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JPH04354609A - Printed wiring board hold-down device - Google Patents

Printed wiring board hold-down device

Info

Publication number
JPH04354609A
JPH04354609A JP12762791A JP12762791A JPH04354609A JP H04354609 A JPH04354609 A JP H04354609A JP 12762791 A JP12762791 A JP 12762791A JP 12762791 A JP12762791 A JP 12762791A JP H04354609 A JPH04354609 A JP H04354609A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
tool
sliding
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12762791A
Other languages
Japanese (ja)
Other versions
JP2969231B2 (en
Inventor
Tamio Otani
民雄 大谷
Yasuhiko Kanetani
保彦 金谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seiko Ltd filed Critical Hitachi Seiko Ltd
Priority to JP3127627A priority Critical patent/JP2969231B2/en
Publication of JPH04354609A publication Critical patent/JPH04354609A/en
Application granted granted Critical
Publication of JP2969231B2 publication Critical patent/JP2969231B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/002Means to press a workpiece against a guide
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

PURPOSE:To provide hold-down pieces capable of holding down a printed wiring board near the bank of a machining hole even when using a tool small in diameter and which can choose each hold-down piece automatically. CONSTITUTION:A printed wiring board 6 mounted on a table 10 is fitted to a printed wiring board finishing device which machines the board 6 with a tool 2 held by a spindle 1. A hold-down member 13A is fitted in the direction in which the tool 2 travels, and has a through hole 13B through which the tool 2 with a maximum diameter can pass. On the under surface of the member 13A, a sliding groove 13C is formed at right angles to the axial direction of the spindle 1. A slide member 7A sliding along the sliding groove 13C and a sliding structure 8 sliding the member 7A are installed, and a plurality of hold-down pieces 7B, 7C different in hole diameter from the member 7A are fixedly installed in an unillustrated control device which chooses the hold-down piece 7B or 7C responding to a tool exchange command.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、プリント基板加工機に
設けられたプリント基板の押え機構に係り、特に加工す
る孔の大きさに応じてプリント基板の押え効率を向上さ
せるのに好適なプリント基板押え装置に関する。
[Industrial Application Field] The present invention relates to a printed circuit board holding mechanism installed in a printed circuit board processing machine, and particularly to a printed circuit board holding mechanism suitable for improving the holding efficiency of a printed circuit board depending on the size of a hole to be processed. The present invention relates to a substrate holding device.

【0002】0002

【従来の技術】従来のプリント基板加工機は、図9に示
すように、プリント基板6を載置固定し、X方向に移動
するテーブル10と、Y方向に移動可能なサドル20に
Z方向に移動可能に支持され、かつ一端にドリル2を保
持するスピンドル1とを備えている。そして、このよう
なプリント基板加工機におけるプリント基板押え装置は
、サドル20に支持された一対のシリンダ5と、このシ
リンダ5に支持されたプレッシャフット3とで構成され
る。そして、シリンダ5は、所定の圧力でプレッシャフ
ット3をテーブル10側に向けて付勢している。
2. Description of the Related Art As shown in FIG. 9, a conventional printed circuit board processing machine has a table 10 on which a printed circuit board 6 is placed and fixed, and a table 10 that moves in the The spindle 1 is movably supported and holds a drill 2 at one end. The printed circuit board holding device in such a printed circuit board processing machine includes a pair of cylinders 5 supported by a saddle 20 and a pressure foot 3 supported by the cylinders 5. The cylinder 5 urges the pressure foot 3 toward the table 10 with a predetermined pressure.

【0003】孔明け加工時には、サドル20が下降する
と、まずプレッシャフット3がプリント基板6に当接す
る。さらにサドル20が下降すると、プレッシャフット
3を支持するシリンダ5が圧縮され、プレッシャフット
3に押え力が作用し、プリント基板6をテーブル10に
押え付ける。さらにサドル20を下降させると図10に
示すように、ドリル2がプリント基板6に押し込まれ、
孔開け加工が行われる。プリント基板6に開けられる孔
は、最大径6.3mmから最小径0.1mmまで各種の
大きさがある。このため、プレッシャフット3の先端の
貫通孔3Bは、最大径のドリル2が通るように直径8m
m程度の大きさになっている。
During drilling, when the saddle 20 is lowered, the pressure foot 3 first comes into contact with the printed circuit board 6. When the saddle 20 further descends, the cylinder 5 supporting the pressure foot 3 is compressed, a pressing force acts on the pressure foot 3, and the printed circuit board 6 is pressed against the table 10. When the saddle 20 is further lowered, the drill 2 is pushed into the printed circuit board 6, as shown in FIG.
Hole drilling is performed. The holes made in the printed circuit board 6 have various sizes from a maximum diameter of 6.3 mm to a minimum diameter of 0.1 mm. Therefore, the through hole 3B at the tip of the pressure foot 3 has a diameter of 8 m so that the maximum diameter drill 2 can pass through.
The size is about m.

【0004】0004

【発明が解決しようとする課題】従来のプリント基板押
え装置にあっては、図9に示すように、直径6.3mm
の孔を開ける場合には、孔の縁から0.85mmの位置
を押えることができるが、図10に示すように、直径0
.3mmの孔を開ける場合には、孔の縁から3.85m
mも離れた場所を押えることになり、充分な押え効果が
得られない状態が発生する。
[Problems to be Solved by the Invention] In the conventional printed circuit board holding device, as shown in FIG.
When drilling a hole of 0.85 mm from the edge of the hole, as shown in Figure 10,
.. When drilling a 3mm hole, 3.85m from the edge of the hole.
This results in a situation in which a sufficient pressing effect cannot be obtained because the pressing is performed at a distance of m.

【0005】本発明の目的は、小径の工具を使用する場
合でも、加工する孔の縁近傍でプリント基板を押えるこ
とができる押えピースを有し、かつそれぞれの押えピー
スを自動的に選択できるプリント基板押え装置を提供す
ることにある。
An object of the present invention is to provide a printed circuit board that has presser pieces that can press the printed circuit board near the edge of the hole to be machined even when using a small-diameter tool, and that can automatically select each presser piece. An object of the present invention is to provide a substrate holding device.

【0006】[0006]

【課題を解決するための手段】前記の目的を達成するた
め、本発明に係るプリント基板押え装置は、テーブルに
載置したプリント基板を、スピンドルの先端に把持した
工具により加工するプリント基板加工機に付設され、工
具が貫通孔を通過してプリント基板に接触する前にプリ
ント基板に接し、加工中プリント基板を押圧する押え部
材を備えたプリント基板押え装置において、押え部材に
スピンドルの軸方向と直交させて摺動溝を形成するとと
もに、摺動溝と摺動自在に係合するスライド部材と、ス
ライド部材を摺動させる摺動機構とを設け、スライド部
材に、それぞれ孔径の異なる貫通孔を穿設した複数の押
えピースを固設し、工具の交換指令に応じてそれぞれの
押えピースのうちいずれか一つを選択し摺動機構を駆動
させる制御装置を具備している構成とする。
[Means for Solving the Problems] In order to achieve the above object, a printed circuit board holding device according to the present invention is provided in a printed circuit board processing machine that processes a printed circuit board placed on a table using a tool held at the tip of a spindle. In a printed circuit board holding device that is attached to a presser member that contacts the printed circuit board and presses the printed circuit board during processing before the tool passes through the through hole and contacts the printed circuit board, the presser member has a The sliding grooves are formed perpendicularly to each other, and a sliding member that slidably engages with the sliding groove and a sliding mechanism that slides the sliding member are provided, and through holes with different diameters are formed in the sliding member. A plurality of perforated presser pieces are fixedly installed, and a control device is provided to select one of the presser pieces and drive a sliding mechanism in response to a tool exchange command.

【0007】そしてテーブルに載置したプリント基板を
、スピンドルの先端に把持した工具により加工するプリ
ント基板加工機に付設され、工具が貫通孔を通過してプ
リント基板に接触する前にプリント基板に接し、加工中
のプリント基板を押圧する押え部材を備えたプリント基
板押え装置において、押え部材にスピンドルの軸方向と
所定角度をなす傾斜面を形成するとともに、傾斜面を回
転自在に摺動する回転部材と、回転部材を回転させる回
転機構とを設け、回転部材の円周上に、それぞれ孔径の
異なる貫通孔を穿設した複数の押えピースを固設し、工
具の交換指令に応じてそれぞれの押えピースのうちいず
れか一つを選択し回転機構を駆動させる制御装置を具備
している構成でもよい。
[0007]The printed circuit board processing machine is attached to a printed circuit board processing machine that processes a printed circuit board placed on a table using a tool held at the tip of a spindle. , a printed circuit board holding device equipped with a holding member that presses a printed circuit board being processed, in which an inclined surface forming a predetermined angle with the axial direction of a spindle is formed on the holding member, and a rotating member that rotatably slides on the inclined surface. and a rotation mechanism that rotates the rotating member, and a plurality of presser pieces each having through holes of different diameters are fixedly installed on the circumference of the rotating member, and each presser piece is rotated in response to a tool change command. The configuration may include a control device that selects any one of the pieces and drives the rotation mechanism.

【0008】[0008]

【作用】本発明のプリント基板押え装置によれば、工具
の径に対応する押えピースは予め設定されており、交換
命令を受信し指定された工具の径を認識した制御装置は
、摺動機構を駆動させてスライド部材を摺動させ、かつ
工具の径に対応するいずれか一つの押えピースを選択し
て工具の直下に配置する。押え部材を介してスライド部
材が下降され、押えピースの貫通孔を通過した工具がプ
リント基板に接触する前に、押えピースにより加工され
る孔の縁近傍が押えられる。
[Operation] According to the printed circuit board holding device of the present invention, the holding piece corresponding to the diameter of the tool is set in advance, and the control device that receives the exchange command and recognizes the designated diameter of the tool moves the sliding mechanism. is driven to slide the slide member, and one of the presser pieces corresponding to the diameter of the tool is selected and placed directly below the tool. The slide member is lowered via the holding member, and the vicinity of the edge of the hole to be machined is held down by the holding piece before the tool that has passed through the through hole of the holding piece comes into contact with the printed circuit board.

【0009】[0009]

【実施例】本発明の一実施例を図1〜図3を参照しなが
ら説明する。図1〜図3に示すように、スピンドル1は
、図示しないサドルに矢印Z方向に移動可能に支持され
ている。このスピンドル1の軸心にはシャフト(図示し
ない)が回転可能に支持され、図示しないモータによっ
て回転駆動される。コレットチャック1Aは、シャフト
に開閉可能に支持されている。ドリル2は、コレットチ
ャック1Aに着脱可能に保持されている。ピストンロッ
ド4は、サドルに支持されたシリンダ(図示しない)か
ら突出し、下方に向けて付勢されている。プレッシャフ
ット13Aは、スピンドル1の先端部に摺動可能に嵌合
し、かつピストンロッド4に支持されている。このプレ
ッシャフット13Aの底面軸心部には、ドリル2が通過
する貫通孔13Bが形成され、外周面下端部にあり溝1
3Cが形成されている。シリンダ8は、プレッシャフッ
ト13Aに一端が固定されている。スライドピース7A
は、あり溝13Cに摺動可能に嵌合し、シリンダ8の他
端に結合されている。このスライドピース7Aには、直
径8mmの貫通孔を形成した押えピース7Bと、直径1
mmの貫通孔を形成した押えピース7Cとが形成されて
いる。テーブル10は、X軸方向に移動可能に構成され
ており、プリント基板6はテーブル10に載置固定され
ている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. 1 to 3. As shown in FIGS. 1 to 3, the spindle 1 is supported by a saddle (not shown) so as to be movable in the Z direction. A shaft (not shown) is rotatably supported at the axis of the spindle 1, and is rotationally driven by a motor (not shown). The collet chuck 1A is supported by a shaft so that it can be opened and closed. The drill 2 is detachably held by the collet chuck 1A. The piston rod 4 protrudes from a cylinder (not shown) supported by the saddle and is biased downward. The pressure foot 13A is slidably fitted to the tip of the spindle 1 and supported by the piston rod 4. A through hole 13B through which the drill 2 passes is formed at the bottom axis of the pressure foot 13A, and a groove 1 is formed at the lower end of the outer peripheral surface.
3C is formed. One end of the cylinder 8 is fixed to the pressure foot 13A. Slide piece 7A
is slidably fitted into the dovetail groove 13C and coupled to the other end of the cylinder 8. This slide piece 7A includes a presser piece 7B having a through hole with a diameter of 8 mm, and a presser piece 7B with a through hole of 1 mm in diameter.
A presser piece 7C having a through hole of mm in diameter is formed. The table 10 is configured to be movable in the X-axis direction, and the printed circuit board 6 is placed and fixed on the table 10.

【0010】本実施例の動作を図1及び図2を参照しな
がら説明する。直径6.3mmのドリル2による孔明け
加工時には、押えピース7Bをプレッシャフット13A
の孔13Bの下に移動させ、プリント基板6の孔明け加
工を行う。また、直径0.3mmのドリル2による孔明
け加工時には、図2に示すように、シリンダ8を動作さ
せ、押えピース7Cをプレッシャフット13Aの孔13
Bの下に移動させ、プリント基板6の孔開け加工を行う
The operation of this embodiment will be explained with reference to FIGS. 1 and 2. When drilling holes with the drill 2 with a diameter of 6.3 mm, the presser piece 7B is attached to the pressure foot 13A.
The printed circuit board 6 is moved under the hole 13B, and the printed circuit board 6 is drilled. In addition, when drilling a hole with the drill 2 having a diameter of 0.3 mm, as shown in FIG.
The printed circuit board 6 is moved to a position below B, and holes are punched in the printed circuit board 6.

【0011】すると、直径6.3mmの孔明け加工時に
は、孔の縁から0.85mmの所を押えて孔明け加工を
行い、直径0.3mmの孔明け加工時には、孔の縁から
0.35mmの所を押えて孔明け加工を行うことができ
る。このように加工する孔の縁の近くを押えることによ
り、孔明け加工時にドリル2のリードによって発生する
プリント基板の浮き上がりを防止することができ、かつ
返りの発生、あるいは切粉がプリント基板の間に侵入す
るのを防止することができ、切粉を押し付けることによ
って発生するプリント基板の損傷を防止することができ
る。
[0011] Then, when drilling a hole with a diameter of 6.3 mm, the hole is pressed 0.85 mm from the edge of the hole, and when drilling a hole with a diameter of 0.3 mm, the hole is pressed 0.35 mm from the edge of the hole. The hole can be drilled by holding down the part. By pressing near the edge of the hole to be machined in this way, it is possible to prevent the printed circuit board from lifting up due to the lead of the drill 2 during drilling, and to prevent warping or cutting chips from occurring between the printed circuit boards. It is possible to prevent damage to the printed circuit board caused by pressing chips.

【0012】なお押えピース7B、7Cは、2種類だけ
ではなく、さらに他の大きさのものを設けてもよい。ま
た、スライドピース7Aの移動は、プリント基板加工機
の制御装置を使用し、その工具交換指令によって指定さ
れた工具の径に合わせ、押えピース7B、7Cを選択す
るようにすればよい。
Note that the holding pieces 7B and 7C are not limited to two types, and pieces of other sizes may also be provided. Further, the slide piece 7A may be moved by using the control device of the printed circuit board processing machine and selecting the holding pieces 7B and 7C in accordance with the diameter of the tool specified by the tool exchange command.

【0013】本実施例によれば、工具の径に対応して押
えピースを選択できるため、孔の縁に近接した周辺でプ
リント基板を押えることができる。なお図1及び図2に
示すように、他の押えピースがプリント基板の端部また
はスタックピン16の突出部に当接する恐れがある場合
、例えばそれぞれの押えピースの間の間隔を広くし、か
つスタックピンの位置を避けてスライドピースを設ける
必要がある。
According to this embodiment, since the holding piece can be selected in accordance with the diameter of the tool, the printed circuit board can be held in the vicinity of the edge of the hole. As shown in FIGS. 1 and 2, if there is a risk that another holding piece may come into contact with the edge of the printed circuit board or the protrusion of the stack pin 16, for example, widen the interval between the holding pieces and It is necessary to provide a slide piece avoiding the position of the stack pin.

【0014】つぎに本発明の他の実施例を図4及び図5
を参照し、一実施例と異なる構成について説明する。プ
レッシャフット23Aは、直径8mmより大きな貫通孔
23Bが形成され、かつ下面にスピンドル1の軸方向と
所定角度θをなす傾斜面23Cが形成されている。そし
て傾斜面23Cと回転自在に摺動する回転部材9Aと、
回転部材9Aの中心突出部に設けた回転用ベアリング1
5を中心に回転部材9Aを回転させる回転機構とを設け
、回転部材9Aの円周上に、ドリル2の軸方向に向けて
直径8mmの貫通孔を穿設した押えピース9Bと、直径
1mmの貫通孔を穿設した押えピース9Cと、それらの
中間の直径を有する押えピース9D、9Eとを固設して
ある。なお回転機構は、例えば回転部材9Aの外周に形
成したギヤ10と、ギヤ10に噛合うピニオン11と、
ピニオン11の軸方向に直結されピニオン11を介して
、回転部材9Aを任意の角度に回転させるモータ12及
びエンコーダ13と、モータ12をピース23Aに固定
するブラケット14とよりなるものとする。
Next, another embodiment of the present invention is shown in FIGS. 4 and 5.
A configuration different from one embodiment will be explained with reference to . The pressure foot 23A has a through hole 23B with a diameter larger than 8 mm formed therein, and an inclined surface 23C forming a predetermined angle θ with respect to the axial direction of the spindle 1 on the lower surface. and a rotating member 9A that rotatably slides on the inclined surface 23C;
Rotating bearing 1 provided at the central protrusion of rotating member 9A
A rotation mechanism for rotating the rotating member 9A around the rotating member 5 is provided, and a presser piece 9B having a through hole with a diameter of 8 mm bored in the axial direction of the drill 2 on the circumference of the rotating member 9A, and a holding piece 9B with a diameter of 1 mm. A presser piece 9C having a through hole and presser pieces 9D and 9E having diameters intermediate therebetween are fixedly provided. Note that the rotating mechanism includes, for example, a gear 10 formed on the outer periphery of the rotating member 9A, a pinion 11 meshing with the gear 10,
It consists of a motor 12 and an encoder 13 that are directly connected in the axial direction of the pinion 11 and rotate the rotating member 9A at an arbitrary angle via the pinion 11, and a bracket 14 that fixes the motor 12 to the piece 23A.

【0015】さらに本発明の他の実施例を図6を参照し
ながら説明する。回転機構を簡略化するため、回転部材
17Aの下面の一個所と、傾斜面にほぼ平行して設けら
れたエアシリンダ18の一端とを回動自在に連結した構
成である。エアシリンダ18を稼働することによって回
転部材17Aを回動し、エアシリンダ18の方向とほぼ
直交する方向に、図7に示すA部または図8に示すB部
の例えば押えピース17Cをドリル2の直下に位置でき
る。
Further, another embodiment of the present invention will be described with reference to FIG. In order to simplify the rotation mechanism, one part of the lower surface of the rotating member 17A is rotatably connected to one end of the air cylinder 18 provided substantially parallel to the inclined surface. By operating the air cylinder 18, the rotating member 17A is rotated, and for example, the holding piece 17C of the section A shown in FIG. 7 or the section B shown in FIG. It can be located directly below.

【0016】これらの他の実施例によれば、回転部材に
設けた押えピースを選択して所定の位置に移動できるた
め。一実施例と同様の効果が得られる。
According to these other embodiments, the presser piece provided on the rotating member can be selected and moved to a predetermined position. The same effects as in the first embodiment can be obtained.

【0017】[0017]

【発明の効果】本発明のプリント基板押え装置によれば
、小径の工具を使用する場合でも、工具径に対応して押
えピースを自動的に選択し、加工する孔の縁近傍でプリ
ント基板を押えることができ、加工中のプリント基板の
浮き上がりを抑制してプリント基板の損傷を防止するこ
とができる。
According to the printed circuit board holding device of the present invention, even when using a small diameter tool, the holding piece is automatically selected according to the tool diameter, and the printed circuit board is held near the edge of the hole to be machined. This can suppress the printed circuit board from lifting up during processing and prevent damage to the printed circuit board.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention.

【図2】本実施例の動作を説明する図である。FIG. 2 is a diagram illustrating the operation of this embodiment.

【図3】本実施例の動作を説明する図である。FIG. 3 is a diagram illustrating the operation of this embodiment.

【図4】本発明の他の実施例を示す縦断面図である。FIG. 4 is a longitudinal sectional view showing another embodiment of the present invention.

【図5】図4の平面図である。FIG. 5 is a plan view of FIG. 4;

【図6】本発明の他の実施例を示す側面図である。FIG. 6 is a side view showing another embodiment of the present invention.

【図7】他の実施例の動作を説明する図である。FIG. 7 is a diagram illustrating the operation of another embodiment.

【図8】他の実施例の動作を説明する図である。FIG. 8 is a diagram illustrating the operation of another embodiment.

【図9】従来の技術を示す縦断面図である。FIG. 9 is a vertical cross-sectional view showing a conventional technique.

【図10】従来の技術を説明する縦断面図である。FIG. 10 is a vertical cross-sectional view illustrating a conventional technique.

【符号の説明】[Explanation of symbols]

1  スピンドル 2  ドリル(工具) 6  プリント基板 7A  スライドピース(スライド部材)7B  押え
ピース 7C  押えピース 8  シリンダ(摺動機構) 10  テーブル 13A  プレッシャフット(押え部材)13B  貫
通孔 13C  あり溝(摺動溝)
1 Spindle 2 Drill (tool) 6 Printed circuit board 7A Slide piece (sliding member) 7B Holding piece 7C Holding piece 8 Cylinder (sliding mechanism) 10 Table 13A Pressure foot (holding member) 13B Through hole 13C Dovetail groove (sliding groove)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】  テーブルに載置したプリント基板を、
スピンドルの先端に把持した工具により加工するプリン
ト基板加工機に付設され、前記工具が貫通孔を通過して
前記プリント基板に接触する前にプリント基板に接し、
加工中プリント基板を押圧する押え部材を備えたプリン
ト基板押え装置において、前記押え部材に前記スピンド
ルの軸方向と直交させて摺動溝を形成するとともに、該
摺動溝と摺動自在に係合するスライド部材と、該スライ
ド部材を摺動させる摺動機構とを設け、前記スライド部
材に、それぞれ孔径の異なる貫通孔を穿設した複数の押
えピースを固設し、前記工具の交換指令に応じてそれぞ
れの押えピースのうちいずれか一つを選択し前記摺動機
構を駆動させる制御装置を具備していることを特徴とす
るプリント基板押え装置。
[Claim 1] A printed circuit board placed on a table,
attached to a printed circuit board processing machine that processes a printed circuit board with a tool held at the tip of a spindle, and contacts the printed circuit board before the tool passes through the through hole and contacts the printed circuit board;
In a printed circuit board holding device equipped with a holding member that presses a printed circuit board during processing, a sliding groove is formed in the holding member perpendicular to the axial direction of the spindle and is slidably engaged with the sliding groove. A sliding member is provided, and a sliding mechanism is provided to slide the sliding member, and a plurality of presser pieces each having a through hole having a different diameter are fixedly attached to the sliding member, and a plurality of presser pieces are fixed to the sliding member, and a plurality of presser pieces are fixed to the sliding member, and a plurality of presser pieces are fixed to the sliding member, and a plurality of presser pieces are fixed to the sliding member. A printed circuit board holding device comprising: a control device that selects one of the holding pieces and drives the sliding mechanism.
【請求項2】  テーブルに載置したプリント基板を、
スピンドルの先端に把持した工具により加工するプリン
ト基板加工機に付設され、前記工具が貫通孔を通過して
前記プリント基板に接触する前にプリント基板に接し、
加工中プリント基板を押圧する押え部材を備えたプリン
ト基板押え装置において、前記押え部材に前記スピンド
ルの軸方向と所定角度をなす傾斜面を形成するとともに
、該傾斜面を回転自在に摺動する回転部材と、該回転部
材を回転させる回転機構とを設け、前記回転部材の円周
上に、それぞれ孔径の異なる貫通孔を穿設した複数の押
えピースを固設し、前記工具の交換指令に応じてそれぞ
れの押えピースのうちいずれか一つを選択し前記回転機
構を駆動させる制御装置を具備していることを特徴とす
るプリント基板押え装置。
[Claim 2] A printed circuit board placed on a table,
attached to a printed circuit board processing machine that processes a printed circuit board with a tool held at the tip of a spindle, and contacts the printed circuit board before the tool passes through the through hole and contacts the printed circuit board;
In a printed circuit board holding device that includes a holding member that presses a printed circuit board during processing, the holding member is provided with an inclined surface forming a predetermined angle with the axial direction of the spindle, and the rotating surface is rotatably slid on the inclined surface. A member and a rotation mechanism for rotating the rotary member are provided, and a plurality of presser pieces having through holes each having a different diameter are fixed on the circumference of the rotary member, and in response to a command to replace the tool. A printed circuit board holding device comprising: a control device for selecting one of the holding pieces and driving the rotating mechanism.
JP3127627A 1991-05-30 1991-05-30 Printed circuit board holding device Expired - Lifetime JP2969231B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3127627A JP2969231B2 (en) 1991-05-30 1991-05-30 Printed circuit board holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3127627A JP2969231B2 (en) 1991-05-30 1991-05-30 Printed circuit board holding device

Publications (2)

Publication Number Publication Date
JPH04354609A true JPH04354609A (en) 1992-12-09
JP2969231B2 JP2969231B2 (en) 1999-11-02

Family

ID=14964766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3127627A Expired - Lifetime JP2969231B2 (en) 1991-05-30 1991-05-30 Printed circuit board holding device

Country Status (1)

Country Link
JP (1) JP2969231B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0774321A1 (en) * 1995-11-15 1997-05-21 Hitachi Seiko, Ltd. Printed-circuit board holding device
US5893687A (en) * 1997-07-10 1999-04-13 Howa Machinery, Ltd. Plate suppressing device for drilling apparatus
WO2003070423A1 (en) * 2002-02-22 2003-08-28 Ballado Investments Inc. Workpiece clamp with two alternately applicable compression rings
US7959385B2 (en) * 2007-05-24 2011-06-14 Hitachi Via Mechanics, Ltd. Printed circuit board machining apparatus
JP2016040055A (en) * 2014-08-12 2016-03-24 ビアメカニクス株式会社 Device and method of drilling substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0774321A1 (en) * 1995-11-15 1997-05-21 Hitachi Seiko, Ltd. Printed-circuit board holding device
US5876156A (en) * 1995-11-15 1999-03-02 Hitachi Seiko, Ltd. Printed-circuit board holding device
US5893687A (en) * 1997-07-10 1999-04-13 Howa Machinery, Ltd. Plate suppressing device for drilling apparatus
KR100483668B1 (en) * 1997-07-10 2005-07-28 호와고교 가부시키가이샤 Flat Plate Presser for Drilling Device
WO2003070423A1 (en) * 2002-02-22 2003-08-28 Ballado Investments Inc. Workpiece clamp with two alternately applicable compression rings
US7959385B2 (en) * 2007-05-24 2011-06-14 Hitachi Via Mechanics, Ltd. Printed circuit board machining apparatus
JP2016040055A (en) * 2014-08-12 2016-03-24 ビアメカニクス株式会社 Device and method of drilling substrate

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