JP7602762B2 - Intraoral sensing device and manufacturing method thereof - Google Patents

Description

The present invention relates to an intraoral sensing device and a method for manufacturing the same.

To date, intraoral sensing devices that are placed in the oral cavity to obtain biometric information have been put into practical use.
Conventionally, when electronic devices such as biomonitoring sensors are attached to oral appliances, they are attached to the oral appliance using a resin that has adhesive properties to both the oral appliance and the electronic device. When attempting to remove the electronic device from the oral appliance to recharge the battery, etc., the resin is tightly attached to the electronic device and cannot be removed, and there is a problem that the electronic device may be damaged if the electronic device is forcibly removed. One possible solution to this problem is to dissolve the resin that bonds the oral appliance and the electronic device with a solvent and remove the electronic device. However, since the electronic device is equipped with a battery, there is also a problem that immersing the electronic device in a solvent may cause a short circuit between the circuit terminals, destroying the electronic device.
To cope with such problems, it is also possible to cover the entire electronic device with the material of the oral appliance. For example, Patent Document 1 describes a method for forming a protective coating having moisture resistance and insulation at least in a portion of an electronic circuit board on which electronic components are mounted, which is required to have moisture resistance and insulation, and the method includes a first step of applying a first coating agent containing a resin to form a first coating, and a second step of applying a second coating agent to which an additive that imparts viscosity to the first coating agent is added to form a second coating. In this case, the electronic device and the oral appliance are not bonded, so the possibility of the electronic device being broken when removed is low. However, when this method is used, the thickness of the material of the oral appliance must be increased in the manufacturing process, and in the case of an orthodontic appliance, for example, there is a problem that it is difficult to control the force applied to the teeth. Furthermore, if a crack occurs in the material of the oral appliance, moisture will come into direct contact with the electronic device, which may result in the electronic device being broken. For safety reasons, a second means must be provided to prevent leakage of electricity even if a crack occurs in one of the means (in this case, the material of the orthodontic appliance). The above-mentioned method has a safety issue because only one means is provided. In addition, the dental resin material that fixes the intraoral appliance and the electronic device is made by polymerizing and curing two liquids, so the viscosity of the liquid is low and the dental resin material flows off before it hardens.

To address these issues, it is possible to construct an oral appliance 41 by sandwiching an electronic device 42 between two sealing films made of a thermoplastic polymer compound, as shown in Figure 17, but there is a need to further simplify the manufacturing process.

JP 2011-66080 A

The objective of the present invention is to provide an intraoral sensing device and a method for manufacturing the same that are easy to manufacture and have excellent safety in use.

The intraoral sensing device of the present invention is a sensing device to be placed in the oral cavity, and includes an electronic device having electronic components mounted on a circuit board, a first dental resin material covering the entire electronic device,
The intraoral sensing device includes a second dental resin material that covers the entire first dental resin material, and an intraoral appliance having a first recess in which the electronic device is housed and is covered with the first dental resin material and the second dental resin material.

A first specific embodiment of the intraoral sensing device of the present invention is characterized in that the second dental resin material adheres the electronic device covered with the first dental resin material to the inside of the first recess.

A second specific embodiment of the intraoral sensing device of the present invention is characterized in that the second dental resin material has one of the broad surfaces of the first dental resin material as a bottom surface, and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of the remaining portions, and a first protrusion is provided at a location of the first recess corresponding to the portion where the thickness of the corner of the second dental resin material is thinner than the thickness of the remaining portions.

A third specific embodiment of the intraoral sensing device of the present invention is characterized in that a second recess is provided on at least two or more surfaces of the second dental resin material that correspond to the side surface relative to one of the broad surfaces of the first dental resin material as a bottom surface, and a first protrusion is provided on the first recess at a location that corresponds to the second recess on the side surface of the second dental resin material.

A fourth specific embodiment of the intraoral sensing device of the present invention is characterized in that a second protrusion is provided on at least two or more surfaces of the second dental resin material that correspond to the side surface relative to one of the broad surfaces of the first dental resin material, with the bottom surface being one of the broad surfaces, and a recess is provided in the first recess at a location that corresponds to the second protrusion on the side surface of the second dental resin material.

A manufacturing method according to a first specific embodiment of the intraoral sensing device of the present invention is a manufacturing method for an intraoral sensing device, which includes preparing an electronic device having electronic components mounted on a circuit board, covering the entire electronic device with a first dental resin material, preparing a dental mold that matches the teeth and gums of a user who is to wear the intraoral sensing device, placing the electronic device covered with the first dental resin material on the dental mold, pressing the dental mold against an intraoral device manufacturing material to perform embossing to form an intraoral device having a first recess in which the electronic device covered with the first dental resin material can be accommodated, removing the intraoral device from the dental mold with the electronic device covered with the first dental resin material housed in the first recess, and covering the electronic device covered with the first dental resin material with a second dental resin material so as to cover the entire first dental resin material and to adhere to the inside of the first recess of the intraoral device.

A manufacturing method according to a second specific embodiment of the intraoral sensing device of the present invention includes preparing an electronic device having an electronic device mounted on a circuit board, covering the entire electronic device with a first dental resin material, covering the entire first dental resin material, and covering the electronic device covered with the first dental resin material with a second dental resin material so that one of the broad surfaces of the first dental resin material is a bottom surface and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of the other parts, and fitting the electronic device to the teeth and gums of a user who is to wear the intraoral sensing device. The method for manufacturing an intraoral sensing device includes preparing a dental mold in which the electronic device covered with the first dental resin material and the second dental resin material is placed on the dental mold, pressing the dental mold against an intraoral appliance manufacturing material to perform embossing to form an intraoral appliance having a first recess in which the electronic device covered with the first dental resin material and the second dental resin material is placed, and removing the intraoral appliance from the dental mold with the electronic device covered with the first dental resin material and the second dental resin material housed in the first recess.

A manufacturing method according to a third specific embodiment of the intraoral sensing device of the present invention includes preparing an electronic device having an electronic device mounted on a circuit board, covering the entire electronic device with a first dental resin material, covering the entire first dental resin material, and covering the electronic device covered with the first dental resin material with a second dental resin material so that a second recess is provided on at least two or more surfaces corresponding to the side surfaces of the first dental resin material, with one of the broad surfaces of the first dental resin material being the bottom surface, and conforming to the teeth and gums of a user who is to wear the intraoral sensing device. This is a method for manufacturing an intraoral sensing device, which includes preparing a dental mold, placing the electronic device covered with the first dental resin material and the second dental resin material on the dental mold, pressing the dental mold against an intraoral appliance manufacturing material to perform embossing, forming an intraoral appliance having a first recess in which the electronic device covered with the first dental resin material and the second dental resin material can be placed, and removing the intraoral appliance from the dental mold with the electronic device covered with the first dental resin material and the second dental resin material housed in the first recess.

A manufacturing method according to a fourth specific embodiment of the intraoral sensing device of the present invention includes preparing an electronic device having an electronic device mounted on a circuit board, covering the entire electronic device with a first dental resin material, covering the entire first dental resin material, and covering the electronic device covered with the first dental resin material with a second dental resin material so that, with one of the broad surfaces of the first dental resin material as a bottom surface, second protrusions are provided on at least two or more surfaces corresponding to the side surfaces relative to the bottom surface, and conforming to the teeth and gums of a user who is to wear the intraoral sensing device. This is a method for manufacturing an intraoral sensing device, which includes preparing a dental mold, placing the electronic device covered with the first dental resin material and the second dental resin material on the dental mold, pressing the dental mold against an intraoral appliance manufacturing material to perform embossing, forming an intraoral appliance having a first recess in which the electronic device covered with the first dental resin material and the second dental resin material can be placed, and removing the intraoral appliance from the dental mold with the electronic device covered with the first dental resin material and the second dental resin material housed in the first recess.

The present invention provides an intraoral sensing device and a method for manufacturing the same that are easy to manufacture and have excellent safety in use.

FIG. 1 is a cross-sectional view of an intraoral sensing device when an electronic device 2 is attached to an intraoral appliance 1 . FIG. 2 is a schematic diagram of the intraoral sensing device when electronic device 2 is attached to intraoral appliance 1. FIG. 3 is a schematic diagram of another intra-oral sensing device when electronic device 2 is attached to intra-oral appliance 1. FIG. 4 is a schematic diagram showing the shape of an electronic device covered with a second dental resin material 4 to be placed in a first cavity of an intraoral appliance. FIG. 5 is a cross-sectional view of the first cavity of the oral appliance 1 when the electronic device 2 is placed in the first cavity. FIG. 6 is a cross-sectional view showing a state in which the electronic device 2 placed in the first cavity of the oral appliance 1 is removed. FIG. 7 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first cavity of an intraoral appliance. FIG. 8 is a cross-sectional view of another first cavity portion of the oral appliance 1 when the electronic device 2 is placed in the first cavity. FIG. 9 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first cavity of an intraoral appliance. FIG. 10 is a cross-sectional view of another first cavity portion of the oral appliance 1 when an electronic device 2 is placed in the first cavity. FIG. 11 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first cavity of an intraoral appliance. FIG. 12 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first cavity of an intraoral appliance. FIG. 13 is a cross-sectional view of another first cavity portion of the oral appliance 1 when an electronic device 2 is placed in the first cavity. FIG. 14 is a cross-sectional view of another first cavity portion of the oral appliance 1 when an electronic device 2 is placed in the first cavity. FIG. 15 is a cross-sectional view of the intraoral sensing device when the electronic device 2 is attached to an implant denture 32. FIG. 16 is a schematic block diagram showing the circuit configuration of the electronic device 2. FIG. 17 is a cross-sectional view of a conventional intraoral sensing device when an electronic device 42 is attached to an intraoral appliance 41. FIG. 18 is a process flow diagram illustrating a method for manufacturing an intra-oral sensing device. FIG. 19 is a process flow diagram illustrating another method for manufacturing an intra-oral sensing device.

The present invention has the following advantageous features:
When used in the oral cavity, the electronic device 2 is doubly covered with the first dental resin material 3 and the second dental resin material 4, so that even if a crack occurs in one of them, the other protects the electronic device, and therefore the electronic device 2 is highly safe for the human body. In particular, when the first dental resin material 3 is a silicone resin, the silicone resin does not adhere to the electronic device 2, so the first dental resin material 3 can be easily peeled off from the electronic device 2, and the electronic device 2 can be reused without being damaged. Furthermore, the first dental resin material 3 can be peeled off from the electronic device 2 and installed in the electronic device 2 to replace the battery, which is particularly useful when the battery is a primary battery.

In a first specific embodiment of the present invention, as shown in Fig. 1, an electronic device 2 entirely covered with a first dental resin material 3 is housed in a first recess of an oral appliance 1, a second dental resin material 4 is filled in a gap between the electronic device 2 entirely covered with the first dental resin material 3 and the first recess, and the electronic device 2 and the oral appliance 1 are bonded by the second dental resin material 4. Figs. 2 and 3 are perspective views of the oral appliance 1. When the oral appliance is attached to the teeth and gums, the electronic device 2 may be arranged on the inside (lingual side) of the oral cavity as shown in Fig. 2, or on the outside (cheek side) of the oral cavity as shown in Fig. 3.
By adopting such a configuration, the intraoral sensing device is safer to use and the manufacture of the intraoral sensing device is easier.

In a second specific embodiment of the present invention, as shown in Figure 4, a second dental resin material 4 that covers an electronic device entirely covered with a first dental resin material is molded so that one of the broad surfaces of the first dental resin material serves as a bottom surface, and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of other parts, and as shown in Figure 5, the first recess of the oral appliance 1 has a first protrusion 1c provided at a location corresponding to the portion of the side surface of the second dental resin material 4 where the thickness of the corner is thinner than the thickness of other parts.
6, the force applied to the oral appliance 1 when attaching and detaching the oral appliance 1 is not directly applied to the electronic device 2, reducing the possibility of the electronic device 2 being damaged by repeated attachment and detachment. In particular, when the oral appliance 1 is molded by vacuum embossing, the first protrusion 1c can be formed at the same time as the first recess, and the setting of the electronic device 2 is also performed automatically, improving work efficiency.

In a third specific embodiment of the present invention, as shown in Figure 7, a second dental resin material 4 covering an electronic device entirely covered with a first dental resin material has a second recess provided on at least two or more surfaces corresponding to the side surfaces relative to one of the broad surfaces of the first dental resin material, with the bottom surface being one of the broad surfaces, and as shown in Figure 8, a first protrusion 1c is provided at a location of the first recess corresponding to the second recess on the side surface of the dental resin material.
By adopting such a configuration, it has become easier to remove the electronic device 2 from the oral appliance 1 and to reattach the electronic device 2 to the oral appliance 1. In particular, when the oral appliance 1 is molded by vacuum embossing, the first protrusion 1c can be formed simultaneously with the formation of the first recess, and the setting of the electronic device 2 is also performed automatically, improving work efficiency.

In a third specific embodiment of the present invention, as shown in Figure 9, a second dental resin material 4 covering an electronic device entirely covered with a first dental resin material has a second protrusion provided on at least two or more surfaces corresponding to the side surfaces relative to a bottom surface, with one of the broad surfaces of the first dental resin material serving as a bottom surface, and as shown in Figure 10, a recess 1d is provided at a location of the first recess corresponding to the second protrusion on the side surface of the second dental resin material 4.
By adopting such a configuration, it has become easier to remove the electronic device 2 from the oral appliance 1 and to reattach the electronic device 2 to the oral appliance 1. In particular, when the oral appliance 1 is molded by vacuum embossing, the recess 1d can be formed simultaneously with the formation of the first recess, and the setting of the electronic device 2 is also performed automatically, improving work efficiency.

In the second and third specific aspects of the present invention described above, as shown in FIG. 11 or 12, the shape is not limited to a substantially rectangular parallelepiped shape, and the corners may be rounded or removed. Also, as shown in FIG. 13 or 14, the corner that contacts the bottom of the first recess may be removed or rounded.

[Intraoral sensing device]
The intraoral sensing device is composed of an electronic device 2, an intraoral appliance 1, a first dental resin material 3, and a second dental resin material 4.

Electronic Devices
As shown in FIG. 16, the electronic device 2 is composed of a wireless module section 23 combining a wireless transceiver section 26, a signal processing section 24 and a memory 25, a sensor 22 and a battery 21, and is entirely covered with a first dental resin material while mounted on a circuit board.
The electronic device 2 is composed of a wireless module section 23 that combines a wireless transmitting/receiving section 26, a signal processing section 24 and a memory 25, a sensor 22 and a battery 21, and is embedded in an orthodontic appliance, a denture or an implant.
The wireless transceiver 26 has the role of transmitting digital data sensed within the oral cavity to a network connector 27 outside the oral cavity, and receiving commands transmitted from the network connector 27 to the electronic device 2 .
The signal processing unit 24 is composed of a microcomputer and an AD converter, and has the following functions: converting the sensing data sent from the sensor 22 into digital data and storing it in the memory 25; converting the digital data stored in the memory 25 into transmittable data; and interpreting commands sent from the network connector 27 and controlling the operation of the sensor 22 and the wireless transceiver unit 26.
The sensor 22 is composed of at least one type selected from the group consisting of a temperature sensor, an acceleration sensor, a gyro sensor, a pressure sensor, a strain sensor, a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen concentration, a heart rate sensor that uses light to measure heart rate, and a laser sensor that uses laser light to measure blood flow, and acquires various physical information and biological information.
The battery 21 is composed of a primary battery or a secondary battery, and supplies power to the wireless transceiver unit 26 , the signal processing unit 24 , the memory 25 and the sensor 22 .
These circuit blocks are implemented on a thin circuit board or a flexible board, and include a battery 21, a sensor 22, a signal processing unit 24, a wireless transceiver unit 26, and a memory 25. In general, the wireless transceiver unit 26, the signal processing unit 24, and the memory 25 are often provided as a single chip. Also, in the electronic device 2, the battery 21, the sensor 22, the signal processing unit 24, the memory 25, and the wireless transceiver unit 26 are implemented on a thin circuit board or a flexible board.

The electronic device 2 is covered with a first dental resin material 3, and the outside of that is covered with a second dental resin material 4 and placed in the oral appliance, thereby preventing moisture from entering the electronic device 2. Even if a crack occurs in the second dental resin material 4, the electronic device 2 is covered with the soft first dental resin material 3, ensuring double safety.

The wireless module section 23 mounted on the electronic device 2 does not necessarily need to wirelessly exchange data with the outside world; it may be an electronic device that exchanges data using a wire. However, in the case of an electronic device that exchanges data using a wire, it is necessary to waterproof the connector section that connects the electronic device 2 to the network connector 27. The connector section is provided with a lid-like mechanism that opens when reading data and closes when placed in the oral cavity. Therefore, sending and receiving data wirelessly has the advantage of making the waterproof structure easier.

By using a temperature sensor for the sensor 22, not only can the time that the oral appliance is worn be measured, which can be utilized in intraoral orthodontic treatment, but also daily changes in body temperature can be monitored.
By using an acceleration sensor/gyro sensor for the sensor 22, it is possible to not only count the number of chews, but also to measure the number of steps, the amount of activity, the movement of the jaw, and bruxism (teeth grinding).
By using a pressure sensor and a strain sensor for the sensor 22, it is possible to measure not only the forces acting on teeth, dentures, and implants, but also the forces exerted on teeth by oral appliances, bruxism (teeth grinding), biting force, number of chews, and the time the oral appliance is worn.

<Oral appliances>
The oral appliance 1 may be, for example, an orthodontic device, a denture, or an implant.

In the case of an orthodontic device, the oral appliance 1 is preferably formed from a thermoplastic polymer compound, and more preferably from any one of the thermoplastic polymer compounds selected from the group consisting of polyethylene-based materials, polyurethane-based materials, and acrylic resins.
When attaching an electronic device to an oral appliance, as shown in Figures 1 to 3, the oral appliance is preferably molded by pressing an oral appliance manufacturing material against a dental mold that matches the teeth and gums of the user who will be wearing the intraoral sensing device, or by molding it into a tooth and gum shape using a 3D printer, and it is more preferable to press the oral appliance against a dental mold that matches the teeth and gums of the user who will be wearing the intraoral sensing device.
The material for manufacturing the oral appliance is preferably a sheet or film of the thermoplastic polymeric compound described above.
A recess is provided in a part of the oral appliance 1, and the electronic device 2 is installed in the recess. The location of the electronic device 2 may be either a location corresponding to the side wall of the tooth crown or a location corresponding to the gums, but considering the occlusion of the upper and lower teeth, it is preferable to install the electronic device in a location corresponding to the gums shown in Fig. 1. In addition, in the case of a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen concentration, a heart rate sensor that uses light to measure heart rate, or a laser sensor that uses laser light to measure blood flow, it is preferable to install the electronic device in a location corresponding to the gums in order to obtain information from blood vessels in the gums.
Furthermore, when installing a sensor using light or laser as described above, light transmission is essential, so the oral appliance 1 is made of a material that can transmit light of any wavelength within the range of 400 to 1000 nm.

In a first specific embodiment, as shown in FIG. 1, the electronic device 2 is entirely covered with a first dental resin material 3, and the first dental resin material 3 is entirely covered with a second dental resin material 4, and the cavity of the oral appliance 1 is filled with the second dental resin material 4, thereby bonding the oral appliance 1 and the electronic device 2 together.

In the second specific embodiment, as shown in FIG. 4, the second dental resin material 4 has a structure in which the thickness of at least two or more corners of the surface facing the bottom surface is thinner than the thickness of the other parts, with one of the broad surfaces of the first dental resin material as the bottom surface. As shown in FIG. 5, the electronic device is fixed by the part where the corner thickness of the second dental resin material 4 is thinner than the other parts and the first protrusion 1c of the oral appliance 1, so that even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral appliance 1 is put on or taken off. In addition, if the corner thickness of the second dental resin material 4 is formed in only one place, the probability of falling off is very high, which is not preferable. By forming at least two corners, preferably four corners, the electronic device 2 will not fall off even when the oral appliance 1 is put on or taken off. FIG. 6 is a schematic diagram showing the state when the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is removed from the oral appliance 1. When the electronic device 2 is removed in the direction of the arrow, the first protrusion 1c of the oral appliance 1 is deformed, so that the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 can be easily removed from the oral appliance 1.

In the third specific embodiment, as shown in FIG. 7, the second dental resin material 4 has a structure in which one of the broad surfaces of the first dental resin material is the bottom surface, and the second recess 4g is provided on at least two surfaces corresponding to the side surfaces of the bottom surface. As shown in FIG. 8, the electronic device 2 is fixed by the second recess 4g formed on the side surface of the second dental resin material 4 and the first protrusion 1c of the oral appliance, so that even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral appliance 1 is attached or removed. In addition, if the second recess 4g is formed only on one side surface, the probability of falling off is very high, which is not preferable. By forming the second recess 4g on at least two side surfaces, preferably four surfaces, the electronic device 2 will not fall off even when the oral appliance 1 is attached or removed. It is preferable that the second recess 4g is parallel to the bottom surface.

In the fourth specific embodiment, as shown in FIG. 9, the second dental resin material 4 has a structure in which one of the broad surfaces of the first dental resin material is the bottom surface, and the second protrusions 4h are provided on at least two surfaces corresponding to the side surfaces of the bottom surface. As shown in FIG. 10, the electronic device 2 is fixed by the second protrusions 4h formed on the side surfaces of the second dental resin material 4 and the recess 1d of the oral appliance, so that even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral appliance 1 is put on or taken off. In addition, if the second protrusions 4h are formed only on one side surface, the probability of falling off is very high, which is not preferable. By forming the second protrusions 4h on at least two side surfaces, preferably four surfaces, the electronic device 2 will not fall off even when the oral appliance 1 is put on or taken off. It is preferable that the second protrusions 4h are parallel to the bottom surface.

In the case of the second specific embodiment (FIG. 4), the third specific embodiment (FIG. 7), or the fourth specific embodiment (FIG. 9), the oral appliance 1 is made of a thermoplastic polymer compound such as a polyethylene-based material, a polyurethane-based material, or an acrylic resin, and is suitable for a method of embossing on a dental mold formed by gypsum or a 3D printer. When the electronic device 2 covered with the second dental resin material 4 shown in FIG. 4, FIG. 7, or FIG. 9 is placed at a location on the dental mold where the electronic device 2 is to be installed, and a sheet or film of the thermoplastic polymer compound is molded by vacuum embossing, the thermoplastic polymer compound enters the thin corners and the first recess, and the first protrusion 1c of the oral appliance 1 as shown in FIG. 5 or FIG. 8, or the recess 1d of the oral appliance 1 as shown in FIG. 10 can be automatically formed.
When the oral device 1 is produced using a 3D printer, it is then necessary to set the electronic device 2 in the first recess of the oral device 1. However, when vacuum embossing is performed using the electronic device 2 having the shape shown in FIG. 4, FIG. 7, or FIG. 9, the labor of setting is eliminated, and work efficiency is improved.

The electronic device 2 may be attached to the oral appliance 1 on either the upper or lower jaw, and may be attached either on the inside (lingual side) or outside (cheek side) of the oral cavity.

When attaching the electronic device 2 to a denture or an implant, it is preferable to place the electronic device 2 inside the denture (implant denture 32) as shown in Fig. 15. Fig. 15 shows an example of an implant embedded in the alveolar bone 34, but the same applies to a denture. It is preferable that the electronic device 2 is entirely doubly covered with a first dental resin material 3 and a second dental resin material 4, and placed inside the denture or implant denture 32.
In the case of a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen concentration, a heart rate sensor that uses light to measure heart rate, or a laser sensor that uses laser light to measure blood flow, it is preferable to install them in a location that corresponds to the gums 33 in order to obtain information from blood vessels in the gums. Furthermore, when the above-mentioned light or laser-based sensor is installed, a part of the denture or implant denture is made of a material that can transmit light with any wavelength of 400 to 1000 nm in order to allow light to pass through.

<First Dental Resin Material>
The first dental resin material 3 is, for example, a silicone resin mainly composed of polydimethylsiloxane or a methacrylate to which butyl phthalate is added as a plasticizer and polymerized and hardened. Examples of the silicone resin include condensation type silicone rubber and addition type silicone rubber. The first dental resin material 3 is not limited to the above-mentioned materials, and other plastics and the like can also be used. As the first dental resin material 3, a silicone resin is preferable.

Since the silicone resin has a weak adhesive force with the electronic device 2, it can be easily removed. Therefore, when the electronic device 2 is reused, cleanliness can always be maintained by replacing the silicone resin with a new one. In addition, since the adhesive force between the second dental resin material 4 described below and the silicone resin is weak, the electronic device 2 can be easily peeled off from the oral appliance 1 when the electronic device 2 is reused.

<Second dental resin material>
The second dental resin material 4 is, for example, a polymerized and cured material of methyl methacrylate and polymethyl methacrylate, a material mainly composed of 2,2-bis(4-(3-methoxoloxy-2-hydroxypropoxy)phenyl)propane, urethane dimethacrylate, triethylene glycol dimethacrylate, a polymerized and cured material of polymethyl methacrylate, 4-methacryloyloxyethyl trimellitate anhydride, tri-n-butylborane, a polyethylene resin, a polyurethane resin, or an acrylic resin. The second dental resin material 4 is not limited to the above-mentioned materials, and other plastics and the like can also be used. As the second dental resin material 4, a polymerized and cured material of methyl methacrylate and polymethyl methacrylate is preferable because it has good coverage for covering the electronic device 2 and can prevent moisture from entering the device.

Dental resin materials made by polymerizing and hardening methyl methacrylate and polymethyl methacrylate, or by polymerizing and hardening polymethyl methacrylate, 4-methacryloyloxyethyl trimellitate anhydride, or tri-n-butylborane are a type that polymerizes and hardens liquid and powder, so the dental resin material will not run off and can fill the gap between the electronic device 2 and the oral appliance. The polymerization procedure is to first apply liquid to a brush or the tip of the brush, and then apply powder to the brush or the tip of the brush. This increases the viscosity of the dental resin material, allowing it to be piled up in the gap between the electronic device 2 and the oral appliance.

The second dental resin material 4 is softer than the first dental resin material 3 and has a strong adhesive force with the intraoral appliance 1, so that the electronic device 2 can be fixed to the intraoral appliance 1 with a strong holding force. In addition, the first dental resin material 3 is harder than the second dental resin material 4 and is suitable for protecting the electronic device 2 from external forces.

[Method of manufacturing intraoral sensing device]
The intraoral sensing device according to the first specific embodiment of the present invention can be manufactured, for example, as shown in FIG. 18 , by preparing an electronic device 2 having electronic components mounted on a circuit board, covering the entire electronic device 2 with a first dental resin material 3, preparing a dental mold that matches the teeth and gums of a user who is to wear the intraoral sensing device, placing the electronic device 2 covered with the first dental resin material 3 on the dental mold, and pressing the dental mold against a material for manufacturing an oral appliance to perform embossing to form an oral appliance 1 having a first depression in which the electronic device 2 covered with the first dental resin material 3 can be accommodated, removing the oral appliance 1 from the dental mold with the electronic device 2 covered with the first dental resin material 3 housed in the first depression, and covering the electronic device 2 covered with the first dental resin material 3 with a second dental resin material 4 so as to cover the entire first dental resin material 3 and to adhere to the inside of the first depression of the oral appliance 1.

In the intraoral sensing device according to the second specific embodiment of the present invention, for example, as shown in FIG. 19, an electronic device 2 having an electronic device mounted on a circuit board is prepared, the entire electronic device 2 is covered with a first dental resin material 3, and the electronic device 2 covered with the first dental resin material 3 is covered in its entirety, and one of the broad surfaces of the first dental resin material 3 is used as a bottom surface, and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of the other parts, and then the electronic device 2 covered with the first dental resin material 3 is covered with a second dental resin material 4, and the intraoral sensing device is mounted on a A dental mold that matches the teeth and gums of a user is prepared, the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is placed on the dental mold, and the dental mold is pressed against an oral appliance manufacturing material to perform embossing to form an oral appliance 1 having a first recess in which the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is placed, and the oral appliance 1 is removed from the dental mold with the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 housed in the first recess.

In the intraoral sensing device according to a third specific embodiment of the present invention, for example, as shown in FIG. 19, an electronic device 2 having an electronic device mounted on a circuit board is prepared, the entire electronic device 2 is covered with a first dental resin material 3, and the electronic device 2 covered with the first dental resin material 3 is covered with a second dental resin material 4 so that the entire first dental resin material 3 is covered and one of the broad surfaces of the first dental resin material 3 is set as a bottom surface and a second recess is provided on at least two or more surfaces corresponding to the side surfaces relative to the bottom surface, and the intraoral sensing device is attached to a user's device. The dental mold is prepared to fit the teeth and gums of the user, the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is placed on the dental mold, and the dental mold is pressed against the material for manufacturing the oral appliance to perform embossing to form the oral appliance 1 having a first recess in which the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is accommodated, and the oral appliance 1 is removed from the dental mold with the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 housed in the first recess. The second recess is preferably provided parallel to the bottom surface.

In the intraoral sensing device according to the fourth specific embodiment of the present invention, for example, as shown in FIG. 19, an electronic device 2 having an electronic device mounted on a circuit board is prepared, the entire electronic device 2 is covered with a first dental resin material 3, and the electronic device 2 covered with the first dental resin material 3 is covered with a second dental resin material 4 so that the entire first dental resin material 3 is covered and one of the broad surfaces of the first dental resin material 3 is set as a bottom surface and second protrusions are provided on at least two or more surfaces corresponding to the side surfaces relative to the bottom surface, and the intraoral sensing device is attached to a user's device. The dental mold is prepared to fit the teeth and gums of the user, the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is placed on the dental mold, and the dental mold is pressed against the material for manufacturing the oral appliance to perform embossing to form the oral appliance 1 having a first recess in which the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is placed, and the oral appliance 1 is removed from the dental mold with the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 housed in the first recess. The second protrusion is preferably provided parallel to the bottom surface.

The intraoral appliance 1, electronic device 2, first dental resin material 3, and second dental resin material 4 are the same as those described with respect to the intraoral sensing device of the present invention, and the preferred embodiments are also the same.

[Action and Effect]
In the intraoral sensing device of the present invention, the first dental resin material 3 covers the entire electronic device 2, so that even if the adhesion between the first dental resin material 3 and the electronic device 2 is very weak, the electronic device will not peel off during use.
By using silicone resin as the first dental resin material 3, even when the electronic device 2 is reused for charging or the like, it can be easily peeled off from the oral appliance 1, and the silicone resin can be peeled off cleanly, so that the electronic device 2 is not destroyed and can be easily reused.
When reusing anything that has been placed in the oral cavity, thorough sterilization procedures are required, but with the intraoral sensing device of the present invention, the silicone resin is disposable after each use, making it easy to clean the electronic device 2.
When the electronic device 2 is used in the oral cavity, the electronic device 2 is covered with the first dental resin material 3 and the second dental resin material 4, and therefore the waterproofing of the electronic device 2 is improved.
When the electronic device 2 is used in the oral cavity, it is covered with the first dental resin material 3 and the second dental resin material 4, so that even if a crack occurs in either one, it is protected by the other material, and safety to the human body is ensured.

In the intraoral sensing device of the present invention, a part of the intraoral appliance 1 is recessed and the electronic device 2 is attached thereto, so that the manufacturing process is simple.
Since part of the oral appliance 1 is recessed and the electronic device 2 is attached thereto, the thickness of the material of the oral appliance 1 can be made thin. For example, if the oral appliance 1 is an orthodontic device, it is possible to finely control the force applied to the dentition.
Since the second dental resin material 4 used to attach the electronic device 2 to the oral appliance 1 is a material that polymerizes and hardens liquid and powder, the second dental resin material 4 does not run off. Therefore, when covering the first dental resin material 3 with the second dental resin material 4, a brush-layering method in which the liquid material is first soaked into a brush and then the brush is dipped in powder and applied around the first dental resin material 3, or a sprinkling method in which the liquid material and powder are alternately sprinkled, can be used.
In the second specific embodiment, the electronic device 2 is fixed to the part where the corner is thinner than the other parts and to the first protrusion 1c of the oral appliance 1 via the second dental resin material 4, so that even if a large force is applied to the oral appliance, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem of the electronic device 2 being damaged by the force applied to the electronic device 2 when the oral appliance 1 is attached or detached.

In the third specific embodiment, the electronic device 2 is fixed to the second recess of the second dental resin material 4 and the first protrusion 1c of the intraoral appliance 1 via the second dental resin material 4, so that even if a large force is applied to the intraoral appliance 1, the force is not directly applied to the electronic device 2. This makes it possible to avoid the problem of the electronic device 2 being damaged due to the force being applied to the electronic device 2 when the intraoral appliance 1 is attached or removed. If the intraoral appliance 1 is molded by vacuum stamping, and a part of the intraoral appliance 1 is recessed and the electronic device 2 is attached in a structure with the first protrusion 1c, the first protrusion 1c can be automatically formed and the electronic device 2 is automatically set, improving work efficiency.

In a fourth specific embodiment, the electronic device 2 is fixed via the second dental resin material 4 between the second protrusion of the second dental resin material 4 and the recess 1d of the oral appliance 1, so that even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. This makes it possible to avoid the problem of the electronic device 2 being damaged when the oral appliance 1 is put on or taken off due to the force being applied to the electronic device 2. If the electronic device 2 is attached in a structure in which a part of the oral appliance 1 is recessed and a recess 1d is further provided by a method of molding the oral appliance 1 by vacuum stamping, the recess 1d can be automatically formed and the electronic device 2 is automatically set, improving work efficiency.

By providing the electronic device 2 with the wireless transceiver 26, it is easy to extract the sensed information to the outside.
By using a temperature sensor for the sensor 22, not only can the time that the oral appliance 1 is worn be measured and utilized for intraoral orthodontic treatment, but also daily changes in body temperature can be monitored.
By using an acceleration sensor/gyro sensor for the sensor 22, it is possible not only to count the number of chews, but also to measure one or more items selected from the group consisting of step counting, activity level, jaw movement, and bruxism (teeth grinding).
By using a pressure sensor/strain sensor for sensor 22, it is possible not only to measure the force applied to the teeth, dentures, or implants, but also to measure one or more types of measurements selected from the group consisting of the force applied to the teeth by the oral appliance 1, bruxism, biting force, number of chews, and time the oral appliance is worn.

This application claims priority based on Japanese Patent Application No. 2020-044440, filed in Japan on March 13, 2020, the contents of which are incorporated herein by reference. Note that "silicone resin" in the specification of Japanese Patent Application No. 2020-044440 means "silicone resin" in the specification of this application.

1...oral appliance, 1c...first protrusion, 1d...recess, 2...electronic device, 3...first dental resin material, 4...second dental resin material, 4g...second recess, 4h...second protrusion, 5...tooth, 21...battery, 22...sensor, 23...wireless module part, 24...signal processing part, 25...memory, 26...wireless transceiver part, 27...network connector, 31...implant, 32...implant denture, 33...gums, 34...alveolar bone, 41...oral appliance, 42...electronic device

Claims (14)

A sensing device to be placed in the oral cavity,
An electronic device having electronic components mounted on a circuit board;
a first dental resin material that covers all of the electronic devices;
A second dental resin material that covers the entirety of the first dental resin material;
an intraoral appliance having a first recess in which the electronic device is housed, the first recess being covered with the first dental resin material and the second dental resin material;
The oral appliance is an orthodontic appliance, a denture, or an implant.
Intraoral sensing device. The intraoral sensing device of claim 1, wherein the second dental resin material adheres the electronic device covered with the first dental resin material to the inside of the first recess. The intraoral sensing device according to claim 1, wherein the second dental resin material has one of the broad surfaces of the first dental resin material as a bottom surface, and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of the other parts, and a first protrusion is provided at a location of the first recess corresponding to the part where the thickness of the corner of the second dental resin material is thinner than the thickness of the other parts. The intraoral sensing device according to claim 1, wherein a second recess is provided on at least two or more surfaces of the second dental resin material that correspond to the side surface relative to one of the broad surfaces of the first dental resin material as a bottom surface, and a first protrusion is provided on the first recess at a location that corresponds to the second recess on the side surface of the second dental resin material. The intraoral sensing device of claim 4, wherein the second recess is parallel to the bottom surface. The intraoral sensing device according to claim 1, wherein the second dental resin material has a second protrusion on at least two or more surfaces that correspond to the side surfaces of the second dental resin material with one of the broad surfaces of the first dental resin material as a bottom surface, and a recess is provided in the first recess at a location that corresponds to the second protrusion on the side surface of the second dental resin material. The intraoral sensing device of claim 6, wherein the second protrusion is parallel to the bottom surface. The electronic device includes:
A sensor for sensing biological information;
a battery for powering the sensor;
a signal processing unit that receives power from the battery and generates digital data based on an output signal from the sensor;
A memory for storing the digital data;
a wireless transceiver unit receiving power from the battery and transmitting the digital data stored in the memory to the network connector in response to a signal sent from the network connector;
The intraoral sensing device according to claim 1 , further comprising: The intraoral sensing device of claim 8, wherein the sensor is at least one selected from the group consisting of a temperature sensor, an acceleration sensor, a gyro sensor, a pressure sensor, a strain sensor, a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen concentration, a heart rate sensor that uses light to measure heart rate, and a laser sensor that uses laser light to measure blood flow. The intraoral sensing device according to any one of claims 1 to 9 , wherein the intraoral appliance is formed of a material capable of transmitting light of any wavelength within a wavelength range of 400 to 1000 nm. A method for manufacturing the intraoral sensing device according to claim 2, comprising:
preparing an electronic device having electronic components mounted on a circuit board;
Covering all of the electronic devices with a first dental resin material;
preparing a dental mold that matches the teeth and gums of a user who is to wear the intraoral sensing device;
placing the electronic device covered with the first dental resin material on the dental model;
pressing the dental mold against a material for manufacturing an oral appliance to perform embossing to form an oral appliance having a first recess in which the electronic device is housed and covered with the first dental resin material;
removing the intraoral appliance from the dental mold while the electronic device covered with the first dental resin material is housed in the first cavity;
covering the electronic device covered with the first dental resin material with a second dental resin material so as to cover the entirety of the first dental resin material and to adhere to the inside of the first recess of the oral appliance;
A method for manufacturing an intraoral sensing device. A method for manufacturing the intraoral sensing device according to claim 3, comprising:
preparing an electronic device having an electronic device mounted on a circuit board;
Covering all of the electronic devices with a first dental resin material;
a second dental resin material is used to cover the entire electronic device covered with the first dental resin material, and the electronic device is covered with the first dental resin material such that one of the broad surfaces of the first dental resin material is used as a bottom surface and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of the other portions;
preparing a dental mold that matches the teeth and gums of a user who is to wear the intraoral sensing device;
placing the electronic device covered with the first dental resin material and the second dental resin material on the dental mold;
pressing the dental mold against a material for manufacturing an oral appliance to perform embossing to form an oral appliance having a first recess in which the electronic device is housed and covered with the first dental resin material and the second dental resin material;
A method for manufacturing an intraoral sensing device, comprising removing the oral appliance from the dental mold while the electronic device covered with the first dental resin material and the second dental resin material is housed in the first recess. A method for manufacturing the intraoral sensing device according to claim 4, comprising:
preparing an electronic device having an electronic device mounted on a circuit board;
Covering all of the electronic devices with a first dental resin material;
Covering the electronic device covered with the first dental resin material with a second dental resin material so as to cover the entirety of the first dental resin material and to provide a second recess on at least two or more surfaces corresponding to side surfaces of the first dental resin material with one of the broad surfaces being a bottom surface, the second recess being provided on at least two or more surfaces corresponding to side surfaces of the bottom surface;
preparing a dental mold that matches the teeth and gums of a user who is to wear the intraoral sensing device;
placing the electronic device covered with the first dental resin material and the second dental resin material on the dental mold;
pressing the dental mold against a material for manufacturing an oral appliance to perform embossing to form an oral appliance having a first recess in which the electronic device is housed and covered with the first dental resin material and the second dental resin material;
A method for manufacturing an intraoral sensing device, comprising removing the oral appliance from the dental mold while the electronic device covered with the first dental resin material and the second dental resin material is housed in the first recess. A method for manufacturing the intraoral sensing device according to claim 6, comprising:
preparing an electronic device having an electronic device mounted on a circuit board;
Covering all of the electronic devices with a first dental resin material;
covering the electronic device covered with the first dental resin material with a second dental resin material so as to cover the entirety of the first dental resin material and to provide second protrusions on at least two or more surfaces corresponding to side surfaces of the first dental resin material with one of the broad surfaces being a bottom surface;
preparing a dental mold that matches the teeth and gums of a user who is to wear the intraoral sensing device;
placing the electronic device covered with the first dental resin material and the second dental resin material on the dental mold;
pressing the dental mold against a material for manufacturing an oral appliance to perform embossing to form an oral appliance having a first recess in which the electronic device is housed and covered with the first dental resin material and the second dental resin material;
A method for manufacturing an intraoral sensing device, comprising removing the oral appliance from the dental mold while the electronic device covered with the first dental resin material and the second dental resin material is housed in the first recess.

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