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JPH0444243A - Test substrate control system of bar-in testing device - Google Patents

Test substrate control system of bar-in testing device

Info

Publication number
JPH0444243A
JPH0444243A JP2149376A JP14937690A JPH0444243A JP H0444243 A JPH0444243 A JP H0444243A JP 2149376 A JP2149376 A JP 2149376A JP 14937690 A JP14937690 A JP 14937690A JP H0444243 A JPH0444243 A JP H0444243A
Authority
JP
Japan
Prior art keywords
substrate
burn
abnormality
test
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2149376A
Other languages
Japanese (ja)
Inventor
Yutaka Hirata
豊 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamaguchi Ltd
Original Assignee
NEC Yamaguchi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamaguchi Ltd filed Critical NEC Yamaguchi Ltd
Priority to JP2149376A priority Critical patent/JPH0444243A/en
Publication of JPH0444243A publication Critical patent/JPH0444243A/en
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enable abnormality due to voltage noise, that of wiring resistance, that due to leak current, and that due to high temperature to be confirmed by providing a device for recognizing an individual BT substrate at a bar-in testing device and a monitor device and by providing a bar code for displaying the BT substrate individually at the BT substrate. CONSTITUTION:A recognition device detects a bar code which is provided at a BT substrate when inserting the BT substrate into bar-in testing device and the data is transferred to a monitor device. Then, when characteristics of an IC deteriorate rapidly and the IC is damaged due to abnormality in voltage noise which is produced on the BT substrate, abnormality of wiring resistance, abnormality due to leak current, and abnormality due to high temperature, a detection device of the bar-in testing device detects BT input abnormality and transfers its detection signal to a monitor device, thus enabling the BT substrate where the BT input abnormality occurred to be recognized and the number of BT input abnormalities to be counted. A BT substrate where abnormalities tend to occur easily can be found by collecting data obtained by counting the number of BT input abnormalities and by performing its statistical analysis.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、バーイン試験装置に関し、特にバーイン試験
装置に用いられる試験基板(以下BT基板と称す)の異
常を個別に管理するシステムに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a burn-in test device, and more particularly to a system for individually managing abnormalities in test boards (hereinafter referred to as BT boards) used in the burn-in test device.

〔従来の技術〕[Conventional technology]

バーイン試験装置は、半導体集積回路(以下、ICと称
す)に高温高電圧を長時間印加する事により、ICにス
トレスを加えてICの特性劣化を加速する装置であり、
ICを挿入し、バーイン試験装置に入れる基板がBT基
板である。このBT基板の管理として従来は、作業者が
定期的にBT基板の目視チエツクや治具を用いたチエツ
クを行うことで、BT基板のショートや破損を確認して
いた。
A burn-in test device is a device that applies high temperature and high voltage to a semiconductor integrated circuit (hereinafter referred to as an IC) for a long period of time, thereby applying stress to the IC and accelerating the deterioration of the characteristics of the IC.
The board into which an IC is inserted and placed in the burn-in test equipment is a BT board. Conventionally, this BT board has been managed by an operator periodically checking the BT board visually or using a jig to check for short circuits or damage to the BT board.

又、バーイン試験装置において、バーイン試験中に温度
や電圧ストレスによりICが破壊され、ICに異常電流
が流れた場合、ICのソケット及びBT基板は、破壊す
ることがある。この対策技術として、バーイン試験装置
はICへ印加する入力信号や入力電源の電圧レベルを検
出し、前記電圧レベルに異常が検出された場合、バーイ
ン試験装置のモニタランプに表示し異常が生じたBT基
板の電源をOFFする機能が有り、前記異常現象をBT
入力異常と称す。
Furthermore, in a burn-in test device, if an IC is destroyed due to temperature or voltage stress during a burn-in test and an abnormal current flows through the IC, the IC socket and BT board may be destroyed. As a countermeasure technology, the burn-in test equipment detects the voltage level of the input signal and input power supply applied to the IC, and if an abnormality is detected in the voltage level, it is displayed on the monitor lamp of the burn-in test equipment and the BT that has the abnormality is displayed. There is a function to turn off the power of the board, and the abnormal phenomenon can be prevented by BT.
This is called an input error.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のBT基板の管理は作業者が定期的にBT
基板の目視チエツクや治具を用いたチエツクにより、B
T基板のショートや破損など簡易な不具合のみの確認し
かできなかった為、BT基板上で生じる電圧ノイズによ
る異常、配線抵抗の異常、リーク電流による異常及び高
温による異常等の確認は非常に困難であるという欠点が
あった。
In the conventional BT board management described above, the operator regularly checks the BT board.
By visually checking the board or checking using a jig, B
Since we were only able to confirm simple defects such as short circuits and damage to the T board, it was extremely difficult to confirm abnormalities caused by voltage noise occurring on the BT board, abnormalities in wiring resistance, abnormalities due to leakage current, abnormalities due to high temperature, etc. There was a drawback.

〔発明の従来技術に対する相違点〕[Differences between the invention and the prior art]

上述した従来のBT基板の管理に対し、本発明は、バー
イン試験装置に個別のBT基板を認識させるための装置
とモニタ装置を具備し、BT基板を個別表示するための
バーコードをBT基板に具備したことにより、従来では
確認困難であったBT基板の電圧ノイズによる異常、配
線抵抗の異常、リーク電流による異常等の確認を可能す
るという相違点を有する。
In contrast to the conventional BT board management described above, the present invention includes a burn-in test device that includes a device and a monitor device for recognizing individual BT boards, and a bar code for displaying each BT board individually on the BT board. The difference is that it is possible to confirm abnormalities caused by voltage noise of the BT board, abnormalities in wiring resistance, abnormalities caused by leakage current, etc., which were difficult to confirm in the past.

〔課題を解決するための手段〕 本発明のバーイン試験装置のBT基板管理システムは、
バーイン試験装置に個別のBT基板を認識させるための
機能とモニタ装置を有し、BT基板を個別表示するため
のバーコードをBT基板に有している。
[Means for solving the problem] The BT board management system of the burn-in test device of the present invention includes the following:
It has a function and a monitor device for making the burn-in test device recognize the individual BT boards, and has a bar code on the BT board for individually displaying the BT boards.

〔実施例〕〔Example〕

次に本発明について、図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は、バーイン試験装置の一実施例の側面図である
。1はBT基板、2はバーイン試験装置炉、3は個別の
BT基板を認識する認識装置で、BT基板を比し入れす
る溝ごとに具備されている。
FIG. 1 is a side view of one embodiment of the burn-in test device. 1 is a BT substrate, 2 is a burn-in test equipment furnace, and 3 is a recognition device for recognizing individual BT substrates, which is provided for each groove into which a BT substrate is inserted.

4はモニタ装置でコンピュータを内蔵しており、各認識
装置と結線されたいる。5は、BT入力異常検出装置で
、バーイン試験装置のBT基板とl対lに対応した各ゾ
ーン毎に具備され、各々のBT入力異常検出装置はモニ
タ装置と結線されている。
4 is a monitor device which has a built-in computer and is connected to each recognition device. Reference numeral 5 denotes a BT input abnormality detection device, which is provided for each zone corresponding to the BT board of the burn-in test device in a one-to-one relationship, and each BT input abnormality detection device is connected to a monitor device.

第2図はBT基板の一実施例の上面図であり、1はBT
基板、6はバーコードであり、BT基板ごとに異なるバ
ーコードが具備されている。
FIG. 2 is a top view of one embodiment of the BT board, and 1 is a top view of an embodiment of the BT board.
The board 6 is a barcode, and each BT board is provided with a different barcode.

次にその動作の説明をする。Next, we will explain its operation.

バーイン試験装置へのBT基板挿入時に、BT基板に具
備しであるバーコードを認識装置が検知し、そのデータ
がモニタ装置に転送される。次に、BT基板上で生じる
電圧ノイズによる異常、配線抵抗の異常、リーク電流に
よる異常及び高温による異常のため、ICの特性が急激
に劣化しICに破壊等異常が生じた場合、バーイン試験
装置の異常検出装置は、BT入力異常を検出し、その検
圧信号をモニタ装置へ退転することで、モニタ装置は、
BT入力異常の発生したBT基板を認識しBT入力異常
の発生回数をカウントすることができる。前記BT入力
異常の発生回数をカウントしたデータを収集、統計する
ことにより、異常の生じやすいBT基板を見つけること
ができるため、従来確認困難であった、BT基板の電圧
ノイズ性。
When the BT board is inserted into the burn-in test equipment, a recognition device detects the barcode provided on the BT board, and the data is transferred to the monitor device. Next, if the characteristics of the IC suddenly deteriorate due to abnormalities caused by voltage noise generated on the BT board, abnormalities in wiring resistance, abnormalities due to leakage current, or abnormalities due to high temperature, the burn-in test equipment will be used. The abnormality detection device detects a BT input abnormality and sends the pressure detection signal to the monitor device, so that the monitor device can
It is possible to recognize the BT board on which the BT input abnormality has occurred and count the number of times the BT input abnormality has occurred. By collecting and statisticizing the data that counts the number of occurrences of the BT input abnormality, it is possible to find BT boards that are prone to abnormalities, and thus the voltage noise of the BT board, which has been difficult to confirm in the past, can be confirmed.

配線抵抗性、II流リーク性及び温度依存のある異常な
りT基板を確認することが可能となる。なお、上記実施
例では、バーコードをBT基板毎に具備して個別表示し
たが、バーコードの代用として、磁気テープ等を具備し
個別表示することて、上述と同等の機能を有することが
可能となる。
It becomes possible to check abnormal T substrates with wiring resistance, II flow leakage, and temperature dependence. In addition, in the above embodiment, a barcode was provided for each BT board and displayed individually, but as a substitute for the barcode, it is possible to provide the same function as described above by providing a magnetic tape or the like and displaying it individually. becomes.

第3図は、認識装置、モニタ装置と結線されたバーイン
試験装置の他の実施例の側面図である。
FIG. 3 is a side view of another embodiment of the burn-in test device connected to a recognition device and a monitor device.

2〜5まで第1図の実施例と同一である。第1図の実施
例では、認識装置をバーイン試験装置炉内に具備してい
たが1本実施例では認識装置をバーイン試験装置と別々
にしており、BT基板をバーイン試験装置に挿入する前
、または、排出した後に、作業者がBT基板のバーコー
ドを認識装置に検知させ、個別のBT基板を認識させる
。その他は、上記実施例と全く同しである。この実施例
2では認識装置がバーイン試験装置炉の外にある為、耐
熱性に劣る認識装置でも使用できるという利点がある。
2 to 5 are the same as the embodiment shown in FIG. In the embodiment shown in FIG. 1, the recognition device was provided in the burn-in test equipment furnace, but in this embodiment, the recognition device is separate from the burn-in test equipment, and before inserting the BT board into the burn-in test equipment, Alternatively, after the BT board is discharged, the operator causes the recognition device to detect the barcode of the BT board and recognizes the individual BT board. The rest is exactly the same as the above embodiment. In this second embodiment, since the recognition device is located outside the burn-in test equipment furnace, there is an advantage that even a recognition device with poor heat resistance can be used.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、バーイン試験装置に個別
のBT基板を認識させるための機能とモ二タ装置を具備
し、BT基板を個別表示するためのバーコードをBT基
板に具備することにより、従来認識困難であったBT基
板の電圧ノイズによる異常、配線抵抗の異常、電流リー
クによる異常、及び温度変化による異常等の確認ができ
る効果がある。
As explained above, the present invention includes a burn-in test device equipped with a function and a monitor device for recognizing individual BT boards, and a bar code for displaying individual BT boards on the BT boards. This has the effect of being able to confirm abnormalities caused by voltage noise on the BT board, abnormalities in wiring resistance, abnormalities due to current leaks, abnormalities due to temperature changes, etc., which have been difficult to recognize in the past.

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第3図はそれぞれ本発明の実施例のバーイ
ン試験装置の側面図である。第2図はそのBT基板の上
面図である。 1・・・・・・BT基板、2・・・・・・バーイン試験
装置炉、3・・・・・・認識装置、4・・・・・・モニ
タ装置、5・・・・・・BT入力異常検出装置、6・・
・・・・バーコード。 代理人 弁理士  内 原   晋
1 and 3 are side views of a burn-in test apparatus according to an embodiment of the present invention, respectively. FIG. 2 is a top view of the BT substrate. 1...BT board, 2...Burn-in test equipment furnace, 3...Recognition device, 4...Monitor device, 5...BT Input abnormality detection device, 6...
····barcode. Agent Patent Attorney Susumu Uchihara

Claims (1)

【特許請求の範囲】[Claims]  半導体集積回路に高温高電圧を印加することにより、
前記半導体集積回路の特性劣化を加速する機能を有する
バーイン試験装置に、前記半導体集積回路を搭載させて
前記バーイン試験装置に入れる試験基板を管理するに際
し、前記バーイン試験装置に個別の試験基板を認識させ
るための装置とモニタ装置とを具備し、試験基板を個別
表示するためのバーコードを前記試験基板に具備したこ
とを特徴とするバーイン試験装置の試験基板管理システ
ム。
By applying high temperature and high voltage to semiconductor integrated circuits,
When the burn-in test device having the function of accelerating characteristic deterioration of the semiconductor integrated circuit is used to manage the test substrates to be loaded into the burn-in test device with the semiconductor integrated circuit mounted thereon, the burn-in test device recognizes individual test substrates. 1. A test board management system for a burn-in test equipment, comprising: a test board management system for a burn-in test equipment, comprising: a test board management system for a burn-in test equipment;
JP2149376A 1990-06-07 1990-06-07 Test substrate control system of bar-in testing device Pending JPH0444243A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2149376A JPH0444243A (en) 1990-06-07 1990-06-07 Test substrate control system of bar-in testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2149376A JPH0444243A (en) 1990-06-07 1990-06-07 Test substrate control system of bar-in testing device

Publications (1)

Publication Number Publication Date
JPH0444243A true JPH0444243A (en) 1992-02-14

Family

ID=15473783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2149376A Pending JPH0444243A (en) 1990-06-07 1990-06-07 Test substrate control system of bar-in testing device

Country Status (1)

Country Link
JP (1) JPH0444243A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8647003B2 (en) 2010-01-13 2014-02-11 Seiko Epson Corporation Printing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312778B2 (en) * 1979-09-06 1988-03-22 Tomuson Sa
JPH01289133A (en) * 1988-05-16 1989-11-21 Hitachi Ltd Transport substrate for semiconductor devices and method for manufacturing semiconductor devices using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312778B2 (en) * 1979-09-06 1988-03-22 Tomuson Sa
JPH01289133A (en) * 1988-05-16 1989-11-21 Hitachi Ltd Transport substrate for semiconductor devices and method for manufacturing semiconductor devices using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8647003B2 (en) 2010-01-13 2014-02-11 Seiko Epson Corporation Printing device

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