JPH0687470B2 - Resin encapsulation equipment for semiconductor devices - Google Patents

Description

The present invention relates to a semiconductor resin encapsulation apparatus suitable for use in a semiconductor assembly process.

[Conventional technology]

Conventionally, this type of semiconductor resin encapsulation device is constructed as shown in FIG. That is, in FIG. 2, 1 is a mold,
The mold 1 is composed of two upper and lower surface plates 2 and 3 each having a heater (not shown) built therein, and a semiconductor element (not shown) on the lead frame 4 which is held by each of the surface plates 2 and 3. It is composed of two upper and lower cavity blocks 8 and 9 having cavities 6 and 7 forming a package 5 for sealing. The numeral 10 is a pot attached to the cavity block 8 of the mold 1, and the plunger 11 for resin pressurization moves forward and backward in the mold.
Is a runner communicating with the pot 10 and the cavities 6 and 7, and 13 is a vent for discharging the air in the cavities 6 and 7. Reference numeral 14 is a synthetic resin inserted into the pot 10 by the plunger 11.

Next, a resin encapsulation method by the semiconductor resin encapsulation device configured as described above will be described.

First, the lead frame 4 to which a semiconductor element (not shown) is bonded is placed in the cavity block 8, and then both the cavity blocks 8 and 9 are clamped. Then, after the preheated synthetic resin 14 is inserted into the pot 10, the cavities 6 and 7 are pressed by pressing the plunger 11.
Fill inside. In this way a semiconductor device (not shown)
It is possible to mold the package 5 in which the resin is sealed.

[Problems to be solved by the invention]

By the way, the conventional semiconductor resin encapsulation device does not have a function of evacuating the inside of the pot 10 and the cavities 6 and 7. Therefore, when the resin is pressurized, the air inside the pot 10 and the cavities 6 and 7 is made of synthetic resin. There is a problem that it enters inside 14 to form voids (cavities) on the surface and inside of the package 5, and as a result, the strength and moisture resistance of the package 5 are adversely affected and the quality of the product deteriorates.

The present invention has been made in view of the above circumstances, and provides a semiconductor resin encapsulation device capable of molding a package having no voids inside and on the surface thereof, thereby improving the quality of products. It is a thing.

[Means for solving problems]

The semiconductor resin sealing device according to the present invention is equipped with a vacuum opening / closing pin having a vent passage communicating with the interior of the cavity and the pot so as to be capable of advancing and retracting in the cull portion of the mold.

[Action]

In the present invention, the vacuum opening / closing pin can make the inside of the pot and the cavity a vacuum state before the resin processing.

〔Example〕

FIG. 1 is a sectional view showing an embodiment of the present invention. In FIG. 1, the same members as those in FIG. 2 are designated by the same reference numerals, and detailed description thereof will be omitted. In FIG. 1, reference numeral 15 is a vacuum opening / closing pin mounted on the cull portion 16 of the upper mold block 9 so as to be slidable up and down, and 15a is an exhaust passage provided at the center of the vacuum opening / closing pin. Reference numeral 17 is an exhaust passage provided in the upper die cavity block 9, 19 and 20 are seal blocks annularly attached to the upper and lower surface plates 3 and 2, and 18 is the seal block 19 and 20 and the upper and lower cavity blocks. An annular exhaust passage formed by 9, 8 and 21, 22, 23 are the upper and lower surface plates 3,
2 and the sealing members 24 and 25 for sealing the mating surfaces of the upper and lower sealing blocks 19 and 20, and the sealing members 24 and 25 provided on the pot 10 and the plunger 11. 26 is the vacuum opening / closing pin 15
A spring 27 for returning to the origin is a rod for transmitting the force of an air cylinder (not shown) for lowering the vacuum opening / closing pin 15 downward. Reference numeral 28 denotes an exhaust passage that opens the annular exhaust passage 18 to the outside of the mold 1, and is piped to a vacuum exhaust device (not shown).

In the semiconductor resin sealing device configured as described above,
When the mold is clamped, the synthetic resin 14 in the pot 10 is pressed by the plunger 11 to fill the cavities 6 and 7 with each other.
The package 5 can be formed.

In this case, after the resin is put into the pot 10, the vacuum opening / closing pin 15 is moved downward almost at the same time as the mold clamping, and the solenoid valve (not shown) of the vacuum exhaust device (not shown) is opened. Exhaust passages 15a, 1 for air in 6, 7 and resin 14
It can be discharged to the outside of the mold 1 from 7, 18, 28,
The inside of the pot 10 and the cavities 6 and 7 can be evacuated. The vacuum opening / closing pin 15 is an air cylinder (not shown) so as to return to the origin before driving the plunger 11.
Is controlled in conjunction with the plunger drive.

As described above, even if air is contained in the resin 14 before molding, vacuum degassing is performed in the pot 10 before pressurization by the plunger. Therefore, pot 10, cavities 6 and 7, resin
The air inside 14 does not enter into the resin, the runner, and the cavity when the resin is pressed to form voids (cavities) on the surface and inside of the package 5.

Incidentally, the seal blocks 19 and 20, the exhaust passage 15 in the present invention.
The shapes and driving methods of a, 17 18 28 and the vacuum opening / closing pin 15 are not limited to those in the above-described embodiments.

〔The invention's effect〕

As described above, according to the present invention, the vacuum opening / closing pin is provided in the cull portion of the mold for forming the package for semiconductor resin encapsulation, and the exhaust device is connected to the exhaust path thereof. Before pressurizing, the inside of the pot and the cavity can be made into a vacuum state, and thus, the void-free package can be formed inside and on the surface of the pot and the cavity.
There is an effect that the quality of the product can be surely improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor resin sealing device. In the figure, 1 is a die, 4 is a lead frame, 5 is a package, 6 and 7 are cavities, 6 and 7 are cavities, 8 and 9 are cavities blocks, 10 is a pot, 11 is a plunger, 15 is a vacuum opening / closing pin, 15a is an exhaust passage, Reference numeral 16 is a cal, and reference numerals 17, 18 and 28 are exhaust passages. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (3)

[Claims] 1. A semiconductor resin encapsulation apparatus comprising: a die having a cavity for forming a package for encapsulating a semiconductor resin; and a pot attached to the die for advancing and retracting a resin pressure plunger. , Equipped with a vacuum opening / closing pin that is attached to the mold's cull part so as to be able to move back and forth, and that has an exhaust path inside that communicates with the inside of the pot and the cavity,
A resin sealing device for a semiconductor device, wherein an exhaust device is connected to an exhaust path of the vacuum opening / closing pin. 2. The resin sealing device for a semiconductor device according to claim 1, wherein a spring for returning to the origin is hung on the vacuum opening / closing pin. 3. The resin sealing device for a semiconductor device according to claim 1 or 2, wherein an air cylinder is connected to the vacuum opening / closing pin.