JPH0451598A - Electronic component mounting equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus that holds electronic components and mounts them on a circuit board.

(Prior Art) A conventional electronic component mounting apparatus will be described with reference to FIGS. 4 and 5, taking a chip type electronic component mounting apparatus as an example.

FIGS. 4(a) and 4(b) are perspective views of a chip-type electronic component mounting device and a component supply device mounted thereon, and FIG. 5 is an explanatory diagram of the operating position of the suction head table.

In FIG. 4(a), the chip type electronic component mounting device is
A supply table 5 that freely slides in the Z-axis direction along a guide rail 1 and is driven by a nut 3 directly connected to a mounted electric motor 2 and a threaded rod 4 fitted thereto, as shown in FIG. 4(b).
As shown in FIG. 4, a component supply device 10 intermittently feeds a component storage band 7 containing chip-shaped electronic components (hereinafter referred to as electronic components) 6 from its supply reel 8 to a supply position by an electric motor 9; Returning to (,), the suction nozzle 11 is attached to the lower end, and the rotation gear 13 driven by the rotation attachment 12 is attached to the upper end, and the 1 is moved up and down freely by the drive device.
It consists of a transport table 15 on which zero suction shafts 14 are mounted at equal intervals around the circumference, and an XZ child table 6 on which a circuit board (not shown) is attached.

In addition, recently, electronic components 6 installed in electronic circuits have become smaller and lighter, and their dimensions have increased.

From L, 6XO, 8X0.5m, 1. OXo, 5X0.
It was miniaturized to 5m. Under such circumstances, in order to improve mounting accuracy, an image recognition device 17 for detecting the suction state of the electronic component 6 is provided below the above-mentioned transport table 15.

The operation of the electronic component mounting apparatus configured in this manner will be explained with reference to FIGS. 4 and 5.

First, the electric motor 9 of the component supply device 10 is activated to feed the electronic component 6 to a predetermined position.Next, the electric motor 2 is activated to move the supply table 5 in two directions at high speed to pick up the desired electronic component 6. The nozzle 11 moves to the component suction position.

FIG. 5 is a model diagram of the transport table 15 viewed from above, and the positions indicated by PIO clockwise from position (hereinafter referred to as P) 1 correspond to the mounting positions of the suction nozzles 11; An image recognition device is disposed at a position P3 where the table 15 rotates intermittently; an image recognition device 17 is disposed at a position P3, and a rotation device 12 is disposed at a position P5 and Pl.

At PI, the suction shaft 14 descends, and the suction nozzle 11 suctions the electronic component 6 from the component supply device 10. Next, when the conveyance table 15 is intermittently moved two steps and reaches P3, the image recognition device 17 is activated and calculates the positional deviation of the electronic component 6 after suction from the center of the suction nozzle 11. At P5, the rotating gear 13 of the suction shaft 14 engages with the rotating device 12, and rotates the electronic component 6 by an angle θ so as to match the mounting direction of the circuit board (not shown). In P6, the above image recognition device! Due to the positional deviation detected by 17,
The Z-table 6 operates to perform correction, and then the suction nozzle 11 descends to mount the electronic component 6 at a predetermined position on the circuit board.

In Pl, the rotating device again! 12, and rotates the angle θ rotated at P5 in the opposite direction. In P8, the electronic component 6 that is incorrectly installed is taken out.

Note that if the suction nozzle 11 needs to be replaced, it is performed in P9.

(Problem to be Solved by the Invention) However, in the above configuration, due to thermal expansion of the supply table 5 due to changes in ambient temperature and heat generated by the electric motor 2,
There was a problem in that each electronic component 6 could not be positioned at a predetermined suction position. In particular, when mounting a minute electronic component 6, there is a problem in that the electronic component 6 comes off from the tip of the suction nozzle 11 due to positional deviation that occurs when the supply table 5 accelerates or decelerates, resulting in poor suction.

The present invention solves the above problem and provides an electronic component mounting apparatus that does not cause suction failure.

(Means for Solving the Problems) In order to solve the above problems, the present invention prevents the positional displacement of electronic components 6 at the suction position! ! ! This is provided with a means for correcting the error and a means for correcting the error.

(Function) With the above configuration, before the electronic component 6 is suctioned by the suction nozzle 11, the recognition device measures the positional deviation of the electronic component 6 in the Z-axis direction due to the vibration and inertia force of the supply table 5, and By correcting the position 5, it is possible to maintain high reliability in component suction.

(Example) An example of the present invention will be described with reference to FIGS. 1 to 3.

1(a) and (b) are a side sectional view showing the main parts of the chip-type electronic component mounting device according to the present invention and a plan view of the component storage band, and FIG. 2 is a schematic diagram for explaining the operation thereof. The plan view and FIG. 3 are flowcharts of the operating procedure.

In FIG. 1(a), the difference between this embodiment and the conventional example shown in FIG. 4 is that the image US camera 1 focuses on the electronic component 6 at the component suction position below the suction nozzle 11 of
8 was installed. Since the rest is the same as the conventional example, the same components are given the same reference numerals and their explanations will be omitted.

The operation of the chip type electronic component mounting apparatus configured as described above is the same as the conventional example except for the suction operation from the supply table 5, so only the suction operation will be explained with reference to FIGS. 2 and 3.

In FIG. 2, first, the supply table 5 (not shown) on which the electronic component 6 is placed moves in the Z-axis direction (step #1
)0 Next, the transport table 15 on which the suction nozzle 11 is mounted
rotates once and moves to the suction position (step #2).

Next, the image recognition camera 18 shown in FIG. 1, which focuses on the electronic component 6 at the suction position, recognizes the positional deviation in the Z-axis direction (step #3) and instructs the Z-axis electric motor 2 to correct the amount. Step #4), complete the correction (Step #5)
).

After the correction is completed, the suction shaft 14 descends and suctions (step #6).

(Effects of the Invention) As explained above, according to the present invention, the positional deviation of the electronic component at the suction position is corrected, so it is possible to prevent suction failure caused by the suction position deviation, and the suction rate is high. A reliable electronic component mounting apparatus can be obtained.

[Brief explanation of the drawing]

FIGS. 1(a) and (b) are a side sectional view of essential parts of an electronic component mounting apparatus according to the present invention and a plan view of a component storage band, and FIG. 2 is a schematic diagram showing the positions of a nozzle and a component supply section. A plan view, FIG. 3 is a flowchart showing the operating procedure of the embodiment, and FIGS. 4(a) and (b) are perspective views of a conventional electronic component mounting device and a component feeding device mounted thereon. , FIG. 5 is a schematic plan view of the transport table for explaining its operation. 1... Guide rail, 2, 9... Electric motor, 3...
Nut, 4... Threaded rod, 5... Supply table,
6... Chip type electronic component (electronic component), 7...
Component storage belt, 8... Supply reel, 10... Component supply device, 11... Suction nozzle, 12... Rotation device, 13... Rotation gear, 14... Suction shaft,
15... Conveyance table, 16... Xz child table 17... Image recognition device, 18... Image recognition camera. Patent applicant: Matsushita Electric Industrial Co., Ltd. Representative: Koji Hoshino ÷ pull i 7- pull storage belt 11---013-nos ゛J[ 18-fmLk name 1- sword
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Claims (1)

[Claims] A supply table that is equipped with one or more component supply devices and can freely slide in the longitudinal direction to supply electronic components to a suction position, and a transport table that is equipped with a plurality of suction shafts with suction nozzles attached to the bottom end. , an electronic component mounting apparatus comprising a mounting table for mounting a circuit board on which an electronic component is to be mounted;
An electronic component mounting apparatus characterized by comprising a position correction amount calculation means and a position correction command means for a supply table.