JP7556080B2 - Optical device and method for manufacturing optical device - Google Patents

Description

The present invention relates to an optical device and a method for manufacturing an optical device.

As an optical device and a manufacturing method thereof, for example, the optical device and the manufacturing method thereof described in Patent Document 1 are known. In this optical device, an optical element is mounted on a wiring substrate.

JP 2009-99680 A

The optical element, except for the light receiving portion that receives light, is sealed with, for example, black sealing resin that is difficult for light to transmit. The sealing resin is dripped in liquid form and pressed by the package components to fill the space between the optical element and the jetty portion. The light receiving portion is located in an opening formed in the sealing resin. A groove is provided around the light receiving portion to prevent the liquid sealing resin from flowing onto the light receiving portion (Figure 7 of Patent Document 1). The position of the groove roughly coincides with the edge of the opening.

On the other hand, there are cases where a sealing resin with an opening is formed by transfer molding using a mold die. In this case, even if a groove is provided at the edge of the opening as in the conventional example described above, it is possible that the liquid sealing resin will go over the groove and enter the opening.

The present invention aims to prevent the sealing resin from entering the position of the light receiving part when a mold die is used to form the sealing resin and an opening is formed to expose the light receiving part of the optical element.

The optical device according to the first aspect has an optical element having a light receiving portion on its surface, a wiring board on which the optical element is mounted and electrically connected to the optical element, a resin portion formed around the optical element using resin and covering a part of the surface of the optical element, a concave opening formed by a molding die in the resin portion so that at least the light receiving portion and the surface around the light receiving portion are exposed, and a suppression portion provided between the edge of the opening of the resin portion covering the optical element and the light receiving portion, and suppressing the resin from entering above the light receiving portion during molding by the molding die.

In this optical device, a suppression section is provided between the edge of the opening of the sealing resin that covers the optical element and the light receiving section, so that the suppression section is spaced apart from the edge of the opening. This makes it possible to promote the resin from hardening before it reaches the suppression section, even if liquid resin seeps onto the portion of the sealing resin exposed at the opening when the resin section is formed using a mold die. In addition, by stopping the resin from seeping in with the suppression section, the resin can be prevented from seeping into the position of the light receiving section.

In a second aspect, in the optical device according to the first aspect, a light-transmitting layer is provided on the surface of the optical element, and the suppression portion is a groove formed in the light-transmitting layer.

In this optical device, the grooves in the light-transmitting layer on the surface of the optical element can accommodate liquid resin that seeps into the opening during molding of the resin part. This prevents resin from seeping into the position of the light-receiving part.

A third aspect is an optical device according to the second aspect, in which the groove surrounds the light receiving portion.

In this optical device, the groove surrounds the light receiving section, preventing resin from entering the position of the light receiving section from various directions.

In a fourth aspect, in the optical device according to the first aspect, the suppression portion is a jetty provided on the surface of the optical element.

In this optical device, the pier provided on the surface of the optical element can stop the flow of liquid resin that seeps into the opening during molding of the resin part. This makes it possible to prevent resin from seeping into the position of the light receiving part.

The manufacturing method of an optical device according to the fifth aspect is a manufacturing method of an optical device including an optical element having a light receiving portion on its surface, and a wiring board on which the optical element is mounted and electrically connected to the optical element, and includes a resin sealing process in which at least a part of the optical element is resin-sealed using a mold die, the mold die having a concave cavity portion filled with a sealing resin and a convex portion for forming an opening in the resin that exposes at least the light receiving portion and the periphery of the light receiving portion, and includes a process of forming a suppression portion between the edge of the opening in the resin covering the optical element and the light receiving portion, the suppression portion suppressing the resin from entering above the light receiving portion during molding using the mold die, prior to the resin sealing process.

This method of manufacturing an optical device includes a process of forming a suppression section between the edge of the opening in the resin that covers the optical element and the light receiving section prior to the resin sealing process, which makes it possible to suppress the resin from entering the position of the light receiving section during molding using a mold die.

According to the present invention, when a mold die is used to mold the sealing resin and an opening is formed to expose the light receiving portion of the optical element, it is possible to prevent the sealing resin from entering the position of the light receiving portion.

1 is a perspective view showing an optical device according to a first embodiment. 4A is a cross-sectional view of the optical device shown in FIG. 1 taken along line 2A-2A, (B) is a cross-sectional view of the optical device shown in FIG. 1 taken along line 2B-2B, and (C) is a cross-sectional view of a molding die used for resin sealing (cross-sectional view of line 2C-2C in FIG. 4A). 1A is a plan view showing the optical device according to the first embodiment, and FIG. 1B is an enlarged plan view showing a part of a light receiving section. 4A to 4D are explanatory views showing a resin sealing step. FIG. 4D is an enlarged cross-sectional view of the FIG. 2 is a cross-sectional view showing a continuous substrate that has been sealed with resin. FIG. 2 is a cross-sectional view showing an optical device cut into individual pieces. 1 is a plan view showing a main part of an optical device according to a first embodiment. 11 is a cross-sectional view showing a state in which liquid resin that has entered an opening during molding of the resin portion is received by a groove. FIG. FIG. 11 is a plan view showing a main part of an optical device according to a second embodiment. FIG. 13 is a plan view showing a main part of an optical device according to a third embodiment. FIG. 13 is a plan view showing a main part of an optical device according to a fourth embodiment. FIG. 13 is a cross-sectional view showing a state in which liquid resin that has entered an opening during molding of a resin portion is received by a groove in the fourth embodiment.

[First embodiment]
An optical device 10 according to a first embodiment of the present invention will be described with reference to Figures 1 to 6. Note that the distinction between top and bottom in the following description is for convenience and does not limit the top and bottom when the optical device is actually used.
In this embodiment, for convenience, the direction of the arrow U in the drawing is referred to as the upper side, the direction of the arrow D in the drawing as the lower side, the direction of the arrow L in the drawing as the left side, the direction of the arrow R in the drawing as the right side, the direction of the arrow F in the drawing as the front side, and the direction of the arrow B in the drawing as the rear side. Also, the direction of the arrow U in the drawing is referred to as the upper direction, the direction of the arrow D in the drawing as the lower direction, the direction of the arrow L in the drawing as the left direction, the direction of the arrow R in the drawing as the right direction, the direction of the arrow F in the drawing as the front direction, and the direction of the arrow B in the drawing as the rear direction.

(Configuration of Optical Device)
As shown in Figures 1, 2(A) and 2(B), the optical device 10 of this embodiment is configured to include a wiring board 12, an optical element 14, a light-emitting element 16, a resin portion 18 formed from a sealing resin, a groove 52 serving as a suppression portion, etc., and is configured as a so-called reflective photointerrupter, and is used, for example, as an encoder, etc.

The wiring board 12 is formed in a rectangular shape, and as shown in Figures 1 and 3 (A), an optical element 14 formed in a rectangular shape is mounted on the upper surface of the wiring board 12.

The optical element 14 is formed smaller than the wiring board 12. In this embodiment, the optical element 14 has a plurality of electrode pads 20 on its surface (the surface on the side indicated by the arrow U in FIG. 2(A), e.g., the top surface) along the sides indicated by the arrow L, the sides indicated by the arrow B, and the sides indicated by the arrow R.

3A , a rectangular (long) light receiving section 22 is provided on the surface of the optical element 14 along the side in the direction of the arrow F on which the electrode pads 20 are not provided. The area of the light receiving section 22 when the optical element 14 is viewed from above is smaller than the area of the upper surface of the optical element 14 exposed in the opening 28.
The light receiving section 22 has a longitudinal direction parallel to the side of the optical element 14 on the arrow F direction side. As shown in Fig. 3B, in the light receiving section 22 of this embodiment, photodiodes 22A as an example of a plurality of pixels are arranged at equal intervals along the longitudinal direction of the light receiving section 22. In other words, the light receiving section 22 of this embodiment functions as a line sensor.

As shown in FIG. 3A, the wiring substrate 12 has a plurality of electrode pads 24 provided around the optical element 14 and adjacent to the electrode pads 20 of the optical element 14.

The electrode pads 20 of the optical element 14 and the electrode pads 24 of the wiring board 12 are electrically connected by bonding wires 26.

As shown in Figures 1 to 3, a part of the wiring board 12, a part of the optical element 14, and the bonding wire 26 are covered with a resin part 18. The resin part 18 is formed around the optical element 14 using resin, and covers a part of the surface of the optical element 14. The upper surface of the resin part 18 is located above the upper end of the bonding wire 26 so that the bonding wire 26 is embedded in the resin. The upper surface of the resin part 18 is formed in a flat shape parallel to the wiring board 12. As an example, the resin part 18 in this embodiment is made of black resin that is used in general semiconductor packages.

A concave opening 28 is formed, for example, in the center of the resin part 18. The opening 28 is formed by a molding die 40 (FIGS. 2C, 4, and 5 ) so that at least the light receiving part 22 and the surface around the light receiving part 22 are exposed. An edge 28A of the opening 28 on the upper surface of the resin part 18 is formed, for example, in a rectangular shape. The opening 28 has a bottom surface 30 that is flush with the upper surface of the optical element 14, and a through part 32 that is provided on the side of the bottom surface 30 in the direction of the arrow F and exposes a part of the upper surface of the wiring board 12. The resin part having the bottom surface 30 that rises from the upper surface of the wiring board 12 is an example of the peripheral part of the optical element.

2(A) and (B), side 28F on the arrow F side, side 28B on the arrow B side, side 28L on the arrow L side, and side 28R on the arrow R side of opening 28 are each approximately perpendicular to wiring board 12. Note that the reason they are approximately perpendicular is that side 28F, side 28B, side 28L, and side 28R have a draft angle for removing resin portion 18 from upper mold die 40A, which will be described later, for forming opening 28. Note that side 28F, side 28B, side 28L, and side 28R may have an angle larger than the normal draft angle provided when molding resin.

As shown in Figures 1 to 3, the upper surface of the optical element 14 around the light receiving portion 22, excluding the area where the bonding wires 26 are arranged, and the upper surface of the bottom surface 30 are exposed in the opening 28. More specifically, the upper surface of the bottom surface 30 is exposed on the arrow L direction side, the arrow F direction side, and the arrow R direction side of the optical element 14 exposed in the opening 28.

As shown in Figures 2(A) and 3(A), the left-right length L0 of the bottom surface 30 is longer than the left-right length L1 of the optical element 14 (which is also the length exposed on the bottom surface 30), and the front-to-back width W0 of the bottom surface 30 is wider than the front-to-back width W1 of the optical element 14 exposed on the bottom surface 30 of the opening 28.

As shown in FIG. 3(A), in the optical element 14 used in the optical device 10 of this embodiment, the left-right length L2 of the light receiving section 22 is shorter than the left-right length L1 of the optical element 14, and the front-rear width W2 of the light receiving section 22 is narrower than the front-rear width W1 of the optical element 14 exposed on the bottom surface 30.

Therefore, in the optical element 14 shown in FIG. 3A, there is room on both the left and right sides of the light receiving portion 22 to make it longer, and there is room on the rear side of the light receiving portion 22 to make it wider.
In FIG. 3A, the two-dot chain line indicates an optical element 14 with an increased length and width.

In the optical device 10 of the present embodiment, as shown in FIGS. 2A, 2B, and 3A, within the opening 28, of the resin portion 18 surrounding the periphery of the optical element 14 at the bottom surface 30 of the opening 28, when the width of the resin portion 18 between the through portion 32 and one side of the optical element 14 facing the through portion 32 is A, and the width of the resin portion 18 between the side surfaces 28L, 28R of the opening 28 and the other side adjacent to the one side of the optical element 14 is B, A>B is set.
In other words, inside the opening 28, the thickness A [W0-W1] of the resin part 18 located on the longitudinal side of the light receiving part 22 is set to be greater than the thickness B [(L0-L1)/2] of the resin part 18 located on the width side of the light receiving part 22 measured along the width direction of the light receiving part 22.

As shown in Figures 1, 2(B), and 3(A), a light-emitting element 16 such as an LED is mounted in the center of the upper surface of the wiring board 12 exposed in the opening 28. As shown in Figures 2(B) and 3, the light-emitting element 16 and the wiring board 12 are electrically connected by a bonding wire 34. The light-emitting element 16 of this embodiment can emit light toward the upper direction of the wiring board 12.

In Figures 1, 2(B), 3(A), 4(C), 4(D), and 5 to 7, a light-transmitting layer 50 is provided on the surface of the optical element 14. The light-transmitting layer 50 is, for example, a polyimide film, and covers the surface of the optical element 14 from the portion covered by the resin portion 18 to the light-receiving portion 22.

The groove 52 as a suppression portion is formed in the light transmitting layer 50. The groove 52 is provided between the edge 28A of the opening 28 of the resin portion 18 covering the optical element 14 and the light receiving portion 22, and suppresses the resin from entering the position of the light receiving portion 22 during molding by the mold die 40. In this embodiment, the groove 52 is formed by omitting a part of the light transmitting layer 50 or by reducing the thickness of a part of the light transmitting layer 50. The groove 52 is formed in a straight line parallel to the longitudinal direction (arrow F direction) of the light receiving portion 22, for example. The length of the groove 52 is longer than the length of the light receiving portion 22. The groove 52 protrudes longer than both ends of the light receiving portion 22 in the directions of arrow L and arrow R, respectively.

(Method of Manufacturing Optical Device)
The manufacturing method of the optical device according to this embodiment is a manufacturing method of an optical device including an optical element 14 having a light receiving portion 22 on its surface, and a wiring board 12 carrying the optical element 14 and electrically connected to the optical element 14, and includes a resin sealing process in which at least a portion of the optical element 14 is resin-sealed using a molding die 40. The molding die 40 has a concave cavity portion 42 filled with sealing resin, and a convex portion 42A for forming an opening 28 in the resin that exposes at least the light receiving portion 22 and the periphery of the light receiving portion 22. Prior to the resin sealing process, the method includes a process of forming a groove 52 as an example of an inhibitor that inhibits resin from entering the position of the light receiving portion 22 during molding using the molding die 40, between the edge of the opening 28 in the resin covering the optical element 14 and the light receiving portion 22.

Figures 2 and 4 show cross-sectional views of a mold die 40 for forming the resin portion 18 of the optical device 10.

The molding die 40 is composed of an upper mold die 40A and a lower mold die 40B. The molding die 40 has a continuous wiring board 12A (see FIGS. 4(C) and (D)), an optical element 14, and a concave cavity portion 42 for forming the resin portion 18. Note that the continuous wiring board 12A here refers to the individual wiring boards 12 shown in FIG. 1 that are continuously connected, and will be cut later to become individual wiring boards 12. Note that the continuous wiring boards 12A loaded into the molding die 40 do not have light emitting elements 16 mounted thereon.

(1) First, as shown in FIG. 4(B), a thin synthetic resin sheet 44 that is flexible and has peelability is attached to the underside of the upper mold part 40A. As an example, a fluororesin sheet can be used as the synthetic resin sheet 44. Note that in FIG. 4(B), the synthetic resin sheet 44 is drawn thick to make the structure easier to understand.

(2) Next, as shown in FIG. 4(C), a light-transmitting layer 50 is provided on the surface of the optical element 14, and grooves 52 are formed in the light-transmitting layer 50.

(3) Next, as shown in FIG. 4(C), the continuous wiring board 12A on which the multiple optical elements 14 are mounted is placed on the lower mold die 40B, and the mold die 40 is closed. Note that the bonding wires 26 that electrically connect the optical elements 14 and the wiring board in the continuous wiring board 12A have already been wired.

(4) Next, as shown in Figures 4(D) and 5, molten resin is injected into the cavity 42 to seal the bonding wires 26 and other necessary parts with resin. This seals the light receiving portion 22 of the optical element 14, part of the top surface of the optical element around the light receiving portion 22, and the remaining parts except for part of the top surface of the continuous wiring board 12A on which the light emitting element 16 is mounted (around the part where the light emitting element 16 is provided). Note that the bonding wires 26 are all embedded inside the resin.

(5) After the resin has solidified, the mold die 40 is opened, and the continuous wiring board 12A is removed from the mold die 40 as shown in FIG. 6, and the light emitting element 16 is mounted on the portion of the wiring board 12A that is not sealed with the resin portion 18.

(6) After that, the continuous wiring substrate 12A is cut with a dicing blade (not shown) to separate it into individual optical devices 10 as shown in FIG.
Through the above steps, the optical device 10 shown in FIG. 1 is completed.

(Action, Effect)
In the optical device 10 of this embodiment, light emitted from the light-emitting element 16 is emitted toward an external irradiation target (not shown) through the through-hole 32 of the opening 28 (see Figures 2 (B) and 3 (A)), and the reflected light reflected from the irradiation target can be received by the light-receiving portion 22 of the optical element 14.
The optical device 10 of the present embodiment can be used, for example, as an encoder.

As shown in FIGS. 2A and 3A, the optical element 14 mounted on the wiring board 12 of this embodiment has a left-right length L1 that is shorter than the left-right length L0 of the bottom surface 30.
In the cavity 42 of the upper mold die 40A filled with resin, as shown in Fig. 2C, the length L3 in the left-right direction of the protrusion 42A for forming the bottom surface 30 of the optical element 14 is equal to the length L0 in the left-right direction of the bottom surface 30 (the thickness of the thin synthetic resin sheet 44 is ignored). The top surface of the protrusion 42A (the lower surface in Fig. 2C) corresponds to the contact portion of the present invention.

As shown in FIG. 2A, the left-right length L1 of the optical element 14 in this embodiment is shorter than the left-right length L3 of the convex portion 42A of the upper mold die 40A. Therefore, even if the left-right length L1 of the optical element 14 is increased to the left-right length L0 of the bottom surface 30, the left and right upper surfaces of the optical element 14 will not be covered with the resin portion 18.

In other words, by adopting the structure of the optical device 10 of this embodiment, it is possible to resin seal necessary locations of the wiring board 12 that is mounted with a large-sized optical element 14 that is longer in left-right length than the optical element 14 of the size shown in Figures 1 to 3 and whose left and right upper surfaces are not covered by the resin portion 18, without changing the molding die 40.

In other words, by configuring the optical device 10 in the structure of the above embodiment, the mold die 40 can be standardized for light receiving sections 22 and optical elements 14 of various sizes, making it possible to reduce manufacturing costs.

In addition, by increasing the left-right length L1 of the optical element 14, the left-right length L2 of the light receiving unit 22 provided on the upper surface of the optical element 14 can be increased by the amount of the increase in the left-right length of the optical element 14, thereby increasing the number of photodiodes 22A (pixels) of the light receiving unit 22.

The dimensions (left-right and front-back) of the opening 28 and bottom surface 30 may be determined taking into consideration that the largest optical element 14 will be mounted on the wiring board 12. In other words, when designing the molding die 40, the dimensions of the portion that will form the opening 28 may be determined in advance, assuming the largest optical element 14.

Furthermore, according to the structure of the optical device 10 of this embodiment, since the front-to-rear width W2 of the light receiving portion 22 is narrower than the front-to-rear width W1 of the optical element 14 exposed at the bottom surface 30, the front-to-rear width W2 of the light receiving portion 22 can also be made wider.

Furthermore, according to the structure of the optical device 10 of this embodiment, the light receiving portion 22 is small relative to the size of the optical element 14 exposed at the bottom surface 30, so that the light receiving portion 22 can be positioned with a high degree of freedom.

In the optical device 10 of this embodiment, as shown in Figures 2(A), (B), and 3(A), the width A of the resin part 18 surrounding the periphery of the optical element 14 between the through part 32 and one side of the optical element 14 is made larger than the width B of the resin part 18 between the wall surfaces 28L, 28R of the opening 28 and the other side adjacent to the one side of the optical element 14, but the relationship between width A and width B can be changed as necessary, and width A may be less than or equal to width B.

In addition, some optical devices of this type have a resin sealing structure in which the light receiving section and wires are covered with a transparent resin. However, this transparent resin is often less reliable in terms of reflow and temperature cycles than the black resin used in general semiconductor devices, and can cause problems such as broken bonding wires.

However, in the optical device 10 of this embodiment, the light receiving portion 22 is exposed in the opening 28, and the resin portion 18 can be made of highly reliable black resin that is used in general semiconductor devices, resulting in high reliability similar to that of general semiconductor devices.

8 and 9, in the optical device 10, a groove 52 is provided as a suppression section between the edge 28A of the opening 28 of the sealing resin covering the optical element 14 and the light receiving section 22. The groove 52 is provided in a light transmitting layer 50 provided on the surface of the optical element 14. The groove 52 is spaced apart from the edge 28A of the opening 28. This can promote the resin to harden before it reaches the groove 52, even if molten liquid resin seeps into the portion of the sealing resin exposed to the opening 28 during molding of the resin section 18 by the mold die 40. In addition, by receiving the resin in the groove 52, the resin can be prevented from seeping into the position of the light receiving section 22.

In this embodiment, the grooves 52 in the light transmitting layer 50 provided on the surface of the optical element 14 can accommodate the liquid resin that has entered the opening 28 during molding of the resin portion 18. This can prevent the resin from entering the position of the light receiving portion 22. This can also improve the yield of the optical device 10.

Furthermore, in the manufacturing method for an optical device according to this embodiment, a process for forming a groove 52 (suppression portion) between the edge 28A of the opening 28 in the resin covering the optical element 14 and the light receiving portion 22 prior to the resin sealing process is included, thereby making it possible to suppress the resin from entering the position of the light receiving portion 22 during molding using the molding die 40.
[Second embodiment]
10 , in the optical device 210 according to this embodiment, a groove 52 surrounds the light receiving section 22. This groove 52 is formed by omitting a part of the light transmitting layer 50 or reducing the thickness of a part of the light transmitting layer 50 around the entire or part of the periphery of the light receiving section 22. Note that the approximately semicircular two-dot chain line in FIG. 10 is a virtual depiction of the state in which molten liquid resin enters from the edge 28A of the opening 28.

In this embodiment, since the groove 52 surrounds the light receiving portion 22, it is possible to prevent the resin from entering the position of the light receiving portion 22 from various directions.
[Third embodiment]
11 , in an optical device 310 according to this embodiment, two light receiving sections 22 are disposed spaced apart from each other along the direction of arrow F. Grooves 52 are formed as suppression sections between the light receiving sections 22 and the edges 28A of the light receiving sections 22 in the directions of arrow L and arrow R in the opening 28. The grooves 52 are formed, for example, parallel to the direction of arrow F and straddle the two light receiving sections 22.

In this embodiment, the groove 52 can prevent resin from entering the position of the light receiving portion 22 from the directions of arrow R and arrow L during molding using the molding die 40.
[Fourth embodiment]
12 and 13, in the optical device 410 according to this embodiment, the suppression section is a jetty 54 provided on the surface of the optical element 14. In this example, the light transmitting layer 50 in the first to third embodiments is omitted, and the light receiving section 22 is exposed to the opening 28. The shape of the jetty 54 in a top view is the same as the groove 52 in the first embodiment. In a cross-sectional view, the jetty 54 protrudes upward (in the direction of the arrow U) from the surface of the optical element 14. The height of the jetty 54 is set to be smaller than the gap between the surface of the optical element 14 and the upper mold die 40A and to a degree that can suppress overflow of the resin. The jetty 54 may be composed of a dummy wiring.

In this optical device, the pier provided on the surface of the optical element 14 can stop the flow of liquid resin that has entered the opening 28 during molding of the resin portion 18. This can prevent the resin from entering the position of the light receiving portion 22.

[Other embodiments]
Although one embodiment of the present invention has been described above, the present invention is not limited to the above, and it goes without saying that the present invention can be implemented in various modified forms without departing from the spirit and scope of the present invention.

In the first embodiment described above, the bonding wires 26 were wired to three sides of the rectangular optical element 14, but the present invention is not limited to this, and the bonding wires 26 may be wired to one side of the optical element 14.

In the above embodiment, the light receiving unit 22 has a structure in which multiple photodiodes 22A are arranged along the longitudinal direction of the light receiving unit 22, but the arrangement of the photodiodes 22A is not particularly limited, and the light receiving unit 22 may be a single photodiode 22A.

In the optical device 10 of the above embodiment, the light emitting element 16 is provided on the wiring substrate 12, but the light emitting element 16 may be provided as necessary and may not be provided. In an optical device 10 that does not have the light emitting element 16, the through portion 32 does not need to be provided in the opening 28.

In the optical device 10 of the above embodiment, the light receiving section 22 has a rectangular shape in plan view, but it may have a shape other than a rectangle, such as a hexagon or an arc shape.

The grooves 52 and the piers 54 as the suppression parts are not limited to being linear when viewed from above, but may be broken lines, curved lines, a combination of straight lines and curved lines, etc. The widths of the grooves 52 and the piers 54 may be constant or may vary depending on the position. In addition, although the grooves 52 and the piers 54 are given as examples of the suppression parts, the suppression parts are not limited to these, and other means may be used as long as they are capable of suppressing the intrusion of resin into the position of the light receiving part 22.

The above embodiments can be combined as appropriate.

10 Optical device 12 Wiring board 14 Optical element
16 Light emitting element
18 Resin portion 22 Light receiving portion 28 Opening 28A Edge 40 Molding die 42 Cavity portion 42A Convex portion (top is contact portion)
50 Light transmission layer 52 Groove (suppression part)
54 Jetty (control section)

Claims (5)

An optical element having a light receiving portion on a surface thereof;
A light-emitting element;
a wiring board on which the optical element and the light emitting element are mounted and which is electrically connected to the optical element and the light emitting element;
a resin portion formed around the optical element using a resin and covering a side surface of the optical element on the light emitting element side and a part of the surface of the optical element;
an opening provided in the resin portion, the opening being formed in a concave shape by a molding die so that at least the light receiving portion and the surface around the light receiving portion are exposed , the opening being flush with an upper surface of the optical element, and a through portion provided on the light emitting element side of the bottom surface and exposing a portion of an upper surface of the wiring substrate, the opening being the resin portion between the optical element and the through portion ;
a suppression portion provided between an edge of the opening of the resin portion covering the optical element and the light receiving portion, the suppression portion suppressing the resin from flowing onto the light receiving portion during molding by the molding die;
An optical device having a light transmitting layer is provided on the surface of the optical element;
The optical device according to claim 1 , wherein the suppression portion is a groove formed in the light transmitting layer. The optical device according to claim 2 , wherein the groove surrounds the light receiving portion. The optical device according to claim 1 , wherein the suppression portion is a jetty provided on the surface of the optical element. A method for manufacturing an optical device including an optical element having a light receiving portion on a surface thereof, a light emitting element, and a wiring board on which the optical element is mounted and which is electrically connected to the optical element and the light emitting element, comprising the steps of:
a resin sealing step of sealing at least a part of the optical element including a side surface of the optical element on the light emitting element side with a molding die;
the molding die has a convex portion for forming an opening having a concave cavity portion to be filled with a sealing resin, a bottom surface that exposes at least the light receiving portion and the periphery of the light receiving portion to the resin and is flush with an upper surface of the optical element, and a through portion that is provided on the light emitting element side of the bottom surface and exposes a part of an upper surface of the wiring substrate ;
a step of forming a suppression portion between an edge of the opening of the resin covering the optical element and the light receiving portion, the suppression portion suppressing the resin from entering onto the light receiving portion during molding by the molding die, before the resin sealing step ;
In the resin sealing step, the resin is filled between the optical element and the through portion to resin-seal a side surface of the optical element facing the light-emitting element .