JPH0697145A - Semiconductor manufacturing equipment - Google Patents

Abstract

(57) [Summary] [Object] The present invention relates to a semiconductor manufacturing apparatus in which a substrate is immersed in a processing liquid for processing, and particularly to provide a semiconductor manufacturing apparatus capable of preventing bubbles from adhering to the back surface of the substrate. And [Constitution] Container 21 for containing treatment liquid 11 for treating substrate 12
And a substrate holding means 31 for holding the back surface of the substrate 12 and immersing it in the processing liquid 11,
The substrate holding means 31 is configured to hold the substrate 12 in the treatment liquid 11 in a state of being inclined with respect to the horizontal plane.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus in which a substrate is immersed in a processing liquid for processing, and more particularly to a semiconductor manufacturing apparatus capable of preventing bubbles from adhering to the back surface of the substrate.

[0002]

2. Description of the Related Art Next, a conventional semiconductor manufacturing apparatus, for example, a conventional semiconductor manufacturing apparatus for removing a chromium (Cr) film deposited on the surface of a transparent quartz substrate by etching it with an etching solution is shown in FIG. And explain.

FIG. 3 is an explanatory view of a conventional semiconductor manufacturing apparatus, and FIG. 3 (a) is a side sectional view of an essential part schematically showing a state before a quartz substrate is immersed in an etching solution. FIG. 3B is a side cross-sectional view of a main part schematically showing a state where the quartz substrate is immersed in the etching liquid, and FIG. 3C is a schematic plan view of the substrate holder.

In FIG. 3, 11 is an etching solution that dissolves chromium (Cr), 12 is a square transparent quartz substrate, and 13 is a transparent quartz substrate.
Is a chrome film deposited on the surface of the quartz substrate 12, and 14 is a chrome film
A resist applied to the surface of 13 and formed into a predetermined pattern,
Reference numeral 21 is a container for containing the etching liquid 11, 22 is an etching liquid supply pipe for supplying the etching liquid 11 into the container 21, and 23 is a substrate holder for holding the back surface of the quartz substrate 12 and immersing it in the etching liquid 11.

With such a conventional semiconductor manufacturing apparatus,
In order to fabricate an exposure reticle used for manufacturing a semiconductor device by etching the chromium film 13 deposited on the surface of the quartz substrate 12, first the quartz substrate 12 is placed on the surface side (chrome film 1
3) is set in the horizontal state on the head 23a of the substrate holder 23 with the side 3) facing upward, and a predetermined amount of the etching liquid 11 is supplied into the empty container 21 from the etching liquid supply pipe 22.

When the supply of a predetermined amount of etching solution 11 into the container 21 is completed, the head 23a is moved through the lifting / rotating shaft 23b of the substrate holder 23 connected to the lifting / rotating device (not shown).
Is lowered to an arrow D, the quartz substrate 12 is immersed in the etching liquid 11, and the chromium film 13 exposed from the resist 14 is etched and removed.

Next, the head 23a is lifted by the lifting / rotating device.
And quartz substrate 12 in the direction of arrow U
After being taken out from inside 11, the etching solution 11 adhering to the quartz substrate 12 rotating in the direction of the arrow R together with the head 23a is washed with water and dropped by a lifting / rotating device.

After that, the resist 14 is removed from the quartz substrate 12 with a resist remover (not shown), whereby the reticle described above is completed.

[0009]

As described above, in the conventional semiconductor manufacturing apparatus, the quartz substrate 12 is immersed in the etching solution 11 in a horizontal state.

By the way, when a large quartz substrate 12 having a side length of about 160 mm is immersed in the etching solution 11 by a conventional semiconductor manufacturing apparatus, large bubbles 15 often adhere to the back surface thereof.

In the case of a large volume of bubbles 15, the quartz substrate 12 can be floated from the head 23a of the substrate holder 23 by its large buoyancy, and the quartz substrate 12 can be detached from the head 23a and dropped on the bottom of the container 21. There was a little.

The present invention has been made to solve such a problem, and an object thereof is to provide a semiconductor manufacturing apparatus capable of preventing bubbles from adhering to the back surface of a quartz substrate.

[0013]

As shown in FIG. 1, a container 21 for containing a processing liquid 11 for processing a substrate 12 and a substrate for holding the back surface of the substrate 12 and immersing the substrate in the processing liquid 11 are provided. In the semiconductor manufacturing apparatus including the holding means 31, the substrate holding means 31 is achieved by the semiconductor manufacturing apparatus characterized by holding the substrate 12 in the treatment liquid 11 in a state of being inclined with respect to the horizontal plane. It

[0014]

In the semiconductor manufacturing apparatus of the present invention, the substrate holding means 31 is configured to immerse the substrate 12 in the processing liquid 11 with the substrate 12 inclined with respect to the horizontal plane.

Therefore, the substrate 12 immediately after being immersed in the treatment liquid 11
Even if air bubbles 15 (see (b) in FIG. 3) adhere to the back surface of the substrate, the air bubbles 15 will be released within a short time because the back surface of the substrate 12 is inclined with respect to the horizontal plane. .

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor manufacturing apparatus of an embodiment according to claim 1 of the present invention will be described below with reference to the drawings. Figure 1
Is an explanatory diagram of an embodiment according to claim 1 of the present invention,
FIG. 1 (a) is a side sectional view schematically showing a state before immersing the quartz substrate in the etching solution, and FIG. 1 (b) is a main section schematically showing a state during immersing the quartz substrate in the etching solution. It is a sectional side view.

In the present specification, the same parts, the same materials and the like are designated by the same reference numerals throughout the drawings. Claim 1 of the present invention as shown in FIGS.
The semiconductor manufacturing apparatus according to the embodiment of the present invention is configured by replacing the substrate holder 23 of the conventional semiconductor manufacturing apparatus described with reference to FIG. 3 with a substrate holder 31.

The substrate holder 31 is constructed by inclining the head 23a of the substrate holder 23 of the conventional semiconductor manufacturing apparatus with respect to the horizontal plane, for example, 3 degrees, so that the quartz substrate 12 is inclined with respect to the horizontal plane. To be immersed in the etching solution 11.

Therefore, the substrate holder 31 causes the processing liquid to flow.
Bubbles 15 (Fig. 3) on the back surface of substrate 12 immediately after being immersed in 11
(See (b)), the bubbles 15 will be released within a short time because the back surface of the substrate 12 is inclined with respect to the horizontal plane.

Thus, the semiconductor manufacturing apparatus of one embodiment of the present invention does not cause the above-mentioned bubbles 15 to adhere to the back surface of the quartz substrate 12 immersed in the treatment liquid 11. Further, in the semiconductor manufacturing apparatus according to the first embodiment of the present invention described above, a stirring means for stirring the etching solution 11 in the container 21 as shown in FIG. 2, for example, a pumping pipe having one end inserted into the container 21. An agitating means composed of 32a, a jet pump 32b connected to the other end of the pumping pipe 32a, and a discharge pipe 32c having one end connected to the jet pump 32b and the other end protruding into the container 21 is provided. The semiconductor manufacturing apparatus of an embodiment according to claim 2 of the present invention is one in which the etching liquid 11 in 21 can be agitated.

By operating the jet pump 32b in the semiconductor manufacturing apparatus according to the second embodiment of the present invention, the etching solution 11 in the container 21 causes the pumping pipe 32a, the jet pump 32b, and the discharge pipe 32c to be indicated by arrows. Via container like
Bubbles 15 ejected into 21 and adhering to the back surface of quartz substrate 12
Will be released more dynamically.

[0022]

As described above, the present invention makes it possible to provide a semiconductor manufacturing apparatus capable of preventing bubbles from adhering to the back surface of a substrate.

Therefore, if the semiconductor manufacturing apparatus of the present invention is adopted, semiconductor devices can be manufactured with high yield.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an embodiment according to claim 1 of the present invention.

FIG. 2 is an explanatory diagram of an embodiment according to claim 2 of the present invention.

FIG. 3 is an explanatory diagram of a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 11 is an etching liquid (treatment liquid) 12, a quartz substrate (substrate) 13, a chrome film 14, a resist 15, a bubble 21, a container, 22 is an etching liquid supply pipe (treatment liquid supply means) 23 , Substrate holder (substrate holding means) 23a, head 23b, lifting / rotating shaft 31, substrate holder (substrate holding means) 32, stirring means 32a, pumping pipe 32b, jet pump 32c, discharge pipe

Claims (2)

[Claims] 1. A container (21) for containing a treatment liquid (11) for treating a substrate (12) and the treatment liquid holding the back surface of the substrate (12).
In a semiconductor manufacturing apparatus comprising a substrate holding means (31) immersed in (11), the substrate holding means (31), the substrate (12) in the treatment liquid (11) in a horizontal plane. A semiconductor manufacturing apparatus, which is held in a tilted state. 2. The semiconductor manufacturing apparatus according to claim 1, further comprising stirring means (32) for stirring the processing liquid (11) in the container (21). .