JPH06174785A - Thermostatic test equipment for ic device - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] To maintain a uniform temperature inside a large temperature chamber so that all devices mounted on a sub-board can be tested and measured under the same temperature conditions. [Structure] By partitioning the interior of the thermostatic chamber 10 with partition walls 52 to 55, the device mounted on the sub-board 6 that is loaded from the outside of the chamber at the portion of the unloader unit 1 is heated to a test / measurement temperature. A constant temperature heat treatment chamber C1 to be cooled is used, the upstream side test measurement unit 2 is a first test chamber C2, the standby unit 3 is a standby chamber C3, the downstream test measurement unit 4 is a second test chamber C4, and the unloader unit 1 is further used.
Is placed, in order to carry out the tested sub-board 6,
The sub-substrate 6 is divided into a room temperature heat treatment chamber C5 for returning the room temperature to a room temperature as close as possible, and each chamber C
Temperature control is individually performed for each of 1 to C5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention connects to a test head of an IC tester during horizontal transportation of an IC device,
The present invention relates to an IC device test apparatus for testing and measuring its electrical characteristics, and more particularly to a constant temperature test apparatus for testing an IC device under a predetermined temperature condition.

[0002]

2. Description of the Related Art IC is used as an IC device testing apparatus.
The tester includes a tester and a device transfer mechanism for supplying the device to the test head of the IC tester and storing the device after the test is completed. The device transfer mechanism includes a loader section and a loader section. A test and measurement section,
An unloader section is provided, and the IC device sent from the loader section is connected to the test head of the IC tester in the test measurement section, and the device is energized to test and measure the electrical characteristics of the IC device. It is configured to discharge.

There are a self-weighted sliding system and a forced transportation system as the device transportation system in the device transfer mechanism.
The forced transfer method is used to handle a device having a shape that is not suitable for sliding by its own weight, and the transfer path is generally provided in the horizontal direction. Put the device on the jig,
Conveyors and other appropriate driving means convey the loader section to the test measuring section and the test measuring section to the unloader section. Here, if a jig dedicated to transportation is used as a jig for mounting the device, there is a disadvantage that the device has to be transferred from the jig to the socket of the test head in the test measurement unit. Using a sub-board with a connection contact part to the test head, the device is mounted in each socket of this sub-board and transported, and in the test measurement section,
A sub-board that has been connected to a test head has been developed. In this way, a large number of devices
Since it becomes possible to contact and separate from the test head at the same time without the need for transferring or the like, there is an advantage that the speed of the test / measurement can be achieved.

Here, the IC device is not only tested at room temperature but also at a high temperature of about 80 ° to 150 ° C.
It is also necessary to perform the test under each condition of low temperature such as 30 ° C to -50 ° C. Therefore, a constant temperature bath is provided to heat the IC device so that the temperature of the IC device is set to a preset temperature condition. In this constant temperature bath, the device mounted on the sub-board is heated or cooled to a test temperature and set. The energization test is performed while maintaining the temperature condition.

[0005]

By the way, in order to test and measure a device in a large amount and efficiently, the area of the sub-board is widened and a larger number of sockets are provided so that the test head A large number of contact portions may be provided, and a plurality of test and measurement portions may be provided in the sub-substrate carrying direction. However, if the area of the sub-board is widened and a large number of test and measurement parts are provided, the thermostat becomes larger accordingly. When such a large-sized constant temperature bath is used, it is extremely difficult to keep the internal temperature of the bath in a uniform state.

The present invention has been made in view of the above points, and an object of the present invention is to make it possible to test and measure all devices in a constant temperature bath under uniform temperature conditions. .

[0007]

In order to achieve the above-mentioned object, the present invention provides a loader in which a sub-board on which a large number of sockets for mounting IC devices are arranged is heat-treated under a predetermined temperature condition. One by one from the unit, horizontally transported, and connected to each of the test heads provided in the test measurement unit provided at a plurality of locations along this transportation path,
A constant temperature test apparatus for an IC device, which is configured to discharge to an unloader section after the electrical characteristics are tested and measured, and a partition formed with an opening for transferring a sub-board between the sections. Each of the formed chambers is formed, and an air circulation flow is made to flow through each of the chambers in the direction along the partition wall.

[0008]

In the thermostatic chamber, from the viewpoint of function, the loader section, the test measurement section and the unloader section, and when a standby section is provided between a plurality of test measurement sections, this standby section is also included. Then, partition walls are provided to divide each unit into a plurality of sections in consideration of the arrangement of the internal constituent members. However, since it is necessary to move the sub-board between the respective parts, the minimum opening necessary for passing the sub-board is formed. As a result, the inside of the large-sized constant temperature bath can be divided into a plurality of small chambers. When the chamber is divided into such small chambers, temperature control in each chamber becomes easy and strict temperature control becomes possible.

Heat treatment is individually performed in each chamber. This heat treatment is performed by circulating an air circulation flow from a heat source in the chamber. Thus, this air circulation flow is made to circulate in the direction along the partition wall that forms a partition in each chamber. As a result, the temperature of each chamber can be kept uniform, and the temperature of each chamber can be controlled independently, so that the air circulation flow of one chamber does not affect the other chamber. It becomes possible to finely control individually according to each function, and it is possible to test / measure the IC device at a uniform temperature.

[0010]

Embodiments of the present invention will now be described in detail with reference to the drawings. First, in FIG. 1, 1 is a loader unit, 2 is an upstream test measuring unit, 3 is a standby unit, 4 is a downstream test measuring unit, and 5 is an unloader unit. The loader unit 1 is
It is composed of a load position 1a and a constant temperature heat treatment section 1b, and a large number of sub-boards 6 are arranged in a stack in the constant temperature heat treatment section 1b. The load position 1a is located at the lower part of the constant temperature heat treatment section 1b. The sub substrates 6 are sequentially supplied one by one to the load position 1a. Further, the unloader unit 5 has an unloading position 5a and an unloading position 5a.
The sub-substrate 6 which is made up of the normal temperature heat treatment section 5b formed on the upper part of the substrate and which has been subjected to the test and measurement and sent to the unloader section 5 is sequentially pushed up to the normal temperature heat treatment section 5b. Further, the test heads 7 and 8 of the IC tester are arranged at the lower positions of the upstream and downstream test measurement units 2 and 4, and the sub-board 6 is connected to the sub-boards from the loader unit 1 to the unloader unit 5. It is displaceable between the transfer positions 2a and 4a facing the transfer path of the substrate 6 and the test positions 2b and 4b connected to the test head 7. In the transport path of the sub-board 6 configured as described above, the loader unit 1, the upstream side test measurement unit 2, the standby unit 3,
When the sub-boards 6 are arranged at the respective positions of the downstream side test measurement section 4 and the unloader section 5, the intervals between the adjacent sub-boards 6 are all set to be constant.

As shown in FIG. 2, the sub-board 6 has a base plate 6a and a large number of sockets 6b mounted on the base plate 6a, and is opposite to the mounting portion of the socket 6b on the base plate 6a. A required number of terminal pins (not shown) connectable to the contact portions of the test heads 7 and 8 are provided on the side surface. The device D is mounted in each socket 6b while being positioned at a predetermined position. For connecting the test heads 7 and 8 to the front and rear positions of the sub-board 6 by fitting the positioning pins 7a and 8a provided on the test heads 7 and 8 to perform the positioning. Through holes 6c and 6d are formed in the. The sub-board 6 has a rectangular shape, and is transported along the transport path with its short sides facing forward and backward in the transport direction.

The IC device testing apparatus is constructed as described above. This apparatus is for testing and measuring the IC device D at a high temperature or a low temperature. The loader section 1 and the upstream side test measurement. The unit 2, the standby unit 3, the downstream side test measuring unit 4 and the unloader unit 5 are provided in a constant temperature bath 10 which is kept in a predetermined constant temperature state.

A first feeding means 11 is provided for transferring the sub-board 6 from the loader unit 1 to the upstream measuring unit 2 and from the upstream measuring unit 2 to the standby unit 3, and from the standby unit 3. In order to transfer the sub-board 6 from the downstream side test measurement section 4 to the unloader section 5 in the downstream side test measurement section 4,
The feeding means 12 is provided. Therefore, the configuration of the feeding means 11 and 12 will be described below with reference to FIGS. 3 to 6. However, since the two feeding means 11 and 12 have exactly the same structure, the first feeding means will be described. 11, the same reference numerals will be used for the respective constituent members of the second feeding means 12, and a detailed description thereof will be omitted.

Reference numeral 20 denotes an arm, and the arm 20 has sub-boards 6 adjacent to each other in the transfer path.
A pair of engagement pins 21 and 22 are vertically provided at positions separated by a distance corresponding to the distance between the six sub-boards. These engagement pins 21 and 22 are located on the upstream side in the transport direction. The through hole 6c on the front side of 6 and the through hole 6d on the rear side of the sub-board 6 located on the downstream side can be engaged with each other. And this engagement pin 2
With each of the sub-boards 6 and 6 inserted into the through holes 6c and 6d, the arm 20 is moved in the carrying direction of the carrying path by a predetermined distance to be separated from the through holes 6c and 6d. You will be able to send one pitch.

The arm 20 carries out a rectangular motion in which one cycle includes descending, advancing, ascending, and retracting, so that the two sub-boards 6 are conveyed one pitch at a time.
An elevating mechanism and a horizontal driving mechanism are provided to enable this rectangular movement. Here, the arm 20 of the first feeding means 11 and the arm 20 of the second feeding means 12 which are operated by the lifting mechanism and the horizontal driving mechanism operate in a synchronized state, and a maximum of four sub-boards are provided. It is controlled so as to pitch 6 simultaneously.

The arm 20 is attached to an elevating block 23 which constitutes an elevating mechanism.
Is connected to the rod 24. The rod 24 penetrates through the bearing member 25 and extends upward, and a guide roller 27 that engages with an up-and-down drive rail 26 formed in a U shape is attached to a tip end portion thereof. Lifting drive rail 26
Has a dimension longer than the moving distance of the arm 20 in the horizontal direction, and has parallelogram linkage mechanism 28a,
28b are connected to each other and can be moved up and down by this parallelogram link. A connecting bar 29 is pivotally mounted at an intermediate position for vertically moving the elevating drive rail 26, and the connecting bar 29 is connected to a lever 31 connected to a motor 30. Therefore, when the motor 30 is operated, the lifting drive rail 26
Is lowered, and the guide roller 27 and the guide roller 2
The rod 24 connected to 7 is pushed down and the arm 20
Can be lowered. here,
The motor 30 is provided outside the constant temperature bath 10, and its output shaft 30 a penetrates the wall of the constant temperature bath 10 and extends into the bath.

As described above, by lowering the arm 20, the engaging pin 21 engages with the rear through hole 6d of the sub-board 6 located at the front side, and the engaging pin 22 moves forward at the rear position. It will be engaged with the through hole 6c on the side. On the other hand, when the arm 20 moves up, the engagement between the engagement pins 21 and 22 and the sub-board 6 is released.

Belt drive means is used as a horizontal drive mechanism for the arm 20. This belt drive means
A metal belt 34 made of a metal strip having good heat resistance is wound around the pair of pulleys 32, 33.
Then, the bearing member 25 is connected to the metal belt 34 and the metal belt 34 is fed to move the arm 20 in the front-rear direction. Further, in order to guide the bearing member 25 when the arm 20 moves, an attachment member 35a of a slide rail 35 is fixed to the inner wall of the constant temperature bath 10, and a slide member connected to the bearing member 25 is attached to the slide rail 35. 36 is engaged.

Shafts 32a and 33a of the pulleys 32 and 33 extend through the wall of the constant temperature bath 10 to the outside, and pulleys 37 and 38 are attached to the other ends of the shafts 32a and 33a. A belt 39 is also wound around the pulleys 37 and 38, and the belt 39 is connected to a driven side member 40 a of a rodless cylinder 40. Therefore, if the stroke of the rodless cylinder 40 is matched with the stroke of the arm 20 moving back and forth, the arm 20 can be accurately moved back and forth without providing a special sensor or the like. Here, the first feeding means 1
The first and second feeding means 12 have exactly the same configuration, but the arms 20 are oriented in opposite directions.

Next, the transfer path of the sub-board 6 will be described with reference to FIG. Here, since the sub-board 6 is provided with the electrode pins protruding on the back surface side thereof,
The left and right sides are guided and conveyed. Then, in the loader unit 1, the sub-board 6 is dropped from the constant temperature heat treatment unit 1b to the loading position 1a,
Further, in the unloader unit 5, the sub-board 6 is pushed up from the unloading position 5a toward the room temperature heat treatment unit 5b, so that the guide rails 41 thereof are provided on the left and right sides of the transfer path so as to face each other. 41a, and the lower surfaces on the left and right sides of the sub-board 6 are brought into sliding contact with the horizontal plane portions of the L-shaped rails 41a, 41a. The upper part is opened to the transition part from the loader part 1 to the upstream side test measurement part 2, the part from the upstream side test measurement part 2 to the standby part 3 and the transition part from the downstream side test measurement part 4 to the unloader part 5. Since there is no requirement that the guide rail 42 be formed, the guide rail 42 may be formed by a U-shaped rail 42a in order to ensure stability of movement, and the L-shaped rail in the loader section 2 and the unloader section 4 described above may be formed. You may make it use the guide rail 41 which consists of 41a.

On the other hand, the first guide rail 43 and the second guide rail 43 are provided at the positions of the upstream and downstream test measuring sections 2 and 4, respectively.
Guide rails 44 and the two guide rails 43 and 44 are arranged vertically with the first guide rail 43 positioned below.
Since the upstream and downstream test measurement units 2 and 4 have the same configuration, the upstream test measurement unit 2 is shown in the drawings, and the downstream test measurement unit 4 is not illustrated and described. Omit it. The first guide rail 43 not only functions as a transfer path for the sub-board 6, but also has a function of bringing the test heads 7 and 8 into and out of contact with each other. The rail 43 has a pair of left and right U-shaped rails 43a, and the left and right side portions of the sub-board 6 are sandwiched by the U-shaped rails 43a so that the vertical movement of the rails 43 can be restricted.
On the other hand, the second guide rail 44 has a configuration including the L-shaped rail 44a because it functions only as a conveyance path.

Here, the first guide rail 43 and the second guide rail 44 are integrally moved up and down by the elevating means so that the first guide rail 43 faces the conveyance path, and the second guide rail. A position 44 is located above the transport path, and both guide rails 43 and 44 are lowered to move the first guide rail 43.
The sub-board 6 is connected to the test heads 7 and 8 by the guide rail 43, and is displaced between the second guide rail 44 and the position facing the transport path. Therefore, the first and second guide rails 43 and 44 are fixedly provided to the holding plates 43b and 44b, respectively, and the height difference between the conveying path and the test head is provided between the holding plates 43b and 44b. A spacer rod 45 is installed to hold the spacer rod 45 at a distance corresponding to. Also, the holding plate 44b
Vertical movement rods 46, 46 are connected to the vertical movement rod 46, and the vertical movement rod 46 is fitted into a bearing member 47 fixedly provided on a mounting plate 35 a of the slide rail 35. An operating plate 48 is connected to the upper end of the vertically moving rod 46,
A rack 49 is attached to the operating plate 48.
A drive gear 50 meshes with the rack 49, and the drive gear 50 is a motor 51 provided outside the constant temperature bath 10.
It is designed to be driven by. In addition to the above-mentioned means, for example, a cylinder or the like can be used as the raising and lowering drive means for the operating plate 48.

With the above-described structure, the first guide rail 43 is lowered to the test positions 2a and 4a in the upstream and downstream test measurement units 2 and 4, so that the sub-board 6 is tested. 7 and 8, and while conducting the energization test of the device D mounted therein, the sub-board 1 is moved from the load position 1a of the loader unit 1 to the sub-board 1.
The sheet is taken out, passed through the upstream side test measurement section 2, and transferred to the standby section 3. In addition, the upstream side test measurement unit 2 is provided in the standby unit 3.
In the case where the sub-board that has been tested is placed in the standby position 3, the pre-tested sub-board is sent from the load position 1a to the standby unit 3 and at the same time, the tested sub-board passes through the downstream side test measurement unit 4 and the unloader. Send to Part 5. here,
When the energization test is being performed in each of the test measuring units 2 and 4, the second guide rail 44 faces the transport path at the relevant portion, so that the first and second sub-boards pass through the first and second passages.
It is performed smoothly by the second feeding means 11 and 12.

When the energization test is completed in each of the test measuring units 2 and 4, and the first guide rail 43 is returned to the transporting positions 2a and 4a, the sub-board before the test faces the loading position 1a and the standby unit 3, In addition, a tested sub-board is located in each test measurement unit 2, 4. Therefore, the first and second feeding means 1
When 1 and 12 are actuated, the two pre-test sub-boards move to the upstream and downstream test measurement units 2 and 4, respectively, and are held by the first guide rails 43. Further, the tested sub-board located in the downstream side test measurement section 4 moves to the unloader section 5, and the sub-board located in the upstream side test measurement section 2 moves to the standby section 3. In this state, the energization test is performed by moving the first guide rail 43 from the transport positions 2a, 4a to the test positions 2b, 4b. During this time, by operating the first and second feeding means 11 and 12 for two cycles, the tested sub-board located in the standby part 3 is moved to the second position in the downstream side test and measurement part 4 at the second transfer position 4a. Guide rail 4
4 and is collected by the unloader unit 5 and the loader unit 1
A new sub-board is taken out from the second guide rail 44 facing the transport position 2a of the upstream side test measuring section 2.
To the standby unit 3 through.

Thereafter, by repeating this operation,
The device D mounted on the sub-board is sequentially tested and measured. That is, by operating the first and second feeding means 11 and 12 for one cycle, the sub-boards are respectively fed to the two test measuring units 2 and 4, and then the device D is operated by each of the test measuring units 2 and 4. While conducting the power-on test of the
By operating the feeding means 11 and 12 for 2 cycles, the two tested sub-boards on the transfer path are collected in the unloader unit 5, and the two pre-tested sub-boards are loaded at the loading position 1a and the standby position, respectively. Place it in part 3,
It is possible to create a state in which the next test / measurement can be performed.
As described above, by providing two test measuring units along the transport path and transporting the sub-board while conducting the device energization test, a high speed and a large number of IC devices can be obtained. Can be tested and measured very efficiently.

The sub-board 6 on which the IC device D is mounted is
In this way, after being taken out from the loader unit 1, the electrical characteristics thereof are tested and measured, and then collected in the unloader unit 5. Since the two sub-boards 6 are tested at the same time, in addition to the loader unit 1 and the unloader unit 5, two test measurement units 2 and 4 and a standby unit 3 therebetween are provided. Moreover, in order to test and measure as many devices D as possible in each of the test measuring units 2 and 4, the sub-board 6 having a large outer dimension itself is used. Here, the device D is designed to be subjected to an energization test in a high temperature or low temperature state. For this reason, the above-mentioned respective parts are arranged inside the constant temperature bath 10.
Therefore, the internal space of the constant temperature bath 10 is considerably wide, and it is extremely difficult to maintain the entire inside of the constant temperature bath 10 in a uniform temperature state.

From the above, in the present invention, the interior of the constant temperature bath 10 is divided into relatively small compartments. That is, the part of the unloader unit 1 is a constant temperature heat treatment chamber C1 for heating or cooling the device D mounted on the sub-board 6 carried in from the outside of the tank to the test / measurement temperature, and the upstream side test measurement unit 2 is used. The first test chamber C2,
The standby unit 3 is used as the standby chamber C3, the downstream side test measurement unit 4 is used as the second test chamber C4, and the unloader unit 1 is arranged. In order to carry out the tested sub-substrate 6, the sub-substrate 6 is kept at room temperature as much as possible. The room temperature heat treatment chamber C5 for returning to a close state is used.

In order to prevent the temperature conditions in the chambers C1 to C5 from affecting each other, the chambers C1 to C5 are partitioned by partition walls 52 to 55, respectively. 55, the sub-board 6 and the first,
The openings 52a to 55a are formed so that the arms 20 of the second feeding means 11 and 12 can pass therethrough. Since the temperature condition of the room temperature heat treatment chamber C5 is significantly different from that of the other chambers, the second chamber of the openings 52a to 55a is the second chamber.
A shutter 55 is provided in the opening 55a between the test chamber C4 and the room temperature heat treatment chamber C5, and the shutter 56 is opened only when the sub-substrate 6 passes, thereby the second test chamber C4. The temperature condition is not influenced by the room temperature heat treatment chamber C5. Further, in the constant temperature heat treatment chamber C1, an inlet 57 for the sub-substrate to be tested is provided, and in the room temperature heat treatment chamber C5, an outlet 58 for the tested sub-substrate is opened. A shutter 59 is provided, and a shutter is provided at the carry-out port 58 as needed.
Here, the outer wall of the constant temperature bath 10 is a heat insulating wall, but the partition walls 52 to 55 that partition the chambers C1 to C5 do not necessarily have to be heat insulating walls, and may be formed using, for example, a metal plate material or the like.

Each of the chambers C1 to C5 is provided with a temperature control mechanism including a heat source and a circulating means for circulating a constant temperature air in order to individually control the temperature. Therefore,
The temperature control mechanism of each chamber C1 to C5 will be described below. The first and second test chambers C2, C4
Since the standby chamber C3 and the standby chamber C3 have the same structure, the first test chamber C2 will be described and the standby chamber C3 will be described.
The illustration and description of the second test chamber C4 are omitted.

A constant temperature heat treatment chamber C1 is shown in FIGS. As you can see from these figures,
In the constant temperature heat treatment chamber C1, nine sub substrates 6 are stacked as the constant temperature heat treatment section 1b.
Then, the stacked sub-boards 6 are lowered one pitch at a time to sequentially move to the loading position 1a. For this purpose, a pair of chain drive type sub-board pitch lowering means 13 is provided, and the sub-board pitch lowering means 13 is provided with holding claws 14 which are engaged and held at both front and rear ends of the sub-board 6. It is installed.

Thus, in the constant temperature heat treatment chamber C1,
The carried-in sub-board 6 is heat-treated so as to reach the test / measurement temperature. As a temperature management mechanism for this purpose, a heater 60 serving as a heat source and a refrigerant supply pipe 61 are provided, and a circulation of a constant temperature air circulation flow composed of warm air or cold air supplied from the heater 60 or the refrigerant supply pipe 61. A fan 62 and a duct 63 are provided as means. The heater 60 is composed of a rod heater and is arranged on the downstream side of the fan 62 in the duct 63 so as to extend over its entire length. The refrigerant supply pipe 61 is for producing cool air by ejecting a refrigerant such as nitrogen gas. As shown in FIG. 10, the refrigerant supply pipe 61 is composed of a T-shaped pipe, and the refrigerant is ejected to positions near both ends thereof. The outlets 61a and 61a are formed.

Here, in the constant temperature heat treatment chamber C1,
When the sub-board 6 is carried in at room temperature and sequentially lowered by the sub-board pitch lowering means 13 to reach the loading position 1a, the sub-board 6 is heated or cooled to the test / measurement temperature, which is more efficient. In order to make the temperature constant, the temperature-controlled air circulation flow outlet in the duct 63 is formed over the upper, middle, and lower three stages 63U, 63M, 63L. And each of these outlets 63U,
At the positions near 63M and 63L, the wind direction adjusting plate 64 is provided.
U, 64M, 64L and air volume adjusting plates 65U, 65M, 6
5L is arranged. Therefore, the wind direction adjusting plates 64U, 6
The 4M, 64L and the air volume adjusting plates 65U, 65M, 65L allow a constant temperature air circulation flow having a desired air flow direction and air volume to flow from the air outlets 63U, 63M, 63L. In the upper part, the sub-board 6 has just been loaded into the constant temperature bath 10 from the loading port 57, so that the upper stage blow-out port 6 should be used in order to perform heat treatment rapidly.
A constant temperature air circulation flow is made to flow from 3U at a large flow rate, and a flow rate is made smaller from that at the middle stage outlet 63M to adjust the temperature, and the temperature state of the sub-board 6 is maintained at the lower stage outlet 63L. Therefore, the flow rate can be controlled to be smaller. In addition, if a sudden temperature change is applied to the sub-board 6 immediately after being loaded into the constant temperature bath 10, if the sub-board 6 may be deformed or damaged, the flow rate of the middle-stage outlet 63M is set to It is also possible to make the most. Of course, all outlets 63U, 63
A constant temperature air circulation flow having a uniform air flow may be made to flow from M and 63L.

In the first test chamber C2 (similarly to the second test chamber C4 and the standby chamber C3), the sub-substrate 6 is maintained at the test / measurement temperature state, and therefore, also in the first test chamber C2. As shown in FIG. 11, as in the constant temperature heat treatment chamber C1, a heater 70 as a heat source and a refrigerant supply pipe 71 are provided as a temperature management mechanism, and the heater 70 or the refrigerant supply pipe 7 is provided.
A fan 72 and a duct 73 are provided as a circulation means of the constant temperature air circulation flow composed of the warm air or the cold air supplied from 1. An air flow direction adjusting plate 74 and an air flow amount adjusting plate 75 are provided in the duct 73 in the vicinity of the blowout port 73a. However, since only the transport position 2a and the test position 2b are provided at this portion, the blowout port 73a is open at only one position toward this position.

Here, a partition wall 5 for partitioning the first test chamber C2, the standby chamber C3, and the second test chamber C4.
At the positions of 3, 54, the first and second feeding means 11, 12 are provided.
Because of the arrangement of the
54a must be formed, but since these three chambers C2 to C4 are maintained at substantially the same temperature state, there is little risk of mutual temperature conditions affecting each other. However, in order to maintain a constant temperature in each of the chambers C2 to C4 and maintain a constant air circulation flow, a constant temperature air circulation flow is individually passed. Further, since the first and second feeding means 11 and 12 are divided at the intermediate position of the standby part 3, a partition is provided at the intermediate position of the standby part 3 to provide the upstream side test measurement part 2 and the standby position. If the parts of the part 3 and the downstream side test measuring part 4 are divided into two chambers, and these are controlled by separate temperature control mechanisms,
This partition can be formed by providing an extremely small opening for passing the arm 20 and the sub-board 6.

The room temperature heat treatment chamber C5 in which the unloader section 5 is arranged is for returning the sub-substrate 6 in the test / measurement temperature state to the state as close to the room temperature as possible while keeping the dry state. Here, the unloader unit 5
Is provided in the room temperature heat treatment chamber C5 because the sub-substrate 6 and the device D mounted thereon are exposed to excessively rapid temperature changes, which causes inconveniences such as dew condensation and deformation. It is the one that exerts a buffering function. For this reason, in this room temperature heat treatment chamber C5, as shown in FIG.
0 is provided. However, since it is not necessary to cool the inside of the chamber, no refrigerant is supplied. Further, a fan 81 and a duct 82 are provided as a circulation means of the normal temperature air circulation flow composed of warm air supplied from the heater 80. Here, since the unloader unit 5 is provided with a plurality of stages (five stages in the drawing) of the room temperature heat treatment unit 5b, the sub substrate pitch lowering means 13 of the chain drive system in the loader unit 1 has the same structure. Substrate pitch raising means (not shown) is provided, the outlet of the duct 82 is formed in two stages, and a position near the lower outlet 82L is
An air flow direction adjusting plate 83L and an air flow rate adjusting plate 84L are provided, and an air flow direction adjusting plate 83U and an air flow rate adjusting plate 84U are provided in the vicinity of the upper outlet 82U so that they can be individually heat-treated at room temperature. It has become. In the room temperature heat treatment chamber C5, since the device D is for returning to normal temperature smoothly while keeping the dry state, the outside air intake part 85 faces the suction port 82S of the duct 82, and therefore, The outside air is taken in as much as possible to create an air circulation flow of a temperature condition approximately in the middle of the outside air temperature and the test / measurement temperature so as to be in contact with the sub-board 6.

Thus, the above-mentioned ducts 63, 73, 82
As shown by arrow F in FIG. 13, the air circulation flow blown out from is in the same direction and along the partition walls 52 to 55 that partition each chamber, that is, the short sides are forward and backward. An air circulation flow is formed in a direction orthogonal to the transport direction of the sub-substrate 6 transported in the facing direction (the direction indicated by the arrow R in the drawing). Accordingly, the partition walls 52 to 55 have openings 52a to 55, respectively.
Despite the formation of a, the temperatures of adjacent chambers hardly affect each other, and each chamber divided into small compartments is independently temperature-controlled strictly. be able to. Moreover, since the air circulation flow is directed in the direction orthogonal to the carrying direction of the sub-board 6 and along the plate surface of the sub-board 6, the air-circulation flow flows in the short side direction of the sub-board 6. Therefore, the distance between the upstream side and the downstream side is considerably reduced. As a result, due to the circulating air flow, the sub-board 6
There is substantially no temperature gradient in itself, and since the sub-board 6 exerts a rectifying function, there is no fear of turbulence or the like in the chamber.

As described above, the internal temperature of each chamber, particularly the first and second test chambers C2 and C4, can be strictly controlled and, in addition, as many devices D as possible can be mounted in a considerably wide range. Sub substrate 6 having an area
Even by itself, by setting a state in which there is substantially no temperature gradient, all devices D can be subjected to an energization test under substantially the same temperature condition, so that the test / measurement accuracy is significantly improved.

In the above-mentioned embodiment, the test path is provided with two test measuring sections, but it is necessary to carry out the device energization test and to carry the sub-board. If there is a larger difference from the time, it is also possible to provide three or more test measurement units and provide a standby unit between each test measurement unit. However, when three test measuring parts are provided, three feeding means are also required, and during the energization test,
These feeding means are operated for 5 cycles. Further, the standby section is formed between the adjacent test and measurement sections. For example, the upstream test and measurement section tests and measures some devices, and the downstream test and measurement section tests other devices. -When performing measurements or conducting some kind of energization test in the upstream side test measurement section, and when conducting a different type of energization test in the downstream side test measurement section, the standby section is not always necessary. There is no need to provide it.

[0039]

As described above, according to the present invention, a plurality of test measuring sections are formed at least between the loader section and the unloader section, and the sub-substrate transfer openings are formed between these sections. Each of the chambers is defined by partition walls, and the air circulation flow is made to flow through each of the chambers in the direction along the partition walls. When testing and measuring the electrical characteristics of a large number of IC devices mounted on the sub-board while maintaining the same, strictly control all IC devices so that they are in a substantially constant temperature state. Therefore, various effects such as a high temperature test and a low temperature test of the IC device can be performed extremely accurately are exhibited.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an IC device testing apparatus showing an embodiment of the present invention.

FIG. 2 is an external view of a sub-board and an IC device.

FIG. 3 is an explanatory diagram of a configuration of a sub-substrate carrying unit.

FIG. 4 is a sectional view taken along line XX of FIG.

FIG. 5 is a plan view showing a configuration of a transport unit and a drive mechanism thereof.

FIG. 6 is a configuration explanatory view of a conveying unit showing an operating state different from that of FIG.

FIG. 7 is an explanatory diagram of a configuration of a sub-board raising / lowering unit in the test measurement unit.

FIG. 8 is an explanatory diagram of the configuration of a constant temperature heat treatment chamber.

9 is a sectional view taken along line YY of FIG.

FIG. 10 is an explanatory diagram of a configuration of a refrigerant supply pipe.

FIG. 11 is an explanatory diagram of a configuration of a first test chamber.

FIG. 12 is an explanatory diagram of a structure of a room temperature heat treatment chamber.

FIG. 13 is an explanatory diagram showing an air circulation flow in each chamber.

[Explanation of symbols]

 1 loader part 1a load position 1b constant temperature heat treatment part 2 upstream test measurement part 3 standby part 4 downstream test measurement part 5 unloader part 5a unload position 5b normal temperature heat treatment part 7, 8 test head 6 sub-board 10 constant temperature chamber 11 1st sending means 12 2nd sending means 52-55 Partition wall 52a-55a Opening 60,70,80 Heater 61,71. Refrigerant supply pipe 62, 72, 81 Fan 63, 73, 82 Duct C1 Constant temperature heat treatment chamber C2 First test chamber C3 Standby chamber C4 Second test chamber C5 Normal temperature heat treatment chamber D IC device

Claims (2)

[Claims] 1. A sub-board on which a large number of sockets for mounting IC devices are arranged is taken out from the loader section one by one and horizontally transferred while being heat-treated under a predetermined temperature condition. In a constant temperature test apparatus for an IC device, which is connected to each of the test heads provided in a plurality of test measuring units provided to test and measure its electrical characteristics, and then discharged to the unloader unit. Between each part, a chamber defined by a partition having an opening for transferring the sub-substrate is formed,
A constant temperature test apparatus for an IC device, characterized in that an air circulating flow is circulated in each of these chambers in a direction along the partition wall. 2. A constant temperature region, in which a plurality of the sub-boards are arranged in the vertical direction, is formed in the loader section, and the constant temperature region is divided into a plurality of stages and the temperature conditions are changed respectively. The IC device testing apparatus according to claim 1, wherein the test device is configured to pass the modified air.