JPH04134227A - Thermal sensor - Google Patents

Abstract

PURPOSE:To eliminate need for wiring for extracting the output signal of a sensor by extracting an output signal as a vibration or a sound. CONSTITUTION:In a thermosensible sensor, a pressure release valve 3 is provided on a gas sealing vessel 1, a vibration plate 4 vibrated by gas is fitted in the vicinity of the valve 3, and a shape memory alloy 2, deformed at a given temperature to open the valve 3, is installed outside the vessel 1. The opening of the valve 3, due to the deformation of the alloy 2 at a given temperature, causes the flowing of a high pressure gas from the outside of the vessel 1 to vibrate the vibration plate 4 by an air current A at that time. Also a sound or a vibration at that time is received with a receiving sensor to judge a received signal with a judging unit. Need for wiring for extracting an output signal can be eliminated by thus extracting the output of the thermal sensor as the sound or the vibration.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a thermal sensor.

[Conventional technology]

Conventional heat-sensitive sensors include thermostats that use a bimetal, which is made by bonding thin plates of two types of metals with different coefficients of thermal expansion.

The bimetal used in this conventional thermal sensor is
A change in temperature causes a difference in the elongation of the two metal plates, resulting in a bend in a direction perpendicular to the surfaces where they are joined. The degree of curvature is proportional to the magnitude of temperature change, and this curving action opens and closes electrical contacts, thereby turning on and off electrical equipment.

[Invention or problem to be solved]

However, the conventional heat-sensitive sensor described above is
When disposed inside a sealed container such as IS), there is a problem in that wiring for extracting the output signal of the heat-sensitive sensor becomes complicated.

An object of the present invention is to provide a thermal sensor that does not require wiring for extracting an output signal.

[Means to solve the problem]

In the heat-sensitive sensor according to claim (1), a pressure relief valve is provided in a gas-sealed container with an internal pressure different from the surrounding pressure, and a diaphragm that vibrates with air flow is provided near the pressure relief valve, and the pressure relief valve deforms at a predetermined temperature. Equipped with a shape memory alloy that opens.

The heat-sensitive sensor according to claim (2) includes a balloon that is expanded by pressurizing gas, and a shape memory alloy that deforms and bursts the balloon at a predetermined temperature.

The heat-sensitive sensor according to claim (3) is provided with a shape memory alloy that deforms at a predetermined temperature, a reversal spring that performs a reversal action in response to the deformation of the shape memory alloy, and a vibration that responds to the reversal action of the reversal spring. It has a body.

[Effect]

According to the configuration described in claim (1), when the shape memory alloy reaches a predetermined temperature, the shape memory alloy deforms and opens the pressure relief valve provided in the gas-sealed container whose internal pressure is different from the surrounding pressure. An airflow is generated, and this airflow causes the diaphragm to vibrate.

According to the configuration described in claim (2), when the temperature reaches a predetermined temperature, the shape memory alloy deforms and bursts the balloon that has been expanded by pressurizing gas.

According to the configuration described in claim (3), the shape memory alloy deforms when the temperature reaches a predetermined temperature, the reversing spring performs a reversing operation in response to this deformation, and the vibrating body responds to this reversing action.

〔Example〕

First example A thermal sensor according to a first embodiment of the present invention is shown in FIG.

FIG. 1(a) is a conceptual diagram of a heat-sensitive sensor used in a gas-insulated switchgear (GIS) or the like whose surroundings are surrounded by high-pressure gas.

This heat-sensitive sensor is equipped with a pressure relief valve 3 in a gas-sealed container l,
A diaphragm 4 that vibrates with airflow is provided near this pressure relief valve 3,
A shape memory alloy 2 that deforms at a predetermined temperature to open the pressure relief valve 3 is provided outside the gas-tight container 1.

FIG. 1(b) is an enlarged view of a main part of the heat-sensitive sensor shown in FIG. 1(a), showing a state in which the pressure relief valve 3 is open.

As shown in FIG. 1(b), the shape memory alloy 2
When the pressure relief valve 3 is opened by deformation, high-pressure gas flows from outside the gas-tight container l. At this time, the airflow A causes the diaphragm 4 to vibrate.

Then, as shown in FIG. 6, for example, the sound or vibration at this time is received by the receiving sensor 11, and the received signal is judged by the judging unit 12.

Note that FIG. 6 is a diagram showing an example of a configuration in which the heat-sensitive sensor of FIG. 1(a) is applied to a bus line of a gas insulated switchgear (GIS). In this case, the thermal sensor S1 is installed near the conductor connection portion 13 of the busbar conduit.

Further, the reception sensor 11 uses a vibration sensor or an ultrasonic sensor, and vibrations are transmitted through the outer shell and are transmitted to the reception sensor 1.
Reach 1. The determination unit 12 determines the frequency of the diaphragm 4 and the duration depending on the size of the gas-sealed container 1 in advance, and incorporates this into the determination algorithm to improve the detection accuracy (S/
It is possible to make a high judgment of N).

Second embodiment A heat-sensitive sensor according to a second embodiment of the present invention is shown in FIG.

FIG. 2 is a conceptual diagram of a heat-sensitive sensor used in a cubicle or the like surrounded by the atmosphere.

This heat-sensitive sensor consists of a gas-sealed container 1 filled with high-pressure gas.
A pressure relief valve 3 is provided in the pressure relief valve 3, a vibration plate 4 that vibrates with air flow is provided near the pressure relief valve 3, and a shape memory alloy 2 that deforms at a predetermined temperature to open the pressure relief valve 3 is provided inside the gas-sealed container l. .

In the heat-sensitive sensor configured as described above, when the shape memory alloy 2 is deformed at a predetermined temperature and the pressure relief valve 3 is opened, high pressure gas flows out from the inside of the gas-tight container l. The airflow at this time causes the diaphragm 4 to vibrate.

Then, for example, as shown in FIG. 7, the vibration sound at this time is received by the microphone lla, which is a receiving sensor, and the received signal is determined by the determination unit 12. Note that FIG. 7 is a diagram showing an example of a configuration in which the thermal sensor shown in FIG. 2 is applied to a cubicle. In this case, the thermal sensor S,
is installed near the main circuit conductor clamping part 14, and the output terminal of the microphone 11a is provided outside.

Third embodiment A third embodiment of the thermal sensor of the present invention is shown in FIG.

FIG. 3 is a conceptual diagram of a heat-sensitive sensor used in a cubicle or the like surrounded by the atmosphere, similar to the second embodiment.

This heat-sensitive sensor deforms the shape memory alloy 2 at a predetermined temperature, and when the knob 6 of the spray-type gas-filled container 5 filled with high-pressure gas is pressed, a pressure relief valve (not shown) opens. High pressure gas flows out. At this time, the diaphragm 4 vibrates due to the airflow.

Then, the vibration sound at this time may be received by the microphone 11a, as shown in FIG. 7, for example, as in the second embodiment.

Fourth example FIG. 4 shows a heat-sensitive sensor according to a fourth embodiment of the present invention.

Figure 4 shows the 2. FIG. 7 is a conceptual diagram of a heat-sensitive sensor used in a cubicle or the like surrounded by the atmosphere, similar to the third embodiment.

This heat-sensitive sensor includes a balloon 7 inflated by pressurizing gas, and a shape memory alloy 28 that deforms and bursts the balloon 7 at a predetermined temperature.

In this heat-sensitive sensor configured as described above, the shape memory alloy 2a is deformed at a predetermined temperature, and the balloon 7 is bursted by the needle-shaped tip of the shape memory alloy 2a. The plosive sound at this time is the second one. As in the third embodiment, the signal may be received by the microphone 11a, as shown in FIG. 7, for example.

Fifth embodiment A heat-sensitive sensor according to a fifth embodiment of the present invention is shown in FIG.

This heat-sensitive sensor uses a shape memory alloy 2 that deforms at a predetermined temperature.
A reversing spring 8 that performs a reversing operation in response to the deformation of the shape memory alloy 2 is provided, and a tuning fork 9 is provided as a vibrating body that responds to the reversing action of the reversing spring.

In the heat-sensitive sensor configured as described above, the shape memory alloy 2 is deformed at a predetermined temperature and the reversal spring 8 is reversed, so that the tuning fork 9
Hit. By simply pressing the tuning fork 9, a sound of a certain frequency is output. This sound of a certain frequency may be received by a microphone lla, for example, as shown in FIG.

As described above, according to the first to fifth embodiments, by extracting the output of the thermal sensor as vibration or sound,
Wiring for extracting the output signal can be made unnecessary.

〔Effect of the invention〕

By extracting the output signal as vibration or sound, the thermal sensor of the present invention can eliminate the need for wiring for extracting the output signal.

[Brief explanation of drawings]

FIG. 1(a) is a conceptual diagram of a heat-sensitive sensor according to a first embodiment of the present invention, FIG. 3 is a conceptual diagram of a thermal sensor according to a third embodiment of the present invention, FIG. 4 is a conceptual diagram of a thermal sensor according to a fourth embodiment of this invention, and FIG. 5 is a conceptual diagram of a thermal sensor according to a fourth embodiment of this invention. Conceptual diagram of the thermal sensor according to the embodiment, No. 6
Figures 1 and 7 show examples of application of the heat-sensitive sensor according to the present invention.・・・Spray type gas filled container, 7... Balloon, 8... Reversing spring,
9... Tuning fork, S..., S2... Thermal sensor Fig. 1 (a) Fig. Shape/Plenary drawing

Claims (3)

[Claims] (1) A pressure relief valve is provided in a gas-sealed container with an internal pressure different from the surrounding pressure, a diaphragm that vibrates with air flow is provided near this pressure relief valve, and a shape memory alloy is provided that deforms at a predetermined temperature to open the pressure relief valve. Thermal sensor. (2) A heat-sensitive sensor including a balloon inflated by pressurizing gas, and a shape memory alloy that deforms and bursts the balloon at a predetermined temperature. (3) A heat-sensitive sensor that includes a shape memory alloy that deforms at a predetermined temperature, a reversal spring that performs a reversal action in response to the deformation of the shape memory alloy, and a vibrator that responds to the reversal action of the reversal spring.