JPH06320261A - Wave soldering device - Google Patents

Abstract

PURPOSE:To prevent the defective soldering by extending the solder to every part of a substance to be treated, and improving the separation of the solder from the substance to be treated without enlarging the soldering tank or the ejection port in executing the soldering by dipping the substance to be treated while being transferred in the molten solder ejecting from the ejection port provided in the solder tank. CONSTITUTION:A guide plate 4 extending along the surface of the substance A to be treated while being transferred is provided at either of or each of the positions before and after the ejection port 2 in the transferring direction of the substance A to be treated. The molten solder C ejected from the end part of the ejection port 2 is guided by the guide plate 4 so as to flow in the horizontal direction, and this constitution increases the dipping time of the substance A to be treated in the molten solder C without the ejection port 2 or increasing the flow rate, and due to the increased flow speed of the molten solder, the solder reaches every part of the substance A to be treated and the separation of the solder from the substance A to be treated is also improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit on a substrate for manufacturing an electronic component such as a network resistor in which elements such as a resistor are mounted on one or both sides of a substrate made of ceramic or the like. The present invention relates to an improvement of a jet type soldering device used for soldering an element or a lead wire or for solder plating on a printed circuit board.

[0002]

2. Description of the Related Art This jet-type soldering apparatus, as shown in FIGS. 7 and 8, supplies a molten solder C to an outlet 12 having an upward opening in a solder bath 11. While the impeller 13 is provided, above the solder bath 11,
A carrier rail 14 for mounting the lead frame B with the lead portion B1 facing downward is provided, and the electronic component A attached to the lead portion B1 of the lead frame B is ejected from the ejection port 2 during the transfer of the molten solder. It is configured to be immersed in C.

[0003]

By the way, in this jet type soldering apparatus, in order to surely perform soldering by spreading the solder to the details of the electronic component A, the immersion time of the electronic component A in the molten solder C is required. Therefore, in order to lengthen the immersion time of the electronic component A in the molten solder C, the length dimension L of the ejection port 12 must be lengthened.

However, if the length L of the jet outlet 12 is increased, the flow rate of the molten solder C is increased accordingly. Therefore, the impeller 13 for sending the molten solder C to the jet outlet 12 must be enlarged. Along with that, the solder bath 11 also becomes large, which causes a problem that the equipment cost increases. On the other hand, in the method of horizontally transferring the electronic component A, the solder tends to be excessively accumulated at the position of the upper end surface of the element A1 such as the resistor in the electronic component A. In order to prevent, in other words, to improve the sharpness of the solder from the electronic component A, FIG.
As shown in FIG. 1, the electronic component A is also transferred along a direction inclined with respect to the horizontal plane. However, in this inclined transfer method, the electronic component A cannot be sufficiently immersed in the molten solder C. There was a problem.

According to the present invention, the solder can be spread to every corner of the object to be processed without increasing the size of the device, and the sharpness of the solder from the object to be processed can be improved, so that the solder can be surely soldered. The purpose is to

[0006]

In order to achieve this object, the present invention transfers a solder bath having an ejection port for ejecting molten solder upward and a transfer means for continuously transferring an object to be processed. In a jet-type soldering device in which a workpiece to be processed is immersed in molten solder jetted from the jet outlet, in any part before or after the jet port in the transfer direction of the workpiece, or Jet-type solder, characterized in that guide plates extending along the surface of the object to be processed during transfer are provided at both front and rear parts so that one end of the guide plates is immersed in the molten solder ejected from the ejection port. It was configured to be attached.

[0007]

In this structure, when the molten solder ejected from the ejection port comes into contact with one end of the guide plate, the molten solder is guided by the guide plate to move in a substantially horizontal direction away from the ejection port. Because of the phenomenon of flow movement,
It is possible to lengthen the time during which the object to be processed comes into contact with the molten solder without changing the length dimension and flow rate of the ejection port.

Further, since a phenomenon occurs in which the molten solder is extruded along the surface of the guide plate, the flow velocity of the molten solder flowing and moving along the surface of the guide plate is merely ejected from the ejection port and naturally falls. Faster than just
As a result, the molten solder can be spread to every corner of the object to be processed, and even in the horizontal transfer method, the cracking of the solder from the object to be processed can be improved.

Therefore, according to the present invention, it is possible to extend the time during which the object to be processed comes into contact with the molten solder without changing the length dimension and flow rate of the ejection port, and the molten solder is applied to every corner of the object to be processed. Combined with the fact that it can spread the solder and break the solder from the object to be processed, it has the effect of significantly reducing the occurrence rate of defective soldering without increasing the equipment cost.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment in which the present invention is applied to soldering of electronic parts will be described with reference to the drawings (FIGS. 1 to 6). In these drawings, reference numeral 1 denotes a solder bath provided with the ejection port 2 (see FIG. 3), and reference numeral 3 denotes a fixed type transport rail for transferring the lead frame B, respectively. Electronic component A stuck to
Is immersed in the molten solder C ejected from the ejection port 2 during its transfer, thereby soldering the element A1 mounted on one surface of the substrate of the electronic component A.

A guide plate 4 extending along the surface on which the element A1 is mounted on both surfaces of the electronic component A that is in the process of being transferred is provided at a portion located in front of the ejection port 2 in the transfer direction of the electronic component A. The guide plate 4 is arranged so that its end portion is partially immersed in the molten solder C ejected from the ejection port 2, and the guide plate 4 is fixed to the side surface of the transport rail 3 with a screw 5 so that the height can be adjusted.

The guide plate 4 is located slightly above the electronic component A, and the guide plate 4 is appropriately angled in plan view so as to approach the electronic component A that is being transferred as it moves away from the ejection port 2. Are arranged so as to extend in an inclined shape. A nozzle adapted to eject an inert gas such as nitrogen gas obliquely from the upper side toward the mounting surface of the element A1 of the electronic component A at a portion in front of the guide plate 4 in the transfer direction of the electronic component A. 6 is provided.

In the above structure, the electronic component A is soldered by transferring the lead frame B while ejecting the molten solder C from the ejection port 2. In that case, as shown by an arrow D in FIG. 4, the molten solder C ejected from the rear end portion of the ejection port 2 toward the front in the transfer direction of the electronic component A is horizontally moved along the guide plate 4. Since the phenomenon of flow movement occurs, the time for the electronic component A to be immersed in the molten solder C can be lengthened without enlarging the ejection port 2 and the solder bath 1.

The reason why the molten solder C flows horizontally along the guide plate 4 is that the molten solder C is prevented from freely diffusing and the molten solder C is applied to the surface portion of the guide plate 4. It seems that the molten solder C is pushed out in the horizontal direction due to the trapped state, and the molten solder C is sandwiched between the guide plate 4 and the electronic component A. Be done.

Further, molten solder C is applied to the surface of the guide plate 4.
Due to the tendency of the molten solder C to concentrate on the surface of the guide plate 4, the flow velocity of the molten solder C when it flows and moves in the horizontal direction also increases, so that the molten solder C spreads to every corner of the electronic component A. The soldering can be made more reliable, and even in the horizontal transfer method, the same effect of breaking the solder from the electronic component A as in the inclined transfer method can be obtained, and excess solder is attached. Can be prevented.

When the guide plate 4 is arranged in a tilted state in a plan view as in the embodiment, the function of concentrating the molten solder C ejected from the ejection port 2 on the surface portion of the guide plate 4 is improved. The effect of guiding C in the horizontal direction and the effect of improving the flow velocity are further improved. When the elements A1 are mounted on both sides of the electronic component A, the guide plates 4 may be arranged on both sides of the passage of the electronic component A as shown by the alternate long and short dash line in FIG.

Further, as in the embodiment, when the nozzle 6 for ejecting an inert gas such as nitrogen gas is provided toward the surface of the electronic component A after soldering, excess solder attached to the electronic component A is removed. Because it can be forcibly removed by an inert gas,
There is an advantage that excessive soldering can be more surely prevented, and the occurrence rate of defective products can be further reduced. In this case, the inert gas ejected from the nozzle 6 is preferably maintained at a high temperature of about 100 to 200 ° C. so that the solder is not rapidly cooled.

The molten solder C ejected from the ejection port 2 may be ejected with nitrogen gas so that the soldering is carried out in an inert atmosphere.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of a first embodiment.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a plan view of an essential part of the first embodiment.

FIG. 5 is a plan view of a portion on the upstream side in the transfer direction with respect to FIG.

FIG. 6 is a front view taken along line VI-VI of FIG.

FIG. 7 is a diagram showing a conventional example.

8 is an overall view of the conventional example of FIG.

FIG. 9 is a diagram showing another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder bath 2 Jet port 3 Conveying rail 4 Guide plate 6 Nozzle A Electronic component as a processed object B Lead frame C Melted solder

Claims (1)

[Claims] 1. A solder bath provided with an ejection port for ejecting molten solder upward and a transfer means for continuously transferring an object to be processed, the object to be processed being transferred is melted out of the nozzle. In a jet-type soldering device provided so as to be immersed in solder, the object to be processed in the middle of transfer may be provided at any part before or after the ejection port in the transfer direction of the object to be processed, or at both parts. A jet type soldering device, characterized in that a guide plate extending along the surface is provided so that one end thereof is immersed in the molten solder jetted from the jet port, and jet type soldering is performed.