JPH0432780Y2 - - Google Patents

Description

[Detailed explanation of the idea] [Industrial application field] This invention relates to a printed circuit board.

[Summary of the invention] This invention is based on a printed circuit board on which leadless chip parts such as capacitors, resistors, transistors, etc. as electronic parts are mounted. A second substrate having a pattern exposed in the vertical hole is attached to at least one side of the first substrate, an electronic component is inserted into the vertical hole of the first substrate, and the electronic component is attached to the second substrate. By supporting and connecting the electronic components on the pattern, it is possible to prevent the electronic components from falling off when mounting the electronic components on the printed circuit board, making it possible to easily perform the mounting work of the electronic components.

[Prior Art] In the case of a printed circuit board on which a large number of leadless chip components (electronic components) are mounted, a number of vertical holes are formed in the board, and the leadless chip components are buried in each of these vertical holes and then printed. Efforts are being made to make the substrate smaller and more dense. This will be explained with reference to FIG. 11. Reference numeral 2 indicates a hard substrate, and this hard substrate 2 has a vertical hole 2a formed therein. This vertical hole 2a
An adhesive 19 is applied to the inner circumferential surface of the leadless chip component 3 or the outer circumferential surface of the leadless chip component 3 to be inserted into the vertical hole 2a. Further, connection lands 5 are fixed to both surfaces of the hard substrate 2 so as to sandwich the vertical hole 2a.

In the printed circuit board configured as described above, the hard substrate 2
When attaching leadless chip part 3 to
First, the leadless chip component 3 is inserted into the vertical hole 2a of the hard substrate 2 and temporarily fixed with adhesive 19. Next, the electrodes 3a at both ends of the leadless chip component 3 and the connection land 5 are connected by soldering (this soldered part is indicated by reference numeral 12) using an automatic soldering device (not shown). ing.

[Problems to be solved by the invention] In order to prevent the leadless chip component 3 from falling off during soldering in the post-process described above, adhesive 19 is applied to the inner circumferential surface of the vertical hole 2a of the hard substrate 2, etc. The work was complicated and required special means.

In addition, if the adhesive 19 is not completely cured, the insertion position of the leadless chip component 3 is likely to shift, and if soldering etc. is performed in this state, the connection position of the leadless chip component 3 will vary, resulting in a highly accurate There was a problem where printed circuit boards could not be obtained.

Furthermore, when the adhesive 19 is completely cured, the leadless chip component 3 is bonded to the vertical hole 2a of the hard board 2, so if it becomes necessary to replace the leadless chip component 3 after soldering, the leadless chip component 3 can be easily replaced. Restip parts 3 could not be replaced, making repair service difficult.

Therefore, the present invention provides a printed circuit board that can prevent electronic components from falling off during soldering, etc., and can simplify the work of mounting and replacing electronic components.

[Means for Solving the Problems] The printed circuit board of this invention has a vertical hole in which an electronic component is embedded in a first substrate, and a pattern is provided on at least one side of the first substrate. A second substrate having an opening formed in a position facing the hole to completely expose a part of the pattern is attached, and the electronic component inserted into the vertical hole is exposed from the opening of the second substrate. It is supported on a part of the pattern and soldered to form an integral structure.

[Operation] The electronic component inserted into the vertical hole of the first board is supported on the pattern of the second board without falling off, and connected by soldering means.

[Example] Hereinafter, an example of this invention will be described in detail with reference to the drawings. In FIG. 1, reference numeral 1 indicates a printed circuit board. This printed circuit board 1 includes a hard board 2 as a first board, leadless chip parts 3 such as capacitors and resistors as electronic parts embedded in this hard board 2, and when the leadless chip parts 3 are installed. a second supporting the leadless chip component 3;
The flexible substrate 4 serves as a substrate.

As shown in FIGS. 1 and 3, a circular vertical hole 2a is formed in the hard substrate 2 by means such as press punching. The inner diameter of this vertical hole 2a is
It is made slightly larger than the outer diameter of the leadless chip component 3. Furthermore, a land 5 is fixed to one side of the hard substrate 2 so as to sandwich the vertical hole 2a.

The leadless chip component 3 is of a standard type having a cylindrical shape, and both ends thereof are provided with electrodes 3a, 3a.
It has become.

The flexible substrate 4 has a pattern 6 made of copper foil, as shown in FIG. This pattern 6 is laminated between a cover film 7 and a base film 8 made of polyimide or the like. Furthermore, a double-sided adhesive paper 9 having a release paper 10 on one side is attached to the lower surface of the base film 8 in the drawing.

The hard substrate 2 of these cover film 7, base film 8, adhesive paper 9, and release paper 10
A circular opening 11 having approximately the same diameter as the inner diameter of the vertical hole 2a is formed at a position corresponding to the vertical hole 2a. At the center of this opening 11, a part of the pattern 6 is completely exposed, as shown in FIG. The width of the pattern 6 exposed in the opening 11 is approximately half the outer diameter of the leadless chip component 3. More specifically, a copper foil is laminated onto the base film 8 in which the opening 11 has been formed in advance, a circuit is printed, and the circuit is formed into the above-mentioned shape by techniques such as masking and etching.

When attaching the leadless chip component 3 to the printed circuit board 1 configured as described above, first peel off the release paper 10 of the flexible substrate 4, and as shown in FIG. The opening 11 of the flexible substrate 4 and the vertical hole 2 of the rigid substrate 2
Attach the flexible substrate 4 so that the centers of a are aligned. Thereafter, by applying heat pressing or other means, the hard substrate 2 and the flexible substrate 4 are bonded together even more firmly.

Next, the leadless chip component 3 is inserted vertically into the vertical hole 2a of the hard substrate 2. At this time, the leadless chip component 3 is placed on the pattern 6 exposed in the opening 11 of the flexible substrate 4, and will not fall off.

Next, the electrode 3 at the lower end of the leadless chip component 3
a and the pattern 6 of the flexible substrate 4 are connected by soldering (the soldered portion is indicated by reference numeral 12) using an automatic soldering device (not shown). Furthermore, the hard substrate 2 and the like are reversed, and the other electrode 3a of the leadless chip component 3 and the pattern 6 of the hard substrate 2 are connected by soldering.

In this way, the leadless chip component 3 is inserted into the vertical hole 2a of the rigid board 2, and the flexible board 4 is inserted.
Since the electrode 3a of the leadless chip component 3 and the pattern 6 can be easily positioned and connected while being supported on the pattern 6 exposed from the opening 11 of the leadless chip component 3, a highly accurate printed circuit board 1 can be obtained. At the same time, it is possible to increase the density of the printed circuit board 1.

Furthermore, by using the pattern 6, which is part of the circuit on the flexible board 4, as a land for solder connection of the leadless chip component 3, there is no need to newly provide a land for solder connection on the flexible board 4 side. The work of installing the leadless chip component 3 becomes even easier.

Furthermore, when connecting the electrode 3a of the leadless chip component 3 and the pattern 6 by soldering, the width of the pattern 6 is approximately half that of the leadless chip component 3, so the soldering can be easily and reliably performed. be able to. Incidentally, as shown in FIG. 6, the pattern 6 exposed from the opening 11 of the flexible substrate 4
A part of the opening 11 may be further exposed in an annular manner along the periphery of the opening 11. Thereby, the connection such as soldering between the electrode 3a of the leadless chip component 3 and the pattern 6 can be made more stable. Further, since the leadless chip component 3 is simply inserted into the vertical hole 2a of the hard substrate 2, the leadless chip component 3 can be easily replaced by simply removing the solder 12 during repair or the like.

Further, as in another embodiment shown in FIG. 7, flexible substrates 4 having circuits formed on both sides of the rigid substrate 2 are attached, and the leadless chip components 3 are embedded in the vertical holes 2a of the rigid substrate 2. The printed circuit board may be constructed by the following.

Furthermore, as in another embodiment shown in FIG. 8, the base film 8 of the flexible substrate 4 and the adhesive paper 9
An opening 11 may be formed only on the side to expose a part of the pattern 6, and the electrode 3a of the leadless chip component 3 within the opening 11 and the pattern 6 may be connected by reflow.

As shown in FIGS. 9 and 10, the pattern 6 of the flexible substrate 4 exposed in the vertical hole 2a of the rigid substrate 2 is cut, and the electrode 3a of the leadless chip component 3 placed vertically or horizontally is cut out. The printed circuit board may be constructed by sandwiching and soldering the printed circuit board between the two.

[Effects of the invention] As described above, according to this invention, a second substrate having a pattern exposed in the vertical holes is pasted on at least one side of the first substrate having vertical holes, and Insert an electronic component into the hole and insert the electronic component into the second
By supporting and connecting on the pattern of the board, electronic parts can be easily mounted by preventing them from falling off during mounting, and high-precision printed circuit boards can be manufactured. Further, when it is necessary to replace the electronic component mounted on the printed circuit board during repair or the like, the electronic component can be easily replaced by simply removing the soldered portion.

[Brief explanation of drawings]

Fig. 1 is a sectional view of the main parts of a printed circuit board according to an embodiment of this invention, Fig. 2 is a bottom view of the same, Fig. 3 is an exploded sectional view of the same, Fig. 4 is a sectional view of main parts of a flexible board, and Fig. The figure is a plan view of the same main part, FIG. 6 is a plan view of the main part of another embodiment of the flexible substrate, and FIGS.
Figure 0 is a sectional view of the main parts of a printed circuit board of another embodiment,
FIG. 11 is a sectional view of a main part of a conventional printed circuit board. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Hard board (first board), 2a... Vertical hole, 3... Leadless chip component (electronic component), 4... Flexible board (second board), 6... ...Pattern, 11...Opening,
12...Solder.

Claims (1)

[Scope of utility model registration request] A vertical hole for embedding an electronic component is formed in a first substrate, a pattern is formed on at least one side of the first substrate, and an opening is formed at a position opposite to the vertical hole so that a part of the pattern is formed. A completely exposed second board is attached, and the electronic component inserted into the vertical hole is supported and soldered on a part of the pattern exposed from the opening of the second board to form an integrated structure. A printed circuit board featuring: