JPH048515A - Manufacture of laminated plate - Google Patents
Manufacture of laminated plateInfo
- Publication number
- JPH048515A JPH048515A JP2112126A JP11212690A JPH048515A JP H048515 A JPH048515 A JP H048515A JP 2112126 A JP2112126 A JP 2112126A JP 11212690 A JP11212690 A JP 11212690A JP H048515 A JPH048515 A JP H048515A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- piled
- base
- end parts
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000000835 fiber Substances 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 6
- 238000011109 contamination Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- -1 Merck Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、含浸樹脂の流出なく、シたがって打痕及び異
物混入の原因なき積層板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a laminate without outflow of impregnated resin and thus without causing dents or foreign matter contamination.
牛導体の技術進歩及び電子機器の発達に伴って。 With the technological progress of cow conductors and the development of electronic equipment.
積層板の需要は益々多く、さらに高機能化の要求が強い
。従来、この積層板の製造方法は、fM繊維基材連続的
に4!1脂を含浸乾燥して得たプリプレグの1枚または
複数枚t−電ね加熱加圧して成形する。The demand for laminates is increasing, and there is a strong demand for higher functionality. Conventionally, the method for producing this laminate is to mold one or more sheets of prepreg obtained by continuously impregnating and drying an fM fiber base material with 4!1 fat by heating and pressing with a T-electrode.
成るいは、さらにプリプレグの片面または両面に金属箔
を重ね加熱加圧して金1s陥張り積層板を作る。Alternatively, metal foil is further layered on one or both sides of the prepreg and heated and pressed to produce a gold 1s recessed laminate.
この積層板の製造においては、加熱加圧時に含浸樹脂が
基材外1cfi出し、打痕、異物混入等の製品不良の原
因となる。In the production of this laminate, 1 cfi of the impregnated resin comes out of the base material during heating and pressing, causing product defects such as dents and foreign matter contamination.
この問題は、常温で液状かつ#溶剤の熱硬化性樹脂上使
用する際には特に起きることが多い。This problem often occurs especially when used on thermosetting resins that are liquid at room temperature and in #solvent.
本発明は、上記の問題点奮おこすことなく、打痕及び異
物混入等の不良原因が少ない積層板の製造方法1r!!
供すること全目的とする。The present invention provides a method for manufacturing a laminate that does not cause the above-mentioned problems and has fewer causes of defects such as dents and foreign matter contamination! !
The entire purpose is to serve
上記の目的を達成するために、不発明は、長尺一定幅の
繊維基材に、その長さ方向両側趨部會除き、熱硬化性樹
脂液を間欠的に連続塗布して長さ方向一定長さ毎に一定
幅の不塗布部を作り、該基材會該不塗布部毎に切断して
四辺形基@を得る0これを加熱半硬化状態として得たプ
リプレグの複数枚を重ね、成るいはさらにその片面又は
両面に鋼箔を重ね加熱加圧する積層板又は銅張り積層板
の製造方法である0
使用する熱硬化性樹脂は、フェノール樹脂、エポキシ樹
脂、不飽和ポリエステル樹脂、ジアリルフタレート樹脂
、不飽和アクリル樹脂、ビニルエステル樹脂等全般にわ
たって通用できる0これに充填剤として、水酸化アルミ
ニウム、クレー、メルク、ワラストナイト、三酸化アン
チモン、五酸化アンチ七ン成るいはこれらの混せ物勿使
用可能である。In order to achieve the above object, the present invention is to apply a thermosetting resin liquid intermittently and continuously to a long fiber base material having a constant width, excluding both sides of the fiber base material in the length direction. A non-coated part of a certain width is made for each length, and the base material is cut into each non-coated part to obtain a quadrilateral base. Multiple sheets of prepreg obtained by heating and semi-curing are stacked to form a This is a method for manufacturing laminates or copper-clad laminates in which steel foil is further layered on one or both sides and heated and pressed.0 The thermosetting resins used are phenolic resin, epoxy resin, unsaturated polyester resin, diallyl phthalate resin. , unsaturated acrylic resin, vinyl ester resin, etc. As a filler, aluminum hydroxide, clay, Merck, wollastonite, antimony trioxide, antiseptane pentoxide, or a mixture thereof. Of course it can be used.
上記の樹脂を含浸する繊維基材には、ガラス、アスベス
ト等の無機繊維成るいはポリエステル、ポリアミド等の
有機仕成緻維會利用した織布、マット又は焼結シー)t
−用いる0又、リンター紙、クラフト紙及びこれらの混
抄紙、成るいは紙と無機繊維との混抄紙も使用可能であ
り、これら基材の組付わせでも良い0
紙基@全便用する揚台は、熱硬化性樹脂全長尺する前に
、予備処理tして積層板の耐温性及び打抜加工性を向上
させる0この予備処理にはメチロール基含有の2エノー
ル樹脂、メラミン榴脂、尿素樹脂等會用いる。The fiber substrate impregnated with the above resin may be a woven fabric, mat, or sintered sheet made of inorganic fibers such as glass or asbestos, or organic fibers such as polyester or polyamide.
- It is also possible to use linter paper, kraft paper, mixed paper of these, or mixed paper of paper and inorganic fibers, and it is also possible to combine these materials. Before making the entire length of the thermosetting resin, the base is pre-treated to improve the temperature resistance and punching workability of the laminate. Urea resin etc. are used.
本発明において、熱硬化性樹脂全長尺一定幅の繊維基材
に間欠的に連続塗布し、かつ基拐長さ方向の両側端部を
塗布しない。一定長さ毎に生じ。In the present invention, the thermosetting resin is continuously applied intermittently to the fiber base material having a constant width over the entire length, and the both ends in the length direction of the base material are not coated. Occurs at regular intervals.
長さ方向に直角位にある不塗布部葡切断して得る樹脂塗
布基材は、その四辺端部に不塗布部分全幅比0.5〜2
0%で有する。樹脂の塗布方法は、スクリーンコーチイ
ン!、 O−ラー’:1−ティング、キスコーティン
グ等全利用して間欠的に連続塗布する。The resin-coated base material obtained by cutting the non-coated part at right angles to the length direction has a total width ratio of 0.5 to 2 on the four sides of the non-coated part.
It has 0%. The resin application method is screen coach-in! , O-ler': Apply intermittently and continuously using all methods such as 1-ting and kiss coating.
上記の方法によって得た一定寸法の樹脂含浸基材から得
たプリプレグを重ね加熱加圧成形して積層板を作る。The prepreg obtained from the resin-impregnated base material of a certain size obtained by the above method is stacked and heated and press-molded to produce a laminate.
本発明の方法によると、流出しようとする流動樹脂會不
造布部分が吸収して、鏡板及び熱板への付st−防ぐた
めに、シ品の打痕、A物の混入不良を低減することがで
きる0
〔実施例〕
本発明の5i!施例に用いる樹脂塗布装置i會図によっ
て説明する0第1図は装置側面、第2図は正面図である
。長尺基材1は、樹脂槽2に浸漬して回転するピックア
ップロール6と接して回転するノ(ブタアブブロール4
との間で樹脂km布さn、ガイドロール5,6を経て切
I!IT機7によって切断される。バックアップロール
4t、第1図に示す状態のように、上方に揚げることt
間欠的に行なうと、その間一定長さだけ樹脂の不塗布s
t−生ずる0ドクター刃9t−、第2図に示すように、
ピックアップロール3の両端部に独立して固定し、基材
の両側端部に樹脂全塗布しないようにする0次に上記装
置112用の実施例全説明するO厚さCL25齢、秤量
140 g/醪のクラフト紙(山場国策パルプ製)をメ
チロールメラミン樹脂(8豆化成ML−630)で予備
処理して付着樹脂分14%の処理紙七得た0これに不飽
和ポリエステル樹脂(日立化成ボリセッ)PS−910
7)100重量部に対してBPOペースト(50%過酸
化ベンゾイル)2Nik部及び水鍍化アルミニウム20
重量部を添加して得た樹脂を樹脂槽2に入れ、上記の長
尺処理紙を装置に流し、切断寸法101000X100
0、周辺3114幅50 BctvaBk含浸基材8奮
得た。この試料7牧1[ね、そり土下金厚さ2都の鋳板
で挟み、120℃、20kg/Uで25分硬化して積層
板を得た。According to the method of the present invention, in order to prevent the non-woven fabric portion of the flowing resin from flowing out and being attached to the mirror plate and the hot plate, it is possible to reduce dents on the product and defects in the product A. 0 [Example] 5i of the present invention! 1 is a side view of the apparatus, and FIG. 2 is a front view thereof. The long base material 1 is immersed in a resin bath 2 and rotates in contact with a rotating pick-up roll 6.
The resin km is cut between the cloth and the guide rolls 5 and 6. It is disconnected by the IT machine 7. Backup roll 4t, as shown in Fig. 1, fry it upwards.
If done intermittently, no resin will be applied for a certain length of time.
t-Produced 0 doctor blade 9t-, as shown in Figure 2,
It is fixed independently to both ends of the pick-up roll 3 to prevent the resin from being completely applied to both ends of the base material. Next, the embodiment for the above device 112 will be fully explained. O thickness CL 25 years, weight 140 g/ Moromi's kraft paper (manufactured by Yamaba Kokusaku Pulp) was pre-treated with methylol melamine resin (8 Mame Kasei ML-630) to obtain treated paper with an adhesion resin content of 14%. This was then treated with unsaturated polyester resin (Hitachi Kasei Volise). PS-910
7) 2 parts of BPO paste (50% benzoyl peroxide) and 20 parts of hydrochlorinated aluminum per 100 parts by weight
The resin obtained by adding parts by weight is placed in the resin tank 2, and the long treated paper is passed through the device, and the cutting size is 101000 x 100.
0, Perimeter 3114 Width 50 BctvaBk impregnated base material 8 was obtained. This sample 7 was sandwiched between two casting plates with a thickness of 1 and 2 mm, and cured at 120° C. and 20 kg/U for 25 minutes to obtain a laminate.
(比較例)
実施例で用いたと同じ拘脂奮同じ基材に塗布し、全面樹
脂塗布の+000x1000mmk得た。この樹脂含浸
基材′に7枚重ねた後、上下全厚さ2IVの鋳板で挟み
、120℃、20kg/aIIで25分間加熱加圧して
積層板を得た。(Comparative Example) The same resin coating as used in the example was applied to the same substrate to obtain a resin-coated surface of +000x1000 mm. After stacking seven sheets on this resin-impregnated base material', they were sandwiched between upper and lower casting plates having a total thickness of 2IV, and heated and pressed at 120° C. and 20 kg/aII for 25 minutes to obtain a laminate.
実施例と比較例で得た各檀層板試料七加熱加圧成形した
時の樹脂流出量を表1に示す。表中の樹脂流れ%は(基
材から流出したM8脂量g)/(樹脂含浸基材g)によ
って得た。Table 1 shows the amount of resin flowing out when each of the wooden laminate samples obtained in Examples and Comparative Examples was heated and press-molded. The resin flow % in the table was obtained by (amount of M8 fat flowing out from the base material, g)/(resin-impregnated base material g).
表1
〔発明の効果〕
本発明の方法VCLる冥施例での樹脂流れを工非常に少
ない結果を示し、これに反して従来法による樹脂流れは
大きい。Table 1 [Effects of the Invention] The resin flow in the VCL method of the present invention was very small, whereas the conventional method resulted in a large resin flow.
この結果によって1本発明の方法による積層板にを工打
痕及び異物混入の不良原因も少ないこと全確認した。From this result, it was confirmed that the laminate produced by the method of the present invention has fewer defects due to machining dents and foreign matter contamination.
第1図は本発明の装置側面図、第2図は第1図の装置正
面図である。
1・・・・・・基材、 2・・・・・・樹脂
槽、3・・・・・・ピックアップミール、 4・・・・
・・バックアラフロール、5.6・・・・・・ガイドロ
ール、 7・・・・・・切断機。
8・・・・・・樹脂含浸基材、 9・・・・・・ドク
ター刃。
第2図FIG. 1 is a side view of the device of the present invention, and FIG. 2 is a front view of the device shown in FIG. 1...Base material, 2...Resin tank, 3...Pickup meal, 4...
... Back rough roll, 5.6 ... Guide roll, 7 ... Cutting machine. 8...Resin-impregnated base material, 9...Doctor blade. Figure 2
Claims (1)
さ方向の両側端部を除き、間欠的に連続塗布して長さ方
向一定長さ毎に一定幅の不塗布部を作り、さらに該基材
を該不塗布部毎に切断して四周辺に不塗布部を有する樹
脂含浸基材として得たプリプレグの複数枚を重ね、或る
いはその片面又は両面にさらに金属箔を重ねて加熱加圧
成形することを特徴とする積層板の製造方法。1. Apply thermosetting resin liquid to a long fiber base material of a constant width intermittently and continuously, except for both ends in the length direction of the base material, and do not apply a constant width at every constant length in the length direction. The base material is then cut into uncoated parts to obtain a resin-impregnated base material having four non-coated parts on the four peripheries. A method for manufacturing a laminate, characterized by stacking foils and forming them under heat and pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2112126A JPH048515A (en) | 1990-04-27 | 1990-04-27 | Manufacture of laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2112126A JPH048515A (en) | 1990-04-27 | 1990-04-27 | Manufacture of laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048515A true JPH048515A (en) | 1992-01-13 |
Family
ID=14578850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2112126A Pending JPH048515A (en) | 1990-04-27 | 1990-04-27 | Manufacture of laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048515A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012167260A (en) * | 2011-01-27 | 2012-09-06 | Sumitomo Bakelite Co Ltd | Prepreg continuum and prepreg |
| US9297061B2 (en) | 2007-02-16 | 2016-03-29 | Kaneka Corporation | Transparent electroconductive film and process for producing the same |
-
1990
- 1990-04-27 JP JP2112126A patent/JPH048515A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9297061B2 (en) | 2007-02-16 | 2016-03-29 | Kaneka Corporation | Transparent electroconductive film and process for producing the same |
| JP2012167260A (en) * | 2011-01-27 | 2012-09-06 | Sumitomo Bakelite Co Ltd | Prepreg continuum and prepreg |
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