JPH07273578A - Manufacture of packaged piezoelectric oscillator - Google Patents

Abstract

PURPOSE:To reduce the manufacture cost by mass-production. CONSTITUTION:A piezoelectric element is mounted in a groove shaped recessed part 12 made on an upper face of a package body 11 and a cover plate 16 is fixed to an upper part of the package in the package piezoelectric oscillator. After the forming process of a package substrate A with a throughhole B being an array of plural packages 11, a process of forming various electrode films to each package 11, a process mounting a piezoelectric element 13 to each package, and a process fixing a cover to the package substrate, each package piezoelectric oscillator is cut off along with a cut lines E1, E2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a package type piezoelectric oscillator including a piezoelectric element such as a piezoelectric ceramic element.

[0002]

2. Description of the Related Art Conventionally, a package type piezoelectric oscillator of this type has a piezoelectric element on the upper surface of a base substrate made of a dielectric material, as described in, for example, JP-A-59-168713. A ceramic in which both ends of the piezoelectric element are electrically connected to a pair of left and right terminal electrode films formed on the base substrate, while the piezoelectric element on the upper surface of the base substrate is fixed to the upper surface of the base substrate. Although it was configured to be packaged with a cover case made of, this conventional package type piezoelectric oscillator,
There is a problem that the size is increased and the weight is increased.

Therefore, the inventor of the present invention applied to the upper surface of the package body 1 made of a synthetic resin in a chip type as shown in FIGS. 33 to 35 in the previous patent application (Japanese Patent Application No. 5-208075). An inner bottom surface electrode film 4 in which the piezoelectric ceramic element 3 is formed in the groove-shaped recess 2 formed as a recess and the electrode films 3a and 3b at both ends of the piezoelectric ceramic element 3 are formed on the inner bottom surface at both ends of the groove-shaped recess 2 , 5 while being mounted so as to be electrically connected to the package body 1, the connection lower surface electrode films 7a and 8a formed on the lower surface of the package body 1 on the left and right ends of the package body 1, and on the side surfaces of the package body 1. The connecting side electrode films 7b and 8b, the connecting upper surface electrode films 7c and 8c formed on the upper surface of the package body 1, and the inner bottom surface electrode films 4 and 5 on the inner wall surfaces of the groove-shaped recess 2 of the package body 1. Continuously Inner surface electrode film 7 for forming the connection as
After forming a pair of connection electrode film bodies 7 and 8 composed of d and 8d, a lid plate 6 is provided on the upper surface of the package body 1, and the inside of the groove-shaped recess 2 of the package 1 is covered by the lid plate 6. We proposed a package-type piezoelectric oscillator that is fixed in a sealed manner.

[0004]

The package type piezoelectric oscillator according to the invention of the prior application has advantages that it can be made smaller and lighter than conventional ones. However, in the package type piezoelectric oscillator of the invention of the prior application, the package body 1 is molded with a synthetic resin, the connecting electrode film bodies 7 and 8 are formed on the package body 1, and then the package body 1 is formed. The piezoelectric ceramic element 3 in the groove type recess 2 in
The step of fixing the cover plate 6 to the upper surface of the package body 1 after mounting must be performed for each of the package type piezoelectric oscillators, so that the productivity is low and the manufacturing cost is significantly high. It was up to.

An object of the present invention is to provide a method for manufacturing the package type piezoelectric oscillator according to the invention of the prior application at a low cost by a mass production method.

[0006]

In order to achieve this technical object, the present invention provides a "package body substrate in which a plurality of package bodies in a package type piezoelectric oscillator are integrally connected, A step of forming a groove-shaped recess on the upper surface of each package body in each of the package bodies and forming through holes between the package bodies and at both end portions of the groove-shaped recess, and molding with a synthetic resin; Forming a side surface electrode film for connection on the inner surface of the through hole, and forming a strip-shaped lower surface electrode film for connection extending in a direction crossing the groove-shaped recess at each through hole of the lower surface of the package substrate. A step of forming an inner surface electrode film for connection and an inner bottom surface electrode film so as to be continuous with the upper surface electrode film at both ends of each groove-shaped recess in the package body substrate; A step of forming a strip-shaped connecting upper surface electrode film extending in a direction crossing the groove-shaped recess at each of the through holes on the upper surface of the step, and a step of mounting a piezoelectric element in the groove-shaped recess of each package body, And a step of fixing a lid plate substrate that closes the groove-shaped recess in each package body to the upper surface of the package body substrate, and a part between the package body substrate and the lid plate substrate. In the above, the step of cutting each package body is provided. ”

[0007]

By doing so, a plurality of package bodies made of synthetic resin can be molded at once, or various connecting electrode films can be formed to form a plurality of packages. A plurality of package-type piezoelectric oscillators can be manufactured at the same time by making all the bodies at once and cutting the whole package body after fixing the lid plate substrate to the package body substrate. Therefore, the manufacturing cost of the package type piezoelectric oscillator can be significantly reduced by the mass production method.

Further, as described in "Claim 2", in the step of molding the package body substrate, the portion of each package body where the various connection electrode films are formed is plated with a metal capable of being plated. Molding with grade synthetic resin,
Alternatively, a primary molding step of molding a portion where the various connecting electrode films are not formed with a non-plating grade synthetic resin in which metal plating is not possible, and a non-plating portion where the various connecting electrode films are not formed Molded with grade synthetic resin, or with the secondary molding process of forming the above-mentioned various connection electrode film forming parts with plating grade synthetic resin. By forming the step of forming a film into a step of plating a metal on the package body substrate, it is possible to form various connection electrode films for each of the package bodies by plating a metal on the package body substrate. The manufacturing cost can be further reduced because it can be made extremely simple by one process called processing.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. First, FIGS. 1 to 6 show a “package type piezoelectric oscillator 30 with a capacitor function” manufactured according to the first embodiment of the present invention. The "package-type piezoelectric oscillator 30 with a capacitor function" according to the first embodiment includes a package body 11, a piezoelectric ceramic element 13 housed therein, and a cover plate 16 fixed to the upper surface of the package body 11. It consists of the following:

That is, the package body 11 is formed of a synthetic resin into a rectangular chip shape, and groove-shaped recesses 12 are formed in the upper surface of the package body 11. Inner bottom surfaces of the groove-shaped recess 12 at the left and right ends thereof are formed. The inner bottom electrode film for connection 1
4 and 15 are formed respectively. Further, the package body 11 is formed with three connection electrode film bodies 17, 18, and 19, and the three connection electrode film bodies 17, 18, and 19 are formed.
Both of the connection electrode film bodies 17 and 18 at both ends are the connection lower surface electrode films 17a and 18a formed on the lower surface of the package body 11, the connection side surface electrode films 17b and 18b formed on the side surfaces of the package body 11, and the package. Connection terminal electrode film 17c formed on the upper surface of the body 11,
18c and inner surface electrode films 17d and 18d for connection formed on the inner wall surface of the groove-shaped recess 12 of the package 11 so as to be continuous with the inner bottom surface electrode films 14 and 15 for connection, and located at the center. Connecting electrode film body 19
Is composed of a connection lower surface electrode film 19a formed on the lower surface of the package body 11, a connection electrode film 19b formed on the side surface of the package body 11, and a connection upper surface electrode film 19c formed on the upper surface of the package body 11. .

The piezoelectric ceramic element 13 has a rod-shaped ceramic piece 13a, a lower surface side electrode film 13b formed on the lower surface of the ceramic piece 13a so as to extend from one end to the other end, and the ceramic piece. The piezoelectric ceramic element 13 is formed of an upper surface side electrode film 13c formed on the upper surface of 13a so as to extend from the other end toward one end. The piezoelectric ceramic element 13 is inserted into the groove-shaped recess 12 of the package body 11, One end of the lower surface side electrode film 13b is fixed to one of the connection inner bottom surface electrode films 14 in the groove-shaped recess 12 by a conductive adhesive 20, and the other end portion of the upper surface side electrode film 13c is It is fixed to the other connecting inner bottom electrode film 15 in the groove-shaped recess 12 with a conductive adhesive 21.

On the other hand, the lid plate 16 is made of a dielectric material such as barium titanate-based ceramic, and the lower surface of the lid plate 16 serves to provide the lid body 16 with two capacitor functions. The three capacitor electrode films, that is, the capacitor first electrode film 16a, the capacitor second electrode film 16b, and the capacitor third electrode film 16
c is formed.

The cover plate 16 is placed on the upper surface of the package body 11 so as to close the groove-shaped recess 12 in the package body 11, and then fixed with an appropriate adhesive 22. At this time, each of the capacitor first electrode film 16a, the capacitor second electrode film 16b, and the capacitor third electrode film 16c on the lower surface of the lid body 16 is formed on the upper surface of the package body 11 for connection. The upper electrode films 17c, 18c and 19c are configured to be electrically connected.

When manufacturing the "package type piezoelectric oscillator with a capacitor function" according to this structure, first, as shown in FIGS. 7 to 9, a plurality of the package bodies 11 are integrally formed. The package body substrates A formed in series are molded with a synthetic resin. At the time of molding the synthetic resin, at the same time, on the upper surface of each package body 11,
A groove type recess 12 is provided, and each package body 11 is provided.
And the connection electrode film bodies 17, 18,
A through hole B is provided in a portion corresponding to 19 and is molded.

Next, as shown in FIGS. 10 and 11, in each through hole B of the package substrate A, side surface electrode films 17b, 18b, 19 for connection made of metal are formed.
b is formed by filling the through hole B with a metal paste such as silver paste. On the other hand, as shown in FIGS. 12 and 13, on the lower surface of the package substrate A, metal connection lower surface electrode films 17a, 18a and 19a are formed on each of the through holes B by silver paste or the like. It is formed by applying such a metal paste so as to extend in a band shape in a direction crossing the groove-shaped recess 12.

Further, on the upper surface of the package substrate A, as shown in FIGS. 14 and 15, at each of the through holes B, an upper electrode film 17 for connection made of metal is formed.
c, 18c and 19c are formed by applying a metal paste such as a silver paste so as to extend in a strip shape in a direction crossing the groove-shaped recess 12. At this time, the connection inner surface electrode films 17d and 18d and the connection inner bottom surface electrode films 14 and 15 are formed at the both ends of the groove-shaped recess 12 of each package 11 at the same time or by another process. To do.

In this case, the side surface electrode film 1 for connection is formed in each through hole B in the package substrate A.
7b, 18b, 19b, and the lower surface electrode films 17a, 18 for connection to the lower surface of the package substrate A.
a, 19a, a step of forming connection upper surface electrode films 17c, 18c, 19c on the upper surface of the package substrate A, and a connection inner surface electrode film 17d in each groove-shaped recess 12, 18d and inner bottom electrode films 14 and 15 for connection
It is also possible to carry out the steps of forming the above-mentioned steps one after the other, or to carry out two or three steps of them at the same time.

In this case, in another embodiment, the entire package substrate A is, for example, a liquid crystal polymer (LC).
P), polyether sulfone (PES) or polyphenylene sulphite (PPS) etc. by mixing an appropriate amount of a metal catalyst such as palladium or gold into a synthetic resin such as a plating grade synthesis capable of plating a metal. Made of resin, with respect to the entire surface of this package substrate A,
After subjecting the metal to electroless plating or electrolytic plating, the various electrode films 17a, 18 of the plated layer are formed.
a, 19a, 17b, 18b, 19b, 17c, 18
The various electrode films 17a, 18a, 19a, 17b, 18b, 19 are removed by removing the plating layer in the portions other than c, 19c, 17d, 18d and 14, 15 by photo etching or laser trimming.
b, 17c, 18c, 19c, 17d, 18d and 1
It is also possible to form 4, 15 and the like.

Next, as shown in FIG. 16, the groove-shaped recess 1 in each package 11 of the package substrate A
A piezoelectric ceramic element 13 is loaded in the inside of the unit 2, and a cover plate substrate C formed by integrally connecting a plurality of the cover plates 16 is prepared. On the lower surface of the cover plate substrate C, a first capacitor plate is formed.
Electrode film 16a, second electrode film 16b, and third electrode film 16c
Is formed by vacuum vapor deposition of metal or application of a metal paste, and the lid plate substrate C is superposed on the upper surface of the package substrate A, and then fixed by an appropriate adhesive 22.

At the time of fixing with the adhesive 22, as shown in FIG. 17, an adhesive 22a made of a thermosetting synthetic resin is used as the adhesive, and the adhesive 22a is used on the upper surface of the package substrate A. Connection upper surface electrode films 17c, 18
While applying to portions other than c and 19c, solder paste 22b is applied to the locations of the connection upper surface electrode films 17c, 18c, and 19c, and the lid plate substrate C is superposed on it and then heated to bond. The agent 22a is cured and the first electrode film 16a for capacitors, the second electrode film 16b, and the third electrode film 16c are soldered to the upper surface electrode films 17c, 18c, and 19c for connection, or A conductive paste is used instead of the solder paste 22b to surely secure the capacitor first electrode film 16a, the second electrode film 16b, and the third electrode film 16c to the respective connection upper surface electrode films 17c, 18c, and 19c. In addition to being electrically connected, in particular, the package body substrate A
Of the upper surface of each of the connection upper surface electrode films 17c, 18c,
By using an adhesive made of a thermoplastic synthetic resin as an adhesive applied to the parts other than 19c, it is caused by a difference in thermal expansion between the package body 11 and the cover plate 16 when a thermal load is applied. There is an advantage that the junction breakdown can be reduced.

In another embodiment, an anisotropic conductive adhesive obtained by dispersing conductive powder such as metal powder in a binder resin is used as the adhesive, and this anisotropic conductive adhesive is Apply to the entire upper surface of the package substrate A,
After overlaying the lid plate substrate C on this, the lid plate substrate C
May be dried and cured while being pressed against the package substrate A. According to this method, the fixing of the lid plate substrate C to the package substrate A with an adhesive can be further simplified, and each electrode film can be formed. It is possible to prevent poor insulation between the two.

Furthermore, any one or all of the various adhesives, solder pastes and conductive pastes described above may be applied to the lower surface side of the cover plate substrate C,
The anisotropic conductive adhesive may be used in the form of a film. In this way, when the cover plate substrate C is fixed to the package substrate A, as shown in FIG. 18, the cutting line E is cut by the cutter D that rotates at a high speed.
By cutting into 1 and E2, each package type piezoelectric oscillator 30 is divided as shown in FIG.

As a result, a plurality of package type piezoelectric oscillators 30 can be manufactured at the same time. Of course, the first electrode film 16a for capacitors and the second
By using a lid plate substrate made of an appropriate material such as synthetic resin in which the electrode film 16b and the third electrode film 16c are not formed,
It goes without saying that it is possible to manufacture a package type piezoelectric oscillator having no capacitor function.

20 to 24 show a "package type piezoelectric oscillator 30 'with a capacitor function" manufactured according to the second embodiment of the present invention. The "package type piezoelectric oscillator 30 'with a capacitor function" according to the second embodiment has the same structure as the package body 11' which is specially constructed only for the second embodiment and the first embodiment. The piezoelectric ceramic element 13 and the cover plate 16 are formed.

That is, the package body 11 'is made of a synthetic resin in a rectangular chip shape, and a groove type recess 12' is formed on the upper surface thereof, and the groove type recess 1 is formed.
Inner bottom surface electrode films 14 'and 15' for connection are formed on the inner bottom surfaces of the left and right ends of 2 '. Further, the package body 11 'includes three connecting electrode film bodies 17', 1 '.
8'and 19 'are formed, and these three connecting electrode film bodies 1 are formed.
The connecting electrode film bodies 17 'and 18' at both ends of 7 ', 18' and 19 'are the connecting lower surface electrode films 17a' and 18a 'formed on the lower surface of the package body 11' and the package body 11 '. Connection side electrode films 17b ', 18b' formed on the side surfaces, connection terminal electrode films 17c ', 18c' formed on the upper surface of the package 11 ', and inner wall surfaces of the groove type recess 12' of the package 11 '. The connecting inner surface electrode films 17d 'and 18d' are formed so as to be continuous with the both connecting inner bottom electrode films 14 'and 15', and the central connecting electrode film body 19 'is a package. In the lower surface electrode film 19a 'for connection formed on the lower surface of the body 11', the electrode film 19b 'for connection formed on the side surface of the package body 11', and the package body 11 ' Connection is formed on the surface upper electrode film 19
It is composed of c '.

The package body 11 'is different from the package body 11' in the connection electrode film bodies 17 ', 1'.
Portions 11a ', 11b', 11 forming 8 ', 19'
c'and each of the connecting electrode film bodies 17 ', 18', 19 '
11d ', 11e', 11f ', 11 not forming
g'and the portions 11a ', 1 for forming the electrode film
1b 'and 11c' are mixed with a synthetic resin such as liquid crystal polymer (LCP), polyether sulfone (PES) or polyphenylene sulphite (PPS) and an appropriate amount of a metal catalyst such as palladium or gold. By doing so, it is made of a plating grade synthetic resin capable of plating a metal, while the electrode film is not formed on the portion 1
1d ', 11e', 11f ', 11g' are plated with a metal such as a synthetic resin such as liquid crystal polymer (LCP), polyether sulfone (PES) or polyphenylene sulphite (PPS) which is not mixed with a metal catalyst. It is made of a non-plating grade synthetic resin, and the whole package body 11 'is electrolessly plated with metal to obtain the plating grade synthetic resin portions 11a', 11b ', 11c'. On the other hand, each of the connection electrode film bodies 17 ', 18', 19 'and both connection inner bottom electrode films 14', 15 'are formed, and the other structures are the same as those of the first embodiment. It is similar to the case of.

In order to manufacture the "package-type piezoelectric oscillator 30 'with a capacitor function" of this structure and the package substrate used for this is molded of synthetic resin, first, referring to FIG. As shown in FIG. 26, in the package body substrate, the connection electrode film bodies 17 ′,
Portions A1'A2 ', A not forming 18', 19 '
3 ', A4', A5 ', A6', A7 'are connected integrally with each other by a connecting member A8' and primary molded with a non-plating grade synthetic resin, and then the above-mentioned parts A1'A2 ', A3', A4 ', A5', A
Between 6'and A7 ', the connection electrode film bodies 17',
Portions A9 ', A10', A1 forming 18 ', 19'
By secondary molding 1 ', A12', A13 ', and A14' with a plating grade synthetic resin, a package substrate A'with through holes B'is molded as shown in FIGS. is there.

Then, the package body substrate A ', which has been molded through the primary molding process and the secondary molding process in this way,
A ″ is subjected to a metal electroless plating process or an electrolytic plating process, so that the non-plating grade synthetic resin part A1′A2 ′, of the package body A ′, A ″. A3 ', A4', A5 ', A6',
Part A made of plating grade synthetic resin except A7 '
9 ', A10', A11 ', A12', A13 ', A1
4'only, each of the connection electrode film bodies 17 ', 18',
19 'and the inner bottom electrode films 14' and 15 'for both connections can be reliably formed.

Therefore, thereafter, by performing the same steps as those in the first embodiment, a plurality of package type piezoelectric oscillators 30 'with a capacitor function shown in FIGS. 20 to 24 can be simultaneously manufactured. is there. As a modified example of the second embodiment, first, as shown in FIGS. 29 and 30, the connection electrode film bodies 17 ', 18', 19 'of the package body substrate are formed. Part A9 ", A1
0 ″, A11 ″, A12 ″, A13 ″, and A14 ″ are integrally connected to each other with a connecting member A15 ″, and primary molding is performed using a plating grade synthetic resin, and then this electrode film Forming parts A9 ", A10", A1
1 ", A12", A13 ", and A14", portions A1 "A2", A3 ", A4", where the electrode film is not formed,
As shown in FIGS. 31 and 32, the A5 ″, A6 ″, and A7 ″ are secondarily molded with a non-plating grade synthetic resin to form a package substrate A ″ with a through hole B ″.
May be molded.

[Brief description of drawings]

FIG. 1 is a vertical sectional front view of a package type piezoelectric oscillator according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a sectional view taken along line IV-IV in FIG.

5 is a plan view taken along line VV of FIG.

FIG. 6 is an exploded perspective view of the package type piezoelectric oscillator according to the first embodiment of the present invention.

FIG. 7 is a perspective view of a package body substrate according to the first embodiment of the present invention.

8 is an enlarged sectional view taken along line VIII-VIII of FIG. 7.

9 is an enlarged sectional view taken along line IX-IX in FIG. 7.

10 is a perspective view showing a state in which a side surface electrode film is formed in a through hole in the package substrate of FIG.

11 is a sectional view taken along line XI-XI of FIG.

12 is a perspective view showing a state where a lower surface electrode film is formed on the lower surface of the package substrate of FIG.

13 is an enlarged sectional view taken along line XIII-XIII in FIG.

14 is a perspective view showing a state where an upper surface electrode film is formed on the upper surface of the package substrate of FIG.

FIG. 15 is an enlarged sectional view taken along line XV-XV of FIG.

FIG. 16 is a perspective view showing a state in which a lid plate substrate is superposed on the package body substrate.

FIG. 17 is an enlarged sectional view taken along line XVII-XVII of FIG. 16.

FIG. 18 is a perspective view showing a state in which a cover plate substrate is overlaid on the package substrate and the package substrate is cut.

FIG. 19 is a perspective view of a cut package type piezoelectric oscillator.

FIG. 20 is a vertical sectional front view of a package type piezoelectric oscillator according to a second embodiment of the present invention.

21 is a sectional view taken along line XXI-XXI of FIG. 20.

22 is a sectional view taken along line XXII-XXII of FIG. 20.

23 is a sectional view taken along line XXIII-XXIII of FIG.

FIG. 24 is a plan view taken along the line XXIV-XXIV of FIG. 20.

FIG. 25 is a perspective view showing a state where the package substrate is primarily molded in the second embodiment.

FIG. 26 is an enlarged sectional view taken along line XXVI-XVVI of FIG. 25.

FIG. 27 is a perspective view showing a state where the package substrate is secondarily molded in the second embodiment.

28 is an enlarged sectional view taken along line XXVIII-XXVIII of FIG. 27.

FIG. 29 is a perspective view showing a state where the package body substrate is primarily molded in the modification of the second embodiment.

FIG. 30 is an enlarged sectional view taken along line XXX-XXX of FIG. 29.

FIG. 31 is a perspective view showing a state in which a package substrate is secondarily molded in the modification of the second embodiment.

FIG. 32 is an enlarged sectional view taken along the line XXXII-XXXII of FIG. 31.

FIG. 33 is a vertical sectional front view of a conventional package type piezoelectric oscillator.

34 is a sectional view taken along the line XXXIV-XXXIV of FIG. 33.

[Explanation of symbols]

 11, 11 'Package 12, 12' Groove type recess 13 Piezoelectric ceramic element 14, 15, 14 ', 15' Connection inner bottom electrode film 16 Lid plate 16a, 16b, 16c Capacitor electrode film 17, 18, 19 Connection electrode film body A, A ', A "Package body substrate B Through hole C Cover plate substrate D Cutting cutter E1, E2 Cutting line

Claims (2)

[Claims] 1. A package body substrate formed by integrally connecting a plurality of package bodies in a package type piezoelectric oscillator, a groove type recess at a location on an upper surface of each package body in the package body substrate, and each package body. And forming a side surface electrode film for connection on the inner surface of each of the through holes, and forming a through hole at each end of the groove-shaped recess and molding with synthetic resin. Forming a strip-shaped lower surface electrode film for connection extending in a direction crossing the groove-shaped recess at each through hole on the lower surface of the body substrate, connecting to both ends of each groove-shaped recess in the package body substrate Forming an inner surface electrode film and an inner bottom surface electrode film so as to be continuous with the upper surface electrode film, and traversing the groove-shaped recess at each through hole on the upper surface of the package substrate. The step of forming a strip-shaped upper electrode film for connection extending in the direction, and the step of mounting a piezoelectric element in the groove type recess in each of the package bodies, and further, a groove of each package body on the upper surface of the package body substrate. And a step of fixing a lid plate substrate that closes the mold recess, and a step of cutting the package body substrate and the lid plate substrate for each package body in a portion between the package bodies. Method for manufacturing package type piezoelectric oscillator. 2. The method according to claim 1, wherein in the step of molding the package substrate, the portion of each package in which the various connection electrode films are formed is made of a plating grade synthetic resin capable of metal plating. Or a primary molding step in which the portion where the various connection electrode films are not formed is molded with a non-plating grade synthetic resin in which metal plating is not possible, and the various connection electrode films are formed. There are two steps, a secondary molding step of molding the non-plating grade synthetic resin with a non-plating grade synthetic resin, or molding the portion for forming the various connection electrode films with a plating grade synthetic resin. A package in a package type piezoelectric oscillator, wherein the step of forming various connection electrode films is a step of plating the package substrate with metal. The method of production.