JPH0745963Y2 - COB sealing material flow prevention frame - Google Patents
COB sealing material flow prevention frameInfo
- Publication number
- JPH0745963Y2 JPH0745963Y2 JP1989071140U JP7114089U JPH0745963Y2 JP H0745963 Y2 JPH0745963 Y2 JP H0745963Y2 JP 1989071140 U JP1989071140 U JP 1989071140U JP 7114089 U JP7114089 U JP 7114089U JP H0745963 Y2 JPH0745963 Y2 JP H0745963Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- epoxy resin
- sealing material
- cob
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003566 sealing material Substances 0.000 title claims description 16
- 230000002265 prevention Effects 0.000 title claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 29
- 229920000647 polyepoxide Polymers 0.000 description 29
- 239000003795 chemical substances by application Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- DNXHEGUUPJUMQT-CBZIJGRNSA-N Estrone Chemical compound OC1=CC=C2[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CCC2=C1 DNXHEGUUPJUMQT-CBZIJGRNSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000012803 melt mixture Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は電子産業における薄肉化製品等でICを基板上に
直接実装し、COB（チツプオンボード）封止する場合、
このCOB封止材料の流れ防止枠に関する。[Detailed Description of the Invention] (Industrial field of application) The present invention is applied to the case where the IC is directly mounted on the substrate and is COB (chip-on-board) sealed in the thin product in the electronic industry.
This COB sealing material relates to a flow prevention frame.
（従来の技術） 従来、COB封止材料が流れすぎて不要な所へ広がること
を防止する方法として、 粘度の高い液状エポキシ樹脂で枠状に予めデイスペ
ンサー等で描き硬化させ、枠状の土手を形成する方法、 枠状に成形した成形物の片面に接着剤を塗布し、貼
り付ける方法、 室温で固形で実質上未硬化状態のエポキシ樹脂を枠
状に成形したものを設置し、加熱溶融させて土手を形成
する方法等が知られている。(Prior art) Conventionally, as a method to prevent the COB sealing material from flowing too much and spreading to unnecessary places, a liquid-type epoxy resin with high viscosity was previously drawn and cured in a frame with a dispenser, etc. A method of forming a frame, applying an adhesive to one side of a frame-shaped molded product and pasting it, setting a frame-shaped solid epoxy resin that is substantially uncured at room temperature, and heat melting There is known a method of forming a bank by making it.
しかし、の方法は手加工では精度が悪く、機械化して
位置精度を良くする方法もあるが、ノズルのつまりや粘
度変化による吐出量の変化等のトラブルが多い。の方
法は接着剤を塗るための工数（自動化しにくい）が大き
い。の方法は溶融時の土手形状が一定にならないとい
う欠点を有する。However, although the method of (1) has a low accuracy in manual processing and there is a method of improving the positional accuracy by mechanization, there are many troubles such as a change in the discharge amount due to a nozzle clogging or a change in viscosity. This method requires a large number of man-hours for applying the adhesive (it is difficult to automate). The method (1) has a drawback that the shape of the bank when melted is not constant.
（発明が解決しようとする課題） 本考案の目的は流れ防止枠として簡便に取り扱えて、位
置決めが確実で土手形状を安定に得ることが可能なCOB
封止材料の流れ防止枠を提供することにある。(Problems to be solved by the invention) The object of the present invention is a COB that can be easily handled as a flow prevention frame, can be positioned reliably, and can obtain a stable bank shape.
It is to provide a frame for preventing the flow of the sealing material.
（課題を解決するための手段） 本考案は片面が150℃以上の耐熱性を有するフイルム又
はシートで覆われた、枠状に成形された硬化可能な、室
温で固形で100℃以上で溶融する実質上未硬化状態のエ
ポキシ樹脂からなるCOB封止材料の流れ防止枠に係る。(Means for Solving the Problems) The present invention is a frame-shaped curable material, one side of which is covered with a film or sheet having a heat resistance of 150 ° C or higher, solidified at room temperature and melted at 100 ° C or higher. This relates to a flow prevention frame for a COB encapsulating material that is made of an epoxy resin that is substantially uncured.
本考案で用いられるフイルム又はシート（以下、代表し
てフイルムという）は150℃以上の耐熱性を有するもの
で、耐熱性が低いとハンダ耐熱性に問題がある。材料と
してはポリイミド、ナイロン、フエノール樹脂、ポリカ
ーボネート、ポリエチレンテレフタレート、ポリブチレ
ンテレフタレート、ガラスエポキシ等を例示できる。フ
イルムの厚さは10〜1000μの範囲が好ましい。10〜1000
μの場合、エポキシ樹脂を加熱溶融する時にそのフイル
ム付近に表面張力でエポキシ材料がまとまり、概略フイ
ルムの枠形状に安定し、その後加熱を続けることにより
硬化、接着する。The film or sheet used in the present invention (hereinafter, typically referred to as a film) has a heat resistance of 150 ° C. or higher, and if the heat resistance is low, there is a problem in solder heat resistance. Examples of the material include polyimide, nylon, phenol resin, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, and glass epoxy. The thickness of the film is preferably in the range of 10 to 1000μ. 10 to 1000
In the case of μ, when the epoxy resin is heated and melted, the epoxy material is gathered in the vicinity of the film due to the surface tension and is stabilized in the frame shape of the film, and then cured and adhered by continuing heating.
本考案で用いられるエポキシ樹脂としては、ビスフエノ
ールＡ型エポキシ樹脂〔油化シエルエポキシ（株）製、
エピコート828,1001,1002,1003,1004,1005,1007,1010,1
100L等〕、臭素化ビスフエノールＡ型エポキシ樹脂〔油
化シエルエポキシ（株）製、エピコート5050,5051,5051
H等〕、ｏ−クレゾールノボラツク型エポキシ樹脂〔住
友化学（株）製、ESCN-220L,ESCN-220F,ESCN-220H,ESCN
-220HH等〕、臭素化ノボラツク型エポキシ樹脂〔日本化
薬（株）製、BREN−Ｓ等〕、フエノールノボラツク型エ
ポキシ樹脂〔住友化学（株）製、ESPN-180等〕及びこれ
らを変性したエポキシ樹脂が挙げられる。これらのエポ
キシ樹脂は併用することも可能である。The epoxy resin used in the present invention is a bisphenol A type epoxy resin [made by Yuka Shell Epoxy Co., Ltd.,
Epicote 828,1001,1002,1003,1004,1005,1007,1010,1
100 L, etc.], brominated bisphenol A type epoxy resin [Yukaka Shell Epoxy Co., Ltd., Epicoat 5050,5051,5051
H etc.], o-cresol novolak type epoxy resin [Sumitomo Chemical Co., Ltd., ESCN-220L, ESCN-220F, ESCN-220H, ESCN
-220HH], brominated novolak type epoxy resin [Nippon Kayaku Co., Ltd., BREN-S etc.], phenol novolak type epoxy resin [Sumitomo Chemical Co., Ltd. ESPN-180 etc.] and these modified An epoxy resin may be used. These epoxy resins can be used together.
本考案ではこのエポキシ樹脂に硬化剤を溶融混合し、実
質上未硬化状態で、枠状に成形する。硬化剤の例とし
て、アミン系硬化剤、酸無水物系硬化剤、フエノール樹
脂系硬化剤、触媒系硬化剤等、エポキシ樹脂と硬化反応
可能な硬化剤であれば特に限定はないが、好ましくは室
温で固型の硬化剤が望ましい。In the present invention, a curing agent is melt-mixed with this epoxy resin and molded into a frame shape in a substantially uncured state. Examples of the curing agent include amine-based curing agents, acid anhydride-based curing agents, phenol resin-based curing agents, catalyst-based curing agents and the like, but are not particularly limited as long as they are curing agents capable of undergoing a curing reaction with an epoxy resin, but are preferably A hardener that is solid at room temperature is desirable.
アミン類の具体例としては、ジエチレントリアミン、ト
リエチレンテトラミン、ビス（ヘキサメチレン）トリア
ミン、トリメチルヘキサメチレンジアミン、メンセンジ
アミン、イソホロンジアミン、メタキシリレンジアミ
ン、3,9−ビス（３−アミノプロピル）−2,4,8−テトラ
スピロ〔5.5〕ウンデカン、メタフエニレンジアミン、
ジアミノジフエニルメタン、ジアミノジフエニルスルホ
ン、4,4′−メチレンビス（２−クロロアニリン）及び
これとエポキシ樹脂とのアダクト等を、酸無水物の具体
例としては、無水フタル酸、無水トリメツト酸、無水ピ
ロメリツト酸、無水ベンゾフエノンテトラカルボン酸、
無水マレイン酸、テトラヒドロ無水フタル酸、ヘキサヒ
ドロ無水フタル酸、無水メチルナジツク酸、無水メチル
シスロヘキセンテトラカルボン酸、テトラクロロ無水フ
タル酸、テトラブロモ無水フタル酸等を、フエノール類
の具体例としては、フエノール、ｏ−クレゾールノボラ
ツク、フエノールノボラツク、フエノールアラルキル等
を挙げることができる。触媒系硬化剤としては例えばベ
ンジルジメチルアミン、2,4,6−トリス（ジメチルアミ
ノメチル）フエノール、ピペリジン、ピリジン、ピコリ
ン等の３級アミンや、２−エチル−４−メチルイミダゾ
ールで代表されるイミダゾール類、その他1,8−ジアザ
ビシクロ〔5.4.0〕ウンデン、BF3等のルイス酸、ジシア
ンジアミド、アミンイミド、有機酸ヒドラジド等、また
これらを組合せた混合物や、塩、錯体等に変性したもの
等を挙げることができる。硬化剤の配合量は通常触媒系
硬化剤の場合はエポキシ樹脂100に対し0.1〜20phr、そ
の他の場合はエポキシ基に対して当量比で0.5〜２の範
囲とするのが好ましい。Specific examples of amines include diethylenetriamine, triethylenetetramine, bis (hexamethylene) triamine, trimethylhexamethylenediamine, mensendiamine, isophoronediamine, metaxylylenediamine, 3,9-bis (3-aminopropyl)- 2,4,8-tetraspiro [5.5] undecane, metaphenylenediamine,
Diaminodiphenylmethane, diaminodiphenyl sulfone, 4,4'-methylenebis (2-chloroaniline) and adducts thereof with an epoxy resin, and specific examples of acid anhydrides include phthalic anhydride, trimetic anhydride, and Pyromellitic anhydride, benzophenone tetracarboxylic anhydride,
Maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, anhydrous methyl nadetic acid, methylcislohexene tetracarboxylic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride and the like, specific examples of phenols include phenol, Examples thereof include o-cresol novolak, phenol novolak, and phenol aralkyl. Examples of the catalyst type curing agent include tertiary amines such as benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, piperidine, pyridine and picoline, and imidazole represented by 2-ethyl-4-methylimidazole. Others, Lewis acid such as 1,8-diazabicyclo [5.4.0] unden, BF 3 , dicyandiamide, amine imide, organic acid hydrazide, and the like, and a mixture of these, salts, modified with a complex, and the like. be able to. The amount of the curing agent is usually 0.1 to 20 phr with respect to 100 of the epoxy resin in the case of the catalyst type curing agent, and in other cases, the equivalent ratio to the epoxy group is preferably in the range of 0.5 to 2.
本考案においてフイルムは上記エポキシ樹脂が溶融して
いる時に供給すると、ホツトメルト接着剤のようにエポ
キシ樹脂とフイルムとを一体化することができる。ここ
で実用上未硬化状態とは硬化反応が多少進んでいるかも
知れないが、加熱することによつてなお溶融させること
が可能な状態をいう。硬化反応が進み実質上未硬化状態
といえない状態では、再加熱してももはや溶融させるこ
とはできない。In the present invention, when the film is supplied while the epoxy resin is melted, the epoxy resin and the film can be integrated like a hot melt adhesive. Here, the uncured state in practical use means a state in which the curing reaction may proceed to some extent, but can still be melted by heating. In the state where the curing reaction proceeds and it cannot be said that it is substantially in an uncured state, it can no longer be melted by reheating.
一方、他の方法として、液状エポキシに硬化剤を混合し
たものをフイルムに塗布した後、加熱し、室温で固形と
なるま硬化反応を少し進めることによつても得られる。
この場合、再可熱によつて溶融することが必要であるた
め、いわゆるＢステージ状態が好ましい。On the other hand, as another method, it is also possible to apply a mixture of a liquid epoxy and a curing agent to a film, then heat the film to slightly advance the curing reaction until it becomes solid at room temperature.
In this case, the so-called B stage state is preferable because it is necessary to melt it by reheating.
以上のエポキシ樹脂を枠状に形成する場合、プレスや押
出等によつてシート状にしたものを打抜成形する方法や
射出成形によって成形する方法がある。When forming the above-mentioned epoxy resin in a frame shape, there are a method of punching and molding a sheet-shaped product by pressing or extrusion, and a method of molding by injection molding.
本考案では成形をやりやすくする目的で必要に応じて熱
可塑性樹脂、充填剤、可塑剤、難燃材、補強材、滑材、
分散材、離型剤、消泡剤、界面活性剤、顔料、染料、カ
ツプリング剤等が挙げられる。充填材としてはマイカ、
シリカ、ガラス繊維、ガラスフレーク、ガラス粉、炭素
繊維、タルク、炭酸カルシウム等の無機充填材、アラミ
ド繊維、ナイロン繊維等の有機充填材など、難燃材とし
ては三酸化アンチモン、水酸化アルミニウム、赤リン、
ハロゲン化合物など、滑材、分散材、界面活性剤として
はワツクス、ステアリン酸亜鉛、シリコンオイルなど、
顔料及び染料としてはカーボンブラツク、ベンガラ、チ
タン白、シアニンブルーなど、カツプリング剤としては
シランカツプリング剤、チタンカツプリング剤などを例
示できる。加熱溶融、硬化させる温度は約80〜180℃が
望ましい。但し、フイルムの耐熱性を越える温度は避け
るべきである。In the present invention, thermoplastic resin, filler, plasticizer, flame retardant, reinforcing material, lubricant,
Examples thereof include a dispersant, a release agent, a defoaming agent, a surfactant, a pigment, a dye and a coupling agent. Mica as a filler,
Inorganic fillers such as silica, glass fibers, glass flakes, glass powder, carbon fibers, talc, calcium carbonate, etc., organic fillers such as aramid fibers, nylon fibers, etc. As flame retardants, antimony trioxide, aluminum hydroxide, red Rin,
Lubricants, dispersion materials, waxes such as halogen compounds, wax as surfactant, zinc stearate, silicone oil, etc.
Examples of pigments and dyes include carbon black, red iron oxide, titanium white, cyanine blue, and the like, and examples of coupling agents include silane coupling agents and titanium coupling agents. The temperature for heating, melting and curing is preferably about 80 to 180 ° C. However, temperatures above the heat resistance of the film should be avoided.
本考案のCOB封止材料の流れ防止枠の形状としては任意
であるが、例えば断面が円形、正方形、長方形、菱形、
楕円状等のものを挙げることができる。第１図に本考案
のCOB封止材料の流れ防止枠の断面を示す。１がフイル
ム、２が実質上未硬化状態のエポキシ樹脂からなる枠で
あり、フイルムが枠の上に載置されている。第２図はフ
イルム１と枠２のエポキシ樹脂が未硬化状態で溶融して
いる本考案の流れ防止枠の断面を示す。第３図に本考案
の防止枠を用いてCOB封止材料の流れを防止している状
態図を示す。基板３上のICベアチツプ４を封止するCOB
封止材料５は防止枠６によつて流出が防止されている。The shape of the flow prevention frame of the COB sealing material of the present invention is arbitrary, for example, the cross section is circular, square, rectangular, rhombic,
Examples thereof include elliptical shapes. FIG. 1 shows a cross section of the flow prevention frame of the COB sealing material of the present invention. Reference numeral 1 is a film, and 2 is a frame made of a substantially uncured epoxy resin, and the film is placed on the frame. FIG. 2 shows a cross section of the flow prevention frame of the present invention in which the epoxy resin of the film 1 and the frame 2 are melted in an uncured state. FIG. 3 shows a state diagram in which the flow of the COB sealing material is prevented by using the prevention frame of the present invention. COB that seals the IC bare chip 4 on the board 3
The sealing material 5 is prevented from flowing out by the prevention frame 6.
（実施例） 以下に実施例及び比較例を挙げて説明する。(Example) Below, an example and a comparative example are given and demonstrated.
実施例１ ・ビスフエノールＡ型エポキシ樹脂 （エピコート1004） 100重量部 ・イミダゾール系硬化剤 ５重量部 ・ポリエステル樹脂 10重量部 ・シリカ 50重量部 ・カーボンブラツク １重量部 上記成分を100℃で１分間ニーダーで溶融混合し、プレ
ート温度70℃に設定したプレス下側盤面の上に75μのポ
リイミドフイルムを置いた上に上記溶融混合物を置き、
更に離型紙を置いてプレスした。この時スペーサーを入
れ肉厚が約0.7mmとなるようにした。室温に冷却された
上記複合シートを内径10mmφ、外径12mmφの枠状形状に
打ち抜いた。Example 1 100 parts by weight of bisphenol A type epoxy resin (Epicoat 1004) 5 parts by weight of imidazole curing agent 10 parts by weight of polyester resin 50 parts by weight of silica 1 part by weight of carbon black 1 minute by weight of the above components at 100 ° C. Melt mix with a kneader, place the above melt mixture on a 75μ polyimide film on the press lower side plate surface set to a plate temperature 70 ° C,
Further, release paper was placed and pressed. At this time, a spacer was inserted so that the wall thickness was about 0.7 mm. The above composite sheet cooled to room temperature was punched into a frame shape having an inner diameter of 10 mmφ and an outer diameter of 12 mmφ.
この枠をベアチツプICの搭載された基板上にベアチツプ
が大略中心にくるようにフイルム面を上にして設置し、
150℃に加熱したオーブン中へ１時間入れたところ、エ
ポキシ樹脂が溶融した後、硬化し、土手形状となつた。This frame is placed on the board on which the bare chip IC is mounted with the film surface facing up so that the bare chip is at the center of the frame.
When placed in an oven heated to 150 ° C. for 1 hour, the epoxy resin was melted and then cured to form a bank.
更にベアチツプへCOB封止材料を供給し、150℃で１時間
オーブン中へ入れておくと、COB封止材料が硬化しベア
チツプを完全に封止した。この時、防止枠を越えてCOB
封止材料が溢れ出すことはなかつた。When the COB sealing material was further supplied to the bare chip and placed in an oven at 150 ° C. for 1 hour, the COB sealing material was cured and the bare chip was completely sealed. At this time, COB is exceeded beyond the prevention frame.
The encapsulating material never overflowed.
実施例２ 0.5mmの厚みを有するガラスエポキシプリント基板の片
面に、ビスフエノールＡ型エポキシ樹脂（エピコート82
8）100重量部、ジアミノジフエニルメタン26重量部を70
℃で混合したものを塗布した。この状態では表面がベタ
ベタしたものであつたが、70℃で２時間加熱しておくと
実質上未硬化状態で室温固型のでエポキシ樹脂が得られ
た。次いで室温に冷却された上記複合シートを内径10mm
φ、外径12mmφの枠状形状に打ち抜いた。Example 2 On one surface of a glass epoxy printed circuit board having a thickness of 0.5 mm, a bisphenol A type epoxy resin (Epicoat 82
8) 100 parts by weight, diaminodiphenylmethane 26 parts by weight 70 parts
The mixture mixed at ° C was applied. In this state, the surface was sticky, but when it was heated at 70 ° C. for 2 hours, an epoxy resin was obtained because it was substantially uncured and solid at room temperature. Then, the above composite sheet cooled to room temperature has an inner diameter of 10 mm.
Punched into a frame shape with φ and outer diameter of 12 mmφ.
これをベアチツプICの搭載された基板上にベアチツプが
大略中心にくるようにフイルム面を上にして設置し、15
0℃に加熱したオーブン中へ１時間入れたところ、エポ
キシ樹脂が溶融した後、硬化し、土手形状となつた。Place this on the board on which the bare chip IC is mounted, with the film surface facing up so that the bare chip is approximately in the center.
When placed in an oven heated to 0 ° C. for 1 hour, the epoxy resin melted and then hardened to form a bank.
更にベアチツプへCOB封止材料を供給し、150℃で１時間
オーブン中へ入れておくと、COB封止材料が硬化しベア
チツプを完全に封止した。この時、防止枠を越えてCOB
封止材料が溢れ出すことはなかつた。When the COB sealing material was further supplied to the bare chip and placed in an oven at 150 ° C. for 1 hour, the COB sealing material was cured and the bare chip was completely sealed. At this time, COB is exceeded beyond the prevention frame.
The encapsulating material never overflowed.
比較例１ 実施例１でポリイミドフイルムを用いない他は同様にし
て得られたエポキシ樹脂の枠状成形品を150℃のオーブ
ン中に入れると、溶融したが、その時、形状はかなりイ
ビツなものとなり、部分的にはベアチツプにかかる位に
なつた。Comparative Example 1 When a frame-shaped molded product of an epoxy resin obtained in the same manner as in Example 1 except that the polyimide film was not used was placed in an oven at 150 ° C., it was melted, but at that time, the shape became considerably squished. , Partially reached the point of bare chip.
（考案の効果） 本考案によれば 枠状に予め成形されているため取り扱いが極めて容
易である。(Effect of the Invention) According to the present invention, since it is preliminarily molded into a frame shape, it is extremely easy to handle.
エポキシ樹脂を加熱溶融させた場合、枠状フイルム
又はシートに形状が表面張力によつて規制され土手形状
がくずれることが無い。When the epoxy resin is heated and melted, the shape of the frame-shaped film or sheet is restricted by surface tension and the bank shape is not broken.
硬化後はエポキシ樹脂の有する耐熱性、耐絶縁性、
耐溶剤性、接着性に優れた枠状となすことができる。After curing, the heat resistance and insulation resistance of the epoxy resin,
It can be formed in a frame shape having excellent solvent resistance and adhesiveness.
COB封止材料の流出防止において、自動化、省力化
及び土手形状の安定や位置精度の向上等により、COB封
止の品質向上に寄与する。In preventing the outflow of COB sealing material, it contributes to the quality improvement of COB sealing by automation, labor saving, stabilization of the bank shape and improvement of position accuracy.
第１〜２図は本考案のCOB封止材料の流れ防止枠の断面
図、第３図は本考案の防止枠を用いてCOB封止材料の流
れを防止している状態図である。1 and 2 are sectional views of the flow preventive frame of the COB sealing material of the present invention, and FIG. 3 is a state diagram in which the flow of the COB sealing material is prevented by using the preventive frame of the present invention.
Claims (1)
ム又はシートで覆われた、枠状に成形された硬化可能
な、室温で固形で100℃以上で溶融する実質上未硬化状
態のエポキシ樹脂からなるCOB封止材料の流れ防止枠。1. A frame-shaped curable epoxy which is solid at room temperature and melts at 100 ° C. or higher, which is covered with a film or sheet having a heat resistance of 150 ° C. or higher on one side. COB sealing material flow prevention frame made of resin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071140U JPH0745963Y2 (en) | 1989-06-16 | 1989-06-16 | COB sealing material flow prevention frame |
| US07/539,816 US5126188A (en) | 1989-06-16 | 1990-06-18 | Shaped material for use in sealing electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071140U JPH0745963Y2 (en) | 1989-06-16 | 1989-06-16 | COB sealing material flow prevention frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0310545U JPH0310545U (en) | 1991-01-31 |
| JPH0745963Y2 true JPH0745963Y2 (en) | 1995-10-18 |
Family
ID=31607908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989071140U Expired - Lifetime JPH0745963Y2 (en) | 1989-06-16 | 1989-06-16 | COB sealing material flow prevention frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745963Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7575653B2 (en) * | 1993-04-15 | 2009-08-18 | 3M Innovative Properties Company | Melt-flowable materials and method of sealing surfaces |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285730A (en) * | 1985-06-13 | 1986-12-16 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device and resin mold member used therefor |
| JPS6239033A (en) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | Manufacture of semiconductor chip carrier |
| JPS6322735U (en) * | 1986-07-29 | 1988-02-15 |
-
1989
- 1989-06-16 JP JP1989071140U patent/JPH0745963Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310545U (en) | 1991-01-31 |
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