JPH04100140A - Tablets and their manufacturing methods - Google Patents
Tablets and their manufacturing methodsInfo
- Publication number
- JPH04100140A JPH04100140A JP2217753A JP21775390A JPH04100140A JP H04100140 A JPH04100140 A JP H04100140A JP 2217753 A JP2217753 A JP 2217753A JP 21775390 A JP21775390 A JP 21775390A JP H04100140 A JPH04100140 A JP H04100140A
- Authority
- JP
- Japan
- Prior art keywords
- axis
- layer
- resistance layer
- resistance
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は押圧点の位置情報を得るためのタブレット(抵
抗感圧型)と、このタブレットの電極形成方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a tablet (resistance pressure sensitive type) for obtaining positional information of a pressed point, and a method for forming electrodes of this tablet.
「従来の技術」
一般に、タブレットは第3図および第4図に示すように
、X軸方向の両端に電極(1)(1)を有するX軸抵抗
板(2)と、Y軸方向の両端に電極(3) (3)を有
するX軸抵抗板(4)とを互いに向き合わせて。"Prior Art" Generally, as shown in FIGS. 3 and 4, a tablet includes an X-axis resistance plate (2) having electrodes (1) (1) at both ends in the X-axis direction, and a and the X-axis resistance plate (4) with electrodes (3) (3) facing each other.
かつ一方の抵抗板(4)上に所定間隔で設けた小さな絶
縁突起のドツトスペーサ(5)を介在してわずかな間隙
をもって配置されている。The dot spacers (5), which are small insulating protrusions, are provided on one resistor plate (4) at predetermined intervals, and are arranged with a slight gap between them.
そして、X軸抵抗板(2)の位置情報を得るには、まず
切換スイッチ(6)をX接点(X、)(X2)(X3)
側へ切換えて、ペン(7)で所定点(P)を押圧して面
抵抗板(2) (4)を短絡する。その点CP)で分圧
された電圧
がX軸抵抗板(4)のy、側から接点(X、)を経てX
軸位置情報として電圧計(V)で測定されて出力される
。To obtain the position information of the X-axis resistance plate (2), first set the changeover switch (6) to the X contacts (X, ) (X2) (X3).
switch to the side and press the predetermined point (P) with the pen (7) to short-circuit the surface resistance plates (2) and (4). The voltage divided at that point CP) is transmitted from the y side of the X-axis resistance plate (4) through the contact point (X, ) to
It is measured with a voltmeter (V) and output as shaft position information.
つぎに、ペン(7)で(P)点を押圧したままで切換ス
イッチ(6)をY接点(Y、)(Y、)(Y3)側へ切
換えると、やはりY軸の分圧された電圧
がX軸抵抗板(2)のx2側がら接点(Y、)を経てY
軸位置情報として電圧計(V)で測定されて出方される
。Next, while pressing point (P) with the pen (7), switch the changeover switch (6) to the Y contact (Y,) (Y,) (Y3) side, and the divided voltage on the Y axis will also be applied. is from the x2 side of the X-axis resistance plate (2) through the contact (Y, )
It is measured with a voltmeter (V) and output as shaft position information.
なお、電圧計(V)は高抵抗のため、x2、y2の抵抗
値による測定値への影響はほとんどない。Note that since the voltmeter (V) has a high resistance, the resistance values of x2 and y2 have almost no effect on the measured value.
以上のようなタブレットは、従来、第2図に示すような
方法で作られていた。The tablets described above have conventionally been manufactured by a method as shown in FIG.
(a)ポリエステルシートなどの基板(8)に、一定厚
の抵抗層(9)を蒸着によって形成する。(a) A resistive layer (9) of a constant thickness is formed by vapor deposition on a substrate (8) such as a polyester sheet.
(b)マスクエツチングにより所定形状の抵抗層(9)
だけを残す。(b) Resistance layer (9) shaped into a predetermined shape by mask etching
leave only
(c)抵抗層(9)の両端の電極(10) (10)と
配線(11)とを印刷により形成する。(c) Electrodes (10) (10) and wiring (11) at both ends of the resistance layer (9) are formed by printing.
(d)電極(10) (10)間の抵抗層(9)上には
ドツトスペーサ(12)の絶縁印刷をするとともに、こ
の抵抗層(9)と配線(11)の外部接続部(17)を
除く部分にはオーバーコート(13)の絶縁印刷をする
。(d) A dot spacer (12) is insulated printed on the resistance layer (9) between the electrodes (10) (10), and an external connection part (17) between this resistance layer (9) and the wiring (11) is printed. An insulating overcoat (13) is printed on the parts except for.
(e)外部接続部(17)が上方にやや突出して残るよ
うに全体を所定形状に裁断して外周の不要部分を除去し
、X軸抵抗板(14)とする。(e) The whole is cut into a predetermined shape so that the external connection portion (17) remains slightly protruding upward, and unnecessary portions on the outer periphery are removed to obtain an X-axis resistance plate (14).
以上のようにして形成されたものがX軸抵抗板(14)
であるとすると、X軸抵抗板(15)は(a) (b)
(c’)(d’)(e’)の工程となる。ここで、こ
のX軸抵抗板(15)がX軸抵抗板(14)と異なるの
は、Y軸の電極(16) (16) (7)位置がY軸
の電極(10) (10) ト直交し、かつ配線(11
)と外部接続部(17)の位置が異なることと、ドツト
スペーサ(12)がないことで、その他は前記同様であ
る。The thing formed as above is the X-axis resistance plate (14)
Assuming that, the X-axis resistance plate (15) is (a) (b)
The steps are (c'), (d'), and (e'). Here, the difference between this X-axis resistance plate (15) and the X-axis resistance plate (14) is that the position of the Y-axis electrode (16) (16) (7) is the position of the Y-axis electrode (10) (10). Orthogonal and wiring (11
) and the external connection part (17) are different from each other, and the dot spacer (12) is not provided, but otherwise the structure is the same as described above.
(f)このX軸抵抗板(14)とX軸抵抗板(15)を
互いに向き合うように重合するとタブレットとなる。(f) When the X-axis resistance plate (14) and the X-axis resistance plate (15) are overlapped so as to face each other, a tablet is obtained.
「発明が解決しようとする課題」
以上のような工程のうち最も問題となるのは、前記(b
)マスクエツチング工程である。この(b)工程は必要
な個所だけにマスクをしてエツチング液に浸し、不要な
抵抗層部分を除去した後、マスクを外すという作業であ
り、この(b)工程だけで全体の工程の半分位を占める
ため、極めて作業性が悪いという問題があった。また、
マスクエツチング工程で抵抗層にマスクをするため、マ
スクを剥がすとき抵抗層が影響を受け、抵抗値が不均一
になり、正しい位置情報が得られなくなるという問題が
あった。"Problem to be Solved by the Invention" Among the above steps, the most problematic is the above (b).
) This is a mask etching process. This step (b) involves covering only the necessary areas with a mask, immersing it in an etching solution, removing unnecessary portions of the resistance layer, and then removing the mask.This step (b) alone takes half of the entire process. There was a problem in that the workability was extremely poor because the Also,
Since the resistive layer is masked in the mask etching process, the resistive layer is affected when the mask is removed, resulting in non-uniform resistance values and a problem in that correct positional information cannot be obtained.
本発明はマスクエツチングに代る簡単な方法で、しかも
正確な情報が得られる装置とその製造方法を提供するこ
とを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a device and a method for manufacturing the same that can provide accurate information using a simple method that replaces mask etching.
「課題を解決するための手段」
本発明は絶縁基板上の抵抗層の両端にX軸電極を形成し
たX軸抵抗板と、絶縁基板上の抵抗層の両端にY軸電極
を形成したX軸抵抗板とをわずかな絶縁空隙をもって重
合してなるタブレットにおいて、前記抵抗層は検出用と
して使用されない非検出部分を絶縁層で被覆し、この絶
縁層と抵抗層の境界の縁部にそれぞれ跨って前記電極を
形成してなるものである。"Means for Solving the Problems" The present invention provides an X-axis resistance plate in which X-axis electrodes are formed on both ends of a resistance layer on an insulating substrate, and an In a tablet formed by polymerizing a resistive plate with a slight insulation gap, the resistive layer covers the non-detection portion that is not used for detection with an insulating layer, and extends over the edge of the boundary between the insulating layer and the resistive layer. The electrode is formed by forming the electrode.
「作用」
絶縁基板上に抵抗層を一定厚で形成し、この抵抗層の位
置検出に使用されない非検出部分にアンダーコートの絶
縁層を被覆して、X軸側とY軸用を形成する。このMm
層と露出している抵抗層との境界の両縁部にまたがるよ
うにそれぞれX軸電極とY軸電極を形成し、さらに絶縁
層上に外部へ導出するための配線を施こす。いずれか一
方、例えばY軸用の露出している抵抗層にはドツトスペ
ーサのIM!!縁印刷をし1位置検出部と外部接続部以
外にはオーバーコートの絶縁印刷をする。外部接続部が
やや突出して残るように全体を正確な寸法に裁断して外
周の不要部分を除去してX軸抵抗板となす。"Operation" A resistive layer is formed with a constant thickness on an insulating substrate, and the non-detection portions of the resistive layer that are not used for position detection are coated with an undercoat insulating layer to form the X-axis side and the Y-axis side. This Mm
An X-axis electrode and a Y-axis electrode are respectively formed so as to straddle both edges of the boundary between the layer and the exposed resistance layer, and wiring for leading to the outside is provided on the insulating layer. On either side, for example, dot spacer IM! on the exposed resistance layer for the Y axis! ! Edge printing is performed, and an insulating overcoat is printed on areas other than the first position detection part and external connection parts. The whole is cut to exact dimensions so that the external connection part remains slightly protruding, and unnecessary parts on the outer periphery are removed to form the X-axis resistance plate.
なお、X軸抵抗板についてはX軸電極がY軸電極と直交
した位置に形成され、また、X軸側の霧出した抵抗層に
はドツトスペーサの絶縁印刷はしない、それ以外はX軸
抵抗板と略同様である。Regarding the X-axis resistance plate, the X-axis electrode is formed at a position perpendicular to the Y-axis electrode, and the dot spacer insulation is not printed on the atomized resistance layer on the X-axis side. It is almost the same as a board.
このようにして形成されたX軸抵抗板とX軸抵抗板とを
互いに向き合せて重合してタブレットとする。The X-axis resistance plate and the X-axis resistance plate thus formed are faced to each other and overlapped to form a tablet.
「実施例」 以下、本発明による一実施例を第1図に基き説明する。"Example" An embodiment of the present invention will be described below with reference to FIG.
X軸抵抗板(14)はつぎの工程(a) (b) (c
) (d) (e)によって作る。The X-axis resistance plate (14) undergoes the following steps (a) (b) (c
) (d) Created by (e).
工程(a):ポリエステルシートなどの絶縁基板(8)
上に、10μ■程度の均一な一定厚さの抵抗層(9)を
蒸着等によって形成する。Step (a): Insulating substrate (8) such as polyester sheet
A resistive layer (9) having a uniform and constant thickness of about 10 .mu.m is formed thereon by vapor deposition or the like.
工程(b):抵抗層(9)のうち、略中央部分であって
位置検出に使用される部分だけが露出するようにそれ以
外の部分を30μm程度の厚さでアンダーコート(18
)の絶縁印刷を行う。Step (b): Of the resistive layer (9), the other parts are undercoated (18
) insulation printing.
工程(c) :Il出した抵抗層(9)の両側縁であっ
てアンダーコート(18)との境界部分に、これらの抵
抗層(9)とアンダーコート(18)とに跨がるように
銀ペーストの電極(10) (10)を印刷により形成
するとともに、外部へ導出するための配線(11)と外
部接続部(17)とを同時に印刷により形成する・工程
(d):抵抗層(9)の位置検出用として用いられる霧
出部分に、小さなドツトスペーサ(12)を所定間隔を
もって絶縁印刷により形成する。この位置検出として用
いられる部分と、配線(11)の外部接続部(17)を
除いてそれ以外の電極(1o) (10)と配線(11
)を形成した面上にはオーバーコート(19)を絶縁印
刷により形成する。Step (c): On both sides of the exposed resistance layer (9) and at the boundary with the undercoat (18), so as to straddle the resistance layer (9) and the undercoat (18). The silver paste electrode (10) (10) is formed by printing, and the wiring (11) and the external connection part (17) for leading to the outside are simultaneously formed by printing. Step (d): Resistance layer ( 9) Small dot spacers (12) are formed at predetermined intervals by insulating printing on the spray part used for position detection. Except for the part used for position detection and the external connection part (17) of the wiring (11), the other electrodes (1o) (10) and the wiring (11)
) is formed with an overcoat (19) by insulating printing.
工程(e):外部接続部(17)が上方にやや突出して
残るように全体を所定形状に裁断して外周の不要部分を
除去し、X軸抵抗板(14)とする。Step (e): The whole is cut into a predetermined shape so that the external connection portion (17) remains slightly protruding upward, and unnecessary portions on the outer periphery are removed to obtain an X-axis resistance plate (14).
つぎに、X軸抵抗板(15)はつぎの工程(a) (b
) (c’)(d’ )(e’ )によって作る。Next, the X-axis resistance plate (15) undergoes the following steps (a) (b
) (c') (d') (e').
工程(a)と(b)は前記同様である。Steps (a) and (b) are the same as above.
工程(c’) : X軸電極(16) (16)の位置
はY軸電極(10) (10)と直交するとともに外部
接続部(17)はY軸側の配線(11)と重合しない位
置となるように印刷形成する。Step (c'): The position of the X-axis electrode (16) (16) is perpendicular to the Y-axis electrode (10) (10), and the external connection part (17) is located at a position where it does not overlap with the wiring (11) on the Y-axis side. Print and form it so that it becomes.
工程(d’):抵抗層(9)の位置検出用として用いら
れる露出面と配線(11)の外部接続部(17)を除い
た面上をオーバーコート(19)の絶縁印刷により被覆
する。抵抗層(9)の露出面にはドツトスペーサ(12
)は印刷しない。Step (d'): The exposed surface of the resistive layer (9) used for position detection and the surface excluding the external connection portion (17) of the wiring (11) are coated with insulating printing of an overcoat (19). A dot spacer (12) is placed on the exposed surface of the resistance layer (9).
) are not printed.
工程(e’):外部接続部(17)が上方にやや突出し
て残るように全体を所定形状に裁断して外周の不要部分
を除去し、X軸抵抗板(15)とする。Step (e'): The whole is cut into a predetermined shape so that the external connection part (17) remains slightly protruding upward, and unnecessary parts on the outer periphery are removed to obtain an X-axis resistance plate (15).
工程(f):工程(e)によるX軸抵抗板(14)上に
、前記工程(e′)によるX軸抵抗板(15)を重合し
てタブレットとなす。Step (f): The X-axis resistance plate (15) obtained in step (e') is superposed on the X-axis resistance plate (14) obtained in step (e) to form a tablet.
「発明の効果」
本発明は上述のように、マスクエツチング工程をなくし
、すべて印刷により構成されるようにしたため、作業時
間が早くなり、しかも安価に提供できる。また、エツチ
ング用のマスクを抵抗層につけたり、剥したりすること
がないため、抵抗層が劣化することがなく、正確な位置
情報を得ることができる。"Effects of the Invention" As described above, the present invention eliminates the mask etching step and is constructed entirely by printing, so that the work time is shortened and it can be provided at low cost. Furthermore, since there is no need to apply or remove an etching mask from the resistive layer, the resistive layer does not deteriorate and accurate positional information can be obtained.
第1図は本発明によるタブレットの製造工程図。
第2図は従来の製造工程図、第3図はタブレットの動作
説明図、第4図はタブレットの断面図である。
(8)・・・基板、(9)・・・抵抗層、(10)・・
・電極、(11)・・・配線、 ’ (12)・・・ド
ツトスペーサ、(14)・・・X軸抵抗板、(15)・
・・X軸抵抗板、(16)・・・X軸電極、(17)・
・・外部接続部、(18)・・・アンダーコート、(1
9)・・・オーバーコート。
出願人 ニスエムケイ株式会社
第
図
第
図FIG. 1 is a manufacturing process diagram of a tablet according to the present invention. FIG. 2 is a conventional manufacturing process diagram, FIG. 3 is an explanatory diagram of the operation of the tablet, and FIG. 4 is a sectional view of the tablet. (8)...Substrate, (9)...Resistance layer, (10)...
・Electrode, (11)... Wiring, ' (12)... Dot spacer, (14)... X-axis resistance plate, (15)...
・・X-axis resistance plate, (16) ・・X-axis electrode, (17)・
・・External connection part, (18) ・・Undercoat, (1
9)...Overcoat. Applicant: Niss MK Co., Ltd.
Claims (2)
X軸抵抗板と、絶縁基板上の抵抗層の両端にY軸電極を
形成したY軸抵抗板とをわずかな絶縁空隙をもって重合
してなるタブレットにおいて、前記抵抗層は検出用とし
て使用されない非検出部分を絶縁層で被覆し、この絶縁
層と抵抗層の境界の縁部にそれぞれ跨って前記電極を形
成してなることを特徴とするタブレット。(1) An X-axis resistance plate with X-axis electrodes formed on both ends of a resistance layer on an insulating substrate and a Y-axis resistance plate with Y-axis electrodes formed on both ends of a resistance layer on an insulated substrate with a slight insulation gap. In the tablet formed by polymerization, the resistive layer is formed by covering a non-detection portion that is not used for detection with an insulating layer, and forming the electrodes across the edges of the boundary between the insulating layer and the resistive layer. A tablet with special features.
X軸抵抗板と、絶縁基板上の抵抗層の両端にY軸電極を
形成したY軸抵抗板とをわずかな絶縁空隙をもって重合
してなるタブレットにおいて、前記抵抗層の検出用とし
て使用されない非検出部分にアンダーコートの絶縁印刷
をする工程と、このアンダーコートと露出した抵抗層と
に電極を形成するとともに、配線を形成する工程と、こ
れら電極と配線上にオーバーコートの絶縁印刷をする工
程とからなるタブレットの製造方法。(2) An X-axis resistance plate with X-axis electrodes formed on both ends of a resistance layer on an insulating substrate and a Y-axis resistance plate with Y-axis electrodes formed on both ends of a resistance layer on an insulated substrate with a slight insulation gap. In the polymerized tablet, a step of printing an insulating undercoat on the non-detection portion of the resistance layer that is not used for detection, forming an electrode on the undercoat and the exposed resistance layer, and forming wiring. and a step of printing an insulating overcoat on these electrodes and wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21775390A JPH0666047B2 (en) | 1990-08-17 | 1990-08-17 | Tablet and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21775390A JPH0666047B2 (en) | 1990-08-17 | 1990-08-17 | Tablet and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04100140A true JPH04100140A (en) | 1992-04-02 |
| JPH0666047B2 JPH0666047B2 (en) | 1994-08-24 |
Family
ID=16709208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21775390A Expired - Lifetime JPH0666047B2 (en) | 1990-08-17 | 1990-08-17 | Tablet and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0666047B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001075576A1 (en) * | 2000-03-31 | 2001-10-11 | Nissha Printing Co.,Ltd. | Touch-panel with light shielding peripheral part |
| US6791535B2 (en) | 1999-12-22 | 2004-09-14 | Nec Corporation | Resistance film type touch panel with short circuit preventing structure |
| JP2011128932A (en) * | 2009-12-18 | 2011-06-30 | Sony Corp | Electro-optical device, method of manufacturing the same, and electronic apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60225221A (en) * | 1984-04-23 | 1985-11-09 | Alps Electric Co Ltd | Coordinate input device |
-
1990
- 1990-08-17 JP JP21775390A patent/JPH0666047B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60225221A (en) * | 1984-04-23 | 1985-11-09 | Alps Electric Co Ltd | Coordinate input device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6791535B2 (en) | 1999-12-22 | 2004-09-14 | Nec Corporation | Resistance film type touch panel with short circuit preventing structure |
| WO2001075576A1 (en) * | 2000-03-31 | 2001-10-11 | Nissha Printing Co.,Ltd. | Touch-panel with light shielding peripheral part |
| US6814452B2 (en) | 2000-03-31 | 2004-11-09 | Nissha Printing Co., Ltd. | Touch-panel with light shielding peripheral part |
| JP2011128932A (en) * | 2009-12-18 | 2011-06-30 | Sony Corp | Electro-optical device, method of manufacturing the same, and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0666047B2 (en) | 1994-08-24 |
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