JPH0415608B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sintered plate used to obtain chip-shaped electronic components, a method for manufacturing the same, and a manufacturing apparatus for the same.

Chip-shaped electronic components such as chip-shaped capacitors, resistors, inductances, and thick-film IC substrates can be easily made smaller and larger in capacity, and can be directly bonded to a flat conductive pattern, meeting the requirements for high-density packaging. It has excellent features such as exhibiting excellent frequency characteristics up to high frequencies, and having a uniform external shape that allows for automatic mounting and assembly when mounted on printed circuit boards, etc.
As an important component that plays a role in the development of thick-film ICs and modular circuits, they are being widely used in various electronic devices such as computers, communication devices, television receivers, electronic watches, and calculators.

This type of electronic component is, for example, 3.2×1.6×0.6m/
It is normal for the parts to be microscopic, about 1.5 m in size, and are too small to be handled as a single item from the beginning to the end of manufacturing. Therefore, in order to facilitate manufacturing and increase production efficiency, as shown in FIG. By providing a shape in a shape and subdividing it along the dividing grooves 2 and 3 after sintering, a pre-formed region Q ₁ , Q ₂ . . . is divided by the grooves 2 and 3. A sintered plate from which each electronic component element can be taken out has been proposed.

However, as shown in FIG. 2, in the conventional sintered plate, the dividing grooves 2 and 3 were V-shaped with a small opening angle θ, so when divided along the grooves 2 and 3, As shown in FIG. 3, the edges of the grooves 2 and 3 become sharp. For this reason, if end electrodes are applied when obtaining chip-shaped capacitors, etc., the thickness of the electrode coating on the edge parts decreases, resulting in electrode breakage, poor solderability, or sticking. There were some drawbacks such as: In order to eliminate these defects, conventionally each electronic component after being separated was subjected to barrel polishing treatment, and the edge parts were polished to give them a rounded shape, but this increased the number of steps and reduced production efficiency. This caused problems such as a decline in performance. Moreover, conventionally, the grooves 2 and 3 for division were provided only on one surface of the sintered plate 1, so when dividing along the grooves 2 and 3, the grooves 2 and 3
A burr as shown by B in FIG. 3 is generated on the other side without the number 3. As a result, dimensional errors occur in each divided electronic component, resulting in a decrease in yield, and there are also disadvantages such as electrode breakage, poor solderability, and sticking of the end electrodes as described above. . Conventionally, as a means for removing this barillo, barrel polishing was performed on each electronic component after being divided, and the bariro was removed along with the edge portions. However, since the size and shape of Bariro vary for each electronic component, it has been extremely difficult to polish them to the same size.

The present invention eliminates the above-mentioned conventional drawbacks, and is suitable for obtaining electronic components that have smooth edges, do not generate burrs, omit the barrel polishing process, and increase productivity and yield. The object of the present invention is to provide a sintered plate, a method for manufacturing the same, and a manufacturing device for the same.

In order to achieve the above object, a sintered plate according to the present invention is a sintered plate having a dividing groove on a surface in the thickness direction, and the groove is located above the cutting edge having a V-shaped tip. The blade is formed by pressing, in the state of a green sheet, a blade in which another blade part having an opening angle larger than the opening angle of the cutting edge is pressed against the blade, and the tip part is V-shaped; and an opening formed by a slope extending from both slopes constituting the tip to the substrate surface, and an opening angle between both slopes constituting the opening is equal to both slopes constituting the tip. It is characterized by being larger than the opening angle between the two.

Furthermore, in the manufacturing method according to the present invention for manufacturing the above-mentioned sintered body, a blade is pressed against the green sheet at opposing positions on both sides of the green sheet in the thickness direction to form dividing grooves. A method for producing a sintered plate in which the green sheet is fired and sintered after being formed, wherein the blade has an opening angle above the cutting edge that is a V-shaped tip that is larger than the opening angle of the cutting edge. It is characterized in that another blade part is connected in series, and a concave groove is formed following the blade edge and the slope of the blade part.

Furthermore, the manufacturing apparatus according to the present invention is an apparatus for forming grooves for dividing on the surface of a flat green sintered body, and the manufacturing apparatus is an apparatus for forming grooves for dividing on the surface of a flat green sintered body, and the manufacturing apparatus comprises: The blade is characterized by having a blade in which another blade part having an opening angle larger than the opening angle of the cutting edge is connected.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples. FIG. 4 is a sectional view of a portion of the sintered plate according to the present invention. As shown in the figure, in the present invention, dividing grooves 2 and 3 are provided in a grid pattern on the surface of a sintered plate 1 formed into a flat plate using alumina porcelain, dielectric porcelain, ferrite, or the like. This is the same as before, but the shape of the dividing grooves 2 and 3 has an opening angle θ ₂ larger than this opening angle θ ₁ above the tip portion C which expands in a V shape with an opening angle θ ₁ . A major feature different from the conventional one is that it has a shape in which two openings are arranged in series.
Both slopes forming the opening angles θ ₁ and θ ₂ of the tip C and the opening D are planar shapes with different slope angles.

By providing the divided grooves 2 and 3 shaped like this,
When the electronic component is divided along the grooves 2 and 3, as shown in FIG. A single electronic component is obtained which has slopes C and D and has a divided cut surface E connected between the slopes C, K and D on both sides in the thickness direction. In this way, the electronic component according to the present invention is
The dividing surface side becomes a smoothly sloped surface, and unlike the conventional method, there is no sharp edge portion. Therefore, even when the end electrodes 4 and 5 as shown in FIG. 6 are provided on the split surface side without performing the barrel polishing process, the coating thickness of the electrodes becomes uniform. Therefore, according to the present invention, it is possible to provide a highly reliable electronic component that does not require a barrel polishing process, has high productivity, and does not cause electrode breakage, deterioration of solderability, hooking, etc. be able to.

The grooves 2 and 3 are formed by a blade in the state of a green sheet, which has a V-shaped tip with another blade part connected above the blade edge and having an opening angle larger than the opening angle of the cutting edge. do. A specific example of this blade will be described later. A groove 2 formed using such a blade,
3 has a fixed opening angle θ _{2 larger than this opening angle θ 1 above} the pointed end C which expands in a V shape with a constant opening angle θ _1.
Since the sintered plate has a predetermined shape in which the openings 2 and 3 are arranged in series, it is possible to provide a sintered plate of constant quality with very small variations in the dimensions of the grooves 2 and 3.

The dividing grooves 2 and 3 are provided at the same position on both sides of the sintered plate 1 in the thickness direction. With this structure, unlike the case where the grooves 2 and 3 are provided only on one side of the sintered plate 1, burrs are not generated on either side of the sintered plate 1 during division. This eliminates the need for a barrel polishing process to remove burrs, improving productivity.
Dimensional accuracy is higher and yield is improved.

Next, a method and apparatus for manufacturing the electronic component described above will be explained.

First, as shown in FIG. 7a, a green sheet 6 having a predetermined width and thickness is formed. This green sheet 6 can be made by printing a sinterable paste prepared by kneading sinterable powder such as porcelain powder or ferrite powder, an appropriate binder, and an appropriate amount of solvent using a doctor blade method, a roll coater method, or a screen printing method. It can be obtained by forming it into a sheet by a method such as a method. The green sheet 6 may have electrodes on its surface or inside depending on the structure of the electronic component that is the final product.

Next, as shown in FIG. 7b, before firing this green sheet 6, both sides 6 in the thickness direction are
A groove for dividing is formed on a and 6b using a blade 7. This blade 7, as shown enlarged in FIG.
It has a structure in which another blade portion 9 having a planar slope inclined at an opening angle θ _{2 larger than the opening angle θ 1 is} connected above the pointed cutting edge 8 having an opening angle θ ₁ . This blade 7 is attached to a green sheet 6 as shown in FIG. 7c.
By pushing the cutting edge 8 to the cutting edge 9 into the surfaces 6a and 6b, a dividing groove having a shape as shown in FIG. 4 is formed. Thereafter, the electronic component shown in FIG. 4 is obtained by firing and sintering the green sheet 6 according to a conventional method.

The appropriate opening angle θ ₁ of the cutting edge 8 is 10°≦θ ₁ ≦20°, and the appropriate opening angle θ ₂ of the blade portion 9 is within the range of 30°≦θ ₂ ≦50°. Also, the length L ₁ of the cutting edge 8 is
Approximately 50 μm is appropriate.

As described above, according to the present invention, the following effects can be obtained.

(a) A sintered plate having grooves for dividing on the surface in the thickness direction, where the grooves are formed by a V-shaped tip and slopes extending from both slopes forming the tip to the substrate surface. Since the opening angle between the two slopes forming the opening is larger than the opening angle between the slopes forming the tip, the dividing surface is smooth. , there are no edges or burrs, and the barrel polishing process is omitted, increasing productivity and yielding highly reliable electronic components.

(b) The concave groove is created by pressing a blade in the form of a green sheet above the V-shaped tip with another blade part having an opening angle larger than the opening angle of the cutting edge. Because it was formed,
It is possible to provide a sintered plate of constant quality with small variations in each dimension of the concave grooves.

(c) In the manufacturing method according to the present invention, blades are pressed against opposing positions on both sides of the green sheet in the thickness direction to form dividing grooves, and then the green sheet is fired. A method for manufacturing a sintered plate by sintering, wherein the blade has a V-shaped pointed tip with another blade part having an opening angle larger than the opening angle of the cutting edge connected above the cutting edge. ,
Since the concave grooves are formed to follow the cutting edge and the slope of the blade portion, it is possible to efficiently manufacture a sintered plate having the concave groove structure.

(d) The manufacturing device according to the present invention has a blade having a V-shaped tip with another blade part having an opening angle larger than the opening angle of the cutting edge above the cutting edge. , it is possible to provide a manufacturing apparatus suitable for realizing the above-described sintered plate and manufacturing method.

[Brief explanation of drawings]

FIG. 1 is a plan view of a conventional electronic component, FIG. 2 is an enlarged cross-sectional view of the main part, FIG. 3 is an end view for explaining the drawbacks thereof, and FIG. 4 is an electronic component according to the present invention. FIG. 5 is a cross-sectional view of the divided strip, FIG. 6 is a cross-sectional view for explaining the effect thereof, and FIGS. 7 a to d are views for explaining the manufacturing method according to the present invention. , FIG. 8 is a front view of the main part of the blade constituting the manufacturing apparatus according to the present invention. 1... Sintered plate, 2, 3... Concave groove for division, H...
...Point, D... Opening, E... Divided cut surface.

Claims (1)

[Scope of Claims] 1. A sintered plate having a groove for dividing on a surface in the thickness direction, wherein the groove is located above the cutting edge, which has a V-shaped tip, and is wider than the opening angle of the cutting edge. It is formed by pressing a blade with another blade part with a large opening angle in a green sheet state, and a V-shaped tip part and both slopes forming the tip part are attached to the substrate. an opening formed by a slope connected to the surface, and an opening angle between both slopes forming the opening is larger than an opening angle between both slopes forming the tip. A sintered board characterized by: 2. A method for producing a sintered plate in which a blade is pressed against a green sheet before firing at opposing positions on both sides in the thickness direction to form dividing grooves, and then the green sheet is fired and sintered. The blade has a V-shaped tip and is connected with another blade part having an opening angle larger than that of the cutting edge, and the blade has the blade edge and the slope of the blade part. A method for manufacturing a sintered plate, characterized by forming grooves according to the following. 3. A device for forming grooves for dividing on the surface of a flat green sintered body, the device having a diameter larger than the opening angle of the cutting edge above the cutting edge having a V-shaped tip. A sintered board manufacturing device characterized by having a blade in which another blade part having an opening angle is connected.