JPH04134898A - Cutting of printed wiring board - Google Patents

Abstract

PURPOSE:To improve efficiency and accuracy by laminating a plurality of substrate sheets, inserting a stack pin into a pin hole, and carrying out outline working. CONSTITUTION:A T-shaped stack pin is fixedly inserted into a pin hole 80 on a substrate sheet on a work table. The outside periphery of a printed wiring board 81 is cut down by router work. A pin suspension section 812 of each discrete piece is arranged to remain during cut down operation. Then, the stack pin is removed and isolated for every substrate sheet 8. After the isolation, the pin suspension section 812 of the substrate sheet 8 is cut down so as to produce a discrete substrate. This construction makes it possible to improve efficiency and accuracy and carry out outline working.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention continuously and efficiently cuts individual substrates from a large number of substrate sheets. This invention relates to a method for cutting printed wiring boards.

[Prior art]

As shown in FIGS. 17 to 20, two to six printed wiring boards 81 are provided in the substrate sheet 8 to be separated into one piece. Each printed wiring board 81 also has a pin hole 810 for positioning and fixing used when cutting into a single piece board.
It has 2 to 4.

Further, the substrate sheet 8 has 2 to 6 pin holes 80 for positioning and fixing, which are used during the cutting, on the outside of the printed wiring board 81.

The substrate sheet 8 is positioned and fixed on the base 9 before being cut into printed wiring boards 81.

The base 9 also has the positioning and fixing pin holes 80, 8.
It has a number of pins 90,91 for inserting 10.

Further, the substrate 9 has a large number of pin holes 92 for erecting pins 90 and 91.

Therefore, when cutting the board sheet 8 into the printed wiring Fi81, the two positioning and fixing pin holes 80.810 are inserted into the pins 90.91 of the machine base 9.

Then, with the substrate sheet 8 positioned and fixed on the two bases 9, the peripheral edge of the printed wiring board 81 is cut using a router or the like.

[Issue to be solved] However, the above-mentioned conventional technology has a first-order problem.

That is, in positioning and fixing the substrate sheet 8 on the base 9, a large number of pins 90 and 91 are used.

It must be installed upright in the pin hole 92.

In order to erect the pins 90 and 91, if the size of the board sheet or the size of the individual board (printed wiring board 81) differs, the pins must be removed and inserted each time. is done manually. Therefore, the work of removing and inserting the pins 90 and 91 is complicated and time-consuming.

As a result, the cutting operation cannot be performed until the pin erecting operation is completed, resulting in idle time such as waiting time, which impairs work efficiency.

The present invention has been made in view of the above-mentioned eight points in the prior art, and it is possible to continuously and efficiently cut individual substrates from a substrate sheet. The present invention aims to provide a method for cutting printed wiring boards.

(Means for Solving the Problems) The present invention stacks a plurality of substrate sheets, inserts stack pins having approximately the same diameter as the pin holes and a T-shaped cross section into the pin holes of these substrate sheets, and then places them on a processing table. In the fixed state, the outer shape of each piece was processed while leaving the hanging pin portion, and then the stack pins were removed and each board sheet was separated.

Thereafter, the method for cutting a printed wiring board is characterized in that the hanging pin portions of each board sheet are cut to separate the boards into individual boards.

What is most noteworthy about the present invention is that a plurality of substrate sheets are stacked, stack pins with a T-shaped cross section are inserted into the pin holes of these substrate sheets, and the outer shape is processed with the suspension pin portion of each piece remaining. Then, each substrate sheet is separated, and then the hanging pin portions of each substrate sheet are cut to obtain individual substrates.

The substrate sheet has pin holes having substantially the same shape as the stack pins at the four corners of the two peripheral edges. The board notebook has a large number (for example, 2 to 30) of printed wiring boards to be cut into pieces in its center.

On the other hand, the stack pin has a T-shaped cross section and consists of a head and a shaft. The head has various shapes such as circular, square, and rectangular, and the shaft part is one
~Several bottles are installed.

The hanging pin portion is a portion of the peripheral edge of the printed wiring board that is left uncut when the outer shape is processed using a router or the like. That is, the hanging pin portion is a remaining portion formed on two to four sides of the printed wiring board, and is a locking piece for fixing the printed wiring board to the board sheet. Moreover, by the above-mentioned external processing, an abbreviated cut gap is formed around the printed wiring board in a portion other than the hanging pin portion (see FIG. 4).

When cutting the substrate sheet into individual substrates, the stack pins are removed from the pin holes, each substrate sheet is separated, and the hanging pin portions are cut.

[Action and effect]

In the present invention, first, a plurality of substrate sheets (for example, three
) Overlap. Next, stack pins are inserted into the pin holes of these substrate sheets. Thereafter, while these are fixed on the processing table, the outer shape of the printed wiring board to be cut into pieces is processed around the periphery of the printed wiring board, leaving hanging pin portions (see FIG. 4).

In this way, the outer shape of the substrate sheet is processed by stacking three sheets and inserting stack pins, so that the outer shape can be efficiently and precisely processed.

Next, the stack pins are removed to separate each substrate sheet, and the hanging pin portions of each substrate sheet are cut to separate them into individual pieces. As a result, individual substrates as printed wiring boards can be obtained continuously and efficiently.

Moreover, since the stack pin has a T-shaped cross section,
It is easy to insert into the pin hole of stacked substrate sorting, and the substrate sheet can be firmly fixed after insertion. Further, the stack pin can be easily removed from the pin hole of the board notebook.

Therefore, according to the second aspect of the present invention, it is possible to provide a printed wiring board cutting method that can cut individual boards more continuously and efficiently than a board sheet.

[Example] A method for cutting a printed wiring board according to an example of the present invention will be described with reference to FIGS. 1 to 16.

As shown in FIGS. 1 to 6, the cutting method of this example includes a center creation step 2 in which three board sheets 8 (FIG. 2) are stacked and stack pins l are inserted, and printed wiring of the board sheets 8. An external shape processing step 3 for cutting the periphery of the plate 81 and forming the hanging pin portion 812, a substrate sheet separation step 4 for extracting the stack pins 1 from the substrate sheet 8 and separating them one by one, and each substrate sheet. Hanging pin part 8 in 8
This consists of a singulation cutting step 5 in which the pieces 12 are cut into pieces. After that, a washing step 6 and a drying step 61 are performed.

Further, the conveyance of the substrate sheet to each of the above steps is performed by the held controller 7.

That is, if this is explained in detail, as shown in FIG.

Three substrate sheets 8 are stacked, and stack pins 1 having approximately the same diameter as the pin holes 80 and a T-shaped cross section are inserted into the pin holes 80 of these substrate sheets 8. Note that a waste plate 83 is disposed below the substrate sheet 8, and a processing table 84 having pin holes 840 is disposed below it.

After that, as shown in Fig. 4, these are placed on the processing table 8.
4, the outer periphery of the printed wiring board 81 is cut by router processing. At this time,
The suspension pin portion 812 of each piece remains.

Next, as shown in the fifth session, the stack pins 1 are removed and each substrate sheet 8 is separated, and then the hanging pin portion of each substrate sheet 8 is cut to separate the substrates into individual pieces.

As a result, a printed wiring board 8I as a two-piece board is obtained as shown in FIG.

As shown in FIG. 2, four printed wiring boards 81 are provided on the substrate sheet 8. As shown in FIG. Then, the substrate sheet 8
has positioning and fixing pin holes 80 at each of the four corners. Further, each printed wiring board 81 has a conductor circuit 81
1 respectively.

The positioning and fixing pin hole 80 is the stack pin 1.
It has a shape with approximately the same diameter. Moreover, the stack pin 1 is
As shown in FIG. 13, it consists of a two-circular head 11 and a shaft 10 extending downward from the head 11. Further, the shaft portion 10 has an inverted V-shaped locking groove at its tip. The circular head 11 and the shaft portion 10 have a T-shaped cross section.

The hanging pin portions 812 are each formed as a substantially square locking piece at the center of each of the four sides of the printed wiring board 81, as shown in FIG.

As shown in FIGS. 5 and 10, the hanging pin portion 812 is cut into one substrate sheet 8 using a cutting tool I! 51. This results in
As shown in FIG. 6, four printed wiring boards 81 as a single piece board can be obtained at the same time.

Next, the apparatus used in the above cutting method will be explained. First, in the set production step 2, a substrate sheet set production apparatus 2A is used as shown in FIG. The substrate sheet set manufacturing apparatus 2A is.

It consists of a suction machine 21 and a pin press-fitting machine 22.

That is, the substrate sheet 8 sent from the F direction by the belt conveyor 7 is sucked by the suction pad 211. Then, the substrate sheet 8 is lifted up by the lifting device 212. Further, the substrate sheet 8 is sent to the pin press-fitting machine 22 side.

Next, as shown in FIG. 3, three of the substrate sheets 8 are stacked in the pin press-fit @22. Then, as shown in FIG. 7, the stack pin 1 is inserted into the pin 41!2.
21, it is inserted into the positioning and fixing pin hole 80 of the substrate sheet 8. As a result, the substrate sheet 8 is
The sheets are stacked and fixed in one position, and assembled into a set for external processing.

Next, the first set of substrate sheets 8 is sent to the contour processing machine 3A through the belt converter No. 7, as shown in FIG. After the set of substrate sheets 8 is transported in the G direction, the outer shape is processed by the drills 33 of the processing machines 31 and 32, respectively. That is, as shown in FIG. 4, the peripheral edges of the four corners of the printed wiring board 81 are each cut into an oval shape.

Further, hanging pin portions 812 serving as substantially square locking pieces are formed on the four sides of the printed wiring board 81. Furthermore, an abbreviated cutting gap 813 is formed in a portion other than the hanging pin portion 812.

Next, the set of the substrate sheets 8 that have undergone the contour processing are as follows:
As shown in FIG. 9, the belt conveyor 7 sends the substrate sheet to the substrate sheet separator 4A. and.

The stack pin 1 is extracted upward by a pin extraction device 41 having a lifting device 42, as shown in FIG.

Then, the substrate sheets 8 are separated one by one by a suction device 44 having a suction pad 441. As shown in FIG. 1O, the substrate sheets 8 are sent one by one by a heat converter 7 to a cutting machine 5A into two pieces. Then, the substrate sheet 8 is transferred in the H direction and cut into pieces by the singulation cutting machine 5A. Thereby, as shown in FIGS. 5 and 6, the printed wiring board 81 is cut into three pieces by the cutting machine 51 having the hanging pin portion 812 and a cutter.

By the way, when processing the outer shape of the substrate sheet 8 as described above, as shown in FIG.
The stack pin 1 is inserted into the hole and these are fixed to the processing table 84 together with the waste plate 83. The stack pin 11 is inserted by the pin press-fitting machine 2A.

That is, when inserting the stack pin 1 into the pin hole 80 for positioning and fixing by the pin press-fitting machine 2A, the first
As shown in FIGS. 1 and 12, a spring 85 and a guide pin 12 were inserted into the pin hole 840. A processing table 84 can be used.

A waste plate 83 is placed on the processing table 84. The waste plate 83 has a pin 6 830 having the same diameter as the pin 6 840 described above. A spring spring 85 is disposed below the guide pin 2 to support the guide pin 12 and move the guide pin 12 up and down with a biasing force.
Instead of the spring spring 85, an elastic structure such as rubber, porous foamed resin, or a pneumatic actuator may be used. The guide pin 12 also has a conical locking head 121 at its upper end. The locking head 121 is for engaging with the inverted V-shaped locking groove 101 provided at the lower end of the stack pin l.

Therefore, when inserting the stack pin l into the positioning and fixing pin hole 80 of the substrate sheet 8, the seventh
As shown in the figure, first, the pin insertion machine 221 holding the stack pin 1 is lowered.

Then, the locking groove 101 at the lower end of the stack pin l is engaged with the locking head 121 of the guide pin 12 to bring the two pins into contact and connect them. Next, the stack pin 1 is press-fitted into the positioning and fixing pin 80 by further pushing down both pins using the pin insertion machine 221.

Thereby, as shown in FIG. 12, the stack pin 1 is easily fixed in the positioning and fixing pin hole 80. Therefore, the stack pin 1 can accurately position and fix the three substrate sheets 8 on the processing table 84.

Further, the guide pin 12 has the function of guiding the insertion of the stack pin 1 when the stack pin 1 is inserted, and has the function of pushing out the stack pin 1 when the stack pin 1 is removed.

Further, the stack pin 1 is 1 as shown in FIG.
A shaft portion 1 (l) having a circular head 11 and a locking groove 101 was used.

Furthermore, the stack pin 1 has heads of various shapes at the upper end, as shown in FIGS. 14 to 16.

On the other hand, it is also possible to use a device having a convex curved end portion 102 at the lower end. Further, the shape of the lower end can be made concave as shown in FIG. 13 above.

First, the stack pin 1 shown in FIG. 14 has a square head 131 and one shaft 10. Further, the stack pin l shown in FIG. 15 has a rectangular head 141 and two shaft parts 10, 10, and can hold one substrate sheet widely.

Further, the stack pin 1 shown in FIG. 16 has a substantially square frame-shaped head 151 and four shaft portions 10.10, 10.10.

Thereby, the entire circumference of the substrate sheet can be widely held.

As described above, in the cutting method of the nine examples, first, three substrate sheets 8 are stacked. Next, the stack pins 1 are inserted into the positioning and fixing pins 8o of these substrate sheets 8. Thereafter, with these pieces fixed on the processing table 84, the printed wiring board 8 to be cut into two pieces as shown in FIG.
1, the outer shape is processed with the hanging pin 812 remaining.

Therefore, external shape processing can be performed efficiently and accurately.

Next, the two stack pins 1 are extracted and each board sheet is separated, and the hanging pins 812 of each board sheet 8 are cut to separate the boards into individual pieces, thereby efficiently and continuously producing individual boards as printed wiring boards 81. Obtainable. Further, since the stack pin 1 has a T-shaped cross section, it can be easily inserted into the pin hole of one stacked substrate sheet, and can firmly hold the substrate sheet. Further, it is easy to take out the stack pin.

Thus, according to one example, four printed wiring boards 8
1, individual substrates can be cut continuously and efficiently and accurately.

[Brief explanation of the drawing]

1 to 16 show a method for cutting a printed wiring board according to an embodiment of the present invention, FIG. 1 is a conceptual diagram of the process, and FIG.
The figure is a plan view of the substrate sheet, FIG. 3 is a cross-sectional view of a set of stacked substrate sheets, FIG. 4 is a plan view of the substrate sheet that has been contoured, and FIG. 5 is a plane view of the substrate sheet that has been cut into pieces. Figure 6 is a plan view of the printed wiring board that has been separated into pieces.
Figure 8 is a side view of the set creation device, Figure 8 is a side view of the contour processing machine, Figure 9 is a side view of the substrate sheet separation machine, Figure 10 is a side view of the singulation cutting machine, Figures 11 and 11 are FIG. 12 is an explanatory diagram showing the stack pin insertion process, and FIGS. 13 to 16 are perspective views of various stack pins. Figures 17 to 20 show conventional examples, and the 17th and 1st
FIG. 9 is a plan view of the substrate sheet, and FIGS. 18 and 20 are side views of the base on which pins are erected. Stack tweezers creation process. External shape processing process Substrate sheet separation process. Singulation cutting process belt conveyor substrate sheet. 80.81 81,. 812,. 2A... 3A... 4A... A 0991 Pin hole printed wiring board for positioning and fixing, hanging pin part set creation device, external shape processing machine. Substrate sheet separation machine singulation cutting machine

Claims (1)

[Claims] While stacking a plurality of substrate sheets, stack pins having approximately the same diameter as the pin holes and a T-shaped cross section are inserted into the pin holes of these substrate sheets, and then these are fixed to a processing table. The external shape of each individual piece is processed with the hanging pin part left in place, then the stack pins are removed and each board sheet is separated, and the hanging pin part of each board sheet is cut and separated into individual pieces. A method for cutting a printed wiring board, characterized by: