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JP7623178B2 - Cleaning resin composition - Google Patents

Cleaning resin composition Download PDF

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JP7623178B2
JP7623178B2 JP2021050165A JP2021050165A JP7623178B2 JP 7623178 B2 JP7623178 B2 JP 7623178B2 JP 2021050165 A JP2021050165 A JP 2021050165A JP 2021050165 A JP2021050165 A JP 2021050165A JP 7623178 B2 JP7623178 B2 JP 7623178B2
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cleaning
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JP2022148466A (en
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宏樹 正村
智朗 内川
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ノバセル株式会社
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Priority to KR1020237032023A priority patent/KR20230159432A/en
Priority to CN202280023029.4A priority patent/CN117042943A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/27—Cleaning; Purging; Avoiding contamination
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C08L25/12—Copolymers of styrene with unsaturated nitriles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

本開示は、樹脂の成形加工に使用する押出加工機や射出成形機の洗浄に使用できる洗浄用樹脂組成物に関する。 This disclosure relates to a cleaning resin composition that can be used to clean extrusion machines and injection molding machines used in resin molding.

樹脂の成形加工に使用する押出加工機や射出成形機を洗浄するための洗浄剤が知られている。
特許文献１（特許第５４０９５２２号公報）には、（ａ）熱可塑性樹脂３０～９０質量％と、（ｂ）平均長さが１００μｍ以下のガラス繊維７０～１０質量％とを含有し、引火温度が４００℃以上である成形機用洗浄剤の発明が記載されている（特許請求の範囲）。
（ａ）熱可塑性樹脂については、ポリスチレン、ポリアミド、スチレン－アクリロニトリル共重合体、ポリカーボネートの中でもポリカーボネートが好ましく、２種以上混合して用いてもよいと記載されている。（段落番号００３１、００３６４） 2. Description of the Related Art Detergents for cleaning extrusion machines and injection molding machines used in resin molding processes are known.
Patent Document 1 (Japanese Patent No. 5,409,522) describes an invention relating to a cleaning agent for molding machines that contains (a) 30 to 90 mass % of a thermoplastic resin and (b) 70 to 10 mass % of glass fibers having an average length of 100 μm or less and has an ignition temperature of 400° C. or higher (claims).
Regarding (a) the thermoplastic resin, it is described that among polystyrene, polyamide, styrene-acrylonitrile copolymer, and polycarbonate, polycarbonate is preferable, and two or more kinds may be mixed and used (paragraphs 0031 and 00364).

特許文献２（特許第５１７１５７３号公報）は、ポリカーボネート（Ａ）１００重量部、珪酸塩化合物（Ｂ）０．１～１００重量部並びに有機酸及び／又は有機酸誘導体（Ｃ）０．００１～１０重量部を含有し、珪酸塩化合物（Ｂ）並びに有機酸及び／又は有機酸誘導体（Ｃ）の混合物のｐＨ値が５～８である洗浄剤の発明が記載されている（特許請求の範囲）。
ポリカーボネートのほかにポリスチレン、ＨＩＰＳ、ＡＳ樹脂、ＡＢＳ樹脂などを含有しても良いことが記載されている。（段落番号００３９） Patent Document 2 (Japanese Patent No. 5,171,573) describes an invention of a cleaning agent which contains 100 parts by weight of polycarbonate (A), 0.1 to 100 parts by weight of a silicate compound (B), and 0.001 to 10 parts by weight of an organic acid and/or an organic acid derivative (C), and in which the mixture of the silicate compound (B) and the organic acid and/or an organic acid derivative (C) has a pH value of 5 to 8 (claims).
It is also described that in addition to polycarbonate, polystyrene, HIPS, AS resin, ABS resin, etc. may be contained. (Paragraph No. 0039)

特許文献３（ＷＯ２０１９／０６９７９８ Ａ１）には、熱可塑性樹脂、及びＴＧＡの分解開始温度が２００℃以上かつ融点が１００℃未満の界面活性剤を含有する、射出成形機及び金型用洗浄剤樹脂組成物の発明が記載されており、前記界面活性剤はスルホン酸塩（アルファスルホ脂肪酸メチルエステル塩）が記載されている（特許請求の範囲）。
熱可塑性樹脂は多数列挙されており、ポリエチレンを含むことが特に好ましいと記載されている。（段落番号００２１） Patent Document 3 (WO2019/069798 A1) describes an invention of a cleaning agent resin composition for injection molding machines and molds, which contains a thermoplastic resin and a surfactant having a TGA decomposition onset temperature of 200°C or higher and a melting point of less than 100°C, and describes the surfactant as a sulfonate (alphasulfo fatty acid methyl ester salt) (claims).
A large number of thermoplastic resins are listed, and it is described that polyethylene is particularly preferable. (Paragraph No. 0021)

特許文献４（特開２０２１－７３４号公報）には、（Ａ）試験温度（θ）２２０℃、公称荷重（Ｍnom）１０kgの条件におけるメルトマスフローレート（ＭＦＲ）の値が１g／１０min乃至４０g／１０minであるスチレン－アクリロニトリル共重合樹脂３０質量部乃至９０質量部、及び（Ｂ）試験温度（θ）３００℃、公称荷重（Ｍnom）１．２kgの条件におけるメルトボリュームフローレート（ＭＶＲ）の値が３cm3／１０min乃至１３０cm3／１０minであるポリカーボネート樹脂質７０量部乃至１０質量部からなり、（Ａ）及び（Ｂ）成分の質量部の合計が１００質量部であることを特徴とする、洗浄用樹脂組成物の発明が記載されている（特許請求の範囲）。
ポリカーボネート樹脂の含有量（ＡＳ樹脂の含有量）については、本発明の洗浄用樹脂組成物において、ポリカーボネート樹脂の含有量は、（Ａ）及び（Ｂ）成分の合計１００質量部に対して、７０質量部乃至１０質量部であり、６０質量部乃至２０質量部であることが好ましく、５０質量部乃至３０質量部であることがより好ましい。（段落番号００２２） Patent Document 4 (JP 2021-734 A) describes an invention of a cleaning resin composition comprising (A) 30 to 90 parts by mass of a styrene-acrylonitrile copolymer resin having a melt mass flow rate (MFR) value of 1 g/10 min to 40 g/10 min under conditions of a test temperature (θ) of 220° C. and a nominal load (Mnom) of 10 kg, and (B) 70 to 10 parts by mass of a polycarbonate resin having a melt volume flow rate (MVR) value of 3 cm 3 /10 min to 130 cm 3 /10 min under conditions of a test temperature (θ) of 300° C. and a nominal load (Mnom) of 1.2 kg, wherein the total parts by mass of the (A) and (B) components is 100 parts by mass (Claims).
Regarding the content of the polycarbonate resin (the content of the AS resin), in the cleaning resin composition of the present invention, the content of the polycarbonate resin is 70 to 10 parts by mass, preferably 60 to 20 parts by mass, and more preferably 50 to 30 parts by mass, per 100 parts by mass of the total of the components (A) and (B). (Paragraph No. 0022)

特許第５４０９５２２号公報Patent No. 5409522 特許第５１７１５７３号公報Patent No. 5171573 ＷＯ２０１９／０６９７９８ Ａ１WO2019/069798 A1 特開２０２１－７３４号公報JP 2021-734 A

本開示は、押出成形機、射出成形機などの樹脂の成形加工機の洗浄性能が良い洗浄用樹脂組成物を提供することを課題とする。 The objective of this disclosure is to provide a cleaning resin composition that has good cleaning performance for resin molding machines such as extrusion machines and injection molding machines.

本開示は、（Ａ）ポリカーボネート樹脂、（Ｂ）スチレン系樹脂および（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールを含有し、（Ｃ－１）成分の含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して０．５～３．５質量部である、洗浄用樹脂組成物を提供する。 The present disclosure provides a cleaning resin composition that contains (A) a polycarbonate resin, (B) a styrene-based resin, and (C-1) a polyoxyethylene polyoxypropylene glycol, and the content of component (C-1) is 0.5 to 3.5 parts by mass per 100 parts by mass of the total of components (A) and (B).

また本開示は、（Ａ）ポリカーボネート樹脂、（Ｂ）スチレン系樹脂、（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールおよび（Ｃ－２）アルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムを含有し、（Ｃ－１）成分と（Ｃ－２）成分の合計１００質量％中の（Ｃ－１）成分の含有割合が２０～８０質量％、（Ｃ－２）成分の含有割合が８０～２０質量％であり、（Ｃ－１）成分と（Ｃ－２）成分の合計含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１～５質量部である、洗浄用樹脂組成物を提供する。 The present disclosure also provides a cleaning resin composition that contains (A) a polycarbonate resin, (B) a styrene-based resin, (C-1) a polyoxyethylene polyoxypropylene glycol, and (C-2) an alkyl (C10-16) sodium benzenesulfonate, in which the content of component (C-1) is 20-80% by mass and the content of component (C-2) is 80-20% by mass, based on 100% by mass of the total of components (C-1) and (C-2), and the total content of components (C-1) and (C-2) is 1-5 parts by mass per 100 parts by mass of the total of components (A) and (B).

本開示の洗浄用樹脂組成物は、押出成形機、射出成形機などの樹脂の成形加工機の洗浄性能が優れている。 The cleaning resin composition disclosed herein has excellent cleaning performance for resin molding machines such as extrusion machines and injection molding machines.

（Ａ）成分のポリカーボネート樹脂は、例えば特開２０１９－１２７５１６号公報、特開２０２１－７３４号公報および特許第５１７１５７３号公報に記載されているものと同じものを使用することができる。 The polycarbonate resin of component (A) can be the same as that described in, for example, JP 2019-127516 A, JP 2021-734 A, and Japanese Patent No. 5171573 A.

（Ｂ）成分スチレン系樹脂は、ポリスチレン（ＰＳ）、ハイインパクトポリスチレン（ＨＩＰＳ）、アクリロニトリル－スチレン樹脂（ＡＳ樹脂）、アクリロニトリル－ブタジエン－スチレン樹脂（ＡＢＳ樹脂）、メチルメタクリレート－ブタジエン－スチレン樹脂（ＭＢＳ樹脂）、ブチルアクリレート－アクリロニトリル－スチレン樹脂（ＡＡＳ樹脂）などを挙げることができ、これらの中でもＡＳ樹脂が好ましい。 (B) Component styrene-based resins include polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene resin (ABS resin), methyl methacrylate-butadiene-styrene resin (MBS resin), butyl acrylate-acrylonitrile-styrene resin (AAS resin), etc., among which AS resin is preferred.

（Ａ）成分と（Ｂ）成分の合計１００質量％中、
（Ａ）成分の含有割合は６０～９５質量％が好ましく、７０～９０質量％がより好ましく、７５～９０質量％がさらに好ましく、
（Ｂ）成分の含有割合は４０～５質量％が好ましく、３０～１０質量％がより好ましく、２５～１０質量％がさらに好ましい。 In the total of 100% by mass of the component (A) and the component (B),
The content of the (A) component is preferably 60 to 95 mass%, more preferably 70 to 90 mass%, and even more preferably 75 to 90 mass%,
The content of the component (B) is preferably from 40 to 5 mass %, more preferably from 30 to 10 mass %, and even more preferably from 25 to 10 mass %.

さらに界面活性剤として、
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールを単独で含有するか、または
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールおよび（Ｃ－２）アルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムの両方を含有することができる。
（Ｃ－２）成分のアルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムのアルキル基は、直鎖アルキル基と分岐鎖アルキル基のいずれでもよいが、直鎖アルキル基が好ましく、アルキル基の炭素数は１０～１３が好ましい。 In addition, as a surfactant,
It may contain (C-1) polyoxyethylene polyoxypropylene glycol alone, or it may contain both (C-1) polyoxyethylene polyoxypropylene glycol and (C-2) sodium alkyl (C10-16) benzenesulfonate.
The alkyl group of the sodium alkyl (C10-16) benzenesulfonate of the component (C-2) may be either a straight-chain alkyl group or a branched-chain alkyl group, but a straight-chain alkyl group is preferred, and the alkyl group preferably has 10 to 13 carbon atoms.

（Ｃ－１）成分を単独で含有するときの含有割合は、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して０．５～３．５質量部が好ましく、１～３．５質量部がより好ましく、１．５～３質量部がさらに好ましい。
（Ｃ－１）成分と（Ｃ－２）成分の両方を含有するときの含有割合は、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して合計で１～５質量部が好ましく、１．５～４重量部がより好ましく、２～４質量部がさらに好ましい。
（Ｃ－１）成分と（Ｃ－２）成分の両方を含有するときのそれぞれの含有割合は、（Ｃ－１）成分と（Ｃ－２）成分の合計１００質量％中、（Ｃ－１）成分の含有割合は２０～８０質量％が好ましく、３０～７０質量％がより好ましく、（Ｃ－２）成分の含有割合は８０～２０質量％が好ましく、７０～３０質量％がより好ましい。 When the component (C-1) is contained alone, the content is preferably 0.5 to 3.5 parts by mass, more preferably 1 to 3.5 parts by mass, and even more preferably 1.5 to 3 parts by mass, per 100 parts by mass of the combined total of the components (A) and (B).
When both the (C-1) component and the (C-2) component are contained, the content ratio thereof is preferably 1 to 5 parts by mass in total, more preferably 1.5 to 4 parts by mass, and even more preferably 2 to 4 parts by mass, per 100 parts by mass of the combined total of the (A) component and the (B) component.
When both the (C-1) component and the (C-2) component are contained, the content of the (C-1) component is preferably 20 to 80 mass%, and more preferably 30 to 70 mass%, and the content of the (C-2) component is preferably 80 to 20 mass%, and more preferably 70 to 30 mass%, of 100 mass% in total of the (C-1) component and the (C-2) component.

上記した（Ｃ－１）成分と（Ｃ－２）成分に加えて、他の界面活性剤（陰イオン界面活性剤、非イオン界面活性剤など）を含有することができるが、前記他の界面活性剤の含有割合は、界面活性剤全量中１０質量％以下が好ましく、５質量％以下がより好ましく、２質量％以下がさらに好ましい。 In addition to the above-mentioned components (C-1) and (C-2), other surfactants (anionic surfactants, nonionic surfactants, etc.) may be contained, but the content of the other surfactants is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 2% by mass or less, of the total amount of surfactants.

さらに（Ｅ）成分としてガラス繊維を含有することができる。
（Ｅ）成分のガラス繊維は、公知のＥガラス、Ｃガラス、Ｓガラス、Ｄガラスからなるものを使用することができるが、Ｅガラスからなるガラス繊維が好ましい。
（Ｅ）成分の含有量は、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１０～１００質量部が好ましい。 Furthermore, glass fibers may be contained as component (E).
The glass fibers of component (E) may be made of known E glass, C glass, S glass, or D glass, but glass fibers made of E glass are preferred.
The content of the component (E) is preferably 10 to 100 parts by mass per 100 parts by mass of the total of the components (A) and (B).

本開示の洗浄用樹脂組成物は、上記各成分を、ヘンシェルミキサー、タンブラーブレンダー、ニーダー等の混合機で予備混合した後、押出機で混練したり、加熱ロール、バンバリーミキサーで溶融混練したりすることによって製造することができる。 The cleaning resin composition of the present disclosure can be produced by premixing the above components in a mixer such as a Henschel mixer, tumbler blender, or kneader, and then kneading the mixture in an extruder or melt-kneading the mixture in a heated roll or Banbury mixer.

本明細書に開示された各々の態様は、本明細書に開示された他のいかなる特徴とも組み合わせることができる。
各実施形態における各構成およびそれらの組み合わせなどは一例であって、本発明の開示の主旨から逸脱しない範囲内で、適宜、構成の付加、省略、置換およびその他の変更が可能である。本開示は、実施形態によって限定されることはなく、特許請求の範囲によってのみ限定される。 Each feature disclosed herein may be combined with any other feature disclosed herein.
Each configuration and combination thereof in each embodiment is merely an example, and addition, omission, substitution, and other modifications of the configuration are possible as appropriate within the scope of the gist of the disclosure of the present invention. The present disclosure is not limited by the embodiments, but is limited only by the claims.

（Ａ）成分
ポリカーボネート樹脂：カリバー300-4(住化スタイロンポリカーボネート株式会社)
（Ｂ）成分
スチレン系樹脂：SAN-A 100LS(テクノＵＭＧ株式会社)
（Ｃ－１）成分
ポリオキシエチレンポリオキシプロピレングリコール：アデカプルロニック（登録商標）F-108(株式会社ADEKA)
（Ｃ－２）成分
直鎖アルキル（Ｃ１０－１３）ベンゼンスルホン酸ナトリウム：ニューレックスソフト 60-N(日油株式会社)（Ｃ１０：８質量％、Ｃ１１：３２質量％、Ｃ１２：３４質量％、Ｃ１３：２６質量％）
比較（Ｃ）成分
アルカンスルホン酸ナトリウム：WeylClean SAS 93(クラリアントジャパン株式会社)
エチレングリコールジステアレート：エマノーン 3201M-V(花王株式会社)
（Ｅ）成分
ガラス繊維：ECS03 T-571(日本電気硝子株式会社) (A) Component Polycarbonate resin: Caliber 300-4 (Sumika Styron Polycarbonate Co., Ltd.)
(B) Component Styrene-based resin: SAN-A 100LS (Techno UMG Co., Ltd.)
Component (C-1) Polyoxyethylene polyoxypropylene glycol: ADEKA Pluronic (registered trademark) F-108 (ADEKA Corporation)
Component (C-2) Linear alkyl (C10-13) sodium benzenesulfonate: Neurex Soft 60-N (NOF Corporation) (C10: 8% by mass, C11: 32% by mass, C12: 34% by mass, C13: 26% by mass)
Comparative component (C): Sodium alkanesulfonate: WeylClean SAS 93 (Clariant Japan Co., Ltd.)
Ethylene glycol distearate: Emanone 3201M-V (Kao Corporation)
(E) Component Glass fiber: ECS03 T-571 (Nippon Electric Glass Co., Ltd.)

実施例１～４、比較例１～７
表１に示す各成分をタンブラーブレンダーで混合(混合時間：120秒混合速度：120r/min)後、押出機にて溶融混練して、洗浄用樹脂組成物を得た。
得られた洗浄用樹脂組成物を使用して、下記の洗浄試験１、２を実施した。結果を表１に示す。表中の各成分の量は質量部である。
なお、洗浄試験１、２で使用した射出成形機と前材は、以下のとおりである。 Examples 1 to 4, Comparative Examples 1 to 7
The components shown in Table 1 were mixed in a tumbler blender (mixing time: 120 seconds, mixing speed: 120 rpm), and then melt-kneaded in an extruder to obtain a cleaning resin composition.
The obtained cleaning resin composition was used to carry out the following cleaning tests 1 and 2. The results are shown in Table 1. The amount of each component in the table is in parts by mass.
The injection molding machines and preforms used in cleaning tests 1 and 2 are as follows:

（射出成形機）
三菱ファナック モデル：2000i-100B (スクリュー径32，型締力100t)
使用時の条件：射出速度 100mm/sec, 回転数100r/min，シリンダー温度：280℃～300℃，背圧：0.3MPa
ストローク：前材使用時50mm，洗浄時40mm
（前材）
ポリカーボネート樹脂: カリバー200-10 (住化スタイロンポリカーボネート株式会社)
黒マスター：PLASBLAK UN2014(Cabot Plastics Hong Kong Ltd.)
ポリカーボネート樹脂と黒マスターを100:0.5の比率でタンブラーブレンダーを用いて混合（混合時間：20秒混合速度：120r/min）した。 (Injection molding machine)
Mitsubishi Fanuc Model: 2000i-100B (screw diameter 32, clamping force 100t)
Conditions: Injection speed 100mm/sec, rotation speed 100r/min, cylinder temperature: 280℃～300℃, back pressure: 0.3MPa
Stroke: 50mm when using front material, 40mm when cleaning
(Front material)
Polycarbonate resin: Caliber 200-10 (Sumika Styron Polycarbonate Co., Ltd.)
Black master: PLASBLAK UN2014 (Cabot Plastics Hong Kong Ltd.)
The polycarbonate resin and the black master were mixed in a ratio of 100:0.5 using a tumbler blender (mixing time: 20 seconds, mixing speed: 120 r/min).

＜滑り性の確認＞
射出成形機のホッパーに洗浄用樹脂組成物を投入した後に計量して、計量時間を評価した。計量は、射出成形機のシリンダー内のスクリューを回転させて後退させながら、ホッパーからシリンダー内に所定量の洗浄用樹脂組成物を充填することである。
「滑り性」とは、洗浄用樹脂組成物とスクリューまたはシリンダーとの滑りが激しくなるなどの理由で、計量時間が非常に長くなったり、計量できなくなったりすることである。
「滑り性」は、成形作業中の計量時間で判断した。滑りが発生せず、計量時間が５秒以内で完了する場合を〇と判定し、計量ができず、成形できない場合を×と判定した。 <Checking slipperiness>
The cleaning resin composition was charged into the hopper of an injection molding machine, and then weighed to evaluate the metering time. The metering was performed by filling a predetermined amount of the cleaning resin composition into the cylinder of the injection molding machine from the hopper while rotating and retracting the screw in the cylinder.
The term "slipperiness" refers to a state in which the washing resin composition slides violently against the screw or cylinder, resulting in a very long metering time or even inability to meter.
"Slipperiness" was judged based on the weighing time during molding. When no slipping occurred and the weighing time was completed within 5 seconds, it was judged as "good", and when weighing and molding were not possible, it was judged as "bad".

＜洗浄試験１＞
前材500gを上記射出成形機（シリンダー温度300℃）に投入して、上記の条件で排出した。
その後、シリンダー温度300℃において洗浄用樹脂組成物を置換し、目視で前材の黒が見えなくなった時点を洗浄完了とし、洗浄完了に必要な洗浄用樹脂組成物の質量（ｇ）を測定することで、洗浄用樹脂組成物の洗浄性能を評価した。
その後、シリンダー温度300℃で、透明PC樹脂（カリバー200-10）の置換を実施するとともに、前材に由来する樹脂の残留がないかを確認した。残留がない場合を〇、残留があった場合（透明PC樹脂が着色した場合）を×とした。
さらに洗浄用樹脂組成物で置換するときに、洗浄用樹脂組成物に由来するガスを含む白煙が発生するかどうかで、洗浄用樹脂組成物の熱安定性を評価した。ガスを含む白煙が発生しなかった（熱安定性が良い）場合を〇、ガスを含む白煙が発生した（熱安定性が悪い）場合を×とした。なお、前記白煙の有無は、目視により確認した。 <Cleaning test 1>
500 g of the starting material was placed in the injection molding machine (cylinder temperature 300° C.) and discharged under the above conditions.
Thereafter, the cleaning resin composition was replaced at a cylinder temperature of 300°C, and the cleaning was deemed complete when the black color of the previous material was no longer visible to the naked eye. The mass (g) of the cleaning resin composition required to complete the cleaning was measured to evaluate the cleaning performance of the cleaning resin composition.
After that, the cylinder temperature was set at 300℃ and the transparent PC resin (Caliber 200-10) was substituted, and it was confirmed whether any resin from the previous material remained. If there was no residue, it was marked with an ◯, and if there was residue (if the transparent PC resin became discolored), it was marked with an X.
Furthermore, when replacing with the cleaning resin composition, the thermal stability of the cleaning resin composition was evaluated based on whether or not white smoke containing gas derived from the cleaning resin composition was generated. A case in which no white smoke containing gas was generated (good thermal stability) was marked with ◯, and a case in which white smoke containing gas was generated (poor thermal stability) was marked with ×. The presence or absence of the white smoke was confirmed by visual inspection.

＜洗浄試験２＞
前材500gを上記射出成形機（シリンダー温度300℃）に投入して、上記の条件で排出した。
その後、シリンダー温度300℃において洗浄用樹脂組成物を置換し、目視で前材の黒が見えなくなった時点を洗浄完了とし、洗浄完了に必要な洗浄用樹脂組成物の質量（ｇ）を測定することで、洗浄用樹脂組成物の洗浄性能を評価した。
その後、シリンダー温度240℃で、透明AS樹脂（050SF ダイセルミライズ株式会社）の置換を実施するとともに、前材に由来する樹脂の残留がないかを確認した。残留がない場合を〇、残留があった場合（透明AS樹脂が着色した場合）を×とした。
さらに洗浄試験１と同様の滑りと熱安定性も試験した。 <Cleaning test 2>
500 g of the starting material was placed in the injection molding machine (cylinder temperature 300° C.) and discharged under the above conditions.
Thereafter, the cleaning resin composition was replaced at a cylinder temperature of 300°C, and the cleaning was deemed complete when the black color of the previous material was no longer visible to the naked eye. The mass (g) of the cleaning resin composition required to complete the cleaning was measured to evaluate the cleaning performance of the cleaning resin composition.
After that, the cylinder temperature was set at 240℃ and transparent AS resin (050SF, Daicel Miraize Co., Ltd.) was substituted, and it was confirmed whether there was any residual resin from the previous material. If there was no residual resin, it was marked with an ◯, and if there was residual resin (if the transparent AS resin was discolored), it was marked with an X.
In addition, slip and thermal stability were tested in the same manner as in cleaning test 1.

実施例１～４と比較例１～７との対比から明らかなとおり、洗浄試験１、２の両方において良い結果が得られた。
比較例１、２、５は、洗浄作業中に洗浄用樹脂組成物に由来するガスが発生した。ガスの発生の有無は、作業環境を適正に維持し、作業員の健康を確保する上で重要である。
比較例３は、滑りが悪かった。
比較例４は、透明AS樹脂への置き換えにおいて洗浄用樹脂組成物が溶融しなかったため、置き換えができなかった。
比較例６は、透明AS樹脂,PC樹脂への置き換えにおいて界面活性剤が配合されていないことから、洗浄用樹脂組成物が排出され難くなり、置き換えができなかった。
比較例７は、高温のためAS樹脂の粘度が極端に下がり、計量時にAS樹脂がノズルから流れることで計量ができなかった。 As is clear from a comparison between Examples 1 to 4 and Comparative Examples 1 to 7, good results were obtained in both cleaning tests 1 and 2.
Gas originating from the cleaning resin composition was generated during the cleaning work in Comparative Examples 1, 2, and 5. Whether or not gas was generated is important in terms of maintaining an appropriate working environment and ensuring the health of workers.
Comparative Example 3 had poor slipperiness.
In Comparative Example 4, the cleaning resin composition was not melted when replacing with the transparent AS resin, and therefore replacement with the transparent AS resin was not possible.
In Comparative Example 6, since no surfactant was blended in the replacement with the transparent AS resin and PC resin, the cleaning resin composition was difficult to discharge, and replacement was not possible.
In Comparative Example 7, the viscosity of the AS resin was extremely reduced due to the high temperature, and the AS resin flowed out of the nozzle during metering, making it impossible to meter it.

本開示の洗浄用樹脂組成物は、押出成形機、射出成形機などの樹脂の成形加工機の洗浄に利用することができる。 The cleaning resin composition disclosed herein can be used to clean resin molding machines such as extrusion machines and injection molding machines.

Claims (5)

（Ａ）ポリカーボネート樹脂、
（Ｂ）スチレン系樹脂および
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールを含有し、
（Ｃ－１）成分の含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して０．５～３．５質量部である、洗浄用樹脂組成物。 (A) a polycarbonate resin,
(B) a styrene-based resin and (C-1) a polyoxyethylene polyoxypropylene glycol,
The content of the component (C-1) is 0.5 to 3.5 parts by mass per 100 parts by mass of the total of the components (A) and (B). （Ａ）ポリカーボネート樹脂、
（Ｂ）スチレン系樹脂、
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールおよび
（Ｃ－２）アルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムを含有し、
（Ｃ－１）成分と（Ｃ－２）成分の合計１００質量％中の（Ｃ－１）成分の含有割合が２０～８０質量％、（Ｃ－２）成分の含有割合が８０～２０質量％であり、
（Ｃ－１）成分と（Ｃ－２）成分の合計含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１～５質量部である、洗浄用樹脂組成物。 (A) a polycarbonate resin,
(B) a styrene-based resin,
(C-1) polyoxyethylene polyoxypropylene glycol and (C-2) sodium alkyl (C10-16) benzenesulfonate;
the content of the component (C-1) is 20 to 80 mass% and the content of the component (C-2) is 80 to 20 mass% based on 100 mass% of the total of the component (C-1) and the component (C-2),
The cleaning resin composition comprises 1 to 5 parts by mass of the total of the components (C-1) and (C-2) per 100 parts by mass of the total of the components (A) and (B). さらに（Ｅ）ガラス繊維を（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１０～１００質量部含有している、請求項１または２記載の洗浄用樹脂組成物。 The cleaning resin composition according to claim 1 or 2 further contains (E) 10 to 100 parts by mass of glass fibers per 100 parts by mass of the total of components (A) and (B). （Ａ）成分と（Ｂ）成分の合計１００質量％中の（Ａ）成分の含有割合が７５～９５質量％、（Ｂ）成分の含有割合が２５～５質量％である、請求項１～３のいずれか１項記載の洗浄用樹脂組成物。 The cleaning resin composition according to any one of claims 1 to 3, in which the content of component (A) is 75 to 95 mass% and the content of component (B) is 25 to 5 mass% out of 100 mass% of the total of components (A) and (B). （Ｂ）成分のスチレン系樹脂が、ポリスチレン（ＰＳ）、ハイインパクトポリスチレン（ＨＩＰＳ）、アクリロニトリル－スチレン樹脂（ＡＳ樹脂）、アクリロニトリル－ブタジエン－スチレン樹脂（ＡＢＳ樹脂）、メチルメタクリレート－ブタジエン－スチレン樹脂（ＭＢＳ樹脂）、ブチルアクリレート－アクリロニトリル－スチレン樹脂（ＡＡＳ樹脂）から選ばれるものを含んでいる、請求項１～４のいずれか１項記載の洗浄用樹脂組成物。 The cleaning resin composition according to any one of claims 1 to 4, wherein the styrene-based resin of component (B) is selected from polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene resin (ABS resin), methyl methacrylate-butadiene-styrene resin (MBS resin), and butyl acrylate-acrylonitrile-styrene resin (AAS resin).
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007007521A1 (en) 2005-07-13 2007-01-18 Miyoshi Kasei, Inc. Surface-treated powder and cosmetic comprising the same
JP2008126555A (en) 2006-11-22 2008-06-05 Sumitomo Chemical Co Ltd Cleaning agent for extruder

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JPH09183133A (en) * 1995-10-30 1997-07-15 Satoshi Yamazaki Cleaning agent composition
JP5305861B2 (en) * 2008-01-23 2013-10-02 ダイセルポリマー株式会社 Cleaning resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007007521A1 (en) 2005-07-13 2007-01-18 Miyoshi Kasei, Inc. Surface-treated powder and cosmetic comprising the same
JP2008126555A (en) 2006-11-22 2008-06-05 Sumitomo Chemical Co Ltd Cleaning agent for extruder

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