JPH0750585B2 - Fuse circuit formation method - Google Patents
Fuse circuit formation methodInfo
- Publication number
- JPH0750585B2 JPH0750585B2 JP1096384A JP9638489A JPH0750585B2 JP H0750585 B2 JPH0750585 B2 JP H0750585B2 JP 1096384 A JP1096384 A JP 1096384A JP 9638489 A JP9638489 A JP 9638489A JP H0750585 B2 JPH0750585 B2 JP H0750585B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- solder
- fuse
- circuit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Fuses (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子回路用基板のヒューズ回路形成におい
て、この回路形成を容易にかつ確実にする方法に関す
る。Description: TECHNICAL FIELD The present invention relates to a method of easily and reliably forming a fuse circuit in an electronic circuit substrate in forming the fuse circuit.
電子回路基板において、ヒューズ回路を形成するには、
導体回路の両側の端末間に低融点金属を融着させて形成
している。To form a fuse circuit on an electronic circuit board,
It is formed by fusing a low melting point metal between terminals on both sides of the conductor circuit.
以下、低融点金属としてハンダを使用した場合について
説明する。他の金属を使用した場合も同様である。The case where solder is used as the low melting point metal will be described below. The same applies when other metals are used.
（１）板状又は線状のハンダをハンダごてを用いて、導
体回路の両端末にハンダづけする。(1) Solder plate-like or linear solder to both ends of the conductor circuit using a soldering iron.
（２）板状のハンダを導体回路の両端末に橋わたしする
ように載置し基板全体をリフロー炉などで加熱する。(2) Place the plate-shaped solder so as to bridge both ends of the conductor circuit and heat the entire board in a reflow oven or the like.
（３）導体回路の両端末と、中間の部分に、印刷の手法
によりハンダペーストを塗布し、リフロー炉などで加熱
する。(3) Solder paste is applied to both ends of the conductor circuit and an intermediate portion by a printing method and heated in a reflow oven or the like.
等の方法が採用されてきた。Etc. have been adopted.
前記（１）の方法によるときは、手間がかかって生産性
が悪い上に、ハンダが溶融したときに、表面張力によっ
て、接続される導体回路の中間にひけが生じて分離して
しまい、回路間の接続がうまくいかないという問題点が
あった。According to the method (1), it takes time and labor to reduce productivity, and when the solder is melted, surface tension causes a sink mark in the middle of the conductor circuit to be connected and the conductor circuit is separated from the circuit. There was a problem that the connection between them did not work.
また（２）による方法では、導体と板状ハンダの間に僅
かな隙間が存在するため、導体への密着接続が充分に得
られる様にしようとすると、加熱時間を長くする必要が
あり、その結果（１）と同様にハンダ全体が溶融して導
体回路の中間にひけが生じ、回路間が接続されない。Further, in the method according to (2), since there is a slight gap between the conductor and the plate-shaped solder, it is necessary to lengthen the heating time in order to obtain a sufficient close contact with the conductor. As in the result (1), the entire solder melts and sink marks occur in the middle of the conductor circuit, so that the circuits are not connected.
また、（３）の方法によるときも、加熱時にハンダの粒
どうしの凝集が起こり易く、連続した状態でのハンダ形
成が困難となる問題がある。Further, also in the case of the method (3), there is a problem that solder particles are likely to be aggregated during heating, which makes it difficult to form solder in a continuous state.
このように従来の方法では、ヒューズ回路を十分に接続
しようとするとひけによりハンダが丸まってしまい、う
まく接続できず、逆にひけによってハンダが丸まらない
ように加熱すると接続が不十分となるという問題点があ
った。As described above, in the conventional method, when the fuse circuit is sufficiently connected, the solder curls due to the sink, and the solder cannot be connected well. There was a point.
本発明の目的は、電子回路用基板のヒューズ回路形成に
おいて、この回路形成を確実に、しかも容易、従って効
率的に行う方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for reliably forming a fuse circuit on an electronic circuit substrate, easily and therefore efficiently.
本発明は、電子回路用基板上に低融点のヒューズ金属に
て、ヒューズ回路を形成するに際し、導体回路の両端末
上に、先ずクリーム状金属を塗布したのち、その上に前
記クリーム状金属に含まれる金属粒子と同一組成の板状
又は線状ヒューズ金属を橋かけ状に載置し、全体をこの
同じ融点の金属の融点以上、融点より５℃高い温度以下
に短時間加熱して融着させることを特徴とするヒューズ
回路形成方法である。The present invention, when forming a fuse circuit with a low melting point fuse metal on a substrate for electronic circuits, first apply a cream-like metal on both ends of the conductor circuit, and then apply the cream-like metal thereon. A plate-like or linear fuse metal having the same composition as the contained metal particles is placed in a bridge shape, and the whole is fused by heating for a short time above the melting point of the metal having the same melting point and below the melting point of 5 ° C. or higher. And a fuse circuit forming method.
本発明のヒューズ回路の形成においては、クリーム状即
ちペースト状の金属、例えばハンダペーストを導体回路
の両端末上に印刷法などにより塗布する。次いでこの上
にハンダペースト中の金属粒子と同一組成の板状又は線
状の板状又は線状のヒューズ金属を載置する。この様な
ヒューズ回路の形成に使用されるペースト状の金属及び
線状又は板状のヒューズ金属としては、融点150〜300℃
でかつ導体回路に使用されるAu、Cu、Ag、Niなどの金属
や、Ag−Od、Ag−Ptなどの合金に対して、濡れ性のよい
Au−Sn、Ag−In、Sn−Pb−Ag、Sn−Pb、Ag−Sn、Snなど
の金属や合金が好適に使用される。In forming the fuse circuit of the present invention, a cream-like or paste-like metal such as solder paste is applied to both ends of the conductor circuit by a printing method or the like. Then, a plate-shaped or linear plate-shaped or linear fuse metal having the same composition as the metal particles in the solder paste is placed on this. The paste-like metal and the linear or plate-like fuse metal used for forming such a fuse circuit have a melting point of 150 to 300 ° C.
And has good wettability to metals such as Au, Cu, Ag, and Ni used for conductor circuits and alloys such as Ag-Od and Ag-Pt.
Metals and alloys such as Au-Sn, Ag-In, Sn-Pb-Ag, Sn-Pb, Ag-Sn and Sn are preferably used.
次に全体をリフロー炉、ホットプレートやVPS（ベーパ
ーフェーズソルダリング）装置やオーブン等の加熱装置
に入れ、ピーク温度をヒューズ金属の融点の僅かに上、
即ち（融点＋５℃）以下の温度とし、融点以上になる時
間を短時間、通常５秒以内となるように加熱して板状ヒ
ューズ金属等を融着させる。Next, the whole is put in a heating device such as a reflow furnace, a hot plate, a VPS (vapor phase soldering) device or an oven, and the peak temperature is slightly above the melting point of the fuse metal.
That is, the temperature is set to (melting point + 5 ° C.) or less, and heating is performed for a short time, usually 5 seconds or less, to fuse the plate-shaped fuse metal or the like.
ハンダペーストによって、板ハンダと導体との間の隙間
が完全に埋められるため、ハンダが流動しない程度の短
時間の加熱で充分な密着状態が得られ回路間が接続され
る。又この場合ハンダペースト中に含まれているフラッ
クスによって導体回路との濡れがよくなるので、この接
続は更に確実なものとなる。Since the gap between the plate solder and the conductor is completely filled with the solder paste, sufficient adhesion can be obtained by heating for a short time so that the solder does not flow, and the circuits are connected. Further, in this case, the flux contained in the solder paste improves the wetting of the conductor circuit, so that this connection becomes more reliable.
この時、加熱装置内の温度は、板状金属の融点より５℃
高い温度以下に保たれ、時間も短時間であるので、板状
金属全体が融解して、丸くなることもなく、接続が確実
に行われることになる。At this time, the temperature inside the heating device is 5 ° C. higher than the melting point of the plate-shaped metal.
Since the temperature is maintained at a high temperature or lower and the time is short, the entire plate-shaped metal is not melted and rounded, and the connection is surely made.
しかも、加熱装置の中で、温度制御しながら、加熱する
ことによって多数の基板に同時にヒューズ回路を形成す
ることができて、生産効率も優れている。Moreover, since the fuse circuits can be simultaneously formed on a large number of substrates by heating while controlling the temperature in the heating device, the production efficiency is excellent.
以下に実施例により、本発明を更に具体的に説明する
が、本発明は、この実施例によって限定されるものでは
ない。Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
（実施例１） 導体回路の両端末上（第１図Ａ）にハンダペースト
を印刷する（第１図Ｂ）。ハンダペーストとしてはSn−
Pb共晶ハンダ、溶融温度183℃を使用した。Example 1 Solder paste is printed on both ends (FIG. 1A) of the conductor circuit (FIG. 1B). Sn-
Pb eutectic solder, melting temperature 183 ° C was used.
両端末に橋かけするように板ハンダ（Sn−Pb共晶ハ
ンダ、溶融温度183℃）をのせる（第１図Ｃ）。Plate solder (Sn-Pb eutectic solder, melting temperature 183 ° C) is placed so as to bridge both terminals (Fig. 1C).
ベルト炉にて、全体を加熱する。この時の温度はピ
ーク温度185℃、183℃以上の温度での保持時間は５秒以
内とした（第１図Ｄは断面立面図を示す。） ハンダペーストによって、導体回路と板ハンダとの間の
隙間が埋められ、ハンダペースト中に含まれるフラック
スによって、ハンダの導体回路への濡れがよくなり、こ
の導体回路と板ハンダとの重なった部分が優先的に融着
し温度と時間の制御により、板ハンダの他の部分が溶融
しても、丸まり難いので回路間の接続が容易にできる。The whole is heated in a belt furnace. The temperature at this time was set to a peak temperature of 185 ° C., and a holding time at a temperature of 183 ° C. or higher was set to 5 seconds or less (FIG. 1D shows a sectional elevation view). The gap between them is filled, and the flux contained in the solder paste improves the wetting of the conductor circuit by the solder, and the overlapping part of this conductor circuit and the plate solder preferentially fuses to control the temperature and time. As a result, even if the other parts of the plate solder are melted, it is difficult for them to be rolled, so that the circuits can be easily connected.
接続しようとする回路上に、ペースト状ハンダ金属があ
り、その上にペースト状金属に含まれる金属粒子と同一
組成の板ハンダが間隙のない状態で載っているので、加
熱したとき、ハンダペーストが融けて板ハンダと回路と
が接続され板ハンダが流動しない程度の短時間の加熱で
十分な密着状態が得られ、回路間が接続される。このた
め回路のヒューズ形成が極めて容易に且つ確実に出来
る。On the circuit to be connected, there is a paste-like solder metal, and the plate solder of the same composition as the metal particles contained in the paste-like metal is placed on top of it without any gap, so when heating, the solder paste is A sufficient adhesion state is obtained by heating for a short time so that the plate solder and the circuit are melted and the plate solder is not connected and the plate solder does not flow, and the circuits are connected. Therefore, the fuse formation of the circuit can be performed very easily and surely.
さらに又ハンダペーストに含まれる金属粒子と、板状又
は線状のヒューズ金属とに同一組成のものを用いてヒュ
ーズを形成するので、正確な作動温度のヒューズ回路が
得られる。Further, since the fuse is formed by using the metal particles contained in the solder paste and the plate-shaped or linear fuse metal having the same composition, a fuse circuit having an accurate operating temperature can be obtained.
第１図は本発明の基板上のヒューズ回路の形成方法の手
順を示した平面図（Ａ〜Ｃ）、Ｄは側面断面図である。 Ａ……導体回路の両端末を示す、Ｂ……両端末上にペー
スト状金属を塗布した所を示す、Ｃ……両端末に橋かけ
するように板ハンダを載置する、Ｄ……加熱装置に入れ
る状態の側面断面図を示す。FIG. 1 is a plan view (A to C) showing a procedure of a method for forming a fuse circuit on a substrate of the present invention, and D is a side sectional view. A: Both terminals of the conductor circuit are shown, B: Where the paste metal is applied on both terminals, C: Plate solder is placed so as to bridge both terminals, D: Heating FIG. 3 is a side sectional view showing a state of being put in the device.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 孝雄 東京都江東区木場１丁目５番１号 藤倉電 線株式会社内 (72)発明者 宇留賀 謙一 東京都江東区木場１丁目５番１号 藤倉電 線株式会社内 (56)参考文献 実開 昭59−162764（ＪＰ，Ｕ) 実開 昭56−51382（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takao Suzuki 1-5-1, Kiba, Koto-ku, Tokyo Fujikura Electric Line Co., Ltd. (72) Kenichi Uruga Kenichi 5-5-1, Kiba, Koto-ku, Tokyo Fujikura Electric Wire Co., Ltd. (56) References Actually open 59-162764 (JP, U) Actually open 56-51382 (JP, U)
Claims (1)
ーズ回路を形成するに際し、導体回路の両端末上に、先
ずクリーム状金属を塗布したのち、その上に前記クリー
ム状金属に含まれる金属粒子と同一組成の板状又は線状
ヒューズを載置し、全体をこの同じ融点の金属の融点以
上、融点より５℃高い温度以下に短時間加熱して融着さ
せることを特徴とするヒューズ回路形成方法。1. When forming a fuse circuit with a low melting point metal on an electronic circuit board, a creamy metal is first applied to both ends of the conductor circuit, and then the creamy metal is contained thereon. Characterized in that a plate-like or linear fuse having the same composition as the metal particles to be placed is placed, and the whole is heated to a temperature not lower than the melting point of the metal having the same melting point and not higher than 5 ° C. for a short time to fuse the particles. Method of forming fuse circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1096384A JPH0750585B2 (en) | 1989-04-18 | 1989-04-18 | Fuse circuit formation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1096384A JPH0750585B2 (en) | 1989-04-18 | 1989-04-18 | Fuse circuit formation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02276125A JPH02276125A (en) | 1990-11-13 |
| JPH0750585B2 true JPH0750585B2 (en) | 1995-05-31 |
Family
ID=14163468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1096384A Expired - Fee Related JPH0750585B2 (en) | 1989-04-18 | 1989-04-18 | Fuse circuit formation method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0750585B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007317580A (en) * | 2006-05-29 | 2007-12-06 | Uchihashi Estec Co Ltd | Thermo-protector and manufacturing method of thermo-protector |
| JP4735874B2 (en) * | 2009-03-16 | 2011-07-27 | ソニーケミカル＆インフォメーションデバイス株式会社 | Protective element |
| JP4735873B2 (en) * | 2009-03-16 | 2011-07-27 | ソニーケミカル＆インフォメーションデバイス株式会社 | Protective element |
| JP2016096134A (en) * | 2014-11-05 | 2016-05-26 | デクセリアルズ株式会社 | Circuit device, and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5651382U (en) * | 1979-09-27 | 1981-05-07 | ||
| JPS59162764U (en) * | 1983-04-15 | 1984-10-31 | 松下電工株式会社 | Protective devices for electrical equipment |
| JPH02144821A (en) * | 1988-11-25 | 1990-06-04 | Fujikura Ltd | Fuse formation method |
-
1989
- 1989-04-18 JP JP1096384A patent/JPH0750585B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02276125A (en) | 1990-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |