JPH07254804A - Dielectric resonator and its mount structure - Google Patents

Abstract

PURPOSE:To provide the dielectric resonator and its mount structure in which a conventional metallic case is not required, working man-hour of the dielectric resonator and its manufacture cost are educed and the mount to the mounting board is facilitated. CONSTITUTION:An outer conductor and a solder bump 7 are formed to an outer side of a dielectric block in which metallic pins 13a, 13b being signal input and output terminals are projected and the dielectric resonator is connected to a ground conductor on the mount board 14 via the solder bump 7. When the dielectric resonator is mounted on the mount board, since the resonator is connected to the surface of the mount board via the solder bump 7, a metallic case having been required for a conventional resonator is not required and the working man-hour of the dielectric resonator and its manufacture cost are reduced and the mount of the dielectric onto the mount board is facilitated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric resonator device in which an inner conductor is provided in a dielectric block and an outer conductor is formed on the outer surface of the dielectric block, and a mounting structure for the mounting substrate.

[0002]

2. Description of the Related Art A dielectric resonator device having an inner conductor formed inside a dielectric block and an outer conductor formed on the outer surface of the dielectric block is used, for example, as a filter or a resonator in the microwave band.

FIG. 8 is an exploded perspective view showing the structure of a conventional dielectric resonator device. As described above, the dielectric resonator device includes the dielectric block 1 and the signal input / output terminal 1 on which various conductors are formed.
0a, 10b and a metal case 20. An inner conductor forming hole 2 having an inner conductor formed on the inner surface of the dielectric block 1.
A coupling hole 22 in which a conductor is not formed is provided on a and 2b and the inner surface, and the outer conductor 6 is formed on the other five surfaces except the upper surface in the drawing. The signal input / output terminals 10a and 10b are metal pins 13.
It is composed of a and 13b and pin holding portions 11a and 11b made of synthetic resin for insulating and holding them in the center. Further, a part of the metal case 20 is projected as four terminals 21. When assembling these parts, the two signal input / output terminals 10a and 10b are connected to the inner conductor forming hole 2 of the dielectric block.
a, 2b, and a metal case 20 is further covered from above, and the metal case 20 is covered with the outer conductor 6 of the dielectric block.
One dielectric resonator device is constructed by soldering to. When mounting such a conventional dielectric resonator device on a mounting substrate, the metal pins 13a and 13b are mounted.
The terminal 21 and the terminal 21 are inserted into the holes provided in the mounting board and soldered to mount the terminals.

[0004]

However, in such a conventional dielectric resonator device, the dielectric resonator device itself has a complicated shape and the number of manufacturing steps is large.
However, not only the number of parts is increased, but also the number of steps for attaching the metal case to the dielectric block is increased, which causes the manufacturing cost to be increased. Further, when mounting such a conventional dielectric resonator device on a mounting board, a metal case terminal 21 is mounted on the mounting board side.
There is also a problem that it is necessary to form a hole for receiving the solder, and there are many soldering points required for mounting the hole.

An object of the present invention is to eliminate the conventional metal case, reduce the man-hours for manufacturing the dielectric resonator device and the manufacturing cost thereof, and further facilitate the mounting on the mounting substrate. It is to provide a device and its mounting structure.

[0006]

According to a first aspect of the present invention, there is provided a dielectric resonator device, wherein a plurality of voids, each having an inner conductor formed on its inner surface, are provided in the dielectric block, and the outer surface of the dielectric block is provided. In the dielectric resonator device, wherein an outer conductor is formed on the inner conductor, and a signal input / output terminal for generating a capacitance between the inner conductor and the inner conductor is protruded from the opening of the gap, the signal input / output of the dielectric block. It is characterized in that a solder bump is formed on the outer surface of the protruding terminal.

A dielectric resonator device according to a second aspect of the present invention is the dielectric resonator device according to the first aspect, wherein a plurality of solder bumps are concentratedly arranged in the peripheral portion of the signal input / output terminal.

According to a third aspect of the dielectric resonator device mounting structure of the present invention, a plurality of voids, each having an inner conductor formed on its inner surface, are provided in the dielectric block, and an outer conductor is formed on the outer surface of the dielectric block. A mounting structure for a mounting board of a dielectric resonator device, in which a signal input / output terminal in which a capacitance is generated between the inner conductor and the inner conductor is projected from an opening of the gap,
A solder bump is formed on an outer surface of the dielectric block from which the signal input / output terminal projects, and an outer conductor of the dielectric block is joined to a conductor on the mounting substrate by melting the solder bump.

[0009]

In the dielectric resonator device according to the first aspect of the present invention, the inner conductor is formed on the inner surface of the plurality of voids provided in the dielectric block, and the outer conductor is formed on the outer surface of the dielectric block. Has been done. Then, in the state where the signal input / output terminal is inserted into the gap, an electrostatic capacitance is generated between the signal input / output terminal and the inner conductor, and the signal input / output terminal and the inner conductor are electrostatically coupled. In this invention, since the solder bumps are formed on the outer surfaces of the signal input / output terminals of the dielectric block that project, when the dielectric resonator device is mounted on the mounting board, the solder bumps are connected to the surface of the mounting board via the solder bumps. It will be fixed. Moreover, since the dielectric block device is not mounted on the mounting substrate by using only the signal input / output terminals, the dielectric block itself is bonded to the surface of the mounting substrate via solder bumps. It is possible to sufficiently increase the bonding strength with the mounting board,
There is no stress concentration on the signal input / output terminals, and the characteristics change little even in response to external environment such as vibration or shock.

In the dielectric resonator device according to a second aspect of the present invention, since the plurality of solder bumps are concentrated in the peripheral portion of the signal input / output terminal, the outer conductor of the dielectric resonator in the vicinity of the signal input / output terminal is arranged. The electrical connection between the mounting boards becomes reliable, and stable characteristics are obtained.

In the mounting structure of the dielectric resonator device according to the third aspect, the solder bump formed on the protruding outer surface of the signal input / output terminal of the dielectric block is bonded to the conductor on the mounting substrate by melting. As a result, the outer conductor of the dielectric block and the conductor on the mounting board are electrically and mechanically connected via the solder bump.

[0012]

1 to 4 show the structure of a dielectric resonator device according to an embodiment of the present invention.

FIG. 1 is an external perspective view of the dielectric resonator device, and FIG. 2 is an exploded perspective view of the dielectric resonator device. Thus, the dielectric resonator device is basically constructed by inserting the two signal input / output terminals 10a and 10b into the dielectric block 1. The dielectric block 1 has a rectangular parallelepiped shape, and as shown in FIG. 2, the inner conductor forming holes 2a, 2 are formed in the vertical direction in the figure.
b is formed, the inner conductor is formed on the inner surface thereof, and the outer conductor 6 is formed on the outer surface (six surfaces) of the dielectric block. Further, a plurality of solder bumps 7 are provided on the protruding outer surface (upper surface in the drawing) of the signal input / output terminal. On the other hand, the signal input / output terminals 10a and 10b hold metal pins 13a and 13b at the centers of cylindrical pin holding portions 11a and 11b made of synthetic resin, and project one end thereof. Further, a rib 12 for press fitting is provided on the outer circumference of the pin holding portions 11a and 11b.
a and 12b are formed. The signal input / output terminals 10a and 10b thus configured are press-fitted into the inner conductor forming holes 2a and 2b of the dielectric block to be fixedly integrated as shown in FIG.

FIG. 3 is a sectional view of the YY portion in FIG. On the inner surface of the inner conductor forming holes 2a, 2b, 5a,
Reference numerals 5b denote gaps between the inner conductors. By thus partially deleting the inner conductors, the inner conductors 3a-4a and the inner conductors 3b-4b are separated from each other. Of these, the inner conductors 3a and 3b act as resonance conductors, respectively, and stray capacitance is generated between the open ends of the inner conductors 3a and 3b and the inner conductors 4a and 4b. The upper end surface in the figure is the outer surface from which the signal input / output terminals project, and a plurality of solder bumps 7 are formed on this surface. As will be described later, the solder bump is used as the outer conductor 6.
Solder-welded conductors are formed on the surface, and a solder flow prevention film 8 is formed on the portions excluding these solder-welded conductors.

FIG. 4 is a plan view of the solder bump forming surface.
Thus, when a plurality of solder bumps 7 are dispersedly arranged on a plane, the stress received by each solder bump is efficiently dispersed by centrally arranging the solder bumps 7 around the solder bump forming surface and the peripheral portion of the signal input / output terminal. In addition, the solder bumps arranged in the ring shape around the signal input / output terminals are electrically connected to the outer conductor on the mounting board at that portion, so that the earth connection can be secured and the characteristics can be stabilized. it can.

Next, FIGS. 5 and 6 show a mounting structure of the dielectric resonator device shown in FIGS. 1 to 4 on a mounting substrate.

FIG. 5 is a cross-sectional view of the dielectric resonator device shown in FIG. 1 mounted on a mounting substrate with the upper surface facing down. In the figure, 14 is a mounting board,
The ground conductor 15 and the signal transmission conductors 16a, 1 are provided on the front and back surfaces thereof.
6b is formed. The solder bumps 7 provided on the dielectric resonator device are melted and connected to the ground conductor 15 on the mounting substrate. Also, the metal pins 13a, 1 of the signal input / output terminals
3b is terminal insertion holes 23a and 23b provided on the mounting substrate 14.
The signal transmission conductor 1 on the back side of the mounting board in the state of being inserted into
6a and 16b are soldered with solder 17a and 17b.

FIG. 6 is an enlarged view of a portion indicated by A in FIG. In the figure, 9 is a solder-welded conductor formed on the surface of the outer conductor 6 on the dielectric resonator side, and 8 is a solder flow prevention film. Further, 19 is a solder-welded conductor formed at a predetermined position of the ground conductor 15 on the mounting board side, and 18 is a solder flow prevention film. In this way, the dielectric resonator device is aligned and placed on the mounting substrate on which the solder-welded conductor 19 and the solder flow prevention film 18 are formed, and the solder bumps are melted and joined by heating. In FIG. 6, the solder-welded conductors 9 and 19 are formed by vapor deposition of conductors composed of three layers of Cr-Rh-Au. The Rh layer acts as a barrier metal, and the Cr layer serves as Rh and the base film (earth conductor 15).
Alternatively, the adhesion with the outer conductor 6 (Ag conductor film) is increased,
The Au layer acts as an antioxidant film for Rh. The solder bumps 7 are formed by welding on the solder-welded conductor 9 by a dip method. At this time, the solder flow prevention film 8 acts to form solder bumps of a predetermined shape without welding the solder to unnecessary portions. A method of forming solder bumps on the dielectric resonator device is described in, for example, Research Practical Report Vol. 26, No. 6 (19).
1977), reprint, pages 1603 to 1629, "Solder fused connection type hybrid IC structure", can be applied.

When aligning the dielectric resonator device with the mounting substrate, the positional relationship between the solder bumps on the dielectric resonator device side and the metal pins of the signal input / output terminals, and the solder-welded conductors and terminals on the mounting substrate side. The positional accuracy with respect to the insertion holes 23a, 23b is previously enhanced, and the metal pins 13a,
By making the outer diameter of 13b and the inner diameters of the terminal insertion holes 23a, 23b substantially equal to each other, it is possible to complete the alignment of both by simply inserting the metal pins 13a, 13b into the terminal insertion holes 23a, 23b of the mounting board. .

Next, FIG. 7 shows an example of a mounting structure for a mounting substrate of dielectric resonator devices having different shapes. The difference from the embodiment shown in FIG. 5 is the shape of the pin holding portion of the signal input / output terminal and the shape of the inner conductor forming hole of the dielectric block. In the example shown in FIG. 7, the inner conductor forming holes 2a and 2b of the dielectric block 1 have a step structure, and flange portions are formed on the pin holding portions 11a and 11b of the signal input / output terminals. It is fixed to the step portions of the inner conductor forming holes 2a and 2b. By doing this,
The insertion depth of the signal input / output terminal with respect to the inner conductor forming hole can be made constant, and furthermore, the pin holding portions 11a, 11b do not project to the outer surface of the dielectric block where the signal input / output terminal projects, so that the metal pin 13, It is possible to have a structure in which only 13b is projected.

In the embodiment, Cr is used as the solder welding conductor.
Although the conductor having a three-layer structure of -Rh-Au is used, Cr, Ti or Ni may be used as the barrier metal, and Ni or Cu may be used as the metal having high solder wettability, and the three-layer structure is not always required. It does not need to be structured. As the solder bump, In—Pb solder may be used instead of Sn—Pb solder. Further, the solder bump is formed by plating a solder film having an area larger than that of the solder bump welded conductor and then heating the whole to form the solder bump, or by forming a standoff by plating Cu or the like. A method of forming by attaching solder to the off portion may be used.

[0022]

According to the dielectric resonator device according to the first aspect of the invention and the mounting structure of the dielectric resonator device according to the third aspect, the solder is attached to the protruding outer surface of the signal input / output terminal of the dielectric block. Since the bumps are formed, when the dielectric resonator device is mounted on the mounting board, it is connected and fixed to the surface of the mounting board via the solder bumps. Therefore, the conventional metal case is not necessary, and accordingly, the number of processing steps of the dielectric resonator device and the manufacturing cost thereof are reduced, and the mounting on the mounting substrate is facilitated. Moreover, instead of mounting the dielectric resonator device on the mounting substrate using only the signal input / output terminals, the dielectric block itself is bonded to the surface of the mounting substrate via solder bumps, so The bonding strength with the substrate can be sufficiently increased, stress concentration on the signal input / output terminals can be avoided, and characteristic changes can be reduced even in response to external environments such as vibration and shock.

According to the dielectric resonator device of the second aspect, since the plurality of solder bumps are concentratedly arranged in the peripheral portion of the signal input / output terminal, the outer conductor of the dielectric resonator near the signal input / output terminal. The electrical connection between the mounting substrates of is assured, and stable characteristics are obtained.

[Brief description of drawings]

FIG. 1 is an external perspective view showing the structure of a dielectric resonator device according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the dielectric resonator device shown in FIG.

FIG. 3 is a cross-sectional view taken along the line YY in FIG.

FIG. 4 is a plan view of the dielectric resonator device shown in FIG.

5 is a sectional view of the dielectric resonator device shown in FIG. 1 in a mounted state on a mounting substrate.

FIG. 6 is an enlarged view of a portion A of FIG.

FIG. 7 is a cross-sectional view showing a mounting structure of a dielectric resonator device according to another embodiment on a mounting substrate.

FIG. 8 is an exploded perspective view of a conventional dielectric resonator device.

[Explanation of symbols]

 1-Dielectric block 2a, 2b-Inner conductor forming hole 3a, 3b, 4a, 4b-Inner conductor 5a, 5b-Gap portion 6-Outer conductor 7-Solder bump 8-Solder flow prevention film 9-Solder welding conductor 10a, 10b-Signal input / output terminal 11a, 11b-Pin holding part 12a, 12b-Rib 13a, 13b-Metal pin 14-Mounting board 15-Ground conductor 16a, 16b-Signal transmission conductor 17a, 17b-Solder 18-Solder flow prevention film 19-Solder welding conductor 20-Case 21-Terminal 22-Coupling hole 23a, 23b-Terminal insertion hole

Claims (3)

[Claims] 1. A plurality of voids, each having an inner conductor formed on its inner surface, are provided in a dielectric block, and an outer conductor is formed on the outer surface of the dielectric block, so that capacitance is generated between the inner block and the inner conductor. In a dielectric resonator device in which a signal input / output terminal is projected from an opening of the gap, a solder bump is formed on an outer surface of the dielectric block from which the signal input / output terminal is projected. Equipment. 2. The dielectric resonator device according to claim 1, wherein a plurality of the solder bumps are concentratedly arranged in the peripheral portion of the signal input / output terminal. 3. A plurality of voids, each having an inner conductor formed on the inner surface thereof, are provided in the dielectric block, and the outer conductor is formed on the outer surface of the dielectric block, so that capacitance is generated between the inner block and the inner conductor. A mounting structure for a mounting substrate of a dielectric resonator device in which a signal input / output terminal is projected from an opening of the gap, wherein a solder bump is formed on an outer surface of the dielectric block where the signal input / output terminal projects. A mounting structure for a dielectric resonator device, wherein an outer conductor of the dielectric block is joined to a conductor on the mounting substrate by melting the solder bump.