JPH0529746A - Semiconductor mounting board - Google Patents

Abstract

PURPOSE:To reduce an occupancy area by placing some of semiconductor parts on the recessed part or in the hole provided in a substrate. CONSTITUTION:Upper two layers 1a and 1b of a substrate 1 consisting of three layers, that is 1a, 1b and 1c, are provided with a hole, thus forming a recessed part 2 as a whole. Within the recessed part 2, a semiconductor parts 3 is arranged. As to a semiconductor mounting substrate such as this, since at least a part of semiconductor parts is placed on the recessed part or in the hole provided on the substrate, the occupancy area on the semiconductor mounting substrate becomes smaller than that of a conventional one. Therefore, in proportion to that, the limitation related with design of precision equipments which include the semiconductor mounting substrate is decreased such that even the smaller precision equipments, etc., can be constituted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting board on which semiconductor parts are mounted.

[0002]

2. Description of the Related Art In recent years, the number of pins of semiconductor circuit parts has tended to increase, and the number of pins has been increased. There is a tendency for electronic circuits having extremely many functions to be arranged.

[0003]

Although it has become possible to arrange an electronic circuit having an extremely large number of functions in a small space as described above, for example, a precision instrument and an electronic circuit for controlling the same are required. In the case of delicate small robots, electronic cameras, etc. that are connected to each other, it is still difficult to secure the space for arranging the semiconductor substrate on which circuit components such as semiconductor components are mounted. In some cases, the space occupied by the semiconductor substrate is required to be further reduced.

In view of the above circumstances, it is an object of the present invention to provide a technique for further reducing the occupied space of a semiconductor mounting board on which semiconductor components are mounted, as compared with the prior art.

[0005]

The semiconductor mounting board of the present invention for achieving the above object is characterized in that at least a part of semiconductor components is arranged in a recess or a hole provided in the board. To do. Here, the substrate may be a substrate composed of only one layer or a multilayer substrate composed of a plurality of layers. The outer shape of the semiconductor component is not particularly limited.
(Plastic led chip carr
ier) or QFP (quad flat packag)
What is enclosed in a package such as e) is suitable.

[0006]

In the present invention, since the substrate is provided with a recess or hole and at least a part of the semiconductor components is arranged in the recess or hole, the occupied space is reduced as compared with the conventional case, and for example, the mechanical component placement space is provided. It is also possible to locally thin only the part that competes with. As a result, there are less restrictions on the design of precision equipment and the like that incorporates the semiconductor mounting board, and it is possible to configure smaller precision equipment and the like.

[0007]

EXAMPLES Examples of the present invention will be described below. FIG. 1 is a perspective view schematically showing a part of a semiconductor mounting board according to an embodiment of the present invention. Holes are formed in the upper two layers 1a, 1b of the substrate 1 consisting of the three layers 1a, 1b, 1c to form a recess 2 as a whole, and the semiconductor component 3 is arranged in the recess 2.

FIG. 2 is a side sectional view schematically showing a part of a semiconductor mounting board according to another embodiment of the present invention. In this embodiment as well, the substrate 5 is formed of three layers 5a, 5b, 5c, but a hole 6 penetrating these three layers 5a, 5b, 5c is provided, and the semiconductor component 7 is placed in this hole 6. It is inserted and is connected to the wiring between the first layer 5a and the second layer 5b. In the present invention, the semiconductor component may be arranged in the hole penetrating the substrate as described above.

FIG. 3 is a side sectional view schematically showing a part of a semiconductor mounting board according to still another embodiment of the present invention.
The semiconductor components 9 and 10 are arranged on the surface of the substrate 8 composed of the three layers 8a, 8b and 8c in the same arrangement form as the conventional one. Holes are formed in the layers 8a and 8b to form a recess 12 as a whole, and the semiconductor component 13 is arranged in the recess 12. As described above, only some of the plurality of semiconductor components may be arranged in the recess or the hole.

In each of the above embodiments, a substrate having three layers is used, but this substrate does not have to have three layers and may be a substrate having any layer including only one layer.

[0011]

As described above, in the semiconductor mounting board of the present invention, at least some of the semiconductor components are arranged in the recesses or holes provided in the board. The occupying space can be made smaller than in the conventional case, and accordingly, there are less restrictions on the design of the precision equipment or the like incorporating the semiconductor mounting board, and a smaller precision equipment or the like can be configured.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing a part of a semiconductor mounting board according to an embodiment of the present invention.

FIG. 2 is a side sectional view schematically showing a part of a semiconductor mounting board according to another embodiment of the present invention.

FIG. 3 is a side sectional view schematically showing a part of a semiconductor mounting board according to another embodiment of the present invention.

[Explanation of symbols]

1, 5, 8 substrate 2, 12 recess 6 hole 3, 7, 9, 10,
13 Semiconductor parts

Claims (1)

Claim: What is claimed is: 1. A semiconductor mounting board on which a semiconductor component is mounted, wherein at least a part of the semiconductor component is arranged in a recess or a hole provided in the substrate. Mounting board.