JP7629283B2 - Material transfer method - Google Patents

Description

The present invention relates to a method for transferring components.

Conventionally, in the processing of electronic components, a substrate is used as a carrier for transport between processes, and electronic components arranged on the substrate are transferred to another substrate. When transferring ultra-small chips such as micro LEDs, a hard substrate is sometimes used as a carrier to improve positional accuracy during transfer.

International Publication No. 2012/011202

When a hard substrate is used as a carrier, more specifically, when an electronic component (e.g., a micro LED) arranged on a first hard substrate via a specific adhesive layer is transferred onto a second hard substrate with an adhesive layer, the first hard substrate is separated from the main surface of the substrate in a direction perpendicular to the substrate because a hard substrate that is not easily bent is used. This puts a load on the electronic component, causing problems such as damage to the electronic component or poor transfer.

The present invention was made to solve the above-mentioned problems of the conventional art, and its purpose is to provide a component transfer method that can effectively transfer a component (workpiece) even when using a hard substrate.

The member transfer method of the present invention is a method for transferring a member arranged on a first hard substrate to a second hard substrate, and includes the steps of: laminating the first hard substrate and the member via a first ultraviolet absorbing layer to form a laminate A; then fixing the laminate A to the second hard substrate with the member facing the second hard substrate to form a laminate B; and then irradiating the first ultraviolet absorbing layer with ultraviolet light to peel off the first hard substrate from the laminate B.
In one embodiment, a pressure-sensitive adhesive layer is disposed between the first hard substrate and the member.
In one embodiment, the first ultraviolet absorbing layer is made of an organic material.
In one embodiment, the first ultraviolet absorbing layer is made of an inorganic material.
In one embodiment, a second ultraviolet absorbing layer is formed on the second hard substrate, and the second ultraviolet absorbing layer is disposed between the member and the second hard substrate.
According to another aspect of the present invention, there is provided a laminate including a first hard substrate, a first ultraviolet absorbing layer, a member, and a second hard substrate in this order, and used in the member transfer method.

The present invention provides a component transfer method that can effectively transfer a component (workpiece) even when using a hard substrate.

1 is a schematic diagram illustrating a member transfer method according to one embodiment of the present invention. 5A to 5C are schematic diagrams illustrating a member transfer method according to another embodiment of the present invention. 5A to 5C are schematic diagrams illustrating a member transfer method according to another embodiment of the present invention.

A. Overview of the member transfer method FIG. 1 is a schematic diagram for explaining a member transfer method according to one embodiment of the present invention. FIG. 2 is a schematic diagram for explaining a member transfer method according to another embodiment of the present invention. The member transfer method of the present invention is a method for transferring a member 30 arranged on a first hard substrate 10 to a second hard substrate 20. The method includes a step of laminating the first hard substrate 10 and the member 30 through the first ultraviolet absorbing layer 40 to form a laminate A (hereinafter also referred to as a lamination step), a step of fixing the laminate A to the second hard substrate 20 so that the member 30 is on the second hard substrate 20 side to form a laminate B (hereinafter also referred to as a fixing step), and a step of irradiating the first ultraviolet absorbing layer 40 with ultraviolet light to peel off the first hard substrate 10 from the laminate B (second hard substrate 20) (hereinafter also referred to as a peeling step). The ultraviolet absorbing layer (first ultraviolet absorbing layer 40, second ultraviolet absorbing layer 50 (described later)) refers to a layer that has the property of being able to absorb ultraviolet light and exhibits peelability over a part or all of its surface when irradiated with ultraviolet light (preferably UV laser light).

The above-mentioned member is not particularly limited, and may be, for example, an electronic component such as a semiconductor element or an optical semiconductor element. Before the fixing step, the above-mentioned member may be arranged in multiple numbers on the first ultraviolet absorbing layer, or may be arranged in a single piece.

The mounting area for each of the above members is, for example, 1 μm ² to 1 cm ^2. When multiple members are arranged, the intervals between them are, for example, 2 μm to 5 mm.

In one embodiment, the member 30 and the first ultraviolet absorbing layer 40 are used together. An example of a structure (e.g., an electronic component) composed of the member 30/first ultraviolet absorbing layer 40 is the member 30 combined with the first ultraviolet absorbing layer 40, which is an inorganic material. Specifically, for example, an optical semiconductor device (LED) having a GaN (gallium nitride) compound crystal layer as the first ultraviolet absorbing layer 40 is included. In this embodiment, as shown in FIG. 1, the structure composed of the member 30/first ultraviolet absorbing layer 40 is transferred from the first hard substrate 10 to the second hard substrate 20 by the above method.

In another embodiment, as shown in FIG. 2, in the peeling step, a laminate including a first hard substrate 10 and a first ultraviolet absorbing layer 40 is peeled off from laminate B (first hard substrate 10), and thus, by the above-mentioned transfer method, the member 30 and the first ultraviolet absorbing layer 40 are separated. In this embodiment, a first ultraviolet absorbing layer 40 that is an organic material may be formed as the first ultraviolet absorbing layer 40.

According to the present invention, the hard substrate can be peeled off by irradiation with ultraviolet light, so that the transfer of the member can be completed without applying unnecessary load to the member. Note that any appropriate process for processing the member may be performed between the lamination process and the fixing process.

B. Lamination process B-1. Hard substrate The hard substrate (first hard substrate, second hard substrate) refers to a plate-shaped molded body having a flexural modulus of 1 GPa or more. The flexural modulus can be measured by a four-point bending test in accordance with JIS K7171 or JIS R1602, depending on the material constituting the hard substrate.

Any suitable material may be used as the material for the hard substrate. Examples of materials for the hard substrate include glass, metal, silicon, sapphire, and plastic. In one embodiment, a hard substrate made of polyethylene terephthalate is used as the hard substrate. The thickness of the hard substrate made of polyethylene terephthalate is, for example, 100 μm or more.

The hard substrate preferably has an ultraviolet light (wavelength 360 nm) transmittance of 70% or more, and more preferably 80% to 99.9%. If the hard substrate has optical transparency, peeling can be favorably performed in the peeling process.

The first rigid substrate and the second rigid substrate may have the same configuration or different configurations.

B-2. First ultraviolet absorbing layer In one embodiment, the first ultraviolet absorbing layer is made of an organic material. In another embodiment, the first ultraviolet absorbing layer is made of an inorganic material.

(First ultraviolet absorbing layer composed of organic material)
The first ultraviolet absorbing layer made of an organic material may be a layer that has adhesiveness initially (i.e., before ultraviolet irradiation) and exhibits peelability due to reduced adhesiveness after ultraviolet irradiation. In one embodiment, the first ultraviolet absorbing layer may be a layer whose adhesiveness is partially reduced by partial ultraviolet irradiation (e.g., UV laser light irradiation).

In one embodiment, the first ultraviolet absorbing layer made of an organic material contains an ultraviolet absorbing agent. Preferably, the first ultraviolet absorbing layer made of an organic material further contains an active energy ray-curable adhesive.

The first ultraviolet absorbing layer contains an ultraviolet absorber, which enables peeling of the adherend by irradiation with UV laser light. More specifically, when the first ultraviolet absorbing layer is irradiated with UV laser light, the ultraviolet absorber decomposes to generate gas, and/or the ultraviolet absorber generates heat to generate gas that causes the first ultraviolet absorbing layer to decompose, which causes deformation of the first ultraviolet absorbing layer, resulting in peelability in the area irradiated with UV laser light.

In addition, if the first ultraviolet absorbing layer contains an active energy ray-curable adhesive, the adhesive strength of the entire first ultraviolet absorbing layer is reduced by irradiating it with active energy rays. After irradiating the entire first ultraviolet absorbing layer to which the member is attached with active energy rays to reduce the adhesive strength, it is possible to prevent adhesive residue after peeling by irradiating it with laser light as described above. Examples of active energy rays include gamma rays, ultraviolet rays, visible light, infrared rays (heat rays), radio waves, alpha rays, beta rays, electron beams, plasma flow, ionizing rays, particle beams, etc. UV rays are preferred.

The light transmittance of the first ultraviolet absorbing layer composed of the organic material at a wavelength of 355 nm is preferably 50% or less. By reducing the light transmittance, the laser output during peeling can be reduced. The light transmittance of the first ultraviolet absorbing layer at a wavelength of 355 nm is more preferably 40% or less, and even more preferably 30% or less. Within such a range, the above effect becomes more pronounced.

The initial adhesive strength at 23°C when the first ultraviolet absorbing layer composed of an organic substance is attached to a stainless steel plate is preferably 0.1N/20mm to 20N/20mm, more preferably 0.5N/20mm to 15N/20mm. Within such a range, an ultraviolet absorbing layer capable of holding a member well can be formed. The adhesive strength is measured in accordance with JIS Z 0237:2000. Specifically, the first ultraviolet absorbing layer is attached to a stainless steel plate (arithmetic mean surface roughness Ra: 50±25nm) by one reciprocation of a 2kg roller, and after leaving it at 23°C for 30 minutes, the first ultraviolet absorbing layer is peeled off at a peel angle of 180° and a peel speed (pulling speed) of 300mm/min to measure. The adhesive strength of the ultraviolet absorbing layer changes when exposed to active energy rays and laser light, but in this specification, "initial adhesive strength" means the adhesive strength before exposure to active energy rays and laser light.

In one embodiment, the adhesive strength at 23°C after the first ultraviolet absorbing layer made of an organic substance is attached to a stainless steel plate and irradiated with ultraviolet light of 460 mJ/ ^cm2 is preferably 0.01 N/20 mm to 2 N/20 mm, more preferably 0.02 N/20 mm to 1 N/20 mm. Within such a range, the member can be transferred with little adhesive residue. The ultraviolet irradiation is performed, for example, by irradiating the first ultraviolet absorbing layer with ultraviolet light from a high-pressure mercury lamp (characteristic wavelength: 365 nm, accumulated light amount: 460 mJ/ ^cm2 , irradiation energy: 70 W/ ^cm2 , irradiation time: 6.6 seconds) using an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., product name "UM-810").

The thickness of the first ultraviolet absorbing layer made of an organic material is preferably 50 μm or less. In this range, it is possible to further reduce the laser output during peeling. The thickness of the first ultraviolet absorbing layer is more preferably 40 μm or less, even more preferably 30 μm or less, and even more preferably 1 μm to 30 μm. In this range, the above-mentioned effects are prominent.

・UV absorber:
Any suitable ultraviolet absorber can be used as the ultraviolet absorber as long as it is a compound that absorbs ultraviolet light (for example, wavelength 355 nm). Examples of ultraviolet absorbers include benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, triazine-based ultraviolet absorbers, salicylate-based ultraviolet absorbers, and cyanoacrylate-based ultraviolet absorbers. Among them, triazine-based ultraviolet absorbers or benzotriazole-based ultraviolet absorbers are preferred, and triazine-based ultraviolet absorbers are particularly preferred. In particular, when an acrylic adhesive is used as the adhesive A, a triazine-based ultraviolet absorber can be preferably used because it has high compatibility with the base polymer of the acrylic adhesive. It is more preferable that the triazine-based ultraviolet absorber is composed of a compound having a hydroxyl group, and it is particularly preferable that the triazine-based ultraviolet absorber is composed of a hydroxyphenyltriazine-based compound (hydroxyphenyltriazine-based ultraviolet absorber).

Examples of hydroxyphenyltriazine-based ultraviolet absorbers include the reaction product of 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl)-5-hydroxyphenyl with [(C10-C16 (mainly C12-C13) alkyloxy)methyl]oxirane (trade name "TINUVIN 400", manufactured by BASF), 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol), and the reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis-(2,4-dimethylphenyl)-1,3,5-triazine with (2-ethylhexyl)-glycidic acid ester (trade name "TINUVIN 405" manufactured by BASF), 2,4-bis(2-hydroxy-4-butoxyphenyl)-6-(2,4-dibutoxyphenyl)-1,3,5-triazine (trade name "TINUVIN 460" manufactured by BASF), 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[(hexyl)oxy]-phenol (trade name "TINUVIN 1577" manufactured by BASF), 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]-phenol (trade name "ADK STAB LA-46, manufactured by ADEKA Corporation), 2-(2-hydroxy-4-[1-octyloxycarbonylethoxy]phenyl)-4,6-bis(4-phenylphenyl)-1,3,5-triazine (trade name "TINUVIN 479", manufactured by BASF), and "TINUVIN 477", manufactured by BASF, are examples.

Benzotriazole-based ultraviolet absorbers (benzotriazole-based compounds) include, for example, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole (trade name "TINUVIN PS", manufactured by BASF), an ester compound of benzenepropanoic acid and 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy (C7-9 side chain and linear alkyl) (trade name "TINUVIN 384-2", manufactured by BASF), a mixture of octyl 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate (trade name "TINUVIN 109”, manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol (trade name “TINUVIN 900”, manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol (trade name “TINUVIN 928”, manufactured by BASF Corporation), reaction product of methyl 3-(3-(2H-benzotriazol-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionate/polyethylene glycol 300 (trade name “TINUVIN 1130”, manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-p-cresol (trade name “TINUVIN P”, manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol (trade name “TINUVIN 234”, manufactured by BASF Corporation), 2-[5-chloro-2H-benzotriazol-2-yl]-4-methyl-6-(tert-butyl)phenol (trade name “TINUVIN 326”, manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-4,6-di-tert-pentylphenol (trade name “TINUVIN 328”, manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol (trade name “TINUVIN 329" manufactured by BASF Corporation), 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol] (trade name "TINUVIN 360" manufactured by BASF Corporation), reaction product of methyl 3-(3-(2H-benzotriazol-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionate and polyethylene glycol 300 (trade name "TINUVIN 213" manufactured by BASF Corporation), 2-(2H-benzotriazol-2-yl)-6-dodecyl-4-methylphenol (trade name "TINUVIN 571" manufactured by BASF Corporation), 2-[2-hydroxy-3-(3,4,5,6-tetrahydrophthalimido-methyl)-5-methylphenyl]benzotriazole (trade name "Sumisorb 250" manufactured by Sumitomo Chemical Co., Ltd.), 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chloro-2H-benzotriazole (trade name "SEESORB 703" manufactured by Shipro Chemical Co., Ltd.), 2-(2H-benzotriazol-2-yl)-4-methyl-6-(3,4,5,6-tetrahydrophthalimidylmethyl)phenol (trade name "SEESORB 706" manufactured by Shipro Chemical Co., Ltd.), 2-(4-benzoyloxy-2-hydroxyphenyl)-5-chloro-2H-benzotriazole (trade name "SEESORB 7012BA" manufactured by Shipro Chemical Co., Ltd.), 2-tert-butyl-6-(5-chloro-2H-benzotriazol-2-yl)-4-methylphenol (trade name "KEMISORB 73" manufactured by Chemipro Chemicals), 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-tert-octylphenol] (trade name "Adeka STAB LA-31" manufactured by ADEKA Corporation), 2-(2H-benzotriazol-2-yl)-p-cellulose (trade name "Adeka STAB LA-32" manufactured by ADEKA Corporation), 2-(5-chloro-2H-benzotriazol-2-yl)-6-tert-butyl-4-methylphenol (trade name "Adeka STAB LA-36" manufactured by ADEKA Corporation), etc.

The ultraviolet absorber may be a dye or a pigment. Examples of pigments include azo, phthalocyanine, anthraquinone, lake, perylene, perinone, quinacridone, thioindigo, dioxandine, isoindolinone, and quinophthalone pigments. Examples of dyes include azo, phthalocyanine, anthraquinone, carbonyl, indigo, quinoneimine, methine, quinoline, and nitro dyes.

The molecular weight of the compound constituting the ultraviolet absorber is preferably 100 to 1500, more preferably 200 to 1200, and even more preferably 200 to 1000. Within this range, an ultraviolet absorbing layer capable of forming a better deformation portion can be formed by irradiation with laser light.

The maximum absorption wavelength of the ultraviolet absorber is preferably 300 nm to 450 nm, more preferably 320 nm to 400 nm, and even more preferably 330 nm to 380 nm. The difference between the maximum absorption wavelength of the ultraviolet absorber and the maximum absorption wavelength of the photopolymerization initiator is preferably 10 nm or more, and more preferably 25 nm or more.

The 5% weight loss temperature of the ultraviolet absorber is preferably 350°C or less, more preferably 330°C or less. The lower limit of the 5% weight loss temperature of the ultraviolet absorber is, for example, 100°C. Within this range, an ultraviolet absorbing layer capable of forming a better deformation portion by laser light irradiation can be formed. The 5% weight loss temperature of the ultraviolet absorber means the temperature at which the weight of the ultraviolet absorber when heated is reduced by 5% by weight compared to the weight before heating. The 5% weight loss temperature is measured using a differential thermal analyzer under the measurement conditions of a heating temperature of 10°C/min, air atmosphere, and a flow rate of 25 ml/min.

The content of the ultraviolet absorber is preferably 1 to 50 parts by weight, and more preferably 5 to 20 parts by weight, relative to 100 parts by weight of the base polymer in the first ultraviolet absorbing layer. Within this range, when the adhesive strength of the entire ultraviolet absorbing layer is satisfactorily reduced by irradiation with active energy rays, the ultraviolet absorbing layer is cured satisfactorily, and an ultraviolet absorbing layer that exhibits good peelability can be formed by irradiation with laser light.

・Active energy ray curable adhesive:
In one embodiment, the active energy ray curable adhesive (A1) is used as the active energy ray curable adhesive, which includes a base polymer as a base material and an active energy ray reactive compound (monomer or oligomer) that can be bonded to the base polymer. In another embodiment, the active energy ray curable adhesive (A2) is used as the base polymer, which includes an active energy ray reactive polymer. Preferably, the base polymer has a functional group that can react with a photopolymerization initiator. Examples of the functional group include a hydroxyl group, a carboxyl group, and the like.

Examples of base polymers used in the above-mentioned adhesive (A1) include rubber-based polymers such as natural rubber, polyisobutylene rubber, styrene-butadiene rubber, styrene-isoprene-styrene block copolymer rubber, reclaimed rubber, butyl rubber, polyisobutylene rubber, and nitrile rubber (NBR); silicone-based polymers; and acrylic-based polymers. These polymers may be used alone or in combination of two or more. Among them, acrylic-based polymers are preferred.

Examples of acrylic polymers include homopolymers or copolymers of hydrocarbon group-containing (meth)acrylic acid esters such as (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, and (meth)acrylic acid aryl esters; copolymers of the hydrocarbon group-containing (meth)acrylic acid esters with other copolymerizable monomers, and the like. Examples of (meth)acrylic acid alkyl esters include the methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, and dodecyl ester, i.e., lauryl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, octadecyl ester, and eicosyl ester of (meth)acrylic acid. Examples of (meth)acrylic acid cycloalkyl esters include the cyclopentyl ester and cyclohexyl ester of (meth)acrylic acid. Examples of (meth)acrylic acid aryl esters include phenyl (meth)acrylate and benzyl (meth)acrylate. The content of the structural unit derived from the above-mentioned hydrocarbon group-containing (meth)acrylic acid ester is preferably 40 parts by weight or more, more preferably 60 parts by weight or more, per 100 parts by weight of the base polymer.

Examples of the other copolymerizable monomers include functional group-containing monomers such as carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, acrylamide, and acrylonitrile. Examples of the carboxy group-containing monomers include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of the acid anhydride monomers include maleic anhydride and itaconic anhydride. Examples of the hydroxy group-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate. Examples of glycidyl group-containing monomers include glycidyl (meth)acrylate and methyl glycidyl (meth)acrylate. Examples of sulfonic acid group-containing monomers include styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid. Examples of phosphoric acid group-containing monomers include 2-hydroxyethyl acryloyl phosphate. Examples of acrylamides include N-acryloylmorpholine. These may be used alone or in combination of two or more. The content of the constituent units derived from the copolymerizable monomer is preferably 60 parts by weight or less, more preferably 40 parts by weight or less, based on 100 parts by weight of the base polymer.

The acrylic polymer may contain a structural unit derived from a polyfunctional monomer to form a crosslinked structure in the polymer skeleton. Examples of the polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy(meth)acrylate (i.e., polyglycidyl(meth)acrylate), polyester(meth)acrylate, and urethane(meth)acrylate. These may be used alone or in combination of two or more. The content of the structural unit derived from the polyfunctional monomer is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, based on 100 parts by weight of the base polymer.

The weight average molecular weight of the acrylic polymer is preferably 100,000 to 3,000,000, and more preferably 200,000 to 2,000,000. The weight average molecular weight can be measured by GPC (solvent: THF).

Examples of the active energy ray reactive compound that can be used in the adhesive (A1) include photoreactive monomers or oligomers having a functional group with a polymerizable carbon-carbon multiple bond, such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, or an acetylene group. Specific examples of the photoreactive monomer include esters of (meth)acrylic acid and polyhydric alcohols such as trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and polyethylene glycol di(meth)acrylate; polyfunctional urethane (meth)acrylate; epoxy (meth)acrylate; oligoester (meth)acrylate; etc. Also, monomers such as methacryloylisocyanate, 2-methacryloyloxyethyl isocyanate (2-isocyanatoethyl methacrylate), and m-isopropenyl-α,α-dimethylbenzyl isocyanate may be used. Specific examples of photoreactive oligomers include dimers to pentamers of the above monomers. The molecular weight of the photoreactive oligomer is preferably 100 to 3,000.

The active energy ray reactive compound may be a monomer such as epoxidized butadiene, glycidyl methacrylate, acrylamide, vinyl siloxane, or an oligomer composed of such a monomer.

Furthermore, as the active energy ray reactive compound, a mixture of an organic salt such as an onium salt and a compound having multiple heterocycles in the molecule may be used. When the mixture is irradiated with active energy rays (e.g., ultraviolet rays, electron beams), the organic salt is cleaved to generate ions, which act as initiating species to cause a ring-opening reaction of the heterocycles to form a three-dimensional network structure. Examples of the organic salt include iodonium salts, phosphonium salts, antimonium salts, sulfonium salts, and borate salts. Examples of the heterocycles in the compound having multiple heterocycles in the molecule include oxirane, oxetane, oxolane, thiirane, and aziridine.

In the above pressure-sensitive adhesive (A1), the content of the active energy ray reactive compound is preferably 0.1 to 500 parts by weight, more preferably 5 to 300 parts by weight, and even more preferably 40 to 150 parts by weight, relative to 100 parts by weight of the base polymer.

Examples of the active energy ray reactive polymer (base polymer) contained in the above adhesive (A2) include polymers having functional groups with carbon-carbon multiple bonds, such as acryloyl groups, methacryloyl groups, vinyl groups, allyl groups, and acetylene groups. Specific examples of active energy ray reactive polymers include polymers composed of multifunctional (meth)acrylates; photocationic polymerization type polymers; cinnamoyl group-containing polymers such as polyvinyl cinnamate; diazotized amino novolac resins; polyacrylamides; and the like.

In one embodiment, an active energy ray reactive polymer is used in which an active energy ray polymerizable carbon-carbon multiple bond is introduced into the side chain, main chain, and/or main chain end of the acrylic polymer. Examples of methods for introducing radiation polymerizable carbon-carbon double bonds into an acrylic polymer include a method in which raw material monomers including a monomer having a specific functional group (first functional group) are copolymerized to obtain an acrylic polymer, and then a compound having a specific functional group (second functional group) that can react with and bond to the first functional group and a radiation polymerizable carbon-carbon double bond is subjected to a condensation reaction or addition reaction with the acrylic polymer while maintaining the radiation polymerizability of the carbon-carbon double bond.

Examples of combinations of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, and an isocyanate group and a hydroxy group. Among these combinations, from the viewpoint of ease of reaction tracking, a combination of a hydroxy group and an isocyanate group, or a combination of an isocyanate group and a hydroxy group is preferred. In addition, while it is technically difficult to prepare a polymer having a highly reactive isocyanate group, from the viewpoint of ease of preparation or availability of an acrylic polymer, it is more preferred that the first functional group on the acrylic polymer side is a hydroxy group and the second functional group is an isocyanate group. In this case, examples of isocyanate compounds having both a radiation-polymerizable carbon-carbon double bond and an isocyanate group as a second functional group include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-α,α-dimethylbenzyl isocyanate. In addition, acrylic polymers having a first functional group are preferably those containing structural units derived from the above-mentioned hydroxyl group-containing monomers, and also preferably those containing structural units derived from ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether.

The pressure-sensitive adhesive (A2) may further contain the active energy ray-reactive compound (monomer or oligomer).

The active energy ray-curable adhesive may contain a photopolymerization initiator.

Any suitable initiator can be used as the photopolymerization initiator. Examples of the photopolymerization initiator include α-ketol compounds such as 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, and 1-hydroxycyclohexylphenylketone; acetophenone compounds such as methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, and 2-methyl-1-[4-(methylthio)-phenyl]-2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; and ketal compounds such as benzyl dimethyl ketal. ; aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; photoactive oxime compounds such as 1-phenone-1,1-propanedione-2-(o-ethoxycarbonyl)oxime; benzophenone compounds such as benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone; thioxanthone compounds such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketones; acylphosphinoxides; acylphosphonates, etc. The amount of the photopolymerization initiator used can be set to any appropriate amount.

In one embodiment, a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less (preferably 380 nm or less, more preferably 340 nm or less) is used. If such a photopolymerization initiator is used, when the adhesive strength of the entire ultraviolet absorbing layer is reduced by irradiating it with active energy rays, a curing reaction of the adhesive occurs favorably, and an ultraviolet absorbing layer with particularly little adhesive residue can be formed.

As the photopolymerization initiator, a commercially available product may be used. For example, photopolymerization initiators having a maximum absorption wavelength in the range of 400 nm or less include products under the trade names "Irgacure 127", "Irgacure 369", "Irgacure 369E", "Irgacure 379", "Irgacure 379EG", "Irgacure 819", "Irgacure TOP", "Irgacure 784", and "Irgacure OXE01" manufactured by BASF Corporation.

In one embodiment, the active energy ray-curable adhesive may contain a photosensitizer.

In one embodiment, the photosensitizer may be used in combination with the photopolymerization initiator. The photosensitizer can generate radicals from the photopolymerization initiator by transferring the energy it has obtained by absorbing light to the photopolymerization initiator, so that polymerization can proceed with light on the long wavelength side where the photopolymerization initiator itself does not have an absorption peak. For this reason, by including a photosensitizer, it is possible to increase the difference between the absorption wavelength of the ultraviolet absorber and the wavelength at which radicals can be generated from the photopolymerization initiator. As a result, the photopolymerization of the first ultraviolet absorbing layer and the peeling by the ultraviolet absorber can be performed without affecting each other. In one embodiment, 2,2-dimethoxy-1,2-diphenylethan-1-one (for example, BASF, product name "Irgacure 651") as a photopolymerization initiator and a photosensitizer are used in combination. Examples of such photosensitizers include "UVS-581" (trade name, manufactured by Kawasaki Chemical Industries, Ltd.) and 9,10-diethoxyanthracene (for example, "UVS1101" (trade name, manufactured by Kawasaki Chemical Industries, Ltd.)).

Other examples of the photosensitizer include 9,10-dibutoxyanthracene (e.g., Kawasaki Chemical Industries, Ltd., product name "UVS-1331"), 2-isopropylthioxanthone, benzophenone, thioxanthone derivatives, 4,4'-bis(dimethylamino)benzophenone, etc. Examples of thioxanthone derivatives include ethoxycarbonylthioxanthone, isopropylthioxanthone, etc.

The content of the photosensitizer is preferably 0.01 to 2 parts by weight, and more preferably 0.5 to 2 parts by weight, per 100 parts by weight of the base polymer.

Preferably, the active energy ray curable adhesive contains a crosslinking agent. Examples of crosslinking agents include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, and amine-based crosslinking agents.

The content of the crosslinking agent is preferably 0.5 to 10 parts by weight, and more preferably 1 to 8 parts by weight, per 100 parts by weight of the base polymer of the adhesive.

In one embodiment, an isocyanate-based crosslinking agent is preferably used. Isocyanate-based crosslinking agents are preferred because they can react with a variety of functional groups. Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; aromatic isocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate and xylylene diisocyanate; and isocyanate adducts such as trimethylolpropane/tolylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., product name "Coronate L"), trimethylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., product name "Coronate HL"), and isocyanurate of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., product name "Coronate HX"). Preferably, a crosslinking agent having three or more isocyanate groups is used.

The active energy ray curable adhesive may further contain any suitable additives as necessary. Examples of additives include active energy ray polymerization accelerators, radical scavengers, tackifiers, plasticizers (e.g., trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, antioxidants, conductive materials, antistatic agents, UV absorbers, light stabilizers, release regulators, softeners, surfactants, flame retardants, antioxidants, etc.

(First ultraviolet absorbing layer composed of inorganic material)
As described above, the first ultraviolet absorbing layer made of an inorganic substance and the above member can be used in combination to form one component (e.g., an electronic component). That is, the first ultraviolet absorbing layer made of an inorganic substance can be a part of the component (e.g., an electronic component).

The first ultraviolet absorbing layer made of the above-mentioned inorganic material may be an epitaxial layer. Examples of the first ultraviolet absorbing layer made of the above-mentioned inorganic material include a layer made of a group III nitride, such as a GaN (gallium nitride) compound crystal layer.

The first ultraviolet absorbing layer made of an inorganic material exhibits peelability by a method known as laser lift-off. For example, the first ultraviolet absorbing layer made of an inorganic material is decomposed by irradiation with high-density UV laser light, and as a result, the first ultraviolet absorbing layer and the first hard substrate are separated. Details of the laser lift-off are described, for example, in International Publication No. 2012/011202, and the description of this publication is incorporated herein by reference.

B-3. Pressure-sensitive adhesive layer The laminate A may include a pressure-sensitive adhesive layer. In one embodiment, a pressure-sensitive adhesive layer may be disposed between the first hard substrate and the member. For example, a pressure-sensitive adhesive layer may be disposed between the first hard substrate and the first ultraviolet absorbing layer. The pressure-sensitive adhesive layer and the first ultraviolet absorbing layer may be laminated via any suitable substrate. As the substrate, a substrate made of any suitable resin may be used.

In one embodiment, the adhesive layer includes an ultraviolet-curing adhesive. The adhesive layer may be an adhesive layer whose adhesive strength improves when irradiated with ultraviolet light, or an adhesive layer whose adhesive strength decreases when irradiated with ultraviolet light. For example, the active energy ray-curing adhesive may be used as the adhesive. In another embodiment, the adhesive layer includes a pressure-sensitive adhesive. A commonly used adhesive may be used as the pressure-sensitive adhesive.

C. Fixing Step After forming the laminate A (first hard substrate 10 /first ultraviolet absorbing layer 40 /member 30) by the lamination step, the laminate A is fixed onto the second hard substrate 20 in the fixing step.

(Second Hard Substrate)
As the second rigid substrate, the rigid substrate described in section B-1 can be used.

1 and 2, a second ultraviolet absorbing layer 50 or an adhesive layer may be formed on the second hard substrate 20. The second ultraviolet absorbing layer 50 may be disposed between the member 30 and the second hard substrate 20. The second ultraviolet absorbing layer 50 is preferably a layer made of an organic material. Examples of such an ultraviolet absorbing layer include the ultraviolet absorbing layer described in the section "First ultraviolet absorbing layer made of an organic material." That is, the second ultraviolet absorbing layer 50 may be a layer that has adhesiveness initially (i.e., before ultraviolet irradiation) and exhibits peelability due to a decrease in adhesiveness after ultraviolet irradiation. If the second ultraviolet absorbing layer 50 is formed, after the peeling step, the laminate C including the second hard substrate 20/second ultraviolet absorbing layer 50/member 30 can be subjected to a further transfer step, and the member can be easily peeled off from the laminate C by laser light irradiation, thereby improving the transfer efficiency.

When the second ultraviolet absorbing layer 50 is formed on the second hard substrate 20, an adhesive layer may be disposed between the second hard substrate 20 and the second ultraviolet absorbing layer 50. In one embodiment, the adhesive layer includes an ultraviolet curing adhesive. The adhesive layer may be an adhesive layer whose adhesive strength is improved by ultraviolet irradiation, or an adhesive layer whose adhesive strength is reduced by ultraviolet irradiation. For example, the active energy ray curing adhesive may be used as the adhesive.

D. Peeling Step In the peeling step, the first ultraviolet absorbing layer 40 of the laminate B (first hard substrate 10/first ultraviolet absorbing layer 40/member 30/(second ultraviolet absorbing layer 50)/second hard substrate 20) formed in the above fixing step is irradiated with ultraviolet light (preferably UV laser light) to peel off the member 30 from the first hard substrate 10. The conditions for the ultraviolet ray irradiation can be any appropriate conditions according to the configuration of the first ultraviolet absorbing layer 40, as long as the first ultraviolet absorbing layer 40 can be made peelable.

In one embodiment, when the first ultraviolet absorbing layer is made of an organic material (preferably contains an ultraviolet absorber), laser light having a wavelength of 200 nm to 380 nm is irradiated to the first ultraviolet absorbing layer at any appropriate output (e.g., 0.01 W to 6 W, preferably 0.05 W to 5 W). The first ultraviolet absorbing layer is deformed by gas generated by decomposition of the ultraviolet absorber and/or gas generated by decomposition of the adhesive layer due to heat generated by the ultraviolet absorber, resulting in the development of peelability in the area irradiated with the laser light.

When the first ultraviolet absorbing layer is made of an organic material (preferably contains an ultraviolet absorbing agent) and contains an active energy ray curable adhesive, the entire first ultraviolet absorbing layer may be irradiated with active energy rays before irradiating with UV laser light as described above to reduce the adhesive strength of the first ultraviolet absorbing layer. Examples of active energy rays include gamma rays, ultraviolet rays, visible light, infrared rays (heat rays), radio waves, alpha rays, beta rays, electron beams, plasma flow, ionizing rays, and particle beams. Preferred is ultraviolet light. The wavelength of ultraviolet light is preferably 300 nm to 400 nm. The amount of irradiation is, for example, an integrated light amount of 300 mJ/cm ² to 1500 mJ/cm ^2. In this way, if active energy rays are irradiated before irradiating with laser light, it is possible to prevent adhesive residue and transfer the member.

In one embodiment, when the first ultraviolet absorbing layer is composed of an inorganic material, the first ultraviolet absorbing layer is irradiated with laser light (excimer laser light) having a wavelength shorter than the absorption edge wavelength of the material constituting the first ultraviolet absorbing layer and longer than the absorption edge wavelength of the first hard substrate. For example, when the first ultraviolet absorbing layer is a GaN (gallium nitride) compound crystal layer, an excimer laser having a wavelength shorter than the absorption edge wavelength of GaN (365 nm) and longer than the absorption edge wavelength of a sapphire substrate (180 nm), for example, a wavelength of 248 nm, is used.

By imparting peelability to the first ultraviolet absorbing layer as described above, the first hard substrate 10 can be peeled off from the laminate B, and the member 30 (effectively a structure composed of the first ultraviolet absorbing layer 40 and the member 30) can be transferred onto the second hard substrate 20. Alternatively, the first hard substrate 10 and the first ultraviolet absorbing layer 40 can be peeled off from the laminate B, and the member 30 can be transferred onto the second hard substrate 20.

E. Application of the member transfer method In one embodiment, the above-mentioned partial transfer method can be repeated multiple times to transfer the above-mentioned members one after another. In this embodiment, it is preferable that a second ultraviolet absorbing layer is formed on the second hard substrate. As described above, the second ultraviolet absorbing layer can be a layer that has adhesiveness initially (i.e., before ultraviolet irradiation) and exhibits peelability due to reduced adhesiveness after ultraviolet irradiation. If the second ultraviolet absorbing layer 50 is formed, the transfer efficiency can be improved.

Specifically, as shown in FIG. 3, the laminate C (FIG. 3(a)-(b)) obtained through the above peeling process is laminated on the third hard substrate 60 (FIG. 3(c)-(d)), and then the second ultraviolet absorbing layer 50 is irradiated with ultraviolet light (FIG. 3(e)), and the member 30 is peeled off from the second hard substrate 20 (FIG. 3(f)). As described above, the laminate C can have a configuration of second hard substrate/second ultraviolet absorbing layer/member, or second hard substrate/second ultraviolet absorbing layer/member/first ultraviolet absorbing layer. When the laminate C is laminated on the third hard substrate 60, the laminate C is arranged so that the surface of the laminate C opposite the second hard substrate 20 (member 30 in the illustrated example) faces the third hard substrate 60.

The hard substrate described in section B-1 can be used as the third hard substrate.

A third ultraviolet absorbing layer 70 or an adhesive layer may be formed on the third hard substrate 60. The third ultraviolet absorbing layer 70 may be disposed between the member 30 and the third hard substrate 60. The third ultraviolet absorbing layer 70 is preferably a layer made of an organic material. Examples of such an ultraviolet absorbing layer include the ultraviolet absorbing layer described in the section "First ultraviolet absorbing layer made of an organic material." In other words, the third ultraviolet absorbing layer 70 may be a layer that has adhesiveness initially (i.e., before ultraviolet irradiation) and exhibits peelability due to a decrease in adhesiveness after ultraviolet irradiation. If the third ultraviolet absorbing layer 70 is formed, after the peeling step, the laminate D including the third hard substrate 60/third ultraviolet absorbing layer 70/member 30 can be subjected to a further transfer step, and the member 30 can be easily peeled off from the laminate D by laser light irradiation, thereby improving the transfer efficiency.

When the third ultraviolet absorbing layer is formed on the third hard substrate, an adhesive layer may be disposed between the third hard substrate and the third ultraviolet absorbing layer. In one embodiment, the adhesive layer includes an ultraviolet curing adhesive. The adhesive layer may be an adhesive layer whose adhesive strength is improved by ultraviolet irradiation, or an adhesive layer whose adhesive strength is reduced by ultraviolet irradiation. For example, the active energy ray curing adhesive may be used as the adhesive.

In one embodiment, the second ultraviolet absorbing layer is a layer containing an ultraviolet curing adhesive, and before the laminate C is laminated on a third hard substrate, the second ultraviolet absorbing layer is irradiated with ultraviolet light to reduce the adhesive strength of the second ultraviolet absorbing layer. Conditions for ultraviolet light irradiation include, for example, an ultraviolet wavelength of 300 nm to 400 nm and an irradiation amount of 300 mJ/cm ² to 1500 mJ/cm ² in total. In this way, by irradiating with active energy rays before laminating on a third hard substrate, the transferability of the member can be improved.

By repeating the above operation, the above components can be transferred one after another.

[Example 1-1]
As illustrated in FIG. 2, a sapphire substrate 10 (first hard substrate 10) having an optical semiconductor element 30 (member 30) formed on the surface thereof via an epitaxial layer 40 (first ultraviolet absorbing layer 40) was prepared.
Next, the optical semiconductor element 30 (member 30) was bonded onto the glass substrate 20 (second hard substrate 20) on which the ultraviolet-curable adhesive layer 50 (second ultraviolet-absorbing layer 50) containing an ultraviolet absorbent was laminated.
The epitaxial layer 40 (first ultraviolet absorbing layer 40) was irradiated with ultraviolet laser light (wavelength: 248 nm, irradiation energy: 1000 J/ ^cm2 ) to peel off the sapphire substrate 10 (first hard substrate 10), thereby transferring the optical semiconductor element 30 (member 30) from the sapphire substrate 10 (first hard substrate 10) to the glass substrate 20 (second hard substrate 20). This method made it possible to transfer the member without destroying it.

[Example 1-2]
The same process as in Example 1 was carried out to obtain a laminate C in which an optical semiconductor element 30 (member 30) was arranged on a second hard substrate 20 via an ultraviolet-curable adhesive layer 50 (second ultraviolet absorbing layer 50).
Next, ultraviolet light (wavelength: 355 nm to 365 nm, accumulated light amount: 1380 mJ/cm ² ) was irradiated onto the ultraviolet-curing adhesive layer 50 (second ultraviolet absorbing layer 50) through the glass substrate 20 (second hard substrate 20) to cure the adhesive layer and reduce the adhesive strength of the adhesive layer to the optical semiconductor element 30 (member 30) (not shown).
Next, as illustrated in FIG. 3, the optical semiconductor element 30 (member 30) was bonded onto a glass substrate 60 (third hard substrate 60) on which an ultraviolet-curable adhesive layer 70 (third ultraviolet absorbing layer 70) containing an ultraviolet absorber was laminated.
Next, the ultraviolet-curing adhesive layer 50 (second ultraviolet absorbing layer 50) was irradiated with ultraviolet laser light (wavelength: 355 nm, irradiation energy: 10 J/ ^cm2 ) to peel off the optical semiconductor element 30 (member 30), thereby transferring the optical semiconductor element (member) from the glass substrate (second hard substrate) to a glass substrate (third hard substrate). This method made it possible to transfer the member without destroying it.

[Examples 2-1 and 2-2]
The transfer of the member 30 was performed in the same manner as in Examples 1-1 and 1-2, except that instead of forming the ultraviolet-curing adhesive layer 50 (second ultraviolet absorbing layer 50) as a single layer, a double-sided adhesive sheet composed of the ultraviolet-curing adhesive layer 50 (second ultraviolet absorbing layer 50), a PET substrate, and a pressure-sensitive adhesive layer was used, and instead of forming the ultraviolet-curing adhesive layer 70 (third ultraviolet absorbing layer 70) as a single layer, a double-sided adhesive sheet composed of the ultraviolet-curing adhesive layer 70 (third ultraviolet absorbing layer 70), a PET substrate, and a pressure-sensitive adhesive layer was used. This method also made it possible to transfer the member without destroying it.

10 First hard substrate 20 Second hard substrate 30 Member 40 First ultraviolet absorbing layer 50 Second ultraviolet absorbing layer 60 Third hard substrate 70 Third ultraviolet absorbing layer

Claims (6)

A method for transferring a feature disposed on a first rigid substrate to a second rigid substrate, comprising the steps of:
A step of laminating the first hard substrate and the member via a first ultraviolet absorbing layer containing an ultraviolet absorber to form a laminate A; and thereafter,
the step of fixing the laminate A to the second hard substrate so that the member faces the second hard substrate to form a laminate B, and thereafter, the step of irradiating the first ultraviolet absorbing layer with ultraviolet light to peel off the first hard substrate from the laminate B,
The ultraviolet absorber is a benzotriazole-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a triazine-based ultraviolet absorber, a salicylate-based ultraviolet absorber, or a cyanoacrylate-based ultraviolet absorber.
Component transfer method. The member transfer method according to claim 1, wherein an adhesive layer is disposed between the first hard substrate and the member. The member transfer method according to claim 1 or 2, wherein the first ultraviolet absorbing layer is made of an organic material. A second ultraviolet absorbing layer is formed on the second hard substrate;
the second ultraviolet absorbing layer is disposed between the member and the second rigid substrate;
The member transferring method according to claim 1 . A first hard substrate, a first ultraviolet absorbing layer, a member, and a second hard substrate are provided in this order;
A method for transferring a member according to any one of claims 1 to 4,
Laminate. the first ultraviolet absorbing layer further comprises an active energy ray-curable pressure-sensitive adhesive,
In the peeling step, the entire first ultraviolet absorbing layer is irradiated with active energy rays to reduce adhesive strength, and then the first hard substrate is peeled off from the laminate B by irradiating with laser light.
The method for transferring a member according to claim 1 .