JPH0590453A - Socket for semiconductor device characteristic inspection - Google Patents

Abstract

PURPOSE:To enable a life to be extended in a socket for inspecting characteristics of a semiconductor device. CONSTITUTION:In a socket 2 for inspecting characteristics of a semiconductor device where one-edge side is connected to an outer lead 1L of a surface-mount type semiconductor device 1 and the other edge side is connected to a test board 4 which is connected to a test main body 6, at least a region where the outer lead 1L of the surface-mount type semiconductor device 1 is in contact is constituted by a flat-type cable 20 where a wiring which is formed by a metal or an alloy on a surface of a flexible resin substrate is placed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device characteristic inspection socket, and more particularly to a technique effectively applied to a surface mounting type semiconductor device characteristic inspection socket.

[0002]

2. Description of the Related Art Surface mount semiconductor devices such as QFP ( Q
uad F lat P ackage) resin-sealed semiconductor device employing the structure, electrical characteristics test in the handler after completion of a product is made, good, it is sorted to one of the defective performed. The handler is provided with a resin-sealed portion between the loader portion that supplies the unsealed resin-sealed semiconductor device and the unloader portion that stores the resin-sealed semiconductor device that has been inspected and selected as a good product after the inspection. The characteristic inspection of the semiconductor device is performed. This characteristic inspection is carried out in a tester main body connected to the test head by mounting a resin-sealed semiconductor device in a test socket arranged in the test head.

The test socket is constructed by arranging a plurality of socket pins in a casing molded of a resin material. One end of each socket pin is in contact with each of the plurality of outer leads of the resin-encapsulated semiconductor device for electrical connection, and the other end of the socket pin is electrically connected to the test board of the test head through a wire. Connections are made. Each socket pin has a Cu material as a base material, has its surface plated with Au, and has a spring region curved in a U shape in an intermediate region. In the characteristic inspection, when the resin-encapsulated semiconductor device is mounted in the test socket and the outer lead makes contact with the socket pin, the pusher (presser (presser) is used to ensure the electrical connection between the socket pin and the outer lead. The outer lead is pressed against the socket pin by the member. In other words, the socket pin of the test socket has an electrical connection function that connects the outer lead of the resin-sealed semiconductor device and the test board of the test head, as well as the outer lead that repels the pressing of the pusher. It has a function of retaining mechanical strength for supporting.

[0004]

However, the present inventor has found the following problems in the above-described test socket.

(1) For the test socket, a handler is used, and several thousand to several tens of thousands of resin-sealed semiconductor devices are mounted per day, and a characteristic test is performed. For this reason, repeated stress is applied to the socket pin of the test socket, and due to this repeated stress, metal fatigue fracture occurs in the socket pin, particularly in the spring region, and the socket pin often breaks. That is, the test socket becomes a defective product.

(2) According to the problem (1), when the socket pin of the test socket is broken, it becomes necessary to mount a new test socket on the test board of the test head. The test socket is mounted on the test board by connecting the other ends of the socket pins and the terminals of the test board with wires one by one.

However, since the resin-encapsulated semiconductor device tends to have a large number of pins, the outer leads have a fine pitch, and the socket pins of the test socket are arranged in correspondence with the fine arrangement pitch of the outer leads. Therefore, the work of connecting the socket pins and the terminals of the test board described above is a very detailed mounting work. As a result, the efficiency of this attachment work is reduced, and the handler is stopped during this attachment work and no characteristic inspection is performed, resulting in a reduction in the ability to select good products and defective products.

(3) The outer leads of the resin-sealed semiconductor device are made of, for example, Fe--Ni (42 [%] N).
(including i) is used as a base material and has a lower hardness than the socket pin of the test socket. The test socket has a structure in which one outer pin of the resin-sealed semiconductor device is in contact with one socket pin, so that when the positional relationship between the two is deviated, the hardness of the resin-sealed Damage such as scratches occurs on the outer leads of the semiconductor device.
When the outer lead is damaged, the resin-encapsulated semiconductor device is selected as a defective product in the appearance defect inspection, so that the yield of the resin-encapsulated semiconductor device is reduced.

An object of the present invention is to provide a technique capable of extending the life of a semiconductor device characteristic inspection socket.

Another object of the present invention is to provide a technique capable of improving the work efficiency when mounting on a test head in a semiconductor device characteristic inspection socket.

Another object of the present invention is to provide a technique for improving the yield of mounted semiconductor devices in a semiconductor device characteristic inspection socket.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0013]

Among the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

(1) At least the surface mounting of a socket for characteristic inspection of a semiconductor device, wherein one end side is connected to an outer lead of the surface mounting type semiconductor device and the other end side is connected to a test board connected to the tester body. The region where the outer leads of the die-type semiconductor device come into contact is composed of a flat type cable in which wiring formed of a metal or an alloy is arranged on the surface of a flexible resin substrate.

(2) The wiring of the flat type cable of the above-mentioned means (1) is formed to have a thin thickness with respect to the resin substrate having flexibility, and is processed by wet etching. The side of the mountable semiconductor device to which the outer leads are connected is smaller than the side to which the test board is connected.

(3) The wiring of the flat type cable of the above-mentioned means (2) is made thinner than the lead thickness of the outer lead of the surface mounting type semiconductor device which is brought into contact therewith.

[0017]

According to the above-mentioned means (1), in the region where the outer leads of the surface mounting type semiconductor device of the characteristic inspection socket of the semiconductor device abut, the electrical connection function and mechanical strength required as the socket pin are obtained. Among the holding functions of the above, the latter is replaced by a flexible resin substrate, and the factor of fatigue damage based on the repeated stress applied during the characteristic inspection is eliminated, so that the characteristics inspection socket of the semiconductor device is not damaged or destroyed. And the like, and the life of the semiconductor device characteristic inspection socket can be extended.

According to the above-mentioned means (2), when the wiring of the resin substrate having flexibility is patterned by wet etching in the socket for inspecting characteristics of the semiconductor device, the wiring is thin and fine. Since it can be processed, the pitch of one end side of the wiring of the resin board having flexibility can be reduced with the finer pitch of the outer leads of the surface mount type semiconductor device, and conversely, the other end side connected to the test board It is possible to improve the efficiency of the artificial attachment work of the cable of the characteristic inspection socket of the semiconductor device when the characteristic inspection socket of the semiconductor device is mounted (or replaced) on the test board by increasing the pitch.

According to the above-mentioned means (3), the end face shape of the wiring of the flat type cable is relaxed by the wet etching process (the corner portion of the wiring is formed into an obtuse angle),
In addition, since the cross-sectional shape of the wiring can be made thin to reduce the step, if a position shift occurs when the wiring of the flat type cable and the outer lead of the surface mounting type semiconductor device are misaligned, the outer lead of the surface mounting type semiconductor device is It is possible to prevent the damage that occurs in the semiconductor device and reduce the occurrence rate of defective products of the surface mounting type semiconductor device.

The structure of the present invention will be described below together with an embodiment in which the present invention is applied to a test socket for mounting a resin-sealed semiconductor device adopting a QFP structure.

In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

[0022]

EXAMPLE A system configuration of a handler for selecting a good product and a bad product of a resin-encapsulated semiconductor device adopting a QFP structure which is an embodiment of the present invention will be described with reference to FIG. 2 (schematic plan view).
Briefly explained.

As shown in FIG. 2, the handler includes a test stage 1 on the transfer path of the resin-sealed semiconductor device 1 having the QFP structure between the loader section and the unloader section.
0 is placed.

The loader section is equipped with a tray 13A for accommodating a plurality of unsealed QFP structure resin-sealed semiconductor devices 1A, and supplies the resin-sealed semiconductor device 1 to the test stage 10. The unloader unit accommodates the tray 13C that stores the resin-sealed semiconductor device 1C that adopts the QFP structure selected as a good product after the inspection, and the resin-sealed semiconductor device 1D that uses the QFP structure selected as a defective product. Each of the trays 13D to be loaded is mounted.
The area between the loader section and the unloader section is an area where the empty tray 13B is moved from the loader section to the unloader section.

The resin-encapsulated semiconductor device 1A in the tray 13A mounted on the loader section is once transported to the stocker and angle changing stage 11 via the transfer robot 14, and then from the stocker and angle changing stage 11. It is transferred to the test stage 10 via the transfer robot 15. In this test stage 10, the electrical characteristics of the resin-sealed semiconductor device 1A are inspected.

Also, in this test stage 10,
The resin-encapsulated semiconductor device 1C after the characteristic inspection, which is selected as a non-defective product, is temporarily transferred to the stocker and the angle changing stage 12 via the transfer robot 15, and the transfer robot 16 is moved from the stocker and the angle changing stage 12. It is conveyed to the tray 13C of the unloader section through the interposition. Resin-encapsulated semiconductor device 1 after characteristic inspection selected as defective product
Similarly, D is temporarily transferred to the stocker and angle changing stage 12 via the transfer robot 15, and then transferred from the stocker and angle changing stage 12 to the tray 1D of the unloader section via the transfer robot 16. ..

The test stage 10 is shown in FIGS.
As shown in (Schematic side view of test head), the test socket 2 is mounted. The test socket 2 is shown in FIG.
As shown in FIG. 3, the ATM disk 3 having a ring-shaped plane is mechanically held and connected to the terminals of the test board (wiring board) 4 of the test head 5 through a plurality of wires. The test board 4 is a resin-sealed semiconductor device 1
Is connected to the tester body 6 for inspecting the electrical characteristics of the.

The test socket 2 mounted on the test stage 10 is, as shown in FIG.
For example, the housing 2 is formed in a square shape in both plane and cross section.
A flat type cable 20 is provided in the inside of the structure 3. The housing 23 is made of, for example, a hard resin, such as an epoxy resin, which is hard to be deformed by an external stress, has an insulating property at least on the surface, has excellent workability, and is inexpensive in product price.

The flat type cable 20 is, as shown in FIG. 4 (enlarged sectional view of the main part) and FIG. 5 (partial plan view),
The resin-based substrate 20A, a plurality of wirings (cables) 20B arranged on the surface, and a protective film 20C that mechanically and electrically protects the wirings 20B are mainly configured. One end side (upper side in FIG. 3) of the flat type cable 20 is protruded and arranged outside the resin sealing body (for example, epoxy resin) 1P of the resin sealing type semiconductor device 1 and arranged in an outer lead 1.
It abuts L and is electrically connected. The inside of the resin sealing body 1P is formed of, for example, a single crystal silicon substrate, and a semiconductor pellet on which the circuit system is mounted is sealed on the surface thereof. The outer lead 1L is formed of, for example, an Fe-Ni (for example, Ni content of 42 or 50 [%]) alloy,
It is formed with a plate thickness of 0.1 to 0.2 [mm]. The resin-encapsulated semiconductor device 1 that employs the QFP structure is usually configured by a four-direction lead array structure, and a plurality of resin-encapsulated semiconductor devices 1 are formed on each side along each side of the resin encapsulation body 1 formed in a planar rectangular shape. The outer leads 1L are arranged.

As shown in FIGS. 3 and 4, the resin-based substrate 20A of the flat type cable 20 is not limited to this shape, but is curved in a U-shape as a whole, and at least a resin-sealed semiconductor is used. It has flexibility (elasticity) on one end side with which the device 1 abuts. That is, the resin-based substrate 20A is used mainly as a substitute for the mechanical strength retaining function of the socket pin of the conventional test socket, and the outer lead 1L of the resin-sealed semiconductor device 1 is used.
Is pressed by the pusher 7 and contacts the surface of the wiring 20B and is electrically connected, the outer lead 1L and the wiring 20B can be reliably connected. Resin board 20A
Is basically flexible and has insulating properties as described above, and is made of, for example, an epoxy resin, a polyimide resin, or the like, and has a plate thickness of about 0.2 to 0.4 [mm]. To be done.

As shown in FIG. 3, the test socket 2
For the main purpose of improving the flexibility of the flat type cable 20, the resin-based substrate 20A is provided on one end side with which the outer lead 1L of the resin-sealed semiconductor device 1 abuts.
The elastic body unit 21 that supports the back surface of the is attached. The elastic unit 21 has a holding plate that supports the back surface of the resin substrate 20A on one end side, and one end is connected to the holding plate and the other end is connected to the back surface of the other end of the resin substrate 20 or the housing 23. Composed of springs. Further, the elastic body unit 21 may be composed of another member having a restoring ability such as a rubber material or a porous material.

In this embodiment, since the resin-sealed semiconductor device 1 adopting the QFP structure adopts the 4-direction lead arrangement structure, the flat type cable 20 has the same structure as the resin-sealed body 1P of the resin-sealed semiconductor device 1. A total of four resin-based substrates 20A corresponding to each side are provided. As shown in FIG. 5, a plurality of wirings 20B corresponding to the arrangement of the outer leads 1L of the resin-sealed semiconductor substrate 1 are arranged on each of the four resin-based substrates 20A. As shown in FIG. 5, for the wiring 20B, basically, for example, a Cu foil is adhered to the surface of the resin substrate 20A, a mask formed by photolithography is used, and the Cu foil is wet-etched. Formed. Since the wiring 20B substitutes the mechanical strength of the flat type cable 20 with the resin substrate 20A, the wiring 20B mainly has an electrical connection function, and thus the resin substrate 20A and the resin-sealed semiconductor are used. Outer lead 1 of device 1
The film thickness is smaller than the thickness of L, for example, 100 to 200 [μ
m].

When the wiring 20B is thinned, the amount of side etching can be reduced when processed by wet etching, so that the wiring can be miniaturized. Therefore, as shown in FIG. 5, one end side 20 of the wiring 20B of the flat type cable 20 is
The BF can reduce the array pitch corresponding to the finer pitch of the outer leads 1L of the resin-encapsulated semiconductor device 1, and the other end side 20BT has wiring for improving the efficiency of the connection work with the wire connected to the test board. The pitch can be increased. Further, as shown in FIG. 4, since the wiring 20B is processed by wet etching, the side surface shape is relaxed (formed at an obtuse angle), and since the wiring 20B is formed with a thin film thickness, the step shape is reduced and relaxed. Even when the outer lead 1L and the outer lead 1L are misaligned when they come into contact with each other,
Damage such as scratches is unlikely to occur on the outer lead 1L.

The other end side (20BT) of the wiring 20B is connected to an electrode 22, and a wire connecting to the test board 4 is directly connected to the electrode 22 via solder, for example.

The wiring 20B is not limited to Cu, and may be, for example, a laminated layer of Cu plated with Ni or Au.
1, Al alloy, Cu-based alloy and the like may be used.

Thus, according to one embodiment of the present invention,
The following effects can be obtained.

(1) One end side is connected to the outer lead 1L of the resin-sealed semiconductor device 1 adopting the QFP structure,
In the test socket 2 whose other end is connected to the test board 4 connected to the tester main body 6, at least a region where the outer lead 1L of the resin-sealed semiconductor device 1 abuts is a flexible resin. System board 20
The flat type cable 20 has a wiring 20B formed of a metal or an alloy on the surface of A. With this configuration, the outer lead 1L of the resin-sealed semiconductor device 1 of the test socket 2 of the resin-sealed semiconductor device 1
Of the electrical connection function and the mechanical strength retention function required for the socket pin in the area where the abutting contacts, the latter is substituted by the flexible resin substrate 20A, which is based on the repeated stress applied during the characteristic inspection. Since the factor of fatigue failure is eliminated, damage and destruction of the test socket 2 can be prevented, and the life of the test socket 2 can be extended.

(2) The wiring 20B of the flat type cable 20 of the above-mentioned means (1) is made thinner than the resinous substrate 20A having flexibility, and
The wiring 20B is processed by wet etching, and the arrangement pitch of the wirings 20B is the outer lead 1L of the resin-sealed semiconductor device 1.
The one end side 20BF connected to is connected to the test board 4 is smaller than the other end side 20BT. With this configuration, in the test socket 2 of the resin-encapsulated semiconductor device 1, when the wiring 20B of the flexible resin-based substrate 20A is patterned by wet etching, the wiring 20B has a small film thickness and is finely processed. Therefore, as the outer leads 1L of the resin-encapsulated semiconductor device 1 are made finer, the arrangement pitch of the one end side 20BF of the wiring 20B of the flexible resin-based substrate 20A can be reduced, and conversely, the test board 4 The arrangement pitch of the other end side 20BT connected to is increased, and when the test socket 2 of the resin-sealed semiconductor device 1 is mounted (or replaced) on the test board 4, the wire of the test socket 2 The efficiency of artificial mounting work can be improved.

(3) The wiring 20B of the flat type cable 20 of the above-mentioned means (2) is formed to have a smaller thickness than the lead thickness of the outer lead 1L of the resin-sealed type semiconductor device 1 which is in contact with the wiring 20B. .. With this configuration, the end face shape of the wiring 20B of the flat type cable 20 is relaxed based on the wet etching process (the corners of the wiring 20B are formed into obtuse angles), and the cross-sectional shape of the wiring 20B can be thinned to reduce the step. Therefore, the wiring 20B of the flat cable 20 and the outer lead 1L of the resin-sealed semiconductor device 1
It is possible to prevent the outer lead 1L of the resin-encapsulated semiconductor device 1 from being damaged when a positional deviation occurs during the contact with, and reduce the incidence of defective products of the resin-encapsulated semiconductor device 1.

As described above, the invention made by the present inventor is
Although the specific description has been given based on the above-mentioned embodiment, the present invention is not limited to the above-mentioned embodiment, and needless to say, various modifications can be made without departing from the scope of the invention.

For example, the present invention can be applied to surface mounting type semiconductor devices other than the resin-sealed type semiconductor device adopting the QFP structure. The sealing body may be either resin or ceramic (glass sealing).

[0042]

The effects obtained by the representative ones of the inventions disclosed in this application will be briefly described as follows.

The life of the semiconductor device characteristic inspection socket can be extended.

In the socket for inspecting the characteristics of the semiconductor device, the working efficiency at the time of mounting on the test head can be improved.

In the semiconductor device characteristic inspection socket, the yield of the mounted semiconductor device can be improved.

[Brief description of drawings]

FIG. 1 is a schematic side view of a test head of a handler that is an embodiment of the present invention.

FIG. 2 is a schematic plan view of the handler.

FIG. 3 is a sectional view of a main part of a test socket mounted on the test head.

FIG. 4 is an enlarged sectional view of a main part of the test socket.

FIG. 5 is a partial plan view of the test socket.

[Explanation of symbols]

1 ... Resin-sealed semiconductor device, 2 ... Test socket, 2
0 ... Flat type cable, 20A ... Resin board, 20B
... Wiring, 20C ... Protective film, 21 ... Elastic unit, 4 ...
Test board, 5 ... Test head, 6 ... Test body.

Claims (3)

[Claims] 1. A characteristic inspection socket for a semiconductor device, one end of which is connected to an outer lead of a surface mount type semiconductor device, and the other end of which is connected to a test board connected to a tester body. A region of the semiconductor device in which the outer leads are abutted is configured by a flat type cable in which wiring formed of a metal or an alloy is arranged on the surface of a resin substrate having flexibility. Characteristic test socket. 2. The wiring of the flat type cable according to claim 1 is formed to have a thin thickness with respect to the resin substrate having flexibility, and is processed by wet etching. The side of the surface mount semiconductor device to which the outer lead is connected is smaller than the side to which the test board is connected. 3. The wiring of the flat type cable according to claim 2 is made thinner than the lead thickness of the outer lead of the surface mounting type semiconductor device which is in contact with it.