JP7732131B1 - Maintenance of substrates and plating equipment - Google Patents

Abstract

To clean a wide area of a power supply contact while suppressing contamination inside a substrate holder.
The maintenance substrate MWF for cleaning the power supply contacts of a plating device includes a maintenance substrate main body 290 and a cleaning member 292 arranged in a contact area 243a of the maintenance substrate main body 290 with which the power supply contacts come into contact when the maintenance substrate main body 290 is clamped to a substrate holder having the power supply contacts. The cleaning member 292 is formed of an elastic body capable of holding a cleaning liquid.

Description

This application relates to a maintenance substrate and a plating apparatus.

Patent Document 1 discloses a dip-type plating device as an example of an electrolytic plating device. In this plating device, a substrate (e.g., a semiconductor wafer) is held in a substrate holder with the surface to be plated facing sideways and immersed in a plating solution. A voltage is applied between the substrate (cathode) and an anode, depositing a conductive film on the surface of the substrate.

The plating apparatus of Patent Document 1 has a maintenance member that allows for easy maintenance of the power supply contacts of the substrate holder. Specifically, the maintenance member has a polishing body that is positioned so as to come into contact with the power supply contacts when held by the substrate holder. When the maintenance member is held by the substrate holder, the power supply contacts come into contact with the polishing body and slide over the polishing body. This polishes the power supply contacts with the polishing body, removing foreign matter adhering to the surface of the power supply contacts, allowing for maintenance of the power supply contacts.

Japanese Patent Application Laid-Open No. 2021-132153

The plating apparatus disclosed in Patent Document 1 does not take into consideration cleaning a wide area of the power supply contacts while preventing contamination from occurring inside the substrate holder.

In other words, the plating apparatus disclosed in Patent Document 1 removes foreign matter adhering to the surface of the power supply contact by polishing the power supply contact with an abrasive, which may contaminate the inside of the substrate holder with removed foreign matter particles. Furthermore, with the plating apparatus disclosed in Patent Document 1, the area from which foreign matter can be removed is limited to the contact area between the power supply contact, which is a rigid body, and the abrasive, so the area from which foreign matter can be removed is relatively narrow.

Therefore, one of the objectives of this application is to clean a wide area of the power supply contacts while suppressing contamination inside the substrate holder.

According to one embodiment, a maintenance substrate for cleaning power supply contacts of a plating device is disclosed, comprising: a maintenance substrate body; and a cleaning member arranged in a contact area of the maintenance substrate body with which the power supply contacts come into contact when the maintenance substrate body is clamped to a substrate holder having power supply contacts, the cleaning member being formed from an elastic body capable of holding a cleaning liquid.

FIG. 1 is a cross-sectional view showing the overall configuration of a plating apparatus according to one embodiment. FIG. 2 is a schematic perspective view of a substrate holder according to one embodiment. FIG. 3 is a schematic plan view of a substrate holder according to one embodiment. FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. FIG. 5 is a plan view of a maintenance board according to an embodiment. FIG. 6 is a diagram showing the configuration of a maintenance board storage according to an embodiment. FIG. 7 is a flowchart of a method for cleaning a power supply contact using a maintenance board. FIG. 8 is a flowchart of a method for supplying a cleaning liquid to a maintenance substrate. FIG. 9 is a diagram showing the configuration of a maintenance board storage according to an embodiment.

Embodiments of the present invention will now be described with reference to the drawings. In the drawings described below, identical or corresponding components will be designated by the same reference numerals and redundant explanations will be omitted.

<Overall configuration of plating equipment>
1 is a plan view showing the overall configuration of a plating apparatus according to this embodiment. The plating apparatus 1000 includes a load port 100, a transfer robot 110, a load stage 120, an unload stage 130, a loader 140, a fixing module 200, a maintenance substrate storage 280, a stocker module 300, a swap module 310, a holder cleaning module 320, a pre-wet module 400, a pre-soak module 500, a pre-soak cleaning module 510, a plating module 600, a plating cleaning module 700, a blow module 710, a temporary placement module 720, a cleaning module 800, a transport device 900, and a control module 950.

The load port 100 is a module for loading substrates WF stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000, and unloading substrates WF from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 is optional. The transport robot 110 is a robot for transporting substrates WF horizontally, and is configured to transfer substrates WF between the load port 100 and the load stage 120.

The load stage 120 is a stage for transferring the substrate WF before plating processing between the transport robot 110 and the loader 140. The unload stage 130 is a stage for transferring the substrate WF after plating processing between the transport robot 110 and the loader 140. The loader 140 is a robot for transferring the substrate WF horizontally, and is configured to transfer the substrate WF between the load stage 120, unload stage 130, fixing module 200, and cleaning module 800.

The maintenance substrate storage 280 is a module for storing maintenance substrates MWF. The fixing module 200 is a module for attaching and detaching substrates WF to and from the substrate holder 210. The fixing module 200 is also a module for attaching and detaching maintenance substrates MWF to and from the substrate holder 210. The loader 140 is a robot for transporting maintenance substrates MWF between the maintenance substrate storage 280 and the fixing module 200. The stocker module 300 is a module for storing substrate holders 210 vertically. The swap module 310 is a module for temporarily storing substrate holders 210 that require replacement or maintenance, and is structured to allow the substrate holders 210 to be inserted and removed. The substrate holder 210 removed from the swap module 310 can be maintained within the plating apparatus 1000 or removed outside the plating apparatus 1000, and the maintained substrate holder 210 or a new substrate holder 210 can be placed in the swap module 310. The holder cleaning module 320 is a module for cleaning the substrate holder 210.

The pre-wet module 400 is a module for wetting the surface of the substrate WF to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing the air inside the pattern formed on the substrate surface with the treatment liquid. The pre-wet module 400 is configured to perform a pre-wet process that replaces the treatment liquid inside the pattern with plating liquid during plating, making it easier to supply plating liquid inside the pattern.

The presoak module 500 is configured to perform a presoak process, which uses a treatment solution such as sulfuric acid or hydrochloric acid to etch away oxide films with high electrical resistance that exist on the surface of a seed layer formed on the surface to be plated of a substrate WF before plating, thereby cleaning or activating the surface of the substrate to be plated. The presoak cleaning module 510 is a module for cleaning the substrate WF that has been subjected to the presoak process.

The plating module 600 is a module for performing plating processing on the substrate WF. The plating cleaning module 700 is a module for cleaning the substrate WF to remove plating solution and the like remaining on the substrate WF after plating processing. In this embodiment, three plating modules 600 and plating cleaning modules 700 are arranged horizontally, but the number and arrangement of the plating modules 600 and plating cleaning modules 700 are optional. The blow module 710 is a module for drying the substrate WF after cleaning processing. The temporary storage module 720 is a module for temporarily storing the substrate holder 210 to which the substrate WF is attached so that it can be transferred between multiple transport devices 900. In this embodiment, the temporary storage module 720 can store one substrate holder 210, but the number can be optional.

The cleaning module 800 is a module for performing cleaning and drying processes on the substrate WF to remove plating solution and other substances remaining on the substrate WF after plating processing that has been removed from the substrate holder 210. In this embodiment, two cleaning modules 800 are arranged horizontally side by side, sandwiching the load stage 120 and unload stage 130, but the number and arrangement of the cleaning modules 800 are optional. The transport device 900 is a device for vertically transporting the substrate holder 210 between multiple modules within the plating apparatus 1000. In one example, the transport device 900 is a device for transporting the substrate holder 210 between the stocker module 300 and the fixing module 200. In this embodiment, three transport devices 900 are arranged side by side, but the number and arrangement of the transport devices 900 are optional.

The control module 950 is configured to control multiple modules of the plating apparatus 1000 and can be, for example, a general computer or a dedicated computer with an input/output interface to and from an operator.

An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate WF stored in a cassette is loaded into the load port 100. Next, the transport robot 110 removes the substrate WF from the cassette in the load port 100 and places the substrate WF on the load stage 120. The loader 140 receives the substrate WF from the load stage 120 and transports it to the fixing module 200.

The fixing module 200 attaches the substrate WF to the substrate holder 210. The transport device 900 transports the substrate holder 210 with the substrate WF attached to the prewet module 400. The prewet module 400 performs a prewet process on the substrate WF. The transport device 900 transports the substrate holder 210 with the prewet-treated substrate WF attached to it to the presoak module 500. The presoak module 500 performs a presoak process on the substrate WF. The transport device 900 transports the substrate holder 210 with the presoak-treated substrate WF attached to it to the presoak cleaning module 510. The presoak cleaning module 510 cleans the substrate WF. The transport device 900 transports the substrate holder 210 with the cleaned substrate WF attached to it to the plating module 600. The plating module 600 performs a plating process on the substrate WF.

The transport device 900 transports the substrate holder 210, to which the plated substrate WF is attached, to the plating cleaning module 700. The plating cleaning module 700 performs a cleaning process on the substrate WF and the substrate holder 210. The transport device 900 transports the substrate holder 210, to which the cleaned substrate WF is attached, to the blow module 710. The blow module 710 performs a drying process on the substrate WF. The transport device 900 transports the substrate holder 210, to which the dried substrate WF is attached, to the temporary placement module 720, and another transport device 900 transports the substrate holder 210 from the temporary placement module 720 to the fixing module 200. The fixing module 200 removes the substrate WF from the substrate holder 210.

The loader 140 transports the substrate WF after plating, which has been removed from the substrate holder 210, to the cleaning module 800. The cleaning module 800 performs cleaning and drying processes on the substrate WF. The loader 140 places the substrate WF after cleaning and drying processes on the unload stage 130. The transport robot 110 receives the substrate WF from the unload stage 130 and transports it to a cassette on the load port 100. Finally, the cassette containing the substrate WF is unloaded from the load port 100.

When the substrate WF is removed from the substrate holder 210 in the fixing module 200, the next substrate WF is attached or the substrate holder 210 is returned to the stocker module 300 by the transport device 900. If necessary, the substrate holder 210 that is not holding a substrate WF is cleaned in the holder cleaning module 320.

<Substrate holder>
Fig. 2 is a schematic perspective view of a substrate holder according to one embodiment. Fig. 3 is a schematic plan view of the substrate holder according to one embodiment. Fig. 4 is a cross-sectional view taken along line 4-4 in Fig. 3. Note that Figs. 3 and 4 show a state in which the substrate holder 210 clamps the maintenance substrate MWF.

As shown in Figures 2 to 4, the substrate holder 210 includes a front frame 220 and a rear frame 230 for sandwiching and holding the substrate WF or maintenance substrate MWF together with the front frame 220. The front frame 220 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The central opening 234a is formed in a rectangular shape. Note that in this embodiment, an example has been shown in which the central opening 234a is formed in a rectangular shape to correspond to a rectangular substrate WF or maintenance substrate MWF, but this is not limited to this. For example, if the substrate WF or maintenance substrate MWF is circular, the central opening 234a is formed in a circular shape.

In addition, in this embodiment, an example is shown in which a central opening is formed in the rear frame 230, but this is for performing plating processing on both sides of the substrate. Therefore, if plating processing is performed on only one side of the substrate, a central opening does not need to be formed in the rear frame 230.

2 and 3, the substrate holder 210 has multiple locking mechanisms 270 for locking and unlocking the front frame 220 and the rear frame 230. The multiple locking mechanisms 270 are provided along the outer periphery of the front frame 220 and the rear frame 230.

As shown in FIG. 4, the substrate holder 210 includes an inner seal member 250 and an outer seal member 260 that is spaced apart from the inner seal member 250 and arranged outside the inner seal member 250. The substrate holder 210 also includes a power supply contact 243 for supplying power to the substrate WF. The power supply contact 243 is provided between the inner seal member 250 and the outer seal member 260. This seals the power supply contact 243 and the edge of the substrate from the plating solution when the substrate holder 210 is immersed in the plating solution.

The locking mechanism 270 includes a holder plate 222 arranged on the rear frame 230 side and a holder hook 224 protruding from the holder plate 222 toward the front frame 220 side. On the other hand, the locking mechanism 270 includes a clamper plate 236 arranged on the front frame 220 side and a clamper hook 238 provided on the clamper plate 236.

The holder hook 224 is configured to be rotatable around the axis 224a. The locking mechanism 270 is configured to lock the front frame 220 and the rear frame 230 together by engaging the holder hook 224 with the clamper hook 238. On the other hand, the locking mechanism 270 is configured so that when the holder hook 224 is rotated, the engagement between the holder hook 224 and the clamper hook 238 is released, and the front frame 220 and the rear frame 230 are unlocked.

<Maintenance board>
Next, the maintenance substrate MWF will be described in detail. FIG. 5 is a plan view of a maintenance substrate according to one embodiment. The maintenance substrate MWF of this embodiment is a substrate for cleaning the power supply contacts 243. The maintenance substrate MWF includes a maintenance substrate main body 290 and a cleaning member 292 disposed in a contact area 243a of the maintenance substrate main body 290 with which the power supply contacts 243 come into contact when the maintenance substrate main body 290 is clamped to a substrate holder 210 having the power supply contacts 243. The cleaning member 292 is formed of an elastic material capable of retaining a cleaning liquid. For example, the cleaning member 292 may be a sheet or a fibrous material having minute grooves or irregularities formed therein. The cleaning member 292 may also be a porous elastic material capable of retaining a cleaning liquid. In one example, the cleaning member 292 is a sponge. In this embodiment, the power supply contacts 243 are provided on the four sides of the frame member 234 to supply power to the four sides of the substrate WF. Therefore, the cleaning members 292 are arranged in the contact areas 243 a on the four sides of the maintenance board body 290 .

This embodiment makes it possible to clean a wide area of the power supply contact while suppressing contamination inside the substrate holder. In other words, in conventional technology, foreign matter adhering to the surface of the power supply contact is removed by polishing the power supply contact with an abrasive, which can contaminate the inside of the substrate holder with particles of the removed foreign matter. Furthermore, in conventional technology, the area from which foreign matter can be removed is limited to the contact area between the power supply contact, which is a rigid body, and the abrasive, so the area from which foreign matter can be removed is relatively narrow.

In contrast, according to this embodiment, when the maintenance board body 290 is clamped to the substrate holder 210, the power supply contact 243 comes into contact with the cleaning member 292. Because the cleaning member 292 holds a cleaning liquid, the power supply contact 243 is immersed in the cleaning liquid, allowing foreign matter adhering to the surface of the power supply contact 243 to be removed. In one example, by holding an acidic solution as the cleaning liquid in the cleaning member 292, oxides or resist residue adhering to the power supply contact 243 can be cleaned. According to this embodiment, foreign particle generation is eliminated, thereby preventing contamination inside the substrate holder. Additionally, according to this embodiment, because the cleaning member 292 is elastic, when the power supply contact 243 comes into contact with the cleaning member 292, the cleaning member 292 is depressed, allowing a wide area of the power supply contact 243 to be immersed in the cleaning liquid. This allows a wide area of the power supply contact 243 to be cleaned.

As shown in Figure 5, the cleaning member 292 has a length extending in the arrangement direction of the multiple power supply contacts and a width 292W perpendicular to the length. The width 292W of the cleaning member 292 is formed to be larger than the width 243W of the contact area 243a. By forming the width 292W of the cleaning member 292 in this manner, when the power supply contacts 243 come into contact with the cleaning member 292, cleaning liquid can be collected in the depressions of the cleaning member 292, allowing a wide area of the power supply contacts 243 to be immersed in the cleaning liquid.

As shown in FIG. 5 , the cleaning member 292 is positioned in the contact area 243a so that the outer end 292EG of the cleaning member 292 is located inside the outer end WEG of the maintenance board main body 290. This forms an outer peripheral area 294 for receiving cleaning liquid on the maintenance board main body 290 outside the cleaning member 292. As a result, cleaning liquid can be prevented from spilling into the interior of the substrate holder 210. That is, because the cleaning member 292 is formed of a porous elastic body capable of retaining cleaning liquid, when the power supply contact 243 contacts and presses the cleaning member 292, cleaning liquid may drip from the cleaning member 292. In this regard, according to this embodiment, cleaning liquid dripping from the cleaning member 292 can be received by the outer peripheral area 294 of the maintenance board main body 290, thereby preventing cleaning liquid from spilling into the interior of the substrate holder 210.

<Maintenance board storage>
Next, a maintenance substrate storage 280 for storing the maintenance substrate MWF will be described. Fig. 6 is a diagram showing the configuration of a maintenance substrate storage according to one embodiment. Fig. 6 shows a plan view and a side view of the maintenance substrate storage 280. The maintenance substrate storage 280 includes a stage 282 configured to hold the maintenance substrate MWF with a cleaning member 292 facing upward. The maintenance substrate storage 280 also includes a nozzle 289 that is arranged facing the cleaning member 292 of the maintenance substrate MWF held on the stage 282 and is configured to eject a cleaning liquid.

The maintenance board storage 280 also includes a tank 284 for storing cleaning liquid, a pump 286 for pressurizing the cleaning liquid stored in the tank 284 to the nozzle 289, and a valve 288 for opening and closing the flow path of the cleaning liquid sent to the nozzle 289.

<How to clean the power supply contact>
Next, a method for cleaning the power supply contacts 243 using the maintenance board MWF will be described. Fig. 7 is a flowchart of the method for cleaning the power supply contacts using the maintenance board. First, the transport device 900 sets an empty board holder 210 in the fixing module 200 (step 102). Next, the loader 140 removes the maintenance board MWF from the maintenance board storage 280 (step 104).

The loader 140 then places the maintenance substrate MWF on the fixing module 200 (substrate holder 210) (step 106). The fixing module 200 then clamps the maintenance substrate MWF with the substrate holder 210 (step 108) and presses the tip of the power supply contact 243 against the cleaning member 292 of the maintenance substrate MWF (step 110). This cleans the power supply contact 243.

The fixing module 200 waits in the clamped state for a preset cleaning time (step 112). After the preset cleaning time has elapsed, the fixing module 200 unclamps the substrate holder 210 (step 114).

Next, as a movement of the maintenance substrate MWF, the loader 140 removes the maintenance substrate MWF from the fixing module 200 (substrate holder 210) (step 116). Next, the loader 140 places the maintenance substrate MWF in the maintenance substrate storage 280 (step 118).

Meanwhile, as the substrate holder 210 moves, the fixing module 200 semi-clamps the substrate holder 210 (step 120). The transport device 900 then transports the substrate holder 210 to the holder cleaning module 320 (step 122). The holder cleaning module 320 cleans the substrate holder 210 and the power supply contact 243 with pure water (step 124). The transport device 900 then returns the substrate holder 210 to the stocker module 300 (step 126).

Figure 8 is a flowchart of a method for supplying cleaning liquid to a maintenance substrate. In the cleaning liquid supply method of this embodiment, first, the loader 140 places the maintenance substrate MWF, whose power supply contacts 243 have been cleaned, on the stage 282 (step 202). At this time, the loader 140 places the maintenance substrate MWF on the stage 282 with the cleaning member 292 facing upward. Next, the maintenance substrate storage 280 raises the stage 282 (step 204).

Next, the maintenance substrate storage 280 opens the valve 288 (step 206) and starts the pump 286 (step 208). This supplies cleaning liquid to the cleaning member 292. After a preset supply time has elapsed, the maintenance substrate storage 280 stops the pump 286 (step 210) and closes the valve 288 (step 212). Next, the maintenance substrate storage 280 lowers the stage 282 (step 214). Next, the loader 140 removes the maintenance substrate MWF placed on the stage 282 to clean the power supply contacts 243 (step 216). Through these steps, foreign matter adhering to the cleaning member 292 of the maintenance substrate MWF after the power supply contacts 243 have been cleaned can be washed away, and the cleaning member 292 can be used to retain cleaning liquid for the next cleaning of the maintenance substrate MWF.

In the above embodiment, an example was described in which oxides on the power supply contact 243 were removed by supplying an acidic solution as a cleaning liquid to the cleaning member 292, and the power supply contact 243 was cleaned with pure water in the holder cleaning module 320, but this is not limiting. This point will be explained below.

Figure 9 is a diagram showing the configuration of a maintenance substrate storage in one embodiment. As shown in Figure 9, the stage 282 includes a first stage 282-1 and a second stage 282-2. The nozzle 289 includes a first nozzle 289-1 that is arranged opposite the cleaning member 292 of the maintenance substrate MWF held on the first stage 282-1 and is configured to eject an acidic solution as a cleaning liquid. The nozzle 289 also includes a second nozzle 289-2 that is arranged opposite the cleaning member 292 of the maintenance substrate MWF held on the second stage 282-2 and is configured to eject pure water as a cleaning liquid.

The maintenance substrate storage 280 of this embodiment can clean oxides and the like from the power supply contacts 243 using a maintenance substrate MWF with an acidic solution held in the cleaning member 292, and then clean the power supply contacts 243 with pure water using a maintenance substrate MWF with pure water held in the cleaning member 292. This eliminates the need to transport the substrate holder 210 to the holder cleaning module 320 for pure water cleaning.

Although several embodiments of the present invention have been described above, the above-described embodiments of the invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from its spirit, and the present invention naturally includes equivalents. Furthermore, any combination or omission of each component described in the claims and specification is possible to the extent that at least some of the above-mentioned problems can be solved or at least some of the effects can be achieved.

In one embodiment, the present application discloses a maintenance board for cleaning power supply contacts of a plating device, comprising: a maintenance board body; and a cleaning member arranged in a contact area of the maintenance board body with which the power supply contacts come into contact when the maintenance board body is clamped to a substrate holder having power supply contacts, the cleaning member being formed of an elastic body capable of holding a cleaning liquid.

In addition, as one embodiment, the present application discloses a maintenance board in which the cleaning member has a length extending in the arrangement direction of the multiple power supply contacts and a width perpendicular to the length, and the width of the cleaning member is formed to be larger than the width of the contact area.

In one embodiment, the present application discloses a maintenance board in which the cleaning member is positioned in the contact area so that the outer end of the cleaning member is located inside the outer end of the maintenance board main body.

In one embodiment, the present application discloses a maintenance substrate in which the cleaning member is formed from a porous elastic body capable of retaining cleaning liquid.

In addition, as one embodiment, the present application discloses a plating apparatus including a maintenance substrate storage for storing any of the maintenance substrates described above, a stocker module for storing substrate holders, a fixing module for attaching the maintenance substrate to the substrate holder and removing the maintenance substrate from the substrate holder, a loader for transporting the maintenance substrate between the maintenance substrate storage and the fixing module, and a transport device for transporting the substrate holder between the stocker module and the fixing module.

In addition, as one embodiment, the present application discloses a plating apparatus in which the maintenance substrate storage includes a stage configured to hold the maintenance substrate with the cleaning member facing upward, and a nozzle positioned opposite the cleaning member of the maintenance substrate held on the stage and configured to eject a cleaning liquid.

In addition, as one embodiment, the present application discloses a plating apparatus in which the stage includes a first stage and a second stage, and the nozzle includes a first nozzle that is positioned opposite the cleaning member of the maintenance substrate held on the first stage and configured to eject an acidic solution, and a second nozzle that is positioned opposite the cleaning member of the maintenance substrate held on the second stage and configured to eject pure water.

140 Loader 200 Fixing module 210 Substrate holder 243 Power supply contact 243W Width of contact area 243a Contact area 280 Maintenance substrate storage 282 Stage 282-1 First stage 282-2 Second stage 289 Nozzle 289-1 First nozzle 289-2 Second nozzle 290 Maintenance substrate main body 292 Cleaning member 292EG Outer end 292W of cleaning member Width 300 Stocker module 900 Transport device 1000 Plating device MWF Maintenance substrate WEG Outer end WF of maintenance substrate main body Substrate

Claims (7)

A maintenance board for cleaning power supply contacts of a plating device,
The maintenance board itself,
a cleaning member that is arranged in a contact area of the maintenance board body with which the power supply contact comes into contact when the maintenance board body is clamped to a board holder having the power supply contact, the cleaning member being made of an elastic body that can hold a cleaning liquid;
Including,
Maintenance board. the cleaning member has a length extending in an arrangement direction of the plurality of power supply contacts and a width perpendicular to the length, the width of the cleaning member being larger than the width of the contact region;
The maintenance board according to claim 1 . the cleaning member is disposed in the contact area so that the outer end of the cleaning member is positioned inside the outer end of the maintenance board body;
The maintenance board according to claim 2 . The cleaning member is formed of a porous elastic body capable of retaining a cleaning liquid.
The maintenance board according to claim 3 . a maintenance board storage for storing the maintenance board according to any one of claims 1 to 4;
a stocker module for storing the substrate holders;
a fixing module for attaching the maintenance board to the substrate holder and for removing the maintenance board from the substrate holder;
a loader for transporting the maintenance board between the maintenance board storage and the fixing module;
a transport device for transporting the substrate holder between the stocker module and the fixing module;
Including,
Plating equipment. The maintenance board storage includes:
a stage configured to hold the maintenance board with the cleaning member facing upward;
a nozzle disposed opposite to the cleaning member of the maintenance board held by the stage and configured to discharge a cleaning liquid;
Including,
The plating apparatus according to claim 5 . the stages include a first stage and a second stage;
the nozzles include a first nozzle that is arranged facing the cleaning member of the maintenance board held on the first stage and configured to discharge an acidic solution, and a second nozzle that is arranged facing the cleaning member of the maintenance board held on the second stage and configured to discharge pure water,
The plating apparatus according to claim 6.