illumination unit, and when the void of the die is detected, the control unit irradiates the die with parallel light from the illumination unit, and the image pickup unit irradiates the die. Take an image.

According to the die bonding apparatus, the void can be recognized.

Schematic top view showing a configuration example of a die bonder FIG. 1 is a diagram illustrating a schematic configuration when viewed from the direction of arrow A. External perspective view showing the configuration of the die supply unit of FIG. Schematic cross-sectional view showing the main part of the die supply part of FIG. The block diagram which shows the schematic structure of the control system of the die bonder of FIG. A flowchart illustrating a die bonding process in the die bonder of FIG. The figure for demonstrating the optical system of the die supply part of FIG. The figure for demonstrating the optical system of the bonding part of FIG. The figure which shows the image of the die which crimping to a substrate is insufficient The figure explaining the captured image of FIG. The figure for demonstrating another example of the optical system of the bonding part of FIG. A diagram for explaining the case where a void is detected by a void recognition camera.

The semiconductor manufacturing apparatus according to the embodiment uses diffused light and parallel light as the light source of the optical system, and detects unevenness due to voids with parallel light. Voids can be detected in a non-contact and in-line manner on thin dies (thickness of 50 μm or less) that are susceptible to voids. The amount of offline SAT confirmation work can be reduced. In SAT, pretreatment such as immersing the die-bonded substrate in water is required, and the substrate becomes a defective product.

Hereinafter, examples and modifications will be described with reference to the drawings. However, in the following description, the same components may be designated by the same reference numerals and repeated description may be omitted. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is just an example, and the interpretation of the present invention is used. It is not limited.

FIG. 1 is a top view showing an outline of a die bonder according to an embodiment. FIG. 2 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 1.

The die bonder 10 is roughly divided into a supply unit 1 for supplying a die D for mounting a product area (hereinafter referred to as a package area P) which is one or a plurality of final packages on a printed substrate S, and a pickup unit 2. It has an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a substrate supply unit 6, a substrate unloading unit 7, and a control unit 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is arranged on the front side of the die bonder 10, and the bonding unit 4 is arranged on the back side.

First, the die supply unit 1 supplies the die D to be mounted in the package area P of the substrate S. The die supply unit 1 has a wafer holding table 12 for holding the wafer 11 and a push-up unit 13 indicated by a dotted line for pushing up the die D from the wafer 11. The die supply unit 1 is moved in the XY direction by a drive means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction, and each drive unit (not shown) that moves the collet 22 up / down, rotates, and moves in the X direction. , Have. The pickup head 21 has a collet 22 (see also FIG. 2) that attracts and holds the pushed-up die D to the tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has each drive unit (not shown) that raises and lowers, rotates, and moves the collet 22 in the X direction.

The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it on the package area P of the substrate S to be conveyed, or laminates it on the die already bonded on the package area P of the substrate S. Bond in shape. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) that attracts and holds the die D to the tip like the pickup head 21, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and a substrate. It has a substrate recognition camera 44 that captures a position recognition mark (not shown) of the package area P of S and recognizes the bonding position.
With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the image pickup data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and makes the substrate based on the image pickup data of the substrate recognition camera 44. Die D is bonded to.

The transport unit 5 has a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 to which the substrate S moves. The substrate S moves by driving a nut (not shown) of the substrate transport claw 51 provided in the transport lane 52 with a ball screw (not shown) provided along the transport lane 52.
With such a configuration, the substrate S moves from the substrate supply unit 6 to the bonding position along the transfer lane 52, and after bonding, moves to the substrate unloading unit 7 and passes the substrate S to the substrate unloading unit 7.

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the die bonder 10, and a central processing unit (CPU) for executing the program stored in the memory.

Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram showing an external perspective view of the die supply unit. FIG. 4 is a schematic cross-sectional view showing a main part of the die supply part.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction) and a push-up unit 13 that moves in the vertical direction. The wafer holding table 12 has an expanding ring 15 for holding the wafer ring 14 and a support ring 17 for horizontally positioning the dicing tape 16 held on the wafer ring 14 and to which a plurality of dies D are adhered. The push-up unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expanding ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held in the wafer ring 14 is stretched to widen the interval between the dies D, and the push-up unit 13 pushes up the die D from below the die D to improve the pick-up property of the die D. The adhesive that adheres the die to the substrate as it becomes thinner changes from a liquid to a film, and a film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. There is. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. In the following, the description will be made ignoring the existence of the die attach film 18.

The die bonder 10 has a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, a stage recognition camera 32 that recognizes the posture of the die D mounted on the intermediate stage 31, and a mounting position on the bonding stage BS. It has a board recognition camera 44 for recognizing. It is the stage recognition camera 32 involved in the pickup by the bonding head 41 and the substrate recognition camera 44 involved in bonding to the mounting position by the bonding head 41 that must correct the posture deviation between the recognition cameras. In this embodiment, the substrate recognition camera 44 is used to detect the void of the die D.

The control unit 8 will be described with reference to FIG. FIG. 5 is a block diagram showing a schematic configuration of the control system. The control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 is roughly divided into a control / arithmetic unit 81 mainly composed of a CPU (Central Processor Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 is an auxiliary storage device 82b composed of a main storage device 82a composed of a RAM for storing a processing program and the like, and an HDD for storing control data, image data, and the like necessary for control. And have. The input / output device 83 includes a monitor 83a for displaying the device status and information, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor, and an image capture device 83d for capturing image data from the optical system 88. And have. Further, the input / output device 83 includes a motor control device 83e that controls a drive unit 86 such as an XY table (not shown) of the die supply unit 1 and a ZZ drive shaft of a bonding head table, various sensor signals, lighting devices, and the like. It has an I / O signal control device 83f that captures or controls a signal from a signal unit 87 such as a switch of the above. The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 32, and a substrate recognition camera 44. The control / arithmetic unit 81 takes in necessary data via the bus line 84, performs arithmetic operations, controls the pickup head 21 and the like, and sends information to the monitor 83a and the like.

The control unit 8 stores the image data captured by the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 in the storage device 82 via the image acquisition device 83d. Using the software programmed based on the stored image data, the control / arithmetic unit 81 is used to position the package area P of the die D and the substrate S, and to inspect the surface of the die D and the substrate S. The drive unit 86 is moved by software via the motor control device 83e based on the positions of the die D and the package area P of the board S calculated by the control / arithmetic unit 81. By this process, the die on the wafer is positioned and operated by the drive unit of the pickup unit 2 and the bonding unit 4 to bond the die D onto the package area P of the substrate S. The wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 to be used are grayscale, color, or the like, and the light intensity is quantified.

FIG. 6 is a flowchart illustrating a die bonding process in the die bonder of FIG.
In the die bonding step of the embodiment, first, the control unit 8 takes out the wafer ring 14 holding the wafer 11 from the wafer cassette and places it on the wafer holding table 12, and the wafer holding table 12 is picked up by the die D. It is conveyed to the reference position where it is performed (wafer loading (process P1)). Next, the control unit 8 makes fine adjustments so that the arrangement position of the wafer 11 exactly matches the reference position from the image acquired by the wafer recognition camera 24.

Next, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch and holds it horizontally, thereby arranging the die D to be picked up first at the pickup position (die transfer). (Step P2)). The wafer 11 is inspected in advance for each die by an inspection device such as a prober, and map data indicating good or bad is generated for each die and stored in the storage device 82 of the control unit 8. Whether the die D to be picked up is a good product or a defective product is determined by the map data. When the die D is a defective product, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch, arranges the die D to be picked up next at the pickup position, and arranges the defective product. Die D is skipped.

The control unit 8 photographs the main surface (upper surface) of the die D to be picked up by the wafer recognition camera 24, and calculates the amount of displacement of the die D to be picked up from the pickup position from the acquired image. The control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed based on this amount of misalignment, and accurately arranges the die D to be picked up at the pickup position (die positioning (process P3)).

Next, the control unit 8 performs a surface inspection (appearance inspection) of the die D from the image acquired by the wafer recognition camera 24 (step P4). Here, the control unit 8 determines whether or not there is a problem in the surface inspection, and if it is determined that there is no problem on the surface of the die D, the process proceeds to the next step (step P9 described later), but it is determined that there is a problem. In that case, the surface image is visually confirmed, or a high-sensitivity inspection or an inspection with different lighting conditions is performed. If there is a problem, skip processing is performed, and if there is no problem, the next step processing is performed. In the skip process, steps P9 and subsequent steps of the die D are skipped, the wafer holding table 12 on which the wafer 11 is placed is moved by a predetermined pitch, and the die D to be picked up next is arranged at the pickup position.

The control unit 8 places the substrate S on the transport lane 52 in the substrate supply unit 6 (board loading (process P5)). The control unit 8 moves the substrate transfer claw 51 that grabs and conveys the substrate S to the bonding position (board transfer (process P6)).

The board is imaged by the board recognition camera 44 and positioned (board positioning (process P7)).

Next, the control unit 8 inspects the surface of the package area P of the substrate S from the image acquired by the substrate recognition camera 44 (step P8). Here, the control unit 8 determines whether or not there is a problem in the surface inspection, and if it is determined that there is no problem on the surface of the package area P of the substrate S, the process proceeds to the next step (step P9 described later), but there is a problem. If it is determined to be present, the surface image is visually checked, or a high-sensitivity inspection or an inspection with different lighting conditions is performed. If there is a problem, skip processing is performed. If there is no problem, the next step is performed. Perform processing. In the skip process, steps P10 and subsequent steps to the corresponding tab in the package area P of the substrate S are skipped, and defects are registered in the substrate construction start information.

The control unit 8 picks up the die D from the dicing tape 16 by the pickup head 21 including the collet 22 after accurately arranging the die D to be picked up at the pickup position (die handling (process P9)), and puts it on the intermediate stage 31. Place it (step P10). The control unit 8 detects the posture deviation (rotational deviation) of the die placed on the intermediate stage 31 with the stage recognition camera 32 (step P11). When there is a posture deviation, the control unit 8 rotates the intermediate stage 31 on a plane parallel to the mounting surface having the mounting position by a turning drive device (not shown) provided in the intermediate stage 31 to correct the posture deviation.

The control unit 8 picks up the die D from the intermediate stage 31 by the bonding head 41 including the collet 42, and bonds (crimps) the die D to the package area P of the substrate S or the die already bonded to the package area P of the substrate S (crimping). Diatouch (process P11)).

After bonding the die D, the control unit 8 inspects whether the bonding position is accurate (relative position inspection between the die and the substrate (step P12)). At this time, the center of the die and the center of the tab are obtained in the same manner as the alignment of the die, and it is inspected whether the relative position is correct.

Next, the control unit 8 inspects the surfaces of the die D and the substrate S from the image acquired by the substrate recognition camera 44 (step P13). Here, the control unit 8 determines whether or not there is a problem in the surface inspection, and if it is determined that there is no problem on the surface of the bonded die D, the process proceeds to the next step (step P9 described later), but there is a problem. If it is determined that the surface image is visually confirmed, or a high-sensitivity inspection or an inspection with different lighting conditions is performed, if there is a problem, skip processing is performed, and if there is no problem, the next process processing is performed. I do. In the skip process, defects are registered in the board construction start information.

Next, the control unit 8 switches the irradiation light of the lighting device of the substrate recognition camera 44 to acquire an image, and performs a void inspection of the die D from the acquired image (step P14). Here, if there is a problem in the void inspection of the die, the control unit 8 re-crimps (step P15). In this case, the position of the bonding head 41 is shifted in consideration of the positions of voids and curls, and re-crimping is performed. If there is no problem in the void inspection of the die, perform the next step without re-crimping.

After that, the dies D are bonded to the package area P of the substrate S one by one according to the same procedure. When the bonding of one substrate is completed, the substrate S is moved to the substrate unloading section 7 by the substrate transport claw 51 (board transfer (process P16)), and the substrate S is passed to the substrate unloading section 7 (board unloading (process P17). )).

After that, the dies D are peeled off from the dicing tape 16 one by one according to the same procedure (step P9). When the pickup of all the dies D except the defective products is completed, the dicing tape 16 and the wafer ring 14 and the like holding the dies D in the outer shape of the wafer 11 are unloaded to the wafer cassette (step P18).

First, the wafer recognition camera will be described with reference to FIG. 7. FIG. 7 is a diagram for explaining the optical system of the die supply unit, and shows the arrangement of the wafer recognition camera and the lighting device that irradiates the die with light for image capture.
The wafer recognition camera 24 includes a camera body 241 and a lens 242, and is configured to capture an image of the main surface of the die D.
A lighting device 25 having a surface emitting illumination (light source) 251 and a half mirror (semi-transmissive mirror) 254 inside is arranged between the lens 242 on the line connecting the camera body 241 and the die D and the die D. There is. The diffused light, which is the irradiation light from the surface emission illumination 251, is reflected by the half mirror 254 on the same optical axis as the camera body 241 and is applied to the die D. The scattered light radiated to the die D on the same optical axis as the camera body 241 is reflected by the die D, and the specularly reflected light of the scattered light passes through the half mirror 254 and reaches the camera body 241 to form the image of the die D. do. That is, the lighting device 25 has a function of coaxial epi-illumination (coaxial lighting).

The surface emitting illumination 251 in the lighting device 25 is a surface emitting type LED light source, and includes an LED substrate 252 having LEDs arranged in a plane and a diffuser plate 253 provided facing the LED substrate 252 on the die D. Is irradiated with diffused light.

Although the wafer recognition camera 24 and its illuminating device 25 have been described, the same applies to the stage recognition camera 32 and its illuminating device.

Next, the substrate recognition camera will be described with reference to FIG. FIG. 8 is a diagram for explaining the optical system of the bonding portion, and shows the arrangement of the substrate recognition camera and the lighting device that irradiates the die with light for image capture.
The substrate recognition camera 44 includes a camera body 441 and a lens 442, and is configured to capture an image of the main surface of the die D.
A lighting device 45 having a surface emitting illumination (light source) 451 and a half mirror (semi-transmissive mirror) 452 inside is arranged between the lens 442 on the line connecting the camera body 441 and the die D and the die D. There is. The irradiation light from the surface emission illumination 451 is reflected by the half mirror 454 on the same optical axis as the camera body 441, and is applied to the die D. The scattered light radiated to the die D on the same optical axis as the camera body 441 is reflected by the die D, and the specularly reflected light of the scattered light passes through the half mirror 454 and reaches the camera body 441 to form the image of the die D. do. That is, the lighting device 45 has a function of coaxial epi-illumination (coaxial lighting).

The lens 442 includes a surface emitting illumination (light source) 443 and a half mirror (semi-transmissive mirror) 444 inside, and the irradiation light from the surface emitting illumination 443 is reflected by the half mirror 444 on the same optical axis as the camera body 441. In-lens coaxial illumination that illuminates the die D as parallel light. The surface emitting illumination 443 is a surface emitting type LED light source.

The surface light emitting illumination 451 in the lighting device 45 is a surface emitting type LED light source, and includes an LED substrate 452 having LEDs arranged in a plane and a diffuser plate 453 provided facing the LED substrate 452 on the die D. Is irradiated with diffused light.

The parallel light from the surface emission illumination 443 and the diffused light from the surface emission illumination 451 are switched and irradiated to the die D, and when a void is detected, the parallel light is irradiated to the die D, and the alignment and appearance inspection other than the void are inspected. In the case of, diffused light is applied to the die D.

The detection of voids by parallel light will be described with reference to FIGS. 9 and 10. FIG. 9 is an image of a die that is not sufficiently crimped to the substrate, FIG. 9 (A) is an image of an image obtained by irradiating a die having a void with parallel light, and FIG. 9 (B) is an image of a die having a curl. It is an image taken by parallel irradiation. 10 is a diagram illustrating the captured image of FIG. 9, FIG. 10 (A) is a schematic diagram of FIG. 9 (A), FIG. 10 (B) is a schematic diagram of FIG. 9 (B), and FIG. 10 (C) is a diagram. 10 (A) is a schematic cross-sectional view taken along line A1-A2, and FIG. 10 (D) is a schematic cross-sectional view taken along line B1-B2 of FIG. 10 (B).

As shown in FIGS. 9A and 9B, the captured image of the portion having voids and curls is black. As shown in FIGS. 10 (C) and 10 (D), the surface of the thin die becomes convex due to the void, and the thin die causes the die to roll up if the crimping is not sufficient. This is because the reflected light does not return. Therefore, when the die has a portion that is not parallel to the substrate, the portion can be imaged in black and detected by irradiating with parallel light.

<Modification example>
Hereinafter, typical modifications will be illustrated. In the following description of the modified example, the same reference numerals as those in the above-described embodiment may be used for the portions having the same configuration and function as those described in the above-described embodiment. As for the explanation of such a portion, the explanation in the above-described embodiment can be appropriately incorporated within a technically consistent range. Further, a part of the above-described embodiment and all or a part of the modified example may be appropriately and combinedly applied within a technically consistent range.

(Modification 1)
In the substrate recognition camera, another example of switching between parallel light and diffused light will be described with reference to FIG. FIG. 11 is a diagram for explaining the optical system of the bonding portion, and shows the arrangement of the substrate recognition camera and the lighting device that irradiates the die with light for image capture. 11 (A) is a side view, and FIG. 11 (B) is a side view seen from a position rotated by 90 degrees with respect to FIG. 11 (A).
The substrate recognition camera 44A includes a camera body 441 and a lens 442A, and is configured to capture an image of the main surface of the die D.
A lighting device 45A having a surface emitting illumination (light source) 451A and a half mirror (semi-transmissive mirror) 454 inside is arranged between the lens 442A and the die D on the line connecting the camera body 441 and the die D. There is. The irradiation light from the surface emission illumination 451 is reflected by the half mirror 454 on the same optical axis as the camera body 441, and is applied to the die D. The scattered light radiated to the die D on the same optical axis as the camera body 441 is reflected by the die D, and the specularly reflected light of the scattered light passes through the half mirror 454 and reaches the camera body 441 to form the image of the die D. do. That is, the lighting device 45 has a function of coaxial epi-illumination (coaxial lighting).

The surface emitting illumination 451 in the lighting device 45A is a surface emitting type LED light source, and includes an LED substrate 452 having LEDs arranged in a plane and a diffuser plate 453 provided facing the LED substrate 452. As shown in FIG. 11B, the diffuser plate 453A can be slid to the left and right, and when the diffuser plate 453A is located on the left side, the die D is irradiated with diffused light. When the diffuser plate 453A is located on the right side, the die D is irradiated with parallel light.

(Modification 2)
A case where the void detection is performed at a station different from the bonding station will be described with reference to FIG. FIG. 12 is a conceptual plan view illustrating a case where a void is detected by a void recognition camera.

The solid arrow indicates the movement of the pickup head or the bonding head, and the broken line indicates the movement of the board recognition camera and the void recognition camera. The bonding head 41, the substrate recognition camera 44, and the void recognition camera 46 move in the Y-axis direction on the substrate.

After die bonding (after position inspection and surface inspection), the substrate S to which the die D is bonded is moved to a station (void detection station VS) next to the bonding station and irradiated with parallel light to check only the void. The void recognition camera 46 has, for example, a configuration having only the substrate recognition camera 44 of FIG. 8 and no lighting device 45, or a lighting device 45A having no substrate recognition camera 44A and a diffuser plate 453A of FIG. It is a composition. Lighting switching between the first embodiment and the first modification can be performed at high speed, and it is not necessary to use a separate station if only the image acquisition time is required, but it is effective when higher productivity is required.

Although the invention made by the present inventor has been specifically described above based on the embodiments and examples, the present invention is not limited to the above embodiments and examples, and can be variously modified. Not to mention.

For example, in the embodiment, the die appearance inspection recognition is performed after the die position recognition, but the die position recognition may be performed after the die appearance inspection recognition.
Further, in the embodiment, imaging by irradiating diffused light (die position recognition, die appearance inspection recognition) and then imaging by irradiating parallel light (void inspection recognition) are performed, but after void inspection recognition, die position recognition and die Appearance inspection recognition may be performed.
Further, in the embodiment, the DAF is attached to the back surface of the wafer, but the DAF may not be present.
Further, in the embodiment, one pickup head and one bonding head are provided, but two or more of each may be provided. Further, although the intermediate stage is provided in the embodiment, the intermediate stage may not be provided. In this case, the pickup head and the bonding head may be used in combination.

10 ... Die bonder 1 ... Die supply unit 13 ... Push-up unit 2 ... Pickup unit 24 ... Wafer recognition camera 3 ... Alignment unit 31 ... Intermediate stage 32 ... Stage recognition Camera 4 ... Bonding part 41 ... Bonding head 42 ... Collet 44 ... Board recognition camera 442 ... Lens 443 ... Plateau 444 ... Half mirror 5 ... Transport part 51 ...・ Board transfer claw 8 ・ ・ ・ Control unit S ・ ・ ・ Board BS ・ ・ ・ Bonding stage D ・ ・ ・ Die P ・ ・ ・ Package area 45 ・ ・ ・ Lighting unit 451 ・ ・ ・ Light source 452 ・ ・ ・ LED board 453・ ・ ・ Diffuse plate 454 ・ ・ ・ Half mirror

Claims (11)

A bonding unit having a bonding head that bonds the die onto a substrate or a die that has already been bonded,
An image pickup unit that captures images of the bonded die, and
An illumination unit arranged on a line connecting the bonded die and the image pickup unit,
A control unit that controls the bonding unit, the imaging unit, and the lighting unit,
Equipped with
When the position inspection of the die is performed, the control unit irradiates the die with diffused light from the illumination unit, and when the void of the die is detected, the control unit irradiates the die with parallel light from the illumination unit, and the image pickup unit irradiates the die. Die bonding device for imaging. In claim 1,
The illuminating unit includes a first illuminating unit that irradiates the parallel light and a second illuminating unit that irradiates the diffused light, and is a die bonding device that switches between the first illuminating unit and the second illuminating unit to irradiate the illuminating unit. In claim 2,
Further, a lens unit is provided between the image pickup unit and the second illumination unit.
The lens unit has the first illumination unit.
The first illumination unit is a die bonding device that is a coaxial illumination having a half mirror arranged on the center line of the image pickup unit and surface emission illumination. In claim 3,
The second illumination unit is a die bonding device that is coaxial illumination having a half mirror arranged on the center line of the image pickup unit and surface emission illumination having a diffuser plate. In claim 2,
The illumination unit is a coaxial illumination having a half mirror arranged on the center line of the image pickup unit, a diffuser plate, and surface emission illumination.
The state in which the diffuser plate is moved from between the half mirror and the surface emitting illumination is the first illumination unit.
A die bonding device in which the diffuser plate is arranged between the half mirror and the surface emitting illumination is the second illumination unit. In claim 1, further
A die supply unit having a wafer ring holder for holding the dicing tape to which the die is attached, and a die supply unit.
The pickup head that picks up the die and
The intermediate stage on which the picked up die is placed and
Equipped with
The bonding unit is a die bonding device that picks up a die placed on the intermediate stage with the bonding head. In any one of claims 1 to 6 ,
When the control unit detects a void or curl, it is a die bonding device that re-bonds with the bonding head. In any one of claims 3 to 5,
The surface emitting illumination is a die bonding device that is a plane-arranged LED. (A) On a line connecting a bonding portion having a bonding head for bonding a die on a substrate or a die that has already been bonded, an imaging unit that images the bonded die, and the bonded die and the imaging unit. The control unit includes a lighting unit arranged in the dicing unit , a bonding unit, an image pickup unit, and a control unit that controls the illumination unit. A wafer ring holder that holds a dicing tape to which a die is attached to a die bonding device that irradiates the die by irradiating the die with parallel light from the illumination unit when the void of the die is detected and images the die by the image pickup unit. The process of carrying in and
(B) The process of bringing in the substrate and
(C) The process of picking up the die attached to the dicing tape and
(D) A step of bonding the picked-up die onto the substrate or a die that has already been bonded to the substrate.
Equipped with
The step (d) is
(D1) A step of irradiating the bonded die with diffused light from the lighting unit at the time of position inspection of the bonded die to image the bonded die by the imaging unit .
(D2) A step of irradiating the bonded die with parallel light from the lighting unit at the time of detecting the void of the bonded die to image the bonded die by the imaging unit .
A method for manufacturing a semiconductor device. In claim 9 .
In the step (c), the picked-up die is placed on an intermediate stage, and the picked-up die is placed on the intermediate stage.
The step (d) is a method for manufacturing a semiconductor device that picks up a die placed on the intermediate stage. In claim 9 .
The step (d) is a method for manufacturing a semiconductor device, further comprising (d3) a step of re-crimping the die when a void or curl is detected in the step (d2).

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