JPH0562956A - Semiconductor substrate cleaning jig and method - Google Patents

Abstract

(57) [Summary] [Object] A jig for cleaning a semiconductor substrate and a cleaning method for the same are intended to prevent dust attached to the jig from being attached to the substrate to reduce the yield. A cleaning jig for vertically supporting a semiconductor substrate, wherein a supporting arm portion that widens upward on the left and right of a circumferential end surface of the semiconductor substrate is supported, and a cleaning jig for the semiconductor substrate. It is configured as a cleaning method in which a cleaning liquid is upflowed from below in a cleaning tank using a tool.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning jig and a cleaning method for a semiconductor manufacturing process. Dust such as particles in the semiconductor process deteriorates the characteristics of the semiconductor and is a direct cause of lowering the yield. For that reason,
It is necessary to perform efficient substrate cleaning such as pretreatment.

[0002]

2. Description of the Related Art Conventionally, for cleaning a semiconductor substrate, a jig as shown in FIG. 6 is used to support the semiconductor substrate 1 by three-point support of a lower support portion 2, left and right support portions 3 and 4, as shown in FIG. This is immersed in the cleaning tank 5, and the cleaning liquid is upflowed from below to perform cleaning. Usually, hydrofluoric acid (5-10%) is used as a cleaning liquid
After removing the natural oxide film by using, the product is rinsed with water.

[0003]

However, there are problems that dust is not completely removed at the time of cleaning, or dust attached to the jig groove portion adheres to the substrate, thereby lowering the yield. In view of the above points, an object of the present invention is to provide a jig for cleaning a substrate with an effective shape to further improve cleaning efficiency.

[0004]

In order to achieve the above-mentioned object, the present invention provides a cleaning jig for vertically supporting a semiconductor substrate, in which a supporting arm portion which expands left and right of a circumferential end surface of the semiconductor substrate upward. Provided is a jig for cleaning a semiconductor substrate, which is characterized by being supported by. Further, the present invention provides a method for cleaning a semiconductor substrate, which comprises supporting a semiconductor substrate using such a jig and performing upflow of a cleaning liquid from below in a cleaning tank for cleaning.

[0005]

In the conventional jig, dust is accumulated at the contact point (supporting portion) with the semiconductor substrate, and dust is attached to the semiconductor substrate from there during the rinse. Therefore, by adhering the semiconductor substrate support portion outwardly so as to prevent dust from accumulating therein, the attachment of dust to the semiconductor substrate can be prevented.

[0006]

EXAMPLE A conventional cleaning method as shown in FIG.
As shown in (a), the lower support portion 2 and the left and right support portions 3,
4 easily collects dust, and as shown in FIG.
At the time of rinsing, dust adhered to the semiconductor substrate around these areas. This fact was confirmed by observing particles (particle size: 0.25 μm or more) attached to the semiconductor substrate after cleaning.

Therefore, in the present invention, as shown in FIG. 1, the support arm portions 11 and 12 which are spread upwardly receive and support the circumferential end portions of the semiconductor substrate 13. The beams 14 and 15 that hold the main surface of the semiconductor substrate 13 are not necessarily the same as those of the semiconductor substrate 13.
It is not necessary to provide each of the above, but it may be provided at both ends of a jig that supports a plurality of substrates. When cleaning is performed using such a jig, the flow of cleaning water as shown in FIG. 2 occurs, so that the cleaning water flows out upward and outward at the contact points between the semiconductor substrate 13 and the support arms 11 and 12. , No garbage collects. Therefore,
After that, even if the substrate is rinsed, the semiconductor substrate will not be contaminated due to the dust along these contact points.

This fact was confirmed by observing particles adhering to the semiconductor substrate cleaned as in the conventional case, using a jig as shown in FIG. That is, when the jig of the present invention was used, no concentration of particles was observed near the contact point with the jig, and the total number of particles was about 7 minutes compared to when the conventional jig was used. It was reduced to 1.

The supporting arms 11 and 12 of the jig are not necessarily required to be straight, and may be expanded so that dust can flow outward during cleaning. Two
0 to 160 ° is preferable. FIG. 3 shows a preferred embodiment in which the jig 21 has a support arm extending above the top of the semiconductor substrate 22. This further reduces the possibility that dust accumulated in the jig will adhere to the semiconductor substrate during rinsing.

In FIG. 2, the cleaning liquid is allowed to flow up from the entire bottom surface of the cleaning tank. However, as shown in FIG. 4, when the cleaning liquid is selectively allowed to flow up only between the legs 25 of the jig, Since the flow surely goes to the outside, the possibility that dust is accumulated in the jig is reduced, and the possibility that the dust accumulated in the jig is adhered to the semiconductor substrate at the time of rinsing is reduced. Therefore, not limited to this aspect, it is preferable to provide a foot portion below the bottom portion of the semiconductor substrate so that the jig, particularly the support arm portions 11 and 12, do not extend and the jig portion is opened.

Further, the jig normally supports a plurality of semiconductor substrates, and a groove (slightly wider than the thickness of the semiconductor substrate) is cut in the receiving portion (support arm portion) thereof as shown in FIG. Preferably. This is because the semiconductor substrate is supported by the groove and the cleaning liquid flows along the groove, so that dust is less likely to collect.

[0012]

As described above, according to the present invention, dust adhering to a jig groove or the like at the time of cleaning a substrate can be put on a forced flow to the outside of the substrate for cleaning, and an effective cleaning can be performed. It makes it possible to greatly improve the yield.

[Brief description of drawings]

FIG. 1 is a schematic view of a semiconductor cleaning jig of the present invention.

FIG. 2 is a diagram showing a state of cleaning using the jig of the present invention.

FIG. 3 is a view showing another embodiment of the semiconductor cleaning jig of the present invention.

FIG. 4 is a diagram illustrating a preferred cleaning method of the present invention.

FIG. 5 is a partial view of a jig showing a groove for receiving a semiconductor substrate.

FIG. 6 is a view showing a conventional jig for cleaning a semiconductor substrate.

FIG. 7 is a diagram showing a state of cleaning using a conventional jig.

FIG. 8 is a diagram illustrating a state of contamination by a conventional jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Semiconductor substrate 2 ... Lower support part 3, 4 ... Left-right support part 5 ... Cleaning tank 11, 12 ... Support arm part 13 ... Semiconductor substrate 14, 15 ... Beam 21 ... Support arm part 22 ... Semiconductor substrate 25 ... Foot part

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kazushi Nakajima 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited

Claims (7)

[Claims] 1. A cleaning jig for supporting a semiconductor substrate in a vertical direction, characterized in that right and left sides of a circumferential end surface of the semiconductor substrate are supported by supporting arm portions that expand upward. 2. The jig according to claim 1, wherein the support arm portion is expanded at an angle of 20 to 160 °. 3. The jig according to claim 1, wherein the support arm portion extends above a vertex of the semiconductor substrate. 4. The jig according to claim 1, wherein the support arm has a groove for receiving a semiconductor substrate. 5. The jig according to any one of claims 1 to 4, wherein the supporting arm portion has a foot portion whose lower portion of the bottom of the semiconductor substrate is open. 6. A semiconductor cleaning method according to claim 1, wherein the semiconductor cleaning jig supports a semiconductor substrate, and a cleaning liquid is upflowed from below in a cleaning tank for cleaning. Substrate cleaning method. 7. The method according to claim 6, wherein the cleaning liquid is selectively upflowed from the open space between the legs.