JPH07230943A - Field emission electron source array and display device - Google Patents

Abstract

(57) [Abstract] [Purpose] To realize a flat display element capable of displaying on a large screen using a field emission electron gun. [Structure] A plurality of electron source array substrates 11 each having an electron gun 15 formed in a matrix are arranged on a support substrate 20,
Form a large substrate. The plurality of array substrates 11 are electrically connected to each other so that the same function as when the electron gun 15 is formed on a single large substrate is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field emission type electron source array in which a plurality of substrates each having a large number of minute field emission type electron guns arranged in a matrix form (two-dimensional plane form) are arranged on the same plane. The present invention relates to a flat display device using a field emission type electron source array.

[0002]

2. Description of the Related Art With the recent progress in fine processing technology used in the fields of integrated circuits and thin films, the manufacturing technology of a field emission type electron source that emits electrons in a high electric field has been rapidly advanced recently. As an example, a field emission type electron gun having a minute structure has been manufactured.

Such a field emission type electron gun is composed of an emitter for emitting electrons and a gate electrode for extracting electrons. By arranging a large number of field emission electron guns of this type on the same plane and controlling the drive of each by XY matrix drive, the electron gun at a desired position can be operated.

Then, when a transparent substrate having a fluorescent layer is arranged to face the surface side of an electron gun array (electron source array) having a large number of field emission electron guns formed, fluorescence is emitted by electrons emitted from the electron gun array. Since the layers emit light, a flat display element is realized.

A method of manufacturing a flat display element using a field emission electron gun array and its operating characteristics are described in, for example, International Conference on Vacuum Microelectronics 91 (IV).
MC91). It is disclosed in the research report published by MEYER et al.

FIGS. 11 and 12 show a self-luminous flat display element using a phosphor. 1 electron gun array
It is composed of a single array substrate 11. Array substrate 1
The reference numeral 1 indicates that a plurality of emitter electrodes (emitter electrode lines) 13 and a plurality of gate electrodes (gate electrode lines) 14 orthogonal to the emitter electrodes (emitter electrode lines) 13 are formed on the surface (upper surface) of a substrate 12, and at their intersections. The electron gun 15 is formed in a matrix. The emitter electrode 13, the gate electrode 14, and the adjacent gate electrodes are electrically insulated by the insulating layer 16.

The above electron gun array is shown in FIG.
It is produced by the process according to (F).

First, as shown in FIG. 13A, a thin metal film (molybdenum) to be the emitter electrode 13 is formed in a line on the surface of a substrate 12 made of, for example, quartz. Subsequently, as shown in FIG. 13B, in order to maintain electrical insulation from the line-shaped metal thin film, silicon dioxide to be the insulating layer 16 is formed on the substrate 12 from above to a thickness of about 1.5 μm. To stack.

Next, as shown in FIG. 13C, 100 nm of aluminum 17 is laminated on the insulating layer 16 for etching mask and lift-off in a later step, and then a circular shape having a diameter of 1 μm is formed on the surface thereof. The pattern is formed in a negative state. Then aluminum 17 and insulating layer 16
Are sequentially etched to form holes 19.

Next, while rotating the substrate 12 in a horizontal plane, molybdenum 18 serving as an electron gun material is vapor-deposited from a direction perpendicular to the substrate surface to form an electron gun 15 in the hole 19 (see FIG. 13 ( D)). After that, as shown in FIG. 13E, the aluminum 17 is dissolved by phosphoric acid to remove unnecessary substances on the insulating layer 16. Finally, as shown in FIG. 13F, the gate electrode 1 is formed on the exposed surface of the insulating layer 16.
A metal thin film (molybdenum) to be 4 is formed in a line shape. As a result, the electron gun array shown in FIGS. 11 and 12 is manufactured.

When the electron gun array having such a structure is applied to a flat display element, a phosphor is arranged on an upper portion corresponding to an electron emission side. In addition, a driving circuit is arranged around it, and when the XY matrix drive is performed with the emitter electrode 13 as the data line and the gate electrode 14 as the scanning line, the electron gun at a predetermined position is driven, and the electron gun is driven upward. Electrons are emitted toward. Then, the phosphor with which the emitted electrons collide emits light, and the function as a display element is thereby exhibited.

By the way, the conventional fluorescent display tube performs the display function by causing each pixel to emit light by electron-optically focusing and scanning the electron beam emitted from the dot-shaped electron gun. On the other hand, this display element, by independently scanning a large number of electron guns arranged in a matrix,
It is possible to make the pixels corresponding to each emit light. Therefore, according to the above display element, while maintaining the performance equivalent to that of the conventional fluorescent display tube, the condensing optical system etc. are not necessary, and since it has a planar structure, it can be significantly thinned and reduced in weight. There is an advantage to be.

[0013]

However, the conventional electron gun array is composed of one array substrate 11. Therefore, when manufacturing a large-sized display element, a large-sized array substrate 11 in which an extremely large number of electron guns 15 are formed on a large-area substrate 12 is required. The production of such a large array substrate 11 leads to an increase in the size of a manufacturing apparatus and a reduction in yield. For this reason, there is a limit to the size increase of the array substrate 11, which has been a bottleneck in increasing the size of the electron gun array and hence the flat display element.

The present invention solves the above-mentioned problems of the prior art, and an object thereof is a field emission type which can easily manufacture a large-sized display screen with excellent display quality at a low cost. An object of the present invention is to provide an electron source array and a display device using the field emission type electron source array at a low cost and a high yield.

[0015]

In the field emission type electron source array of the present invention, a plurality of substrates each having a large number of electron guns for emitting electrons based on the principle of field emission are formed in a matrix on the same plane. The above-mentioned objects are achieved thereby.

Preferably, the plurality of substrates are electrically connected and the electron gun is driven in an XY matrix.

The field emission type electron source array of the present invention is an electric field obtained by arranging a plurality of substrates, each of which has a plurality of electron guns emitting electrons based on the principle of field emission, formed in a matrix on the same plane. In the emission electron source array, a connection space in which the electron gun does not exist is provided in a peripheral portion of the substrate, and the electron gun is arranged in the connection space in the XY direction.
The electrode line for matrix driving is extended, and a connecting portion having good wettability with solder is provided in a portion of the electrode line located between the substrates, thereby achieving the above object. .

Further, in the display element of the present invention, a plurality of electron guns for emitting electrons based on the principle of field emission are arranged on the same plane with a plurality of substrates each formed in a matrix. Phosphors are arranged opposite to each other on the substrate, whereby the above object is achieved.

Preferably, the electron emission sources formed on the substrate are housed in one vacuum container.

Preferably, the vacuum container is composed of a supporting substrate on which the plurality of substrates are arranged and a substrate having a phosphor surface.

Further, preferably, the electron emission sources have the same shape.

Further, preferably, the peripheral portion of the supporting substrate has the same thickness as the electron emission source, and the electrode line is formed on the peripheral portion.

Preferably, the material of the supporting substrate is the same as the material of the substrate.

Further, preferably, in the peripheral portion of the substrate,
A connection space in which the electron gun does not exist is provided, and an electrode line for driving and driving the electron gun in an XY matrix is extended to the connection space, and the electrode line is located between the substrates. In addition, a connection portion having good wettability with solder is provided.

The display element of the present invention is a field emission type electron source array in which a plurality of electron guns for emitting electrons based on the principle of field emission are electrically connected to a plurality of substrates each formed in a matrix. A support substrate that supports a plurality of substrates that form the field emission electron source array; and a support substrate that is arranged to face the surface side of the field emission electron source array and that constitutes a vacuum container together with the support substrate. And a phosphor-side substrate on which a phosphor layer that emits light by electrons emitted from a large number of electron guns is formed on each of the substrates, thereby achieving the above object.

Preferably, an optical element for correcting the enlarged pixel pitch is provided at the connection portion between the plurality of substrates.

Further, preferably, a deflection electrode for deflecting electrons emitted from an electron gun formed on the substrate is provided as a means for correcting the enlarged pixel pitch in the connection portion between the plurality of substrates.

Further, preferably, the pixel pitch at the peripheral portion of the electron emission source is made narrower than the pixel pitch at the central portion.

[0029]

The field-emission electron source array of the present invention has a structure in which a plurality of substrates having a large number of electron guns for emitting electrons are arranged on the same plane based on the principle of field emission. By properly electrically connecting the substrates, it is possible to perform a display operation in a large area using a plurality of small substrates without impairing the display performance. That is, it is possible to exhibit the same characteristics as when using a single large substrate.

Further, by disposing the phosphor surface facing such a field emission type electron source array, it is possible to obtain a large area flat display element.

[0031]

EXAMPLES Examples of the present invention will be described below.

1 and 2 show an embodiment of a flat type display device using the field emission type electron source array of the present invention.

As shown in FIGS. 1 and 2, the display element includes a plurality of field emission type electron source array substrates 11, 11, ...
An electron source array 10 in which (individual substrates on which a large number of electron guns are formed is called an electron source array substrate) are arranged in the same plane and electrically connected to each other, and a single substrate for supporting the electron source array 10 are provided. It has one support substrate 20 and a phosphor-side substrate 30 which is arranged opposite to the front surface side (upper surface side) of the electron source array 10 with a slight gap. As shown in FIG. 1 (B),
The electron source array substrate 11 and the phosphor-side substrate 30 are arranged so as to face each other with an adhesive layer 33 and a plurality of spacers 40 in between.

The electron source array 10 of this embodiment is composed of 3 × 3 electron source array substrates 11, 11, ... As shown in FIG. 3, each electron source array substrate 11 is, for example, 70 mm thick with a thickness of 70 mm.
59 A plurality of emitter electrodes 13 and a plurality of gate electrodes 14 orthogonal to the emitter electrodes 13 were formed on the surface of a substrate 12 made of glass (Corning), and electron guns 15 were formed in a matrix at each intersection. It is configured. The emitter electrode 13, the gate electrode 14, and the adjacent gate electrodes are electrically insulated by the insulating layer 16.

The electrode lines (emitter electrode line 13, gate electrode line 14) between the electron source array substrates 11, 11 ... And between the electrode line of the electron source array substrate 11 and the electrode line on the supporting substrate 20. , Are electrically connected by the solder layer 61.

This electron source array substrate 11 is manufactured by referring to FIG.
It is performed according to the above manufacturing process shown in FIG. Therefore, the description is omitted here.

In the display element of this embodiment, a total of nine electron source array substrates 11, 11, ... Are arranged on the same plane, but the number of electron source array substrates 11 is not limited. Absent. For example, in the embodiment shown in FIGS. 4 to 7, the electron source array substrate 11 has 2 × 2, that is, a total of four electron source array substrates 11, 11 ... Are arranged on the support substrate 20. Each electron source array substrate 11 of this display element is also manufactured by the above manufacturing process, and each electron source array substrate 11 is manufactured.
The gate electrode lines 14 and the emitter electrode lines 13 are wired on the quartz substrate 12 at right angles to each other.
The electron gun 15 is formed at the intersection. The connection portion of each wiring is formed on the gate electrode line 14 and the emitter electrode line 13 by a nickel layer 19b and a gold layer 19a.
Are laminated, and a solder layer 61 is formed so as to cover it.

Next, a method for electrically connecting the electron source array substrates 11 to each other will be described with reference to the embodiments shown in FIGS.

First, as shown in FIG. 5, the electron source array substrate 11 is arranged on the same plane at a predetermined interval. Subsequently, a nickel layer 19b having a thickness of about 0.5 to 1 μm is laminated on a connection portion of the electrode lines 13 and 14, that is, an electrode line connection portion located between the substrates so as to obtain wettability of solder in a subsequent process. Then, a gold layer 19a is laminated thereon with a thickness of 0.3 μm in order to prevent oxidation of the nickel layer 19b. This laminating step is performed using the shielding mask 50 shown in FIG.

Next, as shown in FIG. 7A, the solder wires 60, 60 are arranged in the vertical and horizontal directions within the space between the four electron source array substrates 11, 11 ... Arranged at a predetermined space. Subsequently, these solder wires 60, 60 are heated by a laser. The solder wire 60 is melted by this heating, and the melted solder is repelled on the non-wettable quartz substrate 12 to selectively form the solder layer 61 on the nickel layer 19b and the gold layer 19a having good wettability. Then, the electrode lines 13 and 14 are connected between the substrates.

Here, the size of the electron source array substrate 11 is
Regarding the number of electron guns and the like, taking the embodiment of FIGS. 1 to 3 as an example,
The size of each electron source array substrate 11 is 6
The size is 0.8 mm × 83.6 mm, and the number of electron guns 15 formed on the electron source array substrate 11 is about 350,000,000.
Is. The emitter electrode 13 and the gate electrode 14 are made of a molybdenum layer having a thickness of 0.4 μm and a width of 0.2 mm. The numbers of the emitter electrodes 13 and the gate electrodes 14 are 160 and 220, respectively, and their pitches are set to 0.38 mm.

As shown in FIG. 2, the electron source array substrate 11
For the electrode connection, the connection space where the electron gun 15 does not exist is provided in the peripheral portion of the surface of the substrate 12.
On the other hand, the emitter electrode 13 and the gate electrode 14 are formed up to the end of the substrate 12. Then, on the emitter electrode 13 line and the gate electrode line 14 particularly 150 μm from the end of the connection space, a nickel layer having a thickness of 0.5 to 1 μm and a gold layer having a thickness of 0.3 μm are laminated to form a solder layer. 1
9 is formed. This stacking is for improving the wettability of the solder and facilitating the connection of the electrode lines in the connection step described later.

Next, the details of the support substrate 20 will be described with reference to FIG. The support substrate 20 has the purpose of forming a vacuum container together with the phosphor-side substrate 30 in addition to the purpose of arranging the plurality of electron source array substrates 11 in an aligned state.
Particularly for the latter purpose, the peripheral portion of the support substrate 20 is
A frame-shaped frame body 21 is attached. A plurality of electron source array substrates 11, 11 ... Which constitute the electron source array 10.
Are arranged in the frame 21.

The supporting substrate 20 and the frame body 21 are made of the same material as the substrate 12 constituting the electron source array substrate 11 so that the electrode line connecting portion will not be broken due to temperature changes in the display element manufacturing process. Preferably. In this example, the same 7059 glass as the substrate 12 was used. Support substrate 2
The size of 0 was 202.4 × 270.8 mm, and the size of the frame body 21 was 1 mm in thickness and 10 mm in width. The frame 21 is attached to the peripheral portion of the substrate 12 by frit glass.

On the surface of the frame body 21, as shown in FIGS. 1 and 8, in order to lead out the emitter electrode line 13 and the gate electrode line 14 of the array substrate 11 to the outside, the lead electrode 22 corresponding to them is formed. Are formed. The material of the extraction electrode 22 is the same molybdenum as the emitter electrode line 13 and the gate electrode line 14, and the width and pitch are also set to the same values. A solder layer 23, which is the same as the solder layer 19 and includes a nickel layer and a gold layer, is provided on the inner side of the lead electrode 22 from the inner edge for connecting the electrodes.
It is formed over a range of 5 mm.

Next, the phosphor side substrate 30 will be described. As shown in FIG. 1, the phosphor-side substrate 30 has a size slightly smaller than that of the support substrate 20 so that the extraction electrode 22 formed on the support substrate 20 is exposed to the outside.
The material of the phosphor side substrate 30 is preferably the same as the substrate 12 of the electron source array substrate 11, and in the present embodiment, the substrate 12 is used.
Same as 7059 glass.

As shown in FIGS. 1 and 9, through holes 3 having an inner diameter of 1 mm are provided at the corners of the phosphor side substrate 30.
4 are provided. The through holes 34 are used for exhausting the vacuum container after formation and for drawing out the electrode lines to the outside. A metallization layer 35 is formed by plating on the inner surface of the through hole 34 and in a region 1 mm around the opening in order to lead the electrode line to the outside. Note that FIG. 6A is a rear view, and the through holes 34 in both figures are the same.

Backside of phosphor side substrate 30 (upper side in FIG. 6)
A transparent electrode 31 made of ITO is formed over the entire surface. The thickness of the transparent electrode 31 is 4 to 6 μm.
The fluorescent layers 32 are laminated except for the peripheral portion of the phosphor-side substrate 30. The phosphor layer 32 is a phosphor having a particle size of about 3 μm.
m ZnO (more specifically, Zn powder and frit glass were mixed in a solution in which a low molecular weight acrylic resin was dissolved in α-terpineol and kneaded well using a ball mill to form a paste). It is formed by applying by screen printing, drying and baking. Further, an adhesive layer 33 is formed on the peripheral portion of the transparent electrode 31 for vacuum sealing. The adhesive layer 33 is formed by applying a frit glass paste by screen printing,
It is formed by drying and calcination. The thickness of the adhesive layer 33 is 120 to 150 μm. The metallized layer 35 is formed after the transparent electrode 31 is formed and is electrically connected to the transparent electrode 31.

The display element shown in FIGS. 1 to 3 is assembled by using each member described above. The assembly process will be described below with reference to FIG.

First, as shown in FIGS. 10A and 10B, 9 electron source array substrates 11 are arranged in a 3 × 3 manner inside the frame 21 on the support substrate 20. At each end of the emitter electrode 13 and the gate electrode 14 of the electron source array substrate 11, a solder layer (connection terminal portion) 19 in which a gold layer 19a is laminated on a nickel layer 19b is formed. Further, the extraction electrode 22 is formed on the surface of the frame body 21 so as to correspond to the emitter electrode 13 and the gate electrode 14 of the array substrate 11, and the solder layer 2 having the same laminated structure as the solder layer 19 is formed thereon.
3 is formed. By disposing the electron source array substrate 11 on the support substrate 20, the emitter electrodes 13, 13 of the adjacent electron source array substrates 11, 11 and the gate electrodes 14, 14 of the adjacent electron source array substrates 11, 11 are butted against each other. Further, the emitter electrode 13 and the gate electrode 14 of the electron source array substrate 11 located on the outside are butted with the corresponding extraction electrodes 22.

When the electron source array substrate 11 is arranged on the support substrate 20, the solder wires 60 continuous in the direction of the emitter electrode 13 and the direction of the gate electrode 14 are placed on the respective abutting portions as described above. , Heating the intersection with the butt section with a laser. The melted solder is repelled on the glass substrate 12 having no wettability, selectively adheres to the solder layers 19 and 23 having good wettability, and the solder layer 61 is laminated on the abutting portion. As described above, when the laminated portions 19 of the nickel layer 19b and the gold layer 19a having good wettability are selectively brought into contact with each other, the adjacent electrode lines do not short-circuit.

Through the above process, as shown in FIG. 2, the emitter electrode 1 of the 3 × 3 electron source array substrate 11 is formed.
The electron source array 10 is manufactured by electrically connecting the electrodes 3 and 13 and the gate electrodes 14 and 14 to each other. Also,
The emitter electrode 13 and the gate electrode 14 of the electron source array 10 are electrically connected to the corresponding extraction electrodes 22 on the frame body 21.

When the electron source array 10 is manufactured on the support substrate 20, next, glass ball spacers 40 having a diameter of 100 μm are scattered on the electron source array 10 as shown in FIG. Then, the phosphor-side substrate 30 is overlaid, and about 0.1 N / cm with respect to the adhesive layer 33 at the outer edge portion.
While applying a pressure of 2, baking is performed in an Ar gas atmosphere to form a vacuum container. Subsequently, while baking is performed in the vacuum chamber, the inside of the vacuum container is evacuated through the through holes 34 of the phosphor side substrate 30, and the sealing portion 36 (see FIG. 1) formed by melting the solder balls in the same vacuum is used for the through. Block the hole 34. As a result, the display element is manufactured.

The completed display element is used as an electron emission source.
60.8 mm × 83. With approximately 10,000 electron guns 15.
The electron gun array 10 is configured by arranging 6 mm electron source array substrates 11 in 3 × 3. Therefore, this display element has about 90,000 electron guns 15, and (60.8
mm × 83.6 mm) × 9 times the effective display area.

Since the nine electron source array substrates 11 constituting the electron gun array 10 are small substrates having the same shape, the productivity of each is good, and therefore the productivity of the electron gun array 10 is also good. Therefore, it has been confirmed that the display element using this has high productivity and operates at a high yield, although it is a large element. By the way, it has about 90,000 electron guns 15 and (60.8m
It is difficult to manufacture a single electron source array having an effective display area of (m × 83.6 mm) × 9 times because there are constraints such as an increase in the size of a manufacturing apparatus and a reduction in yield.

Further, in the above embodiment, a connection space where the electron gun 15 does not exist is provided in the peripheral portion of the electron source array substrate 11, and in the connection space, on the emitter electrode 13 and the gate electrode 14. Since the solder layer 19 having good wettability with the solder is formed, the electrode lines can be easily connected.

Next, the operation of the display element manufactured as described above will be described.

An electron source array 10 including a plurality of electron source array substrates 11, 11 ... Using the emitter electrodes 13 as data lines and the gate electrodes 14 as scanning lines, an XY matrix drive is performed by a drive circuit. As a result, the electron gun 15 at the desired position operates. Operated electron gun 15
The electrons emitted from the collide with the fluorescent layer 32 and cause the portion to emit light. That is, the portion of the fluorescent layer 32 corresponding to the electron gun 15 becomes a pixel.

Although the display device of the above-mentioned embodiment has about 90,000 pixels, the nine electron source array substrates 11 constituting the electron source array 10 have electron guns at the periphery for connecting the electrode lines. The structure is provided with a space where 15 does not exist. Due to this configuration, when electrons are emitted from each electron gun 15 of the electron source array substrate 11 in a direction perpendicular to the plate surface, pixels are missing at a position corresponding to a joint portion (connection portion of electrode lines) of the electron source array substrate 11. Part arises. In other words, the dot pitch of the electron gun 15 and the pixel is widened at the joint portion of the array substrate 11.

In order to correct this, for example, an optical element is used to refract the pixels in the outer peripheral portion to the outside. This apparently eliminates the pixel loss in the joint portion.

In this case, it is preferable that the dot pitch of the electron gun 15 on the outer peripheral portion of the electron source array substrate 11 is narrower than the dot pitch on the inner peripheral portion. That is, if the dot pitch is set as described above, the correction by the optical element becomes easier accordingly, and a simple and inexpensive optical element can be used.

Further, such dot pitch correction is
It is also possible to deflect the electrons emitted from each electron gun 15 of the electron source array substrate 11 by the deflection electrode.

[0063]

[0064]

The field-emission electron source array of the present invention has a structure in which a plurality of substrates each having a large number of electron guns formed in a matrix are arranged on the same plane, so that the respective substrates can be electrically electrically connected appropriately. If they are connected, each electron gun can be driven in the same manner as the case where a large number of electron guns formed on a single large substrate are driven by an XY matrix. In this way, when arranging a plurality of small substrates to increase the size, there is no disadvantage such as a decrease in yield or the need for an increase in the size of the manufacturing apparatus, though there is a problem in manufacturing a large size substrate. Can be improved and the cost can be reduced.

The display element of the present invention is
Since the field-emission electron source array is used, it is possible to realize a large-screen flat display element that can enjoy the above-mentioned effects.

Further, in particular, according to the field emission type electron source array of the third aspect and the display element of the seventh aspect, the electrical connection between the adjacent substrates can be further facilitated, so that the yield can be increased accordingly. Improvement and cost reduction can be achieved.

Further, according to the display element of claim 5 or 6, in particular, since each substrate is housed in a vacuum container in an orderly manner, the electron gun formed on each substrate is not deteriorated. . Therefore, the yield and quality can be improved.

Further, in particular, according to the display element of the ninth or tenth aspect, it is possible to correct the deviation of the dot pitch in the substrate connecting portion, which can greatly contribute to the improvement of the display quality.

[Brief description of drawings]

1A is a schematic plan view showing an embodiment of a display element of the present invention, and FIG. 1B is a sectional view taken along the line AA of FIG.

2A is a plan view showing an embodiment of the display element of the present invention, and FIG. 2B is a sectional view taken along line BB of FIG.

FIG. 3 is a perspective view showing an embodiment of an electron source array substrate used for the display device of the present invention.

4A is a plan view showing another embodiment of the display element of the present invention, FIG. 4B is a sectional view taken along line CC of FIG.
(C) is sectional drawing by the DD line of (A).

5A is a perspective view of an electron source array substrate used in the display element of FIG. 4, and FIG. 5B is a plan view of the display element.

6A is another plan view of the display element shown in FIG. 4, FIG. 6B is a cross-sectional view taken along line EE of FIG. 6A, and FIG. 6C is taken along line FF of FIG. FIG.

7A is a plan view showing a state where solder wires are formed on the display device shown in FIGS. 1 to 3, and FIG. 7B is a view showing FIG.
Is a cross-sectional view taken along the line GG of FIG.

FIG. 8A is a schematic plan view showing an extraction electrode provided in the display element of the present invention, and FIG. 8B is a sectional view taken along line JJ of FIG.

9 (A) is a rear view of FIG. 1 (A), and FIG. 9 (B) is (A).
3 is a cross-sectional view taken along line KK of FIG.

FIG. 10 is a cross-sectional view showing a process of assembling the display element of the present invention.

FIG. 11 is a perspective view showing a conventional electron gun array.

FIG. 12 is a cross-sectional view schematically showing the structure of a substrate used for an electron gun array.

FIG. 13 is a cross-sectional view showing the manufacturing process of the substrate.

[Explanation of symbols]

 10 Electron Source Array 11 Electron Source Array Substrate 13 Emitter Electrode (Emitter Electrode Line) 14 Gate Electrode (Gate Electrode Line) 15 Electron Gun 16 Insulating Layer 20 Supporting Substrate 21 Frame 22 Extraction Electrode 23 Solder Layer (Connection Terminal) 30 Fluorescence Body side substrate 31 Transparent electrode 32 Fluorescent layer 33 Adhesive layer 34 Through hole 35 Metallized layer 40 Spacer 50 Shielding mask 60 Solder wire 61 Solder layer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication location H01J 31/15 C (72) Inventor Morinori Yano 22-22 Nagaike-cho, Abeno-ku, Osaka-shi, Osaka Incorporated (72) Inventor Masayoshi Kiba 22-22 Nagaike-cho, Abeno-ku, Osaka-shi, Osaka

Claims (10)

[Claims] 1. A field-emission electron source array in which a plurality of electron guns for emitting electrons based on the principle of field emission are arranged on the same plane, with a plurality of substrates each formed in a matrix. 2. The field emission electron source array according to claim 1, wherein the plurality of substrates are electrically connected to each other and the electron gun is driven in an XY matrix. 3. A field emission type electron source array in which a plurality of electron guns for emitting electrons based on the principle of field emission are arranged on the same plane, and a plurality of substrates each formed in a matrix are arranged on the same plane. A connection space in which the electron gun does not exist is provided in the peripheral portion of, and an electrode line for driving the electron gun in an XY matrix is extended in the connection space.
A field emission type electron source array in which a connection portion having good wettability with solder is provided in a portion of the electrode line located between the substrates. 4. A plurality of electron guns that emit electrons based on the principle of field emission are arranged on the same plane with a plurality of substrates each formed in a matrix, and phosphors are arranged opposite to these substrates. Display element. 5. The display device according to claim 4, wherein the electron emission sources formed on the substrate are housed in one vacuum container. 6. The display element according to claim 5, wherein the vacuum container is formed by stacking a support substrate on which the plurality of substrates are arranged and a substrate having a phosphor surface. 7. A connection space in which the electron gun does not exist is provided in the peripheral portion of the substrate, and an electrode line for driving the electron gun in an XY matrix drive is extended in the connection space. 7. The display element according to claim 4, wherein a connection portion having good wettability with solder is provided in a portion of the electrode line located between the substrates. 8. A field emission electron source array in which a plurality of electron guns for emitting electrons based on the principle of field emission are electrically connected to a plurality of substrates each formed in a matrix, and the field emission electron. A support substrate that supports a plurality of substrates that form the source array, and a support substrate that is disposed opposite to the front surface side of the field emission electron source array, forms a vacuum container together with the support substrate, and is formed on each of the plurality of substrates. And a phosphor side substrate on which a phosphor layer emitting light by electrons emitted from a large number of electron guns is formed. 9. The display element according to claim 4, further comprising an optical element that corrects an enlarged pixel pitch in a connection portion between the plurality of substrates. 10. A deflection electrode for deflecting electrons emitted from an electron gun formed on the substrate is provided as a means for correcting an enlarged pixel pitch in a connection portion between the plurality of substrates. ~ The display element according to claim 8.