JPH07183655A - Iron tip insertion / removal type soldering apparatus and soldering method and solder releasing method using the same - Google Patents

Abstract

(57) [Summary] [Purpose] Iron tip insertion / removal type soldering device that can replace a hot iron tip with a one-touch soldering iron tip of a type suitable for the intended purpose. And a soldering method and a solder releasing method using the same. [Structure] A soldering iron tip provided with a soldering iron tip of a plurality of soldering irons having a specific shape adapted to the form of a soldering portion of an electronic component, and a joining structure for fixing the soldering iron tip in a detachable manner Insertion / removal type soldering device and method for soldering or removing electronic parts using the same. [Effect] The work efficiency of soldering is improved, and by exchanging the soldering iron tip, the electronic components such as the DIP type IC soldered to the printed circuit board can be used without using an expensive solder sucker or a molten solder bath. Solder removal work can be performed easily, efficiently and inexpensively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device for electronic parts and the like, and more particularly to a soldering iron having a structure in which the tip of a soldering iron can be replaced with a one-touch type soldering tip suitable for the purpose of use. The present invention relates to a device and a soldering method using the same, and a solder detaching method capable of easily removing a DIP (Dual Inline Package) type IC or the like in which an electronic component or the like is mistakenly mounted from a soldered printed circuit board. .

[0002]

2. Description of the Related Art For example, a conventional soldering iron is shown in FIG.
As shown in (a), the iron tip 1 is inserted into the heat radiating portion 3 of the soldering iron and is fixed with the screw 2a, as shown in FIG. 5 (b), from the handle 4 portion of the soldering iron. There is a soldering iron having a structure in which the exposed heat radiating rod 5 is wrapped with the iron tip 1 and fixed by using a screw 2b of a size that can be manually rotated by an operator in order to join the handle 4 and the iron tip 1. However, these soldering irons, when changing to a soldering iron tip with a different shape according to the purpose of use, first turn off the soldering iron, cool the soldering iron once, and then use a screwdriver etc. to convert the soldering iron tip (Figure 5 (a)], or the operator manually turns the screw to replace the iron tip [type shown in FIG. 5 (a)]. Therefore, there is a problem that it takes time to cool the soldering iron, so that the working efficiency is lowered, and the workability of soldering is poor because there are few types of iron tips suitable for the purpose of use. In addition, DI which was implemented by mistake
PIP type ICs and the like are detached from a soldered printed circuit board by using a DIP type IC pin and a solder release method.
The solder adhered to the through hole in which the IC pin is inserted is melted, and the molten solder is removed for each pin using a solder sucker, etc., and then the IC is removed or soldered to the printed circuit board. A method of immersing a DIP type IC pin in a molten solder bath to remove the IC has been adopted. However, in the method of removing the IC using the above-mentioned solder sucker, the solder attached to the IC
Since it has to be removed for each pin, a lot of man-hours have been spent to remove the IC. Also, the method of putting the solder in the solder bath and melting the solder to remove the IC can be used only in the place where the solder bath is installed, and the equipment cost is high to prepare the solder sucker and the solder bath. There was a problem.

[0003]

SUMMARY OF THE INVENTION A first object of the present invention is to solve the above-mentioned problems in the prior art, and one-touch operation is possible even with a hot iron tip with the soldering iron turned on. An object of the present invention is to provide a soldering iron tip insertion / removal type soldering device which can be replaced with a soldering iron tip of a type suitable for the intended purpose and a soldering method using the same.

A second object of the present invention is to easily remove an electronic component, such as a DIP type IC, which has been erroneously mounted in a soldering operation of an electronic component, from a soldered printed circuit board. It is to provide a soldering iron and a method for releasing the solder.

[0005]

In order to achieve the above-mentioned object of the present invention, a plurality of types of iron tips having a specific shape adapted to the form of a soldering portion or a solder releasing portion of an electronic component or the like are provided. This is a soldering iron tip insertion / removal type soldering device in which a joining portion having a structure in which tips are fitted and detachably fitted and supported and fixed by one-touch is provided on a soldering iron body. With such a structure, one-touch soldering,
Alternatively, since the iron tip can be freely replaced with a soldering tip having a shape suitable for removing solder, the work efficiency of soldering or removing solder can be significantly improved. In the soldering tip insertion / removal type soldering device of the present invention, the joint portion of the structure in which the soldering iron tip is insertably / removably fitted and fixed has the soldering iron body of the soldering iron main body with the soldering iron tip provided with the protruding portion as the fitting protrusion The fitting convex portion is fitted into the fitting concave portion formed by the spring, the metal member, and the recess portion provided inside, and the elasticity of the spring provided in the fitting concave portion and the metal member make the soldering iron. A structure in which the tip is held in a state of pressing pressure and also serves as a detaching force at the time of detaching the iron tip, and the protrusion of the iron tip is engaged with and fixed to the recess provided in the fitting recess. Is. The soldering iron tips of a plurality of types of soldering irons to be prepared in advance have a predetermined soldering iron tip having a predetermined shape that is suitable for the soldering portion of the electronic component or the like, or a solder detaching portion. It is preferable to prepare as many kinds of iron tips as possible. Further, the present invention relates to a method of soldering or removing an electronic component, for example, a DIP type IC or the like, by using a soldering iron insertion type soldering device. An electronic component soldered to a printed circuit board or the like of the present invention, for example, a method for removing a solder such as a DIP type IC, has two soldering iron tips having a shape suitable for the pin arrangement of the soldered electronic component, The two soldering iron tips are disposed on a supporting member having a structure that can be removably fitted and fixed to the soldering iron main body, and the soldering iron dedicated to detaching the solder has a structure that can be opened and closed in a hinge shape by utilizing the elasticity of a spring. Using, align the two iron tips with the pins of the soldered electronic parts,
A step of holding the pin with the two iron tips, a step of heating the iron tip while holding the pins with the two iron tips to melt the solder of the soldering portion, and a step of melting the solder, At least the step of removing the electronic component is used. As described above, in the method of releasing a solder such as an electronic component soldered on a printed circuit board or the like, for example, a DIP type IC, it is extremely easy and efficient to use a soldering iron for exclusive use of the solder that is suitable for the pin position of the electronic component. Since the solder removing work can be performed, it is not necessary to use a conventional expensive solder sucker or a molten solder bath.

[0006]

Embodiments of the present invention will be described below in more detail with reference to the drawings. <Embodiment 1> FIGS. 1A and 1B are schematic views showing an example of a configuration of a soldering and a solder detaching device, which is manufactured in this embodiment, in which a soldering iron tip can be inserted and removed with one touch. Figure 1
(B) shows the structure of the main body of the soldering device,
The heat dissipation part 3 is joined to the handle 4, and the one-touch insertion / removal iron tip 6 shown in FIG. The fitting concave portion 20 is provided so that the one-touch insertion / removal iron tip 6 can be freely inserted and removed. Further, the iron tip is made of copper, or an iron tip plated with copper is used. A spring 7 and a metal member 8 are provided inside the fitting recess 20, and one side of the spring 7 is fixed to the heat dissipation portion 3. The metal member 8 is a metal piece for supporting the one-touch insertable / removable iron tip 6, and the spring 7 is provided to facilitate the detachment of the iron tip by the elasticity of the spring. You don't have to. Hereinafter, a method of using a soldering and a solder removing device, which allows the iron tip to be inserted and removed with one touch, will be described. 2 (a), (b), (c),
As shown in (d), a suitable iron tip is selected from among several types of one-touch insertion / removal iron tips 6 prepared according to the purpose of use, and attached to the body of the soldering iron. The iron tip can be attached with one touch. The fitting projection 19 of the one-touch insertion / removal iron tip 6 shown in FIG. 1 (a) is provided with projections (projections) 21 at two places, and this is shown in FIG. The fitting recess 20 provided in the heat radiating portion 3 of the soldering iron body shown in b) is fitted into the fitting recess 20, and the metal member 8 supported by the spring 7 inside the fitting recess 20 is brought into contact with the fitting recess 20. After pushing in the direction of A and then turning in the direction of arrow B (counterclockwise), when the force of the iron tip that is pressed and supported is loosened, the spring 7 recoils and the spring is provided in the fitting recess of the heat radiating portion 3. Dimple (concave)
The projection (projection) 21 of the fitting convex portion 19 of the one-touch insertion / removal iron tip 6 is engaged with the portion 22, and the one-touch insertion / removal iron tip 6 can be attached to the soldering iron body. Next, when removing the one-touch insertable / removable iron tip 6, after pushing the iron tip in the direction of arrow A shown in FIG. 1A, and then turning it in the opposite direction (clockwise) of the direction shown by arrow B, By loosening the force that supports the iron tip, it is pushed out by the extension force of the spring 7 and the iron tip can be removed with one touch. In addition, the method of inserting and removing the iron tip when heating the soldering iron is to grasp the iron tip with a radio pliers etc. instead of holding the iron tip by hand, and insert and remove with one touch in the above procedure. You can 2 (a), (b),
The four types of iron tips shown in (c) and (d) are examples of the one-touch insertion / removal iron tip 6 and the one-touch insertion / removal component pull-out iron tip 9. Since all of these are types of iron tips that can be inserted and removed with one touch, it is important to prepare a type of iron tips suitable for the purpose of use and increase the number of types. For example, the one-touch insertion / removal type component withdrawing iron tip 9 shown in FIG. 2D is effective for removing a lead type resistor or a diode soldered to a printed circuit board, for example. The bent portion 23 at the tip of the iron tip of the one-touch insertion / removal type component withdrawing iron tip 9 is hooked on the lead portion, and the lead of the component is pulled out by the bent portion 23 when the solder is melted. You can easily remove the lead of the component. Therefore, it is not necessary to use a solder sucker or a molten solder bath,
Various electronic components and the like can be easily and effectively removed.

<Embodiment 2> FIG. 3 is a schematic view showing an example of the structure of a soldering iron for exclusive use in solder release used in this embodiment. By using this soldering iron, especially a DIP type IC is used.
A method of removing 16 from the printed circuit board 17 will be described as an example. In the figure, the fitting convex portion 19 of the one-touch insertable / removable iron tip 6 is removably fitted into the fitting concave portion 20 of the heat radiating portion 10 provided in the handle 11.
The protruding portion 21 is engaged with and fixed to the recessed portion 22 of the heat dissipation portion 10. In the above soldering iron, the one-touch insertable / removable iron tip 6 may be removably fitted to the heat dissipation portion 10 provided on the handle 11 and screwed. The one-touch insertable / removable iron tip 6 is provided with a spring 13 required to hold the DIP type IC 16 by using two iron tips 12, and the support post 14 is 2
It is a member that supports the iron tip 12 of a sheet. Two iron tips 12
Applies heat to the pins of the IC to melt the solder, and
It is a soldering iron tip that works to hold. Next, a so-called solder release method of removing the DIP type IC 16 from the printed board 17 using the above soldering iron will be described. First, as shown in FIG. 4A, two iron tips 12
The DIP type IC on the printed circuit board 17 from which the solder is removed
16 is made to approach in the direction shown by an arrow. Next, in order to open the two iron tips 12, one side of the two iron tips 12,
Fix the DIP type IC 16 by touching the entire one side of the pin and applying force to the soldering iron handle 11 to the other iron tip 12
A little, and as shown in Fig. 4 (b), two iron tips 1
Leave a space of 2 between the pins on both sides of the DIP IC 16 and
Insert the iron tip 12 so that it touches it. In the state shown in FIG. 4B, the pins of the DIP type IC 16 are heated and held until the solder attached to the pins melts. Next, when the solder melts, use tweezers 18 etc. to remove the DIP type IC.
The DIP type IC 16 can be removed from the printed circuit board 17 by lifting the soldering iron in the direction of the arrow shown in FIG. As described above, the solder release method of the present invention can easily perform the solder release by an inexpensive method without requiring an expensive solder sucker or a molten solder bath.

[0008]

As described above in detail, the iron tip one-touch insertion / removal type soldering apparatus of the present invention and the soldering or solder releasing method using the same have the following effects. (1) In the soldering work, the iron tip of the soldering iron can be replaced with one touch according to the purpose of use, and even when the soldering iron is heated, it can be easily replaced and the soldering work efficiency is improved. improves. (2) Even when replacing an oxidized old iron tip with a new iron tip, it can be easily replaced with one touch. (3) By replacing the shape of the iron tip with the one-touch insertion / removal type component pull-out iron tip, it can be used as a jig for removing the component soldered to the printed board. (4) Even when removing a soldered electronic component such as a DIP type IC, by using a soldering iron with a soldering iron tip matching the pin arrangement of the electronic component, an expensive solder sucker or molten solder is used. Solder removal can be performed easily and inexpensively without using a bath, and the working time can be significantly shortened. (5) Since it is a small-sized and lightweight solder attaching or detaching device, it can be easily carried and applied anywhere.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of a soldering iron one-touch insertion / removal type soldering device exemplified in a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing a configuration of a one-touch insertion / removal iron tip used in the iron tip one-touch insertion / removal soldering device exemplified in the first embodiment of the present invention.

FIG. 3 is a schematic diagram showing a configuration of a one-touch insertion / removal type solder removal iron tip having a structure suitable for removing an electronic component such as a DIP type IC exemplified in the second embodiment of the present invention.

FIG. 4 is a process diagram showing an order of removing electronic components such as a DIP type IC illustrated in the second embodiment of the present invention.

FIG. 5 is a schematic diagram showing a configuration of a conventional soldering iron.

[Explanation of symbols]

 1 ... Iron tip 2a, 2b ... Screw 3 ... Heat dissipation part 4 ... Handle 5 ... Heat dissipation rod 6 ... One-touch insertion / removal iron tip 7 ... Spring 8 ... Metal member 9 ... One-touch insertion / removal component extraction iron tip 10 ... Heat dissipation portion 11 ... Handle 12 ... Iron tip 13 ... Spring 14 ... Strut 15 ... Iron tip 16 ... DIP type IC 17 ... Printed circuit board 18 ... Tweezers 19 ... Fitting convex portion 20 ... Fitting concave portion 21 ... Projection portion 22 ... Recess (concave) Part 23 ... bent part 24 ... electric cord

Claims (5)

[Claims] 1. Bonding of a structure in which a plurality of soldering iron tips having a shape adapted to a soldering portion or a solder releasing portion of an electronic component or the like are provided, and these soldering iron tips are removably fitted and supported and fixed. Iron tip insertion / removal type soldering device characterized in that a portion is provided on a soldering iron main body. 2. The joint portion of the structure according to claim 1, wherein the iron tip is removably fitted and fixed, and the iron tip provided with a protrusion serves as a fitting protrusion and is provided inside the soldering iron body. In the fitting recess composed of the spring, the metal member and the recess,
By fitting the fitting convex portion, the elastic force of the spring provided in the fitting concave portion and the metal member hold the iron tip in a pressing state, and there is no detaching force when the iron tip is detached. A soldering tip insertion / removal type soldering device having a structure in which a protrusion of the iron tip is engaged with and fixed to a recess provided in the fitting recess. 3. A soldering iron tip according to claim 1, wherein the plurality of types of soldering iron tips to be mounted on the soldering iron are a soldering solder soldering iron tip having a predetermined shape dedicated to soldering and a soldering iron soldering tip having a predetermined soldering tip. Insertable and detachable soldering device. 4. A soldering and soldering method, characterized in that a soldering device for inserting and removing soldering iron according to any one of claims 1 to 3 is used for soldering or removing a solder from an electronic component or the like. How to leave. 5. The method for removing solder of an electronic component or the like according to claim 4, comprising two iron tips having a shape adapted to the arrangement of pins of the soldered electronic component. , A soldering iron tip that is arranged on a supporting member that can be removably fitted and fixed to the soldering iron body, and that has a structure that can be opened and closed in a hinge shape by utilizing the elasticity of a spring is used. Aligning the two iron tips with the pins of the soldered electronic component and holding the pins with the two iron tips, and heating the iron tips with the two iron tips held And a step of melting the solder of the soldering part and a step of removing the electronic component after the solder is melted are used at least, and a solder releasing method.