JPH0443029A - Manufacture of copper-clad laminated board - Google Patents
Manufacture of copper-clad laminated boardInfo
- Publication number
- JPH0443029A JPH0443029A JP14877990A JP14877990A JPH0443029A JP H0443029 A JPH0443029 A JP H0443029A JP 14877990 A JP14877990 A JP 14877990A JP 14877990 A JP14877990 A JP 14877990A JP H0443029 A JPH0443029 A JP H0443029A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper foil
- roughened
- copper
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000011889 copper foil Substances 0.000 claims abstract description 33
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 239000000835 fiber Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 12
- 239000002966 varnish Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 2
- 238000009472 formulation Methods 0.000 abstract description 5
- 230000001788 irregular Effects 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は耐熱性が良好であり、かつ反り、寸法安定性、
表面平滑性及び板厚精度に優れた印刷回路用基板の製造
方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention has good heat resistance, and has excellent warpage, dimensional stability,
The present invention relates to a method of manufacturing a printed circuit board with excellent surface smoothness and board thickness accuracy.
従来、エポキシ樹脂積層板等の耐熱性の優れた積層板に
用いる樹脂処方においては、プリプレグの積層板成形時
において、成形が難しく、これを改良するためには成形
時のフローを大きくしなければならなかった。この場合
、硬化の不均一、フローによる反り、寸法安定性、表面
平滑性等の特性か低化する欠点かあった。又、フローが
小さいまま成形性を良くする方法としては、真空含浸プ
リプレグの使用、フロー止め効果のある端部処理プリプ
レグの使用、真空プレスによる成形、銅箔側に使用する
プリプレグのゲルタイムを長めにする方法、紙紐構成の
変更等の手段の組合せである程度効果をあげることがで
きるが、いずれも完全なものではなかった。Conventionally, resin formulations used for laminates with excellent heat resistance, such as epoxy resin laminates, are difficult to mold when forming prepreg laminates, and to improve this, it is necessary to increase the flow during molding. did not become. In this case, there were disadvantages such as uneven curing, warpage due to flow, and poor properties such as dimensional stability and surface smoothness. In addition, methods to improve formability while maintaining a small flow include using vacuum-impregnated prepreg, using end-treated prepreg that has a flow-stopping effect, forming by vacuum press, and extending the gel time of the prepreg used on the copper foil side. A combination of methods such as changing the structure of the paper string and changing the structure of the paper string can be effective to some extent, but none of them are perfect.
本発明の目的とするところは、特に耐熱性樹脂積層板の
製造方法において、樹脂処方の制限を受けないで、反り
、寸法変化率、表面平滑性及び板厚精度が優れた銅張積
層板を提供することにある。The purpose of the present invention is to produce a copper-clad laminate with excellent warpage, dimensional change rate, surface smoothness, and thickness accuracy without being limited by resin formulation, especially in the production method of heat-resistant resin laminates. It is about providing.
本発明は、繊維基材に樹脂ワニスを含浸して得たプリプ
レグの１枚または複数枚と粗化銅箔とを重ね合わせ、こ
れらを加熱加圧成形する積層板の製造方法において、前
記粗化銅箔として、粗化面の凹凸深さの０．３〜１．５
倍にまで樹脂を塗布したものを使用することを特徴とす
る銅張積層板の製造方法、である。The present invention provides a method for manufacturing a laminate in which one or more sheets of prepreg obtained by impregnating a fiber base material with resin varnish and a roughened copper foil are laminated together and then heated and pressure-molded. As a copper foil, the depth of unevenness on the roughened surface is 0.3 to 1.5.
This is a method for manufacturing a copper-clad laminate, characterized in that a copper-clad laminate is coated with resin to double the thickness.
本発明において用いられる銅箔は通常エポキシ樹脂銅張
積層板に用いられる粗化銅箔である。この粗化面の凹凸
の深さは、１８μ銅箔や３５μ銅箔では３〜１０μ程度
である。The copper foil used in the present invention is a roughened copper foil that is normally used in epoxy resin copper-clad laminates. The depth of the unevenness on the roughened surface is about 3 to 10 μ in the case of 18 μ copper foil or 35 μ copper foil.
本発明では、この凹凸の深さの０．３〜１．５倍、好ま
しくは０．５〜１倍まで樹脂を塗布して凹凸を一定の深
さ又は全面的に埋めることにより、積層成形時、銅箔の
粗化面による樹脂の流れが阻害されることなく、脱泡が
行われる。また、銅箔に塗布される樹脂量は多くないの
て、通常エポキシ樹脂積層板に使用される常温で固型の
エポキシ樹脂を使っても、ひび割れ等による樹脂落ちが
発生することもなく、プリプレグ上に落ちた樹脂粉によ
る積層板の表面凹凸やレジンピット等の欠陥も生じない
。また、樹脂塗布後の乾燥時の収縮も小さいので、銅箔
のカールが小さく、取扱いが容易である。In the present invention, by coating the resin to a depth of 0.3 to 1.5 times, preferably 0.5 to 1 times, the depth of the unevenness and filling the unevenness to a certain depth or the entire surface, the resin is applied during lamination molding. , defoaming is performed without the resin flow being inhibited by the roughened surface of the copper foil. In addition, since the amount of resin applied to the copper foil is not large, even if the epoxy resin that is normally used for epoxy resin laminates is solid at room temperature, the resin will not come off due to cracks, etc., and the prepreg There are no defects such as surface irregularities or resin pits on the laminate due to resin powder falling on it. In addition, since the shrinkage during drying after resin application is small, the curl of the copper foil is small and it is easy to handle.
次に、本発明の詳細な説明する。 Next, the present invention will be explained in detail.
例えば、エポキシ樹脂銅張積層板の製造にあたり、ガラ
スクロス基材エポキシ樹脂含浸プリプレグと、粗化銅箔
を重ね合わせて、金属鏡面板に挟んで加熱加圧する際に
、プリプレグ内の気泡が抜けてい（が、気泡のみではな
く樹脂も流出してしまうので、成形された積層板は板厚
精度が悪くなる。流れ出す樹脂量を少なくするために、
プレス圧力を低くすると銅箔と樹脂の界面に気泡が残り
成形不良の原因となる。For example, when manufacturing epoxy resin copper-clad laminates, when a glass cloth-based epoxy resin-impregnated prepreg and a roughened copper foil are layered and heated and pressed between mirror-finished metal plates, air bubbles in the prepreg are removed. (However, not only the air bubbles but also the resin flow out, so the thickness accuracy of the molded laminate deteriorates.In order to reduce the amount of resin that flows out,
If the press pressure is lowered, air bubbles will remain at the interface between the copper foil and the resin, causing molding defects.
これに対して、本発明の方法によれば、粗化銅箔の粗化
面の凹凸を樹脂で埋めて、この凹凸内に空気が滞留する
のを防止しているので、プリプレグ中の樹脂のフローを
小さくする、あるいは成形時のプレス圧力を低くしても
銅箔と樹脂の界面に気泡が残留することがない。従って
、樹脂ワニスの処方、プリプレグの乾燥条件、あるいは
成形条件をかなり広く設定しても、積層板の板厚精度、
寸法安定性、表面平滑性等、成形による不良を減少させ
ることができる。On the other hand, according to the method of the present invention, the unevenness on the roughened surface of the roughened copper foil is filled with resin to prevent air from remaining in the unevenness. Even if the flow is reduced or the press pressure during molding is reduced, no air bubbles remain at the interface between the copper foil and the resin. Therefore, even if the resin varnish formulation, prepreg drying conditions, or molding conditions are set quite widely, the thickness accuracy of the laminate
Defects due to molding, such as dimensional stability and surface smoothness, can be reduced.
銅箔に塗布する樹脂は繊維基材に含浸する樹脂ワニスと
実質的に同一処方のものが銅箔とプリプレグの密着性の
ために好ましいが、特にこれに限定されるものではない
。The resin applied to the copper foil is preferably one having substantially the same formulation as the resin varnish impregnated into the fiber base material for the purpose of adhesion between the copper foil and the prepreg, but is not particularly limited thereto.
樹脂を銅箔に塗布する方法は、銅箔の粗化凹凸内に樹脂
が十分浸透するように、マイクログラビア法を用いるの
が好ましく、樹脂塗布後の乾燥は減圧下で行うと、ボイ
ドを含まない樹脂塗布層を得ることができる。As for the method of applying the resin to the copper foil, it is preferable to use the microgravure method so that the resin sufficiently penetrates into the roughened unevenness of the copper foil.Drying after applying the resin under reduced pressure will prevent voids from forming. It is possible to obtain a resin coating layer that does not contain any resin.
次の処方で樹脂ワニスを調製した。 A resin varnish was prepared using the following recipe.
Ｂ ＲＥ Ｎ ４０部（日本化
薬製ブロム化ノボラック型
エポキシ樹脂、エボキ当量３５０）
Ｅ Ｐ −５０４６３０
（油化シェル製ブロム化ビスフェノールＡ型エポキシ樹
脂、エポキシ当量５００）Ｅ Ｐ −８２８３０
（油化シェル製ビスフェノールＡ型
エポキシ樹脂、エポキシ当量１９０）
ジシアンジアミド ４２エチル４
メチルイミダゾール ０．１（樹脂固形分
５０％）このワニスを２００μ厚
のガラスクロスに含浸し、１７０°Ｃ４分間乾燥し、樹
脂含有率４２％のプリプレグを得た。B RE N 40 parts (Nippon Kayaku brominated novolak epoxy resin, epoxy equivalent 350) EP-504630 (Yuka Shell brominated bisphenol A epoxy resin, epoxy equivalent 500) EP-82830 (Yuka Shell brominated bisphenol A epoxy resin, epoxy equivalent 500) Bisphenol A type epoxy resin, epoxy equivalent: 190) Dicyandiamide 42 Ethyl 4
Methylimidazole 0.1 (resin solid content
A glass cloth having a thickness of 200 μm was impregnated with this varnish and dried at 170° C. for 4 minutes to obtain a prepreg with a resin content of 42%.
一方、厚さ１８μで片面に平均７μの深さの凹凸を有す
る粗化銅箔に対し、上記フェスをマイクログラビア法で
塗布し、５０トルの減圧下で１５０”Ｃ４分間乾燥した
。塗布量は第１表に示す通りである。比較例３（従来例
）は樹脂を塗布しない銅箔を使用した。On the other hand, the above-mentioned face was applied by the microgravure method to a roughened copper foil having a thickness of 18 μm and an average depth of 7 μm on one side, and dried at 150”C for 4 minutes under a reduced pressure of 50 Torr.The amount of coating was The results are shown in Table 1. In Comparative Example 3 (conventional example), copper foil without resin coating was used.
次に、前記プリプレグ８枚とその両面に前記鋼箔を粗化
面を内側にして重ね合わせ、１７０℃２０ｋｇ／ａＩｒ
で９０分間加熱加圧して銅張積層板を得た。Next, the eight sheets of prepreg and the steel foil were stacked on both sides with the roughened side facing inside, and heated at 20 kg/aIr at 170°C.
This was heated and pressed for 90 minutes to obtain a copper-clad laminate.
第１表に、銅箔への樹脂塗布量、樹脂の深さ、及び成形
性、得られた銅張積層板の寸法安定性、平面平滑性の測
定結果を示す。Table 1 shows the measurement results of the amount of resin applied to the copper foil, the depth of the resin, the moldability, and the dimensional stability and planar smoothness of the obtained copper-clad laminate.
本発明の方法によれば、粗化銅箔の粗化面に樹脂を塗布
し凹凸を樹脂で埋めているので、銅箔とプリプレグとの
接着力を低下させることなく、積層板の成形性が向上し
、得られた積層板は寸法安定性や表面平滑性がすぐれた
ものとなる。According to the method of the present invention, since resin is applied to the roughened surface of the roughened copper foil and the unevenness is filled with the resin, the formability of the laminate is improved without reducing the adhesive strength between the copper foil and the prepreg. The resulting laminate has excellent dimensional stability and surface smoothness.
Claims (3)
の１枚または複数枚と粗化銅箔とを重ね合わせ、これら
を加熱加圧成形する積層板の製造方法において、前記粗
化銅箔として、粗化面の凹凸深さの０．３〜１．５倍に
まで樹脂を塗布したものを使用することを特徴とする銅
張積層板の製造方法。(1) A method for producing a laminate in which one or more prepregs obtained by impregnating a fiber base material with a resin varnish and a roughened copper foil are laminated together and then heated and pressure-molded. A method for manufacturing a copper-clad laminate, characterized in that a foil coated with a resin to a depth of 0.3 to 1.5 times the depth of the unevenness on a roughened surface is used.
されている樹脂と本質的に同一の配合のものであること
を特徴とする請求項１記載の銅張積層板の製造方法。(2) The method for manufacturing a copper-clad laminate according to claim 1, wherein the resin applied to the copper foil has essentially the same composition as the resin impregnated in the prepreg.
乾燥することを特徴とする請求項１または２記載の銅張
積層板の製造方法。(3) The method for manufacturing a copper-clad laminate according to claim 1 or 2, wherein the resin is applied to the roughened surface of the copper foil and then dried under reduced pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14877990A JPH0443029A (en) | 1990-06-08 | 1990-06-08 | Manufacture of copper-clad laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14877990A JPH0443029A (en) | 1990-06-08 | 1990-06-08 | Manufacture of copper-clad laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0443029A true JPH0443029A (en) | 1992-02-13 |
Family
ID=15460485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14877990A Pending JPH0443029A (en) | 1990-06-08 | 1990-06-08 | Manufacture of copper-clad laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0443029A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000059274A1 (en) * | 1999-03-26 | 2000-10-05 | Mitsubishi Plastics, Inc. | Method for manufacturing three-dimensional printed wiring board |
| WO2002064364A1 (en) * | 2001-02-16 | 2002-08-22 | Dai Nippon Printing Co., Ltd. | Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
-
1990
- 1990-06-08 JP JP14877990A patent/JPH0443029A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000059274A1 (en) * | 1999-03-26 | 2000-10-05 | Mitsubishi Plastics, Inc. | Method for manufacturing three-dimensional printed wiring board |
| US6499217B1 (en) | 1999-03-26 | 2002-12-31 | Mitsubishi Plastics Inc. | Method of manufacturing three-dimensional printed wiring board |
| WO2002064364A1 (en) * | 2001-02-16 | 2002-08-22 | Dai Nippon Printing Co., Ltd. | Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| US8066891B2 (en) | 2001-02-16 | 2011-11-29 | Dai Nippon Printing Co., Ltd. | Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
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