JPH05319403A - Storage container for electronic component which is apt to be broken by static electricity - Google Patents

Abstract

PURPOSE:To provide a storage container which can protect an electronic component such as an IC or CCD from being broken by static electricity. CONSTITUTION:A laminated sheet 11 for which a conductive sheet 12 and PVC sheet 14 are lamianted is press-molded into a shape which approximately goes along the outer shape of the component, and a component storage part 21 with an opening 20 is formed. When a CCD 110 is stored in the component storage part 21, the CCD 110 is covered by a conductive sheet F, and the conductive sheet F is heated and welded to the PVC sheet 14 around the opening 20, for the constitution of the present storage container. Therefore, a storage container which is excellent in dustproof propety, moistureproof property and shock resistance in addition to antistatic property, and is compact and has a favorable appearance also.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION This invention relates to a semiconductor integrated circuit (I
C), a hybrid IC, a semiconductor device such as a solid-state imaging device (CCD), or an electronic component such as a liquid crystal device (LCD) that is easily destroyed by static electricity (hereinafter simply referred to as “component”) is electrostatically destroyed or externally exposed. The present invention relates to a container that can protect from impacts and can prevent dust and moisture.

[0002]

2. Description of the Related Art At present, there are tray type containers, stick type containers, embossed carrier tapes, etc. as containers for storing ICs and CCDs, and bags as containers for storing LCDs. It uses a container like this.

When a sample such as an IC is to be distributed to a customer, the tray type container made of plastic, which is originally suitable for automatic mounting used for manufacturing electronic equipment in a factory, is diverted and distributed. There is. As such a plastic tray type container, there is one shown in FIGS. 11 to 18. That is,

The one shown in FIG. 11 is a long plastic container developed for housing an IC to be surface-mounted on a printed wiring board, and has a flat lid 1 having a U-shaped cross section.
And a tray 2 having a plurality of storage portions 3 for storing semiconductor elements formed therein. The lid 1 has guide rails 4 formed on both inner side surfaces of its opening, and on the other hand, below the both side surfaces of the tray 2. Is formed with a guide groove 5 into which the guide rail 4 is fitted, and the tray 2 is guided and slid on the guide rail 4 by the guide rail 4 and the guide groove 5, and is covered by the lid 1. ing. The lid 1 and the tray 2 are molded by an injection molding method.

Next, the container shown in FIG. 12 is a so-called stick type container. This is a magazine 6 which is a long plastic storage container developed to store ICs for inserting pins into a printed wiring board, and is formed by drawing to form a storage space 7 having a U-shaped cross section. A plurality of ICs 8 are inserted and housed in the housing space 7 by a method. In this case, the main body portion 8a of the IC 8 is the storage space portion 7
In the lateral space portion 7a of the IC 8 and the leads 8b led out to both ends of the IC 8 in the longitudinal space portions 7b of the storage space portion 7
The main body portion 8a is protected by the upper and lower plastic plates 6a of the magazine 6, and the leads 8b are protected by the left and right plastic plates 6b of the magazine 6, respectively.

Further, the one shown in FIG. 18 is a magazine 6 which is also a long container made of plastic developed for housing the IC 8 which is surface-mounted on the printed wiring board. The space 7 is formed by a drawing method so as to be configured, and a plurality of I
C8 is inserted and stored. Also in this case, the main body portion 8a of the IC 8 corresponds to the lateral space portion 7a of the storage space portion 7, and the leads 8 led out to both ends of the IC 8 correspond to both vertical space portions 7b of the storage space portion 7 and correspond to the outer shape of the IC 8. The main body portion 8a is placed on the upper and lower plastic plates 6 of the magazine 6.
At a, the leads 8b are protected by the outermost plastic plates 6b of the magazines 6, respectively.

[0007]

However, in such a container, it is difficult to automate a series of operations such as storing parts, packing (bundling, bagging, boxing), and labeling.
As a result, it requires a lot of manpower. And again, many materials are required to make the container, which is costly.

In order to use such a container as a sample container, the container shown in FIG. 11 is exclusively used for both the lid and the tray and is manufactured by injection molding using an expensive mold. It is expensive because it Further, the magazines of FIGS. 12 and 18 have a long length, and if the quantity of electronic components is less than a certain amount, the products move in the magazine, and there is a drawback that fractional packaging cannot be performed. Therefore, in order to improve the portability of the magazine, it is necessary to cut the magazine into short pieces, additional processing for that is required, and even if the magazine is shortened to improve portability, it does not look good. The present invention is intended to solve such problems and to provide a container capable of preventing dust, moisture, and preventing static electricity.

[0009]

Therefore, according to the present invention, a laminated sheet in which a conductive sheet and a plastic sheet are laminated is embossed into a shape substantially conforming to the outer shape of the component to form a component storage portion having an opening, When a component is stored in the component storage portion, the electronic component is covered with a conductive sheet, and the conductive sheet can be welded to the plastic sheet around the opening to solve the above problem. ..

[0010]

Therefore, if the container of the present invention is used, dustproof,
Not only can it be moisture-proof and can protect ICs and other parts from static electricity damage and external shocks,
When the goods are distributed to the customer as a sample, the quantity can be selected, and the appearance is good and a good impression can be given.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, the structure of a laminated sheet that can be used in the container body of the present invention will be described with reference to FIG. FIG. 1 shows a partial perspective view thereof. Reference numeral 11 indicates the laminated sheet as a whole, and the laminated sheet 11 has an aluminum foil 12 in the center layer, and one surface of the laminated foil 11 is, for example, a polyvinyl chloride sheet (hereinafter referred to as a polyvinyl chloride sheet) via an adhesive layer 13. , "PVC sheet") is laminated, and on the other surface, for example, a PET sheet or a nylon sheet 16 impermeable to air or moisture is laminated via an adhesive layer 15. The total thickness of the laminated sheet 11 is, for example, about 220 μm. The laminated sheet 11 does not have to have such a five-layer structure, and may have two layers or three layers. The point is that the laminated sheet is electrically conductive and not breathable.

The container of the present invention is formed by molding such a flat laminated sheet 11 to form its main body.
The container of the first embodiment will be described with reference to FIG. The laminated sheet 11 is pressed by a pair of molds to form the opening 2
A housing main body H is formed of a component storage portion 21 having 0, an adhesive portion 22 surrounding the periphery of the opening 20, and a reinforcing flange 23.

The component storage portion 21 has a trapezoidal convex portion 24 capable of supporting the semiconductor device, the main body 111 of the CCD 110 in this example, and the leads 112 and 113 of the CCD 110 floating around the trapezoidal convex portion 24 from the bottom surface thereof. It is composed of a concave portion 25 having a width and a depth that can be stored in a closed state.

Further, the height of the trapezoidal convex portion 24 is lower than the surface of the adhesive portion 22, but the trapezoidal convex portion 2 is formed.
When the main body 111 of the CCD 110 is mounted on the CCD 4, the other surface of the main body 111 is formed to have a height that is sufficiently exposed from the surface of the adhesive portion 22 through the opening 20.

The main body 111 of the CCD 110 is placed on the trapezoidal convex portion 24 of the component storage portion 21 of the main body H of the above structure, and both leads 11 of the CCD 110 are placed in the concave portion 25.
Store in the state that 2,113 floated. In this case, as described above, a part of the main body 111 of the CCD 110 is mounted in a state of being fully exposed from the surface of the adhesive portion 22 through the opening 20.

Then, for example, an aluminum laminated sheet, a transparent (not necessarily transparent), antistatic-treated conductive sheet F based on PET or the like is used as the openings 20 and the bonding portions 22. Of the conductive sheet F is melted by applying heat to the portion corresponding to the adhesive portion 22 around each opening 20, and is welded to the PVC sheet 14 of the laminated sheet 11.

On the conductive sheet F, the exposed C
A holding recess 2 along the contour of the main body 111 of a part of the CD 110
6 is formed, and an escape recess 27 is formed at the center of the restraining recess 26.

When the CCD 110 housed in the conductive sheet F having such a structure is covered, the peripheral portion of the upper surface of the main body 111 of the CCD 110 can be pressed by the stepped portion of the holding recess 26, so that the housed CCD 110. Does not rattle during transportation. Further, the escape recess 27 can protect the light receiving surface 114 of the CCD 110.

Further, if a separating means S such as a perforation or a V-shaped cut groove is provided between the adjacent component storage portions 21, it is possible to easily divide them one by one to separate them.
Further, as will be described later, it can be bent at the separating means S portion depending on the usage of the container.

Next, a second embodiment of the container of the present invention will be described with reference to FIG. Although only one unit of the container is shown in this drawing, in reality, a plurality of containers are formed at the same time, as described later. The same components as those of the container of the first embodiment are designated by the same reference numerals.

In this embodiment, the QFP type IC 120 is used as the electronic component. The container body Ha is formed by embossing the flat laminated sheet 11 to form the container body H of the first embodiment.
In the same manner as described above, a container body H is formed which includes a component storage portion 21 having an opening 20 and an adhesive portion 22 surrounding the opening 20. However, in the case of this embodiment, the reinforcing flange 23 of FIG. 2 is not formed.

The component storage portion 21 has a QF from the bottom.
Trapezoidal protrusion 24 capable of supporting the main body 121 of the P-type IC 120
a and a concave portion 25 having a width and a depth which can accommodate the leads 122 derived from the four sides of the main body 121 in a floating state around the trapezoidal convex portion 24a.

Further, the height of the trapezoidal convex portion 24a is such that the main body 1 of the QFP type IC 120 is located on the trapezoidal convex portion 24a.
When 21 is mounted, the other surface of the main body 121 is formed at a height sufficiently lower than the surface of the adhesive portion 22 from the opening 20.

The QFP type IC 1 is provided on the trapezoidal convex portion 24a of the component storage portion 21 of the storage device main body Ha having such a configuration.
The main body 121 of 20 is placed, and the leads 122 of the QFP type IC 120 are accommodated in the four recesses 25 in a floating state.
In this case, as described above, the main body 1 of the QFP type IC 120
21 is mounted in a state in which it is sufficiently lower than the surface of the adhesive portion 22 from the opening portion 20.

Thereafter, for example, an aluminum laminated sheet, a transparent (not necessarily transparent) plastic sheet having an antistatic treatment, and a buffer portion 28 formed by enclosing air on one surface thereof is formed. Conductive sheet Fa having
Over the entire surface of each of the openings 20 and the adhesive portion 22, and heat is applied to a portion corresponding to the adhesive portion 22 around each of the openings 20 to melt a part of the conductive sheet Fa, thereby forming the laminated sheet. 11 PVC sheet 14 is welded.

The buffer portion 28 is formed so as to be positioned at the central portion of the main body 121 of the QFP type IC 120 when it is welded in this way, and at a height that presses the surface of the main body 121.

When the top of the QFP type IC 120 housed in the conductive sheet Fa having such a structure is covered, the buffer section 2 is formed.
Since the top surface of the central part of the main body 121 of the QFP type IC 120 can be lightly pressed by the tip of 8, the stored QFP
The type IC 120 does not rattle during transportation.

The buffer portion 28 of the above-described embodiment is used as each component storage portion 2
Although it is formed so that only one is distributed to one, as shown in FIG. 4, a plurality of small buffer portions 28 are formed at predetermined intervals on the entire one surface of the conductive sheet Fb. Alternatively, such a conductive sheet Fb may be covered on the entire surface of each of the plurality of openings 20 and the bonding portion 22, and a portion corresponding to the bonding portion 22 around each opening 20 may be heated and welded. .. At this time, the buffer portion 28 at the portion corresponding to each adhesive portion 22 is destroyed by the applied heat, and the film enclosing the air is also melted by the heat and adhered to the adhesive portion 22.

Next, a fourth embodiment of the container of the present invention will be described with reference to FIG. In this figure also, only one unit of the container is shown. The same components as those of the container of the first embodiment are designated by the same reference numerals.

In this embodiment, a liquid crystal device (LCD) used for a monitor of a video camera is used as an electronic component. As shown in FIG. 1B, the appearance of the LCD 130 is composed of a display unit 131 composed of a liquid crystal panel and a terminal unit 132 composed of a flexible circuit board in which conducting wires for supplying a video signal, a control signal and the like are put together. ing.

The container body Hc has an opening 20 formed by embossing a flat laminated sheet 11 into a component container 2
1c and an adhesive portion 22 surrounding the opening 20. The bottom surface of the component storage portion 21c has an LCD 13
When 0 is stored, the upper surface of the display portion 131 is formed to be the same surface as the surface of the adhesive portion 22 or a recess portion 29 having a depth that is slightly lower than that.

The LCD 130 is placed on the component housing 21c of the housing body Hc having the above-mentioned structure, and then the transparent conductive sheet F is covered on the entire surfaces of the opening 20 and the adhesive 22 to form the opening 20. A part of the conductive sheet F is melted by applying heat to the peripheral portion corresponding to the adhesive portion 22, and is welded to the PVC sheet 14 of the laminated sheet 11. It should be noted that the peel portion 30 is formed without heating a part during the welding. By packing the LCD 130 in this way, it is possible to protect it from moisture and static electricity.

A container improved from the container of the fourth embodiment accommodating the LCD 130 is shown in FIG. 6 as a fifth embodiment. The container of this embodiment is an improvement of the container body Hc of the container of the embodiment of FIG. In this figure also, only one unit of the container is shown. The same components as those of the container of the fourth embodiment are designated by the same reference numerals.

The housing main body Hd has a component housing 2 having an opening 20 formed by embossing a flat laminated sheet 11.
1d and an adhesive portion 22 surrounding the opening 20
And a reinforcing flange 23.

The bottom surface of the component storage portion 21d is the LCD 1
When accommodating 30, a concave portion 31 having a depth such that the upper surface of the display portion 131 is flush with or slightly lower than the surface of the adhesive portion 22, and the concave portion 31 is continuous with the concave portion 31. A concave portion 32 having a depth capable of supporting the terminal portion 132 protruding from the display portion 131, and a liquid crystal panel surface of the display portion 131 in the central portion of the concave portion 31 so that the laminated sheet 11 is not touched. And an escape recess 31a serving as a buffer member for the. The recess 31 and the escape recess 31a form a step 31b.

The reinforcing flange 23 is formed with a dimension longer than the depth of any of the recesses. Clogged, and the component storage portion 21d is floated by the reinforcing flange 23.

The display portion 131 of the LCD 130 is placed on the stepped portion 31b of the component storage portion 21d of the housing main body Hd having such a structure, and the terminal portion 1 of the LCD 130 is placed in the recess 32.
Store with 32 mounted.

After that, the transparent conductive sheet F is covered on the entire surfaces of the opening 20 and the adhesive portion 22, and heat is applied to a portion corresponding to the adhesive portion 22 around the opening 20 to form the conductive sheet F. Of the laminated sheet 11 by melting a part of
It is welded to the VC sheet 14. It should be noted that the peel portion 30 is formed without heating a part during the welding, as in the embodiment of FIG.

When the LCD 130 housed in the conductive sheet F having such a structure is covered, the LCD 130 is properly seated in the recess 31 and the recess 32 and does not rattle significantly during transportation. Further, the escape recess 31a causes L
The liquid crystal panel surface of the CD 130 can be protected. Further, since the reinforcing flange 23 is formed to be longer than the depth of any of the recesses, the bottom surface of the component storage portion 21d is held in a state of being protected from obstacles, so that the electronic components stored therein. Is relatively safely protected from impact.

Next, a container having a structure in which the conductive sheet is easily peeled from the container body is shown in FIGS. 7 to 15 as a sixth to eighth embodiment. First, the sixth container will be described with reference to FIGS. 7 and 8. Although only one unit of the container is shown in FIG. 7, as shown in FIG. 13, the container is formed in a plurality of units on the strip-shaped laminated sheet 11 and only one unit is cut out.

The container main body He has a component storage part 21e having a plurality of openings 20 formed by embossing the flat belt-shaped laminated sheet 11, and an adhesive part 22 surrounding each opening 20. , And a plurality of peel forming portions 34 formed in a recess having an opening 33 in the center of both side edge portions in the vicinity thereof. Such a container body He
When the component is stored in the component storage portion 21e, the openings 20 and 33 are covered with the conductive sheet F, and the adhesive portion 22 is welded, the storage container storing the component is completed.

As shown in FIG. 8, the single container shown in FIG. 7 has perforations, which are the separating means S, on the line passing through the center of the peel forming portion 34, the conductive sheet F and the laminated sheet 11. It is put in and stretched at the perforation. Therefore, unlike the conventional peeling portion, the conductive sheet F can be configured to be completely separated from the opening 33, and thus the conductive sheet F can be more easily peeled from the laminated sheet 11.

The peel forming section 34 is used for the component storage section 2
Although it may be formed every other 1e, it may be formed between the component storage portions 21e as shown in FIG. 8 so that the conductive sheet F can be peeled from either side. desirable. Further, it is desirable that the opening 33 of the peel forming portion 34 be formed as small as possible than the opening 20 of the component storage portion 21e, and such a configuration can reduce the material of the laminated sheet 11. Furthermore, the welding of the conductive sheet F to the adhesive portion 22 enables stripping of the conductive sheet F with a minimum force, as shown in FIGS. It is desirable to weld in a linear shape with a narrow width so that a part along the line and a part of the adhesive part 22 between each component storage part 21 facing each other can be left.

The seventh embodiment shown in FIG. 9 is a simplification of the peel forming portion 34 of the sixth embodiment. No recess is formed in the laminated sheet 11 and the peel forming portion 34 shown in FIG.
Is formed by simply punching out the laminated sheet 11 in a circular shape. Therefore, if the sheets are separated one by one at the perforation,
The peel portion 30b is composed of a peel forming portion 34b having a semicircular cutout and a conductive sheet F.
Also in this embodiment, since the conductive sheet F can be configured to be completely separated by the notch, the conductive sheet F can be easily peeled from the laminated sheet 11 accordingly.

An eighth embodiment having a structure in which the conductive sheet F is easily peeled from the container body is illustrated in FIG.
In this embodiment, the peel forming portion 34 is not particularly provided between the component accommodating portions 21e in the sixth embodiment shown in FIG. 8, and these component accommodating portions 21e are formed with as close a space as possible between them. A component (not shown) is stored in the stationary component storage portion 21e, covered with the conductive sheet F, and welded.
This is configured by forming a perforation separating means S in the central portion of the component storage portion 21e that does not store the components of the alternate component storage portion 21e. In this embodiment, the component storage portion 21e having the perforations is the peel forming portion 34a, and the peel portion 30 (FIG. 11) is formed by this and the conductive sheet F.
Has been formed.

FIG. 11 shows one container separated by this perforation. Since the peel forming portion 34c has the same size as the component storage portion 21e, the cut portion of the peel portion 30c cut at the perforation is relatively large, and a fingertip can be inserted into this cut portion as shown in the drawing. .. Therefore, the structure of the peel portion 30c has an excellent effect that the conductive sheet F can be easily peeled from the adhesive portion 22 of the peel forming portion 34c. In addition, in the above-described embodiment, the peeling portion 30c is formed by the component storage portion 21e that is placed every other portion.
Provided for each of a plurality of optional component storage portions 21e as necessary,
In such a configuration, the same effect can be obtained by peeling the conductive sheet F from the peeling portions 30c at one or both ends.

Next, referring to FIG. 12, there is shown a container as shown in FIGS. 3 and 5 and a mass production method for enclosing electronic components in the container.
Will be briefly described using. The thing shown in this FIG. A has shown the state which wound the elongate thing of the laminated sheet 11 demonstrated in FIG. 1 in the shape of a roll. This laminated sheet 11 is sent intermittently. The length of this feed is the upper and lower pressing dies 4 shown in FIG.
It is determined according to the size of the mold area of 0a and 40b.

A plurality of male molds for molding the component storage portion 21 of the container body H are formed in the upper pressing die 40a in FIG. B, and a female mold paired with the male die is formed in one lower pressing die 40b. Are formed. Therefore, by pressing the partially laminated sheet 11 sent out from above and below with the pressing dies 40a and 40b, a plurality of component storage portions 21 can be formed. Although it is shown in this figure that the component storage portions 21 are formed in only one row, the component storage portions 21 may be formed in a plurality of rows as necessary.
Can be formed.

Next, as shown in FIG. C, an electronic component such as an LCD 130 is placed in these component storage portions 21,
Then, as shown in FIG. D, when the conductive sheet F rolled into a roll is unwound and covers the component storage portion 21, and the adhesive portion 22 of each component storage portion 21 heats and welds the conductive sheet F, The electronic parts are enclosed in each container body H.

The container of the first embodiment shown in FIG. 2 can be formed with the reinforcing flange 23 attached by unrolling the roll-shaped laminated sheet 11 by a predetermined width and embossing it in only one row.

After the encapsulation step of FIG. D, a perforation, V is provided between each row and / or column of the plurality of component storage parts 21 formed.
When a separating means such as a V-shaped cut groove is formed, it is possible to separate the separating means into a single container as shown in FIGS. 3 to 5 by breaking the separating means.

FIG. 13 shows an example of a product manufactured by using such a mass production technique. The sixth embodiment is constructed in a tray type. In this tray type storage device, the component storage unit 21 has a plurality of rows and columns at predetermined intervals and the laminated sheet 1
1, the electronic parts are accommodated in the parts accommodating portions 21 (electronic parts are not shown), the conductive sheet F is covered and welded, and the outer peripheral four sides of the lower surface of the laminated sheet 11 side are surrounded. A reinforcing frame 50 is adhered to the periphery to improve the flatness.

By carrying out such reinforcement, the thin sheet will be in a state of being elastic and can be handled in the same manner as an ordinary tray. The size of the reinforcing frame 50 used in this example was such that the area of the laminated sheet 11 and the conductive sheet F was the area of the size of A4 size paper, and the thickness was 1 mm and the width was 10 mm.

The mode of use of the container of the present invention shown in FIG. 14 is an example of one manufactured by using the mass production technique described with reference to FIG. 12, in which the LCD 130 which is an electronic component is housed in a plurality of rows and columns, The enclosed sheet-shaped container is cut into rows to form a tape, and the tape is wound around the reel 60.

The use mode of the container of the present invention shown in FIG. 15 is still another example of the one manufactured by using the mass production technique described in FIG. 12, in which the LCD 130 is housed in a plurality of rows and columns. A sheet-shaped container containing the perforations and the separating means S such as a V-shaped cut groove for each row is cut into an appropriate length and folded like a folding screen at the separating means S. It is Packing the storage device folded in this way in the box 70 facilitates distribution.

The conductive sheet F used in each of the above examples may be transparent or opaque. When the enclosed electronic component itself is printed with symbols such as its model name, serial number, manufacturer's name, etc., and these are stored in the component storage section facing the conductive sheet F side, it is transparent. If the conductive sheet F is used, it is possible to confirm the contents while being enclosed. If such a symbol or the like is not printed on the electronic component, or even if it is printed, if such a symbol does not face the conductive sheet F side, such a symbol or the like is treated as a conductive material. It is only necessary to print it on the sheet F in advance, and by doing so, the enclosed electronic components can be confirmed.

[0057]

As is apparent from the above description, by using the container of the present invention, it is possible to prevent dust and moisture, and to protect electronic components which are easily destroyed by static electricity from destruction by static electricity or impact from the outside. Not only can it be done, but it can look good and give a good impression when the article is distributed to customers as a sample.

Further, compared with the conventional container, a small amount of packaging material is required, and as in the prior art, a bag, a packaging case, a P. P
Resources can be saved because no band, desiccant, cushioning material, etc. are required. What is even more effective is that with conventional containers,
It was difficult to automate a series of operations such as banding, bagging, boxing, labeling, etc. However, if the container of the form of the present invention is used, it is easy to automate such a series of operations. Can reduce costs. Furthermore, since the peeling portion is formed to be relatively large so that the fingertip can be inserted thereinto, and the adhesive portion between the two is minimized, the conductive sheet can be easily peeled from the container body. Furthermore, as compared with the conventional container, the storage space can be reduced because it can be configured to be light, thin, short and small, and by providing the separating means, various excellent effects such as dispensing can be obtained.

[Brief description of drawings]

FIG. 1 is a partial perspective view of a laminated sheet that can be used in the container body of the present invention.

2 shows a CCD according to a first embodiment of the present invention in which a CCD is enclosed. FIG. 2A is a perspective view thereof, and FIG. 2B is a sectional view taken along line AA of FIG. is there.

FIG. 3 shows a container according to a second embodiment of the present invention,
FIG. A is a perspective view thereof, FIG. B is a perspective view of a QFP type IC,
FIG. 6C is a sectional view of the container of FIG. A in which the QFP type IC is housed.

FIG. 4 is a perspective view of a container according to a third embodiment of the present invention.

FIG. 5 shows a container according to a fourth embodiment of the present invention,
FIG. A is a perspective view of a state in which the LCD is stored, and FIG.
3 is a cross-sectional view taken along the line AA in FIG.

FIG. 6 shows a container according to a fifth embodiment of the present invention,
FIG. A is a perspective view of a state in which the LCD is stored, and FIG.
3 is a cross-sectional view taken along the line AA in FIG.

FIG. 7 is a perspective view of a container according to a sixth embodiment of the present invention.

8 shows a container according to a sixth embodiment of FIG. 7 showing a state in which a plurality of component storage parts are formed on a strip-shaped laminated sheet, FIG. 8A is a plan view, and FIG. It is sectional drawing on the AA of A.

FIG. 9 is a perspective view of a container according to a seventh embodiment of the present invention.

FIG. 10 shows a container according to an eighth embodiment showing a state in which a plurality of component storage parts are formed on a strip-shaped laminated sheet,
FIG. A is a plan view and FIG. B is a cross-sectional view taken along the line AA of FIG.

FIG. 11 is a perspective view showing a usage state of a single container of the eighth embodiment.

FIG. 12 is a process diagram for explaining a container according to the present invention and a mass production method for enclosing electronic components in the container.

13A and 13B show a tray type storage device according to a sixth embodiment of the present invention, wherein FIG. A is a plan view thereof and FIG. B is a sectional view taken along the line AA in FIG.

FIG. 14 shows a mode in which the container of the present invention is taped and wound around a reel, and FIG. 14A is a plan view thereof.
FIG. 2B is a sectional view taken along the line AA in FIG.

FIG. 15 is a perspective view showing a plurality of storage devices according to the present invention, each of which is a sheet-shaped storage device arranged in rows and columns at predetermined intervals and is folded and stored in a box.

FIG. 16 is a perspective view of a tray type storage container molded by a conventional injection molding method.

FIG. 17 is a perspective view of a stick type container formed by a conventional drawing method.

FIG. 18 is a perspective view of another type of stick-type container formed by a conventional drawing method.

[Explanation of symbols]

 F Conductive Sheet H Housing Main Body S Separating Means 11 Laminated Sheet 12 Aluminum Foil 14 PVC Sheet 20 Opening 21 Component Storage 22 Adhesive 23 Reinforcing Flange 24 Trapezoidal Convex 25 Recess 28 Buffer Cushion 29 Recess 30 Peel 30a Peel Part 30b Peel part 30c Peel part 31 Recessed part 31a Escape recessed part 31b Step part 32 Recessed part 33 Opening 34 Peel forming part 34b Peel forming part 34c Peel forming part 40a Top push type 40b Down push type 50 Reinforcing frame 60 reel 70 Box 110 CCD 120 QFP type IC 130 LCD

Claims (10)

[Claims] Claims: 1. A laminated sheet obtained by laminating a conductive sheet and a plastic sheet is embossed into a shape substantially conforming to the outer shape of an electronic component to form a component accommodating portion having an opening and an adhesive portion around the opening, and accommodating the component. When an electronic component is stored in the portion, the electronic component is covered with a conductive sheet, and the conductive sheet is configured to be welded to the plastic sheet at the adhesive portion, which is easily destroyed by static electricity. Storage container for parts. 2. A cushion part in which air is enclosed is formed on one surface of the conductive sheet, and the electronic part is covered by the cushion part so as to press the electronic part. Storage container for electronic parts that is easily destroyed by the static electricity described in. 3. A trapezoidal convex portion capable of supporting a main body of a semiconductor device on a bottom surface of the component accommodating portion, and a concave portion having a width and a depth capable of accommodating a lead of the semiconductor device floating around the trapezoidal convex portion. The storage container for electronic parts according to claim 1, wherein the storage container for electronic parts is easily destroyed by static electricity. 4. A trapezoidal convex portion capable of supporting a part of the main body of the semiconductor device by exposing it from the surface of the opening on the bottom surface of the component housing, and a lead of the semiconductor device floating around the trapezoidal convex portion. The recessed portion having a width and a depth capable of being stored in a state is formed, while a recessed portion into which an exposed portion of the semiconductor device is inserted is formed in a portion of the conductive sheet that covers the opening. A storage container for electronic components that is easily destroyed by the static electricity. 5. The embossing of the laminated sheet to form rows and / or columns at equal intervals to form a plurality of component storages, and separation between each row and / or column such as perforations and V-shaped cut grooves. The storage container for electronic parts which is easily destroyed by static electricity according to claim 1, characterized in that the means is formed. 6. A laminated sheet obtained by laminating a conductive sheet and a plastic sheet is embossed into a shape substantially conforming to the outer shape of an electronic component to form rows and / or columns at the same intervals and adhered to a plurality of openings and their periphery. Forming a component storage part having parts, storing electronic components in these component storage parts, and setting a predetermined number of rows and / or columns as one unit, and attaching a reinforcing member to the periphery thereof, and an upper surface of the reinforcing member A storage container for electronic components, which is easily broken by static electricity, characterized in that the laminated sheet on the lower surface of the adhesive portion is adhered. 7. A component accommodating portion having an opening for accommodating an electronic component and a bonding portion around the accommodating portion for accommodating an electronic component in a laminated sheet in which a conductive sheet and a plastic sheet are laminated, and a peel portion adjacent to the component accommodating portion When forming an electronic component in the component storage portion, the electronic component storage portion and the peel portion are covered with a conductive sheet, and the conductive sheet is welded to the plastic sheet at the adhesive portion, A storage container for electronic parts, which is easily broken by static electricity, characterized in that it is constructed so as not to be welded at the peel portion. 8. The electronic component storage container according to claim 7, wherein the peel portion is formed by a recessed portion having an opening smaller than the component storage portion. 9. The container for electronic parts, which is easily broken by static electricity, according to claim 7, wherein the peel part is formed by a notch part. 10. The container for electronic parts which is easily destroyed by static electricity according to claim 7, wherein the peel part is formed of a part housing part.