JPH04268273A - Tape guide block of magnetic tape cassette - Google Patents
Tape guide block of magnetic tape cassetteInfo
- Publication number
- JPH04268273A JPH04268273A JP3014791A JP3014791A JPH04268273A JP H04268273 A JPH04268273 A JP H04268273A JP 3014791 A JP3014791 A JP 3014791A JP 3014791 A JP3014791 A JP 3014791A JP H04268273 A JPH04268273 A JP H04268273A
- Authority
- JP
- Japan
- Prior art keywords
- guide block
- plating
- tape guide
- tape
- magnetic tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 description 21
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【0001】0001
【産業上の利用分野】本発明はアナログ記録、デジタル
記録に使われる磁気テープカセットのテープガイドブロ
ックに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape guide block for a magnetic tape cassette used for analog recording and digital recording.
【0002】0002
【従来の技術】従来、特開昭59−124072号公報
に記載されているようにテープガイドブロックをセラミ
ック材で形成することによりガイド部の垂直性、摩擦特
性、剛性等を改善しようとしたものが知られていた。あ
るいは特開昭59−124073号公報に記載されてい
るようにテープガイドブロックをセラミック材と合成樹
脂との複合材で形成することによりテープガイド部の垂
直性、耐摩耗性を改善しようとしたものが知られていた
。[Prior Art] Conventionally, as described in Japanese Unexamined Patent Publication No. 59-124072, an attempt has been made to improve the perpendicularity, frictional characteristics, rigidity, etc. of the guide portion by forming a tape guide block from a ceramic material. was known. Alternatively, as described in Japanese Patent Application Laid-Open No. 59-124073, an attempt was made to improve the perpendicularity and abrasion resistance of the tape guide section by forming the tape guide block from a composite material of ceramic material and synthetic resin. was known.
【0003】0003
【発明が解決しようとする課題】しかし、かかる従来の
技術は以下に述べるようにそれぞれ大きな問題点を有し
ており実用上、あるいは工業的な製造上の課題となって
いた。先ず特開昭59−124072号公報に記載され
ている方式は焼結など複雑な工程を必要とするファイン
セラミクスでガイドブロックを形成するため加工自体が
手間のかかるものになり、結局大変高価なものについて
しまうという問題点を有している。[Problems to be Solved by the Invention] However, each of these conventional techniques has major problems as described below, which pose problems in practical or industrial production. First, the method described in JP-A-59-124072 forms the guide block using fine ceramics, which requires complex processes such as sintering, which makes the processing itself time-consuming and ultimately very expensive. It has the problem that it sticks.
【0004】次に特開昭59−124073号公報に記
載されている方式はセラミックの粉体を樹脂に混ぜ合わ
せ、これを例えば射出成形することでガイドブロックを
形成しているものである。しかしこの場合は例えばSi
CやAl2O3等のセラミック粉が樹脂成形品から脱落
しやすいため長時間使用すると摩耗が起こり音楽などア
ナログ記録の場合は音質劣化を、コンピュータのデータ
等のデジタル記録の場合はデータ誤り率の悪化を招くと
いう問題点を有している。[0004] Next, the method described in Japanese Patent Application Laid-Open No. 124073/1980 involves mixing ceramic powder with resin and forming a guide block by, for example, injection molding the mixture. However, in this case, for example, Si
Ceramic powders such as C and Al2O3 tend to fall off from resin molded products, which causes wear and tear when used for long periods of time, resulting in deterioration of sound quality in the case of analog recording such as music, and worsening of the data error rate in the case of digital recording such as computer data. It has the problem of inviting people.
【0005】そこで、本発明は時に耐摩耗性、垂直性、
耐熱性の高いテープガイドブロックを工業的に極めて安
価に製造する方法を提供することにより信頼性が高く寿
命の永い磁気テープカセットを安価で提供することを目
的とする。[0005] Therefore, the present invention sometimes improves wear resistance, perpendicularity,
An object of the present invention is to provide a highly reliable and long-life magnetic tape cassette at a low cost by providing a method for industrially manufacturing a highly heat-resistant tape guide block at a very low cost.
【0006】[0006]
【課題を解決するための手段】本発明の磁気テープカセ
ットのテープガイドブロックは、表面の全面あるいはそ
の一部にセラミックコンポジットメッキを施したことを
特徴とする。[Means for Solving the Problems] The tape guide block of the magnetic tape cassette of the present invention is characterized in that the entire surface or a portion thereof is plated with ceramic composite.
【0007】[0007]
【実施例】以下、本発明の実施例について詳述する。図
1は本発明の一実施例を示す一部断面斜視図であり、ガ
イドブロック本体1にはテープガイド部2a〜2dが設
けられている。実際の磁気テープカセットでは磁気テー
プ3の裏面(非記録面)が前記テープガイド部2a〜2
dと接触しながら送られ、記録・再生あるいは巻き取り
が行なわれることになる。昨今では記録密度や耐久性な
どのテープ性能向上に伴いポリエステルなどの磁気テー
プ素材の裏面(非記録面)に硬質樹脂コーティングを施
す例が増えており、従って前記テープガイド部の摩耗量
は大幅に悪化する傾向がみられる。そのためガイドブロ
ック体1の形状を形成する樹脂成形品5の表面にはSi
CやBNなどのコンポジットメッキ4が施されている。
前記樹脂成形品5に使われる樹脂としてはABS、PC
、PPE、POM、PA、PBTあるいは液晶ポリマー
などメッキを施しやすくかつ形状寸法精度を高精度に成
形加工できるものが望ましい。ここではABS、液晶ポ
リマー、PCを使用したがこれ以外の樹脂でも使用可能
である。コンポジットメッキ4は無電解ニッケル・リン
のメッキ液にSiCなどのファインセラミックスの粉体
を混ぜ合わせた複合化学メッキにより形成した。上記コ
ンポジットメッキ4を形成するプロセスは以下のようで
ある。まず樹脂成形品5の表面を酸又はアルカリでエッ
チングし、水洗中和後にパラジウムのコロイド溶液に浸
漬させるキャタリスト処理を行なう。次に希塩酸などを
用いてアクセレータ処理を行ない前述のコロイドを金属
パラジウムに還元させる。以上の処理が済んだ樹脂成形
品5をコンポジット無電解メッキ槽に投入すれば上述の
金属パラジウムが触媒となりメッキ被膜が容易に形成さ
れる訳である。なおコンポジットメッキの前に通常の無
電解ニッケル・リンメッキあるいは無電解銅メッキを0
.1〜0.5μm付着させることによりコンポジットメ
ッキ処理の歩留りを向上させることが可能である。前述
のニッケル・リンメッキは基本的に非磁性であるがリン
の含有率に応じ残留磁気は変化して来る。この場合6〜
15%の含リン率が良好であった。通常のニッケルメッ
キやニッケル・ボロンメッキ、あるいはニッケル・コバ
ルト・リンメッキ等も残留磁気は高くなるが使用可能で
ある。なお、コンポジットメッキ4は無電解メッキ処理
だけでなく通常の電気メッキ処理にても同様の処理膜を
形成することが可能である。[Examples] Examples of the present invention will be described in detail below. FIG. 1 is a partially sectional perspective view showing an embodiment of the present invention, in which a guide block main body 1 is provided with tape guide portions 2a to 2d. In an actual magnetic tape cassette, the back side (non-recording side) of the magnetic tape 3 is connected to the tape guide portions 2a to 2.
The recording/playback or winding is performed while being fed while in contact with d. In recent years, with improvements in tape performance such as recording density and durability, hard resin coatings are increasingly being applied to the back side (non-recording side) of magnetic tape materials such as polyester, and as a result, the amount of wear on the tape guide section has been significantly reduced. There is a tendency for it to get worse. Therefore, the surface of the resin molded product 5 that forms the shape of the guide block body 1 is made of Si.
Composite plating 4 such as C and BN is applied. The resin used for the resin molded product 5 is ABS, PC
, PPE, POM, PA, PBT, or liquid crystal polymer, which are easy to plate and can be molded with high precision in shape and size are desirable. Although ABS, liquid crystal polymer, and PC were used here, other resins can also be used. Composite plating 4 was formed by composite chemical plating in which powder of fine ceramics such as SiC was mixed with an electroless nickel-phosphorus plating solution. The process for forming the composite plating 4 is as follows. First, the surface of the resin molded article 5 is etched with acid or alkali, washed with water, neutralized, and then immersed in a palladium colloidal solution for catalyst treatment. Next, an accelerator treatment is performed using dilute hydrochloric acid or the like to reduce the aforementioned colloid to metallic palladium. When the resin molded article 5 that has undergone the above treatment is placed in a composite electroless plating bath, the metal palladium mentioned above acts as a catalyst and a plating film is easily formed. In addition, before composite plating, normal electroless nickel/phosphorus plating or electroless copper plating is applied.
.. It is possible to improve the yield of composite plating processing by depositing 1 to 0.5 μm. The aforementioned nickel-phosphorus plating is basically non-magnetic, but the residual magnetism changes depending on the phosphorus content. In this case 6~
A phosphorus content of 15% was good. Ordinary nickel plating, nickel/boron plating, or nickel/cobalt/phosphorus plating can also be used, although the residual magnetism will be high. Note that the composite plating 4 can be formed in a similar manner not only by electroless plating but also by ordinary electroplating.
【0008】図2はコンポジットメッキ4の断面部分拡
大図である。ニッケル・リンの金属部40の中にファイ
ンセラミック粉41が共折しており、表面硬度はSiC
コンポジットでHv700〜800、BNコンポジット
でHv500程度と大変高い値を示す。従って磁気テー
プが接触しながら走行しても摩耗量はごく微量であり、
特開昭59−124072号公報に記載されている方式
と同等あるいはそれ以上の耐摩耗性を得ることができた
。FIG. 2 is a partially enlarged cross-sectional view of the composite plating 4. As shown in FIG. Fine ceramic powder 41 is co-fractionated in the nickel-phosphorus metal part 40, and the surface hardness is that of SiC.
The composite shows a very high value of Hv700 to 800, and the BN composite shows a very high value of about Hv500. Therefore, even if the magnetic tape runs in contact with the tape, the amount of wear is very small.
It was possible to obtain wear resistance equivalent to or higher than that of the method described in JP-A-59-124072.
【0009】図3はテープガイドブロックの種別による
比摩耗量を示すグラフである。Aは樹脂成形品を用いた
場合、Bは特開昭59−124073号公報に記載され
ているようなセラミックと樹脂の複合材で形成したもの
を用いた場合、Cは特開昭59−124072号公報に
記載されているようなセラミック材で形成したものを用
いた場合、Dは本発明の実施例を用いた場合のそれぞれ
の図1中の2a〜2d部に於ける比摩耗量を示すもので
ある。本発明によるテープガイドブロックは摩耗量も1
μm以下と大変少なく、従ってコンポジットメッキ自体
の膜厚も数ミクロンと少量で良いためメッキ加工時間も
数分〜数十分と短時間で終了させることができる。前述
の特開昭59−124072号公報に記載されている方
式は押し出し加工→一次焼結→切断→反応焼結という大
変長いプロセスを必要とするのに対し、本発明による方
式は射出成形→前処理→メッキという容易な工程で短時
間に大量に処理できるためその製造コストは極めて安価
になることが判った。FIG. 3 is a graph showing the specific wear amount depending on the type of tape guide block. A is when a resin molded article is used, B is when a composite material of ceramic and resin as described in JP-A-59-124073 is used, and C is when JP-A-59-124072 is used. When using a ceramic material as described in the above publication, D indicates the specific wear amount at parts 2a to 2d in FIG. 1 when using the embodiment of the present invention. It is something. The tape guide block according to the present invention has a wear amount of 1
Since the thickness of the composite plating itself is as small as a few microns, the plating time can be completed in a short time of several minutes to several tens of minutes. The method described in the above-mentioned Japanese Patent Application Laid-Open No. 59-124072 requires a very long process of extrusion → primary sintering → cutting → reaction sintering, whereas the method according to the present invention requires a very long process of extrusion → primary sintering → cutting → reaction sintering. It has been found that the manufacturing cost is extremely low because a large amount can be processed in a short time through a simple process of processing and then plating.
【0010】0010
【発明の効果】本発明は、以上説明したように磁気テー
プカセットのテープガイドブロック表面全面あるいはそ
の一部にセラミックコンポジットメッキを施したことに
よりテープガイド部の耐摩耗性、垂直性、耐熱性等を悪
化させることなくテープガイドブロックを極めて安価に
提供することを可能にするという大きな効果を有するも
のである。従って信頼性の高い、長寿命の磁気テープカ
セットの価格低減についても大いに寄与するものである
。[Effects of the Invention] As explained above, the present invention improves the abrasion resistance, perpendicularity, heat resistance, etc. of the tape guide portion by applying ceramic composite plating to the entire surface or a part of the tape guide block surface of the magnetic tape cassette. This has the great effect of making it possible to provide a tape guide block at an extremely low cost without deteriorating the quality. Therefore, it greatly contributes to reducing the cost of highly reliable and long-life magnetic tape cassettes.
【図1】本発明の一実施例を示す一部断面斜視図。FIG. 1 is a partially sectional perspective view showing an embodiment of the present invention.
【図2】本発明の一実施例の断面部分拡大図。FIG. 2 is a partially enlarged cross-sectional view of one embodiment of the present invention.
【図3】テープガイドブロックの種別による比摩耗量を
示すグラフ。FIG. 3 is a graph showing the specific wear amount depending on the type of tape guide block.
1 ガイドブロック本体 2a〜2d テープガイド部 3 磁気テープ 4 コンポジットメッキ 5 樹脂成形品 40 コンポジットメッキの金属部 41 ファインセラミック粉 1 Guide block body 2a-2d Tape guide part 3 Magnetic tape 4 Composite plating 5 Resin molded products 40 Composite plated metal part 41 Fine ceramic powder
Claims (1)
コンポジットメッキを施したことを特徴とする磁気テー
プカセットのテープガイドブロック。1. A tape guide block for a magnetic tape cassette, characterized in that the entire surface or a portion thereof is plated with ceramic composite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3014791A JPH04268273A (en) | 1991-02-25 | 1991-02-25 | Tape guide block of magnetic tape cassette |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3014791A JPH04268273A (en) | 1991-02-25 | 1991-02-25 | Tape guide block of magnetic tape cassette |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04268273A true JPH04268273A (en) | 1992-09-24 |
Family
ID=12295654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3014791A Pending JPH04268273A (en) | 1991-02-25 | 1991-02-25 | Tape guide block of magnetic tape cassette |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04268273A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007197831A (en) * | 2006-01-26 | 2007-08-09 | Hamilton Sundstrand Corp | Coating for improving the wear performance of an article and method for coating an article |
-
1991
- 1991-02-25 JP JP3014791A patent/JPH04268273A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007197831A (en) * | 2006-01-26 | 2007-08-09 | Hamilton Sundstrand Corp | Coating for improving the wear performance of an article and method for coating an article |
| JP2010270402A (en) * | 2006-01-26 | 2010-12-02 | Hamilton Sundstrand Corp | Coating for improving wear performance of article and coating method of article |
| US8246807B2 (en) | 2006-01-26 | 2012-08-21 | Hamilton Sundstrand Corporation | Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance |
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