JP7615080B2 - Cutting device and manufacturing method of cut product - Google Patents

Description

The present invention relates to a cutting device and a method for manufacturing cut products.

JP 2013-120794 A (Patent Document 1) discloses a dicing device that performs groove processing and cutting processing on workpieces such as wafers. In this dicing device, a dicing blade that rotates at high speed is used to perform each process on the workpiece. In addition, the dicing blade is dressed by cutting grooves into a dressing member with the dicing blade. In this dicing device, the dressing member is replaced automatically (see Patent Document 1).

JP 2013-120794 A

The technology disclosed in the above-mentioned Patent Document 1 relates to a dicing device that performs groove processing and cutting processing on workpieces such as wafers. It is not appropriate to apply this technology as is to a cutting device configured to cut objects that are not the subject of a dicing device, such as a sealed substrate sealed with resin.

The present invention has been made to solve these problems, and its purpose is to provide a cutting device that is configured to cut objects including sealed substrates and that is capable of automatically replacing the dress board, and a method for manufacturing the cut products.

A cutting device according to one aspect of the present invention includes a cutting table, a cutting mechanism, a dressing table, a storage mechanism, and a transport mechanism. The cutting table is configured to hold an object to be cut. The cutting mechanism is configured to cut the object to be cut held on the cutting table with a blade. The dressing table is configured to hold a dress board for dressing the blade. The storage mechanism is configured to store a plurality of dress boards in a stacked manner. The transport mechanism includes a substrate transport section and a dress board transport section that is movable together with the substrate transport section. The substrate transport section is configured to adsorb the object to be cut and transport the adsorbed object to the cutting table. The dress board transport section is configured to transport the dress board between the storage mechanism and the dressing table.

According to another aspect of the present invention, a method for manufacturing a cut product is a method for manufacturing a cut product using the above-mentioned cutting device. The method for manufacturing a cut product includes the steps of adsorbing the object to be cut and transporting the adsorbed object to the cutting table, transporting a dressing board between the storage mechanism and the dressing table, dressing the blade using the dressing board held on the dressing table, and cutting the object to be cut held on the cutting table using the dressed blade to manufacture the cut product.

The present invention provides a cutting device that is configured to cut objects including sealed substrates and that is capable of automatically replacing the dress board, and a method for manufacturing the cut products.

FIG. 2 is a plan view showing a schematic diagram of a cutting device. FIG. 2 is a diagram illustrating a hardware configuration of a computer. FIG. 2 is a perspective view showing a schematic view of the periphery of a storage mechanism. FIG. 2 is a diagram showing a schematic view of the transport mechanism as viewed from diagonally below. FIG. 2 is a schematic diagram showing the transport mechanism as viewed obliquely from above; 13 is a diagram for explaining the relationship between a substrate transport unit, a mounting loader, and a suction source. FIG. FIG. 2 is a schematic side view of a portion of a transport mechanism; FIG. 2 is a diagram showing a schematic view of the cutting table and the dressing table as viewed obliquely from above. FIG. 2 is a diagram showing a schematic plan view of a dress board arrangement member; FIG. 10 is a schematic diagram showing a cross section taken along the line XX in FIG. 9 . 13 is a flowchart showing a procedure for automatic replacement processing of a dress board. 12 is a flowchart showing a process executed in step S110 of FIG. 11 . 13 is a diagram showing the positional relationship between the transport mechanism and the table at the timing of recovering the dressing board held on the dressing table. FIG. 12 is a flowchart showing a process executed in step S120 of FIG. 11 . 13 is a diagram showing the positional relationship between the transport mechanism and the table at the timing when a new dress board is placed on the dressing table. FIG. 13 is a flowchart showing an example of performing a recovery process and an attachment process of a dress board in parallel. FIG. 11 is a perspective view showing a schematic view of the periphery of a new dress holder in another embodiment.

Below, an embodiment of one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail with reference to the drawings. Note that the same or corresponding parts in the drawings are given the same reference numerals and their description will not be repeated. Also, each drawing is drawn in a schematic manner with objects appropriately omitted or exaggerated for ease of understanding.

[1. Configuration]
<1-1. Overall configuration of the cutting device>
1 is a plan view showing a schematic diagram of a cutting apparatus 1 according to the present embodiment. The cutting apparatus 1 is configured to cut a package substrate (one example of an object to be cut) to separate the package substrate into a plurality of electronic components (package components). Examples of package substrates include a substrate or lead frame on which a semiconductor chip is mounted and sealed with resin, and a substrate in which a capacitor, resistor, etc. are sealed with resin. In the present embodiment, the object to be cut is a package substrate, but the object to be cut may be a substrate or wafer that is not sealed with resin.

Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

The cutting device 1 is also configured to inspect each of the multiple individual electronic components. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as a "good product" or a "defective product."

In this example, a package substrate P1 is used as the object to be cut, and the package substrate P1 is divided into a plurality of electronic components S1 by a cutting device 1. In the following, of the two surfaces of the package substrate P1, the surface that is sealed with resin is referred to as the mold surface, and the surface opposite the mold surface is referred to as the ball/lead surface.

As shown in FIG. 1, the cutting device 1 includes, as its components, a cutting module A1 and an inspection and storage module B1. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1.

In addition, in the cutting module A1, a blade 6a (described later) for cutting the package substrate P1 is dressed. Dressing the blade 6a means sharpening the blade 6a. The blade 6a is dressed by forming a groove in a dress board D1 (described later) with the blade 6a. In the cutting module A1, the dress board D1 is automatically replaced. The automatic replacement of the dress board D1 will be described in detail later.

The inspection and storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to the other components.

The cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a table 5, a spindle section 6, and a transport section 7.

The board supply unit 3 supplies the package boards P1 one by one to the positioning unit 4 by pushing the package boards P1 out one by one from a magazine M1 that contains multiple package boards P1. At this time, the package boards P1 are positioned with the ball/lead surface facing upwards.

The positioning unit 4 includes a rail section 4a, a transport mechanism 4b, and a storage mechanism 43. In the rail section 4a, the package substrate P1 pushed out from the substrate supply section 3 is placed on the rail section 4a, and the package substrate P1 is positioned. The transport mechanism 4b then transports the positioned package substrate P1 to the table 5. The storage mechanism 43 stacks and stores multiple dress boards D1 (Figure 3). The transport mechanism 4b transports the dress boards D1 stored in the storage mechanism 43 to the table 5 as necessary. The transport mechanism 4b and the storage mechanism 43 will be described in detail later.

The table 5 holds the package substrate P1 to be cut. Here, a cutting device 1 having a twin-cut table configuration with two tables 5 is illustrated. The tables 5 include a cutting table 5a, a dressing table 5f, a rotation mechanism 5b, and a movement mechanism 5c.

The cutting table 5a holds the package substrate P1 transported by the transport mechanism 4b by suctioning it from below. The dressing table 5f holds the dress board D1 (FIG. 3) transported by the transport mechanism 4b by suctioning it from below. As will be described in detail later, the dress board D1 held on the dressing table 5f is automatically replaced by the transport mechanism 4b.

The rotation mechanism 5b can rotate the cutting table 5a and the dressing table 5f in the θ1 direction in the figure (i.e., rotate them in a horizontal plane). The movement mechanism 5c can move the cutting table 5a and the dressing table 5f along the Y axis in the figure. More specifically, the movement mechanism 5c can move between a set position (hereinafter also simply referred to as the "set position") where the package substrate P1 is held on the cutting table 5a, and a processing position (hereinafter also simply referred to as the "processing position") where the package substrate P1 is subjected to cutting processing.

The spindle unit 6 cuts the package substrate P1 to separate the package substrate P1 into a plurality of electronic components S1. Here, a cutting device 1 having a twin spindle configuration with two spindle units 6 is shown as an example. The spindle units 6 are movable along the X-axis and Z-axis in the figure. The cutting device 1 may also have a single spindle configuration with one spindle unit 6.

The spindle portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, and separates the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotating shaft 6c while being clamped by a first and second flange (not shown). The first and second flanges are fixed to the rotating shaft 6c by a fastening member (not shown), such as a nut. The first flange is also called a back flange, and the second flange is also called an outer flange. In addition, the blade 6a is dressed by rotating the blade 6a at high speed to form a groove in the dress board D1 held on the dressing table 5f. This sharpens the blade 6a.

The spindle section 6 is provided with a cutting water nozzle, a cooling water nozzle, a scrap-blowing water nozzle, etc. The cutting water nozzle sprays cutting water toward the blade 6a, which rotates at high speed. The cooling water nozzle sprays cooling water toward the vicinity of the cutting point of the package substrate P1. The scrap-blowing water nozzle sprays scrap-blowing water to blow away cutting chips, etc.

After the cutting table 5a picks up the package substrate P1, the first position confirmation camera 5d captures an image of the package substrate P1 and confirms the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. The mark indicates, for example, the cutting position of the package substrate P1.

Then, the table 5 moves toward the spindle unit 6 along the Y axis in the figure. After the table 5 moves below the spindle unit 6, the package substrate P1 is cut by moving the table 5 and the spindle unit 6 relatively. Thereafter, if necessary, the package substrate P1 is imaged by the second position confirmation camera 6b provided on the spindle unit 6, and the position of the package substrate P1, etc., is confirmed. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

After cutting of the package substrate P1 is completed, the table 5 moves away from the spindle portion 6 along the Y axis in the figure with the multiple individual electronic components S1 adsorbed thereon. During this movement process, the first cleaner 5e cleans and dries the top surface (ball/lead surface) of the electronic component S1. The first cleaner 5e is provided in the area between the set position and the processing position. Cleaning by the first cleaner 5e may be performed, for example, by directly spraying cleaning water (an example of a liquid) onto the top surface of the electronic component S1, or by supplying cleaning water to the top surface of the electronic component S1 via a brush or the like.

In the cutting device 1, two first cleaners 5e are provided aligned in the X-axis direction in the figure, but the number of first cleaners 5e is not limited to this. In addition, in the cutting device 1, the first cleaner 5e may be capable of cleaning the dress board D1 held on the dressing table 5f. In this case, for example, the dress board D1 may be cleaned by directly spraying cleaning water onto the upper surface of the dress board D1. Also, two fluids including liquid and gas may be directly sprayed onto the upper surface of the dress board D1. In this way, for example, even if processing debris generated during the cutting process of the package substrate P1 adheres to the dress board D1, the dress board D1 can be cleaned, and the cleaned dress board D1 can be used to dress the blade 6a.

The transport unit 7 picks up the electronic component S1 held on the cutting table 5a from above and transports the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the underside (molded surface) of the electronic component S1. This cleaning may be performed, for example, by spraying cleaning water directly onto the underside of the electronic component S1, or by supplying cleaning water to the underside of the electronic component S1 via a brush or the like.

The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. The first optical inspection camera 12 may be provided in the cutting module A1.

The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis in the figure. The inspection table 11 can also be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by suction.

The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both sides (ball/lead surface and mold surface) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is positioned near the inspection table 11 so as to capture an image above.

The first optical inspection camera 12 captures an image of the mold surface of the electronic component S1 being transported to the inspection table 11 by the transport unit 7. The transport unit 7 then places the electronic component S1 on the holding member of the inspection table 11. After the holding member adsorbs the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball/lead surface of the electronic component S1 is captured by the second optical inspection camera 13.

The placement section 14 is where the inspected electronic component S1 is placed. The placement section 14 is movable along the Y axis in the figure. The inspection table 11 places the inspected electronic component S1 on the placement section 14.

The extraction unit 15 transfers the electronic components S1 placed in the placement unit 14 to a tray. The electronic components S1 are sorted into "good" or "defective" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component S1 to a good-product tray 15a or a defective-product tray 15b based on the results of the sorting. That is, good products are stored in the good-product tray 15a, and defective products are stored in the defective-product tray 15b. When the good-product tray 15a and the defective-product tray 15b are each filled with electronic components S1, they are replaced with a new tray.

The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is configured as a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

The computer 50 controls the operation of each part of, for example, the cutting module A1 and the inspection and storage module B1. The computer 50 controls the operation of, for example, the board supply unit 3, the positioning unit 4, the table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction unit 15, and the monitor 20.

<1-2. Computer hardware configuration>
Fig. 2 is a diagram illustrating a hardware configuration of the computer 50. As illustrated in Fig. 2, the computer 50 includes a control unit 70, an input/output I/F (interface) 90, a reception unit 95, and a storage unit 80, and each component is electrically connected via a bus.

The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, and a ROM (Read Only Memory) 76. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input/output I/F 90 is used to transmit data from the computer 50 to each component in the cutting device 1, and to receive data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from a user (operator). The reception unit 95 is configured, for example, with some or all of a touch panel, a keyboard, a mouse, and a microphone.

The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store, for example, a control program 81. The control program 81 is executed by the control unit 70 to realize various operations in the cutting device 1. When the control unit 70 executes the control program 81, the control program 81 is deployed in the RAM 74. The control unit 70 then controls each component by interpreting and executing the control program 81 deployed in the RAM 74 using the CPU 72.

<1-3. Detailed configuration of each mechanism related to automatic exchange of dress board>
As described above, the cutting device 1 is provided with the dressing table 5f configured to hold the dress board D1, and the dress board D1 held by the dressing table 5f is automatically replaced. The reason for this will be described next.

For example, if the dressing table 5f is not provided, it is possible to dress the blade 6a by placing the dress board D1 on the cutting table 5a. It is also possible to manually place the dress board D1. In such a case, the worker must temporarily stop the cutting device 1 and manually place the dress board D1 on the cutting table 5a. Since this type of work requires a certain amount of time, it takes a long time to dress the dress board D1.

In the cutting device 1 according to this embodiment, a dressing table 5f that holds the dress board D1 is provided separately from the cutting table 5a, and the dress board D1 held on the dressing table 5f is automatically replaced by the transport mechanism 4b. Therefore, according to the cutting device 1, the dress board D1 is basically held on the dressing table 5f, and even when replacement of the dress board D1 is required, the dress board D1 is automatically replaced, so that the time required for dressing the dress board D1 can be shortened. Below, each mechanism related to the automatic replacement of the dress board D1 will be described in detail.

(1-3-1. Configuration of accommodation mechanism)
Fig. 3 is a perspective view showing the periphery of the storage mechanism 43. As shown in Fig. 3, the storage mechanism 43 is provided at a position adjacent to the rail portion 4a. The storage mechanism 43 includes a new dress holder 43a and a used dress box 43b.

The new dress holder 43a is configured to accommodate multiple new dress boards D1 in a stacked manner. The new dress holder 43a is attached to a base portion 436 and includes a movable block 432 and a fixed block 433. The base portion 436 is a plate-shaped member supported by multiple legs.

The fixed block 433 is fixed on the base portion 436. A protrusion 437 that protrudes toward the movable block 432 in the X-axis direction is provided on each of both ends of the fixed block 433 in the Y-axis direction. The length between the two protrusions 437 is approximately the same as the length of the corresponding side of the dress board D1. The two protrusions 437 determine the position of the dress board D1 in the Y-axis direction with high precision.

The movable block 432 has a movable range in the X-axis direction on the base portion 436. The movable block 432 can be fixed at a desired position within the movable range. By determining the position of the movable block 432, the position of the dress board D1 in the X-axis direction can be determined with high precision.

A sensor 434 is attached to the underside of the base portion 436. The sensor 434 is, for example, a reflective sensor. The dress board D1 housed at the bottom of the multiple dress boards D1 housed in the new dress holder 43a is exposed to the sensor 434 side. The sensor 434 detects whether or not a dress board D1 remains in the new dress holder 43a by, for example, emitting light toward the new dress holder 43a and detecting the presence or absence of reflected light. For example, when the new dress holder 43a becomes empty, the cutting device 1 may sound an alarm.

The used dress box 43b is configured to store multiple used dress boards D1 in a stacked manner. For example, when the number of dress boards D1 stored in the used dress box 43b reaches a predetermined number, the used dress box 43b is replaced with an empty new one. The used dress box 43b is a box-shaped member with an open top. The used dress box 43b is placed on the base portion 436.

The used dress box 43b includes a bottom portion 430 and side walls 431a, 431b, 431c, and 431d. A plurality of used dress boards D1 are stored in the space enclosed by the side walls 431a, 431b, 431c, and 431d. The side walls 431a and 431c face each other, and the side walls 431b and 431d face each other. A notch portion C1 is formed at the upper end of each of the side walls 431b and 431d. The reason for the notch portion C1 being formed at the upper end of each of the side walls 431b and 431d will be explained later.

A sensor 435 is attached to the underside of the base portion 436. The sensor 435 is, for example, a reflective sensor. At least a portion of the underside of the used dress box 43b is exposed on the sensor 435 side. The sensor 435 detects whether the used dress box 43b is present at a predetermined position by, for example, emitting light toward the used dress box 43b and detecting the presence or absence of reflected light. For example, if the used dress box 43b is not present at the predetermined position, the cutting device 1 may sound an alarm.

(1-3-2. Configuration of the transport mechanism)
Fig. 4 is a schematic diagram of the transport mechanism 4b as viewed from diagonally below. Fig. 5 is a schematic diagram of the transport mechanism 4b as viewed from diagonally above. With reference to Figs. 4 and 5, the transport mechanism 4b includes a substrate transport section 42 and a dress board transport section 41. In each of Figs. 4 and 5, in order to facilitate understanding, the mounting loader 41a and the recovery loader 41b are shown holding the dress board D1, and in particular, the dress board D1 held by the recovery loader 41b is shown as transparent.

The board transport unit 42 is configured to adsorb the package board P1 positioned on the rail portion 4a (Fig. 1) and transport the adsorbed package board P1 to the cutting table 5a. The board transport unit 42 is connected to a suction source 65 (Fig. 6) such as a vacuum ejector via a connecting member 66. The suction source 65 will be described later.

The dress board transport unit 41 includes an attachment loader 41a and a recovery loader 41b. The attachment loader 41a and the recovery loader 41b are provided adjacent to each other in the X-axis direction (see FIG. 1). The dress board transport unit 41 is integrated with the board transport unit 42 and is configured to move in the X-direction together with the board transport unit 42.

The mounting loader 41a is configured to pick up the uppermost dress board D1 among the multiple dress boards D1 housed in the new dress holder 43a (Figure 3) and transport the picked up dress board D1 from the new dress holder 43a to the dressing table 5f. The mounting loader 41a is connected to a suction source 65 such as a vacuum ejector via a connecting member 66.

Figure 6 is a diagram for explaining the relationship between the board conveying unit 42, the mounting loader 41a, and the suction source 65. As shown in Figure 6, the board conveying unit 42 and the mounting loader 41a are each connected to a common suction source 65 via a switching valve V1. For example, by controlling the switching valve V1 by the control unit 70 (Figure 2), a state in which the board conveying unit 42 and the suction source 65 are connected and a state in which the mounting loader 41a and the suction source 65 are connected can be switched. According to the cutting device 1, the suction source for adsorbing the package substrate P1 and the suction source for adsorbing the dress board D1 are common, so that an increase in the number of suction sources can be suppressed. As a result, according to the cutting device 1, an increase in the size of the device can be suppressed.

The mounting loader 41a includes an air cylinder 411a and a vacuum pad 44. The air cylinder 411a is expandable and contractible in the vertical direction, and is configured to move the vacuum pad 44 in the vertical direction. The vacuum pad 44 is lowered and the dress board D1 is adsorbed in a state where the vacuum pad 44 is in contact with the dress board D1. In this way, the dress board D1 is held by the mounting loader 41a. In addition, by connecting a pressure reducing valve to the air cylinder 411a, the dress board D1 can be appropriately picked up regardless of the number of dress boards D1 remaining in the new dress holder 43a.

The recovery loader 41b is configured to mechanically hold the used dress board D1 held on the dressing table 5f and transport the held dress board D1 from the dressing table 5f to the used dress box 43b. The reason why a new dress board D1 is held by suction while a used dress board D1 is not held by suction but is held mechanically will be explained below.

A large number of grooves are formed on the used dress board D1. Depending on the weight of the dress board D1 and/or the size of the grooves, the dress board D1 may not be stably held by suction on the surface on which the large number of grooves are formed. In other words, the holding of the used dress board D1 may become unstable.

In the cutting device 1, a new (unused) dress board D1 is held by suction by the attachment loader 41a, and a used dress board D1 is mechanically held by the recovery loader 41b. Therefore, according to the cutting device 1, since the new dress board D1 is held by suction, it is possible to suppress a decrease in the positional accuracy of the new dress board D1. Also, according to the cutting device 1, since the used dress board D1 is mechanically held, it is possible to stably hold the used dress board D1.

Figure 7 is a schematic diagram showing a side view of a portion of the transport mechanism 4b. Referring to Figure 7, the recovery loader 41b includes an air cylinder 411b and claws 49a and 49b. The air cylinder 411b is expandable and contractible in the vertical direction, and is configured to move the claws 49a and 49b in the vertical direction.

The claws 49a, 49b face each other in the horizontal direction (X-axis direction). The claws 49a, 49b are configured to move toward each other and away from each other. That is, the pair of claws formed by the claws 49a, 49b (hereinafter also simply referred to as the "pair of claws") are configured to open and close in the horizontal direction. The recovery loader 41b mechanically holds the dress board D1 by clamping the dress board D1 with the pair of claws.

The claw portion 49a includes a claw 45a, a linear bushing 47a, an air chuck 46a, and a spring 48a. The claw 45a is a plate-shaped member that has a width in the Y-axis direction and extends in the Z-axis direction. The lower end of the claw 45a is bent toward the claw 45b. The claw 45a is attached to the linear bushing 47a. An axis extending in the X-axis direction passes through the linear bushing 47a, and the linear bushing 47a is configured to move on the axis. On the axis passing through the linear bushing 47a, a spring 48a is provided in a direction opposite to the direction in which the claw 45a exists, based on the linear bushing 47a. The air chuck 46a is configured to move in the X-axis direction. The linear bushing 47a is attached to the air chuck 46a.

The claw portion 49b includes a claw 45b, a linear bushing 47b, an air chuck 46b, and a spring 48b. The claw 45b is a plate-shaped member that has a width in the Y-axis direction and extends in the Z-axis direction. The lower end of the claw 45b is bent toward the claw 45a. The claw 45b is attached to the linear bushing 47b. An axis extending in the X-axis direction passes through the linear bushing 47b, and the linear bushing 47b is configured to move on the axis. On the axis passing through the linear bushing 47b, a spring 48b is provided in a direction opposite to the direction in which the claw 45b exists, based on the linear bushing 47b. The air chuck 46b is configured to move in the X-axis direction. The linear bushing 47b is attached to the air chuck 46b.

As the air chucks 46a and 46b move in a direction approaching each other, the linear bushing 47a to which the claw 45a is attached and the linear bushing 47b to which the claw 45b is attached move closer to each other. Finally, with each of the springs 48a and 48b in a compressed state, the used dress board D1 is held by the claws 45a and 45b. When the springs 48a and 48b are in a compressed state, a force acts in the direction in which each of the springs 48a and 48b expands, so the dress board D1 is held with an appropriate force (soft clamp).

(1-3-3. Configuration of the dressing table)
Fig. 8 is a schematic diagram showing the cutting table 5a and the dressing table 5f as viewed obliquely from above. As shown in Fig. 8, the dressing table 5f is provided at a position adjacent to the cutting table 5a and is fixed to the cutting table 5a. The dressing table 5f includes a base portion 63 and a dress board arrangement member 60 fixed on the base portion 63. The dress board arrangement member 60 is made of an elastic member such as rubber and is replaceable. The dress board D1 is arranged on the dress board arrangement member 60. The dress board D1 is held by suction on the dress board arrangement member 60.

Figure 9 is a diagram that shows a schematic plan view of the dress board placement member 60. Figure 10 is a diagram that shows a schematic cross section taken along line X-X in Figure 9. With reference to Figures 9 and 10, the dress board placement member 60 has a bottom surface portion 61. A plurality of holes H2 are formed on the bottom surface portion 61. Suction of the dress board D1 is performed through the holes H2. A cutout portion C2 is formed on each of a pair of opposing sides among the multiple sides of the bottom surface portion 61. The reason for the formation of the cutout portion C2 will be explained later.

A protrusion 62 extending upward is formed on the outer periphery of the bottom surface portion 61 except for the portion where the notch portion C2 is formed. The dress board D1 is placed within the area surrounded by the protrusion 62. The shape and size of the dress board D1 in a plan view are approximately the same as the shape and size of the area surrounded by the protrusion 62 in a plan view.

2. Operation
11 is a flowchart showing the procedure of the automatic replacement process of the dress board D1. The process shown in this flowchart is executed by the control unit 70 (FIG. 2) of the computer 50 when the installation or replacement of the dress board D1 is required.

Referring to FIG. 11, the control unit 70 determines whether or not a used dress board D1 is present on the dressing table 5f by, for example, referring to the output of a sensor (not shown) that detects the suction state on the dressing table 5f (step S100). If it is determined that a used dress board D1 is not present on the dressing table 5f (NO in step S100), the control unit 70 executes the process of step S120.

On the other hand, when it is determined that a used dress board D1 is present on the dressing table 5f (YES in step S100), the control unit 70 executes a process for collecting the used dress board D1 (step S110). The process for collecting the dress board D1 will be described in detail later. When the process for collecting the used dress board D1 is completed, the control unit 70 executes a process for mounting a new dress board D1 (step S120). The process for mounting the dress board D1 will be described in detail later.

Figure 12 is a flowchart showing the process executed in step S110 (dress board D1 recovery process) in Figure 11. Referring to Figure 12, the control unit 70 controls the drive unit (e.g., a motor) of the transport mechanism 4b so that the recovery loader 41b is positioned above the dressing table 5f (step S200). Thereafter, the control unit 70 controls the drive unit of the pair of claws of the recovery loader 41b so that the pair of claws descends and picks up the used dress board D1 held on the dressing table 5f (step S210).

Referring again to FIG. 9, a pair of claws of the recovery loader 41b are lowered in an open state, and then the pair of claws close, causing the pair of claws to enter the notch C2 of the dress board placement member 60 included in the dressing table 5f. The pair of claws rise with the pair of claws entering the notch C2, thereby picking up the dress board D1.

Figure 13 is a diagram showing the positional relationship between the transport mechanism 4b and the table 5 at the timing of recovering the dress board D1 held on the dressing table 5f. As shown in Figure 13, at the timing of recovering the dress board D1 held on the dressing table 5f, the recovery loader 41b is located above the dressing table 5f. On the other hand, in a plan view, the board transport unit 42 and the cutting table 5a do not overlap. The reason why the dress board D1 is recovered in such a positional relationship will be explained next.

In the cutting device 1, the board conveying section 42 is provided with a pin PI1 extending downward, and the cutting table 5a is provided with a hole H1 into which the pin PI1 enters. In the cutting device 1, in order to ensure the positional accuracy of the package board P1, the board conveying section 42 places the package board P1 on the cutting table 5a with the pin PI1 of the board conveying section 42 entering the hole H1 of the cutting table 5a. If the recovery loader 41b attempts to recover the dress board D1 with the board conveying section 42 and the cutting table 5a overlapping in a plan view, the pin PI1 of the board conveying section 42 gets in the way. According to the cutting device 1, the recovery loader 41b recovers the dress board D1 with the board conveying section 42 and the cutting table 5a not overlapping in a plan view, so that the dress board D1 can be appropriately recovered.

Referring again to FIG. 12, when the pickup of the dress board D1 is completed in step S210, the control unit 70 controls the drive unit of the transport mechanism 4b so that the recovery loader 41b is positioned above the used dress box 43b (step S220). After that, the control unit 70 controls the drive unit of the pair of claws of the recovery loader 41b so that the pair of claws is lowered and opens when each claw enters each notch C1 (FIG. 3) formed in the used dress box 43b (step S230). As a result, the used dress board D1 is stored in the used dress box 43b. Since the pair of claws is opened when each claw enters each notch C1 (FIG. 3) formed in the used dress box 43b, the possibility that the used dress board D1 will not fall into the used dress box 43b is reduced.

Figure 14 is a flow chart showing the process executed in step S120 (dress board D1 installation process) in Figure 11. Referring to Figure 14, the control unit 70 controls the drive unit of the transport mechanism 4b so that the installation loader 41a is positioned above the new dress holder 43a (step S300). The control unit 70 controls the drive unit of the installation loader 41a so that the vacuum pad 44 of the installation loader 41a descends and adsorbs and holds the new dress board D1 housed in the new dress holder 43a (step S310).

The control unit 70 controls the drive unit of the transport mechanism 4b so that the attachment loader 41a is positioned above the dressing table 5f (step S320). The control unit 70 then controls the drive unit of the attachment loader 41a so that the vacuum pad 44 descends and positions the dress board D1 on the dressing table 5f (step S330).

Figure 15 is a diagram showing the positional relationship between the transport mechanism 4b and the table 5 at the timing when a new dress board D1 is placed on the dressing table 5f. As shown in Figure 15, at the timing when a new dress board D1 is placed on the dressing table 5f, the attachment loader 41a is located above the dressing table 5f. On the other hand, in a plan view, the board transport unit 42 and the cutting table 5a do not overlap. According to the cutting device 1, the dress board D1 is placed by the attachment loader 41a in a state where the board transport unit 42 and the cutting table 5a do not overlap in a plan view, so that the dress board D1 can be appropriately placed on the dressing table 5f without being affected by the pin PI1.

[3. Features]
As described above, in the cutting device 1 according to the present embodiment, the transport mechanism 4b includes the dress board transport unit 41. The dress board transport unit 41 automatically transports the dress board D1 between the accommodation mechanism 43 and the dressing table 5f. Therefore, according to the cutting device 1, since the dress board D1 is automatically transported between the accommodation mechanism 43 and the dressing table 5f, the dress board D1 attached to the dressing table 5f can be automatically replaced. As a result, the cutting device 1 can reduce the time required to replace the dress board D1.

The cutting device 1 is an example of a "cutting device" in the present invention. The cutting table 5a is an example of a "cutting table" in the present invention. The spindle unit 6 is an example of a "cutting mechanism" in the present invention. The dressing table 5f is an example of a "dressing table" in the present invention. The storage mechanism 43 is an example of a "storage mechanism" in the present invention. The transport mechanism 4b is an example of a "transport mechanism" in the present invention. The substrate transport unit 42 is an example of a "substrate transport unit" in the present invention. The dress board transport unit 41 is an example of a "dress board transport unit" in the present invention.

The mounting loader 41a is an example of the "mounting loader" in the present invention. The recovery loader 41b is an example of the "recovery loader" in the present invention. The suction source 65 is an example of the "suction source" in the present invention. Each of the claw portions 49a and 49b is an example of the "claw portion" in the present invention. The new dress holder 43a is an example of the "first storage portion" in the present invention. The used dress box 43b is an example of the "second storage portion" in the present invention. The moving mechanism 5c is an example of the "moving mechanism" in the present invention. The first cleaner 5e is an example of the "cleaning portion" in the present invention.

4. Other embodiments
The concept of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the concept of the above embodiment can be applied will be described.

<4-1>
In the above embodiment, in the automatic exchange of the dress board D1, the attachment process of the new dress board D1 is performed after the recovery process of the used dress board D1 is completed. However, the procedure of these processes is not limited to this. For example, these processes may be performed in parallel.

Figure 16 is a flowchart showing an example of performing the recovery process and the installation process of the dress board D1 in parallel. The process shown in this flowchart may be executed by, for example, the control unit 70.

Referring to FIG. 16, the control unit 70 controls the drive unit of the transport mechanism 4b so that the mounting loader 41a is positioned above the new dress holder 43a (step S400). The control unit 70 controls the drive unit of the mounting loader 41a so that the vacuum pad 44 of the mounting loader 41a descends and adsorbs and holds the new dress board D1 housed in the new dress holder 43a (step S405).

The control unit 70 determines whether or not a used dress board D1 is present on the dressing table 5f (step S410) by, for example, referring to the output of a sensor (not shown) that detects the suction state on the dressing table 5f. If it is determined that a used dress board D1 is not present on the dressing table 5f (NO in step S410), the control unit 70 executes the process of step S425.

On the other hand, when it is determined that a used dress board D1 is present on the dressing table 5f (YES in step S410), the control unit 70 controls the drive unit of the transport mechanism 4b so that the recovery loader 41b is positioned above the dressing table 5f (step S415). After that, the control unit 70 controls the drive unit of the pair of claws of the recovery loader 41b so that the pair of claws descends and picks up the used dress board D1 held on the dressing table 5f (step S420).

The control unit 70 controls the drive unit of the transport mechanism 4b so that the attachment loader 41a is positioned above the dressing table 5f (step S425). The control unit 70 then controls the drive unit of the attachment loader 41a so that the vacuum pad 44 descends and positions the dress board D1 on the dressing table 5f (step S430). The control unit 70 then controls the drive unit of the transport mechanism 4b so that the recovery loader 41b is positioned above the used dress box 43b (step S435).

The control unit 70 determines whether the recovery loader 41b holds a used dress board D1 by, for example, referring to the output of a sensor (not shown) provided in the recovery loader 41b (step S440). If it is determined that the recovery loader 41b does not hold a used dress board D1 (NO in step S440), the process shown in this flowchart ends. On the other hand, if it is determined that the recovery loader 41b holds a used dress board D1 (YES in step S440), the control unit 70 controls the drive unit of the pair of claws so that the pair of claws of the recovery loader 41b descends and opens while each claw enters each notch C1 (FIG. 3) formed in the used dress box 43b (step S445). As a result, the used dress board D1 is stored in the used dress box 43b.

In this way, by performing the collection process of the used dress board D1 and the installation process of the new dress board D1 in parallel, the time required to replace the dress board D1 can be further shortened.

<4-2>
In the above embodiment, the recovery loader 41b mechanically holds the used dress board D1. However, the recovery loader 41b does not necessarily have to mechanically hold the dress board D1. For example, when the grooves formed in the dress board D1 are shallow or the dress board D1 is lightweight, the recovery loader 41b may hold the dress board D1 by suction.

<4-3>
In the above embodiment, the board transport unit 42 and the mounting loader 41a are connected to a common suction source 65. However, the board transport unit 42 and the mounting loader 41a do not necessarily have to be connected to a common suction source 65. The suction source connected to the board transport unit 42 and the suction source connected to the mounting loader 41a may be different.

<4-4>
The structure of the new dress holder is not limited to the structure of the new dress holder 43a in the above embodiment. For example, the structure of the new dress holder may be as described below.

Figure 17 is a perspective view showing the periphery of a new dress holder 43aA in another embodiment. As shown in Figure 17, the new dress holder 43aA is configured to accommodate multiple dress boards D1 stacked together. In the example shown in Figure 17, the new dress holder 43aA accommodates two fewer dress boards D1 than the maximum number that can be accommodated (one example).

The new dress holder 43aA is attached to the base portion 436 and includes a movable block 432A and a fixed block 433. The movable block 432A has a movable range in the X-axis direction on the base portion 436. The movable block 432A can be fixed to a desired position within the movable range.

The movable block 432A has a through hole H4 formed therethrough in the thickness direction (X-axis direction) of the movable block 432A. When the maximum number of dress boards D1 are housed in the new dress holder 43aA, the center of the through hole H4 is located at the boundary between the topmost dress board D1 and the second topmost dress board D1. A pipe 438 is connected to the through hole H4, and compressed air is sent to the through hole H4 through the pipe 438.

For example, when the mounting loader 41a sucks and holds the dress board D1 housed in the new dress holder 43a, the discharge of compressed air from the through hole H4 begins. Then, when the dress board D1, while being sucked and held by the mounting loader 41a, rises to the position of the through hole H4, the discharge of compressed air from the through hole H4 stops. Then, the transport of the dress board D1 continues.

The reason why the above operation is performed will be explained below. For example, a water-soaked dress board D1 may be unintentionally stored in the new dress holder 43aA. In such a case, the multiple dress boards D1 may stick to each other, and the multiple dress boards D1 may be lifted up by the attachment loader 41a suctioning and holding the dress boards D1. As described above, by discharging compressed air from the through hole H4 to the boundary between the dress boards D1, the dress boards D1 other than the dress board D1 suctioned and held by the vacuum pad 44 among the multiple dress boards D1 that have been lifted can be dropped into the new dress holder 43aA. In other words, this configuration makes it possible to prevent the occurrence of a situation in which multiple new dress boards D1 are unintentionally transported.

The above is an illustrative description of the embodiment of the present invention. In other words, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative description. Therefore, the components described in the detailed description and the accompanying drawings may include components that are not essential for solving the problem. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately determined that these non-essential components are essential.

Furthermore, the above-described embodiment is merely an example of the present invention in every respect. The above-described embodiment can be improved or modified in various ways within the scope of the present invention. In other words, in implementing the present invention, specific configurations can be appropriately adopted according to the embodiment.
[5. Notes]

This specification discloses a variety of technical ideas, including at least the following technologies:

<Technology 1>
(composition)
a cutting table configured to hold an object to be cut;
a cutting mechanism configured to cut the object held on the cutting table with a blade;
a dressing table configured to hold a dress board for dressing the blade;
A storage mechanism configured to store a plurality of the dress boards in a stacked manner;
a transport mechanism including a substrate transport unit and a dress board transport unit that moves together with the substrate transport unit;
the substrate transport unit is configured to adsorb the workpiece and transport the adsorbed workpiece to the cutting table,
The cutting apparatus, wherein the dress board transport unit is configured to transport the dress board between the accommodation mechanism and the dressing table.

(Effects, etc.)
In this cutting device, the transport mechanism includes a dress board transport unit that automatically transports the dress board between the accommodation mechanism and the dressing table. Therefore, according to this cutting device, since the dress board is automatically transported between the accommodation mechanism and the dressing table, the dress board attached to the dressing table can be automatically replaced.

<Technology 2>
(composition)
The dress board conveying unit is
a mounting loader configured to suck the unused dress board accommodated in the accommodation mechanism and transport the sucked dress board from the accommodation mechanism to the dressing table;
and a recovery loader configured to mechanically hold the used dress board and transport the mechanically held dress board from the dressing table to the storage mechanism.

(Effects, etc.)
In this cutting device, an unused dress board is sucked and held by the attachment loader, and a used dress board is mechanically held by the recovery loader. Therefore, according to this cutting device, since the unused dress board is held by suction, it is possible to suppress a decrease in the positional accuracy of the unused dress board. Also, since a large number of grooves are formed on the surface of the used dress board, the sucked and held state of the used dress board may become unstable. According to this cutting device, since the used dress board is mechanically held, it is possible to stably hold the used dress board.

<Technology 3>
(composition)
The cutting apparatus according to Technology 2, wherein a suction source for suctioning the workpiece by the substrate transport unit and a suction source for suctioning the dress board by the mounting loader are common.

(Effects, etc.)
According to this cutting device, the suction source for suctioning the workpiece and the dress board is common, so that an increase in the number of suction sources can be suppressed, and as a result, the cutting device can be prevented from becoming large in size.

<Technique 4>
(composition)
The recovery loader includes a pair of claws facing each other in a horizontal direction,
The pair of claws are configured to open and close in a horizontal direction,
The cutting device according to Technology 2 or Technology 3, wherein the recovery loader is configured to mechanically hold the dress board by clamping the dress board with the pair of claw portions.

(Effects, etc.)
According to this cutting device, the used dress board is clamped between a pair of claw portions and mechanically held therein, so that the used dress board can be held stably.

<Technology 5>
(composition)
The accommodation mechanism includes:
a first receiving portion configured to receive an unused dress board;
a second storage section configured to store the used dress board;
The shape of the first storage portion and the shape of the second storage portion are different,
The second housing portion includes a plurality of side walls,
The used dress board is stored in a space surrounded by the side walls,
The cutting device according to technology 4, wherein a notch is formed in an upper end of each of two opposing side wall portions among the plurality of side wall portions.

(Effects, etc.)
In this storage mechanism, the first storage section and the second storage section have different shapes, and notches are formed in the upper ends of two of the side walls of the second storage section that face each other. With this cutting device, the pair of claws of the recovery loader enter the notches, and the pair of claws are opened to drop the used dress board, so that the used dress board can be reliably stored in the second storage section.

<Technique 6>
(composition)
a moving mechanism configured to move both the cutting table and the dressing table;
a cleaning unit configured to clean each of the workpiece and the dress board,
the moving mechanism is configured to move between a set position where the object is held on the cutting table and a processing position where a cutting process is performed on the object,
The cutting device according to any one of Techniques 1 to 5, wherein the cleaning unit is provided in an area between the set position and the processing position.

(Effects, etc.)
In this cutting device, a cleaning unit is provided in the region between the set position and the processing position. Therefore, according to this cutting device, the dress board held by the dressing table can be cleaned by the cleaning unit. As a result, according to this cutting device, even if processing debris generated during cutting of the cutting object adheres to the dress board, the dress board can be cleaned and the cleaned dress board can be used to dress the blade.

<Technique 7>
(composition)
The cutting apparatus according to claim 6, wherein the cleaning unit is configured to clean each of the workpiece and the dress board by using at least a liquid.

(Effects, etc.)
The cutting device makes it possible to clean the dressing board held by the dressing table at least with a liquid.

<Technique 8>
(composition)
the substrate transport portion includes a pin extending downwardly;
The cutting table has a hole formed therein,
the substrate transport unit is configured to hold the object on the cutting table with the pins inserted into the holes,
A cutting device described in any one of Technology 1 to Technology 7, wherein the dressing board transport unit is configured to transfer the dressing board between the dressing table and the substrate transport unit without overlapping with the cutting table in a planar view.

(Effects, etc.)
In this cutting device, in order to ensure the positional accuracy of the object to be cut, the object is placed on the cutting table with the pins of the substrate transport unit inserted into the holes of the cutting table. If the dress board is exchanged between the dress board transport unit and the dressing table with the substrate transport unit and the cutting table overlapping in a plan view, the pins of the substrate transport unit may get in the way. According to this cutting device, the dress board is exchanged between the dress board transport unit and the dressing table with the substrate transport unit and the cutting table not overlapping in a plan view, so that the dress board can be exchanged appropriately.

<Technique 9>
(composition)
A method for manufacturing a cut product using the cutting device according to any one of techniques 1 to 8,
a step of sucking the object to be cut and transporting the sucked object to the cutting table;
transporting the dress board between the accommodation mechanism and the dressing table;
dressing the blade using the dress board held on the dressing table;
cutting the object held on the cutting table using the dressed blade to produce the cut product.

(Effects, etc.)
In this cut product manufacturing method, the dress board is automatically transported between the storage mechanism and the dressing table. Therefore, according to this cut product manufacturing method, since the dress board is automatically transported between the storage mechanism and the dressing table, the dress board attached to the dressing table can be automatically replaced.

1 Cutting device, 3 Substrate supply section, 4 Positioning section, 4a Rail section, 4b Transport mechanism, 5 Table, 5a Cutting table, 5b Rotation mechanism, 5c Movement mechanism, 5d First position confirmation camera, 5e First cleaner, 5f Dressing table, 6 Spindle section, 6a Blade, 6b Second position confirmation camera, 6c Rotation shaft, 7 Transport section, 7a Second cleaner, 11 Inspection table, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement section, 15 Extraction section, 15a Good product tray, 15b Defective product tray, 20 Monitor, 41 Dress board transport section, 41a Mounting loader, 41b Recovery loader, 42 Substrate transport section, 43 Storage mechanism, 43a, 43aA New dress holder, 43b Used dress box, 44 Vacuum pad, 45a, 45b Claws, 46a, 46b Air chuck, 47a, 47b Linear bushing, 48a, 48b Spring, 49a, 49b Claw portion, 50 Computer, 60 Dress board arrangement member, 61 Bottom surface portion, 62 Protrusion portion, 63, 436 Base portion, 65 Suction source, 66 Connection member, 70 Control portion, 72 CPU, 74 RAM, 76 ROM, 80 Storage portion, 81 Control program, 90 Input/output I/F, 95 Reception portion, 411a, 411b Air cylinder, 430 Bottom surface portion, 431a, 431b, 431c, 431d Side wall portion, 432, 432A Movable block, 433 Fixed block, 434, 435 Sensor, 437 Protrusion portion, 438 Pipe, A1 Cutting module, B1 Inspection and storage module, C1, C2 cutouts, D1 dress board, H1, H2, H3 holes, H4 through hole, P1 package board, PI1 pin, S1 electronic component, V1 switching valve.

Claims (9)

a cutting table configured to hold an object to be cut;
a cutting mechanism configured to cut the object held on the cutting table with a blade;
a dressing table configured to hold a dress board for dressing the blade;
A storage mechanism configured to store a plurality of the dress boards in a stacked manner;
a transport mechanism including a substrate transport unit and a dress board transport unit that moves integrally with the substrate transport unit;
the substrate transport unit is configured to adsorb the workpiece and transport the adsorbed workpiece to the cutting table,
The cutting apparatus, wherein the dress board transport unit is configured to transport the dress board between the accommodation mechanism and the dressing table. The dress board conveying unit is
a mounting loader configured to suck the unused dress board accommodated in the accommodation mechanism and transport the sucked dress board from the accommodation mechanism to the dressing table;
2. The cutting apparatus of claim 1, further comprising: a recovery loader configured to mechanically hold a used dress board and to transport the mechanically held dress board from the dressing table to the storage mechanism. The cutting device according to claim 2, wherein the suction source for the substrate conveying unit to adsorb the cutting object and the suction source for the mounting loader to adsorb the dress board are the same. The recovery loader includes a pair of claws facing each other in a horizontal direction,
The pair of claws are configured to open and close in a horizontal direction,
The cutting device according to claim 2 , wherein the recovery loader is configured to mechanically hold the dress board by clamping the dress board with the pair of claw portions. The accommodation mechanism includes:
a first receiving portion configured to receive an unused dress board;
a second storage section configured to store the used dress board;
The shape of the first storage portion and the shape of the second storage portion are different,
The second housing portion includes a plurality of side walls,
The used dress board is stored in a space surrounded by the side walls,
The cutting device according to claim 4 , wherein a notch is formed in an upper end of each of two opposing side walls among the plurality of side walls. a moving mechanism configured to move both the cutting table and the dressing table;
a cleaning unit configured to clean each of the workpiece and the dress board,
the moving mechanism is configured to move between a set position where the object is held on the cutting table and a processing position where a cutting process is performed on the object,
The cutting device according to claim 1 , wherein the cleaning unit is provided in a region between the setting position and the processing position. The cutting device according to claim 6, wherein the cleaning unit is configured to clean each of the workpiece and the dress board by using at least a liquid. the substrate transport portion includes a pin extending downwardly;
The cutting table has a hole formed therein,
the substrate transport unit is configured to hold the object on the cutting table with the pins inserted into the holes,
The cutting apparatus according to claim 1 , wherein the dressing board transport unit is configured to transfer the dressing board between the dressing table and the substrate transport unit without overlapping with the cutting table in a plan view. A method for manufacturing a cut product using the cutting device according to any one of claims 1 to 8,
a step of sucking the object to be cut and transporting the sucked object to the cutting table;
transporting the dress board between the accommodation mechanism and the dressing table;
dressing the blade using the dress board held on the dressing table;
cutting the object held on the cutting table using the dressed blade to produce the cut product.