JPH07335679A - Soldering structure for aluminum post - Google Patents
Soldering structure for aluminum postInfo
- Publication number
- JPH07335679A JPH07335679A JP6122410A JP12241094A JPH07335679A JP H07335679 A JPH07335679 A JP H07335679A JP 6122410 A JP6122410 A JP 6122410A JP 12241094 A JP12241094 A JP 12241094A JP H07335679 A JPH07335679 A JP H07335679A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum post
- aluminum
- conductor
- post
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 105
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 238000005476 soldering Methods 0.000 title claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 56
- 239000004020 conductor Substances 0.000 claims abstract description 42
- 239000006071 cream Substances 0.000 claims abstract description 41
- 239000000615 nonconductor Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000012190 activator Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子回路が形成された
回路基板への電子部品の面実装に係り、詳細には、前記
回路基板の導体にクリームはんだを塗布した上に電子部
品を装着し、高温の炉内で前記クリームはんだを溶融し
て前記導体に前記電子部品をはんだ付けするはんだ付け
構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to surface mounting of electronic components on a circuit board on which an electronic circuit is formed. More specifically, the conductor of the circuit board is coated with cream solder and then the electronic components are mounted. And a soldering structure for melting the cream solder in a high temperature furnace and soldering the electronic component to the conductor.
【０００２】[0002]
【従来の技術】従来のアルミポストのはんだ付け構造を
図面を用いて説明する。図５は、従来のアルミポストの
装着状態を示す断面図である。５３はアルミポストで、
半導体などの入出力端子と基板上に設けられた他の回路
をアルミワイヤを用いて接続する場合の接続端子であ
る。材料にはアルミ板が用いられプレス加工により丸形
状や四角形状に形成される。この際一方の面が球面５４
をおびた状態となり、はんだ付けの際にアルミポスト５
３が傾きやすくなる。2. Description of the Related Art A conventional aluminum post soldering structure will be described with reference to the drawings. FIG. 5: is sectional drawing which shows the mounting state of the conventional aluminum post. 53 is an aluminum post,
This is a connection terminal when an input / output terminal such as a semiconductor is connected to another circuit provided on the substrate using an aluminum wire. An aluminum plate is used as a material and is formed into a round shape or a square shape by press working. At this time, one surface is a spherical surface 54
The aluminum post 5 when soldering
3 becomes easy to tilt.
【０００３】５５はクリームはんだで、はんだの微粒子
を活性剤などと共に半練り状態にし、メタルマスクなど
を用いた印刷塗布を可能にしている。クリームはんだ５
５は印刷された状態では、ある程度粘度を有しているの
で、その粘度を利用して電子部品などが実装され高温の
炉内でクリームはんだ５５が溶融されるまで電子部品な
どは定位置に保持される。Reference numeral 55 denotes a cream solder, which finely kneads the solder fine particles together with an activator and the like, and enables printing and coating using a metal mask or the like. Cream solder 5
Since 5 has a certain degree of viscosity in the printed state, the electronic components are held in place until the cream solder 55 is melted in the high temperature furnace by mounting the electronic components using the viscosity. To be done.
【０００４】５６はセラミック基板で、セラミック板の
表面に例えば、銅などの導体５０で電子回路が形成され
ており電子部品などが実装される箇所以外は保護体５２
（ガラス物質）で表面が保護されている。次に、アルミ
ポスト５３のはんだ付けについて説明する。セラミック
基板５６に形成された導体５０のアルミポスト５３をは
んだ付けする箇所であるアルミポスト装着部５１に、メ
タルマスクなどを用いてクリームはんだ５５が印刷塗布
される。そして、クリームはんだ５５の上にアルミポス
ト５３の球面側５４を装着面にして装着される。そし
て、高温の炉内でクリームはんだ５５を溶融し、導体５
０のアルミポスト装着部５１にアルミポスト５３がはん
だ付けされる。Reference numeral 56 designates a ceramic substrate, and an electronic circuit is formed on the surface of the ceramic plate by a conductor 50 such as copper, and a protective body 52 is provided except for a portion where electronic parts are mounted.
The surface is protected by (glass substance). Next, the soldering of the aluminum post 53 will be described. The cream solder 55 is printed and applied to the aluminum post mounting portion 51, which is a portion to which the aluminum post 53 of the conductor 50 formed on the ceramic substrate 56 is soldered, using a metal mask or the like. Then, it is mounted on the cream solder 55 with the spherical surface 54 of the aluminum post 53 as the mounting surface. Then, the cream solder 55 is melted in a high temperature furnace, and the conductor 5
The aluminum post 53 is soldered to the 0 aluminum post mounting portion 51.
【０００５】[0005]
【発明が解決しようとする課題】以上、説明したよう
に、従来の方法ではアルミポスト５３の面積に略等しい
導体のアルミポスト装着部５１全面にクリームはんだ５
５が塗布され、アルミポスト５３の球面をおびた面が装
着されるので、アルミポスト５３の安定が悪くアルミポ
スト５３が傾くおそれがある。また、アルミポスト５３
のはんだ付け時、アルミポスト装着部５１全面に導体が
形成されているので、はんだが溶融状態で表面張力が働
きアルミポスト装着部５１の中央部が中高となる傾向が
ある。そして、アルミポスト５３が不安定な浮遊状態と
なり、はんだが凝固時にアルミポスト５３が傾く要因の
一つになる。As described above, according to the conventional method, the cream solder 5 is formed on the entire surface of the aluminum post mounting portion 51 of the conductor having the substantially same area as the aluminum post 53.
Since No. 5 is applied and the spherical surface of the aluminum post 53 is attached, the stability of the aluminum post 53 is poor and the aluminum post 53 may tilt. Also, aluminum post 53
At the time of soldering, since the conductor is formed on the entire surface of the aluminum post mounting portion 51, the surface tension acts in the molten state of the solder, and the central portion of the aluminum post mounting portion 51 tends to have a middle height. Then, the aluminum post 53 becomes in an unstable floating state, which is one of the factors that the aluminum post 53 tilts when the solder solidifies.
【０００６】そして、アルミポスト５３が傾くと、次工
程で行われるアルミワイヤのボンディング作業において
溶着条件が微妙に変化し、溶着品質に影響を与え歩留り
を低下させるおそれがある。そこで、本発明は上述の問
題を解決するもので、装着面が球面をおびたアルミポス
トでも安定した状態に装着でき、しかも、アルミポスト
とアルミポスト装着部にクリームはんだが均一に濡れ広
がり易くし、アルミポストが傾かずにはんだ付けできる
アルミポストのはんだ付け構造を提供することを目的と
する。If the aluminum post 53 is tilted, the welding conditions may be slightly changed in the aluminum wire bonding work performed in the next step, which may affect the welding quality and reduce the yield. Therefore, the present invention is to solve the above-mentioned problems, and can be mounted in a stable state even on an aluminum post having a spherical mounting surface, and moreover, the solder paste can be easily spread evenly on the aluminum post and the aluminum post mounting portion. An object of the present invention is to provide a soldering structure for an aluminum post that can be soldered without tilting the aluminum post.
【０００７】[0007]
【課題を解決するための手段】本発明は、上述の目的を
達成するもので、電子回路が形成された回路基板の導体
部のアルミポスト装着部にクリームはんだを印刷し、前
記クリームはんだ上に、アルミポストを装着し、前記ア
ルミポスト装着部と前記アルミポストをはんだ付けする
構造において、前記アルミポスト装着部を分割するスリ
ットを設け、はんだ付け時に前記アルミポスト装着部に
クリームはんだが均一にぬれ拡がるようにしたことを特
徴とする。Means for Solving the Problems The present invention achieves the above-mentioned object, in which cream solder is printed on an aluminum post mounting portion of a conductor portion of a circuit board on which an electronic circuit is formed, and the cream solder is printed on the cream solder. In a structure in which an aluminum post is mounted and the aluminum post mounting part and the aluminum post are soldered, a slit that divides the aluminum post mounting part is provided, and the cream solder uniformly wets the aluminum post mounting part during soldering. The feature is that it is spread.
【０００８】また、前記分割された導体部にのみクリー
ムはんだを塗布することを特徴とする。又は、前記アル
ミポスト装着部は、前記アルミポストの中央部に対向す
る部位に導体が除かれた無導体部を有することを特徴と
する。Further, the invention is characterized in that cream solder is applied only to the divided conductor portions. Alternatively, the aluminum post mounting portion has a non-conductor portion in which a conductor is removed at a portion facing the central portion of the aluminum post.
【０００９】[0009]
【作用】本発明によれば、アルミポストをはんだ付けす
る導体部を分割することにより、塗布されたクリームは
んだが分割溝を境にそれぞれ分割されて流動するのでは
んだが均一に濡れ広がる。また、第２の発明によれば、
分割された導体部にのみクリームはんだが塗布されるの
で、第１の発明よりもさらに、はんだが均一に濡れ広が
る。According to the present invention, by dividing the conductor portion to which the aluminum post is soldered, the applied cream solder is divided and flows at the dividing grooves, so that the solder uniformly wets and spreads. According to the second invention,
Since the cream solder is applied only to the divided conductor portions, the solder is evenly spread over the first invention.
【００１０】又は、第３の発明によれば、アルミポスト
の外周から同時に取り囲むようにはんだが溶融し均一に
濡れ広がる。Alternatively, according to the third aspect of the invention, the solder is melted and uniformly spreads so as to surround the outer periphery of the aluminum post at the same time.
【００１１】[0011]
【実施例】本発明の実施例を図面により説明する。図１
は、本発明の一実施例を示す斜視図である。１０は電子
回路基板で、セラミック板の表面に電子回路が形成され
たセラミック基板１２、シリコン基板上に集積回路技術
により集積回路が構成されたシリコンチップ１６の入出
力端子１７とセラミック基板１２に形成された他の回路
を接続する場合に接続用の端子となるアルミポスト１
１、シリコンチップ１６の入出力端子１７とアルミポス
ト１１を接続するアルミワイヤ１８、などにより構成さ
れている。Embodiments of the present invention will be described with reference to the drawings. Figure 1
FIG. 3 is a perspective view showing an embodiment of the present invention. Reference numeral 10 denotes an electronic circuit board, which is formed on a ceramic substrate 12 having an electronic circuit formed on the surface of a ceramic plate, an input / output terminal 17 of a silicon chip 16 having an integrated circuit formed on the silicon substrate by an integrated circuit technique, and the ceramic substrate 12. Post 1 that will be the connection terminal when connecting to another circuit
1. An aluminum wire 18 for connecting the input / output terminal 17 of the silicon chip 16 and the aluminum post 11 to each other.
【００１２】次に、電子回路基板１０の組立を説明す
る。セラミック基板１２にメタルマスクなどを用いてク
リームはんだを印刷塗布しアルミポスト１１やシリコン
チップ１６などを装着する。そして、高温の炉内でクリ
ームはんだを溶融しはんだ付けする。シリコンチップ１
６の入出力端子１７と他の回路をアルミワイヤ１８を用
いて接続する場合、アルミワイヤ１８を電子回路の導体
１４と直接に接続できないので、先に、導体１４のアル
ミアルミポスト装着部２３にはんだ付けされたアルミポ
スト１１が接続用の端子となる。Next, the assembly of the electronic circuit board 10 will be described. Cream solder is printed on the ceramic substrate 12 using a metal mask or the like, and the aluminum post 11 and the silicon chip 16 are attached. Then, the cream solder is melted and soldered in a high temperature furnace. Silicon chip 1
When the input / output terminal 17 of 6 and other circuits are connected using the aluminum wire 18, the aluminum wire 18 cannot be directly connected to the conductor 14 of the electronic circuit. The soldered aluminum posts 11 serve as terminals for connection.
【００１３】そして、アルミワイヤ１８とシリコンチッ
プ１６の接続端子１７、および、アルミワイヤ１８とア
ルミポスト１１との接続部２６を超音波などを用いて機
械的に接着させる。本実施例の詳細を図面により説明す
る。第１実施例を図２により説明する。Then, the connecting terminal 17 between the aluminum wire 18 and the silicon chip 16 and the connecting portion 26 between the aluminum wire 18 and the aluminum post 11 are mechanically bonded by using ultrasonic waves or the like. The details of this embodiment will be described with reference to the drawings. The first embodiment will be described with reference to FIG.
【００１４】図２の（ａ）は、アルミポストの装着状態
を示す断面図、（ｂ）は、アルミポストのはんだ付け状
態を示す断面図、（ｃ）は、セラミック基板の導体部の
アルミポスト装着部を示す平面図である。尚、図１の構
成と同じ構成については同じ符号を付し説明を省略す
る。１１はアルミポストで、材料にアルミ板が用いられ
プレス加工により丸形状や四角形状に形成される。この
際一方の面が球面１５をおびた状態となり、はんだ付け
の際にアルミポスト１１が傾きやすくなる。2A is a sectional view showing a mounted state of an aluminum post, FIG. 2B is a sectional view showing a soldered state of the aluminum post, and FIG. 2C is an aluminum post of a conductor portion of a ceramic substrate. It is a top view which shows a mounting part. The same components as those shown in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. Reference numeral 11 denotes an aluminum post, which is formed into a round shape or a square shape by pressing an aluminum plate as a material. At this time, one surface is covered with the spherical surface 15, and the aluminum post 11 is easily inclined during soldering.
【００１５】１２はセラミック基板で、セラミック板の
表面に銅の導体１５で電子回路が形成されており、電子
部品などが実装される箇所以外は保護体１３（ガラス物
質）で表面が保護されている。クリームはんだ２０は、
はんだの微粒子を活性剤などと共に半練り状態にし、メ
タルマスクなどを用いた印刷塗布を可能にしている。ク
リームはんだ２０は印刷された状態では、ある程度粘度
を有しているので、その粘度を利用して電子部品などが
実装され高温の炉内でクリームはんだ２０が溶融しはん
だ付けされるまで電子部品などは定位置に保持される。Reference numeral 12 denotes a ceramic substrate. An electronic circuit is formed on the surface of the ceramic plate by a copper conductor 15. The surface is protected by a protector 13 (glass substance) except for the parts where electronic parts are mounted. There is. The cream solder 20
Fine particles of solder are made into a half-kneaded state together with an activator, etc., enabling printing application using a metal mask or the like. Since the cream solder 20 has a certain degree of viscosity in a printed state, the viscosity of the cream solder 20 is used to mount electronic components and the like until the cream solder 20 is melted and soldered in a high temperature furnace. Are held in place.
【００１６】１４は導体で、セラミック板上に銅材で電
子回路を形成すると共にアルミポスト１１を実装するア
ルミポスト装着部２３や電子部品などを実装する部品装
着部があり、これらのアルミポスト装着部２３、部品装
着部には、はんだの流れを均一にするために十字状のス
リット２２により４分割された導体２１により形成され
ている。Reference numeral 14 denotes a conductor, which has an aluminum post mounting portion 23 for mounting the aluminum post 11 and an electronic circuit mounting portion on which a copper material is formed on a ceramic plate, and a component mounting portion for mounting an electronic component. The portion 23 and the component mounting portion are formed by the conductor 21 divided into four by the cross slit 22 in order to make the flow of solder uniform.
【００１７】次に、アルミポスト１１のはんだ付けにつ
いて説明する。アルミポスト１１を電子回路の導体１４
にはんだ付けするには、先ず、アルミポスト装着部２３
の導体２１にメタルマスクなどを用いて導体２１の全面
にクリームはんだが印刷塗布される。そして、クリーム
はんだ２０のの上にアルミポスト１１が装着された後
に、高温の炉内でクリームはんだ２０が溶融せれ導体２
１にアルミポスト１１がはんだ付けされる。Next, the soldering of the aluminum post 11 will be described. The aluminum post 11 is used as the conductor 14
For soldering, first, the aluminum post mounting part 23
A cream solder is printed and applied to the entire surface of the conductor 21 using a metal mask or the like. Then, after the aluminum post 11 is mounted on the cream solder 20, the cream solder 20 is melted in a high temperature furnace and the conductor 2
The aluminum post 11 is soldered to the No. 1.
【００１８】以上詳細に説明したように、本実施例によ
れば、アルミポスト装着部２３の導体を４分割したこと
により、クリームはんだ２０がアルミポスト１１と導体
２１の４方向に均一に濡れ拡がり、アルミポスト１１が
傾くことなく導体２１にはんだ付けされる。尚、本発明
では、アルミポスト装着部２３の導体を４分割にした
が、分割数を変えても同じ効果がえられる。As described in detail above, according to the present embodiment, the conductor of the aluminum post mounting portion 23 is divided into four, so that the cream solder 20 spreads uniformly in the four directions of the aluminum post 11 and the conductor 21. The aluminum post 11 is soldered to the conductor 21 without tilting. Although the conductor of the aluminum post mounting portion 23 is divided into four in the present invention, the same effect can be obtained even if the number of divisions is changed.
【００１９】第２実施例を図３により説明する。図３の
（ａ）は、アルミポストの装着状態を示す断面図、
（ｂ）は、アルミポストのはんだ付け状態を示す断面
図、（ｃ）は、セラミック基板の導体部のアルミポスト
装着部を示す平面図である。尚、図１図２の構成と同じ
構成については同じ符号を付し説明を省略する。The second embodiment will be described with reference to FIG. FIG. 3A is a cross-sectional view showing a mounted state of an aluminum post,
(B) is sectional drawing which shows the soldering state of an aluminum post, (c) is a top view which shows the aluminum post mounting part of the conductor part of a ceramic substrate. The same components as those shown in FIGS. 1 and 2 are designated by the same reference numerals and the description thereof will be omitted.
【００２０】第２実施例では、アルミポスト装着部２３
の導体を十字状のスリット２２により４分割された導体
２１にのみ、クリームはんだ３０を塗布するようにした
もので、その他については第１実施例と略同じである。
以上説明したように、本実施例においてもクリームはん
だ３０がアルミポスト１１と導体２１の４方向に均一に
濡れ拡がりアルミポスト１１が傾くことなく導体２１に
はんだ付けされる。In the second embodiment, the aluminum post mounting portion 23
The cream solder 30 is applied only to the conductor 21 divided into four by the cross slit 22. The other points are substantially the same as those in the first embodiment.
As described above, also in this embodiment, the cream solder 30 is uniformly wet and spread in the four directions of the aluminum post 11 and the conductor 21 and soldered to the conductor 21 without tilting the aluminum post 11.
【００２１】第３実施例を図４により説明する。図４の
（ａ）は、アルミポストの装着状態を示す断面図、
（ｂ）は、アルミポストのはんだ付け状態を示す断面
図、（ｃ）は、セラミック基板の導体部のアルミポスト
装着部を示す平面図である。尚、図１、図２、図３の構
成と同じ構成については同じ符号を付し説明を省略す
る。A third embodiment will be described with reference to FIG. FIG. 4A is a cross-sectional view showing the mounted state of the aluminum post,
(B) is sectional drawing which shows the soldering state of an aluminum post, (c) is a top view which shows the aluminum post mounting part of the conductor part of a ceramic substrate. The same components as those shown in FIGS. 1, 2 and 3 are designated by the same reference numerals and the description thereof will be omitted.
【００２２】４０はアルミポスト装着部で、アルミポス
ト１１の中央部に対向する位置の導体４２を除いた導体
に、はんだの流れを均一にするために十字状のスリット
４４により４分割された導体４１が形成されている。そ
して、クリームはんだ４３を４分割された導体４１にの
み、塗布するようにしたもので、その他については第１
実施例と略同じである。Reference numeral 40 denotes an aluminum post mounting portion, which is a conductor excluding the conductor 42 at a position facing the center of the aluminum post 11 and is divided into four by a cross-shaped slit 44 in order to make the solder flow uniform. 41 are formed. The cream solder 43 is applied only to the conductor 41 divided into four parts.
This is almost the same as the embodiment.
【００２３】以上説明したように、本実施例によれば、
クリームはんだ４３が４分割され、さらに、アルミポス
ト１１の中央部に対向する位置のクリームはんだ４３が
削除されているのでアルミポスト１１の装着が安定す
る。そして、クリームはんだ４３が４分割されているの
で、はんだが同時に溶融しアルミポスト１１と導体４１
に均一に濡れ広がりアルミポスト１１の傾きが防止でき
る。As described above, according to this embodiment,
The cream solder 43 is divided into four, and the cream solder 43 at the position facing the central portion of the aluminum post 11 is removed, so that the mounting of the aluminum post 11 is stable. Since the cream solder 43 is divided into four, the solder is melted at the same time and the aluminum post 11 and the conductor 41 are melted.
Therefore, the aluminum post 11 can be prevented from tilting evenly and uniformly.
【００２４】[0024]
【発明の効果】以上説明したように、本発明によれば、
アルミポストをはんだ付けする導体部が分割され、ま
た、クリームはんだも分割して塗布されるので、クリー
ムはんだが同時に溶融し、アルミポストと導体部に均一
に濡れ広がりアルミポストが傾くことなく導体部にはん
だ付けされる。従って、次工程で行われるアルミワイヤ
のボンディング品質と歩留りが向上しコストの改善がは
かれる。As described above, according to the present invention,
The conductor part for soldering the aluminum post is divided, and the cream solder is also divided and applied, so the cream solder melts at the same time and spreads evenly on the aluminum post and the conductor part and the aluminum post does not tilt. Be soldered to. Therefore, the bonding quality and the yield of the aluminum wire to be performed in the next step are improved, and the cost can be improved.
【図１】本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図２】本発明の第１実施例のアルミポストの装着状態
を示す断面図である。FIG. 2 is a cross-sectional view showing a mounted state of the aluminum post of the first embodiment of the present invention.
【図３】本発明の第２実施例のアルミポストの装着状態
を示す断面図である。FIG. 3 is a cross-sectional view showing a mounted state of an aluminum post according to a second embodiment of the present invention.
【図４】本発明の第３実施例のアルミポストの装着状態
を示す断面図である。FIG. 4 is a sectional view showing a mounting state of an aluminum post according to a third embodiment of the present invention.
【図５】従来のアルミポストの装着状態を示す断面図で
ある。FIG. 5 is a cross-sectional view showing a mounted state of a conventional aluminum post.
１０・・・コントロール基板 １１・・・アルミポスト １２・・・セラミック基板 １３・・・保護体 １４・・・導体 ２０、３０、４３・・・クリームはんだ ２３、４０・・・アルミポスト装着部 ２２、４４、・・・スリット 10 ... Control substrate 11 ... Aluminum post 12 ... Ceramic substrate 13 ... Protective body 14 ... Conductor 20, 30, 43 ... Cream solder 23, 40 ... Aluminum post mounting part 22 , 44, ... Slit
Claims (3)
のアルミポスト装着部にクリームはんだを印刷し、前記
クリームはんだ上に、アルミポストを装着し、前記アル
ミポスト装着部と前記アルミポストをはんだ付けする構
造において、 前記アルミポスト装着部を分割するスリットを設け、 はんだ付け時に前記アルミポスト装着部にクリームはん
だが均一にぬれ拡がるようにしたことを特徴とするアル
ミポストのはんだ付け構造1. A cream solder is printed on an aluminum post mounting portion of a conductor portion of a circuit board on which an electronic circuit is formed, an aluminum post is mounted on the cream solder, and the aluminum post mounting portion and the aluminum post are connected to each other. In the soldering structure, a slit for dividing the aluminum post mounting portion is provided so that the cream solder can evenly spread and spread on the aluminum post mounting portion during soldering.
んだを塗布することを特徴とする請求項１記載のアルミ
ポストのはんだ付け構造2. The aluminum post soldering structure according to claim 1, wherein cream solder is applied only to the divided conductor portions.
ポストの中央部に対向する部位に導体が除かれた無導体
部を有することを特徴とする請求項１記載のアルミポス
トのはんだ付け構造3. The soldering structure for an aluminum post according to claim 1, wherein the aluminum post mounting portion has a non-conductor portion in which a conductor is removed at a portion facing a central portion of the aluminum post.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6122410A JPH07335679A (en) | 1994-06-03 | 1994-06-03 | Soldering structure for aluminum post |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6122410A JPH07335679A (en) | 1994-06-03 | 1994-06-03 | Soldering structure for aluminum post |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07335679A true JPH07335679A (en) | 1995-12-22 |
Family
ID=14835122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6122410A Withdrawn JPH07335679A (en) | 1994-06-03 | 1994-06-03 | Soldering structure for aluminum post |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07335679A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002001637A3 (en) * | 2000-06-28 | 2002-09-26 | Intel Corp | Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs |
| US7180195B2 (en) | 2003-12-17 | 2007-02-20 | Intel Corporation | Method and apparatus for improved power routing |
| EP1921643A3 (en) * | 2006-11-07 | 2008-08-06 | AMPHENOL-TUCHEL ELECTRONICS GmbH | Pressure contact array |
-
1994
- 1994-06-03 JP JP6122410A patent/JPH07335679A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002001637A3 (en) * | 2000-06-28 | 2002-09-26 | Intel Corp | Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs |
| US7033923B2 (en) | 2000-06-28 | 2006-04-25 | Intel Corporation | Method of forming segmented ball limiting metallurgy |
| US7034402B1 (en) | 2000-06-28 | 2006-04-25 | Intel Corporation | Device with segmented ball limiting metallurgy |
| US7180195B2 (en) | 2003-12-17 | 2007-02-20 | Intel Corporation | Method and apparatus for improved power routing |
| US7208402B2 (en) | 2003-12-17 | 2007-04-24 | Intel Corporation | Method and apparatus for improved power routing |
| EP1921643A3 (en) * | 2006-11-07 | 2008-08-06 | AMPHENOL-TUCHEL ELECTRONICS GmbH | Pressure contact array |
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|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
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