JPH08236595A - Automatic supplying and erasing method of semiconductor inspection program - Google Patents

Abstract

PURPOSE: To provide the automatically supplying required inspection program by comprehending in-process IC before inspecting step as well as the erasing method of unnecessary inspection program after finishing the in-process step. CONSTITUTION: A production control system 320 and a control device 304, the device 304 and an inspection program file device 302; the device 304 and an inspection program processing device 104 are connected by net works respectively shown by arows 203, 313, 203 so as to receive an in-process part names 321 and a customer specification codes 322 received orders from customers are received by the device 304. Through these procedures, the required inspection programs are assigned and if the inspection program is not found on the inspection program file device 302, the file is transferred and after finishing the in- process steps, any unnecessary inspection programs are erased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for supplying a semiconductor device inspection program, and more particularly, to a plurality of semiconductor devices to be inspected before they are put into a plurality of manufacturing processes (wafer inspection process, assembly inspection process). An ASIC (Application) for a semiconductor inspection device (hereinafter referred to as an IC tester)
The present invention relates to a method for supplying an inspection program of a specific IC) to an inspection program file device.

[0002]

2. Description of the Related Art In recent years, due to the progress of CAD technology, a method for automatically generating an inspection specification of a custom IC ordered by a customer as an inspection program is already at an operational level.
However, this automatically generated inspection program
In the case of applying to the production line of the above, it was supplied to the line based on the production input information obtained by using the magnetic recording medium or the network by human means. Also, the supplied inspection program is applied to the in-process lot. Japanese Patent Laid-Open No. 61-
No. 154138. The automatic program supply apparatus described in the above publication imprints characters on the orientation flat side of a semiconductor wafer, reads the characters, selects the necessary programs by computer processing, and automatically downloads them.

Further, a method of selecting a required program using product information from a magnetic card or the like and automatically downloading the program is also known. However, in any of the examples, if the inspection program does not exist in the inspection program file device at the time of downloading, the inspection program must be supplied by human means after all.

Referring to FIG. 7, which shows an example of a hardware configuration diagram for realizing an automatic supply flow of an inspection program in this type of conventional technology, referring to FIG.
2 is ordered in the direction of arrow 111, and the order is given to the inspection program automatic generator 103 which is a part of the CAD system by arrow 1
Input by 12 logistics means.

Today, the physical distribution means indicated by arrow 112 is composed of an inter-computer network. The following arrows 113, 201 and 312 indicate that they are based on an inter-computer network.

Here, the inspection program information automatically generated is indicated by an arrow 113 in the inspection program processor 104.
Is supplied to the IC tester and programmed by each IC tester. This program processing is the inspection program automatic generator 1
The information created in 03 is not in a format that can be downloaded to the IC tester, and since the execution format of the inspection program is different for each IC tester vendor or each IC tester model, it is converted to an execution format that can be downloaded to the IC tester. Refers to processing.

The inspection program for each IC tester is indicated by arrow 1
The data is recorded on the magnetic recording medium 105 by 14. This recording means is writing to the magnetic recording medium 105 by command input of a computer device, and is usually executed by keyboard operation of the inspection program processing device 104. Further, the magnetic recording medium 105 here means a floppy disk or a magnetic tape.

The magnetic recording medium 105 is used in the production line 300.
It is put in by a physical distribution means indicated by an arrow 202 and stored as a magnetic recording medium 301. In FIG. 7, although the magnetic recording media 105 and 301 are the same, they are shown by different symbols for convenience.

The inspection program must be stored in advance in the inspection program file device 302 in order to be downloaded to the IC tester 303.
When using the magnetic recording medium 301, the production line 30
Work in progress management table 3 created by the production management department by 0 workers
08, either writing from the magnetic recording medium 301 to the inspection program file device 302 by the arrow 311 or performing file transfer from the inspection program processing device 104 of the design department 100 to the inspection program file device 302 by the arrow 201. Determine and execute that action.

In this case, a keyboard operation is performed on the inspection program file device 302 in both cases of writing from the magnetic recording medium 301 and writing by file transfer from the inspection program processing device 104.

[0011]

In the above-mentioned conventional technique, the means for supplying the inspection program to the inspection program file device 302 in advance is manually operated, and the misreading of the in-process management table 308 and the inspection program file device 3 are performed.
If the operation in 02 is incorrect, the necessary inspection program does not exist in the inspection program file device 302.

Therefore, if an inspection program is simply selected in this state based on the product information that has been set in the apparatus and automatically downloaded to the IC tester or the like, an error that the corresponding file does not exist occurs. Further, if the version number of the inspection program is changed and the same error is made, the IC is inspected by the old version inspection program.

In the unlikely event that the inspection program that corrects the inspection omission is not supplied, the IC to be shipped to the customer is
The inspection will be missed, and both the customer and the semiconductor manufacturer will suffer serious damage.

The object of the present invention was made in view of the above-mentioned drawbacks. When an IC is set up in the inspection device, the inspection program always exists in the inspection program file device and the version number of the inspection program is changed. Even in the case of, it is an object of the present invention to provide a method of automatically supplying and erasing an inspection program such that a new version of the inspection program always exists in the inspection program file device.

[0015]

The feature of the semiconductor inspection program automatic supply method of the present invention is that a master wafer having diffusion layer wiring formed in advance is provided with metal wiring to form a plurality of chips having a desired circuit function. In a method of automatically supplying a semiconductor inspection program applied to an IC tester used in this inspection step, which is directed to a semiconductor manufacturing step including a step and a wafer inspection step of inspecting the chips as they are in a wafer state and selecting good or defective. , A master wafer process at a time point when the master wafer is put into the diffusion step, using a control means which is provided between the production management computer and the IC tester and controls supply and erasure of the inspection program to the IC tester. The product name, customer specification code, and lot number are received from the production control computer in advance. By registering the model-specific information of the IC tester and the production process information of the chip, allocating the inspection program necessary for the inspection of the master wafer, and confirming the version number of the inspection program, the version number is erroneous. If so, the correct inspection program is transferred and the lot number is associated with the correct inspection program.

Another feature of the method for automatically supplying a semiconductor inspection program according to the present invention is to further include an assembling step of accommodating the chips selected in the manufacturing process in a predetermined package to form a semiconductor device, and a good or defective semiconductor device. In a method of automatically supplying a semiconductor inspection program applied to an IC tester used in this sorting step, which is intended for a semiconductor assembling step including a sorting and inspecting step, the IC is provided between a production management computer and the IC tester. Using the control means for controlling the supply and erasure of the inspection program to the tester, the in-process product name, the customer specification code, and the lot number of the semiconductor device are produced when the semiconductor device is put into the assembly process. Preliminarily received from the management computer, the model-specific information of the IC tester and the manufacturing process of the semiconductor device By registering information, allocating the inspection program necessary for inspection of the semiconductor device, and confirming the version number of the inspection program, if this version number is incorrect, the correct inspection program is transferred, and the correct inspection program is transferred. It is to correspond lot numbers.

A feature of the semiconductor inspection program automatic erasing method of the present invention is that the semiconductor inspection process includes a wafer inspection process for inspecting chips having a desired circuit function in a wafer state and selecting good or defective wafers. In a method of erasing a semiconductor inspection program applied to an IC tester used in an inspection process, a control means is provided between a production management computer and the IC tester to control supply and erasure of the inspection program to the IC tester. Then, when the chips in the wafer state are put into the wafer inspection process, information of the in-process product name, the customer specification code, and the lot number is accepted, the file name of the inspection program is assigned, and another file is assigned to this inspection program. Check if lot number information exists, and if there is, use the inspection program to enter the lot number. Only allowed to delete is to be erased the test program to be present.

Another feature of the method for automatically erasing a semiconductor inspection program according to the present invention is targeted at a sorting / inspecting step for further sorting out good / defective semiconductor devices in which chips are accommodated in a predetermined package in the semiconductor assembly process. In a method of erasing a semiconductor inspection program applied to an IC tester used in an inspection process, a production management computer and the IC
By using a control unit which is provided between the IC tester and the IC tester and controls supply and erasure of the inspection program,
At the time when the semiconductor device is put into the screening and inspection step, a work-in-process name, a customer specification code, and a lot number of the semiconductor device are previously accepted from the production management computer, and a file name of the inspection program is assigned.
It is to confirm whether other lot number information exists in this inspection program, and if it exists, delete only the lot number from the inspection program, and if it does not exist, delete the inspection program. [Detailed Description of the Invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for supplying a semiconductor device inspection program, and more particularly, to a plurality of semiconductor devices to be inspected before they are put into a plurality of manufacturing processes (wafer inspection process, assembly inspection process). The present invention relates to a method of supplying an ASIC inspection program for a semiconductor inspection device (hereinafter referred to as an IC tester) to an inspection program file device. In an automatic supply method of a semiconductor inspection program targeted for a wafer inspection process in a semiconductor manufacturing process, information for forming a predetermined predetermined metal wiring pattern is supplied to a product master wafer manufactured up to a predetermined wiring process. At the time when the master wafer is put into the metal wiring process, information on each of the in-process product name, the customer specification code, and the lot number of the product master wafer to be the target of the predetermined metal wiring pattern is provided from the computer device for production management. The step of receiving, the step of registering the model-specific information of the IC tester for testing the electrical characteristics of the semiconductor device manufactured from the product master wafer and inspecting whether the semiconductor device is good or defective, and the production process information of the semiconductor device, and these information Based on the product master program, an inspection program necessary for inspecting the semiconductor device is provided. Hikiateru by Ha and customer specification code and the IC tester type and the production process information in that a step.

Another feature of the semiconductor inspection program automatic supply method of the present invention is that in the semiconductor inspection program automatic supply method targeted for the selection inspection step in the semiconductor manufacturing process, the semiconductor device which has undergone the wafer inspection in the assembly step is A step of receiving each information of a work-in-progress item name, a customer specification code, and a lot number from a computer device which manages production at the time of inputting, a step of registering IC tester type information and process information, and based on the information. It has a step of allocating an inspection program necessary for product inspection by a product master, a customer specification code, an IC tester type, and a production process.

The feature of the semiconductor inspection program automatic erasing method of the present invention is that the semiconductor inspection program automatic erasing method targeted for the sorting inspection step of the semiconductor manufacturing process is the point of time when the wafer inspection step of the semiconductor manufacturing step receives the product. Required for product inspection based on the step of receiving information on each of the in-process product name, customer specification code, and lot number from the computer device which manages the production in step 1, the step of registering the IC tester type information and the process information. Of various inspection programs according to the product master wafer, customer specification code, IC tester type, and production process, and the step of associating the inspection program and a plurality of in-process lot numbers required for the inspection of the semiconductor device manufactured from the product master wafer. , In-process lot numbers other than receipt lots are associated If it is is to have a step of erasing only the lot number, and the step of erasing the test program unless has an associated-process lot number other than goods receipt lots.

Another feature of the method for automatically erasing a semiconductor inspection program according to the present invention is that in the method for automatically erasing a semiconductor inspection program targeted for a screening / inspecting step in the semiconductor manufacturing process, the product is stored in the screening step in the semiconductor manufacturing process. The step of receiving the in-process product name, the customer specification code, and the lot number information from the computer device that manages the production at the time, the step of registering the IC tester type information and the process information, and the product inspection based on the information. Correlating the step of allocating the necessary inspection program by the product master wafer, the customer specification code, the IC tester type, and the production process, and the inspection program and a plurality of in-process lot numbers required for the inspection of the semiconductor device manufactured from the product master wafer. By, the work-in-process lot number other than the receipt lot is associated If so lies in having a step of erasing only the lot number, and the step of erasing the test program unless has an associated-process lot number other than goods receipt lots.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram of hardware of an embodiment according to the present invention. Referring to FIG. 1, a difference from the above-described conventional example is that the production management system 320 and the control device 3 are different.
04 is connected by a network indicated by an arrow 203, the control device 304 and the inspection program file device 302 are connected by an arrow 313, and the control device 304 and the inspection program processing device 104 are connected by respective network means indicated by an arrow 203. The device 304 receives the work-in-progress name 321 and the specification (hereinafter, referred to as a customer specification code) 322 from the customer from the production management system 320.

That is, the specification 1 received from the customer 101
02 is supplied to the inspection program automatic generator 103, which is a part of the CAD system, by the physical distribution means of arrow 112. The inspection program information automatically generated here is supplied to the inspection program processing device 104 by the arrow 113, and is subjected to program processing in an executable format for each IC tester.

The inspection program for each IC tester is indicated by arrow 1
It is recorded on the fixed disk 106 by 15. This recording means is writing to the fixed disk 106 by the command input of the computer device, and is usually executed by the keyboard operation of the inspection program processing device 104. Up to this point, it is the same as the conventional one.

The inspection program must be stored in advance in the inspection program file device 302 in order to be downloaded to the IC tester 303.
Conventionally, the operator of the production line 300 looks at the work-in-process management table 308 created by the production management department and looks at the magnetic recording medium 301.
From the arrow 311 to the inspection program file device 30
No. 2 is written or data is transferred from the inspection program processing device 104 of the design department 100 to the inspection program file device 302 by the arrow 201, which is executed in the present embodiment. Automatically handle judgment and execution.

In this automatic processing, the contents of the transferred inspection program differ depending on the manufacturing process. Therefore, when describing this manufacturing process, FIG. 2 showing the semiconductor wafer manufacturing process in the schematic process flow of semiconductor manufacturing will be described. , And FIG. 3 showing a semiconductor assembling process, the semiconductor wafer manufacturing process includes a manufacturing process from diffusion input to wiring input to a diffusion-loaded wafer having a predetermined pattern formed on the wafer and diffusion-loaded. The semiconductor wafer is put into the inspection, and when the inspection is completed, it is divided into the steps of storing.

On the other hand, in the semiconductor assembling flow, a step of putting a wafer, which has been subjected to an electrical characteristic test in a wafer state, into an assembly and storing an IC which has been assembled in a package and which has been assembled is electrically operated. It can be divided into a process of selecting and storing in a physical characteristic test.

The above-mentioned control device 304 causes the production management system 320 to send the in-process product name 321 and the customer specification code 322.
The lot number and the timing for receiving the lot number are set for the inspection program for the wafer inspection process at the time of wiring input for the diffusion process (point A) and for the inspection program for the sorting process at the point of assembly input (point B). For example, the inspection programs used at the time of wafer inspection and at the time of assembly inspection can be accommodated without omission.

Referring also to FIG. 4, which shows the inspection program automatic supply control flow in the control unit 304, for example, to apply it to a semiconductor wafer manufacturing process,
The control device 304 receives the in-process product name 321, the customer specification code 322, and the lot number 323 from the production management system 320 at the time of wiring input, which is point A in FIG. 2 (4
01).

Immediately after receiving the in-process product name 321 and the customer specification code 322, the control device 304 checks the file contents of the fixed disk 106 connected by the connecting line 115 via the inspection program processing device 104 (402).

Referring to FIG. 6 showing the file structure on the fixed disk 106 in a tree structure diagram, on the fixed disk 106, an upper directory, an IC tester model directory, a master wafer (hereinafter referred to as a product master) name directory, It has a customer specification code directory and a production process directory, and finally stores an inspection program file.

The control device 304 determines the product master name directory from the in-process product name 321, and the customer specification code 3
The customer specification code directory is determined from 22. Further, the control device 304 has the inspection device information 306 and the process information 307 in advance, and thereby determines the IC tester model directory and the production process directory.

Therefore, the entire directory tree structure of the inspection program processing device 104 can be determined. Here, the control device 304 reads the version number information of the corresponding inspection program file (403).

Although not specifically shown in the figure, this version number information can be devised by having it as a part of the file name or having another file with the file extension as the version number information on the fixed disk. You can judge.

Next, the control device 304 checks whether or not the inspection program file of the corresponding version number exists on the inspection program file device 302 (404).

The file storage structure here may be the tree structure described above, but the type of IC tester, that is, IC
Depending on the computer equipment used in the tester,
The inspection program file device 302 is often separate, and usually has a storage directory by the inspection program name.

Here, when there is no inspection program file including the old version, the inspection program processing device 104
If the inspection program version number of the inspection program file device 302 is older than the inspection program version number (normally, the number is small), the control device 304 fixes the comparison result from the inspection program processing device 104 because the comparison result does not match. The corresponding inspection program stored in the disk 106 is transmitted through the network to the inspection program file device 3
02 to transfer the file (405).

The storage directory at this time may be the storage directory with the tree structure or the inspection program name described above. Thus, the diffused wafer corresponding to the file-transferred inspection program can be automatically supplied to the inspection program file device 302 before the wafer inspection process is completed.

Next, the inspection program automatic generator 103
When the inspection program file device 302 supplies the inspection program to the inspection program file device 302, or when the inspection program based on the input information already exists, the lot number 323 information is stored in the inspection program storage directory. Or, separately using a database etc., associate lot number information with the inspection program (4
06).

The result of the above-mentioned execution is connected to the control device 304 and the output device 305 by the connection line 315, and if the output device 305 is a printer, for example, a log is left by printing. Therefore, by separately looking at this log, the in-process management table 308 described in the related art is
Further, it becomes possible to refer to the inspection program information.

Further, the inspection program file device 302
Since the file storage capacity of is limited, it is necessary to delete the inspection program that is no longer needed. In this case,
In the semiconductor wafer manufacturing process flow shown in FIG. 2, a case where product lots using the same inspection program are in process from wafer inspection input to wafer inspection storage will be described below.

That is, referring to FIG. 5 showing the flow of deleting the unnecessary inspection program, the control device 304 causes the production management system 320 to perform the wafer inspection in which the in-process product name 321, the customer specification code 322, and the lot number 323 are shown in FIG. Receive at the time of input. That is, it is a time point before the wafer inspection storage (C point) (501).

The controller 304 assigns the corresponding program file name (502).

The lot number information of the inspection program supplied according to the inspection program automatic supply control flow is confirmed (503), and when lot numbers other than the lot to be stored are associated, that is, other lots of the same product type. Or the same inspection program is used for different types, the inspection program remains as it is and only the corresponding lot number is deleted and the process ends (5
04).

Further, when the result of the confirmation in step 503 is only the lot number of the receiving target, the unnecessary program is judged and the corresponding inspection program is erased (5
05).

Similarly, when applied to the semiconductor assembly process,
The control device 304 receives the in-process product name 321, the customer specification code 322, and the lot number 323 from the production management system 320 at the time of assembling and inputting, which is point B in FIG. 2 (4
01).

Immediately after receiving the in-process product name 321 and the customer specification code 322, the control device 304 checks the file contents of the fixed disk 106 connected by the connecting line 115 via the inspection program processing device 104 (402).

The control device 304 determines the product master name directory from the in-process product name 321, and the customer specification code 3
The customer specification code directory is determined from 22. Further, the control device 304 has the inspection device information 306 and the process information 307 in advance, and thereby determines the IC tester model directory and the production process directory. Therefore, the entire directory tree structure of the inspection program processing device 104 can be determined. Here, the control device 3
04 reads the version number information of the corresponding inspection program file (403).

Next, the control device 304 checks whether or not the inspection program file of the corresponding version number exists on the inspection program file device 302 (404).

Here, when there is no inspection program file including the old version, the inspection program processing device 104
If the inspection program version number of the inspection program file device 302 is older than the inspection program version number (normally, the number is small), the control device 304 fixes the comparison result from the inspection program processing device 104 because the comparison result does not match. The corresponding inspection program stored in the disk 106 is transmitted through the network to the inspection program file device 3
02 to transfer the file (405).

As a result, the assembled semiconductor device corresponding to the file-transferred inspection program can be automatically supplied to the inspection program file device 302 before the assembly inspection process is started.

Next, the inspection program automatic generator 103
When the inspection program file device 302 supplies the inspection program to the inspection program file device 302, or when the inspection program based on the input information already exists, the lot number 323 information is stored in the inspection program storage directory. Or, separately using a database etc., associate lot number information with the inspection program (4
06).

Also in this case, if the output device 305 is a printer, the execution result remains as a log by printing.
Therefore, by separately viewing the log, it becomes possible to further refer to the inspection program information with respect to the work-in-progress management table 308 described in the related art.

When erasing unnecessary programs is applied to the semiconductor assembly process, it is the same as in the semiconductor wafer manufacturing process described above. That is, a case where product lots using the same inspection program are in process from the assembly inspection input to the assembly inspection storage in the semiconductor assembly process flow will be described below.

Referring again to FIG. 5, the control unit 304 receives the in-process product name 321, the customer specification code 322, and the lot number 323 from the production management system 320 at the time of the assembly inspection input shown in FIG. That is, assembly inspection receipt (D
It is a time point before (point) (501).

The control device 304 assigns the relevant program file name (502), confirms the lot number information of the inspection program supplied according to the inspection program automatic supply control flow (503), and confirms that the lot number other than the lot to be stored is If they are associated, that is, because they are either different lots of the same product type or the same inspection program is used for different products, the inspection program remains as is and only the corresponding lot number is deleted. Then, the process ends (504).

If the result of the confirmation in step 503 is only the lot number of the receiving target, the unnecessary program is judged and the relevant inspection program is erased (5
05).

As described above, automatic supply and deletion of the inspection program can be carried out in both the wafer inspection process and the assembly inspection process.

[0043]

As described above, the method for automatically supplying and erasing a semiconductor inspection program according to the present invention does not fail when the semiconductor device is installed in the inspection device in the semiconductor wafer manufacturing process flow and the semiconductor assembly flow. Since it exists in the inspection program file device, the quality of inspection in the semiconductor manufacturing process can be expected to be improved, and it is possible to avoid the situation where the lot remains set in the device due to the absence of the inspection program during work in progress. It can be expected to be effective in shortening the manufacturing period.

[Brief description of drawings]

FIG. 1 is a block diagram of hardware of an embodiment according to the present invention.

FIG. 2 is a diagram showing an outline of a semiconductor wafer manufacturing process.

FIG. 3 is a schematic process flow of a semiconductor assembly process.

FIG. 4 is an inspection program automatic supply control flowchart.

FIG. 5 is a flowchart for deleting an unnecessary inspection program.

FIG. 6 is a diagram showing a file storage tree structure of a fixed disk connected to an inspection program processing device.

FIG. 7 is a conventional hardware configuration diagram.

[Explanation of symbols]

100 Design Department 101 Customer 102 Specifications 103 Inspection Program Automatic Generator 104 Inspection Program Processor 105 Magnetic Recording Medium 106 Fixed Disk 115 Connection Line 111, 112, 113, 114, 201, 202, 2
03 arrow 300 production line 301 magnetic recording medium 302 inspection program file device 303 IC tester 304 control device 305 output device 306 inspection device information 307 process information 308 in-process management table 315 connection line 311, 312, 313, 314 arrow 320 production management system 321 Work in process information 322 Customer specification code information 323 Lot number information

Claims (4)

[Claims] 1. A diffusion step of forming a plurality of chips having a desired circuit function by applying metal wiring to a master wafer on which diffusion layer wiring has been formed in advance, and a wafer for inspecting the chips in a wafer state and selecting good or bad. In a semiconductor manufacturing process including an inspection process, an automatic supply method of a semiconductor inspection program applied to a semiconductor inspection device used in the inspection process, wherein the semiconductor inspection is provided between a production management computer and the semiconductor inspection device. A control means for controlling the supply and erasing of the inspection program to the apparatus is used to obtain the work-in-progress name, the customer specification code, and the lot number of the master wafer for the production control when the master wafer is put into the diffusion process. Accepted in advance from a computer, the model-specific information of the semiconductor inspection device and the raw chip By registering production process information, allocating the inspection program necessary for inspecting the master wafer, and confirming the version number of the inspection program, if the version number is incorrect, the correct inspection program is transferred, and the correct inspection program is transmitted. A semiconductor inspection program automatic supply method characterized in that lot numbers are associated with each other. 2. A semiconductor assembling process including an assembling process for accommodating chips selected in a manufacturing process in a predetermined package to form a semiconductor device and a selecting and inspecting process for further selecting good or defective semiconductor devices. In an automatic supply method of a semiconductor inspection program applied to a semiconductor inspection device used in this sorting step, supplying and erasing the inspection program to the semiconductor inspection device between the production management computer and the semiconductor inspection device. Using the control means for controlling, when the semiconductor device is put into the assembling process, the work in process name, the customer specification code, and the lot number of the semiconductor device are preliminarily received from the production control computer, and the semiconductor inspection device is used. It is necessary to inspect the semiconductor device by registering the model-specific information and the production process information of the semiconductor device. By allocating the necessary inspection program and confirming the version number of the inspection program, if the version number is incorrect, the correct inspection program is transferred, and the lot number is associated with the correct inspection program. Automatic supply method of semiconductor inspection program. 3. A wafer inspecting process for inspecting a chip having a desired circuit function in a wafer state as it is in a semiconductor manufacturing process to select good or bad, and is applied to a semiconductor inspecting apparatus used in this inspecting process. In a method of erasing a semiconductor inspection program, a chip in the wafer state is controlled by using a control unit that is provided between a production management computer and the semiconductor inspection apparatus and controls supply and erasure of the inspection program to the semiconductor inspection apparatus. Accepts each information of in-process product name, customer specification code and lot number at the time of being put into the wafer inspection process, assigns the file name of the above inspection program, and confirms whether other lot number information exists in this inspection program If it exists, only the lot number is deleted from the inspection program. If it does not exist, the lot number is deleted. A method for automatically erasing a semiconductor inspection program, characterized by erasing a program. 4. A semiconductor inspection applied to a semiconductor inspection device used in this selection inspection step, which is targeted for a selection inspection step of further selecting good or defective semiconductor devices in which chips are accommodated in a predetermined package in the semiconductor assembly step. In the program erasing method, the semiconductor device is subjected to the screening inspection process by using a control unit that is provided between the production management computer and the semiconductor inspection device and controls supply and erasure of the inspection program to the semiconductor inspection device. At the time of introduction, the in-process product name of the semiconductor device, the customer specification code, and the lot number are previously received from the production management computer, the file name of the inspection program is assigned, and other lot number information exists in this inspection program. Check if there is, and if it exists, only the lot number from the above inspection program Is deleted, and the inspection program is erased if it does not exist.