JPH07180092A - Continuous surface treating device - Google Patents

Abstract

PURPOSE:To provide a continuous surface treating device which is capable of continuously executing plating or electrolytic grinding on a broad metallic sheet or a metallic wire or plating on a plastic film made conducting, does not require a plating bath tank of a large capacity and enables plating with a uniform thickness. CONSTITUTION:The surface of a rotary drum 7 insulated by a resin is projected from the pass line of a traveling metallic strip 2 which is a material to be treated, is un-coiled and is subjected to a cleaning treatment. This surface is brought into surface-to surface contact in an arc form with such metallic strip 2. An arc-shaped liquid absorptive structural material layer 14, such as polyurethane sponge, formed to permit continuous outflow of a plating liquid via pipes 12 with valves connected to a plating liquid storage tank 11 is fixed to an arc-shaped anode plate 13. The plating liquid is made to flow out by the capillarity of the liquid absorptive structural material layer 14 at the time of pressing and sliding this layer on the arc surface of the metallic strip 2 which serves as cathode, by which ions are supplied and electroplating is effected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous plating treatment for forming a metal layer and an alloy layer by electroplating on one side of a metal plate or a wire material and a plastic film material made conductive by chemical plating or continuous electrolytic polishing. Related to the continuous surface treatment apparatus, the material to be treated and the material to be absorbed which become the cathode material while pressing and sliding the arc-shaped liquid-absorbing structure material layer containing the bath liquid on the material to be processed that contacts the rotating drum in an arc-shape. The present invention relates to a continuous surface treatment apparatus that does not require a large-capacity plating bath and can perform plating with a uniform thickness by applying an electric current between anode materials that support layers.

[0002]

2. Description of the Related Art Conventionally, in a continuous plating apparatus for electroplating while supplying a plating solution between a running metal strip serving as a cathode and an anode plate, a uniform film is formed over the entire surface to be plated of the metal strip serving as a cathode. In order to form a thick plating layer, it is necessary to uniformly supply the plating solution between the metal strip and the anode material. For that purpose, the plating solution flows out (leakage liquid) to both sides of the metal strip in the traveling direction. ) Is required, a device is complicated, and it is difficult to obtain a plating layer having a uniform thickness.

[0003]

Recently, an object to be plated, which has been made into a conductor, is used as a cathode, and absorbent cotton has been fixed to a brush tip connected to an anode jig. Although a brush plating method for forming a plating layer at a required place of is proposed, the object to be plated which is made conductive is limited to a small article and is effective for partial plating, but a wide metal plate during running, It was not possible to apply it to a metal film or a plastic film made into a conductor by chemical plating or the like.

The object of the present invention is to provide a continuous surface treatment apparatus capable of continuously plating a wide metal plate, a metal wire, electrolytic polishing or a conductive plastic film, and does not require a large-capacity plating bath. It is an object of the present invention to provide a continuous surface treatment apparatus capable of performing uniform thickness plating.

[0005]

SUMMARY OF THE INVENTION The inventors of the present invention have made it possible to uniformly dispose on a wide metal plate, a metal wire or a plastic film which has been made conductive by chemical plating or the like, while the vehicle is running, without disposing a sealing device unlike the conventional device. As a result of various studies on equipment capable of electroplating, the rotating drum surface insulated with resin was made to protrude from the pass line of the treated material to the treated material that had been rewound and cleaned, and then contacted in an arc shape. ,
The material to be treated, which becomes a cathode by fixing an arc-shaped liquid absorption structure material layer such as a polyurethane sponge capable of continuously flowing out the plating solution through a pipe with a valve connected to a plating solution storage tank to the arc-shaped anode plate The present invention has been completed by finding that the plating solution flows out and ions are supplied to perform electroplating due to the capillary phenomenon of the liquid absorption structure substance when the material is pressed and slid on the circular arc surface.

According to the present invention, a rotating drum, which has a width equal to or larger than that of a material to be treated and is electrically insulated, can contact a material to be treated as a cathode material in an arc shape during traveling. A circular arc-shaped liquid absorption structure substance layer containing a bath liquid supplied from a bath of a plating solution or an electropolishing solution is disposed on the arc-shaped anode material arranged to face the material to be processed in contact with the arc shape, The continuous surface treatment apparatus is characterized in that an electric current can be applied between the cathode material and the anode material while pressing and sliding the liquid absorbing structure substance layer on the material to be treated with the arc-shaped anode material. In addition, the present invention also proposes a continuous surface treatment apparatus having an ultrasonic wave oscillating device that applies ultrasonic waves to the liquid absorption structure material layer.

In the present invention, as the material to be treated, various metal plates or wires and various plastic film materials which are made conductive by chemical plating or the like can be applied, and the rotary drum for contacting these in an arc shape is electrically. Although any material may be used as long as it is insulated to, for example, the outer peripheral surface of the stainless steel drum is coated with a resin such as fluororesin, tetrafluoroethylene or the like which is hard and has good slipperiness and excellent chemical resistance. The structure can be adopted. By making the width of the rotary drum wider than the width of the material to be processed, the entire width of the material to be processed can be electroplated, and a plurality of materials having a narrow width can be electroplated at the same time.

In the present invention, the liquid-absorbing structure material layer contains any bath liquid supplied from the bath of the plating liquid or the electropolishing liquid, and any known material can be used as long as it can be continuously discharged. Polyurethane foam, polyethylene foam, polystyrene foam, carbon, absorbent cotton, felt, glass fiber foamed aluminum, and other organic and inorganic materials can be applied, and their specific gravity is 0.02% / cm ^{3 to} 0.05%. / Cm ³ , porosity 60% to 90%, pore diameter 0.05 mm to 1.0 m
m, preferably has a tensile strength of ^{4kg / mm 2 ~6kg / mm 2} , thickness 10mm~100mm is preferred. Although the thicknesses may be the same, the thickness of the material to be treated on the inlet side is increased and the thickness on the outlet side is decreased to make the thicknesses unequal to change the current density and change the alloy ratio. In addition, although it may be an integral body, it is divided in the traveling direction of the material to be treated, and the bath liquid temperature, concentration, and voltage are changed for each division, so that the current density in each divided portion can be adjusted under different conditions. Can be changed to change the alloy ratio.

In the present invention, the arc-shaped angle of the liquid-absorbent structure material layer is between the inlet and outlet sides of the liquid-absorbent structure material layer and the center point of the rotary drum, and the angle is 60 to 12 degrees.
0 degree is preferable. Further, as a method of pressing the liquid-absorbing structure material layer to the material to be treated, a circular arc-shaped anode material itself for disposing the liquid-absorbing structure material layer or the arc-shaped anode material with another arc-shaped pressing member is screwed, It can be adjusted to various pressing forces via a spring type, air cylinder, etc., and the pressing force is 100 g /
Preferably ^{cm 2 ~200g / cm 2, 100g} / cm 2
If it is less than 200 g / g
If it exceeds cm ² , glossiness and smoothness are deteriorated, and there is a problem of generation of scratches, which is not preferable.

In the present invention, the cathode plate is a material to be treated as described above, and various metal plates and metal wires, as well as plastic film material whose surface is made conductive by conductive coating or chemical plating, can be used. As the pretreatment, cleaning treatment such as degreasing of the surface, chemical grinding, and washing is preferably performed. Further, as the anode plate, either a melting electrode or a non-melting electrode can be used, and as the melting electrode, electrolytic gas copper, oxygen-free copper, phosphorus-containing copper, electrolytic gas nickel, high sulfur nickel, carbonized nickel, zinc , Tin, solder and brass can be used, and as the insoluble electrode, lead alloy, pure lead ferrite, platinum-coated titanium, carbon, pure lead, platinum and the like can be used. Further, stainless steel, platinum-coated titanium, electric nickel or the like can be used for electrolytic polishing.

In order to improve the plating or polishing rate using the continuous surface treatment apparatus according to the present invention, it is preferable to dispose an ultrasonic oscillating device on the metal band outlet side of the liquid absorbing structure material layer. By installing the apparatus, H ₂ gas, O ₂ gas, etc. generated in the material to be processed can be quickly removed. The oscillation frequency of the ultrasonic oscillator is 20 kHz
47 kHz, and the output is preferably 30 W to 300 W. When electroplating the entire surface of the material to be treated, the width of the liquid-absorbing structure material layer should be at least equal to or greater than that of the material to be treated. By making it narrower, it is possible to carry out partial stripe plating at a required position on the material to be treated, and if masking is performed at a required position on the material to be treated, it is possible to carry out partial plating in a scattered manner. The width of the liquid absorption structure material layer and the rotary drum must be wider than the width of the anode plate and the material to be processed.If the liquid absorption structure material layer is pressed and slid on the material to be processed of the cathode plate, the cathode plate Must be the same as the width of.

In the present invention, the plating film is removed in a colloidal form during sliding contact, and at the same time, a new plating solution is supplied to obtain a smooth and glossy plating film, which is then washed with water. Plating film thickness is 0.1 μm to 10 μm
and the traveling speed of the material to be treated is 0.03 m / min to 0.
3 m / min is preferred. The plating film thickness can be controlled by appropriately selecting the traveling speed and current density of the material to be processed.

[0013]

The operation of the present invention will be described in detail with reference to the drawings. Here, the case where the material to be processed is a metal plate will be described. FIG. 1 is an explanatory view showing the structure of a continuous surface treatment apparatus according to the present invention. FIG. 2 is a vertical cross-sectional explanatory view showing a configuration of a main part of the continuous surface treatment apparatus of FIG. The metal strip 2 to be plated that has been unwound from the rewinding drum 1 passes through the continuous processing device 3 for cleaning the metal, and then is sent to the inlet-side power feeding guide roller 6 via the drive roller 4 and the tension roller 5. To be The upper surface of the rotating drum 7 whose surface is coated with an insulating resin is disposed at a position higher than the position of the power feeding guide roller 6, and the metal strip 2 serves as a cathode and makes an arc-shaped surface contact with the upper surface of the rotating drum 7. Meanwhile, the continuous washing and drying device 1 through the outlet side power feeding guide roller 8 and the drive roller 9
It is sent to 0 and wound up by the winding drum 17. Metal strip 2 of the cathode which is in surface contact with the rotating drum 7 in an arc shape.
The arc-shaped liquid absorption structure material layer 14 fixed to the arc-shaped anode plate 13 is in contact with the upper surface of the plate, and the plating solution is supplied from the plating solution storage tank 11 to the liquid absorption structure material layer 14 via the pipe 12 with bubbles. In addition, the support member 15 of the arc-shaped anode plate 13 is configured to be pressed by the air cylinder 16, and the plating solution is used when the liquid absorption structure material layer 14 is pressed and slid on the metal strip 2 by the air cylinder 16. And is electroplated while flowing out by a capillary phenomenon, and an electroplating layer is formed on the surface of the metal strip 2 on the liquid absorption structure material layer side. An ultrasonic oscillator 18 is installed on the liquid absorption structure material layer 14 and the arc-shaped anode plate 13 to remove H ₂ gas, O ₂ gas, etc. generated in the metal strip 2, and the plating solution storage tank 11 is removed. Is equipped with a heater and a stirrer, the liquid temperature is kept at a predetermined temperature with a thermometer, and a water tank is provided below the rotary drum 7 to wash the rotary drum 7 with water on the outlet side and air blow on the inlet side. I'm draining.

1 and 2 show an example in which the upper surface side of the running metal band 2 is projected in an arc shape by the rotating drum 7 and the liquid absorbing structure material layer 14 is brought into contact with it. As shown in A and B, the arrangement may be reversed. That is,
In the example shown in FIG. 3A, the lower surface side of the running metal band 2 is projected in an arc shape by the rotating drum 7 to allow the liquid absorption structure material layer 2
4, a pressure adjusting device 22 for holding the support 21 so that it can move up and down is used, and an arc-shaped anode plate 23 having an arc-shaped liquid absorbing structure material layer 24 fixed to the inner surface thereof is used as the arc-shaped support 21. Placed on the metal strip 2 and pressed against the arc surface of the metal strip 2 with a predetermined pressure, and when the plating solution supplied from the plating solution storage tank 25 through the pipe slides against the metal strip 2 by pressure, it flows out by a capillary phenomenon. At the same time, electroplating is performed. In the example shown in B of FIG. 3, an arcuate support base 31 arranged in the plating solution bath 30.
The arc-shaped anode plate 33 having the arc-shaped liquid absorbing structure material layer 32 adhered to the inner surface thereof is placed on the lower surface of the running metal strip 2 by the rotating drum 7 with a predetermined pressure to form an arc shape. When the metal strip 2 is pressed and slid on the liquid absorption structure material layer 32 sucking up the plating solution in the bath 30, the metal layer 2 is caused to flow out by a capillary phenomenon and electroplating is performed.

The example shown in C of FIG. 3 is an example of an apparatus for changing the alloy ratio of plating. In the configuration of FIGS. 1 and 2 described above, the arc-shaped anode plate 13 and the liquid absorption structure material layer are provided. 14 is divided into a required number in the running direction and the bath liquid temperature and concentration of the plating solution supplied to the divided liquid absorption structure material layers 14 ₁ , 14 ₂ and 14 ₃ are changed, respectively. By changing the voltage supplied to each of ₁ , 13 ₂ and 13 ₃ , the alloy density can be changed by changing each condition of the current density in each divided portion.

[0016]

【Example】

Example 28 mm wide as an anode plate of the continuous surface treatment apparatus shown in FIG.
× Using an arc-shaped metal plate shown in Table 1 having a thickness of 0.2 mm,
As the insulating resin rotating drum, a drum having a diameter of 998 mm and a fluorine resin coating of 2 mm in thickness on the outer peripheral surface of a stainless steel drum having a diameter of 1 m was used. While rotating the rotary drum at a rotation speed of 0.3 rpm, a width of 26 mm ×
A thickness of 0.2 m is obtained by transferring various metal plates shown in Table 2 as cathode plates at the feed rates shown in Table 3 and fixing the plates to the anode plate at an opening of 60 ° from the center of the rotary drum. An arc-shaped polyurethane sponge layer having a width of 48 mm and a thickness of 70 mm is slid on the cathode plate at a contact pressure of 150 g / cm ² while penetrating the anode plate from the upper plating solution storage layer through a pipe. The plating solution filled in the sponge layer flowed out of the sponge layer due to a capillary phenomenon during the pressure sliding of the sponge layer, and electroplating was performed under the plating conditions shown in Table 3.

Table 4 shows the plating properties of the metal strip of the cathode plate. Adhesiveness was evaluated by sticking an adhesive tape on a 1 mm square board provided on the plated surface and measuring the number of peeled eyes. The gloss was evaluated by visual inspection as good, and as a part of discoloration was evaluated as fair. Further, the film defects were visually inspected with a 400 × optical microscope, and evaluated as “good”, and “fair” when some defects were observed. Further, the whiskers were visually inspected with a 400 times optical microscope, and evaluated with a number of 0.1 mm or more.

Comparative Example Cu plate having dimensions of 100 mm length × 50 mm width × 0.3 mm thickness immersed in the plating solution shown in Table 1 of the plating solution tank (Comparative Example 1) and Cu / stainless steel of the same size / Ni 3
The layer clad plate (Comparative Example 2) was used as a cathode plate, and the anode plate was a brass plate (Comparative Example 1) having a length of 180 mm × width of 90 mm and thickness of 2 mm, and Sn plate (Comparative Example 2). The properties of the yellow plating tank (Comparative Example 1) and the tin plating layer (Comparative Example 2) coated on the cathode plate by electroplating were evaluated in the same manner as in Examples, and shown in Table 4.

[0019]

[Table 1]

[0020]

[Table 2]

[0021]

[Table 3]

[0022]

[Table 4]

[0023]

As described above, the continuous surface treatment apparatus according to the present invention does not require a large-capacity plating tank as in the prior art, can downsize the apparatus, and can improve the working environment. Further, since the distance between the electrodes is constant, it is possible to reduce the variation in the thickness of the plating film, and further, by making the liquid absorption structure material layer thickness thick on the inlet side of the material to be treated and thin on the outlet side, the alloy In the case of plating, the alloy ratio can be changed. Also, widen the rotating drum width of the continuous surface treatment device,
By narrowing the width of the anode plate and the material to be treated, it is possible to perform plating treatment on several treatment materials at the same time, there are few plating film defects, gloss smoothness is improved, and high-speed plating treatment is performed. can do.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration of a continuous surface treatment apparatus according to the present invention.

FIG. 2 is a vertical cross-sectional explanatory view showing a configuration of a main part of the continuous surface treatment apparatus according to the present invention in FIG.

3A, 3B and 3C are longitudinal explanatory views showing another configuration of the main part of the continuous surface treatment apparatus according to the present invention.

[Explanation of symbols]

1 Rewinding Drum 2 Metal Band 3 Continuous Processing Device 4 Drive Roller 5 Tension Roller 6 Inlet-side Power Supply Guide Roller 7 Rotating Drum 8 Outlet-side Power Supply Guide Roller 9 Drive Roller 10 Rinsing / Drying Continuous Device 11, 25 Plating Solution Storage Tank 12 With Bubble Pipes 13, 13 ₁ , 13 ₂ , 13 ₃ , 23, 33 Anode plates 14, 14 ₁ , 14 ₂ , 14 ₃ , 24, 32 Liquid absorption structure material layer 15 Support 16 Air cylinder 17 Winding drum 18 Ultrasonic oscillation Device 21 Support 22 Pressure regulator 30 Plating bath

Claims (2)

[Claims] 1. A rotating drum, which has a width equal to or larger than that of a material to be treated and is electrically insulated, allows a material to be treated, which is a cathode material, to be in an arcuate shape while running, and the rotating drum has an arcuate shape. The arc-shaped anode material disposed in opposition to the material to be treated, which is in contact with the arc-shaped anode material, is provided with an arc-shaped liquid absorption structure material layer containing a bath solution supplied from a bath of a plating solution or an electrolytic polishing solution. A continuous surface treatment apparatus characterized in that a current can be applied between a cathode material and an anode material while the liquid absorption structure material layer is pressed and slid on the material to be treated by the material. 2. The continuous surface treatment apparatus according to claim 1, further comprising an ultrasonic wave oscillating device that applies ultrasonic waves to the liquid absorption structure material layer.