JPH06211320A - Wafer carrying-in and out device - Google Patents

Abstract

PURPOSE:To carry in and out a wafer against a deformed carrier case or a carrier case set slipped out of a normal setting position by detecting a deformation amount and positional slippage of the carrier case and adjusting a retractable/extensible angle of a wafer carrier arm. CONSTITUTION:A wafer carrying-in and-out device is constituted of a carrier case elevation means 10 furnished with a carrier table 13, a wafer carrier arm 20 to carry in and out a wafer 100 against a carrier case 51 on the carrier table 13 and a driving part 30 to drive them. Carrier case information of a deformation amount, positional slippage and others of the carrier case 51 acquired by a carrier case detection means 70 and wafer information concerning existence of the wafer 100 acquired by a wafer detection means 80 are received by a control means 90, and a retractable/extensible angle of the wafer carrier arm 20 against the carrier case 51 is indicated to an angle variable driving part 41. Consequently, in accordance with inclination of a wafer storage groove of the carrier case 51, the wafer carrier arm 20 is retracted and extended.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer carry-in / carry-out device for carrying out a wafer stored in a carrier case or carrying a wafer into a carrier case in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art An example of a normal wafer loading / unloading device will be described with reference to FIG. As shown in the figure, the wafer loading / unloading device 200 includes a carrier case lifting / lowering means 210, a wafer loading / unloading means 220, and a control means 230 for controlling them. The carrier case elevating means 210 includes a carrier table 211 on which the carrier case 51 is placed, an elevating shaft 212 for elevating the carrier table 211, and an elevating shaft 2.
It is composed of a drive unit 213 for raising and lowering 12. The carrier case lifting means 210 is provided with a sensor 240 for detecting the position of the wafer storage groove 52 of the carrier case 51 placed on the carrier table 211. Further, a sensor 241 for detecting whether or not the wafer 100 is present is provided in the wafer storage groove 52 of the carrier case 51. The wafer carry-in / out means 220 carries out the wafer 100 stored in the carrier case 51 or carries the wafer 100 into the carrier case 51.
And an arm drive unit 222 that reciprocates the wafer transfer arm 221 in the wafer loading / unloading direction of the carrier case 51. The control means 230 includes sensors 240 and 241.
Based on the information obtained by the above, the carrier case elevating means 210, the wafer loading / unloading means 220, etc. are connected so as to be controlled.

In order to carry out or carry in the wafer 100 to or from the carrier case 51 by the wafer carry-in / carry-out device 200, the carrier case 211 is stepped up or down while the sensor 240 is used to detect the carrier case 51.
The position of the wafer storage groove 52 is detected. Also the sensor 24
1, whether or not the wafer 100 exists at that position is detected. Then, the carrier base 211 is stopped at a predetermined position based on the information obtained by the sensors 240 and 241. After that, the wafer transfer arm 221 is inserted into the carrier case 51, and the wafer 100 stored in the carrier case 51 is unloaded. Alternatively, the wafer 100 is loaded into the carrier case 51.

When the sensor 240 is not installed, information on the pitch of the wafer storage groove 52 is stored in advance in a storage means (not shown). Then, based on the stored information on the pitch of the wafer storage groove 52, the carrier table 211 is moved up and down and stopped at a predetermined position. Thereafter, the wafer transfer arm 221 is inserted into the carrier case 51, and the wafer 100 stored in the carrier case 51 is inserted.
Carry out. Alternatively, the wafer 100 is placed in the carrier case 51.
Bring in.

[0005]

However, when the carrier case is used for a long period of time, the wafers to be housed and the carrier case rub against each other, and the wafer housing groove of the carrier case is at a position different from the normal position. Is formed. When the wafer is stored in the wafer storage groove in such a state, the wafer is stored in a tilted state. Further, when the carrier case and the carrier table on which it is placed rub against each other and the positioning portion of the carrier case is scraped, the carrier case cannot be installed in a normal position of the carrier table. Further, when the carrier case is deformed by heat or chemicals, the position of the wafer storage groove is also displaced from the normal position. Therefore, the wafer is stored in an inclined state with respect to the normal storage position.

If the carrier case is deformed due to the above-mentioned causes or is not placed in a normal position on the carrier base,
When a wafer is loaded by the wafer transfer arm or a wafer stored in the carrier case in the above state is unloaded by the wafer transfer arm, the transfer arm contacts the wafer to be transferred or a wafer adjacent to the wafer. .
Therefore, the contacted wafer is damaged. Further, the wafer to be transferred is caught in the carrier case, and the wafer cannot be transferred. Further, the wafer and the carrier case rub against each other. Therefore, foreign matter is generated and the cleanliness of the wafer is reduced.

Further, even in a device in which a sensor detects a wafer storage groove of a carrier case and raises and lowers a carrier table based on the position, the amount of deformation of the carrier case and the carrier case If the amount of displacement of the installation position exceeds the permissible value, the wafer transfer arm cannot support the loading and unloading of wafers.

Further, in the future, since the diameter of the wafer will be further increased than the present, the carrier case for accommodating the wafer will also be large. For this reason, the amount of deformation of the carrier case also becomes very large, and the above-mentioned problems become more serious.

An object of the present invention is to provide a wafer carry-in / carry-out device for facilitating the transfer of a wafer to / from the carrier case in response to the deformation of the carrier case and the displacement of the carrier case installation position.

[0010]

The present invention is a wafer carry-in / carry-out device made to achieve the above object. That is, the first wafer loading / unloading device includes a carrier case elevating means having a carrier table that can be raised and lowered, a wafer transfer arm for loading and unloading a wafer to and from the carrier case on the carrier table, and a wafer transfer arm. And a driving unit for driving. Moreover, the carrier case detecting means for detecting the position of the carrier case placed on the carrier table or the deformation amount thereof, the wafer detecting means for detecting the wafer in the carrier case, and the changing angle of the wafer transfer arm with respect to the carrier case In addition, the angle variable drive unit provided between the drive unit and the wafer transfer arm, the carrier case information obtained by the carrier case detection unit and the wafer information obtained by the wafer detection unit are received to change the angle. The control means for instructing the drive unit is provided.

For example, the drive unit reciprocates the wafer transfer arm in the carrier case direction, and the angle variable drive unit rotates the wafer transfer arm in the reciprocating direction.

As the second wafer unloading / carrying-in device, in the first wafer unloading / carrying-in device, the drive means is configured to reciprocate the reciprocating arm of the wafer transfer arm system. Further, the wafer transfer arm system is rotatably connected to the reciprocating arm, an intermediate arm rotatably connected to the reciprocating arm, a first rotation drive unit for rotating the intermediate arm, and rotatably connected to the intermediate arm. It is composed of a wafer transfer arm and a second rotation drive unit for rotating the wafer transfer arm. Further, the control means receives the carrier case information obtained from the carrier case detection means and the wafer information obtained from the wafer detection means and instructs the first and second rotation drive sections. Other components are the same as those of the wafer loading / unloading device described above.

Alternatively, the third wafer loading / unloading device comprises a wafer transfer arm system composed of a plurality of arms rotatably connected to the carrier case elevating means and a drive means for rotating the wafer transfer arm system. Of the respective arms, the arm on which the wafer mounting portion is formed is provided with a rotation drive portion for rotating the wafer mounting portion around the arm axis.

In each of the wafer unloading / carrying-in devices, the wafer detecting means is a sensor for detecting the deformation of the carrier case placed on the carrier table in at least one direction or a plurality of sensors for detecting the deformation in two or more directions. It is composed of a sensor.

Further, in the above-described wafer carry-in / carry-out device, a wafer suction means is provided on the wafer transfer arm or the wafer mounting portion.

[0016]

In the wafer carry-in / carry-out device having the above structure, the carrier case information such as the deformation amount and the positional deviation of the carrier case obtained by the carrier case detecting means and the wafer information concerning the presence or absence of the wafer obtained by the wafer detecting means are controlled by the control means. By instructing the variable angle drive unit of the angle for inserting and removing the wafer transfer arm with respect to the carrier case, the wafer transfer arm does not come into contact with wafers other than the wafer to be loaded and unloaded.

In the above-mentioned wafer loading / unloading device, the wafer transfer arm is rotated about its reciprocating direction by the variable angle drive unit, so that the wafer transfer arm is inserted / removed in accordance with the inclination of the wafer storage groove of the carrier case. To be done. For this reason, the wafer transfer arm does not come into contact with other wafers to damage them.

Further, a reciprocating arm that reciprocates by a drive unit, an intermediate arm rotatably connected to the reciprocating arm, a first rotation drive unit that rotates the intermediate arm, and a rotation with respect to the intermediate arm. With a wafer transfer arm that is freely connected and a second rotation drive unit that rotates the wafer transfer arm, the wafer transfer arm is pulled out from the carrier case at a two-dimensional or three-dimensional insertion / removal angle. be able to. For this reason, even if the carrier case is deformed in various states, the wafer transfer arm is inserted / removed along the inclination of the stored wafer corresponding to the state. Therefore, the wafer transfer arm does not come into contact with other wafers to damage them.

Further, in a wafer transfer arm system including a plurality of arms rotatably connected to each other, an arm provided with a wafer mounting part may be provided with a rotation drive part for rotating the wafer mounting part. The same action as above can be obtained.

In the above-described wafer loading / unloading apparatus, the wafer detecting means is a sensor for detecting deformation of the carrier case placed on the carrier table in at least one direction or a plurality of sensors for detecting deformation in two or more directions. With this configuration, the deformation and position shift of the carrier case can be accurately grasped.

By providing the wafer suction means on the wafer transfer arm or the wafer mounting portion, the wafer does not slip off from the wafer transfer arm even if a large-sized wafer is inserted and removed in a tilted state.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to the perspective view of FIG. As shown in the figure, the wafer loading / unloading device 1
Is the carrier case lifting means 10 and the wafer transfer arm 2.
1 and a driving unit 30 that drives the driving unit 1.
The carrier case lifting / lowering means 10 includes a lifting / lowering drive unit 11.
And a lifting shaft 12 that is lifted and lowered by the lifting drive unit 11.
And a carrier table 13 installed on the upper end thereof.

The wafer transfer arm 20 is connected to the drive shaft 31 of the drive unit 30 via the variable angle drive unit 41. The drive unit 30 reciprocates the wafer transfer arm 20 in the wafer loading / unloading direction of the carrier case 51 together with the angle variable drive unit 41. The variable angle drive unit 41 rotates the wafer transfer arm 20 around the reciprocating direction of the wafer transfer arm 20, and has a function of changing the insertion / removal angle of the wafer transfer arm 20 in the arrow A direction. Is. Further, the variable angle drive unit 41 is installed on a movable base 61 which is movable in the inserting / removing direction of the wafer transfer arm 20. The movable base 61 is, for example, in a state of being slidable in the direction of arrow a, while the rail 6
It is provided on 2.

Further, on the side opposite to the wafer transfer arm 20 side with respect to the carrier table 13, in the vicinity of the wafer accommodating grooves 52, 53 on the opening side of the carrier case 51 mounted on the carrier table 13, Carrier case detection means 70 including sensors 71 and 72 is provided. These sensors 71, 72 are provided at positions that do not affect the vertical movement of the carrier table 13. The carrier case detecting means 70 detects the amount of deformation of the carrier case 51 placed on the carrier table 13 or the amount of displacement of the installation position of the carrier case 51. Furthermore, the sensor 71,
Wafer detection means 80 is provided at a predetermined position between 72 and at a position that does not affect the vertical movement of the carrier table 13. The wafer detecting means 80 detects the presence / absence of the wafer 100 stored in the carrier case 51 on the carrier table 13.

Carrier case information S-C such as the amount of deformation of the carrier case 51 (or the amount of displacement of the installation position of the carrier case 51) obtained by the sensors 71 and 72 of the carrier case detector 70, and the wafer detector 80. A control unit 90 for instructing the drive of the carrier case elevating unit 10 and the wafer transfer arm 20 is provided based on the wafer storage information S-U or the like regarding the presence or absence of the wafer 100 in each of the wafer storage grooves 52 and 53 transmitted from Has been.

That is, the control means 90 receives, for example, the carrier case information S-C and the wafer storage information S-U, and calculates the deformation amount (or the positional deviation amount) of the carrier case 51. Based on this calculation result, the angle for inserting and removing the wafer transfer arm 20 with respect to the carrier case 51 is set. Further, the position information SP of the carrier table 13 is received from the carrier case elevating means 10 to grasp the position of the carrier table 13 at the present time, for example. Further, by receiving the wafer storage information S-U, for example, the storage status of the wafer 100 in the carrier case 51 at present is grasped.
Based on the position information SP of the carrier table 13 and the wafer storage information S-U, it is determined whether or not the wafer 100 is transferred by the wafer transfer arm 20. Further, a command to move the carrier table 13 based on the wafer storage information S-U is transmitted to the carrier case lifting means 10. The control means 90 is a controller (not shown) divided for each control function.
And an integrated controller (not shown) that controls each of the divided controllers. As described above, the wafer carry-in / carry-out device 1 is configured.

Next, the operation of the wafer carry-in / carry-out device 1 having the above structure will be described with reference to FIGS. First, when carrying out the wafer 100 stored in the carrier case 51,
This will be described with reference to FIG. First, the carrier case detection means 70
Then, the positions of the wafer storage grooves 52 and 53 formed on both sides of the carrier case 51 placed on the carrier table 13 are confirmed. Next, the control means 90 determines whether or not the positions of the opposed wafer storage grooves 52, 53 are in the normal position. When the positions of the wafer storage grooves 52 and 53 are in the normal positions, the control means 90 determines the insertion / removal angle of the wafer transfer arm 20 at the normal position.

On the other hand, when the positions of the wafer storage grooves 52 and 53 are not in the normal positions, the position of the one wafer storage groove 52 is read by the one sensor 71 and the position of the carrier table 13 at that time is controlled by the control means 90. Send to. Then, the carrier case elevating means 10 raises or lowers the carrier table 13 to a position where the other sensor 72 can read the position of the wafer storage groove 53 facing the wafer storage groove 52. Then, the position of the wafer storage groove 53 is read by the other sensor 72, and the carrier table 1 at that time is read.
The position 3 is transmitted to the control means 90. Then, the control unit 90 calculates the deformation amount of the carrier case 51 based on the transmitted carrier case information S-C. That is, the inclination of the wafer storage grooves 52, 53 is calculated from the width between the wafer storage grooves 52, 53 and the ascending / descending distance of the carrier table 13.
Based on the result of this calculation, the insertion / removal angle of the wafer transfer arm 20 is determined.

Then, the control means 90 instructs the angle variable drive section 41 to specify the insertion / extraction angle of the wafer transfer arm 20,
The removal / insertion angle of the wafer transfer arm 20 is set.

Next, the carrier table 13 is raised by the carrier case lifting means 10, and then the carrier table 13 is lowered for each pitch of the wafer storage grooves 52 and 53 of the carrier case 51, for example. Then, the wafer detecting means 80
At the position where the wafer 100 is detected, the lowering of the carrier table 13 is stopped. Then, the wafer transfer arm 20 is inserted to a predetermined position in the carrier case 51, and then the carrier table 13 is slightly lowered to mount the wafer 100 on the wafer transfer arm 20. Then, with the wafer 100 placed thereon, the drive unit 30 is driven to pull the wafer transfer arm 20 out of the carrier case 51.

Further, the wafer 10 in the carrier case 51
To carry out 0, the wafer 100 may be carried out and then the wafer 100 may be carried out in the same manner as described above. By repeating the work described above, the carrier case 5
It becomes possible to carry out the wafers 100 in 1 sequentially.

Next, a case where the wafer 100 is loaded into the carrier case 51 will be described with reference to FIG. First, the carrier case raising / lowering means 10 lowers the carrier table 13 and then raises the carrier table 13 for each pitch of the wafer housing grooves of the carrier case 51, for example. Then, the wafer detecting means 80 checks whether or not the wafer 100 is stored. Then, after confirming that another wafer (not shown) is not accommodated at the position where the wafer 100 is to be accommodated, the control means 90 stops the lowering of the carrier table 13. Then, a command is issued from the control means 90, and the wafer 1
After setting the wafer transfer arm 20 on which 01 is placed at a predetermined extraction / insertion angle, the drive unit 30 is driven to insert it into the carrier case 51. Wafer 100 is wafer storage groove 5
When it reaches a predetermined position of 2, 53, the carrier table 13 is slightly raised. And the wafer storage groove 5 facing each other
The wafer 100 is placed on the wafers 2, 53, and the drive unit 30 is driven to store the wafer 100 in the carrier case 51.

Further, in order to carry out another wafer (not shown) into the carrier case 51, the inserted wafer carrying arm 20 is pulled out of the carrier case 51. Then, in the same manner as described above, the wafer is stored in the carrier case 51. By repeating the above-described operation, the wafer can be loaded and stored in all of the wafer storage grooves of the carrier case 51.

As described above, the carrier case information S-, such as the amount of deformation of the carrier case 51 obtained by the carrier case detecting means 70 and the amount of displacement with respect to the carrier base 13, is obtained.
Based on C, it is possible to change the insertion / extraction angle of the wafer transfer arm 20 by the angle variable drive unit 41, so that the wafer transfer arm 20 is adjacent to the wafer 100 to be carried in and out (not shown). Contact).

In the wafer loading / unloading device 1 described above,
The carrier case detecting means 70 detects the deformation amount of the carrier case 51 in one direction.
Is not limited to one direction. For example, carrier case 51
There are also two-direction deformations or three-direction deformations that are different from each other at right angles. In order to deal with such deformation of the carrier case 51, the deformation amount of the carrier case 51 can be detected more accurately by installing the carrier case detection means 70 as described in the first embodiment at a plurality of locations, for example. It becomes possible to do. At that time, the carrier case detecting means 7 is preferentially applied to the direction in which the carrier case 51 is likely to be deformed.
It is effective to set 0.

Next, a case where the deformation of the carrier case 51 (including the displacement of the installation position of the carrier case 51) is measured from, for example, three directions will be described with reference to FIG. Hereinafter, the deformation of the carrier case 51 also includes a displacement of the installation position of the carrier case. As shown in the figure, to detect how much the carrier case 51 is deformed,
For example, as with the first embodiment, the sensor (71),
A carrier case detecting means 70 constituted by (72) is provided. At the same time, carrier case detection means 73 is provided on the upper side surface of the carrier case 51. The carrier case detecting means 73 is composed of sensors 74 and 75. Further, a carrier case detecting means 76 is provided on the upper surface side portion of the carrier case 51. The carrier case detecting means 76 is composed of sensors 77 and 78.

Since the method of detecting the deformation amount of the carrier case 51 by the carrier case detecting means 70 has been described above, the method of detecting the deformation amount by the carrier case detecting means 73 will be described here with reference to FIG. As shown in the figure, the sensor 74 measures the distance D1 from the reference position B1 to the edge 54 of the carrier case 51. A sensor 75 provided at a position separated from the sensor 74 by a certain distance (for example, a distance W) measures the distance D2 from the reference position B2 to the edge 55 of the carrier case 51. At this time, the positions of the reference positions B1 and B2 are set to have the same height, for example. And carrier case 5
The deformation amount M of 1 is determined by the difference ΔD = D1-D2 between the values measured by the sensors 74 and 75 and the distance W. That is, M = ΔD / W.

Regarding the carrier case detecting means 76,
In the same manner as described above, the deformation amount of the carrier case 51 (or the installation position shift amount of the carrier case 51) can be calculated.

As described above, the amount of deformation of the carrier case 51 is measured not only in one direction but also in two or more directions (including the amount of displacement of the installation position of the carrier case 51). Deformation, displacement, etc. can be accurately detected.

For example, in the wafer carry-in / carry-out device provided with the carrier case detecting means 76, a driving means for moving the wafer carrying arm two-dimensionally or three-dimensionally in response to the deformation of the carrier case 51 is required. Therefore, as a second embodiment, a wafer carry-in / carry-out device provided with the above-mentioned driving means will be described with reference to the perspective view of FIG.

As shown in the figure, the wafer loading / unloading device 2
Is composed of a carrier case elevating means 10, a wafer transfer arm system 21, and a driving means 32 for driving the same. The carrier case lifting / lowering means 10 has the same structure as that described in the first embodiment, and includes a lifting / lowering drive unit 11, a lifting / lowering shaft 12 lifted and lowered by the lifting / lowering drive unit 11, and an upper end thereof. It consists of a carrier table 13 installed.

The drive means 32 is configured to reciprocate the wafer transfer arm system 21. The wafer transfer arm system 21 includes a reciprocating arm 22 connected to the driving means 32, an intermediate arm 23 rotatably connected thereto, and a wafer transfer rotatably connected to the intermediate arm 23. It is composed of an arm 24. Further, the reciprocating arm 22 is provided with a first rotation drive section 42 for rotating the intermediate arm 23. Further, the intermediate arm 23 is provided with a second rotation drive section 43 for rotating the wafer transfer arm 24. Although not shown, a movable base that slidably supports the reciprocating arm 22 may be provided.

The sensors 71, 72, 77, 78 of the carrier case detecting means 70, 76 are provided at the same positions as described in the first embodiment and the same positions as described in FIG. ing. The carrier case detecting means 70 and 76 detect the amount of deformation of the carrier case 51 placed on the carrier table 13 or the amount of displacement of the installation position of the carrier case 51. Hereinafter, these pieces of information will be referred to as carrier case information SC. Further, the sensors 71, 7
Wafer detection means 80 is provided at a predetermined position between the two that does not affect the vertical movement of the carrier table 13.
The wafer detecting means 80 detects the presence / absence of the wafer 100 stored in the carrier case 51 on the carrier table 13. Hereinafter, information regarding the accommodation of the wafer 100 will be referred to as wafer accommodation information S-U.

Furthermore, the above carrier case information S-C
Control means 90 for instructing the drive of the carrier case lifting means 10 and the wafer transfer arm system 21 based on the wafer storage information S-U and the like is provided.

That is, the control means 90 receives, for example, the carrier case information S-C and the wafer storage information S-U, and calculates the deformation amount (or the positional deviation amount) of the carrier case 51. Based on the result of this calculation, the insertion / removal angle of the wafer transfer arm 24 with respect to the carrier case 51 is set. Further, the position information SP of the carrier table 13 is received from the carrier case elevating means 10 to grasp the position of the carrier table 13 at the present time, for example. Further, by receiving the wafer storage information S-U, for example, the storage status of the wafer 100 in the carrier case 51 at present is grasped.
Based on the position information SP of the carrier table 13 and the wafer storage information S-U, whether or not the wafer 100 is transferred by the wafer transfer arm 24 is determined. Further, a command to move the carrier table 13 based on the wafer storage information S-U is transmitted to the carrier case lifting means 10. The control means 90 is a controller (not shown) divided for each control function.
And an integrated controller (not shown) that controls each of the divided controllers. As described above, the wafer loading / unloading device 2 is configured.

Next, the operation of the wafer carry-in / carry-out device 2 having the above structure will be described. First, a case where the wafer 100 stored in the carrier case 51 is carried out will be described with reference to FIG. 7. First, the sensors 71, 7 of the carrier case detection means 70
2, the positions of the wafer storage grooves 52 and 53 of the carrier case 51 placed on the carrier table 13 are measured. At the same time, the other sensors 77 and 78 measure the deformed state (or misaligned state) of the carrier case 51. When the carrier case 51 is not deformed, the control means 90 determines the insertion / removal angle and the insertion / removal direction of the wafer transfer arm 24 in the normal state, and
Instruct the second rotation drive units 42 and 43.

On the other hand, when the carrier case 51 is deformed, the control means 90 controls the carrier case 51.
The insertion / removal angle of the wafer transfer arm 24 is determined in accordance with the amount of deformation of the wafer transfer arm 24, and the operation direction and operation speed of the wafer transfer arm system 21 are instructed to the first and second rotation drive units 42 and 43 and driven. The moving speed in the reciprocating direction is instructed to the means 32. For example, the wafer storage grooves 52 and 53 of the carrier case 51 are formed to be inclined in the angle θ direction. Further, it is assumed that the carrier case 51 is installed so as to be inclined in the angle φ direction. In such a case, for example, the insertion / extraction angle α of the wafer transfer arm 24 is adjusted to the angle θ. Further, the inserting / removing direction C of the wafer transfer arm 24 is aligned with the direction inclined by the angle φ.

Next, the carrier case lifting means 10 raises the carrier table 13 and then lowers the carrier table 13 for each pitch of the wafer housing grooves 52 and 53 of the carrier case 51. Then, the wafer detecting means 80
At the position where the wafer 100 is detected, the lowering of the carrier table 13 is stopped.

The control means 90 controls the first and second rotation drive portions 42 so that the wafer transfer arm 24 is moved in and out of the carrier case 51 in the insertion / removal direction C while maintaining the extraction / insertion angle α. , 43 and drive means 3
2 and drive.

Then, the wafer transfer arm 24 is inserted to a predetermined position in the carrier case 51, and then the carrier table 13 is slightly lowered. Then, the wafer 100 is placed on the wafer transfer arm 24. And wafer 1
The wafer transfer arm 24 is pulled out to the outside of the carrier case 51 in a state where 00 is placed.

In order to carry out another wafer (not shown) in the carrier case 51, the wafer 100 is carried out and then the wafer is carried out in the same manner as described above. By repeating the work described above, the carrier case 51
It becomes possible to carry out all the wafers therein.

Next, the case of loading a wafer into the carrier case 51 will be described with reference to FIG. First, the carrier case 13 is lowered by the carrier case lifting means 10,
For example, the carrier table 13 is raised for each pitch of the wafer storage grooves of the carrier case 51. Then, the wafer detecting means 80 checks whether or not the wafer 100 is stored.
Then, the wafer 1 is placed at the position where the wafer 101 is to be stored.
After confirming that 00 is not stored, the lowering of the carrier table 13 is stopped. Then, in response to a command from the control means 90, the first and second rotation drive units 41 and 42 are driven,
The wafer transfer arm 24 on which the wafer 101 is placed is set to a predetermined insertion / removal angle α and a predetermined insertion / removal direction C. After that, the wafer transfer arm 24 is inserted into the carrier case 51 together with the wafer 100 by the drive unit 32 and the rotation drive unit 41. When the wafer 101 has reached the predetermined position in the wafer storage grooves 52, 53, the carrier base 1
Increase 3 slightly. And the wafer storage grooves 52, 5
The wafer 101 is placed on the wafer 3, and the wafer 101 is housed in the carrier case 51. After that, the inserted wafer transfer arm 24 is pulled out of the carrier case 51.

Further, in order to carry out another wafer (not shown) in the carrier case 51, the wafer may be housed in the carrier case 51 in the same manner as described above. By repeating the above-described operation, the wafer can be loaded and stored in all of the wafer storage grooves of the carrier case 51.

As described above, based on the carrier case information S-C such as the deformation amount of the carrier case 51 obtained by the carrier case detection means 70, 76 and the positional shift amount with respect to the carrier base 13, the wafer transfer arm 24 is detected. Since the removal / insertion angle can be changed by the first and second rotation drive units 42 and 43, the wafer transfer arm 2
4 does not come into contact with wafers other than the wafer 100 to be carried in and out.

Next, as a third embodiment, the case of a wafer carry-in / carry-out device for carrying a wafer only by the rotational movement of the arm will be described with reference to the perspective view of FIG. As shown in the figure,
The wafer carry-in / carry-out device 3 includes carrier case lifting means 10
Wafer transfer arm system 25 and drive means 3 for driving it
It is composed of 3 and 3. This wafer carry-in / carry-out device 3
Is the same as the wafer transfer arm system (21) of the wafer carry-in / carry-out device (2) described above except for the driving means (32), and therefore the description thereof will be omitted. Here, the wafer transfer arm system 25 will be described. The driving means 33 will be described. The symbols and names of the main components are shown in the figure.

The wafer transfer arm system 25 includes a plurality of arms, for example, first and second rotatably connected to each other.
It is composed of a so-called multi-joint arm composed of the arms 26 and 27. The drive means 33 is configured to rotate the first and second arms 26 and 27 in, for example, arrow D and E directions. A rotation drive unit 44 is provided on the tip end side of the second arm 27, and the wafer mounting unit 28 is provided in the rotation drive unit 44 in a rotatable state. As described above, the wafer loading / unloading device 3
Is configured.

Next, the operation of the wafer transfer arm system 25 of the wafer carry-in / carry-out device 3 having the above structure will be described. First, a case where the wafer 100 stored in the carrier case 51 is carried out will be described with reference to FIG. First, in the same manner as described in the second embodiment, the carrier case detection means 70
Then, the positions of the wafer storage grooves 52 and 53 of the carrier case 51 placed on the carrier stand 13 are measured. At the same time, the other sensors 77 and 78 measure the deformed state (or misaligned state) of the carrier case 51. If the carrier case 51 is not deformed,
Wafer transfer arm system 2 in normal state by control means 90
The insertion / removal angle and the insertion / removal direction of 5 are determined, and the drive means 33 and the rotation drive unit 44 are instructed.

On the other hand, when the carrier case 51 is deformed, the carrier case 51 is controlled by the control means 90.
The insertion / removal angle α of the rotation drive unit 44 is determined in accordance with the deformation amount of, and the drive means 33 is instructed about the rotation direction and rotation speed of the wafer transfer arm system 25. For example, the opposing wafer storage grooves 52 and 53 of the carrier case 51 are formed to be inclined in the angle θ direction. Further carrier case 51
Is installed at an angle of φ. In such a case, the removal / insertion angle α of the wafer transfer arm system 25 is adjusted to the angle θ. Further, the inserting / removing direction C of the wafer mounting portion 28 is aligned with the direction inclined by the angle φ.

Then, in the same manner as described in the second embodiment, the carrier table 13 is lifted by the carrier case lifting means 10, and then the carrier table 13 is lifted for each pitch of the wafer receiving grooves 52 and 53, for example. Lower 13 Then, the wafer 100 is detected by the wafer detecting means 80.
The descent of the carrier base 13 is stopped at the position where is detected.

Then, with the insertion / removal angle α and the insertion / removal direction C maintained, the center of the wafer (not shown) mounted on the wafer mounting portion 28 is moved in and out of the carrier case 51 in the insertion / removal direction C. First, the first and second arms 26, 27 are driven by the drive means 33. Then, the wafer mounting portion 28 is inserted to a predetermined position in the carrier case 51, and then the carrier table 13 is slightly lowered to mount the wafer 100 on the wafer mounting portion 28. Then, with the wafer 100 placed thereon, the wafer transfer arm system 25 is rotated to take out the wafer placing portion 28 from the carrier case 51.

In order to carry out another wafer 101 in the carrier case 51, the wafer 100 may be carried out and then the wafer 100 may be carried out in the same manner as described above.
By repeating the work described above, it becomes possible to carry out all the wafers 100 in the carrier case 51.

Next, the case of loading a wafer into the carrier case 51 will be described with reference to FIG. First, in the same manner as described above, the wafer mounting portion 2 of the wafer transfer arm system 25.
The removal / insertion angle α of 8 is adjusted to the angle θ by the rotation drive unit 44, and the removal / insertion direction C of the wafer mounting unit 28 is adjusted to the direction tilted by the angle φ.

Then, the carrier table 13 is lowered by the carrier case elevating means 10 and then the carrier table 1 is set at each pitch of the wafer storage grooves of the carrier case 51, for example.
Raise 3 Then, the wafer detecting means 80 checks whether or not the wafer is accommodated, and then confirms that the wafer is not accommodated at the position where the wafer 100 is to be accommodated, and then the carrier stand 13 is instructed by the control means 90. Stop descent.

Then, the drive means 33 is driven by the command of the control means 90. At this time, the wafer mounting portion 28 is kept in the state where the removal / insertion angle α is maintained, and the center of the wafer 101 mounted on the wafer mounting portion 28 is at the carrier case 5.
The driving means 33 causes the first and second arms 2 to move in and out of the first arm 2 along the insertion / removal direction c.
6, 27 are driven. Then, the wafer 101 placed on the wafer placing portion 28 is inserted into the wafer storage grooves 52 and 53 of the carrier case 51. After the wafer 101 reaches the predetermined position in the wafer storage grooves 52, 53, the carrier table 13 is slightly raised. Then, the wafer 101 is placed in the opposing wafer storage grooves 52 and 53, and the wafer 101
Are stored in the carrier case 51. After that, the wafer transfer arm system 25 including the wafer mounting portion 28 is pulled out from the carrier case 51.

In order to carry another wafer (not shown) into the carrier case 51, the wafer may be carried in in the same manner as described above. By repeating the above-described operation, the wafer can be loaded and stored in all the wafer storage grooves of the carrier case 51.

As described above, the carrier case information S-, such as the amount of deformation of the carrier case 51 obtained by the carrier case detecting means 70 and the amount of displacement with respect to the carrier table 13, is obtained.
Based on C, it is possible to change the inserting / removing direction of the wafer transfer arm system 25 by the drive means 34 and change the removing / inserting angle by the rotation drive section 44. It does not come into contact with another wafer other than the intended wafer 100.

The wafer carry-in / carry-out devices 1 to 3 described above
In the above, it is possible to provide a wafer suction means on the wafer transfer arm 20 or the wafer mounting portion 28. Figure 1
As shown in FIG. 2, the wafer suction means 110 includes a plurality of exhaust passages 1 for evacuation inside the wafer transfer arm 20.
11 to form a wafer (not shown) from each exhaust path 111.
A plurality of holes 112 for evacuation are formed toward the surface on which is placed. A pump (not shown) for vacuuming is connected to one end of each of the exhaust passages 111. Although not shown, the wafer mounting portion (2) described in the third embodiment is also used.
It is possible to form the similar wafer suction means 110 also in 8).

When a wafer (not shown) is placed on the wafer transfer arm 20 (or the wafer transfer arm 24 or the wafer mounting portion 28) having the above-described structure, the wafer is immediately transferred to the wafer transfer arm by vacuuming. 20 (or the wafer transfer arm 24 or the wafer mounting portion 28). By sucking the wafer in this way, even if the wafer is transferred in an obliquely inclined state, the wafer does not slip off from the wafer transfer arm 20 (or the wafer transfer arm 24 or the wafer mounting portion 28). Therefore, it becomes possible to enhance the safety during the transfer of the wafer. Therefore,
Large wafers can be easily transported without slipping.

[0069]

As described above, according to the present invention,
Since the insertion / removal angle and the rotation angle of the wafer transfer arm or the wafer transfer arm system with respect to the carrier case are determined based on the carrier case information, the wafer transfer arm or the wafer transfer arm system contacts the wafer other than the wafer to be loaded / unloaded. There is nothing to do. Therefore, the damage of the wafer by the wafer transfer arm or the wafer transfer arm system is reduced, so that the yield can be improved.

Since the carrier case detecting means is composed of a sensor for detecting deformation of the carrier case placed on the carrier table in at least one direction or a plurality of sensors for detecting deformation in two or more directions, It is possible to accurately grasp the deformation and displacement of the carrier case. Therefore, the wafer is less likely to come into contact with the carrier case when the wafer is carried in and out, so that the wafer is not damaged or dust is not attached to the wafer.

Further, in the case where the wafer transfer arm or the wafer mounting portion is provided with the wafer suction means, the wafer does not slip off from the wafer transfer arm or the wafer mounting portion even if a large-sized wafer is inserted and removed in a tilted state. . Therefore, the wafer can be stably transported.

[Brief description of drawings]

FIG. 1 is a perspective view of a wafer loading / unloading device according to a first embodiment.

FIG. 2 is an operation explanatory diagram when a wafer is unloaded in the first embodiment.

FIG. 3 is an operation explanatory diagram when a wafer is loaded in the first embodiment.

FIG. 4 is an explanatory diagram of an installation position of carrier case detection means.

FIG. 5 is a diagram illustrating a method of measuring a deformation amount of a carrier case.

FIG. 6 is a perspective view of a wafer loading / unloading device according to a second embodiment.

FIG. 7 is an operation explanatory diagram when a wafer is unloaded in the second embodiment.

FIG. 8 is an operation explanatory diagram when a wafer is loaded in the second embodiment.

FIG. 9 is a perspective view of a wafer loading / unloading device according to a third embodiment.

FIG. 10 is an operation explanatory diagram when a wafer is unloaded in the third embodiment.

FIG. 11 is an operation explanatory view when a wafer is loaded in the third embodiment.

FIG. 12 is an explanatory diagram of a vacuum suction means.

FIG. 13 is a perspective view of a conventional wafer loading / unloading device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Wafer carry-in / carry-out device 2 Wafer carry-in / carry-out device 3 Wafer carry-in / carry-out device 10 Carrier case lifting means 13 Carrier table 20 Wafer transfer arm 21 Wafer transfer arm system 22 Reciprocating arm 23 Intermediate arm 24 Wafer transfer arm 25 Wafer transfer arm system 26th 1st arm 27 2nd arm 28 Wafer placing section 30 Driving section 32 Driving means 33 Driving means 41 Angle variable driving section 42 First rotation driving section 43 Second rotation driving section 44 Rotation driving section 51 Carrier Case 70 Carrier case detection means 71 Sensor 72 Sensor 74 Sensor 75 Sensor 76 Carrier case detection means 77 Sensor 78 Sensor 80 Wafer detection means 90 Control means 100 Wafer 110 Wafer suction means S-C Carrier case information S-U Wafer information

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[Procedure amendment]

[Submission date] January 19, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 5

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 6

[Correction method] Change

[Correction content]

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 7

[Correction method] Change

[Correction content]

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/68 L 8418-4M

Claims (7)

[Claims] 1. A carrier case elevating means having a vertically movable carrier stand; a wafer transfer arm for carrying out a wafer in the carrier case placed on the carrier stand or for carrying a wafer into the carrier case; A wafer carrying-in / carrying-out device comprising a driving unit for driving a wafer carrying arm, and carrier case detection means for detecting one or both of a deformation amount of the carrier case itself and a positional shift amount of the carrier case with respect to the carrier table. A wafer detecting means for detecting the presence / absence of a wafer in a carrier case placed on the carrier table, and a means for changing the inserting / removing angle of the wafer transfer arm with respect to the carrier case, between the drive section and the wafer transfer arm. The angle variable drive unit provided and the carrier obtained from the carrier case detection means. A wafer carry-in / carry-out device, characterized in that the angle variable drive section is provided with control means for receiving rear case information and wafer information obtained from the wafer detection means and for instructing a rotation angle of the wafer transfer arm. . 2. The wafer loading / unloading device according to claim 1, wherein the drive unit reciprocates the wafer transfer arm in a carrier case direction, and the angle variable drive unit reciprocates the wafer transfer arm. A wafer carry-in / carry-out device comprising a device for rotating the wafer transfer arm around the direction. 3. A carrier case elevating means having a carrier table that can be raised and lowered, and a wafer transfer arm system for unloading a wafer in the carrier case placed on the carrier table or for loading a wafer into the carrier case. A wafer carrying-in / carrying-out device including a driving means for driving the wafer carrying arm system, wherein carrier case detection for detecting one or both of a deformation amount of the carrier case itself and a positional shift amount of the carrier case with respect to the carrier table. Means and a wafer detection means for detecting the presence / absence of a wafer in a carrier case placed on the carrier table, and the drive means are configured to enable the wafer transfer arm system to reciprocate. The wafer transfer arm system includes a reciprocating arm connected to the drive means and a reciprocating arm. An intermediate arm connected rotatably to the first pivoting the intermediate arm
And a second rotation drive unit for rotating the wafer transfer arm, and a wafer transfer arm rotatably connected to the intermediate arm. Control means is provided for receiving the obtained carrier case information and the wafer information obtained from the wafer detection means, and for instructing the rotation direction and the rotation angle to the first and second rotation drive portions. A wafer loading / unloading device. 4. A carrier case elevating means having an ascendable / descendable carrier base, and means for unloading a wafer in the carrier case placed on the carrier base or for loading a wafer in the carrier case are rotatable with respect to each other. A wafer transfer arm system including an arm connected to the wafer transfer mechanism, and a wafer loading / unloading device including a drive unit for rotating the wafer transfer arm system. A wafer carrying-in / carrying-out device, characterized in that a wafer placing section rotated by the rotation driving section is provided. 5. The wafer carry-in / carry-out device according to claim 1, wherein the carrier case detecting means detects a deformation of the carrier case placed on a carrier table in at least one direction. A wafer loading / unloading device. 6. The wafer unloading / carrying-in device according to claim 1, wherein said carrier case detecting means deforms a carrier case placed on a carrier table in two or more directions. A wafer loading / unloading device comprising a plurality of sensors for detecting 7. The wafer carry-in / carry-out device according to claim 1, wherein the wafer carry-in / carry-out device is provided with a wafer suction means on the wafer transfer arm or the wafer mounting portion.