JPH06120625A - Mounted body of glass substrate - Google Patents

Abstract

(57) [Abstract] [Purpose] To improve the reliability and quality of an apparatus in which an FPC (flexible circuit board) is mounted on a glass substrate. In an image sensor device 4 having a glass substrate 1, an FPC 8 and Au bump electrodes 7 formed on the device surface, a predetermined solder plating electrode 10 and a predetermined Au bump electrode 7 are provided on the main surface of the glass substrate 1. The predetermined ITO film 3 of No. 1 and the solder plating electrode 10 and the Au bump electrode 10 are arranged so as not to overlap with each other, and they are installed through a modified acrylate-based UV-curable insulating resin 11 so that their positions coincide with each other. An image sensor manufactured by a manufacturing method in which the glass substrate 1 side is irradiated with ultraviolet rays to cure the insulating resin 11 and then the insulating resin 11 is mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting method at an electrode portion formed on a glass substrate, and more particularly to a mounting body for a glass substrate.

[0002]

2. Description of the Related Art In recent years, a mounting body having a circuit board made of a glass plate which is low in cost and excellent in smoothness and the like has been incorporated in many devices such as image sensors.

An example of the above image sensor will be described below with reference to the drawings. FIG. 3 is a sectional view of a main part of a conventional image sensor. In FIG. 3, reference numeral 21 is a translucent glass substrate. 22 is A
u electrode, 23 is an Ag-based electrode, and 24 is this electrode 2
2, 23 is a circuit conductor layer connected to. Reference numeral 25 is an image sensor element, 26 is a light receiving element, and 27 is an Al electrode pad. In addition, 28 is a flexible circuit board (hereinafter FP
(C), 29 is a Cu conductor layer, and 30 is a solder plating electrode. Further, 31 is a dedicated tool, and 32 is a modified acrylate-based ultraviolet curable insulating resin.

The mounting method of the image sensor configured as described above will be described below.

First, a glass substrate 21 on which an Au electrode 22, an Ag-based electrode 23 and a circuit conductor layer 24 have been formed is prepared in advance by a screen printing process. Next, a plurality of image sensor elements 25, each of which is made into an individual state by applying a necessary amount of ultraviolet curable insulating resin 32 on the glass substrate 21 at a predetermined position and cutting the wafer from the wafer, After connecting and installing on a straight line so that the predetermined Al electrode pad 27 and the Au electrode 22 are aligned with each other, pressure is applied until the insulating resin 32 between the electrodes is pushed away and abutted. In this state, ultraviolet light is irradiated from the glass substrate 21 side to cure the insulating resin 32, and the image sensor element 25
Implement.

Next, a desired Cu conductor layer 29 is formed on the FPC 28 by a photolithography method, and a solder plating electrode 30 is formed on the electrode pad portion. The FPC 28 is formed on the glass substrate 21 from the solder plating electrode 30. After installation so that the positions of the Ag-based electrode and the Ag-based electrode coincide with each other, pressure is applied from above the FPC 28 with a dedicated tool 31 at a temperature of about 250 ° C. to melt and solder the solder.

[0007]

However, in the above-mentioned configuration, the glass substrate 21 is partially heated by the dedicated tool 31, and microcracks are generated in the glass plate having poor thermal conductivity. Since these microcracks gradually become larger due to the influence of external environment such as heat and vibration over time, there is a risk of causing serious quality defects such as peeling of the Ag-based electrode 23 and cracks of the glass substrate 21. It had a problem that it included.

In view of the above problems, the present invention provides a highly reliable and high-quality glass substrate mounting body.

[0009]

In a transparent glass substrate having a desired electrode formed on a main surface and an FPC having the desired electrode formed thereon, the FPC is provided on the main surface of the glass substrate. Installed through a modified acrylate-based UV-curable insulating resin so that the positions of the electrodes of the FPC and the electrodes of the glass substrate coincide with each other, and pressurize until the insulating resin between the electrodes disappears. After that, the glass substrate is mounted by a manufacturing method in which the FPC is mounted on the glass substrate by irradiating ultraviolet light from the glass substrate side to cure the insulating resin.

[0010]

According to the present invention, since the FPC is mounted on the glass substrate by the above-mentioned construction, no heating step is required at all, so that the micro-cracks are less likely to occur and the reliability is high. Is possible.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An image sensor according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing the main part of an image sensor according to the first embodiment of the present invention. In FIG. 1, 1 is a translucent glass substrate, 2 is a circuit conductor layer,
3 is an Indium- of an electrode connected to the circuit conductor layer 2.
A tin-oxide (hereinafter referred to as ITO) film, 4 is an image sensor element, 5 is a light receiving element, 6 is an Al electrode pad, and 7 is an Au bump electrode. Also, 8 is FPC, 9
Is a Cu conductor layer, 10 is a solder plating electrode, and 11 is a modified acrylate-based ultraviolet curable resin.

A method of manufacturing the image sensor having the above structure will be described below with reference to FIGS.

First, as shown in FIG. 1, a glass substrate 1 is prepared in advance.
Then, the circuit conductor layer 2 and the ITO film 3 are formed by a screen printing process or the like. Next, after the elements such as the light receiving element 5 and the wiring of Al and the electrode pad 6 are formed on the Si wafer by using a semiconductor process, molten spherical Au is Al.
The Au bump electrode 7 is formed by adhering to the electrode pad 6.
Then, the wafer is cut and processed to form the image sensor element 4. Further, a desired Cu conductor layer 9 is formed on the FPC 8 by a photolithography method, and a solder-plated electrode 10 is formed on the electrode portion so as to prevent oxidation of the surface of the Cu conductor layer 9 and perform stable connection.

In the member thus manufactured, first, a required amount of the ultraviolet curable resin is applied to a predetermined position on the glass substrate 1, and the solder plating electrode 10 and the IT of the predetermined FPC 8 are applied.
It is installed so that the positions of the O film 3 are aligned with each other, an appropriate pressure is applied to the FPC 8 and the glass substrate 1, and the insulating resin 11 between the electrodes is pushed away and pressure-contacted, and ultraviolet light is irradiated from the glass substrate 1 side. Then, the insulating resin 11 is cured to mount the FPC 8 on the glass substrate 1. Similarly, the glass substrate 1
A predetermined amount of the ultraviolet curable insulating resin 11 is applied to a predetermined position on the main surface of the, and a plurality of image sensor elements 4 are connected to each other in a straight line and arranged to form a predetermined Au bump electrode 7. The ITO film 3 is installed so that the positions thereof are aligned with each other, appropriate pressure is applied to the image sensor element 4 and the glass substrate 1, and the insulating resin 11 between the electrodes is pushed away and pressure-contacted. Insulating resin 1 by irradiating light
The image sensor element 1 is adhered and fixed by hardening the image sensor element 1.
In this way, the plurality of image sensor elements 4 are linearly connected and mounted on the glass substrate 1. At this time, Au
By providing the bump electrodes 7, the Au bump electrodes, which are sufficiently pressed against the ITO film 3 connected to the same image sensor element 5 with the ITO film having a large film thickness, are easily crushed and a good connection can be achieved. Thus, even a thin ITO film is brought into a sufficient pressure contact state, and reliable connection can be performed.

In the above-mentioned mounting body, the electrode portion on the glass substrate 1 is made of an ITO film, so that it is shaded by an electrode and irradiated with ultraviolet light as compared with a conventional one formed of a metal film such as Au or Ag. Since there is no unbonded portion, strong bonding can be performed, and mounting reliability is improved. Also, the glass substrate 1
Between the FPC 8 and the glass substrate 1 and the image sensor element 4
The film thickness of the ultraviolet curable insulating resin 11 after curing is 50
It is configured so as to be not more than μm. In the connection mechanism of this embodiment, the contraction stress of the insulating resin 11 acts as an attractive force between the electrodes, and the thermal expansion of the insulating resin 11 acts as a repulsive force between the electrodes. This repulsive force is a value proportional to the film thickness. Therefore, the connection part will not be broken in the actual use state, that is,
To satisfy the condition that the repulsive force is less than the attractive force, the film thickness should be 5
This is because it is necessary to set the thickness within 0 μm.

As described above, according to this embodiment, by curing the ultraviolet curing type insulating resin, F
By mounting a PC, a highly reliable and high-quality image sensor can be obtained.

An image sensor according to a second embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a sectional view showing the main part of an image sensor according to the second embodiment of the present invention. 2, parts that are the same as the parts shown in FIG. 1 are given the same numbers, and descriptions thereof are omitted.

The difference from FIG. 1 is that the circuit conductor layer 2 formed by the screen printing process is not provided on the glass substrate 1.

A method of manufacturing the image sensor having the above structure will be described below.

Also in this embodiment, the image sensor element 4 and the FPC 8 are prepared in advance in the same manner as in the first embodiment. Further, only the ITO film 3 is formed on the main surface of the glass substrate 1 by a screen printing process or the like. In such a member, first, a required amount of a modified acrylate-based UV-curable insulating resin 11 is applied to a predetermined position on the main surface of the glass substrate 1, and a predetermined solder-plated electrode 10 of the FPC 8 and a plurality of solder-plated electrodes 10 are provided. The predetermined Au bump electrodes 7 of the image sensor elements 4 connected and arranged in a straight line are installed so as to match the positions of the ITO film 3 on the glass substrate. At this time, the solder plating electrode 10 of the FPC 8 and the Au bump electrode 7 of the image sensor element 4 should not overlap. Next, appropriate pressure is applied to the solder plated electrode 10 and the IT.
The insulating resin 11 between the O films 3 and between the Au bump electrodes 7 and the ITO film 3 is pushed and pressed to irradiate ultraviolet light from the glass substrate 1 side to cure the insulating resin 11.

As described above, in this embodiment, the circuit conductor layer formed by the screen printing process on the glass substrate is not provided, and the FPC and the image sensor element are directly connected via the ITO film. Therefore, in addition to the first embodiment, the conductor resistance and the interline capacitance can be reduced, or a fine pattern with a pitch of 0.1 mm or less can be easily formed, so that the performance of the image sensor can be easily improved. realizable.

In this embodiment, 10 is a solder plated electrode, but an Au plated electrode may be used.

[0025]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, in a light-transmissive glass substrate having a desired electrode formed on its main surface and an FPC having the desired electrode formed, the FPC is replaced by the glass substrate. The electrode of the FPC and the electrode of the glass substrate are placed on the main surface via a modified acrylate-based UV-curable insulating resin, and the insulating resin between the electrodes is applied by applying pressure. After pressure contact until there is no
High reliability is obtained by using a glass substrate mounting body characterized by being manufactured by a manufacturing method in which FPC is mounted on a glass substrate by irradiating ultraviolet light from the glass substrate side to cure the insulating resin. It is possible to realize a glass substrate mounting body with excellent quality.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part of an image sensor according to a first embodiment of the present invention.

FIG. 2 is a sectional view of an essential part of an image sensor according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a main part of a conventional image sensor.

[Explanation of symbols]

 1, 21 Glass substrate 2, 24 Circuit conductor layer 3 ITO film 4, 24 Image sensor element 5, 26 Light receiving element 6, 27 Al electrode pad 7 Au bump electrode 8, 28 FPC 9, 29 Cu conductor 10 Solder plating electrode 11 Modified Acrylate type UV curable insulating resin 22 Au electrode 23 Ag electrode

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H04N 1/028 Z 8721-5C // H01L 27/14

Claims (8)

[Claims] 1. A light-transmissive glass substrate having desired electrodes formed on a main surface thereof, and a flexible circuit board having desired electrodes formed thereon, wherein the flexible circuit board is a flexible circuit board. On the surface, the electrodes of the flexible circuit board and the electrodes of the glass substrate are placed via a modified acrylate-based ultraviolet curing type insulating resin so that the positions of the electrodes are aligned with each other, and the insulation between the electrodes is applied by applying pressure. After pressure contact until the resin disappears, ultraviolet light is irradiated from the glass substrate side to cure the insulating resin,
A glass substrate mounting body, which is manufactured by a manufacturing method in which a flexible circuit board is mounted on a glass substrate. 2. An electrode provided on the main surface of a glass substrate is made of In
The glass-body mounted body according to claim 1, wherein the glass-tin-oxide film is used. 3. The mounting body for a glass substrate according to claim 1, wherein the electrode of the flexible circuit board is formed by depositing Au on the surface of the Cu conductor layer by a plating method. 4. The glass substrate mounting body according to claim 1, wherein the electrodes of the flexible circuit board are formed by attaching solder to the surface of the conductor of the Cu layer by a plating method. 5. The glass according to claim 1, wherein the ultraviolet curable insulating resin interposed between the glass substrate and the flexible circuit substrate is configured so that the film thickness after curing is 50 μm or less. Board assembly. 6. A semiconductor element having electrodes formed on a glass substrate, a flexible circuit board, and an element surface, wherein a predetermined electrode of the flexible circuit board and a predetermined electrode of the semiconductor element are glass substrates on the main surface of the glass substrate. The predetermined electrode, the electrode of the flexible circuit board and the electrode of the semiconductor element do not overlap each other, and they are installed through a modified acrylate-based UV-curable insulating resin so that their positions are aligned with each other. The flexible circuit board is formed by pressing the insulating resin between the electrodes on the substrate and the electrodes of the flexible circuit board and the electrodes of the semiconductor element until the insulating resin is exhausted, and then irradiating ultraviolet light from the glass substrate side to cure the insulating resin. The glass substrate mounting body according to claim 1, which is manufactured by a manufacturing method in which the semiconductor element and the semiconductor element are mounted on the glass substrate. 7. The glass substrate mounting body according to claim 2, wherein the electrode of the semiconductor element is provided with a protruding electrode formed by a manufacturing method in which molten Au is adhered onto an Al electrode pad. . 8. The semiconductor element is an image sensor element in which an array of a plurality of light receiving elements is formed on a straight line, and a plurality of the image sensor elements are connected and mounted on a straight line. The mounted body of the glass substrate according to claim 2.