JPH08176496A - Adhesion preventive agent for thermosetting resin and adhesion preventive method - Google Patents

Abstract

(57) [Abstract] [Purpose] An anti-adhesion agent for thermosetting resin that has excellent anti-adhesion properties and solder properties for thermosetting resin, and that does not cause defects during coating or printing. A method of imparting anti-adhesion properties is provided. [Structure] 30 to 99% by weight of at least one of the esters represented by the general formulas (1) to (3) as a constituent unit and a vinyl or (meth) acrylic compound containing a functional group as a constituent unit of 1 to 30% A thermosetting resin adhesion preventive agent comprising a polymer having a fluoroalkyl group or fluoroalkenyl group consisting of 1% by weight and a functional group, wherein the functional group is an alkoxy group having 1 to 6 carbon atoms, an acetoxy group or methoxyethoxy. A hydroxyl group substituted with a group or a carbon number of 1
To 6 is a glycidyl group substituted with an alkoxy group, an acetoxy group or a methoxyethoxy group, and further contains a functional group-containing compound and / or a crosslinking auxiliary agent to prevent adhesion of a thermosetting resin. Inhibitor and method for preventing adhesion of thermosetting resin using the same.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anti-adhesive agent for thermosetting resins, and more particularly, when a thermosetting resin is coated on the surface of a capacitor, excess thermosetting resin adheres to lead wires. The present invention relates to an anti-adhesion agent for preventing heat and a method for imparting thermosetting resin anti-adhesion property to a substrate.

[0002]

2. Description of the Related Art Thermosetting resins such as epoxy resins are often used as moisture-proof protective materials for ceramic capacitors, chemical capacitors, film capacitors and the like. Generally, thermosetting resin such as epoxy resin adheres to the lead wire of the capacitor by coating with thermosetting resin such as epoxy resin, but the capacitor itself is accurate because of the reduction in size and weight of electronic equipment accompanying the progress of integrated circuit technology. Dimensional accuracy is required, and it is required that the thermosetting resin such as epoxy resin does not adhere to the lead wire portion.
In order to prevent the adhesion to the lead wire, various anti-adhesion agents have been conventionally used. For example, silicone type (Japanese Patent Laid-Open No. 53-49260), fluorine type (Japanese Patent Publication No.
62-29473, JP-B-63-7229 and JP-A-62
-149784). However, the silicone-based anti-adhesive agent not only has a low anti-adhesive property for thermosetting resins such as epoxy resin, but also has poor soldering properties, resulting in poor conductivity due to the silicone-based anti-adhesive agent left on the lead wire. have. Fluorine-based anti-adhesive agents have excellent anti-adhesion properties because of their low critical surface tension, and also have excellent solder properties. However, these anti-adhesion agents dissolve in a liquid epoxy resin coating agent (especially one containing a styrene monomer) and inhibit the uniform coating film formation on the surface of the capacitor during mass production in a line, resulting in uneven coating or coating failure. Defects that occur and printing on the surface
It has a drawback that defective (hot stamping) occurs.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks by providing a thermosetting resin which has excellent anti-adhesion property and soldering property of the thermosetting resin and which does not cause defects during coating and printing. It is an object of the present invention to provide an anti-adhesion agent and a method for imparting an anti-adhesion property of a thermosetting resin to a substrate.

[0004]

The present invention is represented by the general formula (1)-
A fluoroalkyl group or fluoro comprising 30 to 99% by weight of at least one of the esters represented by (3) as a constitutional unit and 1 to 30% by weight of a vinyl or (meth) acrylic compound containing a functional group as a constitutional unit. A thermosetting resin adhesion preventive agent comprising a polymer containing an alkenyl group and a functional group, wherein the functional group is a hydroxyl group or carbon number substituted with an alkoxy group having 1 to 6 carbon atoms, an acetoxy group or a methoxyethoxy group. 1 to 6 is a glycidyl group substituted with an alkoxy group, an acetoxy group or a methoxyethoxy group, and further contains a functional group-containing compound and / or a crosslinking aid to prevent adhesion of a thermosetting resin The present invention relates to an anti-adhesion agent and a method for preventing adhesion of a thermosetting resin using the same.

[0005]

Embedded image

[Wherein Rf is a fluoroalkyl group or fluoroalkenyl group having 4 to 20 carbon atoms, R ¹ is a hydrogen atom,
Methyl group, fluorine atom or trifluoromethyl group, R ²
Is an alkylene group having 1 to 10 carbon atoms or --CH ₂ CH (OR
³⁾ CH ₂ -, R ³ is a hydrogen atom or an acyl group having a carbon number of 1 to 11, R ⁴ represents an alkylene group, R ⁵ is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms having 1 to 10 carbon atoms. ]

The polymer containing a fluoroalkyl group or a fluoroalkenyl group and a functional group in the present invention is usually a polymerizable compound containing a fluoroalkyl group or a fluoroalkenyl group and a polymerizable compound containing a functional group. Or a copolymer of these compounds with a compound copolymerizable with the compound. The functional group in the present invention includes, for example, 1 to 6 carbon atoms.
And a hydroxyl group substituted with an acetoxy group or a methoxyethoxy group, an alkoxy group having 1 to 6 carbon atoms, a glycidyl group substituted with an acetoxy group or a methoxyethoxy group, and the like. Examples of the polymerizable compound containing a fluoroalkyl group or a fluoroalkenyl group include an acrylic acid ester containing a fluoroalkyl group or a fluoroalkenyl group or an α-substituted acrylic acid ester. Specifically, for example, the following general formula ( The compounds represented by 4) to (6) can be exemplified.

[0008]

[Chemical 4]

[Wherein Rf is a fluoroalkyl group or fluoroalkenyl group having 4 to 20 carbon atoms, R ¹ is a hydrogen atom,
Methyl group, fluorine atom or trifluoromethyl group, R ²
Is an alkylene group having 1 to 10 carbon atoms or --CH ₂ CH (OR
³⁾ CH ₂ -, R ³ is a hydrogen atom or an acyl group having a carbon number of 1 to 11, R ⁴ represents an alkylene group, R ⁵ is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms having 1 to 10 carbon atoms. ]

In the present invention, the fluoroalkyl group includes a perfluoroalkyl group and a ω-hydroperfluoroalkyl group, and a perfluoroalkyl group is preferable,
Of the fluoroalkenyl groups, perfluoroalkenyl groups are preferred. Specific examples of the acrylic acid ester and the α-substituted acrylic acid ester represented by the general formulas (4) to (6) are shown below. _{CF 3 (CF 2) 4 CH} 2 OCOCH = CH 2 CF 3 (CF 2) 6 (CH 2) 2 OCOCH = CH 2 CF 3 (CF 2) 6 OCOCH = CH 2 CF 3 (CF 2) 7 CH 2 CH _{2 OCOCH = CH 2 CF 3 (} CF 2) CF (CF 2 CF 2) 3~8 CH 2 CH (OH) C
_{H 2 OCOCH = CH 2 (CF} 3) 2 CF (CF 2 CF 2) 2~8 CH 2 CH (OCOCH 3)
CH ₂ OCOCH = CH ₂

[0011]

[Chemical 5]CF₃(CF₂)₇SO₂N (C₂H_Five) CH₂CH₂OCOCH =
CH₂ CF₃CF₂(CF₂CF₂)_{2 ~ 8}(CH₂CH₂)_1-2OCOC
H = CH₂ CF₃(CF₂)₇SO₂N (CH₃) CH₂CH₂OCOCH =
CH₂ (CF₃)₃C (CF₂CF₂)₂CH₂CH₂OCOCH = CH₂ (CF₃)₂CF (CF₂CF₂)₃CH₂CH₂OCOCH = C
H₂ CF₃(CF₂)₇SO₂N (C₃H₇) CH₂CH₂OCOCH =
CH₂ CF₃(CF₂)₇CONHCH₂CH₂OCOCH = CH₂ H (CF₂CF₂)_FourCH₂OCOCH = CH₂  CF₃CF₂(CF₂CF₂)₃CH₂CH₂OCOCH = CH₂ CF₃(CF₂)₇SO₂N (C₂H_Five) CH₂CH₂OCOCH =
CH₂ And the hydrogen atom at the α-position of these acrylates
Corresponding each substituted by a tyl group, F or fluoromethyl group
Mention may be made of acrylates.

The polymerizable compound containing a functional group is, for example,

[Chemical 6] 2-Hydroxyethyl (meth) acrylate 2-hydroxy-3-chloropropyl (meth) acrylate Glycidyl (meth) acrylate and the like can be exemplified over a wide range, and these are also used alone or in combination of two or more kinds. .

The polymerizable compound having a fluoroalkyl group or a fluoroalkenyl group and the compound capable of copolymerizing with the polymerizable compound having a functional group can be selected in a wide range as long as the performance is not deteriorated. .
For example, ethylene, vinyl acetate, vinyl chloride, vinyl fluoride, vinylidene halide, styrene, acrylic acid and its alkyl ester, methacrylic acid and its alkyl ester, poly (oxyalkylene) acrylate, poly (oxyalkylene) methacrylate, acrylamide,
Methacrylamide, diacetone acrylamide, methylol diacetone acrylamide, N-methylol acrylamide, vinyl alkyl ether, perfluoroalkenyl vinyl ether, halogenated alkyl vinyl ether, vinyl alkyl ketone, butadiene, isoprene, chloroprene, glycidyl acrylate, glycidyl methacrylate, benzyl acrylate , Benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, maleic acid and its alkyl esters, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, aziridyl acrylate, aziridyl methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, etc. Connexion are possible examples, may be employed in combination are also one or more kinds.

In the present invention, a polymer containing a fluoroalkyl group or fluoroalkenyl group and a functional group as described above is applied to the surface of a lead wire or the like by applying an organic solution prepared by dissolving the polymer in an organic solvent. Form a covering film. In this case, as a polymer containing a fluoroalkyl group or a fluoroalkenyl group and a functional group for forming an anti-adhesion coating film of a thermosetting resin such as an epoxy resin by coating, a polymer having a good coating forming ability should be used. It can be suitably adopted. From the viewpoint of such solubility, film-forming ability, adhesion, etc., in the present invention, as a polymerizable compound having a fluoroalkyl group or a fluoroalkenyl group and another compound copolymerizable with a polymerizable compound having a functional group. Is preferably such that it does not affect the anti-adhesion property, for example, stearyl acrylate, stearyl methacrylate, lauryl acrylate, lauryl methacrylate, 2-ethylhexyl acrylate, 2
Polymerizable compounds having a long-chain alkyl group such as -ethylhexyl methacrylate are exemplified as particularly preferable ones. As the polymerizable compound having a functional group, a compound having good coating strength and adhesion to the surface of a lead wire or the like is preferable.

In order to further improve the coating strength and adhesion of the anti-adhesion coating film made of the above-mentioned polymer, a polymer having a fluoroalkyl group or a fluoroalkenyl group and a functional group is added to the functional group-containing compound or / and Add a crosslinking aid. Examples of the functional group-containing compound include a silane coupling agent, a titanium coupling agent, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a polyfunctional polysiloxane compound, and an amine compound, which can be exemplified over a wide range. They may be employed in one kind or in a combination of two or more kinds. The amount of the functional group-containing compound is preferably 0 to 5 parts by weight, more preferably 0 to 2 parts by weight, based on 1 part by weight of the polymer containing the fluoroalkyl group or the fluoroalkenyl group and the functional group.

Examples of silane coupling agents are γ-aminopropyltriethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane. Silane, β- (3,4-epoxycyclohexyl) ethyltrimethylsilane, γ-methacryloxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, vinyltris (β-methoxyethoxy) silane, Vinyltriethoxysilane, vinyltrichlorosilane, vinyltriacetoxysilane, N- (trimethoxysilylpropyl) ethylenediamine, N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane, β
-Aminoethyl-β-aminoethyl-γ-aminopropyltrimethoxysilane and the like can be mentioned.

Examples of titanium coupling agents include tetraalkoxytitanium (eg, tetraethoxytitanium, tetraisopropoxytitanium, tetrabutyroxytitanium),
Tetraethylene glycol titanate, di-n-titanate
Butyl bis (triethanolamine), bis (acetylacetone) acid di-isopropoxy titanium, isopropoxy titanium octanoate, isopropyl titanium trimethacrylate, isopropyl titanium triacrylate, isopropyl tri (butyl, methyl pyrophosphate) titanate, tetraisopropyl Examples thereof include di (dilaurylphosphite) titanate, dimethacryloxyacetate titanate, diacryloxyacetate titanate, di (dioctylphosphate) ethylene titanate, and tri (dioctylphosphoric acid) isopropoxytitanium.

Examples of the polyfunctional isocyanate compound are polymeric MDI (MDI: diphenylmethane diisocyanate), polymeric TDI (TDI: tolylene diisocyanate),

[Chemical 7]

Embedded image Etc. are illustrated.

Examples of polyfunctional epoxy compounds include diglycidyl ether of bisphenol A, butadiene diepoxide, 3,4-epoxycyclohexylmethyl- (3,4
-Epoxy) cyclohexanecarboxylate, vinylcyclohexane dioxide, 4,4'-di (1,2-epoxyethyl) diphenyl ether, 4,4 '-(1,2-epoxyethyl) biphenyl, 2,2-bis (3,4-epoxycyclohexyl) propane, resorcin glycidyl ether, phloroglysin diglycidyl ether, methyl phloroglysin diglycidyl ether, bis (2,3-epoxycyclopentyl) ether, 2- (3,4-epoxy) -Cyclohexane-5,5-spiro (3,4-epoxy) -cyclohexane-m-dioxane, bis- (3,4-epoxy-6-methylcyclohexyl) adipate, N, N'-m-phenylenebis (4,5 -Epoxy-1,2-cyclohexane) dicarboximide and other bifunctional epoxy compounds, para-aminophenol triglycidyl ether, polyary Glycidyl ether, 1,3,5-tri (1,2-epoxy ethyl) benzene, 2,2 ', 4,4'-tetra glycidoxy benzophenone,
Examples thereof include trifunctional or higher functional epoxy compounds such as tetraglycidoxytetraphenylethane, phenol formaldehyde novolac polyglycidyl ether, glycerin triglycidyl ether, and trimethylolpropane triglycidyl ether.

Examples of polyfunctional polysiloxane compounds include

[Chemical 9] R ^6: a methyl group or a phenyl group m: 2 to 200 integer R ^7: a hydrogen atom, can be mentioned ladder polymer like of organosilsesquioxane represented by a methyl group or an ethyl group.

These functional group-containing compounds act as a crosslinking curing agent. In order to accelerate this action, a crosslinking aid is added. As the crosslinking aid, for example, boron trifluoride complex such as boron trifluoride ethyl etherate, triethanolamine, tetramethylbutanediamine, tetramethylpentanediamine, tetramethylhexanediamine,
Tertiary amines such as triethylenediamine and dimethylaniline; oxyalkylamines such as dimethylaminoethanol and dimethylaminopentanol; amines such as tris (dimethylaminomethyl) phenol and methylmorpholine; cetyltrimethylammonium bromide and cetyltrimethylammonium chloride. , Dodecyltrimethylammonium iodide, trimethyldodecylammonium chloride, benzyldimethyltetradecylammonium chloride, benzylmethylpalmitylammonium chloride, allyldodecyltrimethylammonium bromide, benzyldimethylstearylammonium bromide, stearyltrimethylammonium chloride, benzyldimethyltetradecylammonium acetate, etc. of Quaternary ammonium salts, 2-undecyl imidazole, 2-methylimidazole, 1-ethylimidazole, 2-heptadecyl imidazole, 2
Methyl-4-ethylimidazole, 1-butylimidazole, 1-propyl-2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-
2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-azine-2-methylimidazole,
Imidazole compounds such as 1-azine-2-undecylimidazole, triphenylphosphine tetraphenylborate, triethylamine tetraphenylborate, N
-Methylmorpholine tetraphenylborate, pyridine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate, 2-ethyl-1,4-
Examples thereof include tetraphenylboron salts such as dimethylimidazole tetraphenylborate, organometallic compounds such as tin octylate, ammonium formate and chloroplatinic acid. The amount of the crosslinking aid is preferably 0 to 5% by weight based on the amount of the polymer containing the fluoroalkyl group or the fluoroalkenyl group and the functional group.

In the present invention, the functional group of the polymer having a functional group is a hydroxyl group or a glycidyl group, and it is essential that a functional group-containing compound and / or a crosslinking aid is further added. In the present invention, as the polymer containing a fluoroalkyl group or a fluoroalkenyl group and a functional group,
Containing in a composition ratio of 30 to 99% by weight of a polymerizable compound having a fluoroalkyl group or a fluoroalkenyl group, 1 to 30% by weight of a polymerizable compound containing a functional group, and 0 to 69% by weight of a copolymerizable compound. Are preferred. Next, as the organic solvent, a solvent capable of dissolving the above-mentioned copolymer containing a fluoroalkyl group or a fluoroalkenyl group and a functional group is adopted. Usually, m-xylene hexafluoride, 1,1,2-trichloro-1,2,
Fluorine-containing organic solvents such as 2, -trifluoroethane, 1,1-difluorotetrachloroethane and trichloromonofluoromethane are desirable. These can be appropriately used as a mixed solvent, and n-hexane, n-heptane, 1,1,1 in order to further facilitate the dissolution of the copolymer containing a fluoroalkyl group or a fluoroalkenyl group and a functional group. -It is also possible to use organic solvents such as trichloroethane, dichloromethane, butanol, toluene, xylene, acetone, methyl ethyl ketone in combination or alone.

In the present invention, the concentration of the polymer containing a fluoroalkyl group or fluoroalkenyl group and a functional group in an organic solvent solution is not particularly limited, but is usually 0.
It can be selected from the range of about 1 to 50% by weight, preferably about 0.2 to 15% by weight. When the concentration is too high, the solution viscosity becomes excessive, which causes a difficulty in coating workability and is also disadvantageous in terms of uniform coating. Also, if the concentration is too low, pinholes will occur in the resin adhesion prevention coating film such as epoxy resin,
Difficulty in developing good resin adhesion preventive property. In the present invention, the means and conditions for applying and drying the polymer containing a fluoroalkyl group or a fluoroalkenyl group and a functional group are not particularly limited and can be adopted over a wide range. For example, the organic solvent solution is applied to the surface of the lead wire by an immersion method, a spray method, a roll method or the like, and the drying temperature is usually preferably in the range of 10 to 150 ° C. There is also no particular limitation on the thickness of the coating film made of a polymer containing a fluoroalkyl group or a fluoroalkenyl group and a functional group on the surface of the lead wire or the like, usually 0.1 to 50 microns,
Preferably about 0.3 to 5 microns is sufficient.

[0024]

EXAMPLES The present invention will be described more specifically with reference to Examples and Comparative Examples below. Examples 1 and 2 and Comparative Examples 1 to 6 The semiconductor element with the lead wire (5 cm) was turned upside down and the upper 4 cm of the lead wire was dipped in each anti-adhesive solution, pulled up, and then dried at 80 ° C. for 10 minutes, Then, dip it into the epoxy resin for semiconductor device encapsulation [Unicast U3800: Union Kasei Co., Ltd.] up to 3 cm above the lead wire, leave it at room temperature for 1 minute to drain the liquid, and then crosslink and cure the epoxy resin at 100 ° C for 1 hour. After that, the portion of each lead wire coated with the anti-adhesion agent was observed, and the adhesion state of the epoxy resin was judged according to the following criteria.
Shown in the table. The judgment criteria in this case are as follows. ◎ No epoxy resin adhered to the part coated with anti-adhesion agent. ○ A small amount of epoxy resin adheres to the area where the anti-adhesive agent is applied, but it can be removed immediately by touching it with your fingertips. △ Epoxy resin is mottled on the part coated with the anti-adhesive agent and can be removed easily with a fingertip. × There is no effect of the anti-adhesion agent, and the epoxy resin adheres to the uncoated area as well.

Next, the above operation was repeated without changing the bath of the epoxy resin for encapsulating the semiconductor element, and 3000 capacitors thus obtained were applied to the epoxy resin coating for surface treatment [Unicoat U606: Union Kasei Co., Ltd.]. , Soak up to 3 cm above the lead wire, leave at room temperature for 1 minute to drain the liquid, then 120 ° C x 2
After cross-linking and curing the epoxy resin coating over time, the coating unevenness or coating defective portion was observed, the coating condition was judged according to the following criteria, and the sum of Δ and × was expressed as a defective rate (%). ○ A uniform coating film is formed on the surface of the condenser. △ There is coating unevenness on the surface of the capacitor. × Paint cissing is seen on the capacitor surface. Next, printing was performed on the coated surface of the epoxy resin paint (hot stamping: for capacitors), the printing condition was judged according to the following criteria, and the sum of Δ and × was expressed as a defective rate (%). ○ The printout is clean. △ Partially printed. × The print is completely discolored. Next, the completed capacitor was attached to a printed board, and the suitability for soldering of the lead wire and the wiring portion of the printed board was observed with Pb-Sn based solder (melting point 180 to 185 ° C), and the judgment was made according to the following criteria. ○ Good adhesion × Bad adhesion

[0026]

[Table 1]

In the table, FA: CF ₃ CF ₃ (CF ₂ CF ₂ ) nCH ₂ CH ₂ OC
OCH = CH ₂ (provided that the fluorine-containing compound composition is 55 mol% for n = 3,
28 mol% for n = 4, 11 mol% for n = 5, n =
6 is 4 mol% and n = 7 is 1 mol%. ) FMA: C ₈ F ₁₇ SO ₂ N (CH ₃ ) CH ₂ CH ₂ OCO
_{C (CH 3) = CH 2} OHM: 2- hydroxyethyl methacrylate 2EHM: 2- ethylhexyl methacrylate BUM: butyl methacrylate GM: glycidyl methacrylate CyHMA: cyclohexyl methacrylate GR650: Glass Resin GR650:

[Chemical 10] (Ladder polymer of organosilsesquioxane manufactured by Owenth Illinois Co., Ltd.) NCO: triphenylmethane triisocyanate TCTFE: trichlorotrifluoroethane m-XHF: m-xylene hexafluoride AC: acetone TCE: 1, 1,1-trichloroethane

[0028]

EFFECT OF THE INVENTION By forming a polymer film containing a fluoroalkyl group or a fluoroalkenyl group and a functional group on the surface in the present invention, a coating film which is a drawback of the conventional fluoroalkyl group-containing polymer coating film. It is possible to prevent adverse effects due to weak strength and solubility of the coating film in the liquid resin.
Therefore, the anti-adhesion agent of the present invention, for example, the liquid epoxy resin coating agent (especially those containing styrene monomer) disappears, forming a uniform coating film on the capacitor coating film surface during mass production in a line, There is no uneven coating or defective coating, and defective printing (hot stamping) on the surface is eliminated. Further, it is excellent in preventing adhesion of thermosetting resin such as liquid epoxy resin of the lead wire and also excellent in soldering property.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location C08F 230/08 MNU C08G 59/20 NHW C09K 3/00 R

Claims (4)

[Claims] 1. 30 to 99% by weight of at least one of the esters represented by the general formulas (1) to (3) as a constitutional unit
And a thermosetting resin adhesion preventive agent comprising a polymer having a fluoroalkyl group or a fluoroalkenyl group and a functional group containing 1 to 30% by weight of a vinyl or (meth) acrylic compound containing a functional group as a constitutional unit. There
The functional group is an alkoxy group having 1 to 6 carbon atoms, a hydroxyl group substituted with an acetoxy group or a methoxyethoxy group, or a glycidyl group substituted with an alkoxy group having 1 to 6 carbon atoms, an acetoxy group or a methoxyethoxy group, and further functional. An anti-adhesion agent for preventing adhesion of a thermosetting resin, which comprises a group-containing compound and / or a crosslinking aid. Embedded image [In the formula, Rf represents a fluoroalkyl group or fluoroalkenyl group having 4 to 20 carbon atoms, R ¹ represents a hydrogen atom, a methyl group, a fluorine atom or a trifluoromethyl group, and R ² represents 1 to 1 carbon atoms.
0 alkylene group or ^{_{-CH 2 CH (OR 3) CH}} 2 -, R
³ is a hydrogen atom or an acyl group having 1 to 11 carbon atoms, R ⁴ is an alkylene group having 1 to 10 carbon atoms, R ⁵ is a hydrogen atom or 1 to 1 carbon atoms
An alkyl group of 0 is shown. ] 2. The antiadhesive agent according to claim 1, wherein the polymer further contains another copolymerizable compound as a constituent unit in an amount of 69% by weight or less. 3. 30 to 99% by weight of at least one of the esters represented by the general formulas (1) to (3) as a constitutional unit
And a polymer containing a functional group containing a fluoroalkyl group or a fluoroalkenyl group consisting of 1 to 30 wt% of a vinyl or (meth) acrylic compound containing a functional group as a constitutional unit, wherein the functional group has 1 to 1 carbon atoms. 6 is a hydroxyl group substituted with an alkoxy group, an acetoxy group or a methoxyethoxy group, or a glycidyl group substituted with an alkoxy group having 1 to 6 carbon atoms, an acetoxy group or a methoxyethoxy group, and further a functional group-containing compound and / or a crosslinker A method for preventing adhesion of a thermosetting resin, which comprises preventing a thermosetting resin from adhering to a covered part, characterized by coating a composition containing an auxiliary agent. Embedded image [In the formula, Rf represents a fluoroalkyl group or fluoroalkenyl group having 4 to 20 carbon atoms, R ¹ represents a hydrogen atom, a methyl group, a fluorine atom or a trifluoromethyl group, and R ² represents 1 to 1 carbon atoms.
0 alkylene group or ^{_{-CH 2 CH (OR 3) CH}} 2 -, R
³ is a hydrogen atom or an acyl group having 1 to 11 carbon atoms, R ⁴ is an alkylene group having 1 to 10 carbon atoms, R ⁵ is a hydrogen atom or 1 to 1 carbon atoms
An alkyl group of 0 is shown. ] 4. The method of preventing adhesion according to claim 3, wherein the polymer further contains another copolymerizable compound as a constituent unit in an amount of 69% by weight or less.