JP7699286B1 - electronic equipment - Google Patents

Abstract

An electronic device capable of reducing component costs is provided.
[Solution] An electronic device comprises a housing member, a board having a first side and a second side and a mounting hole penetrating in the plate thickness direction, a support surface supporting the first side of the board, a screw hole into which a screw passed through the mounting hole is tightened from the second side toward the first side, a boss portion protruding from the inner surface side of the housing member, a through hole arranged coaxially with the screw hole and through which the screw is passed, a stud component mounted on the second side of the board to cover the mounting hole, and a board fixing component fixed to the stud component by the screw tightened into the screw hole.
[Selected figure] Figure 3

Description

The present invention relates to an electronic device equipped with a substrate.

Electronic devices such as notebook PCs are equipped with a circuit board on which a CPU, connectors, etc. are mounted. In many cases, the circuit board is screwed to a housing member or a keyboard device supported by a housing member. A component such as a bracket that holds electronic components connected to the connector is fixed to the surface of the circuit board. For example, Patent Document 1 discloses a configuration in which this component is screwed to a stud component mounted on the circuit board.

JP 2020-057737 A

Conventionally, special stud components were mounted on the board in order to screw the above-mentioned components into place. This meant that the board's mounting space was taken up by the number of stud components mounted. As a result, it was previously necessary to expand the board area in accordance with the number of stud components mounted, which increased component costs.

The present invention was made in consideration of the problems with the conventional technology described above, and aims to provide an electronic device that can reduce component costs.

An electronic device according to one aspect of the present invention includes a housing member, a substrate having a first surface and a second surface and a mounting hole penetrating in a plate thickness direction, a support surface supporting the first surface of the substrate, a screw hole into which a screw passed through the mounting hole is fastened from the second surface side toward the first surface side, a boss portion provided to protrude from the inner surface side of the housing member, a through hole arranged coaxially with the screw hole and through which the screw is passed, a stud component mounted on the second surface of the substrate to cover the mounting hole, and a substrate fixing component fixed to the stud component by the screw fastened into the screw hole.

The above aspects of the present invention allow for reduced component costs.

FIG. 1 is a schematic plan view of an electronic device according to an embodiment viewed from above. FIG. 2 is a plan view showing a schematic internal structure of the housing. FIG. 3 is a schematic side cross-sectional view of the fastening structure. FIG. 4 is an exploded view of the fastening structure shown in FIG. FIG. 5 is a schematic side cross-sectional view of a fastening structure according to a modified example. FIG. 6 is a schematic side cross-sectional view of a fastening structure according to another modified example. FIG. 7 is a schematic cross-sectional side view showing a fixing structure of a board and a board fixing component according to a comparative example.

The following describes in detail a preferred embodiment of the electronic device according to the present invention with reference to the attached drawings.

FIG. 1 is a schematic plan view of an electronic device 10 according to an embodiment, viewed from above. As shown in FIG. 1, the electronic device 10 of this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to one another. In this embodiment, a notebook PC electronic device 10 is shown as an example, but the electronic device may be other than a notebook PC, such as a desktop PC, a display device, a tablet PC, a smartphone, or a portable game console.

The lid 11 is a thin, flat, box-shaped housing. The lid 11 is equipped with a display 16. The display 16 is, for example, an organic electroluminescence display or a liquid crystal display.

The housing 12 is a thin, flat box. The keyboard device 18 and the touch pad 19 face the top surface (surface 12a) of the housing 12. Hereinafter, the housing 12 and each of the components mounted thereon will be described with reference to the posture of the operator operating the keyboard device 18, with the width direction (left and right) of the housing 12 referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 referred to as the Z1 and Z2 directions. The X1 and X2 directions are sometimes collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions are sometimes similarly referred to as the Y direction and the Z direction. For convenience of explanation, the Z1 direction in the thickness direction of the housing 12 may be called the down direction, and the opposite (Z2 direction) may be called the up direction (see FIG. 3, etc.). These directions are determined for convenience of explanation, and may of course change depending on the usage state or installation posture of the electronic device 10.

The housing 12 is composed of a housing member 20 that forms the top surface and all four side surfaces, and a cover material 21 that forms the bottom surface. The housing member 20 is formed by forming standing walls 20B on the four peripheral edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the housing member 20 has a roughly bathtub shape with an open bottom surface. The cover material 21 has a roughly flat plate shape and serves as a lid that closes the bottom opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and are detachably connected to each other. The standing walls 20B may be formed on the cover material 21. In this case, it is preferable that the housing member 20 is composed of only the cover plate 20A.

The hinge 14 is installed in a concave hinge arrangement groove 12b formed in the rear edge of the housing 12, and connects the housing 12 and the cover 11. The hinge 14 has a structure in which a hinge shaft, which serves as an axis of rotation, is supported at both ends of the hinge housing in the longitudinal direction.

Figure 2 is a plan view showing the internal structure of the housing 12. Figure 2 shows the inside of the housing member 20 from the bottom side with the cover material 21 removed.

As shown in FIG. 2, the housing 12 contains a thermal module 24, a circuit board 25, and a battery device 26. Various electronic and mechanical components are also provided inside the housing 12.

The board 25 is a circuit board that serves as the main board (motherboard) of the electronic device 10. The board 25 is disposed toward the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source for the electronic device 10. The battery device 26 is disposed toward the Y1 side of the board 25 and extends in the X direction.

The board 25 of this embodiment is mounted with a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the board 25 can also mount various electronic components such as a GPU. For example, the first surface 25A on the Z1 side of the board 25 serves as the mounting surface for the housing member 20 and the keyboard device 18, and the second surface 25B on the Z2 side serves as the mounting surface for the CPU 25a and the like. The first surface 25A of the board 25 is fixed to the inner surface (Z2 side) of the housing member 20 using, for example, screws 27. Furthermore, the first surface 25A is also fixed to the bottom surface (Z2 side) of the keyboard device 18 using a fastening structure 52 described later.

The thermal module 24 can absorb and diffuse heat generated by the CPU 25a, which is a heat generating element, and expel the heat to the outside of the housing 12. The thermal module 24 may be configured to cool a heat generating element other than the CPU 25a, such as a GPU. As shown in FIG. 2, the thermal module 24 can have a heat diffusion member 32 including a metal plate 30, a pressing part 34, and a pair of left and right fans 36, 36.

The heat diffusion member 32 can absorb and diffuse heat from the CPU 25a. The heat diffusion member 32 is provided so as to cover a part of the second surface 25B of the substrate 25 together with the CPU 25a. The metal plate 30 is a thin metal plate-shaped member formed of a material with high thermal conductivity such as copper or aluminum. In this embodiment, the metal plate 30 is a copper plate. The heat diffusion member 32 can have a heat transport device such as a heat pipe or a vapor chamber laminated on the Z1 side of the metal plate 30. The heat pipe is a metal pipe that is crushed thin and flat to form an elliptical cross section, and a working fluid is sealed in the sealed space inside. The vapor chamber is a sealed space formed between two metal plates and a working fluid is sealed in it.

The pressing part 34 is a part for pressing the heat diffusion member 32 against the CPU 25a. The pressing part 34 constantly urges the heat diffusion member 32 toward the second surface 25B of the board 25. The pressing part 34 has a pair of leaf spring members 34a, 34a in the Y direction. The leaf spring member 34a is connected, for example, at its center to a thin metal frame fixed to the Z1 side of the heat diffusion member 32, and presses the heat diffusion member 32 against the CPU 25a through this metal frame. This metal frame is provided inside the frame so as to surround the CPU 25a, and is fixed to the surface of the Z1 side of the heat diffusion member 32 by soldering or the like. Both ends of each leaf spring member 34a are fastened and fixed to the stud parts 42 mounted on the second surface 25B of the board 25 using screws 44. The stud parts 42 have female threaded holes into which the screws 44 can be fastened, and protrude from the second surface 25B.

2, the left and right fans 36 are arranged side by side in the X direction so as to straddle the heat diffusion member 32 between them, and face each other. Each fan 36 has an outlet 36b on the side surface 36a facing each other. The outlets 36b of the left and right fans 36 face each other with the heat diffusion member 32 between them. This allows each fan 36 to discharge air toward the thermal module 24. Each fan 36 has an intake port 36c on at least the end surface on the Z2 side of the upper and lower end surfaces facing the Z direction. The intake port 36c can also be provided on the end surface on the Z1 side. The intake port 36c can draw in outside air (cold air) from, for example, a vent formed on the bottom surface of the housing 12. The fan 36 can be configured as a centrifugal fan that rotates an impeller housed inside the housing by a motor. The fan 36 can discharge the air drawn in from the intake port 36c from the outlet port 36b.

The housing 12 has an exhaust port 46 formed in the vertical wall 20B at its rear edge (Y2 side edge). The exhaust port 46 is a vent that can exhaust the air (hot air) that is discharged from the outlet 36b of each fan 36 and flows around the board 25 and thermal module 24 to the outside of the housing 12. A number of fins are formed upright on the surface 30a on the Z2 side of the metal plate 30 to expand the heat exchange area.

As shown in FIG. 2, for example, a connector 25b, electronic components 25c, and an external connection port 25d are mounted on the second surface 25B of the substrate 25.

The connector 25b is connected to a cable 48. For example, a pair of cables 48 are provided on the left and right. One cable 48 is, for example, a wire that connects the display 16 mounted on the cover 11 to the board 25. The other cable 48 is, for example, a wire that connects the camera 17 (see FIG. 1) mounted on the cover 11 to the board 25. Each cable 48 can be configured, for example, with a flexible board (FPC: Flexible printed circuits). The connector 25b is a so-called BtoB connector (board-to-board connector). A pair of connectors 25b are provided on the left and right to correspond to the left and right cables 48. For example, the connectors 25b can be provided near both ends of the leaf spring member 34a on the Y2 side.

The connection between the cable 48 and the connector 25b is held down by a bracket 50. The bracket 50 can be made of a metal plate such as stainless steel (SUS). As shown in FIG. 2, the left and right brackets 50 can be used by arranging the same parts symmetrically. The bracket 50 is arranged to straddle the cable 48 in the width direction and holds the cable 48 from above the connector 25b. This allows the bracket 50 to prevent the cable 48 from coming off the connector 25b. The bracket 50 has one end fixed to the board 25 in the direction straddling the cable 48 (X direction) using a fastening structure 52 described later. The other end of the bracket 50 is supported by, for example, the end of the leaf spring member 34a on the Y2 side. The fastening structure 52 may also be applied to the other end of the bracket 50.

The electronic component 25c is, for example, a communication module compatible with an SSD or a WWAN. The electronic component 25c is connected to the board 25 via a connector 25c1. The end of the electronic component 25c opposite the connector 25c1 is fixed to the second surface 25B with a screw 25c2. The external connection port 25d is an IO port such as a USB or LAN. The external connection port 25d is integrally provided on a metal bracket fixed to the second surface 25B with, for example, a screw 25d1.

As shown in FIG. 2, the battery device 26 can have an attachment piece 26a protruding from the edge on the Y2 side. For example, a pair of attachment pieces 26a are provided on the left and right. The attachment pieces 26a are arranged overlapping the second surface 25B of the substrate 25 and are fixed to the substrate 25 using a fastening structure 52 similar to the bracket 50. The edge on the Y1 side of the battery device 26 is connected to the housing member 20, for example, by a hook structure.

Next, we will explain the fastening structure 52.

Figure 3 is a schematic side cross-sectional view of the fastening structure 52. Figure 4 is an exploded view of the fastening structure 52 shown in Figure 3.

As shown in Figures 2 and 3, the fastening structure 52 can integrally fix the board 25 to the keyboard device 18 supported by the housing member 20 and fix a specified component to the board 25. The components fixed to the board 25 are, for example, the bracket 50 and the mounting piece 26a (battery device 26). Hereinafter, such components may be collectively referred to as "board fixing components 53."

The keyboard device 18 occupies a large area on the inner surface side of the housing member 20. The keyboard device 18 has a metal base plate 18a that supports, for example, key caps, a scissor mechanism, a rubber dome, and a membrane sheet (see FIG. 3). In this embodiment, a fastening structure 52 that fixes the substrate 25 to the base plate 18a is illustrated.

The fastening structure 52 can also be used in a configuration in which the substrate 25 is fixed directly to the inner surface of the housing member 20. In this case, for example, as shown by the reference characters 20, 20A in parentheses in FIG. 3, the fastening structure 52 may be applied to the cover plate 20A of the housing member 20 instead of the base plate 18a. The object to which the substrate (substrate 25) is fixed by the fastening structure 52 may be a member other than the housing member 20 or the keyboard device 18, such as a specified metal bracket supported by the housing member 20.

As shown in Figures 3 and 4, the fastening structure 52 includes a boss portion 54, a stud component 56, and a screw 58.

The boss portion 54 is provided so as to protrude in the Z2 direction on the inner surface side of the housing member 20. The boss portion 54 is a portion for fixing the substrate 25 to the base plate 18a. The boss portion 54 can be configured as a cylindrical member standing from the base plate 18a toward the substrate 25 side (Z2 side). The boss portion 54 may be fixed to the base plate 18a by screwing or welding, or may be formed integrally with the base plate 18a. When the boss portion 54 is provided on the housing member 20, if the housing member 20 is made of metal, it may be formed integrally with the housing member 20. If the housing member 20 is made of resin, an insert nut may be used. Of the multiple fastening structures 52, some of the boss portions 54 may be provided on the keyboard device 18, and other boss portions 54 may be provided on the housing member 20.

The boss portion 54 can have a support surface 54a, a protrusion 54b, and a screw hole 54c.

The support surface 54a is a surface that supports the first surface 25A of the substrate 25. The support surface 54a is a flange-shaped portion formed in a ring shape around the protrusion 54b and the screw hole 54c. The support surface 54a may be brought into contact with the ground pattern 60a provided on the first surface 25A. This allows the substrate 25 to be easily frame grounded. The ground pattern 60a is formed in a ring shape that surrounds the mounting hole 25C of the substrate 25. The mounting hole 25C is a through hole that penetrates the substrate 25 in the thickness direction.

The protrusion 54b is a cylindrical portion that protrudes upward (toward the Z2 side) from the center of the support surface 54a. The protrusion 54b passes through the mounting hole 25C. In the configuration example shown in FIG. 3, the protrusion 54b protrudes through the mounting hole 25C to the second surface 25B side.

The screw hole 54c is a hole into which the screw 58 is fastened, and a female thread is formed on the inner peripheral surface. The screw hole 54c is provided inside the protruding portion 54b, and opens at the top surface (protruding end surface 54b1) of the protruding portion 54b. The depth of the screw hole 54c is sufficient as long as it can securely fasten the screw 58. In the configuration example shown in FIG. 3, the screw hole 54c reaches from the protruding end surface 54b1 to near the middle of the boss portion 54 in the height direction.

The stud component 56 is a component for connecting the board fixing component 53 to the board 25. The stud component 56 is mounted on the second surface 25B of the board 25 and can be configured as a cylindrical metal component standing on the Z2 side from the second surface 25B. The stud component 56 is fixed by soldering or the like to the ground pattern 60b provided on the second surface 25B. The ground pattern 60b is formed in a ring shape surrounding the mounting hole 25C.

The stud component 56 can have a through hole 56a, a fixing surface 56b, and an escape hole 56c.

Through hole 56a is arranged coaxially with screw hole 54c and is a Z-direction through hole through which screw 58 is passed. The inner diameter of through hole 56a is smaller than head 58a of screw 58 and larger than threaded portion (shaft) 58b.

The fixing surface 56b is a surface that supports the board fixing component 53. The fixing surface 56b is a flange-shaped portion that is provided on the top surface of the stud component 56 and is formed one step lower than the peripheral portion of the through hole 56a. The board fixing component 53 has, for example, a fixing hole 53a. The fixing hole 53a is a hole portion that penetrates the plate-shaped bracket 50 or the mounting piece 26a in the plate thickness direction. The center of the top surface of the stud component 56 is inserted into the fixing hole 53a. The peripheral portion of the fixing hole 53a of the board fixing component 53 is placed on the fixing surface 56b. As a result, the board fixing component 53 is sandwiched between the head 58a and the fixing surface 56b and fixed to the stud component 56 and the board 25.

The relief hole 56c is a concave hole formed in the fixing surface (Z1 side surface) of the stud component 56 relative to the second surface 25B, and communicates coaxially with the through hole 56a. The inner diameter of the relief hole 56c is larger than the through hole 56a and is also larger than the outer diameter of the protruding portion 54b. The depth of the relief hole 56c is greater than the protruding height of the protruding portion 54b from the second surface 25B. This allows the upper portion (Z2 side portion) of the protruding portion 54b, including the protruding end surface 54b1, to be inserted into the relief hole 56c, preventing interference with the stud component 56.

Next, we will explain one procedure for fixing the substrate 25 and the substrate fixing component 53 using the fastening structure 52.

As shown in Figures 3 and 4, first, the stud component 56 is mounted on the second surface 25B of the board 25 via the ground pattern 60b. The mounting of the stud component 56 can be performed, for example, by reflow soldering at the same time as other components (e.g., CPU 25a) to be mounted on the board 25.

Next, the board 25 on which the stud components 56 are mounted is fixed to the keyboard device 18 and the housing member 20. The boss portion 54 has the protruding portion 54b inserted into the mounting hole 25C, and the support surface 54a is placed against the first surface 25A (ground pattern 60a). Following this, the board 25 is fixed to the housing member 20 with the screws 27 (see FIG. 2).

The board fixing component 53 is placed on the fixing surface 56b of the stud component 56. Next, the screw 58 is tightened into the screw hole 54c. The screw 58 is tightened into the screw hole 54c by inserting the threaded portion 58b through the fixing hole 53a and the through hole 56a. This fastens the board fixing component 53 to the stud component 56 with the screw 58, and the board fixing component 53 is fixed to the board 25 on the second surface 25B side. At the same time, the board 25 and the stud component 56 mounted thereon are also fastened to the boss portion 54 with the screw 58. In other words, the board 25 and the board fixing component 53 are fixed to the keyboard device 18. As a result, the board 25 and the board fixing component 53 are fixed to the housing member 20 by the fastening structure 52 using one screw 58.

As described above, the electronic device 10 of this embodiment includes the housing member 20 and the substrate 25 having the mounting hole 20C. The electronic device 10 further includes the boss portion 54, the stud component 56, and the substrate fixing component 53. The boss portion 54 has a support surface 54a that supports the first surface 25A of the substrate 25, and a screw hole 54c into which a screw 58 passed through the mounting hole 20C from the second surface 25B side toward the first surface 25A side is fastened, and is provided so as to protrude from the inner surface side of the housing member 20. The stud component 56 has a through hole 56a that is arranged coaxially with the screw hole 54c and through which the screw 58 is passed, and is mounted on the second surface 25B so as to cover the mounting hole 25C. The substrate fixing component 53 is fixed to the stud component 56 by the screw 58 fastened to the screw hole 54c.

In this way, the electronic device 10 integrates the boss portion 54 that directly or indirectly fixes the board 25 to the housing member 20 and the stud component 56 that fixes the board fixing component 53 to the board 25. In other words, the fastening structure 52 uses the mounting hole 25C and the screw 58 that fix the board 25 to the housing member 20, etc., to fix the board fixing component 53 to the board 25. This eliminates the need to secure a mounting space for the stud component 56 on the board 25. In other words, the fastening structure 52 can fix the board fixing component 53 by utilizing the dead space above the boss portion 54. As a result, the electronic device 10 can reduce the area of the board 25, reduce the cost of parts, and also reduce the weight. In the electronic device 10, the board 25 is miniaturized and there is more space in the housing 12, so the capacity of the thermal module 24 can be increased and the housing 12 can be made smaller. The housing member to which the fastening structure 52 is applied may be a member that constitutes the bottom surface of the housing 12.

In the electronic device 10, the through hole 56a of the stud component 56 is disposed above the screw hole 54c. As a result, after the screw 58 is removed from the screw hole 54c, the threaded portion 58b is caught in the through hole 56a and held there, and the screw 58 does not easily fall out. This allows the worker to easily grasp the screw 58 with the fingertips or the like and pull it up. In this way, the through hole 56a also functions as a handle to hold the screw 58 removed from the screw hole 54c.

The boss portion 54 can have a protruding portion 54b that protrudes from the support surface 54a and passes through the mounting hole 30C, and has a screw hole 54c opening on its protruding end surface 54b1. This makes it easy to form a screw hole 54c deep enough to more reliably tighten the screw 58. In other words, the protruding portion 54b can expand the depth of the screw hole 54c. In this case, the height of the boss portion 54 can also be reduced as shown in FIG. 5.

Figure 5 is a schematic side cross-sectional view of a fastening structure 52A according to a modified example. The fastening structure 52A shown in Figure 5 is a configuration example in which the height H1 from the base plate 18a (cover plate 20A) to the first surface 25A of the substrate 25 is a lower height H1a compared to the fastening structure 52 shown in Figure 3. In other words, the boss portion 54 of the fastening structure 52A is lower in height than the boss portion 54 of the fastening structure 52 shown in Figure 3. In the fastening structure 52A, the height H2 from the second surface 25B of the substrate 25 to the head 58a of the screw 58 is the same or approximately the same as the fastening structure 52 shown in Figure 3.

In this way, the fastening structures 52, 52A are provided with the protrusions 54b, so that the height of the bosses 54 can be reduced while still ensuring the amount of engagement of the screws 58. As a result, the electronic device 10 can reduce the height H1 from the base plate 18a (cover plate 20A) to the board 25, making it possible to further reduce the thickness of the housing 12.

The protrusion 54b can be omitted or configured to a height that does not penetrate the mounting hole 25C. In this case, the height of the stud part 56 can be reduced as shown in FIG. 6.

Figure 6 is a schematic side cross-sectional view of a fastening structure 52B according to another modified example. The fastening structure 52B shown in Figure 6 is a configuration example in which the protrusion 54b is eliminated and the height H2 from the second surface 25B to the head 58a of the screw 58 is set to a lower height H2a compared to the fastening structure 52 shown in Figure 3. In other words, the stud component 56 of the fastening structure 52B does not require an escape hole 56c for the protrusion 54b, so the height can be lower than that of the stud component 56 of the fastening structure 52 shown in Figure 3. As shown by the two-dot chain line in Figure 6, the fastening structure 52B may have a protrusion 54b of a height that does not penetrate the mounting hole 25C.

In this way, by omitting the protruding portion 54b or making it lower than the second surface 25B, the fastening structure 52B does not require the escape hole 56c, and the height of the stud component 56 can be reduced. On the other hand, by ensuring the height H1 of the boss portion 54 in the fastening structure 52B, the depth of the screw hole 54c required for reliable tightening of the screw 58 can be sufficiently ensured. Therefore, the electronic device 10 can reduce the height H2 from the board 25 to the board fixing component 53, and can accommodate further reduction in thickness of the housing 12.

Next, as a comparative example, a configuration example of the fixing structure of the substrate 25 and substrate fixing part 53 according to a conventional configuration will be described. Figure 7 is a schematic side cross-sectional view showing the fixing structure of the substrate 25 and substrate fixing part 53 according to the comparative example.

In the configuration of the comparative example shown in Figure 7, the boss portion 70 that fixes the board 25 to the base plate 18a (cover plate 20A) and the stud component 72 that fixes the board fixing component 53 to the board 25 are located in different positions. Therefore, the board 25 is fixed to the boss portion 70 with a screw 74, and the board fixing component 53 is fixed to the stud component 72 with a screw 76. Therefore, in the configuration shown in Figure 7, the screws 74 and 76 are located in different positions on the board 25, and take up a large installation space on the board 25.

The substrate 25 must have the hole 78 through which the screw 74 passes and the hole 80 into which the stud component 72 fits in different positions. The hole 80 is an escape hole for extending a portion of the stud component 72 in the Z1 direction. The extension of the stud component 72 to the hole 80 is a necessary structure for ensuring that the screw hole 72a is deep enough to securely fasten the screw 76 while suppressing the protrusion height of the stud component 72 from the second surface 25B. The height of the boss 70 must also be sufficient to ensure that the screw hole 72a is deep enough to securely fasten the screw 74.

As a result, in the comparative example shown in FIG. 7, it is necessary to provide two holes 78, 80 and two screws 74, 76 in the board 25. This requires the area of the board 25 to be enlarged. In addition, the heights of the boss 70 and the stud component 72 must be sufficient to fasten the screws 74, 76, respectively, making it difficult to achieve a thin structure like the configuration examples shown in FIG. 5 and FIG. 6 described below. In addition, in the comparative example shown in FIG. 7, since there is no configuration similar to the through hole 56a, the screws 74, 76 lose their support immediately after being removed from the screw holes 70a, 72a, which reduces workability.

The present invention is not limited to the above-described embodiment, and can of course be freely modified without departing from the spirit of the present invention.

In the above, the fastening structures 52, 52A, and 52B are used to fasten the bracket 50 and the battery device 26, but the fastening structures 52 and the like may also be applied to the fastening parts of other screws 25c2, 25d1, 27, 44, etc.

REFERENCE SIGNS LIST 10 Electronic device 11 Cover 12 Housing 18 Keyboard device 20 Housing member 24 Thermal module 25 Board 25a CPU
25c2, 25d1, 44, 58, 76 Screw 42, 56, 72 Stud part 52, 52A, 52B Fastening structure 53 Board fixing part 54, 70 Boss part 54a Support surface 54b Protruding part 56a Through hole 56c Relief hole

Claims (4)

An electronic device,
A housing member;
A substrate having a first surface and a second surface and a mounting hole penetrating in a thickness direction of the substrate;
a boss portion having a support surface that supports a first surface of the substrate and a screw hole into which a screw that is passed through the mounting hole from the second surface side toward the first surface side is fastened, the boss portion being provided so as to protrude from an inner surface side of the housing member;
a stud component having a through hole arranged coaxially with the screw hole and through which the screw is inserted, the stud component being mounted on the second surface of the board so as to cover the mounting hole;
a board fixing component that is fixed to the stud component by the screw that is fastened to the screw hole;
An electronic device comprising: 2. The electronic device according to claim 1,
the boss portion has a protruding portion protruding from the support surface, being inserted into the mounting hole, and having the screw hole formed therein. 3. The electronic device according to claim 2,
the protrusion protrudes through the mounting hole onto the second surface of the substrate;
The stud component has a relief hole into which the protrusion is inserted,
The electronic device according to claim 1, wherein the relief hole is coaxially connected to the through hole and has a larger diameter than the through hole. The electronic device according to any one of claims 1 to 3,
The electronic device characterized in that the board fixing part includes any one of a bracket that holds a cable connected to a connector mounted on the second surface, a battery device that serves as a power source for the electronic device, a thermal module that cools a heat-generating element mounted on the second surface, an electronic component mounted on the second surface, and an external connection port mounted on the second surface.

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