JPH0611535Y2 - Electronic component unit - Google Patents
Electronic component unitInfo
- Publication number
- JPH0611535Y2 JPH0611535Y2 JP16168886U JP16168886U JPH0611535Y2 JP H0611535 Y2 JPH0611535 Y2 JP H0611535Y2 JP 16168886 U JP16168886 U JP 16168886U JP 16168886 U JP16168886 U JP 16168886U JP H0611535 Y2 JPH0611535 Y2 JP H0611535Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component group
- height
- component unit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は、電子部品ユニットに関し、特に、基板および
該基板に実装される電子部品が樹脂によりモールド被覆
されて成る電子部品ユニットの改良に関する。Description: TECHNICAL FIELD The present invention relates to an electronic component unit, and more particularly to improvement of an electronic component unit in which a substrate and electronic components mounted on the substrate are mold-coated with a resin.
（従来の技術） 従来、例えば実開昭６０−２７４３８号公報に記載され
るように、電子部品が実装された基板全体を樹脂により
モールド被覆する手法が知られている。(Prior Art) Conventionally, as described in, for example, Japanese Utility Model Laid-Open No. 60-27438, there is known a method of mold-coating the entire substrate on which electronic components are mounted with a resin.
ところで、従来の基板への複数の電子部品の実装は、一
般的に個々の電子部品の機能を優先して行われる傾向に
あることから、個々の電子部品の高さ寸法に着目した場
合、高い部品と低い部品とが混在配置され易い傾向にあ
る。このような従来の一例を示すと、第３図に示すよう
に、複数の電子部品１０が実装された１つの基板２０を
ケース３０内に収容した後、該ケース３０内に例えばエ
ポキシ系の樹脂を注入し、この樹脂の注入にて形成され
た被覆部分５０により前記複数の電子部品１０および基
板２０の全体を略同一の高さ寸法でモールド被覆するよ
うになされていた。By the way, since the conventional mounting of a plurality of electronic components on a substrate generally tends to be performed by prioritizing the functions of the individual electronic components, when focusing on the height dimension of each electronic component, high Parts and low parts tend to be mixedly arranged. As shown in FIG. 3, as an example of such a conventional art, after housing one substrate 20 on which a plurality of electronic components 10 are mounted in a case 30, for example, an epoxy resin is housed in the case 30. And the whole of the plurality of electronic components 10 and the substrate 20 are mold-coated with substantially the same height dimension by the coating portion 50 formed by the resin injection.
そして、前記基板２０にコネクタ６０が実装されるに際
し、このコネクタ６０の接続部分６０ａは前記被覆部分
５０の上面５０ａ、すなわち、電子部品ユニットの外形
ラインから大きく突出して設けられる必要があった。When the connector 60 is mounted on the board 20, the connection portion 60a of the connector 60 needs to be provided so as to largely project from the upper surface 50a of the covering portion 50, that is, the outer shape line of the electronic component unit.
（考案が解決しようとする問題点） しかし、このようにして個々の電子部品について所謂背
の高い部品と背の低い部品とが混在配置されている場合
には、モールド被覆部分５０の高さ寸法は、背の高い部
品を覆うレベルで略一様に形成されるため、ケース３０
内に注入される樹脂の必要量が余分となって、電子部品
ユニット全体の重量が大きなものとなるばかりか、一般
にモールド被覆に用いられる樹脂は高価なものであるた
め、全体としてコスト高になるという問題点があった。(Problems to be solved by the invention) However, in the case where so-called tall components and short components are mixedly arranged in the individual electronic components in this way, the height dimension of the mold coating portion 50 is large. Are formed substantially uniformly at a level that covers tall parts, so that the case 30
Not only the required amount of resin injected into the inside becomes extra, the weight of the entire electronic component unit becomes large, but also the resin used for mold coating is generally expensive, so the cost becomes high as a whole. There was a problem.
また、コネクタ６０の接続部分６０ａは前記被覆部分５
０の上面５０ａ、すなわち、電子部品ユニットの外形ラ
インから大きく突出することになるため、この電子部品
ユニットの実質的な高さ寸法が大きくなると共に、この
電子部品ユニットの外形ラインから局部的に大きく突出
したコネクタ６０の接続部分６０ａは、電子部品ユニッ
トを他の機体に組み付ける際のスペース制約要因となっ
たり、該組み付け時は勿論のこと運搬時等において他の
機物等への接触による機械的な損傷を受け易いという問
題点があった。Further, the connecting portion 60a of the connector 60 has the covering portion 5
The upper surface 50a of 0, that is, a large protrusion from the outer shape line of the electronic component unit, increases the substantial height dimension of the electronic component unit and locally increases the height from the outer shape line of the electronic component unit. The protruding connection portion 60a of the connector 60 may be a space limiting factor when the electronic component unit is assembled to another machine body, or may be a mechanical element due to contact with another machine body or the like not only during assembly but also during transportation. There was a problem that it was easily damaged.
（問題点を解決するための手段） 本考案は、上記問題点を解決するために、基板２上に複
数の電子部品１を実装し、該基板２および電子部品１を
樹脂によりモールド被覆して成る電子部品ユニットにお
いて、前記複数の電子部品１を所定の高さＨを越える第
１の部品群１ａと、該所定の高さＨに満たない第２の部
品群１ｂとに区分して配置すると共に、前記第２の部品
群１ｂ側に、該第２の部品群１ｂより高い位置となるよ
うにコネクタ６を実装し、前記第１および第２の部品群
１ａ，１ｂにそれぞれ応じた高さ寸法h1,h2で前記モー
ルド被覆による第１および第２の被覆部分５ａ，５ｂを
形成して、前記コネクタ６の接続部分６ａを前記第２の
被覆部分５ｂの上面５′ｂから突出させたことを特徴と
し、モールド樹脂の必要量を節減して製造コストの低減
を図ると共に、電子部品ユニット全体を軽量化し、更
に、製品の組み付け時および運搬時等における機械的損
傷を受けにくい構造となる電子部品ユニットを提供する
ことを目的としている。(Means for Solving Problems) In order to solve the above problems, the present invention mounts a plurality of electronic components 1 on a substrate 2 and mold-covers the substrates 2 and the electronic components 1 with a resin. In the electronic component unit, the plurality of electronic components 1 are arranged by being divided into a first component group 1a that exceeds a predetermined height H and a second component group 1b that is less than the predetermined height H. At the same time, the connector 6 is mounted on the side of the second component group 1b so as to be at a position higher than that of the second component group 1b, and the heights corresponding to the first and second component groups 1a and 1b, respectively. Forming the first and second covering portions 5a and 5b by the mold coating with dimensions h 1 and h 2 , and projecting the connecting portion 6a of the connector 6 from the upper surface 5′b of the second covering portion 5b. It is characterized by reducing the required amount of mold resin With reduced cost, and weight of the entire electronic component unit, further, it is an object to provide an electronic component unit comprising a receiving structure difficult mechanical damage during assembly of the product and transportation or the like.
（作用） 第１の部品群１ａをモールド被覆する第１の被覆部分５
ａの高さ寸法h1と第２の部品群１ｂをモールド被覆する
第２の被覆部分５ｂの高さ寸法h2との差h1−h2に応じ
て、必要とされる樹脂の量を削減して節約できると共
に、この樹脂の削減量に応じて電子部品ユニット全体の
重量が軽減される。(Operation) First covering portion 5 for mold-covering the first component group 1a
Depending on the difference between h 1 -h 2 of the height h 2 of the second cover portion 5b of height h 1 and the cover mold a second component group 1b of a, the amount of resin required The amount can be reduced and saved, and the weight of the entire electronic component unit can be reduced according to the reduced amount of the resin.
また、コネクタ６の接続部分６ａは、前記第１の被覆部
分５ａの高さ寸法h1と第２の被覆部分５ｂの高さ寸法h2
との差h1−h2により形成される空間を有効利用して配置
される。The connection of the connector 6 portions 6a, the height dimension of the first coating portion 5a and the height h 1 second cover portion 5b h 2
The space formed by the difference between h 1 and h 2 is effectively used.
（実施例） 以下、本考案の一実施例を添付図面に基づいて説明す
る。(Embodiment) An embodiment of the present invention will be described below with reference to the accompanying drawings.
第１図および第２図に示すように、複数の電子部品１
は、全体形状が略矩形の基板２上に実装されている。こ
こで、前記複数の電子部品１は、第１の部品群１ａ、す
なわち、前記基板２の板面から所定の高さＨを超える部
品群と、第２の部品群１ｂ、すなわち、前記高さＨに満
たない部品群とにそれぞれ区分され、前記基板２の長手
方向（第１図および第２図中、左右方向）略中間位置を
境界として左側の部分２ａに前記第１の部品群１ａがま
とめて配置されている一方、基板２の右側の部分２ｂに
は前記第２の部品群がコネクタ６と共にまとめて配置さ
れている。このような区分は、一般に小部品は比較的に
小信号を扱う傾向にあり、大部品は比較的に大信号を扱
う傾向にあることから、配線設計を大幅に複雑化するも
のではない。そして、これら第１、第２の部品群１ａ，
１ｂおよび前記基板２は、例えば熱伝導性の良いアルミ
ニウム金属から成るケース３内に略水平に収容されてい
る。As shown in FIGS. 1 and 2, a plurality of electronic components 1
Are mounted on a substrate 2 having a substantially rectangular overall shape. Here, the plurality of electronic components 1 includes a first component group 1a, that is, a component group that exceeds a predetermined height H from the plate surface of the substrate 2, and a second component group 1b, that is, the height. Each of the first component group 1a is divided into a component group less than H, and the left component 2a is bounded by a substantially intermediate position in the longitudinal direction (horizontal direction in FIGS. 1 and 2) of the substrate 2 as a boundary. On the other hand, the second component group is arranged together with the connector 6 on the right side portion 2b of the board 2 while being arranged together. Such a division does not greatly complicate the wiring design, since small components generally tend to handle relatively small signals and large components tend to relatively handle large signals. Then, these first and second component groups 1a,
The substrate 1b and the substrate 2 are housed substantially horizontally in a case 3 made of, for example, aluminum metal having good thermal conductivity.
ケース３は、上方開放型の略ボックス形状とされ、この
ケース３内において、前記第１、第２の部品群１ａ，１
ｂおよび前記基板２の全体は例えばエポキシ系の樹脂に
よりモールド被覆されている。このモールド被覆によ
り、前記基板２の左側の部分２ａ側においては、該部品
２ａに配置されている第１の部品群１ａの高さに応じた
高さ寸法h1で第１の被覆部分５ａが形成されていると共
に、前記基板２の右側の部分２ｂ側においては、該部分
２ｂに配置されている第２の部品群１ｂの高さに応じた
高さ寸法h2で第２の被覆部分５ｂが形成されており、こ
れら第１および第２の被覆部分は一体となっている。一
方、前記コネクタ６の接続部分6aは、第２の被覆部分5b
の上面５′bから突出して設けられており、この接続部
分６ａの上端面６′ａは前記第１の被覆部分５ａの上面
５′ａと略同一の高さとなっている。なお、この上面
５′ａと前記上面５′ｂとの境界部分には段部５ｃが形
成されており、この段部５ｃには仕切板８が取り付けら
れている。The case 3 has a substantially box shape that is open upward, and the inside of the case 3 includes the first and second component groups 1a and 1a.
The entire b and the substrate 2 are mold-coated with, for example, an epoxy resin. By this mold coating, on the left side portion 2a side of the substrate 2, the first coating portion 5a is formed with a height dimension h 1 corresponding to the height of the first component group 1a arranged in the component 2a. On the right side portion 2b side of the substrate 2 which is formed, the second covering portion 5b has a height dimension h 2 corresponding to the height of the second component group 1b arranged in the portion 2b. Are formed, and the first and second covering portions are integrated. On the other hand, the connecting portion 6a of the connector 6 has a second covering portion 5b.
Is provided so as to project from the upper surface 5'b of the above, and the upper end surface 6'a of the connecting portion 6a has substantially the same height as the upper surface 5'a of the first covering portion 5a. A step portion 5c is formed at the boundary between the upper surface 5'a and the upper surface 5'b, and a partition plate 8 is attached to the step portion 5c.
ここで、前記ケース３内に収容された基板２および該基
板２に実装された第1、第２の部品群1a，１ｂの全体をそ
れぞれモールド被覆するためには、ケース３内に第１の
部品群１ａおよび基板２の全部がそれぞれモールド被覆
される高さにまで樹脂を注入する。そして、この樹脂が
硬化して前記第２の被覆部分5bの全部および第１の被覆
部分5aの下部がそれぞれ前記高さ寸法h2にて形成された
後に、この第１の被覆部分５ａと第２の被覆部分５ｂと
の境界部分上に仕切板８を載置し、しかる後、第１の部
品群１ａの上部が突出している側に樹脂を注入すれば前
記第１の被覆部分５ａの上部が形成され、この第１の被
覆部分５ａの高さ寸法h1は第１の部品群１ａの全体を覆
う高さとなる。こうして、ケース３内に注入硬化された
樹脂により前記第１の被覆部分5aと第２の被覆部分5bと
は、その境界部分に段部５ｃを有しながら一体的に形成
される。なお、この段部５ｃに接着状態となった仕切板
８は、前記第１の被覆部分5aの上部が硬化した後に離型
剤等を用いて離脱してもよい。Here, in order to mold-coat the board 2 housed in the case 3 and the first and second component groups 1a and 1b mounted on the board 2, The resin is injected to a height at which all of the component group 1a and the substrate 2 are covered with the mold. Then, after the resin is cured to form the whole of the second covering portion 5b and the lower portion of the first covering portion 5a with the height dimension h 2, respectively, the first covering portion 5a and the first covering portion 5a The partition plate 8 is placed on the boundary between the second cover portion 5b and the second cover portion 5b, and then resin is injected into the side where the upper portion of the first component group 1a projects. Is formed, and the height dimension h 1 of the first covering portion 5a is the height that covers the entire first component group 1a. In this way, the first coating portion 5a and the second coating portion 5b are integrally formed of the resin that has been injected and hardened in the case 3 while having the step portion 5c at the boundary portion. The partition plate 8 adhered to the stepped portion 5c may be removed by using a release agent or the like after the upper portion of the first covering portion 5a is cured.
次に、この実施例の作用を説明する。Next, the operation of this embodiment will be described.
第１の被覆部分５ａおよび第２の被覆部分５ｂの境界面
（段部５ｃ）と、第２の被覆部分５ｂの上面５′ｂとを
外面の一部とする直方体状空間部分の体積分だけ、ケー
ス３内に注入される樹脂の必要量は削減して節約できる
と共に、この樹脂の削減量に応じた重量の軽減分、電子
部品ユニット全体の重量は軽減される。Only the volume of the rectangular parallelepiped space portion having the boundary surface (step portion 5c) of the first covering portion 5a and the second covering portion 5b and the upper surface 5'b of the second covering portion 5b as a part of the outer surface. The required amount of the resin injected into the case 3 can be reduced and saved, and the weight of the electronic component unit as a whole can be reduced by the reduction in weight corresponding to the reduced amount of the resin.
また、コネクタ６の接続部分6aの上端面６′ａの高さ
は、前記第１の被覆部分５ａの上面５′ａと略同一高さ
とされるため、この接続部分６ａは電子部品ユニット全
体の外形ライン内に含まれることとなる。Further, since the height of the upper end surface 6'a of the connecting portion 6a of the connector 6 is substantially the same as the height of the upper surface 5'a of the first covering portion 5a, this connecting portion 6a is equivalent to the entire electronic component unit. It will be included in the outline line.
なお、この実施例においては、基板２を長手方向に沿っ
て左右２つに区画して、この区画された一方の部分２ａ
に第１の部品群１ａを、他方の部分２ｂに第２の部品群
１ｂをそれぞれ配置しているが、例えば、基板２の外周
部分に第１の部品群１ａを配置し、基板２の中央部分に
第２の部品群１ｂをそれぞれ配置してモールド被覆する
構成等も可能である。In this embodiment, the substrate 2 is divided into two right and left along the longitudinal direction, and the divided one portion 2a.
The first component group 1a is arranged on the other side 2b, and the second component group 1b is arranged on the other part 2b. For example, the first component group 1a is arranged on the outer peripheral portion of the board 2 and the center of the board 2 is arranged. A configuration or the like in which the second component group 1b is arranged in each part and covered with a mold is also possible.
（考案の効果） 以上説明したように本考案においては、複数の電子部品
を所定の高さを基準として、この高さを超える第１の部
品群と、この高さに満たない第２の部品群とに区分して
基板上にそれぞれ配置すると共に、第２の部品群側にこ
の第２の部品群より高い位置となるようにコネクタを実
装して、これら第１、第２の部品群の全体をそれぞれの
高さに応じた高さ寸法で第１、第２の被覆部分により樹
脂モールド被覆したので、この第１、第２の被覆部分の
高さ寸法の差に応じて、樹脂の必要量を削減して節約す
ることができ、この樹脂の削減量に応じて電子部品ユニ
ット全体の軽量化を実現できると共に、製造コストを低
減することができる。(Effects of the Invention) As described above, in the present invention, a plurality of electronic components are set to a predetermined height as a reference, and a first component group that exceeds this height and a second component that is less than this height. And a connector is mounted on the side of the second component group so as to be positioned higher than the second component group so that the first component group and the second component group are separated from each other. Since the whole is resin-molded with the first and second coating portions in a height dimension corresponding to each height, resin is required depending on the difference in height dimension between the first and second coating portions. The amount can be reduced and saved, and the weight of the entire electronic component unit can be realized according to the reduced amount of the resin, and the manufacturing cost can be reduced.
また、コネクタの接続部分を前記第２の被覆部分の上面
から突出させたので、この接続部分は、前記第１、第２
の被覆部分の高さ寸法の差に応じて電子部品ユニット全
体の外形ライン内に含まれることとなり、この電子部品
ユニットの実質的な高さ寸法を小さなものとすることが
できると共に、この電子部品ユニットを他の機体に組み
付ける際のスペース的な自由度を増大させることができ
る。Further, since the connecting portion of the connector is made to project from the upper surface of the second covering portion, the connecting portion is connected to the first and second connecting portions.
According to the difference in the height dimension of the covered portion of the electronic component unit, it is included in the outline line of the entire electronic component unit, and the substantial height dimension of the electronic component unit can be made small, and the electronic component can be made small. It is possible to increase the degree of freedom in space when assembling the unit to another airframe.
更に、前記コネクタの接続部分が電子部品ユニット全体
の外形ラインから大きく突出しないようにこの外形ライ
ン内に略収めた状態で配置することもできるので、この
電子部品ユニットは、他の機体への組み付け時および運
搬時等において、コネクタの他の機物等への接触による
機械的な損傷を受けにくい構造とすることができる。Further, since the connecting portion of the connector can be arranged in such a state that the connecting portion of the connector does not largely project from the outline line of the entire electronic component unit, the electronic component unit can be mounted in another machine body. It is possible to make the structure less susceptible to mechanical damage due to the contact of the connector with other objects during transportation and transportation.
第１図は本考案による電子部品ユニットの一実施例の概
略縦断面図、第２図はその概略横断面図、第３図は従来
の電子部品ユニットの一部破断面図である。 １…複数の電子部品、1a…第１の部品群、1b…第２の部
品群、２…基板、５ａ…第１の被覆部分、５ｂ…第２の
被覆部分、５′ｂ…第２の被覆部分の上面、６…コネク
タ、６ａ…コネクタの接続部分、Ｈ…所定の高さ、h1…
第１の被覆部分の高さ寸法、h2…第２の被覆部分の高さ
寸法。FIG. 1 is a schematic vertical sectional view of an embodiment of an electronic component unit according to the present invention, FIG. 2 is a schematic horizontal sectional view thereof, and FIG. 3 is a partially broken sectional view of a conventional electronic component unit. DESCRIPTION OF SYMBOLS 1 ... Multiple electronic components, 1a ... 1st component group, 1b ... 2nd component group, 2 ... Substrate, 5a ... 1st covering part, 5b ... 2nd covering part, 5'b ... 2nd the upper surface of the cover portion, 6 ... connectors, 6a ... connecting portion of the connector, H ... predetermined height, h 1 ...
The height dimension of the first coating portion, h 2 ... The height dimension of the second coating portion.
Claims (1)
および電子部品を樹脂によりモールド被覆して成る電子
部品ユニットにおいて、前記複数の電子部品を所定の高
さを越える第１の部品群と、該所定の高さに満たない第
２の部品群とに区分して配置すると共に、前記第２の部
品群側に、該第２の部品群より高い位置となるようにコ
ネクタを実装し、前記第１および第２の部品群にそれぞ
れ応じた高さ寸法で前記モールド被覆による第１および
第２の被覆部分を形成して、前記コネクタの接続部分を
前記第２の被覆部分の上面から突出させたことを特徴と
する電子部品ユニット。1. An electronic component unit in which a plurality of electronic components are mounted on a substrate, and the substrate and the electronic components are mold-coated with a resin, wherein the plurality of electronic components exceed a predetermined height. And a second component group that does not reach the predetermined height, and a connector is mounted on the side of the second component group so as to be positioned higher than the second component group. Then, by forming the first and second coating portions by the mold coating with height dimensions corresponding to the first and second component groups, respectively, the connecting portion of the connector is formed on the upper surface of the second coating portion. An electronic component unit characterized by being projected from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16168886U JPH0611535Y2 (en) | 1986-10-21 | 1986-10-21 | Electronic component unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16168886U JPH0611535Y2 (en) | 1986-10-21 | 1986-10-21 | Electronic component unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367281U JPS6367281U (en) | 1988-05-06 |
| JPH0611535Y2 true JPH0611535Y2 (en) | 1994-03-23 |
Family
ID=31088235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16168886U Expired - Lifetime JPH0611535Y2 (en) | 1986-10-21 | 1986-10-21 | Electronic component unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611535Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1054146A2 (en) | 1999-05-20 | 2000-11-22 | Honda Giken Kogyo Kabushiki Kaisha | Engine generator |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6373721B2 (en) * | 2014-01-15 | 2018-08-15 | 株式会社日立製作所 | Communication apparatus and manufacturing method thereof |
-
1986
- 1986-10-21 JP JP16168886U patent/JPH0611535Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1054146A2 (en) | 1999-05-20 | 2000-11-22 | Honda Giken Kogyo Kabushiki Kaisha | Engine generator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6367281U (en) | 1988-05-06 |
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