JP7563938B2 - Air conditioning system, air conditioning method, factory clean room equipped with air conditioning system, and partition member for air conditioning system - Google Patents

Description

The present disclosure relates to an air conditioning system, an air conditioning method, a room equipped with an air conditioning system and having a heat generating device installed therein, and a partition member for an air conditioning system.

When performing replacement air conditioning, in which low-temperature air is supplied into an air-conditioned space and the heated air that has risen due to being heated by a heating element in the air-conditioned space is exhausted from the top of the air-conditioned space, there is known an air-conditioning system that imparts a swirling component to the low-temperature air and blows it out into the air-conditioned space from an air intake port located at the bottom of the air-conditioned space. With this type of air-conditioning system, it is possible to blow out air with less of a draft feeling than when air is blown out without imparting a swirling component. This does not disturb the air in the air-conditioned space, making it possible to perform replacement air conditioning while maintaining temperature stratification.

Patent No. 4006196

In recent years, efficient air conditioning is required not only in spaces with few heat sources, such as offices where clerical work is done, but also in spaces that contain heat sources such as semiconductor manufacturing equipment that emits high heat, such as semiconductor manufacturing factories. The application of the above-mentioned displacement air conditioning can be considered as a method of efficiently conditioning spaces that contain such heat-generating elements.

For example, if you want to apply displacement air conditioning to a clean room in a semiconductor manufacturing factory, the cold air blown out from the air intake is piled up in layers to form a thermal stratification, so that various pieces of equipment, such as semiconductor manufacturing equipment, installed on the floor are placed in an atmosphere with an appropriate temperature. However, with displacement air conditioning, the upper part of the air-conditioned space becomes hotter than the lower part, so if the amount of heat increases due to an increase in the size of the semiconductor manufacturing equipment, the appropriate atmospheric temperature may be exceeded in the upper part of the air-conditioned space. For this reason, for example, if you want to install equipment that handles intermediate or final products, such as an automatic conveying system, in the upper part, it may be unavoidable to postpone installation because the atmospheric temperature in the upper part does not meet the conditions of the product.

On the other hand, it is possible to increase the volume of cold air blown out by the displacement air conditioning to raise the height of the low-temperature area appropriate for the product. However, increasing the volume of blown out air increases the amount of power consumed by the air conditioning power required to blow out the cold air, which reduces energy saving. In addition, increasing the volume of blown out air will agitate the cold air that has accumulated in the lower part of the clean room, making it impossible to maintain the temperature stratification achieved by the displacement air conditioning. Furthermore, since the high-temperature air that has accumulated in the upper part of the clean room will also be agitated, it may become impossible to efficiently exhaust suspended particles such as dust that rise together with the high-temperature air generated by semiconductor manufacturing equipment and the like and accumulate in the upper part of the clean room. Furthermore, if there are workers in the clean room, increasing the volume of blown out air will also increase the draft of cold air that flows down from the air intake toward the floor and along the floor. This may cause discomfort at the feet of the workers.

In one aspect, the present disclosure has been made in consideration of this actual situation, and its purpose is to provide an air conditioning system, an air conditioning method, a heat-generating device installation room equipped with an air conditioning system, and a partition member for an air conditioning system that can suppress a temperature rise in a specific upper part of a heat-generating device installation room while maintaining an air volume that can maintain temperature stratification by replacement air conditioning when the heat-generating device is installed in the room and the room is conditioned by replacement air conditioning.

To solve the above problems, the present disclosure adopts the following configuration.

For example, an air conditioning system according to one aspect of the present disclosure is an air conditioning system that performs displacement air conditioning on a heat generating device installation room in which a heat generating device is installed, and includes an outlet provided in the lower part of the heat generating device installation room for blowing out cool air to cool a first region of the space in the heat generating device installation room from the floor to a predetermined height, an air intake provided in the upper part of the heat generating device installation room for taking in hot air that has risen from the heat generating device, and a partition member disposed in a second region above the first region of the space in the heat generating device installation room to separate the rising region where the hot air rises from other regions.

In this configuration, the cool air blown out from the air outlet is heated by the heat of the heat generating device and becomes hot air, and this hot air rises while diffusing to the upper part of the room where the heat generating device is installed, and is taken in from the air intake. In this configuration, a partition member is provided in a second area above the first area where the heat generating device is located, separating the rising area where the hot air rises from the heat generating device from other areas. This makes it possible to prevent the hot air in the rising area from flowing into other areas. This makes it possible to suppress the temperature rise in other areas while maintaining an air volume that can maintain temperature stratification by displacement air conditioning.

In the air conditioning system according to one aspect described above, the partition member may include a first partition member erected in the second region above the condition definition section of the heat generating device where the predetermined temperature conditions are defined.

With this configuration, the first partition member can block the hot air in the rising area above the heat generating device from flowing into the area on the condition definition unit side. This makes it possible to suppress the temperature rise of the cold air in the area on the condition definition unit side while maintaining an air volume that can maintain the temperature stratification caused by displacement air conditioning.

In the air conditioning system according to the above aspect, the partition member may include a second partition member that is erected on the side of the heat generating device in the first region and the second region so as to cover a heat dissipation portion of the heat generating device that dissipates heat from the air outlet side.

With this configuration, the second partition member can block the hot air in the rising area next to the heat dissipation unit from flowing into the area on the condition definition unit side. This makes it possible to suppress the temperature rise of the cold air in the area on the condition definition unit side while maintaining the air volume that can maintain the temperature stratification caused by displacement air conditioning.

Furthermore, in the air conditioning system according to one aspect described above, the partition member may include a third partition member that covers the upper side of the condition definition section of the heat generating device in which the predetermined temperature condition is defined.

With this configuration, the third partition plate can block the hot air in the rising area above the area on the condition specification side from flowing into the area on the condition specification side. This makes it possible to suppress the temperature rise of the cold air in the area on the condition specification side while maintaining the air volume that can maintain the temperature stratification caused by displacement air conditioning.

In addition, in the air conditioning system relating to the above-mentioned aspect, a plurality of air outlets may be arranged vertically and horizontally in the lower part of the room where the heat generating device is installed, and a swirling flow generator may be provided in each of the plurality of air outlets to impart a swirling component to the cool air and blow it into the room where the heat generating device is installed.

This configuration allows the air in the room around the air outlet where the heat generating device is installed to be attracted. This increases the amount of air attracted (attraction ratio) in the room around the air outlet where the heat generating device is installed to the cool air blown out from the air outlet, and increases the volume of cool air to be diffused in the room where the heat generating device is installed. This allows the cool air to be blown out without a drafty feeling compared to when the cool air is not given a swirling component.

According to the present disclosure, it is possible to suppress temperature rise in a specific upper part of a room in which a heat generating device is installed, while maintaining an air volume that can maintain temperature stratification through displacement air conditioning.

FIG. 1 is a top view showing the configuration of a clean room to which an air conditioning system according to a first embodiment is applied. FIG. 2(A) is a side view showing the configuration of a portion of a clean room when viewed in the row direction of the equipment rows, and FIG. 2(B) is a side view showing the same configuration when viewed in a direction perpendicular to the row direction of the equipment rows. FIG. 3 is a perspective view showing the external configuration of the air conditioning unit. 4A and 4B are diagrams for explaining the flows of cold air and hot air in a clean room to which the air conditioning system of the first embodiment is applied. FIG. 5(A) is a diagram showing an outline of the configuration of a clean room when a first partition plate is provided, and FIG. 5(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specified position in the column direction in this case. 6A and 6B are cross-sectional views showing the horizontal temperature distribution in the clean room at a given position in the height direction when the first partition plate is provided. FIG. 7(A) is a diagram showing an outline of the configuration of a clean room when a first partition plate is not provided, and FIG. 7(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specified position in the column direction in that case. 8A and 8B are cross-sectional views showing the horizontal temperature distribution in the clean room at a predetermined position in the height direction when the first partition plate is not provided. FIG. 9 is a top view showing the configuration of a clean room to which the air conditioning system according to the second embodiment is applied. FIG. 10(A) is a side view showing the configuration of a portion of the clean room when viewed in the row direction of the equipment rows, and FIG. 10(B) is a side view showing the same configuration when viewed in a direction perpendicular to the row direction of the equipment rows. FIG. 11(A) is a diagram showing an outline of the configuration of a clean room when first and second partition plates are provided, and FIG. 11(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specified position in the column direction in this case. 12A and 12B are cross-sectional views showing the horizontal temperature distribution in a clean room at a given position in the height direction when first and second partition plates are provided. FIG. 13 is a top view showing the configuration of a clean room to which the air conditioning system according to the third embodiment is applied. FIG. 14(A) is a side view showing the configuration of a part of the clean room when viewed in the row direction of the equipment rows, and FIG. 14(B) is a side view showing the same configuration when viewed in a direction perpendicular to the row direction of the equipment rows. FIG. 15(A) is a diagram showing an outline of the configuration of a clean room when first, second and third partition plates are provided, and FIG. 15(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specified position in the column direction in this case. 16A and 16B are cross-sectional views showing the horizontal temperature distribution in a clean room at a predetermined position in the height direction when first, second and third partition plates are provided. FIG. 17 is a top view showing the configuration of a clean room to which the air conditioning system according to the fourth embodiment is applied. FIG. 18(A) is a side view showing the configuration of a portion of the clean room when viewed in the row direction of the equipment rows, and FIG. 18(B) is a side view showing the same configuration when viewed in a direction perpendicular to the row direction of the equipment rows. FIG. 19(A) is a diagram showing an outline of the configuration of a clean room when a third partition plate is provided, and FIG. 19(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specified position in the column direction in this case. 20A and 20B are cross-sectional views showing the horizontal temperature distribution in a clean room at a given position in the height direction when a third partition plate is provided. FIG. 21(A) is a diagram showing an outline of the configuration of the clean room when the third partition plate is extended toward the equipment side, and FIG. 21(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specified position in the column direction in this case. 22A and 22B are cross-sectional views showing the horizontal temperature distribution in the clean room at a given position in the height direction when the third partition plate is extended toward the apparatus side. FIG. 23 is a top view showing the configuration of a clean room to which the air conditioning system according to the fifth embodiment is applied. FIG. 24(A) is a side view showing the configuration of a part of the clean room when viewed in the row direction of the equipment rows, and FIG. 24(B) is a side view showing the same configuration when viewed in a direction perpendicular to the row direction of the equipment rows. FIG. 25(A) is a diagram showing an outline of the configuration of a clean room when a fan is provided, and FIG. 25(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specific position in the column direction in this case. 26A and 26B are cross-sectional views showing the horizontal temperature distribution in a clean room at a given position in the height direction when a fan is provided. FIG. 27(A) is a diagram showing an outline of the configuration of a clean room when a third partition plate is not provided and only a fan is provided, and FIG. 27(B) is a cross-sectional view showing the temperature distribution in the clean room in the vertical direction at a specified position in the column direction in this case. 28A and 28B are cross-sectional views showing the temperature distribution in the horizontal direction in a clean room at a predetermined position in the height direction when the third partition plate is not provided and only a fan is provided.

Below, an embodiment of one aspect of the present disclosure (hereinafter also referred to as "the present embodiment") will be described with reference to the drawings. However, the present embodiment described below is merely an example of the present disclosure in all respects. Needless to say, various improvements and modifications can be made without departing from the scope of the present disclosure. In other words, when implementing the present disclosure, a specific configuration according to the embodiment may be appropriately adopted.

[First embodiment]
The air conditioning system of this embodiment is, for example, an air conditioning system that uses an air conditioning unit installed in a room to condition the room by displacement air conditioning. The room to which the air conditioning system is applied is, for example, a clean room of a semiconductor manufacturing factory in which a plurality of semiconductor manufacturing devices are installed and which is equipped with an automatic transport system for transporting intermediate and final semiconductor device products from or to the semiconductor manufacturing devices. The semiconductor manufacturing devices are, for example, etching devices, CVD (Chemical Vapor Deposition) devices, etc.

Fig. 1 is a top view showing the configuration of a clean room to which an air conditioning system according to a first embodiment is applied, Fig. 2(A) is a side view showing the configuration of a part of the clean room as viewed in the row direction of the equipment rows, and Fig. 2(B) is a side view showing the configuration as viewed in a direction perpendicular to the row direction of the equipment rows.

1 and 2, the clean room 1 is a room surrounded by a floor 2, four side walls 3 to 6, and a ceiling 7. A plurality of semiconductor manufacturing devices 8 (an example of a "heat generating device" in this disclosure) are installed on the floor 2 inside the clean room 1. A load port 9 is installed in front of each of the plurality of semiconductor manufacturing devices 8. The load port 9 is an interface section that transfers products contained in a container 10 between the semiconductor manufacturing devices 8. In other words, in front of the semiconductor manufacturing devices 8, products are transported from the container 10 to the semiconductor manufacturing devices 8, and the products after processing in the semiconductor manufacturing devices 8 are transported from the semiconductor manufacturing devices 8 to the container 10. For this reason, predetermined temperature conditions according to the products are specified in front of the semiconductor manufacturing devices 8 (an example of a "condition specifying section" in this disclosure). In this embodiment, since the semiconductor manufacturing equipment 8 is exemplified as an example of the "heat generating equipment" in the present application, the "condition specifying unit" in the present application specifies the temperature conditions of the product at the front part of the semiconductor manufacturing equipment 8 where the product handled by the semiconductor manufacturing equipment 8 is inserted and removed, but in the case of a heat generating equipment that is responsible for the manufacture of various products other than semiconductors, the temperature conditions of the product handled by the heat generating equipment are specified as the thermal environment conditions of the "condition specifying unit". For example, in the case of an experimental equipment or processing equipment that handles medicines or high-performance materials, the temperature conditions of the items handled by the equipment are specified in the "condition specifying unit" as the thermal environment conditions of the parts of the equipment where the items are inserted and removed (the front, side, rear, etc. of the equipment). In addition, the predetermined temperature conditions according to the product are not only specified for the condition specifying unit such as the front part of the semiconductor manufacturing equipment 8, but are also specified at the places where the products inserted and removed from the semiconductor manufacturing equipment 8 are handled. In this way, because products are being handled in and out of the semiconductor manufacturing equipment 8, areas where the same thermal environment conditions as those specified by the condition specification unit are specified (hereinafter referred to as the "condition specification area") include the space near the front of the semiconductor manufacturing equipment 8 and the space above the front of the semiconductor manufacturing equipment 8 where the products are transported by a transport device described below. In the clean room 1 of the semiconductor manufacturing factory, various conditions are specified for the thermal environment in areas where products are automatically transported and areas where workers enter, so the condition specification area is set to a spatial area according to such various conditions.

Above the semiconductor manufacturing equipment 8, a lattice-shaped ceiling frame 12 is installed, suspended from the ceiling 7 by hanging members 11. The spaces between the lattices of the ceiling frame 12 are openings, allowing air to flow between the top and bottom of the ceiling frame 12.

Under the ceiling frame 12, rails 14 are installed along which the conveying device 13 of the automatic conveying system runs. The conveying device 13 runs while suspended from the rails 14, holding the container 10 at its bottom. The conveying device 13 also has a hoist that moves up and down between the load port 9, and transfers the container 10 containing the product between the load port 9 and the rails 9 by raising and lowering the hoist. In other words, the conveying device 13 holds the container 10 and runs along the rails 14, thereby conveying the container 10 in the direction in which the rails 14 extend, that is, in the width direction (X direction in Figures 1 and 2) and length direction (depth direction: Y direction in Figures 1 and 2) of the clean room 1, that is, in the horizontal direction. Furthermore, the conveying device 13 uses the hoist to raise and lower the container 10 between the load port 9 and the rails 9, thereby conveying the container 10 in the height direction (Z direction in Figure 2), that is, in the vertical direction, of the clean room 1. Thermal environment conditions are set for the products handled by the conveying device 13, so the area in which the conveying device 13 is installed falls within the condition-defined area described above.

On the other hand, above the ceiling frame 12, there is a passage for maintenance of the automatic transport system, lighting, etc.

Hereinafter, the area in the space of the clean room 1 from the floor 2 to a predetermined height, for example, to the upper end of the semiconductor manufacturing equipment 8 in the height direction is referred to as the first area. Furthermore, the area in the height direction from the upper end of the semiconductor manufacturing equipment 8 to the ceiling frame 12 is referred to as the second area. And the area in the height direction from the ceiling frame 12 to the ceiling 7 in the height direction is referred to as the third area. In this embodiment, since it is assumed that the room in which the semiconductor manufacturing equipment 8 is installed is substituted with air conditioning while maintaining temperature stratification, it is possible to grasp the lower part of the room in which the semiconductor manufacturing equipment 8 is installed as the first area, the part in which the support members such as the ceiling frame 12 that enable the installation of the partition plate described later are arranged as the second area, and the upper part of the room in which the heat rising from the semiconductor manufacturing equipment 8 accumulates as the third area, but the first area, second area, and third area referred to in this application are not limited to the concept of being defined by the members such as the semiconductor manufacturing equipment 8 and the ceiling frame 12 as boundaries. For example, in the case of an indoor space where another device is installed instead of the semiconductor manufacturing equipment 8, the lower part of the room where the other device is installed is understood as the first area. Also, in the case where the partition plate is supported by another support member instead of the ceiling frame 12, the part where the partition member is provided by the other support member is understood as the second area. The lower limit of the height at which the partition member can be installed, in other words, the height of the lower end of the second area, is determined according to the amount of heat generated by a heat generating device such as the semiconductor manufacturing equipment 8 and the temperature conditions required by the semiconductor manufacturing equipment 8, and it is desirable that the first area is secured so that the supply of cool air to the semiconductor manufacturing equipment 8 by the displacement air conditioning is not hindered. Therefore, in this embodiment, the position of the upper end of the semiconductor manufacturing equipment 8 is exemplified as the position of the lower limit of the second area, but the boundaries of the first to third areas are not limited to this form and are set at appropriate positions according to, for example, the work area of a worker performing maintenance or the external shape of the semiconductor manufacturing equipment 8.

As described above, a plurality of semiconductor manufacturing devices 8 are installed in the first of the first to third regions. Some of the semiconductor manufacturing devices 8 (four semiconductor manufacturing devices 8 in FIG. 1) are arranged in a line along the length of the clean room 1 with gaps between them to form a row of semiconductor manufacturing devices 8 (hereinafter referred to as an "equipment row"). Furthermore, a plurality of such equipment rows (four in FIG. 1) are arranged in a line along the width of the clean room 1 with gaps between them. Hereinafter, the direction in which the equipment row is formed by the plurality of semiconductor manufacturing devices 8 is referred to as the "row direction." Note that in this embodiment, the row direction is the same direction as the length of the clean room 1 (the X direction in FIG. 1).

In each of the multiple equipment rows, the front of each of the multiple semiconductor manufacturing equipment 8 on which the load port 9 is installed faces one direction (for example, the right direction in the case of the second equipment row from the left in Figure 1) perpendicular to the row direction (in this embodiment, the same direction as the width direction of the clean room 1; in Figure 1, the Y direction). Therefore, the rear surface faces the other direction perpendicular to the row direction (the left direction in the case of the equipment row described above).

In adjacent rows of equipment, for example, the first and second rows from the left in FIG. 1, the rear of the semiconductor manufacturing equipment 8 in the first row faces the rear of the semiconductor manufacturing equipment 8 in the second row. In the second and third rows from the left in FIG. 1, the front of the semiconductor manufacturing equipment 8 in the first row faces the front of the semiconductor manufacturing equipment 8 in the second row. The portion between adjacent rows of equipment where the fronts of the semiconductor manufacturing equipment 8 face each other (hereinafter referred to as the "portion between the rows of equipment where the fronts face each other") is a portion where the container 10 containing the product is transported. On the other hand, the portion between adjacent rows of equipment where the rears of the semiconductor manufacturing equipment 8 face each other (hereinafter referred to as the "portion between the rows of equipment where the rears face each other") is a portion for maintenance of the semiconductor manufacturing equipment 8. In addition, the front side portion of the semiconductor manufacturing equipment 8 between the side walls 4 and 6 where the air conditioning units described later are not installed and the semiconductor manufacturing equipment 8 is also a portion where the container 10 containing the product is transported.

Spanning from the first area to part of the third area, multiple air conditioning units (six in FIG. 1) are installed on each of the side walls 3, 5, which have a surface direction in the same direction as the direction perpendicular to the row direction, among the four side walls 3-6, so as to sandwich the multiple device rows from both sides in the row direction. Each of the multiple air conditioning units has an air supply section 15 located at the bottom of the side walls 3, 5, and an air intake section 16 located above the air supply section 15.

Figure 3 is a perspective view showing the external configuration of the air conditioning unit.

The intake section 16 of the air conditioning unit is equipped with a fan inside. As shown in FIG. 3, a rectangular intake port 17 is provided on the upper surface 16a of the intake section 16 (the side surface on the ceiling 7 side). In the intake section 16, the fan draws air from the upper part of the clean room 1 through the intake port 17 and supplies it to the air supply section 15. The intake port 17 is not limited to being provided on the upper surface 16a of the intake section 16, but may be provided on the side surface, etc. In addition, FIG. 3 shows the intake section 16 integrated with the air supply section 15, but the intake section 16 and the air supply section 15 may be separate bodies connected to a duct, etc., and the internal parts such as the built-in fan and cooling coil may be located in appropriate locations.

The air supply section 15 is equipped with a cooling coil and a filter inside. As shown in FIG. 3, a plurality of (eight in FIG. 3) circular air outlets 18 are provided on the front surface 15a (side surface facing the device row) of the air supply section 15. The plurality of air outlets 18 are arranged in a line in the height direction and width direction of the air supply section 15 with gaps between them. In the air supply section 15, the cooling coil cools the air supplied from the air intake section 16 to form cold air, and after removing dust and the like from the cold air using a filter, the cold air is blown out in the row direction from the air outlets 18. The height of the first air outlet 18 from the top in the air supply section 15 is a height for forming temperature stratification under a predetermined temperature condition, and is slightly higher than the height of the container 10 held by the conveying device 13 suspended from the rail 14.

A number of fins 19 (an example of a "swirl flow generator" of the present disclosure) are attached to each of the multiple air outlets 18 at equal intervals in the circumferential direction and radially around the center of the air outlet 18. In addition, each of the multiple fins 19 is arranged at an angle to the central axis of the air outlet 18. This allows the cold air to have a swirling component around the central axis when it is blown out from the air supply section 15 into the clean room 1, thereby attracting air in the clean room 1 around the air outlet 18.

In addition, among the multiple air outlets 18, the inclination directions of the fins 19 of adjacent air outlets 18 in the height direction of the air supply section 15 are opposite to each other, so that the swirling components that they give to the cold air are opposite to each other. For example, as shown by the thin arrows in FIG. 3, when the first air outlet 18 from the top gives a counterclockwise swirling component to the cold air, the second air outlet 18 from the top gives a clockwise swirling component to the cold air. As a result, between these air outlets 18, the swirling components of the first air outlet 18 from the top and the second air outlet 18 from the top are in the same direction (to the right in FIG. 3), and the swirling components enhance each other. In this case, the third air outlet 18 from the top gives a counterclockwise swirling component to the cold air. As a result, between the second air outlet 18 from the top and the third air outlet 18 from the top, the swirl component from the second air outlet 18 from the top and the swirl component from the third air outlet 18 from the top are in the same direction (leftward in FIG. 3), and the swirl components enhance each other.

As a result, the amount of air attracted (attraction ratio) in the clean room 1 around the air outlet 18 to the cool air blown out from the air outlet 18 increases, so that the volume of the cool air can be increased and diffused in the clean room 1 as shown by the thick arrow in Fig. 3. This makes it possible to blow out the cool air without a drafty feeling compared to a case where the cool air is not given a swirling component.

As shown in Figs. 1 and 2, the multiple air supply sections 15 are arranged side by side with gaps between them in a range corresponding to the range from one end of the multiple device rows in a direction perpendicular to the row direction on the side walls 3 and 5 (e.g., the first device row from the left in Fig. 1) to the other end (e.g., the first device row from the right in Fig. 1).

As described above, when cold air is blown out in the row direction from the air outlet 18 of the air supply section 15, the air in the clean room 1 around the air outlet 18 is attracted, so the mass of the cold air increases. For this reason, the cold air quickly decelerates after being blown out from the air outlet 18 in accordance with the law of conservation of momentum. Also, because the cold air has a relatively high density, it descends and sinks to the floor 2. As a result, the cold air builds up in layers from the floor 2 in the clean room 1, forming temperature stratification. At this time, the arrangement of the air supply sections 15 of the multiple air conditioning units described above allows the cold air to efficiently build up in the parts of the first area between the device rows.

As described above, the air conditioning system of this embodiment has an air conditioning unit (air supply section 15 and air intake section 16) as a basic configuration. Moreover, fins 19 are attached to the air outlet 18 of the air supply section 15 to impart a swirling component to the cold air being blown out. This air conditioning unit performs displacement air conditioning of the clean room 1 while forming temperature stratification. In addition to this air conditioning unit, the air conditioning system of this embodiment further has a first partition plate 20.

As shown in Figs. 1 and 2, the first partition plate 20 is a plate-like member such as a resin plate, and is hung from the ceiling frame 12 with a hanging device attached to the upper end. As a result, the first partition plate 20 is arranged in an upright state relative to the floor 2 on the front part of the upper surface of the semiconductor manufacturing equipment 8 in the second area for each of the multiple equipment rows. Furthermore, the first partition plate 20 extends in the row direction, i.e., in the same direction as the blowing direction of the cool air, from the front of the multiple semiconductor manufacturing equipment 8 in the equipment row (in Fig. 1, the first semiconductor manufacturing equipment 8 from the top) to the rear (in Fig. 1, the first semiconductor manufacturing equipment 8 from the bottom).

The first partition plate 20 is attached to the top of each of the semiconductor manufacturing devices 8 in the equipment row with a mounting fixture at its bottom end. This makes it possible to prevent the first partition plate 20 from shaking. It is also possible to replace the mounting fixture and attach a weight to the bottom of the first partition plate 20. This also makes it possible to prevent the first partition plate 20 from shaking.

In the clean room 1 to which the air conditioning system of this embodiment is applied, the cold air and hot air flow as follows:

Figures 4 (A) and (B) are diagrams explaining the flow of cold air and hot air in a clean room to which the air conditioning system of the first embodiment is applied.

As shown by the thin arrows in FIG. 4, cold air is blown out in the row direction from the air outlet 18 provided on the front surface 15a of the air supply section 15 of the air conditioning unit. At this time, as described above, the fins 19 of the air outlet 18 give the cold air a swirling component, so the cold air blown out from the air outlet 18 attracts the surrounding air and quickly decelerates. In addition, because the cold air has a relatively high density, it descends and sinks to the floor 2. As a result, for example, the cold air is piled up in layers from the floor 2 in the part of the first area between the rows of devices whose front surfaces face each other.

On the other hand, the semiconductor manufacturing equipment 8 discharges heat from the top, rear and side surfaces, except the front surface where the decorative panel is provided. In particular, the top surface of the semiconductor manufacturing equipment 8 discharges more heat than the rear and side surfaces. The piled up cold air is heated by the heat of the semiconductor manufacturing equipment 8 and becomes hot air. The hot air has a lower density than the cold air, so it rises slowly while diffusing in the second area due to buoyancy as shown by the white arrow in FIG. 4, passes over the ceiling frame 12 above the semiconductor manufacturing equipment 8, and accumulates in the upper part of the clean room 1 in the third area. At this time, dust and the like generated by the semiconductor manufacturing equipment 8 and the like also rises together with the hot air, is carried to the upper part of the clean room 1, and accumulates as suspended fine particles.

As the temperature of the cold air rises, it gradually rises in temperature, and accumulates not only in the area between the rows of equipment in the first area where the front faces of the equipment face each other, but also in the area above the area between the rows of equipment in the second area above. If the first partition plate 20 were not installed, the hot air from above the semiconductor manufacturing equipment 8 in the second area would flow into the area above the areas between the rows of equipment where the front faces of the equipment face each other, which is relatively cool. This would cause the temperature of the area above the areas between the rows of equipment where the front faces of the equipment face each other to rise even further.

In this embodiment, the first partition plate 20 separates the portion of the second region above the semiconductor manufacturing equipment 8 from the portion above the rows of equipment whose front faces face each other. This makes it possible to block the high-temperature air in the portion above the semiconductor manufacturing equipment 8 (an example of the "rising region where high-temperature air rises" in this disclosure) from flowing into the portion above the rows of equipment whose front faces face each other (an example of the "other region" in this disclosure) as shown in the rectangular area surrounded by the dashed line in FIG. 4. This makes it possible to suppress the temperature rise of the piled-up cool air in the portion above the rows of equipment whose front faces face each other.

The first partition plate 20 separates the portion of the second area above the semiconductor manufacturing equipment 8 from the portion above the front side of the semiconductor manufacturing equipment 8, which is between the side walls 4, 6 where no air conditioning unit is installed and the semiconductor manufacturing equipment 8. This makes it possible to prevent the hot air from the portion above the semiconductor manufacturing equipment 8 from flowing into the portion above the front side of the semiconductor manufacturing equipment 8 (an example of the "other area" of the present disclosure) as shown in the rectangular area surrounded by the dashed line in FIG. 4. This makes it possible to suppress the temperature rise of the piled-up cool air even in the portion above the front side of the semiconductor manufacturing equipment 8.

Incidentally, the upper part of the second area between the rows of equipment whose front faces each other and the upper part of the front side of the semiconductor manufacturing equipment 8 include a vertical transport area in which the containers 10 containing products are transported vertically between the load port 9 and the transport device 13 by the raising and lowering of the hoist of the transport device 13, as shown in FIG. 2. In addition, it also includes a horizontal transport area in which the containers 10 are transported horizontally by the travel of the transport device 13 on the rails 14.

In recent years, the products of semiconductor manufacturing equipment 8 have become increasingly miniaturized, including extremely fine wiring of, for example, 20 nm, which can cause defects due to heat.

As described above, the air conditioning system of this embodiment can suppress temperature increases above the areas between the rows of equipment whose front faces face each other and above the areas on the front side of the semiconductor manufacturing equipment 8, thereby suppressing the occurrence of heat-induced defects in products during transport.

Some of the hot air that has accumulated in the upper part of the clean room 1 descends along the side walls 3 and 5 and is drawn in through the air intake 17 provided on the upper surface 16a of the air intake section 16 of the air conditioning unit. The hot air is then supplied from the air intake section 16 to the air supply section 15, where it is cooled and becomes cold air. The cold air is then blown out again from the air outlet 18 after dust and other particles are removed from it in the air supply section 15.

The temperature distribution in the clean room 1 when the first partition plate 20 is provided was simulated. For comparison, the temperature distribution in the clean room when the first partition plate 20 is not provided was also simulated.

Figure 5 (A) is a diagram showing an outline of the configuration of a clean room when a first partition plate is provided, and Figure 5 (B) is a cross-sectional view showing the temperature distribution in the vertical direction in the clean room at a predetermined position in the column direction in that case. Furthermore, Figures 6 (A) and (B) are cross-sectional views showing the temperature distribution in the horizontal direction in the clean room at a predetermined position in the height direction in the same case when a first partition plate is provided.

Figure 7(A) is a schematic diagram of the clean room configuration when the first partition plate is not provided, and Figure 7(B) is a cross-sectional view showing the temperature distribution in the vertical direction in the clean room at a predetermined position in the column direction in that case. Figures 8(A) and (B) are cross-sectional views showing the temperature distribution in the horizontal direction in the clean room at a predetermined position in the height direction in the same case when the first partition plate is not provided.

The conditions used in these simulations were as follows. That is, the floor area of the clean room was 36 m wide (length perpendicular to the row direction) × 35 m deep (length in the row direction) = 1,260 ^m2 , and the ceiling height was 8 m. The number of semiconductor manufacturing devices 8 was 64, and the load (heat generation) by the devices 8 was 19,687.5 W/device. The load was broken down as follows: 50% on the top surface of the device 8, 0% on the front surface, 30% on the rear surface, and 10% on the side surface × 2 = 20%. As a result, the total load by the devices 8 was 1,260,000 W, and the load density in the clean room was 1,000 W/ ^m2 . Furthermore, the number of air conditioning units (air supply section 15, air intake section 16) was 24, and the air volume of each air conditioning unit was 12,000 ^m3 /h. As a result, the total air volume was 288,000 ^m3 /h. Furthermore, the temperature of the cold air blown out from the air conditioning unit was set to 20° C., and the circulation rate of the air conditioning unit was set to 65 times/h. Note that this circulation rate is the circulation rate at the guaranteed height (3.5 m), i.e., the height of the container held by the conveying device suspended from the rail. The guaranteed height is understood to be the height set as the condition-specifying region described above.

The first partition plate 20 is suspended from the ceiling frame to cover the area from the top of the device (height 2.5 m) to the ceiling frame (height 4.5 m). The height of the ceiling frame is roughly equivalent to the upper limit of the part where the cold air is blown out by the air outlet 18 of the air supply section 15.

The simulation results also showed the temperature distribution at a position 19.25 m from the side wall where the air conditioning unit is installed as a predetermined position in the row direction. Furthermore, as predetermined positions in the height direction, the temperature distribution at a height of 1.5 m from the floor in the first area and the temperature distribution at a height of 3.5 m in the second area were shown. Note that in the simulation results, the white areas indicate device 8. Furthermore, among the sections between device rows, the section with the longer distance between devices indicates the section between device rows where the front faces face each other, and the section with the shorter distance between devices indicates the section between device rows where the rear faces face each other.

For example, in the portion between the rows of devices in the first region where the front faces face each other, the above-mentioned predetermined position in the row direction is a position near the center of the depth of the clean room. This position is where the temperature is highest in the row direction, as shown in Figures 6(A) and 8(A), because heat from the sides and rear of the devices 8 flows in from each of the portions between the devices 8 in the row. At this predetermined position in the row direction, focusing on the upper portion of the portion between the rows of devices in the second region where the front faces face each other, the temperature distribution at the guaranteed height is as follows. That is, if the first partition plate 20 is not provided, the temperature distribution is as shown in Figures 7(B) and 8(A).
As shown in FIG. 5B, the guaranteed height includes a region with a temperature range of 30° C. to 32° C. and a region with a temperature range of 32° C. to 34° C. In contrast, when the first partition plate 20 is provided, as shown in FIG. 5B and FIG. 6B, the region with a temperature range of 30° C. to 32° C. becomes higher, so that the region with a temperature range of 32° C. to 34° C. disappears at the guaranteed height, and only the region with a temperature range of 30° C. to 32° C. exists. From this, it was found that the provision of the first partition plate 20 suppresses the temperature rise of the cold air in the focused portion. Similarly, it was found that the temperature rise of the cold air is also suppressed in the portion above the front side of the device in the second region.

As described above, in the air conditioning system of this embodiment, for example, the first partition plate 20 is arranged in the second area on the front side of the upper surface of the semiconductor manufacturing equipment 8 in an upright position relative to the floor 2, separating the upper portion of the upper surface of the semiconductor manufacturing equipment 8 from the upper portion between the rows of equipment whose front faces face each other. This makes it possible to block the hot air above the semiconductor manufacturing equipment 8 from flowing into the upper portion between the rows of equipment whose front faces face each other. This makes it possible to suppress the temperature rise of the cool air above the portion between the rows of equipment whose front faces face each other while maintaining an air volume that can maintain temperature stratification by displacement air conditioning.

In this embodiment, as described above, an air conditioning system based on displacement air conditioning is adopted, and the heat of the semiconductor manufacturing equipment 8 is processed by air conditioning while maintaining the temperature stratification in the room, so the first partition plate 20 and other partition plates described later do not completely separate the indoor space. In other words, this embodiment is based on the realization of efficient air conditioning by displacement air conditioning that gradually pushes air up from the floor 2 to the ceiling 7 while maintaining the temperature stratification in the room, and does not adopt air conditioning based on forced circulation that completely blocks the cold aisle and the hot aisle with a partition, as is used in data centers, for example, so there is a gap between the semiconductor manufacturing equipment 8 and the first partition plate 20. Therefore, workers can pass through and items can be taken in and out through such a gap, and inspection of the semiconductor manufacturing equipment 8 is also easy. This is the same in other embodiments described later.

In this embodiment, the first partition plate 20 arranged above each equipment row is composed of one plate-shaped member, but may be composed of multiple plate-shaped members. Also, the first partition plate 20 covers from the semiconductor manufacturing equipment 8 to the ceiling frame 12, but is not limited to this. For example, a gap may be provided between the semiconductor manufacturing equipment 8 and the first partition plate 20, or between the first partition plate 20 and the ceiling frame 12, or both, to cover a portion of the area from the semiconductor manufacturing equipment 8 to the ceiling frame 12.

Second Embodiment
Fig. 9 is a top view showing the configuration of a clean room to which the air conditioning system according to the second embodiment is applied, Fig. 10(A) is a side view showing the configuration of a part of the clean room as viewed in the row direction of the equipment rows, and Fig. 10(B) is a side view showing the configuration as viewed in a direction perpendicular to the row direction of the equipment rows.

The air conditioning system of the first embodiment described above is provided with a first partition plate 20. The air conditioning system of this embodiment is provided with a second partition plate in addition to the first partition plate 20. In the air conditioning system of this embodiment, the configuration other than the second partition plate is the same as the air conditioning system of the first embodiment, so a detailed description thereof will be omitted.

As shown in Fig. 9 and Fig. 10, the second partition plate 21 is a plate-like member such as a resin plate, and is hung from the ceiling frame 12 with a suspender at the upper end. As a result, the second partition plate 21 is arranged as follows for adjacent equipment rows (for example, the first and second equipment rows from the left in Fig. 9) whose rear surfaces face each other. That is, the second partition plate 21 is arranged in an upright state with respect to the floor 2 on the side of the outer side of the row of the first semiconductor manufacturing equipment 8 in the equipment row and on the side of the outer side of the row of the rear semiconductor manufacturing equipment 8 in the first and second areas. Furthermore, the second partition plate 21 extends in a direction perpendicular to the row direction, i.e., perpendicular to the blowing direction of cool air, from the semiconductor manufacturing equipment 8 in one equipment row through the portion between the equipment rows whose rear surfaces face each other to the semiconductor manufacturing equipment 8 in the other equipment row.

Therefore, in the second region, the first and second partition plates 20, 21 surround the periphery of the portion above the semiconductor manufacturing equipment 8 in the adjacent equipment rows.

In the clean room 1 to which the air conditioning system of this embodiment configured as described above is applied, the flow of cold air and hot air is basically the same as that of the first embodiment. However, due to the placement of the second partition plate 21, there are the following differences.

First, regarding the cold air, if the second partition plate 21 is not arranged, the cold air blown out in the row direction from the air outlet 18 of the air supply section 15 will pile up, for example, in both the portions between the rows of devices in the first area, i.e., the portions between the rows of devices whose front faces face each other, and the portions between the rows of devices whose rear faces face each other.

In contrast, in this embodiment, the second partition plate 21 covers the portions of the first region between the device rows where the rear faces face each other at both ends of the row direction of adjacent device rows. As a result, the cold air blown out from the air outlet 18 of the air supply section 15 does not pile up much in the portions between the device rows where the rear faces face each other, but rather concentrates and piles up in the portions between the device rows where the front faces face each other. Therefore, the temperature of the piled up cold air can be lowered overall in the portions of the first region between the device rows where the front faces face each other, and in the portion above the portions of the second region between the device rows where the front faces face each other.

In addition, with regard to the high-temperature air, if the second partition plate 21 is not arranged, in the first region, the high-temperature air from the lateral portions of the sides and rear of the semiconductor manufacturing equipment 8 at both ends of the row direction of adjacent rows of equipment flows into the portion between the semiconductor manufacturing equipment 8 and the side walls 3, 5, and further flows into the portion between the rows of equipment whose front faces face each other. Furthermore, in the second region, the high-temperature air from the portion above the semiconductor manufacturing equipment 8 flows into the portion above the portion between the semiconductor manufacturing equipment 8 and the side walls 3, 5, and further flows into the portion above the portion between the rows of equipment whose front faces face each other.

In contrast, in this embodiment, the second partition plate 21 separates the first region from the side of the semiconductor manufacturing equipment 8 and the portion between the rows of equipment whose front faces face each other, via the portion between the semiconductor manufacturing equipment 8 and the side walls 3 and 5 on the side of the side. This prevents high-temperature air from the side of the side and rear of the semiconductor manufacturing equipment 8 (an example of the "heat dissipation section" of this disclosure) (an example of the "rising region where high-temperature air rises" of this disclosure) from flowing into the portion between the rows of equipment whose front faces face each other (an example of the "other region" of this disclosure). Furthermore, the second region is separated from the portion above the semiconductor manufacturing equipment 8 and the portion above the portion between the rows of equipment whose front faces face each other, via the portion above the portion between the semiconductor manufacturing equipment 8 and the side walls 3 and 5. This makes it possible to block the high-temperature air in the area above the semiconductor manufacturing equipment 8 (an example of the "rising area where high-temperature air rises" in this disclosure) from flowing into the area above the area between the rows of equipment whose front faces face each other (an example of the "other area" in this disclosure).

As a result, the temperature rise of the piled up cold air can be further suppressed in the upper part between the rows of equipment whose front faces each other.

In addition, the second partition plate 21 causes the cold air blown out from the air outlet 18 of the air supply section 15 to concentrate and pile up in the front part of the semiconductor manufacturing equipment 8 in the first area. This makes it possible to lower the temperature of the piled up cold air overall in the front part of the semiconductor manufacturing equipment 8 and in the part of the second area above that above the front part of the semiconductor manufacturing equipment 8.

In addition, the second partition plate 21 separates the first region from the sides and rear of the semiconductor manufacturing equipment 8 via the portions between the semiconductor manufacturing equipment 8 and the side walls 3 and 5, and from the front of the semiconductor manufacturing equipment 8. This prevents the high-temperature air from the sides and rear of the semiconductor manufacturing equipment 8 from flowing into the front of the semiconductor manufacturing equipment 8 (one example of the "other region" of this disclosure). Furthermore, the second region separates the top of the semiconductor manufacturing equipment 8 from the portion above the front of the semiconductor manufacturing equipment 8 via the portion above the portion between the semiconductor manufacturing equipment 8 and the side walls 3 and 5. This prevents the high-temperature air from the top of the semiconductor manufacturing equipment 8 from flowing into the portion above the front of the semiconductor manufacturing equipment 8 (one example of the "other region" of this disclosure).

As a result, the temperature rise of the piled up cold air can be further suppressed even above the front side of the semiconductor manufacturing equipment 8.

The temperature distribution inside the clean room 1 was simulated when the first and second partition plates 20 and 21 were installed.

Figure 11 (A) is a diagram showing an outline of the configuration of a clean room when first and second partition plates are provided, and Figure 11 (B) is a cross-sectional view showing the temperature distribution in the vertical direction in the clean room at a predetermined position in the column direction in that case. Furthermore, Figures 12 (A) and (B) are cross-sectional views showing the temperature distribution in the horizontal direction in the clean room at a predetermined position in the height direction when first and second partition plates are provided.

The conditions used in this simulation include all of the conditions used in the simulation of the first embodiment. In addition to those conditions, in this embodiment, the second partition plate 21 is suspended from the ceiling frame to cover the area from the floor (height 0 m) to the ceiling frame (height 4.5 m).

For example, when focusing on the upper part of the second region between the rows of devices whose front faces each other at a certain position in the row direction, the temperature distribution at the guaranteed height is as follows. That is, when the first and second partition plates 20, 21 are provided, as shown in Fig. 11(B) and Fig. 12(B), for example, the region of the temperature range from 28°C to 30°C becomes higher, and the region of the temperature range from 30°C to 32°C that exists when only the first partition plate 20 is provided (see Figs. 5 and 6) disappears at the guaranteed height, and only the region of the temperature range from 28°C to 30°C exists. From this, it was found that the temperature rise of the cold air is further suppressed in the focused part by further providing the second partition plate 21. Similarly, it was found that the temperature rise of the cold air is further suppressed in the upper part of the front side of the devices in the second region.

As described above, in the air conditioning system of this embodiment, in addition to the arrangement of the first partition plate 20, the second partition plate 21 is further arranged in an upright position relative to the floor 2 in the first area and the second area, next to the outer side of the row of the first semiconductor manufacturing equipment 8 in adjacent rows of equipment whose rear faces face each other, and next to the outer side of the row of the last semiconductor manufacturing equipment 8.

The second partition plate 21 covers the areas between the device rows where the rear faces face each other at both ends of the row direction of adjacent device rows. As a result, the cold air blown out from the air outlet 18 of the air supply section 15 is concentrated and piled up, for example, in the area between the device rows where the front faces face each other in the first area. This makes it possible to lower the temperature of the piled up cold air overall in the area between the device rows where the front faces face each other and in the area above that, above the area between the device rows where the front faces face each other in the second area.

Furthermore, the second partition plate 21 separates the side of the side of the semiconductor manufacturing equipment 8 from the area between the rows of equipment whose front faces face each other, via the area between the semiconductor manufacturing equipment 8 and the side walls 3 and 5 on the side of the side of the side. This makes it possible to prevent high-temperature air from the lateral area of the side and rear of the semiconductor manufacturing equipment 8 from flowing into the area between the rows of equipment whose front faces face each other. Furthermore, the second region is separated from the area above the semiconductor manufacturing equipment 8 by the area above the area between the semiconductor manufacturing equipment 8 and the side walls 3 and 5. This makes it possible to prevent high-temperature air from the area above the semiconductor manufacturing equipment 8 from flowing into the area above the area between the rows of equipment whose front faces face each other.

As a result, it is possible to maintain the air volume required to maintain temperature stratification through displacement air conditioning, while further suppressing the temperature rise of the cold air above the area between the rows of equipment whose front faces each other.

In this embodiment, the second partition plate 21 arranged at each end of the adjacent device rows in the row direction is composed of one plate-shaped member, but may be composed of multiple plate-shaped members. Also, the second partition plate 21 covers from the floor 2 to the ceiling frame 12, but is not limited to this. For example, a gap may be provided between the floor 2 and the second partition plate 21, or between the second partition plate 21 and the ceiling frame 12, or both of these spaces, so that the second partition plate 21 covers a part of the area from the floor 2 to the ceiling frame 12.
[Third embodiment]

Figure 13 is a top view showing the configuration of a clean room to which an air conditioning system according to a third embodiment is applied. Also, Figure 14(A) is a side view showing the configuration of a part of the clean room when viewed in the row direction of the equipment rows, and Figure 14(B) is a side view showing the configuration when viewed in a direction perpendicular to the row direction of the equipment rows.

The air conditioning system of the second embodiment described above includes first and second partition plates 20, 21. The air conditioning system of this embodiment includes a third partition plate in addition to the first and second partition plates 20, 21. The configuration of the air conditioning system of this embodiment other than the third partition plate is the same as that of the air conditioning system of the second embodiment, so a detailed description thereof will be omitted.

As shown in Fig. 13 and Fig. 14, the third partition plate 22 is a plate-like member such as a resin plate, and is installed on the ceiling frame 12 as a partial ceiling panel with a fastener on the lower surface. As a result, the third partition plate 22 is arranged as follows for adjacent device rows (the second and third device rows from the left in Fig. 13) in which the front faces of the semiconductor manufacturing devices 8 face each other. That is, the third partition plate 22 is arranged as a part thereof (hereinafter referred to as the "first part") in a state of being laid down against the floor 2 in the upper part of the second area, above the part between the device rows in which the front faces each other. Furthermore, the first part of the third partition plate 22 extends linearly in the row direction in the range from the front to the rear of the device row. In addition to this, the third partition plate 22 is also arranged as follows around the multiple device rows. That is, the third partition plate 22, as the remaining portion (hereinafter referred to as the "second portion"), is disposed in a frame-like state in a state of being tilted down against the floor 2 on the portion of the upper part of the second area between the four side walls 3 to 6 and the semiconductor manufacturing equipment 8. The second portion of the third partition plate 22 is connected to both ends of the first portion of the third partition plate 22 near the center of the side walls 3 and 5 on which the air conditioning unit is installed.

In the clean room 1 to which the air conditioning system of this embodiment configured as described above is applied, the flow of cold air and hot air is basically the same as that of the second embodiment. However, due to the placement of the third partition plate 22, the following points are different.

As mentioned above, the third area is filled with high-temperature air that has been heated by the heat of the semiconductor manufacturing equipment 8 and rises. If the third partition plate 22 were not provided, the hot air from the third area would flow into the area above the rows of equipment in the second area, where the front faces of the equipment face each other and are relatively cooler.

In contrast, in this embodiment, the first portion of the third partition plate 22 separates the third region from the portion of the second region above the portion between the rows of devices whose front faces face each other. This makes it possible to block the hot air in the third region (an example of the "rising region where hot air rises" in this disclosure) from flowing into the portion above the portion between the rows of devices whose front faces face each other (an example of the "other region" in this disclosure). This makes it possible to further suppress the temperature rise of the piled up cool air in the portion above the portion between the rows of devices whose front faces face each other.

The second portion of the third partition plate 22 separates the third area from the portion of the second area above the portion of the front side of the semiconductor manufacturing equipment 8. This makes it possible to block the hot air from the third area from flowing into the portion above the portion of the front side of the semiconductor manufacturing equipment 8 (an example of the "other area" of this disclosure). This makes it possible to further suppress the temperature rise of the piled-up cool air even in the portion above the portion of the front side of the semiconductor manufacturing equipment 8.

The temperature distribution in the clean room 1 was simulated when the first, second and third partition plates 20, 21 and 22 were installed.

Figure 15 (A) is a diagram showing an outline of the configuration of a clean room when first, second, and third partition plates are provided, and Figure 15 (B) is a cross-sectional view showing the vertical temperature distribution in the clean room at a specified position in the column direction in that case. Furthermore, Figures 16 (A) and (B) are cross-sectional views showing the horizontal temperature distribution in the clean room at a specified position in the height direction when first, second, and third partition plates are provided.

The conditions used in this simulation include all of the conditions used in the simulation of the second embodiment. In addition to those conditions, in this embodiment, the third partition plate 22 is installed above the ceiling frame (height 4.5 m).

For example, when the above-mentioned predetermined position in the row direction is focused on the upper part of the second region between the rows of devices whose front faces each other, the temperature distribution of the guaranteed height is as follows. That is, when the first, second and third partition plates 20-22 are provided, as shown in Fig. 15(B) and Fig. 16(B), the area of the temperature range from 28°C to 30°C that exists in the guaranteed height when only the first and second partition plates 20, 21 are provided (see Fig. 11 and Fig. 12) disappears, and only the area of the temperature range from 20°C to 22°C exists. From this, it was found that the temperature rise of the cold air is further suppressed in the focused part by further providing the third partition plate 22. Similarly, it was found that the temperature rise of the cold air is further suppressed in the upper part of the front side of the devices in the second region.

As described above, in the air conditioning system of this embodiment, in addition to the arrangement of the first and second partition plates 20, 21, for example, the first member of the third partition plate 22 is arranged in a fallen state against the floor 2 in the upper part of the second area above the portion between the rows of devices whose front faces face each other, separating the third area from the portion of the second area above the portion between the rows of devices whose front faces face each other. This makes it possible to block the hot air in the third area from flowing into the portion above the portion between the rows of devices whose front faces face each other. Therefore, it is possible to further suppress the temperature rise of the cool air in the portion above the portion between the rows of devices whose front faces face each other while maintaining an air volume that can maintain the temperature stratification by displacement air conditioning.

In this embodiment, the third partition plate 22 is installed on the ceiling frame 12, but this is not limited to the above. For example, the third partition plate may be made up of multiple plate-shaped members, and the multiple plate-shaped members may be fitted into the openings between the lattices of the lattice-shaped ceiling frame 12.

[Fourth embodiment]
Fig. 17 is a top view showing the configuration of a clean room to which an air conditioning system according to a fourth embodiment is applied, Fig. 18(A) is a side view showing the configuration of a part of the clean room as viewed in the row direction of the equipment rows, and Fig. 18(B) is a side view showing the configuration as viewed in a direction perpendicular to the row direction of the equipment rows.

In the air conditioning system of the first embodiment described above, only the first partition plate 20 is arranged. In the air conditioning system of this embodiment, the first partition plate 20 is replaced and only the third partition plate 22 used in the air conditioning system of the third embodiment is provided. In the air conditioning system of this embodiment, the configuration is the same as that of the air conditioning system of the first embodiment except that the first partition plate 20 is replaced and only the third partition plate 22 is provided, so a detailed description thereof will be omitted.

As shown in Figures 17 and 18, the third partition plate 22 of this embodiment is the same member as the third partition plate 22 of the third embodiment. Therefore, a detailed description of the third partition plate 22 will be omitted.

In the clean room 1 to which the air conditioning system of this embodiment configured as described above is applied, the flow of cold air and hot air is basically the same as that of the first embodiment. However, by replacing the first partition plate 20 with a third partition plate 22, the following points are different.

If the third partition plate 22 is not installed, the hot air from the third area will flow into the area above the rows of equipment in the second area where the relatively cool front faces of the equipment face each other.

In contrast, in this embodiment, the first portion of the third partition plate 22 separates the third region from the portion of the second region above the portion between the rows of devices whose front faces face each other. This makes it possible to block the hot air from the third region from flowing into the portion of the second region above the portion between the rows of devices whose front faces face each other.

Furthermore, the first portion of the third partition plate 22 covers the boundary between the upper portion of the portion between the rows of equipment whose front faces face each other in the second region and the upper portion of the portion between the rows of equipment whose front faces face each other in the third region above. This allows the cold air that has piled up in the portion above the portion between the rows of equipment whose front faces face each other in the second region to flow not above it, but to the portion above the semiconductor manufacturing equipment 8 beside it. As this cold air flows, lower temperature cold air rises from the portion between the rows of equipment whose front faces face each other in the first region below to the portion above the portion between the rows of equipment whose front faces face each other.

As a result, the temperature rise of the piled-up cool air can be suppressed in the upper part of the second area between the rows of devices whose front faces face each other.

The second portion of the third partition plate 22 separates the third area from the portion of the second area above the front side of the semiconductor manufacturing equipment 8. This makes it possible to prevent the hot air from the third area from flowing into the portion above the front side of the semiconductor manufacturing equipment 8.

Furthermore, the second part of the third partition plate 22 covers the boundary between the upper part of the front part of the semiconductor manufacturing equipment 8 in the second area and the upper part of the front part of the semiconductor manufacturing equipment 8 in the third area above. This allows the cold air that has piled up in the upper part of the front part of the semiconductor manufacturing equipment 8 in the second area to flow to the part above the semiconductor manufacturing equipment 8 next to it. As a result of this flow of cold air, lower temperature cold air rises up to the upper part of the front part of the semiconductor manufacturing equipment 8 from the front part of the semiconductor manufacturing equipment 8 in the first area below.

As a result, the temperature rise of the piled up cold air can be suppressed even in the upper part of the second area on the front side of the semiconductor manufacturing equipment 8.

The temperature distribution in the clean room 1 was simulated when only the third partition plate 22 was installed.

Figure 19 (A) is a diagram showing an outline of the configuration of a clean room when a third partition plate is provided, and Figure 19 (B) is a cross-sectional view showing the temperature distribution in the vertical direction in the clean room at a specified position in the column direction in that case. Furthermore, Figures 20 (A) and (B) are cross-sectional views showing the temperature distribution in the horizontal direction in the clean room at a specified position in the height direction when a third partition plate is provided.

The conditions used in this simulation are basically the same as those used in the simulation of the first embodiment. However, in this embodiment, the condition used in the first embodiment, in which the first partition plate 20 covers the device from the height of the top end to the height of the ceiling frame, is changed to one in which the third partition plate 22 is installed above the ceiling frame (height 4.5 m).

For example, when focusing on the upper part of the portion between the rows of devices whose front faces each other in the second region at a predetermined position in the row direction, the temperature distribution of the guaranteed height is as follows. That is, when only the third partition plate 22 is provided, as shown in Figures 19(B) and 20(B), there is no region in the temperature range of 30°C to 34°C, which exists when none of the first to third partition plates 20 to 23 are provided (see Figures 7 and 8), and there is a mixture of a region in the temperature range of 26°C to 28°C and a region in the temperature range of 28°C to 30°C. From this, it was found that the provision of the third partition plate 22 suppresses the temperature rise of the cold air in the focused portion. Similarly, it was found that the temperature rise of the cold air is also suppressed in the upper part of the front side of the devices in the second region.

As described above, in the air conditioning system of this embodiment, for example, the first member of the third partition plate 22 is arranged in a fallen state against the floor 2 in the upper part of the second area above the portion between the rows of devices whose front faces face each other, separating the third area from the portion above the portion between the rows of devices whose front faces face each other in the second area. This makes it possible to block the hot air in the third area from flowing into the portion above the portion between the rows of devices whose front faces face each other. Therefore, it is possible to suppress the temperature rise of the cool air in the portion above the portion between the rows of devices whose front faces face each other while maintaining an air volume that can maintain the temperature stratification by displacement air conditioning.
[Modification of the fourth embodiment]

In the air conditioning system of the fourth embodiment described above, the first portion of the third partition plate 22 is disposed in the upper portion of the second region above the portion between the rows of devices whose front faces face each other. In other words, the width of the first portion of the third partition plate 22 is the same as the width of the portion between the rows of devices whose front faces face each other. However, the width of the first portion of the third partition plate 22 is not limited to being the same as the width of the portion between the rows of devices whose front faces face each other.

For example, in this modified example, both ends of the first portion of the third partition plate are extended toward the semiconductor manufacturing equipment 8 in the adjacent equipment rows so as to cover a portion of the upper surface of the semiconductor manufacturing equipment 8, and the width of the first portion is made wider than the width of the portion between the equipment rows whose front faces each other. Furthermore, one end of the second portion of the third partition plate on the side walls 4 and 6 where the air conditioning unit is not installed is also extended toward the semiconductor manufacturing equipment 8 in the equipment row so as to cover a portion of the upper surface of the semiconductor manufacturing equipment 8, and the width of the second portion is made wider than the width of the portion between the side walls 4 and 6 and the semiconductor manufacturing equipment 8. Note that the width of the second portion of the third partition plate on the side walls 3 and 5 where the air conditioning unit is installed is the same as the width of the portion between the side walls 3 and 5 and the semiconductor manufacturing equipment 8, as in the fourth embodiment.

The temperature distribution inside the clean room 1 was simulated when the third partition was extended toward the semiconductor manufacturing equipment 8.

Figure 21 (A) is a diagram showing an outline of the configuration of the clean room when the third partition plate is extended toward the equipment side, and Figure 21 (B) is a cross-sectional view showing the temperature distribution in the vertical direction in the clean room at a specified position in the column direction in that case. Furthermore, Figures 22 (A) and (B) are cross-sectional views showing the temperature distribution in the horizontal direction in the clean room at a specified position in the height direction when the third partition plate is extended toward the equipment side.

The conditions used in this simulation are basically the same as those used in the simulation of the fourth embodiment. However, in this modified example, the third partition plate 22 used is a partition plate in which both ends of the first part are extended 2 m toward the equipment side, and one end of the second part on the side wall where the air conditioning unit is not installed is extended 2 m toward the equipment side.

For example, in the above-mentioned predetermined position in the row direction, when the upper part of the second region between the rows of devices whose front faces each other is focused on, the temperature distribution at the guaranteed height is as follows. That is, when the third partition plate 22 is extended toward the device side, only the region with a temperature range of 26°C to 28°C exists at the guaranteed height, as shown in Figures 21(B) and 22(B). From this, it was found that even if the third partition plate 22 is extended to 2m toward the device side, the temperature rise of the cold air is suppressed in the focused part to the same extent as when the third partition plate 22 is not extended. Similarly, it was found that the temperature rise of the cold air is suppressed in the upper part of the front side of the device in the second region to the same extent as when the third partition plate 22 is not extended.

Note that extending the third partition plate 22 increases the amount of plate-shaped material used, and therefore increases the cost of the third partition plate 22. From the perspective of cost-effectiveness, therefore, it may be decided whether or not to extend the third partition plate 22 toward the device side, and if it is extended, it may be decided to what length up to 2 m.

[Fifth embodiment]
Fig. 23 is a top view showing the configuration of a clean room to which an air conditioning system according to the fifth embodiment is applied, Fig. 24(A) is a side view showing the configuration of a part of the clean room as viewed in the row direction of the equipment rows, and Fig. 24(B) is a side view showing the configuration as viewed in a direction perpendicular to the row direction of the equipment rows.

The air conditioning system of the fourth embodiment described above is provided with only the third partition plate 22. The air conditioning system of this embodiment is provided with a fan in addition to the third partition plate 22. The configuration of the air conditioning system of this embodiment other than the fan is the same as that of the air conditioning system of the fourth embodiment, so a detailed description thereof will be omitted.

As shown in Figures 23 and 24, the fans 23 blow air upward and are attached to the ceiling frame 12 with fasteners. The fans 23 are also located above each of the multiple semiconductor manufacturing devices 8 in the upper part of the second area. The fans 23 are set to an air volume that can maintain the temperature stratification caused by displacement air conditioning.

In the clean room 1 to which the air conditioning system of this embodiment configured as described above is applied, the flow of cold air and hot air is basically the same as that of the fourth embodiment. However, due to the presence of the fan 23, there are the following differences.

As mentioned above, the third partition plate 22 allows the cold air that is piled up above the area between the rows of equipment whose fronts face each other in the second area to flow to the area above the semiconductor manufacturing equipment 8 next to it.

On the other hand, even if the fan 23 is not arranged, the hot air in the part of the second area above the semiconductor manufacturing equipment 8 rises to the third area, but by arranging the fan 23, the hot air in the part of the second area above the semiconductor manufacturing equipment 8 can be forced to rise to the third area.

In this embodiment, as the high-temperature air is forcibly raised by the fan 23, the cold air piled up in the upper part of the area between the rows of equipment whose front faces face each other in the second region flows more strongly to the area above the semiconductor manufacturing equipment 8 beside it. Furthermore, as this cold air flows, lower-temperature cold air rises up from the area between the rows of equipment whose front faces face each other in the first region below to the area above the area between the rows of equipment whose front faces face each other. Therefore, the temperature rise of the piled-up cold air can be suppressed in the area above the area between the rows of equipment whose front faces face each other.

In addition, as the high-temperature air is forcibly raised by the fan 23, the cool air piled up above the front part of the semiconductor manufacturing equipment 8 in the second area flows more strongly to the area above the semiconductor manufacturing equipment 8 beside it. Furthermore, as this cool air flows, cooler air rises from the front part of the semiconductor manufacturing equipment 8 in the first area below to the area above the front part of the semiconductor manufacturing equipment 8. Therefore, the temperature rise of the piled-up cool air can be suppressed even in the area above the front part of the semiconductor manufacturing equipment 8.

The temperature distribution inside the clean room 1 when a fan 23 is installed was simulated.

Figure 25(A) is a diagram showing an outline of the configuration of a clean room when a fan is provided, and Figure 25(B) is a cross-sectional view showing the temperature distribution in the vertical direction in the clean room at a specified position in the row direction in that case. Furthermore, Figures 26(A) and (B) are cross-sectional views showing the temperature distribution in the horizontal direction in the clean room at a specified position in the height direction when a fan is provided.

The conditions used in this simulation include all of the conditions used in the simulation of the fourth embodiment. In addition to those conditions, in this embodiment, the fan 23 is installed under the ceiling frame (height 4.5 m) above each of the multiple devices. Furthermore, the air volume of the fan 23 is 4,500 ^m3 /h.

For example, when focusing on the upper part of the second region between the rows of devices whose front faces each other at a given position in the row direction described above, the temperature distribution at the guaranteed height is as follows. That is, when the fan 23 is provided, as shown in Figures 25(B) and 26(B), the guaranteed height does not have the region of temperature range from 28°C to 30°C that exists when the fan 23 is not provided (see Figures 21 and 22), but has a mixture of regions of temperature ranges from 24°C to 26°C and 26°C to 28°C. From this, it was found that by further providing the fan 23, the temperature rise of the cold air is further suppressed in the focused region. Similarly, it was found that the temperature rise of the cold air is further suppressed in the upper part of the second region on the front side of the devices.

For comparison, we also simulated the temperature distribution in the clean room without the third partition plate 22 and equipped only with the fan 23.

Figure 27(A) is a diagram showing an outline of the configuration of a clean room when only a fan is provided without a third partition plate, and Figure 27(B) is a cross-sectional view showing the temperature distribution in the vertical direction in the clean room at a specified position in the column direction in that case. Furthermore, Figures 28(A) and (B) are cross-sectional views showing the temperature distribution in the horizontal direction in the clean room at a specified position in the height direction in the same case when only a fan is provided without a third partition plate.

The conditions used in this simulation were basically the same as those used in the simulation of the fourth embodiment. However, instead of the condition used in the fourth embodiment that the third partition plate 22 was installed above the ceiling frame (height 4.5 m), the fan 23 was installed below the ceiling frame (height 4.5 m) above each of the multiple devices. Furthermore, the air volume of the fan 23 was set to 4,500 ^m3 /h.

For example, in the above-mentioned predetermined position in the row direction, when the upper part of the second region between the rows of devices whose front faces each other is focused on, the temperature distribution of the guaranteed height is as follows. That is, when the third partition plate is not provided and only the fan 23 is provided, as shown in Fig. 27(B) and Fig. 28(B), the guaranteed height includes a region with a temperature range of 32°C to 34°C, and a region with a temperature range of 34°C to 36°C that does not exist when none of the first to third partition plates 20-22 and the fan 23 are provided (see Figs. 7 and 8). From this, it was found that it is more preferable to provide the fan 23 together with a partition plate such as the third partition plate 22 than to provide only the fan 23. Similarly, it was found that it is more preferable to provide the fan 23 together with a partition plate in the upper part of the front side of the devices in the second region.

As described above, in the air conditioning system of this embodiment, in addition to the third partition plate 22, fans 23 are also disposed above each of the multiple semiconductor manufacturing equipment 8 in the upper part of the second area. This allows the high-temperature air in the part of the second area above the semiconductor manufacturing equipment 8 to be forced to rise to the third area. Accordingly, for example, in the part above the part between the rows of equipment whose front faces each other in the second area, cooler air rises from the part between the rows of equipment whose front faces each other in the first area below. Therefore, it is possible to suppress the temperature rise of the cool air in the part above the part between the rows of equipment whose front faces each other while maintaining an air volume that can maintain the temperature stratification by displacement air conditioning.

In this embodiment, the fan 23 is arranged above each of the multiple semiconductor manufacturing devices 8 in the upper part of the second area, but this is not limited to the above. For example, the fan may be arranged above the portion between the rows of devices whose rear faces face each other in the upper part of the second area. The fan may also be arranged above each of the multiple semiconductor manufacturing devices 8 and above the portion between the rows of devices whose rear faces face each other in the upper part of the second area.

[Other embodiments]
The above-described first to fifth embodiments and their modifications can be combined with each other.

For example, the fan 23 used in the air conditioning system of the fifth embodiment may be added to each of the air conditioning systems of the first to third embodiments.

The second partition plate 21 used in the air conditioning system of the second embodiment may also be added to each of the air conditioning systems of the fourth and fifth embodiments.

The air conditioning system of the first embodiment includes only the first partition plate 20, and the air conditioning system of the fourth embodiment includes only the third partition plate 22. Similarly, the air conditioning system may include only the second partition plate 21.

[Modification]
In the above-described embodiment, plate-like members such as resin plates are used for the partition plates 20-22, but flexible thin members such as transparent vinyl sheets may also be used. Transparent, flexible thin members make it easy to see the state of the equipment through the partition plates 20-22. Furthermore, flexibility allows the members to deform when contacted by people or objects, and prevents them from interfering with work, etc. When a flexible member is used, it is preferable that the lower end is detachably attached to the semiconductor manufacturing equipment 8 in order to suppress loose movement.

In addition, in the above-mentioned embodiment, an air conditioning system that performs replacement air conditioning by attaching a swirl flow generator, such as fins 19, that imparts a swirling component to cool air to the air outlet 18 of the air supply section 15 of the air conditioner is described, but the present invention can also be applied to an air conditioning system that performs replacement air conditioning without attaching a swirl flow generator to the air outlet.

In the above embodiment, an air conditioning system that performs replacement air conditioning by installing an air conditioning unit including an air supply section 15 and an air intake section 16 in the clean room 1 has been described, but the form of the air conditioning system that performs replacement air conditioning is not limited to this. For example, the air supply section may generate cold air outside the clean room and supply it to an air supply chamber installed in the lower part of a side wall in the clean room, so that the cold air is blown out from an outlet of the air supply chamber. In addition, the air intake section may be provided with an air intake port in the upper part of a side wall or in the ceiling in the clean room, and a fan may be installed outside the clean room to exhaust high-temperature air in the clean room to the outside. In addition, in the above embodiment, an air conditioning unit in which the air intake section 16 includes a fan and the air supply section 15 includes a cooling coil and a filter has been described, but the form of the air conditioning unit is not limited to this. For example, the air conditioning unit may include a fan and a cooling coil in the air intake section, and a filter in the air supply section.

In the above embodiment, the air conditioning system that performs replacement air conditioning is applied to a clean room 1 in which multiple semiconductor manufacturing devices 8 are installed. However, the air conditioning system may be applied to a clean room 1 in which one semiconductor manufacturing device 8 is installed. In this case, the first partition plate may be arranged in an upright position relative to the floor on the front part of the upper surface of the semiconductor manufacturing device 8 in the second area. In addition, the second partition plate may be arranged in an upright position relative to the floor next to the side and rear surfaces of the semiconductor manufacturing device 8 in the first area and the second area. In addition, the third partition plate may be arranged in a tilted position relative to the floor 2 on the part above the front part of the semiconductor manufacturing device 8 in the upper part of the second area. Also, only the third partition plate may be arranged as described above. Furthermore, in addition to the partition plate, a fan may be arranged above the semiconductor manufacturing device 8 in the upper part of the second area.

In the above embodiment, the air conditioning system that performs replacement air conditioning is described as being applied to a clean room 1 in which semiconductor manufacturing equipment 8 is installed, but the application is not limited to a clean room 1 in which semiconductor manufacturing equipment 8 is installed. For example, the system may be applied to a clean room in which manufacturing equipment for chemicals or the like that requires strict temperature control is installed, or to a room other than a clean room.

REFERENCE SIGNS LIST 1 clean room 2 floor 3 to 6 side wall 7 ceiling 8 semiconductor manufacturing equipment 9 load port 10 container 11 hanging material 12 ceiling frame 13 transport device 14 rail 15 air supply section of air conditioning unit 15a front side of air supply section 16 air intake section of air conditioning unit 16a upper side of air intake section 17 air intake port 18 air outlet 19 fin 20 first partition plate 21 second partition plate 22 third partition plate 23 fan

Claims (10)

An air conditioning system that performs replacement air conditioning on a heat generating device installation room in which a heat generating device is installed,
an air outlet provided in a lower portion of the heat generating device installation chamber and configured to blow out cold air for cooling a first region from a floor to a predetermined height in a space within the heat generating device installation chamber while maintaining temperature stratification ;
an intake port provided at an upper portion of the heat generating device installation chamber for taking in high-temperature air rising from the heat generating device;
a partition member disposed in a second region above the first region in the space within the heat generating device installation room, the partition member separating an ascending region in which the high-temperature air ascends from another region;
Equipped with
The air conditioning system is characterized in that the partition member includes a first partition member that is erected in the second region above the condition specification section of the heat-generating device in which a predetermined temperature condition is specified, and the first partition member separates the rising region, including the area directly above the heat-generating device, from other regions . The air conditioning system according to claim 1, characterized in that the partition member includes a second partition member erected next to a side surface of the heat generating device in the first region and the second region so as to cover a heat dissipation portion of the heat generating device that dissipates heat from the air outlet side. 3. The air conditioning system according to claim 1, wherein the partition member includes a third partition member that covers an upper side of a condition defining portion of the heat generating device in which a predetermined temperature condition is defined. A plurality of the air outlets are arranged vertically and horizontally in a lower portion of the heat generating device installation chamber,
a swirl flow generator provided at each of the plurality of air outlets, for giving a swirl component to the cool air and blowing the cool air into the heating device installation room;
The air conditioning system according to any one of claims 1 to 3 , further comprising: 5. The air conditioning system according to claim 1 , wherein the heat generating devices are arranged in a row such that the condition defining portions, in which the predetermined temperature conditions are defined, face in the same direction. 6. The air conditioning system according to claim 5 , wherein the heating device row includes a row in which the condition defining units of the heating devices are arranged in a positional relationship facing each other. An air conditioning method for performing replacement air conditioning on a room in which a heat generating device is installed, comprising:
blowing out cold air from an air outlet provided in a lower portion of the heat generating device installation chamber to cool a first region from a floor to a predetermined height in a space within the heat generating device installation chamber while maintaining temperature stratification ;
The high-temperature air rising from the heat generating device is taken in through an air intake provided at the top of the heat generating device installation chamber,
a partition member disposed in a second region above the first region in the space within the heat generating device installation room to separate an ascending region in which the high-temperature air ascends from another region;
Including,
The air conditioning method is characterized in that the partition member includes a first partition member that is erected in the second region above the condition specification section of the heat-generating device in which a predetermined temperature condition is specified, and the first partition member separates the rising region, including the area directly above the heat-generating device, from other regions . A clean room in a factory where a heat-generating manufacturing device is installed and which is equipped with an air conditioning system that performs displacement air conditioning,
the manufacturing apparatus includes a load port for an automatic product conveyance system in a condition defining section in which a predetermined temperature condition is defined;
the automatic transfer system includes a transfer device that transfers products to and from the load port,
The air conditioning system includes:
an air outlet provided in a lower portion of the clean room and configured to blow out cold air for cooling a first region from a floor to a predetermined height in a space within the clean room while maintaining temperature stratification;
an intake port provided in an upper portion of the clean room for taking in high-temperature air rising from the manufacturing apparatus;
a partition member disposed in a second region above the first region in the space within the clean room, the partition member separating an ascending region in which the high-temperature air ascends from another region;
A factory clean room comprising: the clean room includes a ceiling frame suspended from a ceiling to be disposed between a floor and the ceiling and above the manufacturing equipment;
the transport device includes a track installed under the ceiling frame, and a hoist that travels while suspended from the track and moves up and down between the track and the load port,
the conveying device conveys a container containing a product of the manufacturing device in a horizontal direction by traveling on the track, and conveys the container in a vertical direction by raising and lowering the container between the load port and the conveying device using the hoist;
9. The factory clean room according to claim 8, wherein the first area is a vertical area of the space of the clean room from the floor to a predetermined height, and the second area is a vertical area from the predetermined height to the ceiling frame . A partition member for an air conditioning system that performs displacement air conditioning on a heat generating device installation room in which a heat generating device is installed,
a blowing outlet provided in a lower portion of the heat generating device installation room for blowing out cool air for cooling a first region from the floor to a predetermined height in the space within the heat generating device installation room while maintaining temperature stratification , and a intake port provided in an upper portion of the heat generating device installation room for taking in high-temperature air that has risen from the heat generating device , the blowing outlet being provided in a second region above the first region in the space within the heat generating device installation room, the blowing outlet separating an ascending region in which the high-temperature air rises from other regions,
The partition member for an air conditioning system is characterized in that the partition member includes a first partition member that is erected in the second region above the condition specification section of the heat-generating device in which a predetermined temperature condition is specified, and the first partition member separates the rising region, including the area directly above the heat-generating device, from other regions .

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